CD74HC597M [TI]

High Speed CMOS Logic 8-Bit Shift Register with Input Storage; 具有输入存储的高速CMOS逻辑8位移位寄存器
CD74HC597M
型号: CD74HC597M
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

High Speed CMOS Logic 8-Bit Shift Register with Input Storage
具有输入存储的高速CMOS逻辑8位移位寄存器

移位寄存器 存储
文件: 总10页 (文件大小:51K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CD74HC597,  
CD74HCT597  
Data sheet acquired from Harris Semiconductor  
SCHS191  
High Speed CMOS Logic  
8-Bit Shift Register with Input Storage  
January 1998  
Features  
Description  
• Buffered Inputs  
The Harris CD74HC597 and CD74HCT597 are high-speed  
silicon gate CMOS devices that are pin-compatible with the  
LSTTL 597 devices. Each device consists of an 8-flip-flop  
input register and an 8-bit parallel-in/serial-in, serial-out shift  
register. Each register is controlled by its own clock. A “low” on  
the parallel load input (PL) shifts parallel stored data asyn-  
chronously into the shift register. A “low” master input (MR)  
• Asynchronous Parallel Load  
[ /Title  
(CD74  
HC597  
,
o
• Typical f  
MAX  
= 60MHz at V = 5V, C = 15pF, T = 25 C  
CC L A  
• Fanout (Over Temperature Range)  
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads  
CD74  
HCT59  
7)  
/Sub-  
ject  
(High  
Speed  
CMOS  
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads clears the shift register. Serial input data can also be synchro-  
nously shifted through the shift register when PL is high.  
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C  
• Balanced Propagation Delay and Transition Times  
Ordering Information  
• Significant Power Reduction Compared to LSTTL  
Logic ICs  
PKG.  
NO.  
o
PART NUMBER TEMP. RANGE ( C) PACKAGE  
• HC Types  
CD74HC597E  
CD74HCT597E  
CD74HC597M  
CD74HCT597M  
NOTES:  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
16 Ld PDIP  
16 Ld PDIP  
E16.3  
E16.3  
- 2V to 6V Operation  
- High Noise Immunity: N = 30%, N = 30% of V  
IL IH CC  
at V  
= 5V  
CC  
16 Ld SOIC M16.15  
16 Ld SOIC M16.15  
• HCT Types  
- 4.5V to 5.5V Operation  
- Direct LSTTL Input Logic Compatibility,  
1. When ordering, use the entire part number. Add the suffix 96 to  
obtain the variant in the tape and reel.  
V = 0.8V (Max), V = 2V (Min)  
IL IH  
- CMOS Input Compatibility, I 1µA at V , V  
OL OH  
l
2. Wafer and die is available which meets all electrical  
specifications. Please contact your local sales office or Harris  
customer service for ordering information.  
Pinout  
CD74HC597, CD74HCT597  
(PDIP, SOIC)  
TOP VIEW  
D1  
D2  
1
2
3
4
5
6
7
8
16 V  
CC  
15 D0  
14 D  
D3  
S
D4  
13 PL  
12 ST  
D5  
CP  
D6  
11 SH  
CP  
10 MR  
Q7  
D7  
9
GND  
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.  
File Number 1915.1  
Copyright © Harris Corporation 1998  
1
CD74HC597, CD74HCT597  
Functional Diagram  
DS  
14  
15  
D0  
1
D1  
2
D2  
3
PARALLEL  
DATA  
D3  
D4  
D5  
D6  
D7  
8-BIT  
SHIFT  
REG.  
8 F/F  
STORAGE  
REG.  
4
5
INPUTS  
6
7
9
Q7  
12  
ST  
CP  
11  
13  
10  
SH  
CP  
PL  
MR  
FUNCTION TABLE  
MR  
ST  
CP  
SH  
PL  
X
L
FUNCTION  
CP  
X
X
H
H
L
Data Loaded to Input Flip-Flops  
X
X
X
Data Loaded from Inputs to Shift Register  
Data Transferred from Input Flip-Flops to Shift Register  
No Clock Edge  
X
L
L
Invalid Logic, State of Shift Register Indeterminate when  
Signals Removed  
X
X
X
H
H
L
Shift Register Cleared  
H
Shift Register Clocked Qn = Qn-1, Q0 = D  
S
NOTE: H = High Voltage Level, L = Low Voltage Level, X = Don’t Care, = Transition from Low to High CP Level  
2
CD74HC597, CD74HCT597  
Absolute Maximum Ratings  
Thermal Information  
o
DC Supply Voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V Thermal Resistance (Typical, Note 3)  
θ
( C/W)  
CC  
DC Input Diode Current, I  
JA  
IK  
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
90  
For V < -0.5V or V > V  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA  
OK  
For V < -0.5V or V > V  
I
I
CC  
160  
o
DC Output Diode Current, I  
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150 C  
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C  
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300 C  
o
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA  
O
O
CC  
o
DC Drain Current, per Output, I  
O
For -0.5V < V < V  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA  
O
CC  
(SOIC - Lead Tips Only)  
DC Output Source or Sink Current per Output Pin, I  
O
For V > -0.5V or V < V  
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA  
O
O
CC  
DC V  
or Ground Current, I  
. . . . . . . . . . . . . . . . . . . . . . . . .±50mA  
CC  
CC  
Operating Conditions  
o
o
Temperature Range, T . . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C  
A
Supply Voltage Range, V  
CC  
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V  
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V  
I
O
CC  
Input Rise and Fall Time  
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)  
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)  
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
3. θ is measured with the component mounted on an evaluation PC board in free air.  
JA  
DC Electrical Specifications  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
TYP  
-40 C TO 85 C -55 C TO 125 C  
V
(V)  
CC  
PARAMETER  
HC TYPES  
SYMBOL  
V (V)  
I
I
(mA)  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
O
High Level Input  
Voltage  
V
-
-
-
2
4.5  
6
1.5  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5  
-
1.5  
-
-
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
µA  
IH  
3.15  
-
-
3.15  
-
-
3.15  
4.2  
4.2  
4.2  
-
Low Level Input  
Voltage  
V
-
2
-
0.5  
1.35  
1.8  
-
-
0.5  
1.35  
1.8  
-
-
0.5  
1.35  
1.8  
-
IL  
4.5  
6
-
-
-
-
-
-
High Level Output  
Voltage  
CMOS Loads  
V
V
or V  
IH IL  
-0.02  
2
1.9  
1.9  
1.9  
OH  
-0.02  
-0.02  
-
4.5  
6
4.4  
-
4.4  
-
4.4  
-
5.9  
-
5.9  
-
5.9  
-
High Level Output  
Voltage  
TTL Loads  
-
-
-
-
-
-
-
-4  
4.5  
6
3.98  
-
3.84  
-
3.7  
-
-5.2  
0.02  
0.02  
0.02  
-
5.48  
-
5.34  
-
5.2  
-
Low Level Output  
Voltage  
CMOS Loads  
V
V
or V  
IH IL  
2
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
OL  
4.5  
6
Low Level Output  
Voltage  
TTL Loads  
-
4
4.5  
6
0.26  
0.26  
±0.1  
0.33  
0.33  
±1  
0.4  
0.4  
±1  
5.2  
-
Input Leakage  
Current  
I
V
or  
6
I
CC  
GND  
3
CD74HC597, CD74HCT597  
DC Electrical Specifications (Continued)  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
V
CC  
PARAMETER  
SYMBOL  
V (V)  
I
(mA)  
(V)  
MIN  
TYP  
MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
Quiescent Device  
Current  
I
V
GND  
or  
0
6
-
-
8
-
80  
-
160  
µA  
CC  
CC  
HCT TYPES  
High Level Input  
Voltage  
V
-
-
-
-
4.5 to  
5.5  
2
-
-
-
-
-
0.8  
-
2
-
-
0.8  
-
2
-
-
0.8  
-
V
V
V
IH  
Low Level Input  
Voltage  
V
4.5 to  
5.5  
IL  
High Level Output  
Voltage  
CMOS Loads  
V
V
V
or V  
-0.02  
4.5  
4.5  
4.5  
4.5  
4.4  
4.4  
4.4  
OH  
IH  
IH  
IL  
High Level Output  
Voltage  
TTL Loads  
-4  
3.98  
-
-
-
-
3.84  
-
3.7  
-
V
V
V
Low Level Output  
Voltage  
CMOS Loads  
V
or V  
0.02  
4
-
-
0.1  
0.26  
-
-
0.1  
0.33  
-
-
0.1  
0.4  
OL  
IL  
Low Level Output  
Voltage  
TTL Loads  
Input Leakage  
Current  
I
V
and  
0
0
-
5.5  
5.5  
-
-
-
±0.1  
8
-
-
-
±1  
80  
-
-
-
±1  
µA  
µA  
µA  
I
CC  
GND  
Quiescent Device  
Current  
I
V
or  
-
160  
490  
CC  
CC  
GND  
Additional Quiescent  
Device Current Per  
Input Pin: 1 Unit Load  
I  
V
4.5 to  
5.5  
100  
360  
450  
CC  
CC  
-2.1  
HCT Input Loading Table  
INPUT  
UNIT LOADS  
D
0.2  
0.3  
1.5  
1.5  
S
D
n
PL, MR  
ST , SH  
CP CP  
NOTE: Unit load is I  
CC  
Table, e.g., 360µA max. at 25 C.  
limit specified in DC Electrical Specifications  
o
Prerequisite for Switching Specifications  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
SYMBOL  
V
(V) MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX UNITS  
CC  
HC TYPES  
SH Frequency  
f
2
6
-
-
-
-
-
-
5
-
-
-
-
-
-
4
-
-
-
-
-
-
MHz  
MHz  
MHz  
CP  
MAX  
4.5  
6
30  
35  
25  
29  
20  
23  
4
CD74HC597, CD74HCT597  
Prerequisite for Switching Specifications (Continued)  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
SYMBOL  
V
(V) MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX UNITS  
CC  
SH  
Pulse Width  
Pulse Width  
t
t
t
t
2
80  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
100  
20  
17  
75  
15  
13  
100  
20  
17  
90  
18  
15  
125  
25  
21  
65  
13  
11  
0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
120  
24  
20  
90  
18  
15  
120  
24  
20  
105  
21  
18  
150  
30  
26  
75  
15  
13  
0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CP  
W
W
W
W
4.5  
6
16  
14  
60  
12  
10  
80  
16  
14  
70  
14  
12  
100  
20  
17  
50  
10  
9
ST  
2
CP  
4.5  
6
MR Pulse Width  
PL Pulse Width  
2
4.5  
6
2
4.5  
6
ST  
CP  
Time  
to SH  
Setup  
t
t
2
CP  
SU  
SU  
4.5  
6
D
D
to SH  
to ST  
Setup Time  
Setup Time  
2
S
n
CP  
CP  
4.5  
6
ST  
CP  
Time  
to SH  
Setup  
t
t
2
0
CP  
H
H
4.5  
6
0
0
0
0
0
0
D
D
to SH  
to ST  
Hold Time  
Hold Time  
2
3
3
3
S
n
CP  
CP  
4.5  
6
3
3
3
3
3
3
MR to SH  
Time  
Removal  
t
2
3
3
3
CP  
REM  
4.5  
6
3
3
3
3
3
3
HCT TYPES  
SH  
Frequency  
f
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
25  
20  
13  
18  
16  
24  
-
-
-
-
-
-
-
-
-
-
-
-
20  
25  
16  
23  
20  
30  
-
-
-
-
-
-
-
-
-
-
-
-
16  
30  
20  
27  
24  
36  
-
-
-
-
-
-
-
-
-
-
-
-
MHz  
ns  
CP  
CP  
CP  
MAX  
SH  
Pulse Width  
Pulse Width  
t
t
t
t
W
W
W
W
ST  
ns  
MR Pulse Width  
PL Pulse Width  
ns  
ns  
ST  
CP  
to SH  
Setup  
t
ns  
CP  
SU  
Time  
5
CD74HC597, CD74HCT597  
Prerequisite for Switching Specifications (Continued)  
o
o
o
o
o
25 C  
TYP  
-
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
SYMBOL  
V
(V) MIN  
MAX  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX UNITS  
CC  
D
D
to SH  
to ST  
Setup Time  
Setup Time  
t
4.5  
10  
-
13  
-
-
15  
-
-
ns  
S
n
CP  
CP  
H
ST to SH Hold Time  
CP CP  
t
t
4.5  
4.5  
0
3
-
-
-
-
0
3
-
-
-
-
0
3
-
-
-
-
ns  
ns  
H
D
D
to SH  
CP  
Hold Time  
Hold Time  
S
H
to ST  
n
CP  
MR to SH  
Time  
Removal  
t
4.5  
10  
-
-
13  
-
-
15  
-
-
ns  
CP  
REM  
Switching Specifications Input t , t = 6ns  
r
f
o
o
o
o
o
25 C  
TYP MAX  
-40 C to 85 C -55 C to 125 C  
TEST  
PARAMETER  
HC TYPES  
Propagation Delay  
SH to Q7  
SYMBOL CONDITIONS  
V
(V) MIN  
MIN  
MAX  
MIN  
MAX UNITS  
CC  
t
t
t
t
t
C = 50pF  
2
-
-
175  
35  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
220  
44  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
265  
53  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
pF  
pF  
PLH, PHL  
L
4.5  
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
CP  
C =15pF  
14  
L
C = 50pF  
6
-
30  
200  
40  
-
37  
250  
50  
-
45  
300  
60  
-
L
PL to Q7  
t
C = 50pF  
2
-
PLH, PHL  
L
4.5  
5
-
C =15pF  
17  
L
C = 50pF  
6
-
34  
240  
48  
-
43  
300  
60  
-
51  
360  
72  
-
L
ST  
CP  
to Q7  
t
C = 50pF  
2
-
PLH, PHL  
L
4.5  
5
-
C =15pF  
20  
L
C = 50pF  
6
-
41  
175  
35  
-
51  
220  
44  
-
61  
265  
53  
-
L
MR to Q7  
t
C = 50pF  
2
-
PLH, PHL  
L
4.5  
5
-
C =15pF  
14  
L
C = 50pF  
6
-
30  
75  
15  
13  
10  
-
37  
95  
19  
16  
10  
-
45  
110  
22  
19  
10  
-
L
Output Transition Time  
Input Capacitance  
t
, t  
TLH THL  
C = 50pF  
2
-
L
4.5  
6
-
-
-
C
C = 50pF  
L
-
I
Power Dissipation  
C
-
5
13.5  
PD  
Capacitance, (Notes 4, 5)  
HCT  
Propagation Delay  
t
t
PLH, PHL  
SH  
CP  
to Q7  
C = 50pF  
4.5  
5
-
-
-
-
-
-
-
16  
-
38  
-
-
-
48  
-
-
-
57  
-
ns  
ns  
ns  
ns  
ns  
ns  
L
C = 15pF  
L
PL to Q7  
t
t
t
C = 50pF  
4.5  
5
48  
-
60  
-
72  
-
PLH, PHL  
L
C = 15pF  
20  
-
-
-
-
-
L
ST  
CP  
to Q7  
t
C = 50pF  
4.5  
5
56  
-
70  
-
84  
-
PLH, PHL  
L
C = 15pF  
23  
L
6
CD74HC597, CD74HCT597  
Switching Specifications Input t , t = 6ns (Continued)  
r
f
o
o
o
o
o
25 C  
-40 C to 85 C -55 C to 125 C  
TEST  
PARAMETER  
MR to Q7  
SYMBOL CONDITIONS  
V
(V) MIN  
TYP MAX  
MIN  
MAX  
55  
-
MIN  
MAX UNITS  
CC  
t
t
C = 50pF  
4.5  
5
-
-
-
-
-
-
18  
-
44  
-
-
-
-
-
-
-
-
-
-
-
66  
-
ns  
ns  
ns  
pF  
pF  
PLH, PHL  
L
C = 15pF  
L
Output Transition Time  
Input Capacitance  
t
, t  
TLH THL  
C = 50pF  
4.5  
-
15  
10  
-
19  
10  
-
22  
10  
-
L
C
C = 50pF  
L
-
I
Power Dissipation  
C
-
5
18.5  
PD  
Capacitance, (Notes 4, 5)  
NOTES:  
4. C  
PD  
is used to determine the dynamic power consumption, per package.  
2
2
5. P = C  
V
f + Σ (C V  
CC  
f ) where: f = Input Frequency, f = Output Frequency, C = Output Load Capacitance, V  
= Supply  
D
PD CC  
i
L
o
i
o
L
CC  
Voltage.  
Test Circuits and Waveforms  
I
t
+ t =  
WH  
WL  
I
t C = 6ns  
fC  
r
L
t
+ t  
=
L
WL  
WH  
t C = 6ns  
t C  
f
L
fC  
t C  
f
L
L
r
L
3V  
V
CC  
90%  
10%  
2.7V  
0.3V  
CLOCK  
CLOCK  
50%  
10%  
1.3V  
0.3V  
50%  
t
50%  
1.3V  
t
1.3V  
GND  
GND  
t
t
WH  
WL  
WH  
WL  
NOTE: Outputs should be switching from 10% V  
to 90% V  
in  
NOTE: Outputs should be switching from 10% V  
to 90% V  
in  
CC  
CC  
CC  
CC  
accordance with device truth table. For f  
, input duty cycle = 50%. accordance with device truth table. For f , input duty cycle = 50%.  
MAX  
MAX  
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND  
PULSE WIDTH  
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND  
PULSE WIDTH  
t = 6ns  
t = 6ns  
t = 6ns  
t = 6ns  
r
f
r
f
V
3V  
CC  
90%  
50%  
10%  
2.7V  
1.3V  
0.3V  
INPUT  
INPUT  
GND  
GND  
t
t
t
t
THL  
TLH  
THL  
TLH  
90%  
1.3V  
90%  
50%  
10%  
INVERTING  
OUTPUT  
INVERTING  
OUTPUT  
10%  
t
t
PLH  
PHL  
t
t
PLH  
PHL  
FIGURE 3. HC TRANSITION TIMES AND PROPAGATION  
DELAY TIMES, COMBINATION LOGIC  
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION  
DELAY TIMES, COMBINATION LOGIC  
7
CD74HC597, CD74HCT597  
Test Circuits and Waveforms (Continued)  
t C  
t C  
t C  
t C  
r
L
f
L
f
L
r
L
V
3V  
CC  
90%  
10%  
2.7V  
0.3V  
CLOCK  
INPUT  
CLOCK  
INPUT  
50%  
1.3V  
GND  
GND  
t
t
t
t
H(L)  
H(H)  
H(H)  
H(L)  
V
3V  
CC  
DATA  
INPUT  
DATA  
INPUT  
50%  
1.3V  
t
SU(L)  
1.3V  
1.3V  
GND  
GND  
t
t
t
SU(H)  
SU(H)  
SU(L)  
t
t
90%  
50%  
t
t
THL  
TLH  
THL  
TLH  
90%  
1.3V  
90%  
90%  
1.3V  
OUTPUT  
OUTPUT  
10%  
10%  
t
t
t
PLH  
t
PHL  
PHL  
PLH  
t
REM  
t
REM  
V
3V  
CC  
SET, RESET  
OR PRESET  
SET, RESET  
OR PRESET  
50%  
1.3V  
GND  
GND  
IC  
IC  
C
C
L
L
50pF  
50pF  
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,  
AND PROPAGATION DELAY TIMES FOR EDGE  
TRIGGERED SEQUENTIAL LOGIC CIRCUITS  
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,  
AND PROPAGATION DELAY TIMES FOR EDGE  
TRIGGERED SEQUENTIAL LOGIC CIRCUITS  
8
CD74HC597, CD74HCT597  
Timing Diagram  
SHIFT CLOCK  
SH  
CP  
SERIAL DATE  
D
S
MASTER RESET  
MR  
PARALLEL LOAD  
PL  
STORAGE CLOCK  
ST  
CP  
L
D0  
L
H
L
D1  
D2  
D3  
D4  
D5  
D6  
D7  
Q7  
L
L
L
L
H
L
L
L
L
PARALLEL  
DATA  
INPUTS  
H
H
L
H
L
L
H
L
H
H
L
H
L
H
L
H
H
L
H
L
H
L
H
L
L
L
H
L
H
H
RESET  
SHIFT  
REGISTER  
SERIAL  
SHIFT  
SERIAL  
SHIFT  
SERIAL  
SHIFT  
SERIAL  
SHIFT  
LOAD  
FLIP-FLOPS  
PARALLEL LOAD  
SHIFT REGISTER  
LOAD  
FLIP-FLOPS  
PARALLEL LOAD  
SHIFT REGISTER  
PARALLEL LOAD FLIP-FLOPS  
AND SHIFT REGISTER  
9
IMPORTANT NOTICE  
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any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
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BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
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Copyright 1999, Texas Instruments Incorporated  

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