CD74ACT541E 概述
OCTAL BUFFER/LINE DRIVERS, 3-STATE 八路缓冲器/线路驱动器,三态 逻辑控制器 总线驱动器/收发器
CD74ACT541E 规格参数
是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | DIP |
包装说明: | DIP-20 | 针数: | 20 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 0.71 | Samacsys Confidence: | |
Samacsys Status: | Released | Samacsys PartID: | 181093 |
Samacsys Pin Count: | 20 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Other | Samacsys Footprint Name: | DIP254P762X508-20 |
Samacsys Released Date: | 2017-01-12 12:59:53 | Is Samacsys: | N |
其他特性: | WITH DUAL OUTPUT ENABLE | 控制类型: | ENABLE LOW |
计数方向: | UNIDIRECTIONAL | 系列: | ACT |
JESD-30 代码: | R-PDIP-T20 | JESD-609代码: | e4 |
长度: | 24.33 mm | 负载电容(CL): | 50 pF |
逻辑集成电路类型: | BUS DRIVER | 最大I(ol): | 0.024 A |
位数: | 8 | 功能数量: | 1 |
端口数量: | 2 | 端子数量: | 20 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
输出特性: | 3-STATE | 输出极性: | TRUE |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | DIP |
封装等效代码: | DIP20,.3 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 包装方法: | TUBE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 5 V |
Prop。Delay @ Nom-Sup: | 9.6 ns | 传播延迟(tpd): | 7.5 ns |
认证状态: | Not Qualified | 座面最大高度: | 5.08 mm |
子类别: | Bus Driver/Transceivers | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 6.35 mm | Base Number Matches: | 1 |
CD74ACT541E 数据手册
通过下载CD74ACT541E数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载Data sheet acquired from Harris Semiconductor
SCHS285A – Revised November 1999
The CD54/74AC540, -541, and CD54/74ACT540, -541 octal
buffer/line drivers use the RCA ADVANCED CMOS technology. The
CD54/74AC/ACT540 are inverting 3-state buffers having two
active-LOW output enables. The CD54/74AC/ACT541 are
non-inverting3-statebuffershavingtwoactive-LOWoutputenables.
The CD74AC540, -541, and CD74ACT540, -541 are supplied in
20-lead dual-in-line plastic packages (E suffix) and in 20-lead
dual-in-line small-outline plastic packages (M suffix). Both package
types are operable over the following temperature ranges: Industrial
(–40 to +85°C) and Extended Industrial/Military (–55 to +125°C).
The CD54AC540, -541, and CD54ACT540, -541, available in chip
form (H suffix), are operable over the –55 to +125°C temperature
range.
L
H
Z
Copyright 1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MAXIMUM RATINGS, Absolute-Maximum Values:
DC SUPPLY-VOLTAGE (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 to 6 V
CC
DC INPUT DIODE CURRENT, I (for V < –0.5 or V > V
+ 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
IK
I
I
CC
(for V < –0.5 or V > V + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
CC
DC OUTPUT DIODE CURRENT, I
DC OUTPUT SOURCE OR SINK CURRENT per Output Pin, I (for V > –0.5 or V < V
OR GROUND CURRENT (I or I
CC GND
PACKAGE THERMAL IMPEDANCE, θ (see Note 1): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
OK
O
O
+ 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
O
O
O
CC
DC V
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA*
CC
JA
M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
STORAGE TEMPERATURE (T ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65 to +150°C
stg
LEAD TEMPERATURE (DURING SOLDERING):
At distance 1/16 ± 1/32 in. (1.59 ± 0.79 mm) from case for 10 s maximum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +265°C
Unit inserted into PC board min. thickness 1/16 in. (1.59 mm) with solder contacting lead tips only . . . . . . . . . . . . . . . . . . . . . . . . +300°C
* For up to 4 outputs per device: add ±25 mA for each additional output.
NOTE 1:
The package thermal impedance is calculated in accordance with JESD 51.
2
3
4
ns
5
6
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
CDIP
SOIC
Drawing
CD54AC541F3A
CD54ACT540F3A
CD54ACT541F3A
CD74AC540M
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
J
20
20
20
20
1
1
1
TBD
TBD
TBD
Call TI
Call TI
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
J
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74AC540ME4
CD74AC541E
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SSOP
SSOP
SSOP
PDIP
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
DW
N
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74AC541EE4
CD74AC541M
N
20
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
DW
DW
DW
DW
DB
DB
DB
N
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74AC541M96
CD74AC541M96E4
CD74AC541ME4
CD74AC541SM
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74AC541SM96
CD74AC541SM96E4
CD74ACT540E
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74ACT540M
DW
DW
DW
DW
N
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74ACT540M96
CD74ACT540M96E4
CD74ACT540ME4
CD74ACT541E
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74ACT541EE4
CD74ACT541M
N
20
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
DW
DW
DW
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74ACT541M96
CD74ACT541M96E4
CD74ACT541ME4
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74ACT541SM
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
20
20
TBD
Call TI
Call TI
CD74ACT541SM96
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
CD74ACT541SM96E4
ACTIVE
SSOP
DB
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Copyright 2005, Texas Instruments Incorporated
CD74ACT541E 替代型号
型号 | 制造商 | 描述 | 替代类型 | 文档 |
CD74ACT541EE4 | TI | OCTAL BUFFER/LINE DRIVERS, 3-STATE | 完全替代 | |
CD74ACT541M | TI | OCTAL BUFFER/LINE DRIVERS, 3-STATE | 完全替代 | |
CD74ACT541M96 | TI | OCTAL BUFFER/LINE DRIVERS, 3-STATE | 完全替代 |
CD74ACT541E 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
CD74ACT541EE4 | TI | OCTAL BUFFER/LINE DRIVERS, 3-STATE | 获取价格 | |
CD74ACT541EN | ETC | Logic IC | 获取价格 | |
CD74ACT541EX | ROCHESTER | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20, PACKAGE-20 | 获取价格 | |
CD74ACT541F | ETC | Logic IC | 获取价格 | |
CD74ACT541M | TI | OCTAL BUFFER/LINE DRIVERS, 3-STATE | 获取价格 | |
CD74ACT541M | ROCHESTER | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | 获取价格 | |
CD74ACT541M96 | TI | OCTAL BUFFER/LINE DRIVERS, 3-STATE | 获取价格 | |
CD74ACT541M96E4 | TI | OCTAL BUFFER/LINE DRIVERS, 3-STATE | 获取价格 | |
CD74ACT541M96G4 | TI | 具有 TTL 兼容型 CMOS 输入和三态输出的 8 通道、4.5V 至 5.5V 缓冲器 | DW | 20 | -55 to 125 | 获取价格 | |
CD74ACT541ME4 | TI | OCTAL BUFFER/LINE DRIVERS, 3-STATE | 获取价格 |
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