CD74HCT4024EE4 [TI]
High-Speed CMOS Logic 7-Stage Binary Ripple Counter; 高速CMOS逻辑7级二进制纹波计数器型号: | CD74HCT4024EE4 |
厂家: | TEXAS INSTRUMENTS |
描述: | High-Speed CMOS Logic 7-Stage Binary Ripple Counter |
文件: | 总13页 (文件大小:290K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CD54HC4024, CD74HC4024,
CD54HCT4024, CD74HCT4024
Data sheet acquired from Harris Semiconductor
SCHS202C
High-Speed CMOS Logic
7-Stage Binary Ripple Counter
November 1997 - Revised October 2003
Features
Description
• Fully Static Operation
• Buffered Inputs
The ’HC4024 and ’HCT4024 are 7-stage ripple-carry binary
counters. All counter stages are master-slave flip-flops. The
state of the stage advances one count on the negative
transition of each input pulse; a high voltage level on the MR
line resets all counters to their zero state. All inputs and
outputs are buffered.
[ /Title
(CD74
HC402
4,
CD74
HCT40
24)
/Sub-
ject
(High
Speed
CMOS
• Common Reset
• Negative Edge Clocking
• Fanout (Over Temperature Range)
Ordering Information
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
TEMP. RANGE
o
PART NUMBER
CD54HC4024F3A
CD54HCT4024F3A
CD74HC4024E
( C)
PACKAGE
14 Ld CERDIP
14 Ld CERDIP
14 Ld PDIP
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C
• Balanced Propagation Delay and Transition Times
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
CD74HC4024M
14 Ld SOIC
14 Ld SOIC
14 Ld SOIC
14 Ld TSSOP
14 Ld TSSOP
14 Ld TSSOP
14 Ld PDIP
- 2V to 6V Operation
CD74HC4024MT
CD74HC4024M96
CD74HC4024PW
CD74HC4024PWR
CD74HC4024PWT
CD74HCT4024E
CD74HCT4024M
- High Noise Immunity: N = 30%, N = 30% of V
IL IH CC
at V
= 5V
CC
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V = 0.8V (Max), V = 2V (Min)
IL IH
- CMOS Input Compatibility, I ≤ 1µA at V , V
OL OH
l
14 Ld SOIC
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
Pinout
CD54HC4024, CD54HCT4024
(CERDIP)
CD74HC4024
(PDIP, SOIC, TSSOP)
CD74HCT4024
(PDIP, SOIC)
TOP VIEW
CP
1
2
3
4
5
6
7
14
13 NC
12 Q ’
V
CC
MR
Q
Q
Q
Q
7
6
5
4
1
11 Q
2
10 NC
9
8
Q
3
NC
GND
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2003, Texas Instruments Incorporated
1
CD54HC4024, CD74HC4024, CD54HCT4024, CD74HCT4024
Functional Diagram
12
11
9
Q ’
1
1
CP
Q
Q
Q
Q
Q
Q
2
3
4
5
6
7
6
5
2
4
MR
3
TRUTH TABLE
CP COUNT
MR
OUTPUT STATE
↑
↓
L
L
No Change
Advance to Next State
All Outputs Are Low
X
H
H = High Voltage Level, L = Low Voltage Level, X = Don’t Care,
↑ = Transition from Low to High Level, ↓ = Transition from High to Low.
Logic Diagram
1
CP
Q
CP
CP
Q
Q
CP
CP
Q
Q
CP
CP
Q
Q
CP
CP
Q
Q
CP
CP
Q
Q
CP
CP
Q
Q
CP
Q1
Q
1
2
3
4
5
6
7
CP
R
R
R
R
R
R
R
2
MR
7
GND
14
12
11
9
6
5
4
3
V
CC
Q ’
Q
Q
Q
Q
Q
Q
7
1
2
3
4
5
6
2
CD54HC4024, CD74HC4024, CD54HCT4024, CD74HCT4024
Absolute Maximum Ratings
Thermal Information
o
DC Supply Voltage, V
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Thermal Resistance (Typical, Note 1)
θ
( C/W)
CC
DC Input Diode Current, I
For V < -0.5V or V > V
JA
IK
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . .
M (SOIC) Package . . . . . . . . . . . . . . . . . . . . . . . .
PW (TSSOP) Package. . . . . . . . . . . . . . . . . . . . . .
80
86
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
OK
For V < -0.5V or V > V
I
I
CC
DC Output Diode Current, I
113
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
O
O
CC
(Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150 C
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C
o
o
DC Output Source or Sink Current per Output Pin, I
O
o
For V > -0.5V or V < V
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
O
O
CC
DC V
or Ground Current, I
. . . . . . . . . . . . . . . . . . . . . . . . .±50mA
CC
CC
(SOIC - Lead Tips Only)
Operating Conditions
o
o
Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C
A
Supply Voltage Range, V
CC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V
I
O
CC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
V
CC
PARAMETER
HC TYPES
SYMBOL
V (V)
I
I
(mA)
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
O
High Level Input
Voltage
V
-
-
-
2
4.5
6
1.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5
-
1.5
-
-
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
µA
IH
3.15
-
-
3.15
-
-
3.15
4.2
4.2
4.2
-
Low Level Input
Voltage
V
-
2
-
0.5
1.35
1.8
-
-
0.5
1.35
1.8
-
-
0.5
1.35
1.8
-
IL
4.5
6
-
-
-
-
-
-
High Level Output
Voltage
CMOS Loads
V
V
or V
IH IL
-0.02
2
1.9
1.9
1.9
OH
-0.02
-0.02
-
4.5
6
4.4
-
4.4
-
4.4
-
5.9
-
5.9
-
5.9
-
High Level Output
Voltage
TTL Loads
-
-
-
-
-
-
-
-4
4.5
6
3.98
-
3.84
-
3.7
-
-5.2
0.02
0.02
0.02
-
5.48
-
5.34
-
5.2
-
Low Level Output
Voltage
CMOS Loads
V
V
or V
IH IL
2
-
-
-
-
-
-
-
0.1
0.1
0.1
-
-
-
-
-
-
-
-
0.1
0.1
0.1
-
-
-
-
-
-
-
-
0.1
0.1
0.1
-
OL
4.5
6
Low Level Output
Voltage
TTL Loads
-
4
4.5
6
0.26
0.26
±0.1
0.33
0.33
±1
0.4
0.4
±1
5.2
-
Input Leakage
Current
I
V
or
6
I
CC
GND
Quiescent Device
Current
I
V
GND
or
0
6
-
-
8
-
80
-
160
µA
CC
CC
3
CD54HC4024, CD74HC4024, CD54HCT4024, CD74HCT4024
DC Electrical Specifications (Continued)
TEST
CONDITIONS
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
V
CC
PARAMETER
HCT TYPES
SYMBOL
V (V)
I
I
(mA)
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
O
High Level Input
Voltage
V
-
-
-
-
4.5 to
5.5
2
-
-
-
-
-
0.8
-
2
-
-
0.8
-
2
-
-
0.8
-
V
V
V
IH
Low Level Input
Voltage
V
4.5 to
5.5
IL
High Level Output
Voltage
CMOS Loads
V
V
V
or V
-0.02
4.5
4.5
4.5
4.5
4.4
4.4
4.4
OH
IH
IH
IL
High Level Output
Voltage
TTL Loads
-4
3.98
-
-
-
-
3.84
-
3.7
-
V
V
V
Low Level Output
Voltage
CMOS Loads
V
or V
0.02
4
-
-
0.1
0.26
-
-
0.1
0.33
-
-
0.1
0.4
OL
IL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
I
V
and
0
0
-
5.5
5.5
-
-
-
-
-
±0.1
8
-
-
-
±1
80
-
-
-
±1
µA
µA
µA
I
CC
GND
Quiescent Device
Current
I
V
or
160
490
CC
CC
GND
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
∆I
CC
(Note 2)
V
4.5 to
5.5
100
360
450
CC
-2.1
NOTE:
2. For dual-supply systems theoretical worst case (V = 2.4V, V
I
= 5.5V) specification is 1.8mA.
CC
HCT Input Loading Table
INPUT
CP, MR
UNIT LOADS
0.5
NOTE: Unit Load is ∆I
360µA max at 25 C.
limit specified in DC Electrical Table, e.g.,
CC
o
Prerequisite for Switching Specifications
o
o
o
o
o
25 C
-40 C TO 85 C
-55 C TO 125 C
PARAMETER
HC TYPES
SYMBOL
V
(V)
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
CC
Maximum Input Pulse
Frequency
f
2
6
-
-
-
-
-
-
-
-
-
5
24
29
100
20
17
65
13
11
-
-
-
-
-
-
-
-
-
4
20
24
120
24
20
75
15
13
-
-
-
-
-
-
-
-
-
MHz
MHz
MHz
ns
MAX
4.5
30
35
80
16
14
50
10
9
6
2
Input Pulse Width
t
W
4.5
6
ns
ns
Reset Removal Time
t
2
ns
REM
4.5
6
ns
ns
4
CD54HC4024, CD74HC4024, CD54HCT4024, CD74HCT4024
Prerequisite for Switching Specifications (Continued)
o
o
o
o
o
25 C
-40 C TO 85 C
-55 C TO 125 C
PARAMETER
SYMBOL
V
(V)
MIN
80
MAX
MIN
100
20
MAX
MIN
120
24
MAX
UNITS
ns
CC
Reset Pulse Width
t
2
-
-
-
-
-
-
-
-
-
W
4.5
16
ns
6
14
17
20
ns
HCT TYPES
Maximum Input Pulse
Frequency
f
t
4.5
25
-
20
-
16
-
MHz
MAX
Input Pulse Width
Reset Recovery Time
Reset Pulse Width
t
4.5
4.5
4.5
20
10
20
-
-
-
25
13
25
-
-
-
30
15
30
-
-
-
ns
ns
ns
W
REC
t
W
Switching Specifications Input t , t = 6ns
r
f
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
TEST
V
CC
PARAMETER
HC TYPES
SYMBOL CONDITIONS
(V)
MIN TYP MAX
MIN
MAX
MIN
MAX UNITS
Propagation Delay Time
(Figure 1)
t
t
C = 50pF
2
-
-
140
-
175
-
210
ns
PLH,
L
PHL
CP to Q1’ Output
4.5
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
11
-
28
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
35
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
42
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
pF
pF
C =15pF
L
C = 50pF
6
24
75
15
-
30
95
19
-
36
110
22
-
L
Q to Q + 1
t
t
C = 50pF
2
-
n
n
PLH,
L
t
PHL
4.5
5
-
C =15pF
6
-
L
C = 50pF
6
13
170
34
-
13
215
43
-
19
255
51
-
L
MR to Q
C = 50pF
2
-
n
PLH,
L
t
PHL
4.5
5
-
14
-
6
29
75
15
13
10
-
27
95
19
16
10
-
43
110
22
19
10
-
Output Transition Time
(Figure 1)
t
, t
C = 50pF
2
-
TLH THL
L
4.5
6
-
-
Input Capacitance
C
C = 50pF
-
-
IN
L
Power Dissipation Capacitance
(Notes 3, 4)
C
C =15pF
5
30
PD
L
HCT TYPES
Propagation Delay Time
(Figure 2)
t
t
C = 50pF
4.5
-
-
40
-
50
-
60
ns
PLH,
L
PHL
CP to Q1’ Output
C =15pF
5
4.5
5
-
-
-
-
-
17
-
-
15
-
-
-
-
-
-
-
19
-
-
-
-
-
-
-
22
-
ns
ns
ns
ns
ns
L
Q to Q + 1
t
t
C = 50pF
L
n
n
PLH,
t
PHL
C =15pF
6
L
MR to Q
C = 50pF
4.5
5
-
40
-
50
-
60
-
n
PLH,
L
t
PHL
C =15pF
17
L
5
CD54/74HC4024, CD54/74HCT4024
Switching Specifications Input t , t = 6ns (Continued)
r
f
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
TEST
SYMBOL CONDITIONS
V
CC
(V)
PARAMETER
Output Transition
MIN TYP MAX
MIN
MAX
19
10
-
MIN
MAX UNITS
t
, t C = 50pF
4.5
-
-
-
-
-
-
15
10
-
-
-
-
-
-
-
22
10
-
ns
pF
pF
TLH THL
L
Input Capacitance
C
C =15pF
L
IN
Power Dissipation Capacitance
(Notes 3, 4)
C
C =15pF
5
30
PD
L
NOTES:
3. C
is used to determine the dynamic power consumption, per package.
PD
2
2
1
2
3
4
5
6
7
4. P = V
f + ∑ (C V
CC
fi/M) where: M = 2 , 2 , 2 , 2 ,2 , 2 , 2 f = Input Frequency, C = Output Load Capacitance, V = Supply
CC
D
CC
i
L
i
L
Voltage.
Test Circuits and Waveforms
I
t
+ t =
WH
WL
I
t C = 6ns
fC
r
L
t
+ t
=
L
WL
WH
t C = 6ns
t C
f
L
fC
t C
f
L
L
r
L
3V
V
CC
90%
10%
2.7V
0.3V
CLOCK
CLOCK
50%
10%
1.3V
0.3V
50%
t
50%
1.3V
t
1.3V
GND
GND
t
t
WH
WL
WH
WL
NOTE: Outputs should be switching from 10% V
to 90% V
in
NOTE: Outputs should be switching from 10% V
to 90% V
in
CC
CC
CC
CC
accordance with device truth table. For f
, input duty cycle = 50%.
accordance with device truth table. For f
, input duty cycle = 50%.
MAX
MAX
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
t = 6ns
t = 6ns
t = 6ns
t = 6ns
r
f
r
f
V
3V
CC
90%
50%
10%
2.7V
1.3V
0.3V
INPUT
INPUT
GND
GND
t
t
t
t
THL
TLH
THL
TLH
90%
1.3V
90%
50%
10%
INVERTING
OUTPUT
INVERTING
OUTPUT
10%
t
t
PLH
PHL
t
t
PLH
PHL
FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
6
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
CDIP
PDIP
Drawing
CD54HC4024F
CD54HC4024F3A
CD54HCT4024F3A
CD74HC4024E
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
J
14
14
14
14
1
1
TBD
TBD
TBD
A42 SNPB
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
J
1
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74HC4024EE4
CD74HC4024M
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
N
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HC4024M96
CD74HC4024M96E4
CD74HC4024ME4
CD74HC4024MT
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HC4024MTE4
CD74HC4024PW
CD74HC4024PWE4
CD74HC4024PWR
CD74HC4024PWRE4
CD74HC4024PWT
CD74HC4024PWTE4
CD74HCT4024E
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PDIP
PW
PW
PW
PW
PW
PW
N
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74HCT4024EE4
CD74HCT4024M
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SOIC
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HCT4024ME4
SOIC
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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