CD74HCT297 [TI]

High-Speed CMOS Logic Digital Phase-Locked-Loop; 高速CMOS逻辑数字锁相环回路
CD74HCT297
型号: CD74HCT297
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

High-Speed CMOS Logic Digital Phase-Locked-Loop
高速CMOS逻辑数字锁相环回路

文件: 总11页 (文件大小:99K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CD74HC297,  
CD74HCT297  
Data sheet acquired from Harris Semiconductor  
SCHS177  
High-Speed CMOS Logic  
Digital Phase-Locked-Loop  
November 1997  
Features  
Description  
• Digital Design Avoids Analog Compensation Errors  
• Easily Cascadable for Higher Order Loops  
The Harris CD74HC297 and CD74HCT297 are high-speed  
silicon gate CMOS devices that are pin-compatible with low  
power Schottky TTL (LSTTL).  
[ /Title  
(CD74  
HC297  
,
CD74  
HCT29  
7)  
• Useful Frequency Range  
These devices are designed to provide a simple, cost-effec-  
tive solution to high-accuracy, digital, phase-locked-loop appli-  
cations. They contain all the necessary circuits, with the  
exception of the divide-by-N counter, to build first-order  
phase-locked-loops.  
- K-Clock . . . . . . . . . . . . . . . . . . . . . . . . . .DC to 55MHz (Typ)  
- I/D-Clock . . . . . . . . . . . . . . . . . . . . DC to 35MHz (Typ)  
• Dynamically Variable Bandwidth  
• Very Narrow Bandwidth Attainable  
• Power-On Reset  
Both EXCLUSIVE-OR (XORPD) and edge-controlled phase  
detectors (ECPD) are provided for maximum flexibility. The  
input signals for the EXCLUSIVE-OR phase detector must  
have a 50% duty factor to obtain the maximum lock-range.  
/Sub-  
ject  
• Output Capability  
- Standard. . . . . . . . . . . . . . . . . . . . XORPD  
, ECPD  
OUT  
OUT  
OUT  
(High-  
Speed  
CMOS  
Logic  
Digi-  
tal  
Proper partitioning of the loop function, with many of the build-  
ing blocks external to the package, makes it easy for the  
designer to incorporate ripple cancellation (see Figure 2) or to  
cascade to higher order phase-locked-loops.  
- Bus Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I/D  
• Fanout (Over Temperature Range)  
- Standard Outputs . . . . . . . . . . . . . . . . . . 10 LSTTL Loads  
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads  
The length of the up/down K-counter is digitally programmable  
according to the K-counter function table. With A, B, C and D  
all LOW, the K-counter is disabled. With A HIGH and B, C and  
D LOW, the K-counter is only three stages long, which widens  
the bandwidth or capture range and shortens the lock time of  
the loop. When A, B, C and D are all programmed HIGH, the  
K-counter becomes seventeen stages long, which narrows  
the bandwidth or capture range and lengthens the lock time.  
Real-time control of loop bandwidth by manipulating the A to  
D inputs can maximize the overall performance of the digital  
phase-locked-loop.  
• Balanced Propagation Delay and Transition Times  
• Significant Power Reduction Compared to LSTTL  
Logic ICs  
Phase-  
Locked  
• CD74HC297 Types  
- Operation Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 to 6V  
- High Noise ImmunityN = 30%, N = 30% of V at 5V  
IL IH CC  
• CD74HCT297 Types  
- Operation Voltage . . . . . . . . . . . . . . . . . . . . . . . . 4.5 to 5.5V  
- Direct LSTTL Input Logic Compatibility  
The CD74HC297 and CD74HCT297 can perform the classic  
first order phase-locked-loop function without using analog  
components. The accuracy of the digital phase-locked-loop  
V
= 0.8V (Max), V = 2V (Min)  
IH  
IL  
- CMOS Input Compatibility I 1µA at V , V  
OL OH  
I
(DPLL) is not affected by V  
depends solely on accuracies of the K-clock and loop propa-  
gation delays.  
and temperature variations but  
CC  
Ordering Information  
PKG.  
NO.  
o
PART NUMBER TEMP. RANGE ( C) PACKAGE  
CD74HC297E  
CD74HCT297E  
NOTES:  
-55 to 125  
-55 to 125  
16 Ld PDIP  
16 Ld PDIP  
E16.3  
E16.3  
Pinout  
CD74HC297, CD74HCT297 (PDIP)  
TOP VIEW  
1. When ordering, use the entire part number. Add the suffix 96 to  
obtain the variant in the tape and reel.  
B
A
1
2
3
4
5
6
7
8
16 V  
15 C  
14 D  
CC  
2. Wafer or die for this part number is available which meets all elec-  
trical specifications. Please contact your local sales office or  
Harris customer service for ordering information.  
EN  
CTR  
K
13 φA  
2
CP  
I/D  
12 ECPD  
OUT  
CP  
D/U  
11 XORPD  
OUT  
10 φB  
I/D  
OUT  
9
φA  
1
GND  
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.  
File Number 1852.1  
Copyright © Harris Corporation 1997  
1
CD74HC297, CD74HCT297  
The phase detector generates an error signal waveform that,  
Functional Diagram  
at zero phase error, is a 50% duty factor square wave. At the  
limits of linear operation, the phase detector output will be  
either HIGH or LOW all of the time depending on the direction  
of the phase error (φIN - φOUT). Within these limits the phase  
detector output varies linearly with the input phase error  
D
C
B
A
14 15  
1
2
4
6
3
CARRY  
K
CP  
7
BORROW  
MODULO-K  
COUNTER  
I/D  
D/U  
CTR  
OUT  
I/D  
according to the gain K , which is expressed in terms of  
d
CKT  
EN  
phase detector output per cycle or phase error. The phase  
detector output can be defined to vary between ±1 according  
to the relation:  
5
9
I/D  
CP  
φA  
11  
12  
1
XORPD  
OUT  
%HIGH - %LOW  
--------------------------------------------  
phase detector output =  
10  
13  
100  
J
Q
φB  
ECPD  
OUT  
F/F  
K
φA  
The output of the phase detector will be K φ , where the  
d e  
2
phase error φ = φIN - φOUT.  
e
FUNCTION TABLE  
EXCLUSIVE-OR PHASE DETECTOR  
EXCLUSIVE-OR phase detectors (XORPD) and edge-con-  
trolled phase detectors (ECPD) are commonly used digital  
types. The ECPD is more complex than the XORPD logic  
function but can be described generally as a circuit that  
changes states on one of the transitions of its inputs. The gain  
φA  
φB  
L
XORPD OUT  
1
L
L
L
H
H
L
H
L
(K ) for an XORPD is 4 because its output remains HIGH  
d
H
H
(XORPD  
= 1) for a phase error of one quarter cycle.  
OUT  
H
Similarly, K for the ECPD is 2 since its output remains HIGH  
d
for a phase error of one half cycle. The type of phase detector  
will determine the zero-phase-error point, i.e., the phase sep-  
aration of the phase detector inputs for a φe defined to be  
zero. For the basic DPLL system of Figure 3, φe = 0 when the  
phase detector output is a square wave.  
FUNCTION TABLE  
EDGE-CONTROLLED PHASE DETECTOR  
φA  
φB  
ECPD OUT  
2
H or L  
H
H or L  
L
The XORPD inputs are one quarter cycle out-of-phase for  
zero phase error. For the ECPD, φe = 0 when the inputs are  
one half cycle out of phase.  
H or L  
No Change  
No Change  
H or L  
The phase detector output controls the up/down input to the  
H = Steady-State High Level, L = Steady-State Low Level, = LOW  
K-counter. The counter is clocked by input frequency Mf  
to HIGH φ Transition, = HIGH to LOW φ Transition  
c
which is a multiple M of the loop center frequency f . When  
c
K-COUNTER FUNCTION TABLE  
(DIGITAL CONTROL)  
the K-counter recycles up, it generates a carry pulse. Recy-  
cling while counting down generates a borrow pulse. If the  
carry and the borrow outputs are conceptually combined into  
one output that is positive for a carry and negative for a bor-  
row, and if the K-counter is considered as a frequency divider  
MODULO  
(K)  
D
L
C
L
B
L
A
L
Inhibited  
with the ratio Mf /K, the output of the K-counter will equal the  
c
3
L
L
L
H
L
2
input frequency multiplied by the division ratio. Thus the out-  
4
L
L
H
H
L
2
put from the K-counter is (K φ Mf )/K.  
d e  
c
5
L
L
H
L
2
The carry and borrow pulses go to the increment/decrement  
(I/D) circuit which, in the absence of any carry or borrow  
6
L
H
H
H
H
L
2
pulses has an output that is one half of the input clock (I/D ).  
7
CP  
L
L
H
L
2
The input clock is just a multiple, 2N, of the loop center fre-  
quency. In response to a carry of borrow pulse, the I/D circuit  
8
L
H
H
L
2
9
will either add or delete a pulse at I/D  
. Thus the output of  
L
H
L
2
OUT  
the I/D circuit will be Nf + (K φ Mf )/2K.  
d e  
10  
2
c
c
H
H
H
H
H
H
H
H
The output of the N-counter (or the output of the phase-  
locked-loop) is thus: f = f + (K φ Mf )/2KN.  
11  
2
L
L
H
L
o
c
d e  
c
12  
2
L
H
H
L
If this result is compared to the equation for a first-order ana-  
log phase-locked-loop, the digital equivalent of the gain of the  
13  
2
L
H
L
14  
2
H
H
H
H
VCO is just Mf /2KN or f /K for M = 2N.  
c
c
15  
2
L
H
L
Thus, the simple first-order phase-locked-loop with an adjust-  
able K-counter is the equivalent of an analog phase-locked-  
loop with a programmable VCO gain.  
16  
2
H
H
17  
2
H
2
CD74HC297, CD74HCT297  
Absolute Maximum Ratings  
Thermal Information  
o
DC Supply Voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V  
Thermal Resistance (Typical, Note 2)  
θ
( C/W)  
CC  
DC Input Diode Current, I  
For V < -0.5V or V > V  
JA  
IK  
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
90  
o
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA  
OK  
For V < -0.5V or V > V  
I
I
CC  
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150 C  
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C  
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C  
o
o
DC Output Diode Current, I  
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA  
O
O
CC  
DC Drain Current, per Output, I  
O
For -0.5V < V < V  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA  
O
CC  
DC Output Source or Sink Current per Output Pin, I  
O
For V > -0.5V or V < V  
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA  
O
O
CC  
DC V  
or Ground Current, I  
. . . . . . . . . . . . . . . . . . . . . . . . .±50mA  
CC  
CC  
Operating Conditions  
o
o
Temperature Range, T . . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C  
A
Supply Voltage Range, V  
CC  
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V  
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V  
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V  
I
O
CC  
Input Rise and Fall Time  
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)  
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)  
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
3. θ is measured with the component mounted on an evaluation PC board in free air.  
JA  
DC Electrical Specifications  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
HC TYPES  
SYMBOL V (V)  
I
(mA)  
V
(V) MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
CC  
High Level Input  
Voltage  
V
-
-
-
2
1.5  
3.15  
4.2  
-
-
-
-
-
-
-
-
-
-
-
-
1.5  
3.15  
4.2  
-
-
1.5  
3.15  
4.2  
-
-
V
V
V
V
V
V
V
V
V
V
IH  
4.5  
-
-
-
6
2
-
-
-
Low Level Input  
Voltage  
V
-
0.5  
0.5  
0.5  
IL  
4.5  
6
-
1.35  
-
1.35  
-
1.35  
-
1.8  
-
1.8  
-
1.8  
High Level Output  
Voltage  
CMOS Loads  
V
V
or  
-0.02  
2
1.9  
4.4  
5.9  
3.98  
-
-
-
-
1.9  
4.4  
5.9  
3.84  
-
-
-
-
1.9  
4.4  
5.9  
3.7  
-
-
-
-
OH  
IH  
V
IL  
-0.02  
-0.02  
-6  
4.5  
6
High Level Output  
Voltage  
4.5  
(Note 4)  
TTL Loads  
-7.8  
6
5.48  
-
-
5.34  
-
5.2  
-
V
(Note 4)  
Low Level Output  
Voltage  
CMOS Loads  
V
V
V
or  
0.02  
0.02  
0.02  
2
-
-
-
-
-
-
-
-
0.1  
0.1  
-
-
-
-
0.1  
0.1  
-
-
-
-
0.1  
0.1  
0.1  
0.4  
V
V
V
V
OL  
IH  
IL  
4.5  
6
0.1  
0.1  
Low Level Output  
Voltage  
4
4.5  
0.26  
0.33  
(Note 4)  
TTL Loads  
5.2  
6
-
-
0.26  
-
0.33  
-
0.4  
V
(Note 4)  
3
CD74HC297, CD74HCT297  
DC Electrical Specifications  
(Continued)  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
Input Leakage  
SYMBOL V (V)  
I
(mA)  
V
(V) MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
CC  
I
V
or  
-
6
-
-
±0.1  
-
±1  
-
±1  
µA  
I
CC  
Current  
GND  
Quiescent Device  
Current  
I
V
GND  
or  
0
6
-
-
8
-
80  
-
160  
µA  
CC  
CC  
HCT TYPES  
High Level Input  
Voltage  
V
-
-
-
-
4.5 to  
5.5  
2
-
-
-
-
-
0.8  
-
2
-
-
0.8  
-
2
-
-
0.8  
-
V
V
V
IH  
Low Level Input  
Voltage  
V
4.5 to  
5.5  
IL  
High Level Output  
Voltage  
CMOS Loads  
V
V
or  
IH  
-0.02  
4.5  
4.5  
4.5  
4.5  
4.4  
4.4  
4.4  
OH  
V
IL  
High Level Output  
Voltage  
TTL Loads  
-4  
3.98  
-
-
-
-
3.84  
-
3.7  
-
V
V
V
Low Level Output  
Voltage  
CMOS Loads  
V
V
or  
IH  
0.02  
4
-
-
0.1  
0.26  
-
-
0.1  
0.33  
-
-
0.1  
0.4  
OL  
V
IL  
Low Level Output  
Voltage  
TTL Loads  
Input Leakage  
Current  
I
V
to  
0
0
-
5.5  
5.5  
-
-
-
-
-
±0.1  
8
-
-
-
±1  
80  
-
-
-
±1  
µA  
µA  
µA  
I
CC  
GND  
Quiescent Device  
Current  
I
V
or  
160  
490  
CC  
CC  
GND  
Additional Quiescent  
Device Current Per  
Input Pin: 1 Unit Load  
(Note 3)  
I  
CC  
V
4.5 to  
5.5  
100  
360  
450  
CC  
-2.1  
NOTE:  
4. For dual-supply systems theoretical worst case (V = 2.4V, V  
I
= 5.5V) specification is 1.8mA.  
CC  
5. XORPD, ECPD  
HCT Input Loading Table  
INPUT  
EN , D/U  
UNIT LOADS  
0.3  
0.6  
1.5  
CTR  
A, B, C, D, K , φA  
CP  
2
I/D , φA , φB  
CP  
1
NOTE: Unit Load is I  
limit specified in DC Electrical  
CC  
Specifications table, e.g., 360µA max at 25 C.  
o
4
CD74HC297, CD74HCT297  
Prerequisite For Switching Function  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
HC TYPES  
Maximum Clock Frequency  
SYMBOL  
V
(V)  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
CC  
f
2
6
30  
35  
4
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
5
24  
28  
3
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
4
20  
24  
2
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MHz  
MHz  
MHz  
MHz  
MHz  
MHz  
ns  
MAX  
MAX  
K
CP  
4.5  
6
2
Maximum Clock Frequency  
I/D  
f
CP  
4.5  
6
20  
24  
80  
16  
14  
125  
25  
21  
100  
20  
17  
0
16  
19  
100  
20  
17  
155  
31  
26  
125  
25  
21  
0
13  
15  
120  
24  
20  
190  
38  
32  
150  
30  
26  
0
Clock Pulse Width  
t
2
w
K
CP  
4.5  
6
ns  
ns  
Clock Pulse Width  
I/D  
t
2
ns  
W
CP  
4.5  
6
ns  
ns  
Set-up Time  
D/U, EN  
t
2
ns  
SU  
to K  
to K  
CTR  
CP  
CP  
4.5  
6
ns  
ns  
Hold Time  
D/U, EN  
t
2
ns  
H
CTR  
4.5  
6
0
0
0
ns  
0
0
0
ns  
HCT TYPES  
Maximum Clock Frequency  
f
f
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
30  
20  
16  
25  
20  
0
-
-
-
-
-
-
24  
16  
20  
31  
25  
0
-
-
-
-
-
-
20  
13  
24  
38  
30  
0
-
-
-
-
-
-
MHz  
MHz  
ns  
MAX  
K
CP  
Maximum Clock Frequency  
I/D  
MAX  
CP  
Clock Pulse Width  
t
t
w
K
CP  
Clock Pulse Width  
I/D  
ns  
w
CP  
Set-up Time  
D/U, EN  
t
ns  
SU  
to K  
to K  
CTR  
Hold Time  
D/U, EN  
CP  
CP  
t
ns  
H
CTR  
Switching Specifications Input t , t = 6ns  
r
f
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
TEST  
PARAMETER  
SYMBOL  
CONDITIONS  
V
(V)  
TYP  
MAX  
MAX  
MAX  
UNITS  
CC  
HC TYPES  
Propagation Delay,  
I/D to I/D  
t
, t  
C = 50pF  
2
-
-
-
175  
35  
220  
44  
265  
53  
ns  
ns  
ns  
PLH PHL  
L
CP OUT  
4.5  
6
30  
34  
43  
5
CD74HC297, CD74HCT297  
Switching Specifications Input t , t = 6ns (Continued)  
r
f
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
TEST  
PARAMETER  
SYMBOL  
CONDITIONS  
V
(V)  
TYP  
MAX  
150  
30  
MAX  
190  
38  
MAX  
225  
45  
UNITS  
ns  
CC  
Propagation Delay,  
t , t  
PLH PHL  
C = 50pF  
2
-
-
-
-
-
-
-
-
-
-
-
-
-
L
φA , φB to XORPD  
1
OUT  
4.5  
ns  
6
2
26  
33  
38  
ns  
Propagation Delay,  
t , t  
PHL PHL  
C = 50pF  
200  
40  
250  
50  
300  
60  
ns  
L
φB, φA to ECPD  
OUT  
2
4.5  
6
ns  
34  
43  
51  
ns  
Output Transition Time  
XORPD  
t
C = 50pF  
2
75  
95  
110  
22  
ns  
TLH  
TLH  
L
OUT  
4.5  
6
15  
19  
ns  
ECPD  
OUT  
13  
16  
19  
ns  
Output Transition Time  
I/D  
t
C = 50pF  
L
2
60  
75  
90  
ns  
OUT  
4.5  
6
12  
15  
18  
ns  
10  
13  
15  
ns  
Input Capacitance  
C
-
-
10  
10  
10  
pF  
I
HCT TYPES  
Propagation Delay,  
I/D to I/D  
CP OUT  
t
t
t
, t  
C = 50pF  
4.5  
4.5  
4.5  
4.5  
4.5  
-
-
-
-
-
-
-
35  
30  
40  
15  
12  
10  
44  
38  
50  
19  
15  
10  
53  
45  
60  
22  
18  
10  
ns  
ns  
ns  
ns  
ns  
pF  
PLH PHL  
L
Propagation Delay,  
, t  
PLH PHL  
C = 50pF  
L
φA , φB to XORPD  
1
OUT  
Propagation Delay,  
, t  
PHL PHL  
C = 50pF  
L
φB, φA to ECPD  
OUT  
2
Output Transition Time  
XORPD  
t
C = 50pF  
L
TLH  
TLH  
OUT  
Output Transition Time  
ECPD  
t
C = 50pF  
L
OUT  
Input Capacitance  
C
-
I
6
CD74HC297, CD74HCT297  
Logic Diagram  
MODULO-K COUNTER  
2
A
1
2
4
8
1
B
CONTROL CIRCUIT  
14 13 12 11 10  
15  
C
14  
D
9
8
7
6
5
4
3
2
1
0
TO MODE CONTROLS 12-2  
(11 STAGES NOT SHOWN)  
4
K
CP  
6
D/U  
R
R
R
R
D
R
R
D
D
D
D
D
D
D
T
D
T
D
T
Q
Q
Q
FF14  
Q
CP  
FF  
Q
T
T
T
T
FF  
FF  
FF1  
T
FF13  
FF  
M
M
Q
Q
M
3
EN  
CTR  
D
Q
Q
M
M
T
M
T
Q
FF14  
Q
FF1  
FF  
CP  
T
FF  
Q
FF  
T
FF  
Q
FF13  
Q
D
D
R
D
R
R
D
R
D
R
R
D
D
D
D
POWER ON RESET  
1 = 1  
1
BORROW  
CARRY  
INCREMENT/DECREMENT CIRCUIT  
5
I/D  
CP  
7
I/D  
OUT  
D
Q
D
D
Q
Q
D
CP  
CP  
CP  
FF  
Q
CP  
FF  
Q
FF  
FF  
Q
Q
J
FF  
CP  
K
Q
D
Q
D
D
Q
D
Q
CP  
CP  
CP  
FF  
Q
CP  
FF  
FF  
Q
FF  
Q
9
φA  
1
EXCLUSIVE-OR PHASE DETECTOR  
11  
XORPD  
OUT  
10  
φB  
EDGE-CONTROLLED PHASE DETECTOR  
12  
S
S
D
D
ECPD  
OUT  
Q
Q
FF  
FF  
Q
Q
R
R
D
D
13  
φA  
2
7
CD74HC297, CD74HCT297  
K
CARRY  
CP  
Mf  
C
D/U  
CTR  
DIVIDE-BY-K  
COUNTER  
EN  
BORROW  
XORPD  
OUT  
φA  
1
φB  
I/D  
f
CP  
OUT  
2Nf  
I/D CIRCUIT  
C
φOUT  
ECPD  
OUT  
J
J
ECPD  
φA  
2
f
IN  
K
I/D  
φIN  
OUT  
FF  
DIVIDE-BY-N  
COUNTER  
FIGURE 1. DPLL USING BOTH PHASE DETECTORS IN A RIPPLE-CANCELLATION SCHEME  
K
CARRY  
CP  
Mf  
C
DIVIDE-BY-K  
COUNTER  
D/U  
BORROW  
XORPD  
OUT  
φA  
f
1
OUT  
φIN  
φB  
I/D  
CP  
2Nf  
I/D CIRCUIT  
C
I/D  
OUT  
f
DIVIDE-BY-N  
COUNTER  
OUT  
φOUT  
FIGURE 2. DPLL USING EXCLUSIVE-OR PHASE DETECTION  
CARRY PULSE  
(INTERNAL SIGNAL)  
BORROW PULSE  
(INTERNAL SIGNAL)  
I/D  
CP  
INPUT  
I/D  
OUTPUT  
OUT  
FIGURE 3. TIMING DIAGRAM: I/D  
IN-LOCK CONDITION  
OUT  
8
CD74HC297, CD74HCT297  
øB INPUT  
øA INPUT  
2
ECPD  
OUTPUT  
OUT  
FIGURE 4. TIMING DIAGRAM: EDGE CONTROLLED PHASE COMPARATOR WAVEFORMS  
øB INPUT  
øA INPUT  
1
XORPD  
OUT  
OUTPUT  
FIGURE 5. TIMING DIAGRAM: EXCLUSIVE OR PHASE DETECTOR WAVEFORMS  
I/f  
MAX  
t
W
I/D  
V
CP  
S
t
PHL  
t
PLH  
V
I/D  
OUT  
S
t
t
THL  
TLH  
FIGURE 6. WAVEFORMS SHOWING THE CLOCK (I/D ) TO OUTPUT (I/D  
CP  
) PROPAGATION DELAYS, CLOCK PULSE WIDTH,  
OUT  
OUTPUT TRANSITION TIMES AND MAXIMUM CLOCK PULSE FREQUENCY  
V
S
øB INPUT  
V
S
øA INPUT  
1
t
TLH  
XORPD  
OUT  
V
S
OUTPUT  
t
PLH  
t
PLH  
t
t
t
PLH  
THL  
PHL  
FIGURE 7. WAVEFORMS SHOWING THE PHASE INPUT (øB, øA ) TO OUTPUT (XORPD  
1
) PROPAGATION DELAYS AND  
OUT  
OUTPUT TRANSITION TIMES  
9
CD74HC297, CD74HCT297  
V
S
øB INPUT  
øA INPUT  
2
V
S
ECPD  
OUT  
OUTPUT  
V
S
t
t
t
TLH  
PHL  
PLH  
t
THL  
FIGURE 8. WAVEFORMS SHOWING THE PHASE INPUT (øB, øA ) TO OUTPUT (ECPD  
2
) PROPAGATION DELAYS AND OUTPUT  
OUT  
TRANSITION TIMES  
t
t
H
H
D/U, EN  
CTR  
V
S
INPUT  
t
t
SU  
SU  
V
S
K
INPUT  
CP  
t
W
1/f  
MAX  
NOTE: The shaded areas indicate when the input is permitted to change for predictable output performance.  
FIGURE 9. WAVEFORMS SHOWING THE CLOCK (K ) PULSE WIDTH AND MAXIMUM CLOCK PULSE FREQUENCY, AND THE  
CP  
INPUT (D/U, EN  
CTR  
) TO CLOCK (K ) SETUP AND HOLD TIMES  
CP  
10  
IMPORTANT NOTICE  
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any product or service without notice, and advise customers to obtain the latest version of relevant information  
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pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
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In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
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Copyright 1998, Texas Instruments Incorporated  

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