CD74HCT393E [TI]
High Speed CMOS Logic Dual 4 -Stage Binary Counter; 高速CMOS逻辑双路4 -stage二进制计数器![CD74HCT393E](http://pdffile.icpdf.com/pdf1/p00088/img/icpdf/CD74HCT393_465012_icpdf.jpg)
型号: | CD74HCT393E |
厂家: | ![]() |
描述: | High Speed CMOS Logic Dual 4 -Stage Binary Counter |
文件: | 总8页 (文件大小:40K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
![](http://public.icpdf.com/style/img/ads.jpg)
CD74HC393,
CD74HCT393
Data sheet acquired from Harris Semiconductor
SCHS186
High Speed CMOS Logic
September 1997
Dual 4 -Stage Binary Counter
V
= 5V
Features
CC
• HCT Types
• Fully Static Operation
• Buffered Inputs
• Common Reset
- 4.5V to 5.5V Operation
[ /Title
(CD74
HC393
,
CD74
HCT39
3)
/Sub-
ject
(High
Speed
CMOS
- Direct LSTTL Input Logic Compatibility,
V = 0.8V (Max), V = 2V (Min)
IL IH
- CMOS Input Compatibility, I ≤ 1µA at V , V
OL OH
l
• Negative-Edge Clocking
• Typical f
MAX
= 60 MHz at V = 5V, C = 15pF,
CC L
Description
o
T = 25 C
A
The Harris CD74HC393 and CD74HCT393 are 4-stage
ripple-carry binary counters. Al counter stages are master-
slave flip-flops. The state of the stage advances one count
on the negative transition of each clock pulse; a high voltage
level on the MR line resets all counters to their zero state. All
inputs and outputs are buffered.
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C
• Balanced Propagation Delay and Transition Times
Ordering Information
• Significant Power Reduction Compared to LSTTL
Logic ICs
PKG.
o
PART NUMBER TEMP. RANGE ( C) PACKAGE
NO.
E14.3
E14.3
• HC Types
CD74HC393E
CD74HCT393E
-55 to 125
-55 to 125
14 Ld PDIP
14 Ld PDIP
- 2V to 6V Operation
- High Noise Immunity: N = 30%, N = 30%of V
IL IH CC
at
Pinout
CD74HC393, CD74HCT393
(PDIP, SOIC)
TOP VIEW
1CP
1MR
1Q0
1Q1
1Q2
1Q3
GND
1
2
3
4
5
6
7
14 V
CC
13 2CP
12 2MR
11 2Q0
10 2Q1
9
8
2Q2
2Q3
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
File Number 1653.1
Copyright © Harris Corporation 1997
1
CD74HC393, CD74HCT393
Functional Diagram
3
1Q
1Q
1Q
1Q
0
1
2
3
1
2
4
5
6
1CP
1MR
BINARY
COUNTER
11
10
9
2Q
2Q
2Q
2Q
0
1
2
3
13
12
2CP
2MR
BINARY
COUNTER
8
GND = 7
= 14
V
CC
TRUTH TABLE
OUTPUTS
CP COUNT
Q
Q
Q
Q
3
0
1
2
0
1
L
H
L
L
L
L
L
H
H
L
L
L
L
L
2
3
H
L
L
L
4
H
H
H
H
L
L
5
H
L
L
L
6
H
H
L
L
7
H
L
L
8
H
H
H
H
H
H
H
H
9
H
L
L
L
10
11
12
13
14
15
H
H
L
L
H
L
L
H
H
H
H
H
L
L
H
H
H
CP COUNT
MR
L
OUTPUT
No Change
Count
↑
↓
L
X
H
L L L L
NOTE: H = High Voltage Level, L = Low Voltage Level, X = Don’t Care,
↑ = Transition from Low to High Level, ↓ = Transition from High to Low.
2
CD74HC393, CD74HCT393
Logic Diagram
Q
Q
Q
Q
Q
Q
Q
Q
Φ
Φ
Φ
Φ
Φ
Φ
Φ
Φ
1(13)
CP
R
R
R
R
2(12)
MR
3(11)
4(10)
5(9)
6(8)
Q
Q
Q
Q
3
0
1
2
3
CD74HC393, CD74HCT393
Absolute Maximum Ratings
Thermal Information
o
DC Supply Voltage, V
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V Thermal Resistance (Typical, Note 3)
θ
( C/W)
CC
DC Input Diode Current, I
JA
IK
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
90
For V < -0.5V or V > V
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
OK
For V < -0.5V or V > V
I
I
CC
175
o
DC Output Diode Current, I
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150 C
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300 C
o
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
O
O
CC
o
DC Output Source or Sink Current per Output Pin, I
O
For V > -0.5V or V < V
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
O
O
CC
(SOIC - Lead Tips Only)
DC V
or Ground Current, I
I
. . . . . . . . . . . . . . . . . .±50mA
CC
CC or GND
Operating Conditions
o
o
Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C
A
Supply Voltage Range, V
CC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V
I
O
CC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θ is measured with the component mounted on an evaluation PC board in free air.
JA
DC Electrical Specifications
TEST
CONDITIONS
o
o
o
o
o
25 C
TYP
-40 C TO 85 C -55 C TO 125 C
V
(V)
CC
PARAMETER
HC TYPES
SYMBOL
V (V)
I
I
(mA)
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
O
High Level Input
Voltage
V
-
-
-
2
4.5
6
1.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5
-
1.5
-
-
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
µA
IH
3.15
-
-
3.15
-
-
3.15
4.2
4.2
4.2
-
Low Level Input
Voltage
V
-
2
-
0.5
1.35
1.8
-
-
0.5
1.35
1.8
-
-
0.5
1.35
1.8
-
IL
4.5
6
-
-
-
-
-
-
High Level Output
Voltage
CMOS Loads
V
V
or V
IH IL
-0.02
2
1.9
1.9
1.9
OH
-0.02
-0.02
-
4.5
6
4.4
-
4.4
-
4.4
-
5.9
-
5.9
-
5.9
-
High Level Output
Voltage
TTL Loads
-
-
-
-
-
-
-
-4
4.5
6
3.98
-
3.84
-
3.7
-
-5.2
0.02
0.02
0.02
-
5.48
-
5.34
-
5.2
-
Low Level Output
Voltage
CMOS Loads
V
V
or V
IH IL
2
-
-
-
-
-
-
-
0.1
0.1
0.1
-
-
-
-
-
-
-
-
0.1
0.1
0.1
-
-
-
-
-
-
-
-
0.1
0.1
0.1
-
OL
4.5
6
Low Level Output
Voltage
TTL Loads
-
4
4.5
6
0.26
0.26
±0.1
0.33
0.33
±1
0.4
0.4
±1
5.2
-
Input Leakage
Current
I
V
or
6
I
CC
GND
Quiescent Device
Current
I
V
GND
or
0
6
-
-
8
-
80
-
160
µA
CC
CC
4
CD74HC393, CD74HCT393
DC Electrical Specifications (Continued)
TEST
CONDITIONS
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
V
CC
PARAMETER
HCT TYPES
SYMBOL
V (V)
I
I
(mA)
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
O
High Level Input
Voltage
V
-
-
-
-
4.5 to
5.5
2
-
-
-
-
-
0.8
-
2
-
-
0.8
-
2
-
-
0.8
-
V
V
V
IH
Low Level Input
Voltage
V
4.5 to
5.5
IL
High Level Output
Voltage
CMOS Loads
V
V
V
or V
-0.02
4.5
4.5
4.5
4.5
4.4
4.4
4.4
OH
IH
IH
IL
High Level Output
Voltage
TTL Loads
-4
3.98
-
-
-
-
3.84
-
3.7
-
V
V
V
Low Level Output
Voltage
CMOS Loads
V
or V
0.02
4
-
-
0.1
0.26
-
-
0.1
0.33
-
-
0.1
0.4
OL
IL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
I
V
and
0
0
-
5.5
5.5
-
-
-
-
-
±0.1
8
-
-
-
±1
80
-
-
-
±1
µA
µA
µA
I
CC
GND
Quiescent Device
Current
I
V
or
160
490
CC
CC
GND
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
∆I
V
4.5 to
5.5
100
360
450
CC
CC
-2.1
NOTE: For dual-supply systems theorectical worst case (V = 2.4V, V
I
= 5.5V) specification is 1.8mA.
CC
HCT Input Loading Table
INPUT
UNIT LOADS
nCP
nMR
0.4
1
NOTE: Unit Load is ∆I
360µA max at 25 C.
limit specified in DC Electrical Table, e.g.,
CC
o
Prerequisite for Switching Specifications
o
o
o
o
o
25 C
TYP
-40 C TO 85 C
-55 C TO 125 C
PARAMETER
HC TYPES
SYMBOL
V
(V)
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
CC
Maximum Clock
Frequency
f
MAX
2
6
30
35
80
16
14
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
5
24
28
100
20
17
5
-
-
-
-
-
-
-
-
-
4
20
24
120
24
20
5
-
-
-
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
4.5
6
2
Clock Pulse Width
t
W
4.5
6
Reset Recovery Time
t
REC
2
4.5
6
5
5
5
5
5
5
5
CD74HC393, CD74HCT393
Prerequisite for Switching Specifications (Continued)
o
o
o
o
o
25 C
-40 C TO 85 C
-55 C TO 125 C
PARAMETER
SYMBOL
V
(V)
MIN
80
TYP
MAX
MIN
100
20
MAX
MIN
120
24
MAX
UNITS
ns
CC
Reset Pulse Width
t
2
-
-
-
-
-
-
-
-
-
-
-
-
W
4.5
16
ns
6
14
17
20
ns
HCT TYPES
Maximum Clock
Frequency
f
t
4.5
27
-
-
22
-
18
-
MHz
MAX
Clock Pulse Width
Reset Recovery Time
Reset Pulse Width
t
4.5
4.5
4.5
19
5
-
-
-
-
-
-
24
5
-
-
-
29
5
-
-
-
ns
ns
ns
W
REC
t
16
20
24
W
Switching Specifications Input t , t = 6ns
r
f
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
TEST
V
CC
(V)
PARAMETER
HC TYPES
SYMBOL CONDITIONS
MIN TYP MAX
MIN
MAX
MIN
MAX UNITS
Propagation Delay Time
(Figure 1)
t
t
C = 50pF
2
-
-
45
-
55
-
70
ns
PLH,
L
PHL
Q to Q + 1
4.5
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
4
-
9
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
11
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
14
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
pF
pF
n
n
C =15pF
L
C = 50pF
6
8
9
12
225
59
-
L
nCP to nQ
t
t
C = 50pF
2
-
150
30
-
190
38
-
0
PLH,
L
PHL
4.5
5
-
C =15pF
12
-
L
C = 50pF
6
26
190
38
33
240
48
41
285
57
48
135
27
-
33
245
49
42
300
60
51
355
71
60
170
34
-
50
295
59
50
360
72
61
430
86
73
205
41
-
L
nCP to nQ
nCP to nQ
nCP to nQ
t
t
t
t
C = 50pF
2
-
1
2
3
PLH,
L
t
PHL
4.5
6
-
-
C = 50pF
2
-
PLH,
L
t
PHL
4.5
6
-
-
C = 50pF
2
-
PLH,
L
t
PHL
4.5
6
-
-
-
-
-
-
-
-
-
-
-
-
MR to Q
C = 50pF
2
-
n
PLH,
L
t
PHL
4.5
5
-
C =15pF
11
-
L
C = 50pF
6
23
75
15
13
10
-
29
95
19
16
10
-
35
110
22
19
10
-
L
Output Transition Time
(Figure 1)
t
, t
C = 50pF
2
-
TLH THL
L
4.5
6
-
-
Input Capacitance
C
C = 50pF
-
-
IN
L
Power Dissipation Capacitance
(Notes 4, 5)
C
C =15pF
5
20
PD
L
6
CD74HC393, CD74HCT393
Switching Specifications Input t , t = 6ns (Continued)
r
f
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
TEST
SYMBOL CONDITIONS
V
CC
(V)
PARAMETER
HCT TYPES
MIN TYP MAX
MIN
MAX
MIN
MAX UNITS
Propagation Delay Time
(Figure 1)
t
t
C = 50pF
4.5
-
-
12
-
15
-
18
ns
PLH,
L
PHL
Q to Q + 1
C =15pF
5
-
-
-
-
4
-
-
-
-
-
-
-
-
-
-
-
-
ns
ns
ns
ns
n
n
L
nCP to nQ
t
t
C = 50pF
4.5
5
32
-
40
-
48
-
0
PLH,
L
PHL
C =15pF
13
-
L
nCP to nQ
nCP to nQ
nCP to nQ
t
t
t
t
C = 50pF
4.5
44
55
66
1
2
3
PLH,
L
t
PHL
C = 50pF
4.5
4.5
-
-
-
-
50
62
-
-
63
78
-
-
75
93
ns
ns
PLH,
L
t
PHL
C = 50pF
PLH,
L
t
PHL
MR to Q
C = 50pF
4.5
5
-
-
-
-
-
-
13
-
32
-
-
-
-
-
-
40
-
-
-
-
-
-
48
-
ns
ns
ns
pF
pF
n
PLH,
L
t
PHL
C =15pF
L
Output Transition
Input Capacitance
t
, t
C = 50pF
4.5
-
15
10
-
19
10
-
22
10
-
TLH THL
L
C
C =15pF
-
IN
L
Power Dissipation Capacitance
(Notes 4, 5)
C
C =15pF
5
21
PD
L
NOTES:
4. C
PD
is used to determine the dynamic power consumption, per stage.
2
5. P = V
CC
f (C
PD
+ C ) where f = Input Frequency, C = Output Load Capacitance, V = Supply Voltage.
CC
D
i
L
i
L
Test Circuits and Waveforms
t = 6ns
f
t = 6ns
t = 6ns
t = 6ns
r
r
f
V
3V
CC
90%
50%
10%
2.7V
1.3V
0.3V
INPUT
INPUT
GND
GND
t
t
t
t
THL
TLH
THL
TLH
90%
1.3V
90%
50%
10%
INVERTING
OUTPUT
INVERTING
OUTPUT
10%
t
t
PLH
PHL
t
t
PLH
PHL
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
7
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明