CD74HCT74M96G4 [TI]

具有设置和复位端的高速 CMOS 逻辑双路正边沿触发式 D 触发器 | D | 14 | -55 to 125;
CD74HCT74M96G4
型号: CD74HCT74M96G4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有设置和复位端的高速 CMOS 逻辑双路正边沿触发式 D 触发器 | D | 14 | -55 to 125

光电二极管 逻辑集成电路 触发器 锁存器
文件: 总8页 (文件大小:45K)
中文:  中文翻译
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CD54HC74, CD74HC74,  
CD74HCT74  
Data sheet acquired from Harris Semiconductor  
SCHS124  
Dual D Flip-Flop with Set and Reset  
Positive-Edge Trigger  
January 1998  
Features  
Description  
• Hysteresis on Clock Inputs for Improved Noise Immu-  
nity and Increased Input Rise and Fall Times  
The Harris CD54HC74, CD74HC74 and CD74HCT74 utilize  
silicon gate CMOS technology to achieve operating speeds  
equivalent to LSTTL parts. They exhibit the low power  
consumption of standard CMOS integrated circuits, together  
with the ability to drive 10 LSTTL loads.  
[ /Title  
(CD54H  
C74,  
CD74H  
C74,  
CD74H  
CT74)  
/Subject  
(Dual D  
Flip-  
• Asynchronous Set and Reset  
• Complementary Outputs  
• Buffered Inputs  
This flip-flop has independent DATA, SET, RESET and  
CLOCK inputs and Q and Q outputs. The logic level present  
at the data input is transferred to the output during the  
positive-going transition of the clock pulse. SET and RESET  
are independent of the clock and are accomplished by a low  
level at the appropriate input.  
• Typical f  
MAX  
= 50MHz at V = 5V, C = 15pF,  
CC L  
o
T = 25 C  
A
• Fanout (Over Temperature Range)  
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads  
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads The 74HCT logic family is functionally as well as pin  
compatible with the standard 74LS logic family.  
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C  
• Balanced Propagation Delay and Transition Times  
Flop  
with Set  
Ordering Information  
TEMP. RANGE  
PKG.  
NO.  
• Significant Power Reduction Compared to LSTTL  
Logic ICs  
o
PART NUMBER  
CD54HC74F  
CD74HC74E  
CD74HCT74E  
CD74HC74M  
CD74HCT74M  
NOTES:  
( C)  
PACKAGE  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
14 Ld CERDIP F14.3  
• HC Types  
14 Ld PDIP  
14 Ld PDIP  
14 Ld SOIC  
14 Ld SOIC  
E14.3  
- 2V to 6V Operation  
- High Noise Immunity: N = 30%, N = 30% of V  
CC  
E14.3  
IL  
IH  
at V  
= 5V  
CC  
M14.15  
M14.15  
• HCT Types  
- 4.5V to 5.5V Operation  
- Direct LSTTL Input Logic Compatibility,  
1. When ordering, use the entire part number. Add the suffix 96 to  
obtain the variant in the tape and reel.  
V = 0.8V (Max), V = 2V (Min)  
IL IH  
- CMOS Input Compatibility, I 1µA at V , V  
OL OH  
l
2. Die is available which meets all electrical specifications. Please  
contact your local sales office or Harris customer service for  
ordering information.  
Pinout  
CD54HC74, CD74HC74, CD74HCT74  
(PDIP, SOIC, CERDIP)  
TOP VIEW  
1R  
1D  
1
2
3
4
5
6
7
14 V  
CC  
13 2R  
12 2D  
11 2CP  
10 2S  
1CP  
1S  
1Q  
1Q  
9
8
2Q  
2Q  
GND  
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.  
File Number 1476.1  
Copyright © Harris Corporation 1998  
1
CD54HC74, CD74HC74, CD74HCT74  
Functional Diagram  
1
RESET  
R
2
3
5
6
Q
Q
DATA  
D
F/F 1  
CP  
CLOCK  
S
4
SET  
13  
RESET  
R
12  
11  
9
8
D
Q
Q
DATA  
F/F 2  
CP  
CLOCK  
GND = PIN 7  
= PIN 14  
S
V
CC  
10  
SET  
TRUTH TABLE  
INPUTS  
OUTPUTS  
SET  
L
RESET  
CP  
X
X
X
D
Q
Q
H
L
X
X
X
H
L
H
L
H
L
H
L
L
H (Note 3)  
H (Note 3)  
H
H
H
H
L
L
H
H
H
H
L
X
Q0  
Q0  
NOTE:  
H = High Level (Steady State)  
L
X
= Low Level (Steady State)  
= Don’t Care  
= Low-to-High Transition  
Q0 = the level of Q before the indicated input conditions were established.  
3. This configuration is nonstable, that is, it will not persist when set and reset inputs return to their inactive (high) level.  
2
CD54HC74, CD74HC74, CD74HCT74  
Absolute Maximum Ratings  
Thermal Information  
o
o
DC Supply Voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V Thermal Resistance (Typical, Note 4)  
θ
( C/W)  
θ
( C/W)  
CC  
DC Input Diode Current, I  
JA  
JC  
PDIP Package . . . . . . . . . . . . . . . . . . .  
SOIC Package. . . . . . . . . . . . . . . . . . .  
CERDIP Package . . . . . . . . . . . . . . . .  
90  
120  
130  
-
-
55  
IK  
For V < -0.5V or V > V  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA  
I
I
CC  
DC Drain Current, per Output, I  
O
o
For -0.5V < V < V  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA  
Maximum Junction Temperature (Hermetic Package or Die) . . . 175 C  
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150 C  
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C  
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300 C  
O
CC  
o
DC Output Diode Current, I  
OK  
For V < -0.5V or V > V  
o
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA  
O
O
CC  
o
DC Output Source or Sink Current per Output Pin, I  
O
For V > -0.5V or V < V  
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA  
(SOIC - Lead Tips Only)  
O
O
CC  
DC V  
or Ground Current, I  
. . . . . . . . . . . . . . . . . . . . . . . . .±50mA  
CC  
CC  
Operating Conditions  
o
o
Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C  
A
Supply Voltage Range, V  
CC  
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V  
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V  
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V  
I
O
CC  
Input Rise and Fall Time  
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)  
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)  
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
4. θ is measured with the component mounted on an evaluation PC board in free air.  
JA  
DC Electrical Specifications  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
HC TYPES  
SYMBOL V (V)  
I
(mA)  
V
(V) MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
CC  
High Level Input  
Voltage  
V
-
-
-
2
1.5  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5  
-
1.5  
-
-
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
µA  
IH  
4.5  
3.15  
-
-
3.15  
-
-
3.15  
6
2
4.2  
4.2  
4.2  
-
Low Level Input  
Voltage  
V
-
-
0.5  
1.35  
1.8  
-
-
0.5  
1.35  
1.8  
-
-
0.5  
1.35  
1.8  
-
IL  
4.5  
6
-
-
-
-
-
-
High Level Output  
Voltage  
CMOS Loads  
V
V
or  
-0.02  
2
1.9  
1.9  
1.9  
OH  
IH  
V
IL  
4.5  
6
4.4  
-
4.4  
-
4.4  
-
5.9  
-
5.9  
-
5.9  
-
High Level Output  
Voltage  
TTL Loads  
-
-
-
-
-
-
-
-
-4  
4.5  
6
3.98  
-
3.84  
-
3.7  
-
-5.2  
5.48  
-
5.34  
-
5.2  
-
Low Level Output  
Voltage  
CMOS Loads  
V
V
or  
0.02  
2
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
OL  
IH  
V
IL  
4.5  
6
Low Level Output  
Voltage  
TTL Loads  
-
4
-
4.5  
6
0.26  
0.26  
±0.1  
0.33  
0.33  
±1  
0.4  
0.4  
±1  
5.2  
-
Input Leakage  
Current  
I
V
or  
6
I
CC  
GND  
3
CD54HC74, CD74HC74, CD74HCT74  
DC Electrical Specifications (Continued)  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
SYMBOL V (V)  
I
(mA)  
V
(V) MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
CC  
Quiescent Device  
Current  
I
V
GND  
or  
0
6
-
-
4
-
40  
-
80  
µA  
CC  
CC  
HCT TYPES  
High Level Input  
Voltage  
V
-
-
-
-
-
4.5 to  
5.5  
2
-
-
-
-
-
0.8  
-
2
-
-
0.8  
-
2
-
-
0.8  
-
V
V
V
IH  
Low Level Input  
Voltage  
V
4.5 to  
5.5  
IL  
High Level Output  
Voltage  
V
V
or  
IH  
4.5  
4.4  
4.4  
4.4  
OH  
V
IL  
CMOS Loads  
High Level Output  
Voltage  
-0.02  
4.5  
3.98  
-
-
3.84  
-
3.7  
-
V
TTL Loads  
Low Level Output  
Voltage CMOS Loads  
V
V
V
or  
IH  
-4  
4.5  
4.5  
-
-
-
-
0.1  
-
-
0.1  
-
-
0.1  
0.4  
V
V
OL  
IL  
Low Level Output  
Voltage  
TTL Loads  
0.02  
4
0.26  
0.33  
Input Leakage  
Current  
I
V
and  
GND  
5.5  
5.5  
-
±0.1  
-
±1  
-
±1  
µA  
I
CC  
Quiescent Device  
Current  
I
V
or  
0
-
-
-
-
4
-
-
40  
-
-
80  
µA  
µA  
CC  
CC  
GND  
Additional Quiescent  
Device Current Per  
Input Pin: 1 Unit Load  
I  
V
4.5 to  
5.5  
100  
360  
450  
490  
CC  
(Note 5)  
CC  
- 2.1  
NOTE:  
5. For dual-supply systems theoretical worst case (V = 2.4V, V  
I
= 5.5V) specification is 1.8mA.  
CC  
HCT Input Loading Table  
INPUT  
UNIT LOADS  
D
0.5  
0.5  
R
CP  
S
0.7  
0.75  
NOTE: Unit Load is I  
tions table, e.g., 360µA max at 25 C.  
limit specified in DC Electrical Specifica-  
CC  
o
Prerequisite For Switching Specifications  
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
TEST  
V
CC  
PARAMETER  
HC TYPES  
SYMBOL CONDITIONS (V)  
MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
Data to CP Setup Time  
(Figure 5)  
t
-
2
60  
12  
10  
-
-
-
-
-
-
75  
15  
13  
-
-
-
90  
18  
15  
-
-
-
ns  
ns  
ns  
SU  
4.5  
6
4
CD54HC74, CD74HC74, CD74HCT74  
Prerequisite For Switching Specifications (Continued)  
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
TEST  
V
CC  
PARAMETER  
SYMBOL CONDITIONS (V)  
MIN TYP MAX  
MIN  
3
MAX  
MIN  
3
MAX  
UNITS  
ns  
Hold Time (Figure 5)  
t
-
-
-
-
-
2
4.5  
6
3
3
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
H
3
3
ns  
3
3
3
ns  
Removal Time R, S, to CP  
(Figure 5)  
t
REM  
2
30  
6
40  
8
45  
9
ns  
4.5  
6
ns  
5
7
8
ns  
Pulse Width R, S (Figure 1)  
Pulse Width CP (Figure 1)  
CP Frequency  
t
2
80  
16  
14  
80  
16  
14  
6
100  
20  
17  
100  
20  
17  
5
120  
24  
20  
120  
24  
20  
4
ns  
W
W
4.5  
6
ns  
ns  
t
2
ns  
4.5  
6
ns  
ns  
f
MAX  
2
MHz  
MHz  
MHz  
4.5  
6
30  
35  
25  
29  
20  
23  
HCT TYPES  
Data to CP Setup Time  
(Figure 6)  
t
-
4.5  
12  
-
-
15  
-
18  
-
ns  
SU  
Hold Time (Figure 6)  
t
-
-
4.5  
4.5  
3
6
-
-
-
-
3
8
-
-
3
9
-
-
ns  
ns  
H
Removal Time R, S, to CP  
(Figure 6)  
t
f
REM  
Pulse Width R, S (Figure 2)  
Pulse Width CP (Figure 2)  
CP Frequency  
t
t
-
-
-
4.5  
4.5  
4.5  
16  
18  
25  
-
-
-
-
-
-
20  
23  
20  
-
-
-
24  
27  
16  
-
-
-
ns  
ns  
W
W
MHz  
MAX  
Switching Specifications Input t , t = 6ns  
r
f
o
o
o
o
o
25 C  
MIN TYP MAX  
-40 C TO 85 C -55 C TO 125 C  
TEST  
V
CC  
PARAMETER  
HC TYPES  
SYMBOL CONDITIONS (V)  
MIN  
MAX  
MIN  
MAX  
UNITS  
Propagation Delay,  
CP to Q, Q (Figure 3)  
t
, t  
PLH PHL  
C = 50pF  
2
4.5  
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
175  
35  
-
-
-
-
-
-
-
-
-
-
-
-
-
220  
44  
-
-
-
-
-
-
-
-
-
-
-
-
-
265  
53  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
pF  
L
C = 50pF  
L
C = 15pF  
14  
-
L
C = 50pF  
6
30  
200  
40  
-
37  
250  
50  
-
45  
300  
60  
-
L
Propagation Delay,  
R, S to Q, Q (Figure 3)  
t , t  
PLH PHL  
C = 50pF  
2
-
L
C = 50pF  
4.5  
5
-
L
C = 15pF  
17  
-
L
C = 50pF  
6
34  
75  
15  
13  
10  
43  
95  
19  
16  
10  
51  
110  
22  
19  
10  
L
Transition Time (Figure 3)  
Input Capacitance  
t
, t  
TLH THL  
C = 50pF  
2
-
L
C = 50pF  
4.5  
6
-
L
C = 50pF  
L
-
C
-
-
-
I
5
CD54HC74, CD74HC74, CD74HCT74  
Switching Specifications Input t , t = 6ns (Continued)  
r
f
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
TEST  
V
CC  
PARAMETER  
CP Frequency  
SYMBOL CONDITIONS (V)  
MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
MHz  
pF  
f
CL = 15pF  
-
5
5
-
-
50  
25  
-
-
-
-
-
-
-
-
-
-
MAX  
Power Dissipation Capacitance  
(Notes 6, 7)  
C
PD  
HCT TYPES  
Propagation Delay,  
CP to Q, Q (Figure 4)  
t
, t  
PLH PHL  
C = 50pF  
L
4.5  
4.5  
-
-
-
-
35  
40  
-
-
44  
50  
-
-
53  
60  
ns  
ns  
Propagation Delay,  
t , t  
PHL PLH  
CL = 50pF  
R, S to Q, Q (Figure 4)  
Transition Time (Figure 4)  
Input Capacitance  
CP Frequency  
t
, t  
TLH THL  
C = 50pF  
L
4.5  
-
-
-
-
-
-
15  
10  
-
-
-
-
-
19  
10  
-
-
-
-
-
22  
10  
-
ns  
pF  
C
-
-
I
f
CL = 15pF  
-
5
50  
30  
MHz  
pF  
MAX  
Power Dissipation Capacitance  
(Notes 6, 7)  
C
5
-
-
-
PD  
NOTES:  
6. C  
PD  
is used to determine the dynamic power consumption, per flip-flop.  
2
2
7. P = C  
V
f + Σ (C V  
f ) where f = input frequency, f = output frequency, C = output load capacitance, V  
= supply voltage.  
D
PD CC  
i
L
CC  
o
i
o
L
CC  
Test Circuits and Waveforms  
I
t
+ t =  
WH  
WL  
I
t C = 6ns  
fC  
r
L
t
+ t  
=
L
WL  
WH  
t C = 6ns  
t C  
f
L
f
t C  
f
L
CL  
r
L
3V  
V
CC  
90%  
10%  
2.7V  
CLOCK  
CLOCK  
50%  
10%  
1.3V  
0.3V  
50%  
t
50%  
1.3V  
t
1.3V  
0.3V  
GND  
GND  
t
t
WH  
WL  
WH  
WL  
NOTE: Outputs should be switching from 10% V  
to 90% V  
in  
NOTE: Outputs should be switching from 10% V  
to 90% V  
in  
CC  
CC  
CC  
CC  
accordance with device truth table. For f  
, input duty cycle = 50%. accordance with device truth table. For f , input duty cycle = 50%.  
MAX  
MAX  
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND  
PULSE WIDTH  
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND  
PULSE WIDTH  
t = 6ns  
t = 6ns  
t = 6ns  
t = 6ns  
r
f
r
f
V
3V  
CC  
90%  
50%  
10%  
2.7V  
1.3V  
0.3V  
INPUT  
INPUT  
GND  
GND  
t
t
t
t
THL  
TLH  
THL  
TLH  
90%  
1.3V  
90%  
50%  
10%  
INVERTING  
OUTPUT  
INVERTING  
OUTPUT  
10%  
t
t
PLH  
PHL  
t
t
PLH  
PHL  
FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGA-  
TION DELAY TIMES, COMBINATION LOGIC  
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION  
DELAY TIMES, COMBINATION LOGIC  
6
CD54HC74, CD74HC74, CD74HCT74  
Test Circuits and Waveforms (Continued)  
t C  
t C  
t C  
t C  
r
L
f
L
f
L
r
L
V
3V  
CC  
90%  
10%  
2.7V  
0.3V  
CLOCK  
INPUT  
CLOCK  
INPUT  
50%  
1.3V  
GND  
GND  
t
t
t
t
H(L)  
H(H)  
H(H)  
H(L)  
V
3V  
CC  
DATA  
INPUT  
DATA  
INPUT  
50%  
1.3V  
t
SU(L)  
1.3V  
1.3V  
GND  
GND  
t
t
t
SU(H)  
SU(H)  
SU(L)  
t
t
90%  
50%  
t
t
THL  
TLH  
THL  
TLH  
90%  
1.3V  
90%  
90%  
1.3V  
OUTPUT  
OUTPUT  
10%  
10%  
t
t
t
PLH  
t
PHL  
PHL  
PLH  
t
REM  
t
REM  
V
3V  
CC  
SET, RESET  
OR PRESET  
SET, RESET  
OR PRESET  
50%  
1.3V  
GND  
GND  
IC  
IC  
C
C
L
L
50pF  
50pF  
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,  
AND PROPAGATION DELAY TIMES FOR EDGE  
TRIGGERED SEQUENTIAL LOGIC CIRCUITS  
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,  
AND PROPAGATION DELAY TIMES FOR EDGE  
TRIGGERED SEQUENTIAL LOGIC CIRCUITS  
7
IMPORTANT NOTICE  
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any product or service without notice, and advise customers to obtain the latest version of relevant information  
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pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
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BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
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Copyright 1999, Texas Instruments Incorporated  

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