CD74HCT280E [TI]

High-Speed CMOS Logic 9-Bit Odd/Even Parity Generator/Checker; 高速CMOS逻辑9位奇/偶校验发生器/校验器
CD74HCT280E
型号: CD74HCT280E
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

High-Speed CMOS Logic 9-Bit Odd/Even Parity Generator/Checker
高速CMOS逻辑9位奇/偶校验发生器/校验器

运算电路
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CD54HC280, CD74HC280,  
CD54HCT280, CD74HCT280  
Data sheet acquired from Harris Semiconductor  
SCHS175D  
High-Speed CMOS Logic  
9-Bit Odd/Even Parity Generator/Checker  
November 1997 - Revised October 2003  
Features  
Description  
• Typical Propagation Delay = 17ns at V  
o
= 5V,  
The ’HC280 and ’HCT280 are 9-bit odd/even parity, generator  
checker devices. Both even and odd parity outputs are  
available for checking or generating parity for words up to nine  
bits long. Even parity is indicated (ΣE output is high) when an  
even number of data inputs is high. Odd parity is indicated  
(ΣO output is high) when an odd number of data inputs is  
high. Parity checking for words larger than 9 bits can be  
accomplished by tying the ΣE output to any input of an  
additional HC/HCT280 parity checker.  
CC  
C = 15pF, T = 25 C  
L
A
[ /Title  
(CD74  
HC280  
,
• Replaces LS180 Types  
• Easily Cascadable  
• Fanout (Over Temperature Range)  
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads  
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads  
CD74  
HCT28  
0)  
/Sub-  
ject  
(High  
Speed  
CMOS  
Logic  
9-Bit  
Odd/E  
ven  
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C  
• Balanced Propagation Delay and Transition Times  
Ordering Information  
TEMP. RANGE  
o
• Significant Power Reduction Compared to LSTTL  
Logic ICs  
PART NUMBER  
CD54HC280F3A  
CD54HCT280F3A  
CD74HC280E  
( C)  
PACKAGE  
14 Ld CERDIP  
14 Ld CERDIP  
14 Ld PDIP  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
• HC Types  
- 2V to 6V Operation  
- High Noise Immunity: N = 30%, N = 30% of V  
IL IH CC  
at V  
= 5V  
CC  
CD74HC280MT  
CD74HC280M96  
CD74HCT280E  
14 Ld SOIC  
• HCT Types  
- 4.5V to 5.5V Operation  
- Direct LSTTL Input Logic Compatibility,  
14 Ld SOIC  
14 Ld PDIP  
Parity  
V = 0.8V (Max), V = 2V (Min)  
IL IH  
NOTE: When ordering, use the entire part number. The suffix 96  
denotes tape and reel. The suffix T denotes a small-quantity reel  
of 250.  
- CMOS Input Compatibility, I 1µA at V , V  
l
OL OH  
Pinout  
Functional Diagram  
CD54HC280, CD54HCT280  
(CERDIP)  
8
I0  
CD74HC280  
(PDIP, SOIC)  
CD74HCT280  
(PDIP)  
9
I1  
10  
I2  
5
EVEN  
TOP VIEW  
11  
I3  
12  
I6  
I7  
1
2
3
4
5
6
7
14 V  
CC  
I4  
I5  
I6  
6
ODD  
13  
1
13 I5  
12 I4  
11 I3  
10 I2  
NC  
I8  
2
4
I7  
I8  
GND = 7  
= 14  
ΣE  
V
CC  
NC = 3  
ΣO  
GND  
9
8
I1  
I0  
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.  
Copyright © 2003, Texas Instruments Incorporated  
1
CD54HC280, CD74HC280, CD54HCT280, CD74HCT280  
Absolute Maximum Ratings  
Thermal Information  
o
DC Supply Voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V  
Thermal Resistance (Typical, Note1)  
θ
( C/W)  
CC  
DC Input Diode Current, I  
For V < -0.5V or V > V  
JA  
IK  
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .  
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .  
80  
86  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA  
OK  
For V < -0.5V or V > V  
I
I
CC  
o
DC Output Diode Current, I  
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150 C  
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C  
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C  
o
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA  
O
O
CC  
o
DC Drain Current, per Output, I  
O
For -0.5V < V < V  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA  
O
CC  
(SOIC - Lead Tips Only)  
DC Output Source or Sink Current per Output Pin, I  
O
For V > -0.5V or V < V  
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA  
O
O
CC  
DC V  
or Ground Current, I  
. . . . . . . . . . . . . . . . . . . . . . . . .±50mA  
CC  
CC  
Operating Conditions  
o
o
Temperature Range, T . . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C  
A
Supply Voltage Range, V  
CC  
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V  
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V  
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V  
I
O
CC  
Input Rise and Fall Time  
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)  
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)  
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
1. The package thermal impedance is calculated in accordance with JESD 51-7.  
DC Electrical Specifications  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
HC TYPES  
SYMBOL V (V)  
I
(mA)  
V
(V) MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
CC  
High Level Input  
Voltage  
V
-
-
-
2
1.5  
3.15  
4.2  
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5  
3.15  
4.2  
-
-
1.5  
3.15  
4.2  
-
-
V
V
V
V
V
V
V
V
V
V
V
IH  
4.5  
-
-
-
6
2
-
-
-
Low Level Input  
Voltage  
V
-
0.5  
0.5  
0.5  
IL  
4.5  
6
-
1.35  
-
1.35  
-
1.35  
-
1.8  
-
1.8  
-
1.8  
High Level Output  
Voltage  
CMOS Loads  
V
V
V
or  
-0.02  
2
1.9  
4.4  
5.9  
3.98  
5.48  
-
-
-
-
-
1.9  
4.4  
5.9  
3.84  
5.34  
-
-
-
-
-
1.9  
4.4  
5.9  
3.7  
5.2  
-
-
-
-
-
OH  
IH  
V
IL  
-0.02  
-0.02  
-4  
4.5  
6
High Level Output  
Voltage  
TTL Loads  
4.5  
6
-5.2  
Low Level Output  
Voltage  
CMOS Loads  
V
or  
0.02  
0.02  
0.02  
4
2
4.5  
6
-
-
-
-
-
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
0.1  
0.1  
0.1  
0.4  
0.4  
V
V
V
V
V
OL  
IH  
V
IL  
0.1  
0.1  
Low Level Output  
Voltage  
TTL Loads  
4.5  
6
0.26  
0.26  
0.33  
0.33  
5.2  
Input Leakage  
Current  
I
V
or  
-
6
6
-
-
-
-
±0.1  
-
-
±1  
-
-
±1  
µA  
µA  
I
CC  
GND  
Quiescent Device  
Current  
I
V
or  
0
8
80  
160  
CC  
CC  
GND  
2
CD54HC280, CD74HC280, CD54HCT280, CD74HCT280  
DC Electrical Specifications  
(Continued)  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
HCT TYPES  
SYMBOL V (V)  
I
(mA)  
V (V) MIN TYP MAX  
CC  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
High Level Input  
Voltage  
V
-
-
-
-
4.5 to  
5.5  
2
-
-
-
-
-
0.8  
-
2
-
-
0.8  
-
2
-
-
0.8  
-
V
V
V
IH  
Low Level Input  
Voltage  
V
4.5 to  
5.5  
IL  
High Level Output  
Voltage  
CMOS Loads  
V
V
V
or  
-0.02  
4.5  
4.5  
4.5  
4.5  
4.4  
4.4  
4.4  
OH  
IH  
V
IL  
High Level Output  
Voltage  
TTL Loads  
-4  
3.98  
-
-
-
-
3.84  
-
3.7  
-
V
V
V
Low Level Output  
Voltage  
CMOS Loads  
V
or  
0.02  
4
-
-
0.1  
0.26  
-
-
0.1  
0.33  
-
-
0.1  
0.4  
OL  
IH  
V
IL  
Low Level Output  
Voltage  
TTL Loads  
Input Leakage  
Current  
I
V
to  
0
0
-
5.5  
5.5  
-
-
-
-
-
±0.1  
8
-
-
-
±1  
80  
-
-
-
±1  
µA  
µA  
µA  
I
CC  
GND  
Quiescent Device  
Current  
I
V
or  
160  
490  
CC  
CC  
GND  
Additional Quiescent  
Device Current Per  
Input Pin: 1 Unit Load  
I  
CC  
(Note 2)  
V
4.5 to  
5.5  
100  
360  
450  
CC  
-2.1  
NOTE:  
2. For dual-supply systems theoretical worst case (V = 2.4V, V  
I
= 5.5V) specification is 1.8mA.  
CC  
HCT Input Loading Table  
INPUT  
All  
UNIT LOADS  
1
NOTE: Unit Load is I  
Specifications table, e.g., 360µA max at 25 C.  
limit specified in DC Electrical  
o
CC  
Switching Specifications Input t , t = 6ns  
r
f
o
-55 C TO  
125 C  
o
o
o
o
25 C  
-40 C TO 85 C  
TEST  
PARAMETER  
HC TYPES  
SYMBOL  
CONDITIONS  
V
(V)  
TYP  
MAX  
MAX  
MAX  
UNITS  
CC  
Propagation Delay,  
Any Input to ΣO  
t
, t  
PLH PHL  
C = 50pF  
2
-
-
200  
40  
34  
-
250  
50  
43  
-
300  
60  
51  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
L
4.5  
6
5
2
-
C = 15pF  
17  
-
L
Propagation Delay,  
Any Input to ΣE  
t , t  
PLH PHL  
C = 50pF  
200  
40  
34  
-
250  
50  
43  
-
300  
60  
51  
-
L
4.5  
6
-
-
C = 15pF  
5
17  
L
3
CD54HC280, CD74HC280, CD54HCT280, CD74HCT280  
Switching Specifications Input t , t = 6ns (Continued)  
r
f
o
-55 C TO  
125 C  
o
o
o
o
25 C  
-40 C TO 85 C  
TEST  
PARAMETER  
SYMBOL  
CONDITIONS  
V
(V)  
TYP  
MAX  
75  
15  
13  
10  
-
MAX  
95  
19  
16  
10  
-
MAX  
110  
22  
UNITS  
ns  
CC  
Output Transition Time  
t
, t  
TLH THL  
C = 50pF  
L
2
-
-
4.5  
ns  
6
-
-
19  
ns  
Input Capacitance  
C
-
-
-
10  
pF  
I
Power Dissipation  
Capacitance  
C
5
58  
-
pF  
PD  
(Notes 3, 4)  
HCT TYPES  
Propagation Delay,  
Any Input to ΣO  
t
, t  
PLH PHL  
C = 50pF  
4.5  
5
-
19  
-
45  
-
56  
-
68  
-
ns  
ns  
ns  
ns  
ns  
pF  
pF  
L
C = 15pF  
L
Propagation Delay,  
Any Input to ΣE  
t , t  
PLH PHL  
C = 50pF  
4.5  
5
42  
-
53  
-
63  
-
L
C = 15pF  
18  
-
L
Output Transition Time  
Input Capacitance  
t
, t  
TLH THL  
C = 50pF  
L
4.5  
-
15  
10  
-
19  
10  
-
22  
10  
-
C
-
-
-
IN  
Power Dissipation  
Capacitance  
C
5
58  
PD  
(Notes 3, 4)  
NOTES:  
3. C  
is used to determine the dynamic power consumption, per package.  
2
PD  
4. P = V  
f (C  
PD  
+ C ) where f = Input Frequency, f = Output Frequency, C = Output Load Capacitance, V  
= Supply Voltage.  
D
CC  
i
L
i
O
L
CC  
Test Circuits and Waveforms  
t = 6ns  
t = 6ns  
t = 6ns  
t = 6ns  
r
f
r
f
V
3V  
CC  
90%  
50%  
10%  
2.7V  
1.3V  
0.3V  
INPUT  
INPUT  
GND  
GND  
t
t
t
t
THL  
TLH  
THL  
TLH  
90%  
1.3V  
90%  
50%  
10%  
INVERTING  
OUTPUT  
INVERTING  
OUTPUT  
10%  
t
t
PLH  
PHL  
t
t
PLH  
PHL  
FIGURE 1. HC TRANSITION TIMES AND PROPAGATION  
DELAY TIMES, COMBINATION LOGIC  
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION  
DELAY TIMES, COMBINATION LOGIC  
4
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Sep-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CDIP  
CDIP  
PDIP  
Drawing  
8607701CA  
CD54HC280F3A  
CD54HCT280F3A  
CD74HC280E  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
J
J
14  
14  
14  
14  
1
1
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
J
1
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
CD74HC280EE4  
CD74HC280M96  
CD74HC280M96E4  
CD74HC280MT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
N
D
D
D
D
N
N
14  
14  
14  
14  
14  
14  
14  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HC280MTE4  
CD74HCT280E  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
CD74HCT280EE4  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
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