CD74HC4075PWT [TI]
High-Speed CMOS Logic Triple 3-Input OR Gate; 高速CMOS逻辑三路3输入或门
| 型号： | CD74HC4075PWT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | High-Speed CMOS Logic Triple 3-Input OR Gate |
| 文件： | 总13页 (文件大小：348K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CD54HC4075, CD74HC4075,
CD54HCT4075, CD74HCT4075
Data sheet acquired from Harris Semiconductor
SCHS210F
High-Speed CMOS Logic
Triple 3-Input OR Gate
August 1997 - Revised August 2003
Features
Description
• Buffered Inputs
The ’HC4075 and ’HCT4075 logic gates utilize silicon-gate
CMOS technology to achieve operating speeds similar to
LSTTL gates with the low power consumption of standard
CMOS integrated circuits. All devices have the ability to drive
10 LSTTL loads. The HCT logic family is functionally pin
compatible with the standard LS logic family.
• Typical Propagation Delay: 8ns at V
o
= 5V,
[ /Title
(CD74H
C4075,
CD74H
CT4075)
/Subject
(High
Speed
CMOS
Logic
CC
C = 15pF, T = 25 C
L
A
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Ordering Information
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C
• Balanced Propagation Delay and Transition Times
TEMP. RANGE
o
PART NUMBER
CD54HC4075F3A
CD54HCT4075F3A
CD74HC4075E
( C)
PACKAGE
14 Ld CERDIP
14 Ld CERDIP
14 Ld PDIP
• Significant Power Reduction Compared to LSTTL
Logic ICs
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
• HC Types
Triple 3-
Input
- 2V to 6V Operation
- High Noise Immunity: N = 30%, N = 30% of V
IL IH CC
CD74HC4075M
14 Ld SOIC
14 Ld SOIC
14 Ld SOIC
14 Ld SOP
at V
= 5V
CC
CD74HC4075MT
CD74HC4075M96
CD74HC4075NSR
CD74HC4075PW
CD74HC4075PWR
CD74HC4075PWT
CD74HCT4075E
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V = 0.8V (Max), V = 2V (Min)
IL IH
14 Ld TSSOP
14 Ld TSSOP
14 Ld TSSOP
14 Ld PDIP
- CMOS Input Compatibility, I ≤ 1µA at V , V
OL OH
l
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
Pinout
CD54HC4075, CD54HCT4075 (CERDIP)
CD74HC4075 (PDIP, SOIC, SOP, TSSOP)
CD74HCT4075 (PDIP)
TOP VIEW
2A
2B
1
2
3
4
5
6
7
14 V
CC
13 3C
12 3B
11 3A
10 3Y
1A
1B
1C
1Y
9
8
2Y
2C
GND
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2003, Texas Instruments Incorporated
1
CD54HC4075, CD74HC4075, CD54HCT4075, CD74HCT4075
Functional Diagram
3
4
5
1A
1B
1C
6
1Y
1
2A
2B
2C
9
2
8
2Y
11
12
13
3A
10
3Y
3B
3C
GND = 7
= 14
V
CC
TRUTH TABLE
INPUTS
OUTPUT
nA
L
nB
L
nC
L
nY
L
H
X
X
X
H
H
X
X
H
X
H
H
H = High Voltage Level, L = Low Voltage Level, X = Irrelevant
Logic Diagram
nA
nB
nC
nY
2
CD54HC4075, CD74HC4075, CD54HCT4075, CD74HCT4075
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, V
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Package Thermal Impedance, θ (see Note 1):
JA
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80 C/W
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86 C/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 C/W
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 113 C/W
Maximum Junction Temperature (Hermetic Package or Die) . 175 C
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150 C
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C
CC
DC Input Diode Current, I
For V < -0.5V or V > V
o
IK
o
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
OK
For V < -0.5V or V > V
I
I
CC
o
DC Output Diode Current, I
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
O
O
CC
o
DC Output Source or Sink Current per Output Pin, I
O
o
For V > -0.5V or V < V
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
O
O
CC
o
o
DC V
or Ground Current, I
I
. . . . . . . . . . . . . . . . . .±50mA
CC
CC or GND
o
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C
(SOIC - Lead Tips Only)
Operating Conditions
o
o
Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C
A
Supply Voltage Range, V
CC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V
I
O
CC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
V
CC
PARAMETER
HC TYPES
SYMBOL
V (V)
I
I
(mA)
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
O
High Level Input
Voltage
V
-
-
-
2
4.5
6
1.5
3.15
4.2
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5
3.15
4.2
-
-
1.5
3.15
4.2
-
-
V
V
V
V
V
V
V
V
V
V
V
IH
-
-
-
-
-
-
Low Level Input
Voltage
V
-
2
0.5
0.5
0.5
IL
4.5
6
-
1.35
-
1.35
-
1.35
-
1.8
-
1.8
-
1.8
High Level Output
Voltage
CMOS Loads
V
V
V
or V
IH IL
-0.02
2
1.9
4.4
5.9
3.98
5.48
-
-
-
-
-
1.9
4.4
5.9
3.84
5.34
-
-
-
-
-
1.9
4.4
5.9
3.7
5.2
-
-
-
-
-
OH
-0.02
-0.02
-4
4.5
6
High Level Output
Voltage
TTL Loads
4.5
6
-5.2
Low Level Output
Voltage
CMOS Loads
V
or V
IH IL
0.02
0.02
0.02
4
2
4.5
6
-
-
-
-
-
-
-
-
-
-
0.1
0.1
-
-
-
-
-
0.1
0.1
-
-
-
-
-
0.1
0.1
0.1
0.4
0.4
V
V
V
V
V
OL
0.1
0.1
Low Level Output
Voltage
TTL Loads
4.5
6
0.26
0.26
0.33
0.33
5.2
Input Leakage
Current
I
V
or
-
6
6
-
-
-
-
±0.1
-
-
±1
-
-
±1
µA
µA
I
CC
GND
Quiescent Device
Current
I
V
or
0
2
20
40
CC
CC
GND
3
CD54HC4075, CD74HC4075, CD54HCT4075, CD74HCT4075
DC Electrical Specifications (Continued)
TEST
CONDITIONS
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
V
CC
PARAMETER
HCT TYPES
SYMBOL
V (V)
I
I
(mA)
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
O
High Level Input
Voltage
V
-
-
-
-
4.5 to
5.5
2
-
-
-
-
-
0.8
-
2
-
-
0.8
-
2
-
-
0.8
-
V
V
V
IH
Low Level Input
Voltage
V
4.5 to
5.5
IL
High Level Output
Voltage
CMOS Loads
V
V
V
or V
-0.02
4.5
4.5
4.5
4.5
4.4
4.4
4.4
OH
IH
IH
IL
High Level Output
Voltage
TTL Loads
-4
3.98
-
-
-
-
3.84
-
3.7
-
V
V
V
Low Level Output
Voltage
CMOS Loads
V
or V
0.02
4
-
-
0.1
0.26
-
-
0.1
0.33
-
-
0.1
0.4
OL
IL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
I
V
and
0
0
-
5.5
5.5
-
-
-
±0.1
2
-
-
-
±1
20
-
-
-
±1
40
µA
µA
µA
I
CC
GND
Quiescent Device
Current
I
V
or
-
CC
CC
GND
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
∆I
CC
(Note 2)
V
4.5 to
5.5
100
360
450
490
CC
-2.1
NOTE:
2. For dual-supply systems theoretical worst case (V = 2.4V, V
I
= 5.5V) specification is 1.8mA.
CC
HCT Input Loading Table
INPUT
All
UNIT LOADS
1.6
NOTE: Unit Load is ∆I
360µA max at 25 C.
limit specified in DC Electrical Table, e.g.
CC
o
Switching Specifications Input t , t = 6ns
r
f
o
-40 C TO
85 C
o
o
o
o
25 C
-55 C TO 125 C
TEST
SYMBOL CONDITIONS
PARAMETER
HC TYPES
V
(V) MIN
TYP MAX
MIN
MAX
MIN
MAX UNITS
CC
Propagation Delay,
Input to Output (Figure 1)
t
t
C = 50pF
2
-
-
-
100
20
17
-
-
-
-
-
-
-
-
-
125
25
21
-
-
-
-
-
-
-
-
-
150
30
26
-
ns
ns
ns
ns
ns
ns
ns
pF
PLH, PHL
L
4.5
6
-
-
-
-
-
-
-
-
C = 15pF
5
8
-
L
Transition Times (Figure 1)
Input Capacitance
t
, t
TLH THL
C = 50pF
L
2
75
15
13
10
95
19
16
10
110
22
19
10
4.5
6
-
-
C
-
-
-
IN
4
CD54HC4075, CD74HC4075, CD54HCT4075, CD74HCT4075
Switching Specifications Input t , t = 6ns (Continued)
r
f
o
-40 C TO
85 C
o
o
o
o
25 C
-55 C TO 125 C
TEST
PARAMETER
SYMBOL CONDITIONS
V
(V) MIN
TYP MAX
MIN
MAX
MIN
MAX UNITS
CC
Power Dissipation Capacitance
(Notes 3, 4)
C
-
5
-
26
-
-
-
-
-
pF
PD
HCT TYPES
Propagation Delay, Input to
Output (Figure 2)
t
, t
C = 50pF
4.5
5
-
-
-
-
-
-
9
-
24
-
-
-
-
-
-
30
-
-
-
-
-
-
36
-
ns
ns
ns
pF
pF
PLH PHL
L
C = 15pF
L
Transition Times (Figure 2)
Input Capacitance
t
, t
TLH THL
C = 50pF
L
4.5
-
15
10
-
19
10
-
22
10
-
C
-
-
-
IN
Power Dissipation Capacitance
(Notes 3, 4)
C
5
28
PD
NOTES:
3. C
is used to determine the dynamic power consumption, per gate.
2
PD
4. P = V
f (C
PD
+ C ) where f = Input Frequency, C = Output Load Capacitance, V = Supply Voltage.
CC
D
CC
i
L
i
L
Test Circuits and Waveforms
t = 6ns
t = 6ns
f
r
t = 6ns
f
t = 6ns
r
V
CC
3V
90%
50%
10%
2.7V
1.3V
0.3V
INPUT
INPUT
GND
GND
t
t
TLH
THL
t
t
THL
TLH
90%
1.3V
90%
50%
10%
INVERTING
OUTPUT
INVERTING
OUTPUT
10%
t
t
t
t
PLH
PLH
PHL
PHL
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
5
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
CDIP
PDIP
Drawing
5962-8772201CA
CD54HC4075F3A
CD54HCT4075F3A
CD74HC4075E
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
J
14
14
14
14
1
1
TBD
TBD
TBD
Call TI
Call TI
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
J
1
N
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74HC4075M
CD74HC4075M96
CD74HC4075M96E4
CD74HC4075ME4
CD74HC4075MT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HC4075MTE4
CD74HC4075NSR
CD74HC4075NSRG4
CD74HC4075PW
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
NS
NS
PW
PW
PW
PW
PW
PW
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PDIP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HC4075PWE4
CD74HC4075PWR
CD74HC4075PWRE4
CD74HC4075PWT
CD74HC4075PWTE4
CD74HCT4075E
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD74HCT4075EE4
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2005
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2005, Texas Instruments Incorporated
相关型号：
CD74HC4094E96
HC/UH SERIES, 8-BIT RIGHT SERIAL IN PARALLEL OUT SHIFT REGISTER, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16
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