CD74HC75 [TI]

Dual 2-Bit Bistable Transparent Latch; 双路2位双稳态透明锁存器
CD74HC75
型号: CD74HC75
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Dual 2-Bit Bistable Transparent Latch
双路2位双稳态透明锁存器

锁存器
文件: 总8页 (文件大小:58K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CD74HC75,  
CD74HCT75  
Data sheet acquired from Harris Semiconductor  
SCHS135  
Dual 2-Bit Bistable  
Transparent Latch  
March 1998  
at V  
= 5V  
Features  
CC  
• HCT Types  
• True and Complementary Outputs  
• Buffered Inputs and Outputs  
- 4.5V to 5.5V Operation  
[ /Title  
(CD74  
HC75,  
CD74  
HCT75  
)
/Sub-  
ject  
(Dual  
2-Bit  
Bistabl  
e
- Direct LSTTL Input Logic Compatibility,  
• Fanout (Over Temperature Range)  
V = 0.8V (Max), V = 2V (Min)  
IL IH  
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads  
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads  
- CMOS Input Compatibility, I 1µA at V , V  
OL OH  
l
Description  
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C  
• Balanced Propagation Delay and Transition Times  
The Harris CD74HC75 and CD74HCT75 are dual 2-bit  
bistable transparent latches. Each one of the 2-bit latches is  
controlled by separate Enable inputs (1E and 2E) which are  
active LOW. When the Enable input is HIGH data enters the  
latch and appears at the Q output. When the Enable input  
(1E and 2E) is LOW the output is not affected.  
• Significant Power Reduction Compared to LSTTL  
Logic ICs  
• HC Types  
- 2V to 6V Operation  
- High Noise Immunity: N = 30%, N = 30% of V  
CC  
Ordering Information  
IL  
IH  
Pinout  
CD74HC75, CD74HCT75  
(PDIP, SOIC)  
TOP VIEW  
1Q0  
1D0  
1D1  
2E  
1
2
3
4
5
6
7
8
16 1Q0  
15 1Q1  
14 1Q1  
13 1E  
V
12 GND  
11 2Q0  
10 2Q0  
CC  
2D0  
2D1  
2Q1  
9
2Q1  
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.  
File Number 1666.1  
Copyright © Harris Corporation 1998  
1
CD74HC75, CD74HCT75  
Functional Diagram  
16 (10)  
1 (11)  
14 (8)  
15 (9)  
Q0  
2 (6)  
D0  
Q0  
Q1  
Q1  
1 OF 2  
LATCHES  
3 (7)  
D1  
E
13 (4)  
TRUTH TABLE  
INPUTS  
OUTPUTS  
D
L
E
Q
L
Q
H
H
H
L
H
X
H
L
Q0  
Q0  
NOTE:  
H = High Level  
L
X
= Low Level  
= Don’t Care  
Q0 = The level of Q before the transition of E.  
LATCH 0  
2 (6)  
16 (10)  
Q0  
D0  
D
Q
LE  
LE  
1 (11)  
Q0  
13 (4)  
E
LE  
LE  
P
N
P
N
14 (8)  
Q1  
Q
LE  
D
LE  
Q
3 (7)  
D1  
LE  
Q
LE  
15 (9)  
Q1  
LATCH 1  
5
V
CC  
12  
GND  
FIGURE 1. LOGIC DIAGRAM  
FIGURE 2. LATCH DETAIL  
2
CD74HC75, CD74HCT75  
Absolute Maximum Ratings  
Thermal Information  
o
DC Supply Voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V  
Thermal Resistance (Typical, Note 3)  
θ
( C/W)  
CC  
DC Input Diode Current, I  
For V < -0.5V or V > V  
JA  
IK  
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
90  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA  
I
I
CC  
115  
o
DC Drain Current, per Output, I  
O
Maximum Junction Temperature (Hermetic Package or Die) . . . 175 C  
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150 C  
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C  
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C  
o
For -0.5V < V < V  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA  
O
CC  
o
o
DC Output Diode Current, I  
OK  
For V < -0.5V or V > V  
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA  
O
O
CC  
DC Output Source or Sink Current per Output Pin, I  
O
(SOIC - Lead Tips Only)  
For V > -0.5V or V < V  
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA  
O
O
CC  
DC V  
or Ground Current, I  
. . . . . . . . . . . . . . . . . . . . . . . . .±50mA  
CC  
CC  
Operating Conditions  
o
o
Temperature Range, T . . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C  
A
Supply Voltage Range, V  
CC  
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V  
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V  
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V  
I
O
CC  
Input Rise and Fall Time  
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)  
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)  
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
3. θ is measured with the component mounted on an evaluation PC board in free air.  
JA  
DC Electrical Specifications  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
HC TYPES  
SYMBOL V (V)  
I
(mA)  
V
(V) MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
CC  
High Level Input  
Voltage  
V
-
-
-
2
1.5  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5  
-
1.5  
-
-
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
µA  
IH  
4.5  
3.15  
-
-
3.15  
-
-
3.15  
6
2
4.2  
4.2  
4.2  
-
Low Level Input  
Voltage  
V
-
-
0.5  
1.35  
1.8  
-
-
0.5  
1.35  
1.8  
-
-
0.5  
1.35  
1.8  
-
IL  
4.5  
6
-
-
-
-
-
-
High Level Output  
Voltage  
CMOS Loads  
V
V
or  
-0.02  
2
1.9  
1.9  
1.9  
OH  
IH  
V
IL  
4.5  
6
4.4  
-
4.4  
-
4.4  
-
5.9  
-
5.9  
-
5.9  
-
High Level Output  
Voltage  
TTL Loads  
-
-
-
-
-
-
-
-
-4  
4.5  
6
3.98  
-
3.84  
-
3.7  
-
-5.2  
5.48  
-
5.34  
-
5.2  
-
Low Level Output  
Voltage  
CMOS Loads  
V
V
or  
0.02  
2
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
OL  
IH  
V
IL  
4.5  
6
Low Level Output  
Voltage  
TTL Loads  
-
4
-
4.5  
6
0.26  
0.26  
±0.1  
0.33  
0.33  
±1  
0.4  
0.4  
±1  
5.2  
-
Input Leakage  
Current  
I
V
or  
6
I
CC  
GND  
3
CD74HC75, CD74HCT75  
DC Electrical Specifications (Continued)  
TEST  
o
o
o
o
o
CONDITIONS  
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
SYMBOL V (V)  
I
(mA)  
V
(V) MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
CC  
Quiescent Device  
Current  
I
V
GND  
or  
0
6
-
-
4
-
40  
-
80  
µA  
CC  
CC  
HCT TYPES  
High Level Input  
Voltage  
V
-
-
-
-
-
4.5 to  
5.5  
2
-
-
-
-
-
0.8  
-
2
-
-
0.8  
-
2
-
-
0.8  
-
V
V
V
IH  
Low Level Input  
Voltage  
V
4.5 to  
5.5  
IL  
High Level Output  
Voltage  
V
V
or  
IH  
4.5  
4.4  
4.4  
4.4  
OH  
V
IL  
CMOS Loads  
High Level Output  
Voltage  
-0.02  
4.5  
3.98  
-
-
3.84  
-
3.7  
-
V
TTL Loads  
Low Level Output  
Voltage CMOS Loads  
V
V
V
or  
IH  
-4  
4.5  
4.5  
-
-
-
-
0.1  
-
-
0.1  
-
-
0.1  
0.4  
V
V
OL  
IL  
Low Level Output  
Voltage  
TTL Loads  
0.02  
4
0.26  
0.33  
Input Leakage  
Current  
I
V
and  
GND  
5.5  
5.5  
-
±0.1  
-
±1  
-
±1  
µA  
I
CC  
Quiescent Device  
Current  
I
V
or  
0
-
-
-
-
4
-
-
40  
-
-
80  
µA  
µA  
CC  
CC  
GND  
Additional Quiescent  
Device Current Per  
Input Pin: 1 Unit Load  
I  
CC  
(Note 4)  
V
4.5 to  
5.5  
100  
360  
450  
490  
CC  
- 2.1  
NOTE:  
4. For dual-supply systems theoretical worst case (V = 2.4V, V  
I
= 5.5V) specification is 1.8mA.  
CC  
HCT Input Loading Table  
INPUT  
D0, D1  
UNIT LOADS  
0.8  
1.2  
1E, 2E  
NOTE: Unit Load is I  
tions table, e.g., 360µA max at 25 C.  
limit specified in DC Electrical Specifica-  
CC  
o
Prerequisite For Switching Specifications  
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
TEST  
V
CC  
PARAMETER  
HC TYPES  
SYMBOL CONDITIONS (V)  
MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
Pulse Width Enable Input  
t
-
-
2
80  
16  
14  
60  
12  
10  
-
-
-
-
-
-
-
-
-
-
-
-
100  
20  
17  
75  
15  
13  
-
-
-
-
-
-
120  
24  
20  
90  
18  
15  
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
W
4.5  
6
Setup Time D to Enable  
t
2
SU  
4.5  
6
4
CD74HC75, CD74HCT75  
Prerequisite For Switching Specifications (Continued)  
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
TEST  
V
CC  
PARAMETER  
SYMBOL CONDITIONS (V)  
MIN TYP MAX  
MIN  
3
MAX  
MIN  
3
MAX  
UNITS  
ns  
Hold Time Enable to D  
t
-
2
4.5  
6
3
3
3
-
-
-
-
-
-
-
-
-
-
-
-
H
3
3
ns  
3
3
ns  
HCT TYPES  
Pulse Width Enable Input  
t
-
-
-
4.5  
4.5  
4.5  
16  
12  
3
-
-
-
-
-
-
20  
15  
3
-
-
-
24  
18  
3
-
-
-
ns  
ns  
ns  
W
Setup Time D to Enable  
Hold Time Enable to D  
t
SU  
t
H
Switching Specifications Input t , t = 6ns  
r
f
o
o
o
o
o
25 C  
MIN TYP MAX  
-40 C TO 85 C -55 C TO 125 C  
TEST  
V
CC  
PARAMETER  
HC TYPES  
SYMBOL CONDITIONS (V)  
MIN  
MAX  
MIN  
MAX  
UNITS  
Propagation Delay,  
Data to Q  
t
t
t
t
, t  
C = 50pF  
2
4.5  
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
110  
22  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
140  
28  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
165  
33  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
pF  
pF  
PLH PHL  
L
C = 50pF  
L
C = 15pF  
9
-
L
C = 50pF  
6
19  
130  
26  
-
24  
165  
33  
-
28  
195  
39  
-
L
Propagation Delay,  
Data to Q  
, t  
PLH PHL  
C = 50pF  
2
-
L
C = 50pF  
4.5  
5
-
L
C = 15pF  
10  
-
L
C = 50pF  
6
22  
130  
26  
-
28  
165  
33  
-
33  
195  
39  
-
L
Propagation Delay,  
Enable to Q  
, t  
PLH PHL  
C = 50pF  
2
-
L
C = 50pF  
4.5  
5
-
L
C = 15pF  
10  
-
L
C = 50pF  
6
22  
130  
26  
-
28  
165  
33  
-
33  
195  
39  
-
L
Propagation Delay,  
Enable to Q  
, t  
PLH PHL  
C = 50pF  
2
-
L
C = 50pF  
4.5  
5
-
L
C = 15pF  
11  
-
L
C = 50pF  
6
22  
75  
15  
13  
10  
-
28  
95  
19  
16  
10  
-
33  
110  
22  
19  
10  
-
L
Output Transition Time  
Input Capacitance  
t
, t  
TLH THL  
C = 50pF  
2
-
L
C = 50pF  
4.5  
6
-
L
C = 50pF  
L
-
C
-
-
-
-
I
Power Dissipation Capacitance  
(Notes 5, 6)  
C
5
46  
PD  
HCT TYPES  
Propagation Delay,  
Data to Q  
t
t
t
, t  
C = 50pF  
4.5  
5
-
-
-
-
-
-
11  
-
28  
-
-
-
-
-
-
-
35  
-
-
-
-
-
-
-
42  
-
ns  
ns  
ns  
ns  
ns  
ns  
PLH PHL  
L
C = 15pF  
L
Propagation Delay,  
Data to Q  
, t  
PLH PHL  
C = 50pF  
4.5  
5
28  
-
35  
-
42  
-
L
C = 15pF  
11  
-
L
Propagation Delay,  
Enable to Q  
, t  
PLH PHL  
C = 50pF  
4.5  
5
28  
-
35  
-
42  
-
L
C = 15pF  
11  
L
5
CD74HC75, CD74HCT75  
Switching Specifications Input t , t = 6ns (Continued)  
r
f
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
TEST  
V
CC  
PARAMETER  
Propagation Delay,  
SYMBOL CONDITIONS (V)  
MIN TYP MAX  
MIN  
MAX  
38  
-
MIN  
MAX  
45  
-
UNITS  
ns  
t
, t  
C = 50pF  
4.5  
5
-
-
-
-
-
-
12  
-
30  
-
-
-
-
-
-
-
-
-
-
-
PLH PHL  
L
Enable to Q  
C = 15pF  
ns  
L
Output Transition Time  
Input Capacitance  
t
, t  
TLH THL  
C = 50pF  
L
4.5  
-
15  
10  
-
19  
10  
-
22  
10  
-
ns  
C
-
-
-
pF  
I
Power Dissipation Capacitance  
(Notes 5, 6)  
C
5
46  
pF  
PD  
NOTES:  
5. C  
is used to determine the dynamic power consumption, per latch.  
2
PD  
6. P = V  
f (C  
PD  
+ C ) where f = input frequency, C = output load capacitance, V  
= supply voltage.  
D
CC  
i
L
i
L
CC  
Test Circuits and Waveforms  
I
t
+ t  
WH  
=
WL  
I
t C = 6ns  
fC  
L
r
L
t
+ t  
=
WL  
WH  
t C = 6ns  
t C  
f
L
f
t C  
f
L
CL  
r
L
3V  
V
CC  
90%  
10%  
2.7V  
CLOCK  
CLOCK  
50%  
10%  
1.3V  
0.3V  
50%  
t
50%  
1.3V  
t
1.3V  
0.3V  
GND  
GND  
t
t
WH  
WL  
WH  
WL  
NOTE: Outputs should be switching from 10% V  
to 90% V  
in  
NOTE: Outputs should be switching from 10% V  
to 90% V  
in  
CC  
CC  
CC  
CC  
accordance with device truth table. For f  
, input duty cycle = 50%.  
accordance with device truth table. For f  
, input duty cycle = 50%.  
MAX  
MAX  
FIGURE 3. HC CLOCK PULSE RISE AND FALL TIMES AND  
PULSE WIDTH  
FIGURE 4. HCT CLOCK PULSE RISE AND FALL TIMES AND  
PULSE WIDTH  
t = 6ns  
t = 6ns  
t = 6ns  
t = 6ns  
r
f
r
f
V
3V  
CC  
90%  
50%  
10%  
2.7V  
1.3V  
0.3V  
INPUT  
INPUT  
GND  
GND  
t
t
t
t
THL  
TLH  
THL  
TLH  
90%  
1.3V  
90%  
50%  
10%  
INVERTING  
OUTPUT  
INVERTING  
OUTPUT  
10%  
t
t
PLH  
PHL  
t
t
PLH  
PHL  
FIGURE 5. HC AND HCU TRANSITION TIMES AND PROPAGA-  
TION DELAY TIMES, COMBINATION LOGIC  
FIGURE 6. HCT TRANSITION TIMES AND PROPAGATION  
DELAY TIMES, COMBINATION LOGIC  
6
CD74HC75, CD74HCT75  
Test Circuits and Waveforms (Continued)  
t C  
t C  
t C  
t C  
r
L
f
L
f
L
r
L
V
3V  
CC  
90%  
10%  
2.7V  
0.3V  
CLOCK  
INPUT  
CLOCK  
INPUT  
50%  
1.3V  
GND  
GND  
t
t
t
t
H(L)  
H(H)  
H(H)  
H(L)  
V
3V  
CC  
DATA  
INPUT  
DATA  
INPUT  
50%  
1.3V  
t
SU(L)  
1.3V  
1.3V  
GND  
GND  
t
t
t
SU(H)  
SU(H)  
SU(L)  
t
t
90%  
50%  
t
t
THL  
TLH  
THL  
TLH  
90%  
1.3V  
90%  
90%  
1.3V  
OUTPUT  
OUTPUT  
10%  
10%  
t
t
t
PLH  
t
PHL  
PHL  
PLH  
t
REM  
t
REM  
V
3V  
CC  
SET, RESET  
OR PRESET  
SET, RESET  
OR PRESET  
50%  
1.3V  
GND  
GND  
IC  
IC  
C
C
L
L
50pF  
50pF  
FIGURE 7. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,  
AND PROPAGATION DELAY TIMES FOR EDGE  
TRIGGERED SEQUENTIAL LOGIC CIRCUITS  
FIGURE 8. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,  
AND PROPAGATION DELAY TIMES FOR EDGE  
TRIGGERED SEQUENTIAL LOGIC CIRCUITS  
7
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
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party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1998, Texas Instruments Incorporated  

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