CDC906PW [TI]
PROGRAMMABLE 3-PLL CLOCK SYNTHESIZER / MULTIPLIER / DIVIDER; 可编程3 -PLL时钟合成器/乘法器/除法器
| 型号： | CDC906PW |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | PROGRAMMABLE 3-PLL CLOCK SYNTHESIZER / MULTIPLIER / DIVIDER |
| 文件： | 总39页 (文件大小：1085K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CDC906
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SCAS828–SEPTEMBER 2006
PROGRAMMABLE 3-PLL CLOCK SYNTHESIZER / MULTIPLIER / DIVIDER
FEATURES
•
•
•
3.3-V Device Power Supply
•
High Performance 2:6 PLL based Clock
Commercial Temperature Range 0°C to 70°C
Synthesizer / Multiplier / Divider
Development and Programming Kit for Easy
PLL Design and Programming
(TI Pro-Clock™)
•
•
User Programmable PLL Frequencies
Easy In-Circuit Programming via SMBus Data
Interface
•
•
Packaged in 20-Pin TSSOP
•
•
Wide PLL Divider Ratio Allows 0-PPM Output
Clock Error
Factory Programmable for Customized
Default Settings are Available. Contact TI
Sales Fordes for Further Details.
Generates Precise Video (27 MHz or 54 MHz)
and Audio System Clocks from Multiple
Sampling Frequencies (fS = 16, 22.05, 24, 32,
44.1, 48, 96 kHz)
APPLICATIONS
•
•
•
•
Digital TV
Printer / Scanner
Set Top Box
Video / Audio
•
Clock Inputs Accept a Crystal or a
Single-Ended LVCMOS or a Differential Input
Signal
•
•
•
•
•
•
Accepts Crystal Frequencies from 8 MHz up
to 54 MHz
TERMINAL ASSIGNMENT
Accepts LVCMOS or Differential Input
Frequencies up to 167 MHz
PW PACKAGE
(TOP VIEW)
Two Programmable Control Inputs [S0/S1] for
User Defined Control Signals
1
20
19
18
17
16
15
14
13
12
11
S0/CLK_SEL
Y5
2
S1
VCC
Y4
Six LVCMOS Outputs with Output
Frequencies up to 167 MHz
3
VCCOUT2
GND
Y3
4
GND
CLK_IN0
CLK_IN1
VCC
TSSOP 20
Pitch 0,65 mm
6.6 x 6.6
5
LVCMOS Outputs can be Programmed for
Complementary Signals
6
Y2
7
VCCOUT1
GND
Y1
Free Selectable Output Frequency via
Programmable Output Switching Matrix [6x6]
Including 7-Bit Post-Divider for Each Output
8
GND
9
SDATA
SCLOCK
10
Y0
•
•
•
PLL Loop Filter Components Integrated
Low Period Jitter (Typical 60 ps)
Features Spread Spectrum Clocking (SSC)
for Lowering System EMI
•
Programmable Center Spread SSC
Modulation (±0.1%, ±0.25%, and ±0.4%) with a
Mean Phase Equal to the Phase of the
Non-Modulated Frequency
•
•
•
Programmable Down Spread SSC Modulation
(1%, 1.5%, 2%, and 3%)
Programmable Output Slew-Rate Control
(SRC) for Lowering System EMI
Separate Power Supplies for Outputs
(2.3 V to 3.6 V) Supports Mixed Power
Supply Environments
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Pro-Clock is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
CDC906
www.ti.com
SCAS828–SEPTEMBER 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION
The CDC906 is one of the smallest and powerful PLL synthesizer / multiplier / divider available today. Despite its
small physical outlines, the CDC906 is flexible. It has the capability to produce an almost independent output
frequency from a given input frequency.
The input frequency can be derived from a LVCMOS, differential input clock, or a single crystal. The appropriate
input waveform can be selected via the SMBus data interface controller.
To achieve an independent output frequency the reference divider M and the feedback divider N for each PLL
can be set to values from 1 up to 511 for the M-Divider and from 1 up to 4095 for the N-Divider. The PLL-VCO
(voltage controlled oscillator) frequency than is routed to the free programmable output switching matrix to any
of the six outputs. The switching matrix includes an additional 7-bit post-divider (1-to-127) and an inverting logic
for each output.
The deep M/N divider ratio allows the generation of zero ppm clocks from any reference input frequency (e.g., a
27 MHz).
The CDC906 includes three PLLs of those one supports SSC (spread-spectrum clocking). PLL1, PLL2, and
PLL3 are designed for frequencies up to 167 MHz and optimized for zero-ppm applications with wide divider
factors.
PLL2 also supports center-spread and down-spread spectrum clocking (SSC). This is a common technique to
reduce electro-magnetic interference. Also, the slew-rate controllable (SRC) output edges minimize EMI noise.
Based on the PLL frequency and the divider settings, the internal loop filter components is automatically
adjusted to achieve high stability and optimized jitter transfer characteristic of the PLL.
The device provides customized applications. It is preprogrammed with a factory default configuration (see
Figure 13) and can be reprogrammed to a different application configuration via the serial SMBus interface.
Two free programmable inputs, S0 and S1, can be used to control for each application the most demanding
logic control settings (outputs disable to low, outputs 3-state, power down, PLL bypass, etc).
The CDC906 has three power supply pins, VCC, VCCOUT1 and VCCOUT2. VCC is the power supply for the device. It
operates from a single 3.3-V supply voltage. VCCOUT1 and VCCOUT2 are the power supply pins for the outputs.
VCCOUT1 supplies the outputs Y0 and Y1 and VCCOUT2 supplies the outputs Y2, Y3, Y4, and Y5. Both outputs
supplies can be 2.3 V to 3.6 V.
The CDC906 is characterized for operation from 0°C to 70°C.
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SCAS828–SEPTEMBER 2006
FUNCTIONAL BLOCK DIAGRAM
V
CC
GND
V
CCOUT1
PLL Bypass
Output Switch Matrix
VCO1 Bypass
PLL1
MUX
prg. 9 Bit
Divider M
PFD
Filter
VCO
LV
CMOS
Y0
Y1
prg. 12 Bit
Divider N
LV
CMOS
CLK_IN0
CLK_IN1
VCO2 Bypass
XO
or
2 LVCMOS
or
Differential
Input
PLL2
w/ SSC
LV
CMOS
prg. 9 Bit
Divider M
Y2
Y3
PFD
Filter
VCO
MUX
prg. 12 Bit
Divider N
LV
CMOS
SSC
On/Off
SO/CLK_SEL
Programing
LOGIC
VCO3 Bypass
LV
CMOS
S1
SDATA
PLL3
MUX
Y4
Y5
prg. 9 Bit
Divider M
SMBUS
LOGIC
PFD
Filter
VCO
SCLOCK
LV
CMOS
Factory Prg.
prg. 12 Bit
Divider N
GND
V
CCOUT2
OUTPUT SWITCH MATRIX
5x6 − Switch A
7-Bit Divider
P0
6x6 − Switch B
Y0
Y1
Y2
Y3
Y4
Y5
Input CLK
(PLL Bypass)
P1
P2
P3
P4
PLL 1
PLL 2
non SSC
PLL 2
w/ SSC
P5
PLL 3
Programming
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SCAS828–SEPTEMBER 2006
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
TSSOP20
NAME
NO.
11, 12, 15,
Y0 to Y5
O
I
LVCMOS outputs
16, 19, 20
Dependent on SMBus settings, CLK_IN0 is the crystal oscillator input and can also be used as
LVCMOS input or as positive differential signal inputs.
CLK_IN0
CLK_IN1
5
6
Dependent on SMBus settings, CLK_IN1 is serving as the crystal oscillator output or can be the
second LVCMOS input or the negative differential signal input.
I/O
VCC
3, 7
14
Power 3.3-V power supply for the device
VCCOUT1
VCCOUT2
GND
Power Power 2.5-V to 3.3-V power supply for outputs Y0, Y1
Power Power 2.5-V to 3.3-V power supply for outputs Y2, Y3, Y4, Y5
18
4, 8, 13, 17 Ground Ground
User programmable control input S0 (PLL bypass or power-down mode) or CLK_SEL (selects one
S0,
CLK_SEL
1
I
of two LVCMOS clock inputs), dependent on the SMBus settings; LVCMOS inputs; internal pullup
150 kΩ.
User programmable control input S1 (output enable/disable or all output low), dependent on the
SMBus settings; LVCMOS inputs; internal pullup 150 kΩ
S1
2
I
SDATA
9
I/O
I
Serial control data input/output for SMBus controller; LVCMOS input
Serial control clock input for SMBus controller; LVCMOS input
SCLOCK
10
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
–0.5 to 4.6
–0.5 to VCC + 0.5
– 0.5 to VCC + 0.5
±20
UNIT
V
VCC
VI
Supply voltage range
Input voltage range(2)
Output voltage range(2)
Input current (VI < 0, V I > VCC
Continuous output current
Storage temperature range
V
VO
II
V
)
mA
mA
°C
°C
IO
±50
Tstg
TJ
–65 to 150
125
Maximum junction temperature
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
(2) The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
PACKAGE THERMAL RESISTANCE
for TSSOP20 (PW) Package(1)(2)
PARAMETER
Thermal resistance junction-to-ambient
Thermal resistance junction-to-case
AIRFLOW (LFM)
°C/W
66.3
59.3
56.3
51.9
19.7
0
150
250
500
θJA
θJC
(1) The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
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SCAS828–SEPTEMBER 2006
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
3
NOM
MAX
3.6
UNIT
V
VCC
Device supply voltage
3.3
VCCOUT1
VCCOUT2
VIL
Output Y0,Y1 supply voltage
Output Y2, Y3, Y4, Y5 supply voltage
Low level input voltage LVCMOS
High level input voltage LVCMOS
Input voltage threshold LVCMOS
Input voltage range LVCMOS
Differential input voltage
2.3
2.3
3.6
V
3.6
V
0.3 VCC
V
VIH
0.7 VCC
V
VIthresh
VI
0.5 VCC
V
0
0.1
0.2
3.6
V
|VID
|
V
VIC
Common-mode for differential input voltage
Output current (3.3 V)
VCC– 0.6
V
IOH / IOL
IOH / IOL
CL
±6
±4
25
70
mA
mA
pF
°C
Output current (2.5 V)
Output load LVCMOS
TA
Operating free-air temperature
0
RECOMMENDED CRYSTAL SPECIFICATIONS
MIN
NOM
MAX
54
UNIT
MHz
Ω
fXtal
ESR
CIN
Crystal input frequency range (fundamental mode)
Effective series resistance(1)(2)
8
27
15
60
Input capacitance CLK_IN0 and CLK_IN1
3
pF
(1) For crystal frequencies above 50 MHz the effective series resistor should not exceed 50Ω to assure stable start-up condition.
(2) Maximum Power Handling (Drive Level) see Figure 16.
TIMING REQUIREMENTS
over recommended ranges of supply voltage, load, and operating-free air temperature
MIN NOM MAX UNIT
CLK_IN REQUIREMENTS
PLL mode
1
0
167
167
4
fCLK_IN
CLK_IN clock input frequency (LVCMOS or Differential)
MHz
ns
PLL bypass mode
tr / tf
Rise and fall time CLK_IN signal (20% to 80%)
Duty cycle CLK_IN at VCC / 2
dutyREF
40%
60%
SMBus TIMING REQUIREMENTS (see Figure 11)
fSCLK
SCLK frequency
100
50
kHz
µs
µs
µs
µs
µs
µs
ns
ns
µs
µs
ms
th(START)
tw(SCLL)
tw(SCLH)
tsu(START)
th(SDATA)
tsu(SDATA)
tr
START hold time
4
4.7
4
SCLK low-pulse duration
SCLK high-pulse duration
START setup time
0.6
0.3
0.25
SDATA hold time
SDATA setup time
SCLK / SDATA input rise time
SCLK / SDATA input fall time
STOP setup time
1000
300
tf
tsu(STOP)
tBUS
4
Bus free time
4.7
tPOR
Time in which the device must be operational after power-on reset
500
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DEVICE CHARACTERISTICS
over recommended operating free-air temperature range and test load (unless otherwise noted), see Figure 1
PARAMETER
OVERALL PARAMETER
TEST CONDITIONS
MIN TYP(1)
MAX
UNIT
All PLLs on, all outputs on,
fOUT = 80 MHz, fCLK_IN = 27 MHz,
f(VCO) = 160 MHz
(2)
ICC
Supply current
90
115
mA
Power down current. Every circuit powered
down except SMBus
ICCPD
VPUC
fIN = 0 MHz, VCC = 3.6 V
50
µA
Supply voltage VCC threshold for power up
control circuit
2.1
V
All PLLs
80
80
200
167
300
250
300
Normal
speed-mode(3)
VCO frequency of internal PLL (any of three
PLLs)
f(VCO)
PLL2 with SSC
MHz
MHz
High-speed mode(3)
VCC = 2.5 V
180
LVCMOS output frequency range(4), See
Figure 4
fOUT
VCC = 3.3 V
LVCMOS PARAMETER
VIK
II
LVCMOS input voltage
VCC = 3 V, II = –18 mA
–1.2
±5
V
LVCMOS input current (CLK_IN0 / CLK_IN1) VI = 0 V or VCC, VCC = 3.6 V
µA
µA
µA
pF
IIH
IIL
CI
LVCMOS input current (For S1/S0)
LVCMOS input current (For S1/S0)
Input capacitance at CLK_IN0 and CLK_IN1
VI = VCC, VCC = 3.6 V
VI = 0 V, VCC = 3.6 V
VI = 0 V or VCC
5
-35
–10
3
LVCMOS PARAMETER FOR VCCOUT = 3.3-V Mode
VCCOUT = 3 V, IOH = –0.1 mA
VCCOUT = 3 V, IOH = –4 mA
VCCOUT = 3 V, IOH = –6 mA
VCCOUT = 3 V, IOL = 0.1 mA
VCCOUT = 3 V, IOL = 4 mA
VCCOUT = 3 V, IOL = 6 mA
All PLL bypass
2.9
2.4
2.1
VOH
LVCMOS high-level output voltage
V
0.1
0.5
VOL
LVCMOS low-level output voltage
Propagation delay
V
0.85
9
tPLH
,
ns
tPHL
VCO bypass
11
tr0/tf0
tr1/tf1
tr2/tf2
Rise and fall time for output slew rate 0
Rise and fall time for output slew rate 1
Rise and fall time for output slew rate 2
VCCOUT = 3.3 V (20%–80%)
VCCOUT = 3.3 V (20%–80%)
VCCOUT = 3.3 V (20%–80%)
1.7
1.5
1.2
3.3
2.5
1.6
4.8
3.2
2.1
ns
ns
ns
Rise and fall time for output slew rate 3
(Default Configuration)
tr3/tf3
tjit(cc)
VCCOUT = 3.3 V (20%–80%)
0.4
0.6
1
ns
ps
1 PLL, 1 Output
3 PLLs, 3 Outputs
1 PLL, 1 Output
3 PLLs, 3 Outputs
fOUT = 24.576 MHz
65
85
95
135
115
150
(5)(6)
Cycle-to-cycle jitter
fOUT = 24.576 MHz
fOUT = 24.576 MHz
fOUT = 24.576 MHz
90
tjit(per)
tsk(o)
Peak-to-peak period jitter(5)(6)
ps
ps
100
Output skew (see (7) and Table 5)
1.6-ns rise/fall time at f(VCO) = 150 MHz,
Pdiv = 3
200
(1) All typical values are at respective nominal VCC
.
(2) For calculating total supply current, add the current from Figure 2, Figure 3, and Figure 4. Using high-speed mode of the VCO reduces
the current consumption significantly. See Figure 3
(3) Normal-speed mode or high-speed mode must be selected by the VCO frequency selection bit in Byte 6, Bit [7:5]. The min f(VCO) can be
lower but impacts jitter-performance.
(4) The maximum output frequency may be exceeded, but specifications under the Recommended Operating Condition may change and
are no longer assured. Do not exceed the maximum power dissipation of the 20-pin TSSOP package (600 mW at no air flow). See
Figure 5.
(5) 50000 cycles.
(6) Jitter depends on configuration. Jitter data is for normal tr/tf, input frequency = 27 MHz, f(VCO) = 147 MHz output.
(7) The tsk(o) specification is only valid for equal loading of all outputs.
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DEVICE CHARACTERISTICS (continued)
over recommended operating free-air temperature range and test load (unless otherwise noted), see Figure 1
PARAMETER
Output duty cycle(8)
LVCMOS PARAMETER FOR VCCOUT = 2.5-V Mode
TEST CONDITIONS
f(VCO) = 100 MHz, Pdiv = 1
MIN TYP(1)
MAX
UNIT
odc
45%
55%
VCCOUT = 2.3 V, IOH = 0.1 mA
VCCOUT = 2.3 V, IOH = –3 mA
VCCOUT = 2.3 V, IOH = –4 mA
VCCOUT = 2.3 V, IOL = 0.1 mA
VCCOUT = 2.3 V, IOL = 3 mA
VCCOUT = 2.3 V, IOL = 4 mA
All PLL bypass
2.2
1.7
1.5
VOH
LVCMOS high-level output voltage
V
0.1
0.5
VOL
LVCMOS low-level output voltage
Propagation delay
V
0.85
9
tPLH
,
ns
tPHL
VCO bypass
11
tr0/tf0
tr1/tf1
tr2/tf2
Rise and fall time for output slew rate 0
Rise and fall time for output slew rate 1
Rise and fall time for output slew rate 2
VCCOUT = 2.5 V (20%–80%)
VCCOUT = 2.5 V (20%–80%)
VCCOUT = 2.5 V (20%–80%)
2
1.8
1.3
3.9
2.9
2
5.6
4.4
3.2
ns
ns
ns
Rise and fall time for output slew rate 3
(Default Configuration)
tr3/tf3
tjit(cc)
VCCOUT = 2.5 V (20%–80%)
0.4
0.8
1.1
ns
ps
1 PLL, 1 Output
3 PLLs, 3 Outputs
1 PLL, 1 Output
3 PLLs, 3 Outputs
fOUT = 24.576 MHz
85
95
120
155
135
175
(9)(10)
Cycle-to-cycle jitter
fOUT = 24.576 MHz
fOUT = 24.576 MHz
fOUT = 24.576 MHz
110
110
(9)(10)
tjit(per)
Peak-to-peak period jitter
ps
ps
2-ns rise/fall time at f(VCO) = 150 MHz,
Pdiv = 3
tsk(o)
odc
Output skew (see (11) and Table 5)
Output duty cycle(12)
250
f(VCO) = 100 MHz, Pdiv = 1
45%
2.1
55%
SMBus PARAMETER
VIK
II
SCLK and SDATA input clamp voltage
VCC = 3 V, II = –18 mA
–1.2
±5
V
µA
V
SCLK and SDATA input current
SCLK input high voltage
VI = 0 V or VCC, VCC = 3.6 V
VIH
VIL
VOL
SCLK input low voltage
0.8
0.4
10
V
SDATA low-level output voltage
IOL = 4 mA, VCC = 3 V
VI = 0 V or VCC
V
CI(SCLK) Input capacitance at SCLK
3
3
pF
CI(SDAT Input capacitance at SDATA
VI = 0 V or VCC
10
pF
A)
(8) odc depends on output rise and fall time (tr/tf); above limits are for normal tr/tf.
(9) 50000 cycles.
(10) Jitter depends on configuration. Jitter data is for normal tr/tf, input frequency = 27 MHz, f(VCO) = 147 MHz output.
(11) The tsk(o) specification is only valid for equal loading of all outputs.
(12) odc depends on output rise and fall time (tr/tf); above limits are for normal tr/tf.
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PARAMETER MEASUREMENT INFORMATION
CDC906
1 k
Yn
LVCMOS
10 pF
1 k
Figure 1. Test Load
TYPICAL CHARACTERISTICS
120
110
V
= 3.3 V,
CC
M div = 1,
100
90
N div = 2,
P div = 1,
VCO normal-speed mode
80
70
PLL 1 + PLL 2 + PLL3
PLL 1 + PLL 2 SSC + PLL3
60
50
40
PLL 1 + PLL 2
PLL 1
30
20
10
0
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210
- [MHz]
f
VCO
Figure 2. ICC vs Number of PLLs and VCO Frequency (VCO at Normal-Speed Mode, Byte 6 Bit [7:5])
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TYPICAL CHARACTERISTICS (continued)
120
V
= 3.3 V,
CC
110
100
90
M div = 1,
N div = 2,
P div = 1,
VCO high-speed mode
PLL 1 + PLL 2 + PLL3
80
70
PLL 1 + PLL 2 SSC + PLL3
60
50
40
PLL 1 + PLL 2
PLL 1
30
20
10
0
130 140 150 160 170 180 190 200 210 220 230 240 250 260 270 280 290 300 310
f
- [MHz]
VCO
Figure 3. ICC vs Number of PLLs and VCO Frequency (VCO at High-Speed Mode, Byte 6 Bit [7:5])
55
50
V
= 3.3 V,
CC
6 Outputs
5 Outputs
M div = 1,
N div = 2,
P div = 1
45
40
35
30
25
20
15
10
5
4 Outputs
3 Outputs
2 Outputs
1 Outputs
0
0
10
20
30
40
50
60
70
80
90
100 110 120 130 140 150 160 170 180
f
- [MHz]
VCO
Figure 4. ICCOUT vs Number of Outputs and VCO Frequency
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TYPICAL CHARACTERISTICS (continued)
3.6
3.4
3.2
V
at V
= 3.6 V
CCOUT
V
= 3.3 V,
OH
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
CC
M div = 4,
N div = 15,
P div = 1
V
at V
= 2.3 V
CCOUT
OH
V
at V
= 3.6 V
V
at V
= 2.3 V
OL
CCOUT
130
OL
CCOUT
180
90
100
110
120
140
150
160
170
190
200
210
220
f
- [MHz]
OUT
Figure 5. Output Swing vs Output Frequency
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APPLICATION INFORMATION
SMBus Data Interface
To enhance the flexibility and function of the clock synthesizer, a two-signal serial interface is provided. It follows
the SMBus specification Version 2.0, which is based upon the principals of operation of I2C. More details of the
SMBus specification can be found at http://http://www.smbus.org.
Through the SMBus, various device functions, such as individual clock output buffers, can be individually
enabled or disabled. The registers associated with the SMBus data interface initialize to their default setting
upon power-up; therefore, using this interface is optional. The clock device register changes are normally made
upon system initialization, if any are required.
Data Protocol
The clock driver serial protocol accepts Byte Write, Byte Read, Block Write, and Block Read operations from the
controller.
For Block Write/Read operations, the bytes must be accessed in sequential order from lowest to highest byte
(most significant bit first) with the ability to stop after any complete byte has been transferred. For Byte Write and
Byte Read operations, the system controller can access individually addressed bytes.
Once a byte has been sent, it is written into the internal register and effective immediately. With the rising edge
of the ACK bit, this applies to each transferred byte, independent of whether this is a Byte Write or a Block Write
sequence.
The offset of the indexed byte is encoded in the command code, as described in Table 1.
The Block Write and Block Read protocol is outlined in Figure 9 and Figure 10, while Figure 7 and Figure 8
outlines the corresponding Byte Write and Byte Read protocol.
Slave Receiver Address (7 bits)
A6
1
A5
1
A4
0
A3
1
A2
0
A1
0
A0
1
R/W
0
Table 1. Command Code Definition
Bit
Description
0 = Block Read or Block Write operation
1 = Byte Read or Byte Write operation
7
Byte Offset for Byte Read and Byte Write operation.
For Block Read and Block Write operation, these bits have to be 000 0000.
(6:0)
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1
7
1
1
8
1
1
S
Slave Address
Wr A
Data Byte
A
P
S
Start Condition
Reapeated Start Condition
Read (Bit Value = 1)
Sr
Rd
Write (Bit Value = 0)
Wr
A
Acknowledge (ACK = 0 and NACK = 1)
Stop Condition
P
PE Packet Error
Master to Slave Transmission
Slave to Master Transmission
Figure 6. Generic Programming Sequence
Byte Write Programming Sequence
1
7
1
1
8
1
8
1
1
S
Slave Address
Wr
A
CommandCode
A
Data Byte
A
P
Figure 7. Byte Write Protocol
Byte Read Programming Sequence
1
7
1
1
8
1
1
7
1
1
S
Slave Address
8
Wr
A
CommandCode
A
S
Slave Address
Rd
A
1
1
Data Byte
A
P
Figure 8. Byte Read Protocol
Block Write Programming Sequence(1)
1
7
1
1
8
1
8
1
S
Slave Address
8
Wr
1
A
CommandCode
1
A
Byte Count N
8
A
8
1
1
Data Byte 0
A
Data Byte 1
A
- - - - -
Data Byte N–1
A
P
(1)Data Byte 0 is reserved for revision code and vendor identification. However, this byte is used for internal test. Do not write into it other
than 0000 0000.
Figure 9. Block Write Protocol
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Block Read Programming Sequence
1
7
1
1
8
1
1
7
1
1
S
Slave Address
8
Wr
A
1
CommandCode
8
A
Sr
Slave Address
Rd
A
1
1
8
1
Byte Count N
A
Data Byte 0
A
- - - - -
Data Byte N–1
A
P
Figure 10. Block Read Protocol
Bit 7 (MSB)
Bit 6
Bit 0 (LSB)
P
S
A
P
t
t
W(SCLH)
W(SCLL)
t
f(SM)
t
r(SM)
V
IH(SM)
IL(SM)
SCLK
V
t
h(START)
t
su(SDATA)
t
t
su(START)
t
h(SDATA)
su(STOP)
t
t
f(SM)
(BUS)
t
r(SM)
V
V
IH(SM)
IL(SM)
SDATA
Figure 11. Timing Diagram Serial Control Interface
SMBus Hardware Interface
The following diagram shows how the CDC906 clock synthesizer is connected to the SMBus. Note that the
current through the pullup resistors (Rp) must meet the SMBus specifications (min 100 µA, max 350 µA). If the
CDC906 is not connected to the SMBus, then SDATA and SCLK inputs have to be connected with 10-kΩ pullup
resistors to VCC to avoid floating input conditions.
R
P
R
P
SMB Host
SDATA
CDC906
9
SCLK
10
C
BUS
C
BUS
Figure 12. SMBus Hardware Interface
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Table 2. Register Configuration Command Bitmap
Adr
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Byte 0
Byte 1
Byte 2
Revision Code
Vendor Identification
PLL1 Reference Divider M 9-Bit [7:0]
PLL1 Feedback Divider N 12-Bit [7:0]
PLL1 Ref
Dev M [8]
Byte 3
PLL1 Mux
PLL2 Mux
PLL3 Mux
PLL1 Feedback Divider N 12-Bit [11:8]
Byte 4
Byte 5
PLL2 Reference Divider M 9-Bit [7:0]
PLL2 Feedback Divider N 12-Bit [7:0]
PLL1 fvco
Selection
PLL2 fvco
Selection
PLL3 fvco
Selection
PLL2 Ref
Dev M [8]
Byte 6
PLL2 Feedback Divider N 12-Bit [11:8]
Byte 7
Byte 8
PLL3 Reference Divider 9-Bit M [7:0]
PLL3 Feedback Divider N [12-Bit 7:0]
PLL3 Ref
Dev M [8]
Byte 9
PLL Selection for P0 (Switch A)
PLL3 Feedback Divider N 12-Bit [11:8]
Inp. Clock
Selection
Byte 10
PLL Selection for P1 (Switch A)
Input Signal Source
Configuration Inputs S1
Configuration Inputs S0
Byte 11
Byte 12
Byte 13
Byte 14
Byte 15
Byte 16
Byte 17
Byte 18
PLL Selection for P3 (Switch A)
PLL Selection for P5 (Switch A)
PLL Selection for P2 (Switch A)
PLL Selection for P4 (Switch A)
Reserved
Power Down
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
7-Bit Divider P0 [6:0]
7-Bit Divider P1 [6:0]
7-Bit Divider P2 [6:0]
7-Bit Divider P3 [6:0]
7-Bit Divider P4 [6:0]
7-Bit Divider P5 [6:0]
Y0 Inv. or
Non-Inv
Y0 Enable or
Low
Byte 19
Byte 20
Byte 21
Byte 22
Byte 23
Byte 24
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Y0 Slew-Rate Control
Y1 Slew-Rate Control
Y2 Slew-Rate Control
Y3 Slew-Rate Control
Y4 Slew-Rate Control
Y5 Slew-Rate Control
Y0 Divider Selection (Switch B)
Y1 Divider Selection (Switch B)
Y2 Divider Selection (Switch B)
Y3 Divider Selection (Switch B)
Y4 Divider Selection (Switch B)
Y5 Divider Selection (Switch B)
Y1 Inv. or
Non-Inv
Y1 Enable or
Low
Y2 Inv. or
Non-Inv
Y2 Enable or
Low
Y3 Inv. or
Non-Inv
Y3 Enable or
Low
Y4 Inv. or
Non-Inv
Y4 Enable or
Low
Y5 Inv or
Non-Inv
Y5 Enable or
Low
Spread Spectrum (SSC) Modulation
Selection
Byte 25
Byte 26
Reserved
Reserved
Frequency Selection for SSC
7-Bit Byte Count
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Default Device Setting
The CDC906 is pre-programmed with a factory default configuration as shown below. This puts the device in an
operating mode without the need to program it first. The default setting appears after power is switched on or
after a power-down/up sequence until it is re-programmed by the user to a different application configuration. A
new register setting is programmed via the serial SMBUS Interface.
A different default setting can be programmed upon customer request. Contact a Texas Instruments sales or
marketing representative for more information.
f
VCO1
= 216 MHz
Output Switch Matrix
PLL1
Divider M
1
Y0
Y1
PFD
Filter
VCO
LV
CMOS
P0-Div
10
27 MHz
27 MHz
MUX
Divider N
8
LV
CMOS
P1-Div
20
f
VCO2
= 250 MHz
CLK_IN0
CLK_IN1
XO
or
2LVCMOS
or
Differential
Input
PLL2
Y2
Y3
w/ SSC
LV
CMOS
Divider M
27
P2-Div
8
27 MHz
Crystal
27 MHz
27 MHz
PFD
Filter
VCO
MUX
Divider N
250
LV
CMOS
P3-Div
9
SSC-OFF
SO/CLK_SEL
f
= 225.792 MHz
VCO3
PROGRAMMING
LOGIC
Y4
Y5
LV
CMOS
P4-Div
32
S1
SDATA
PLL3
27 MHz
27 MHz
SMBUS
LOGIC
Divider M
375
PFD
Filter
VCO
SCLOCK
P5-Div
4
LV
CMOS
MUX
Divider N
3136
NOTE: All outputs are enabled and in non-inverting mode. S0, S1, and SSC comply according the default setting described
in Byte 10 and Byte 25 respectively.
Figure 13. Default Device Setting
The output frequency can be calculated:
fin x N
M x P
27 MHz x 8
(1 x 8)
, i.e. fout =
fout =
= 27 MHz
(1)
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Functional Description of the Logic
All Bytes are read-/write-able, unless otherwise expressly mentioned.
Byte 0 (read only): Vendor Identification Bits [3:0]; Revision Code Bit [7:4]
Revision Code(1)
Vendor Identification
X
X
X
X
0
0
0
1
(1) Byte 0 is readable by "Byte Read sequency" only.
Byte 1 to 9: Reference Divider M of PLL1, PLL2, PLL3(1)
M8
0
M7
0
M6
0
M5
0
M4
0
M3
0
M2
0
M1
0
M0
0
Div by
Default(2)(3)
Not allowed
0
0
0
0
0
0
0
0
1
1
2
3
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
1
1
•
•
•
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
0
1
509
510
511
(1) By selecting the PLL divider factors, M ≤ N and 80 MHz ≤ fvco ≤ 300 MHz.
(2) Unless customer specific setting.
(3) Default setting of divider M for PLL1 = 1, for PLL2 = 27 and for PLL3 = 375.
Byte 1 to 9: Feedback Divider N of PLL1, PLL2, PLL3(1)
N11
N10
N9
N8
N7
N6
N5
N4
N3
N2
N1
N0
Div by
Default(2)(3)
Not
allowed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
1
1
2
3
•
•
•
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
0
1
4093
4094
4095
(1) By selecting the PLL divider factors, M ≤ N and 80 MHz ≤ fvco ≤ 300 MHz.
(2) Unless customer specific setting.
(3) Default setting of divider N for PLL1 = 8, for PLL2 = 250 and for PLL3 = 3136.
Byte 3 Bit [7:5]: PLL (VCO) Bypass Multiplexer
PLLxMUX
PLL (VCO) MUX Output
PLLx
Default(1)
0
1
Yes
VCO bypass
(1) Unless customer specific setting.
Byte 6 Bit [7:5]: VCO Frequency Selection Mode for each PLL(1)
PLLxFVCO
VCO Frequency Range
Default(2)
0
1
80-200 MHz
180-300 MHz
Yes
(1) This bit selects the normal-speed mode or the high-speed mode for the dedicated VCO in PLL1, PLL2 or PLL3. At power-up, the
high-speed mode is selected, fVCO is 180-300 MHz. In case of higher fVCO, this bit has to be set to [1].
(2) Unless customer specific setting.
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Byte 9 to 12: Outputs Switch Matrix (5x6 Switch A) PLL Selection for P-Divider P0-P5
SWAPx2
SWAPx1
SWAPx0
Any Output Px
PLL bypass (input clock)
PLL1
Default(1)
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
P2, P3, P4, P5
P0
PLL2 non-SSC
PLL2 w/ SSC(2)
PLL3
P1
Reserved
Reserved
Reserved
(1) Unless customer specific setting.
(2) PLL2 has a SSC output and non-SSC output. If SSC bypass is selected (see Byte 25, Bit [6:4]), the SSC circuitry of PLL2 is
powered-down and the SSC output is reset to logic low. The non-SSC output of PLL2 is not affected by this mode and can still be used.
Byte 10, Bit [1:0]: Configuration Settings of Input S0/CLK_SEL
S01
S00
Function
Default(1)
If S0 is low, the PLLs and the clock-input stage are going into power-down mode, outputs are in
3-state, all actual register settings will be maintained, SMBus stays active
Yes
0
0
(2)
If S0 is low, the PLL and all dividers (M-Div and P-Div) are bypassed and PLL is in power-down,
all outputs are active (inv. or non-inv.), actual register settings will be maintained, SMBus stays
active; this mode is useful for production test;
0
1
CLK_SEL (input clock selection — overwrites the CLK_SEL setting in Byte 10, Bit [4])(3)
— CLK_SEL is set low selects CLK_IN_IN0
— CLK_SEL is set high selects CLK_IN_IN1
1
1
0
1
Reserved
(1) Unless customer specific setting.
(2) Power-down mode overwrites 3-state or low-state of S1 setting in Byte 10, Bit [3:2].
(3) If the clock input (CLK_IN0/CLK_IN1) is selected as crystal input or differential clock input (Byte 11, Bit [7:6]) then this setting is not
relevant.
Byte 10, Bit [3:2]: Configuration Settings of Input S1
S11
0
S10
0
Function
Default(1)
If S1 is set low, all outputs are switched to a low-state (non-inv.) or high-state (inv.);
Yes
0
1
If S1 is set low, all outputs are switched to a 3-state
1
0
Reserved
Reserved
1
1
(1) Unless customer specific setting.
Byte 10, Bit [4]: Input Clock Selection(1)
CLKSEL
Input Clock
CLK_IN0
Default(2)
0
1
Yes
CLK_IN1
(1) This bit is not relevant, if crystal input or differential clock input is selected, Byte 11, Bit [7:6].
(2) Unless customer specific setting.
Byte 11, Bit [7:6]: Input Signal Source(1)
IS1
IS0
Function
Default(2)
Yes
0
0
CLK_IN0 is Crystal Oscillator Input and CLK_IN1 is serving as Crystal Oscillator Output.
CLK_IN0 and CLK_IN1 are two LVCMOS Inputs. CLK_IN0 or CLK_IN1 are selectable via CLK_SEL control
pin.
0
1
1
1
0
1
CLK_IN0 and CLK_IN1 serve as differential signal inputs.
Reserved
(1) In case the crystal input or differential clock input is selected, the input clock selection, Byte 10, Bit [4], is not relevant.
(2) Unless customer specific setting.
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Byte 12, Bit [6]: Power-Down Mode (except SMBus)
PD
0
Power-Down Mode
Normal Device Operation
Power Down(2)
Default(1)
Yes
1
(1) Unless customer specific setting.
(2) In power down, all PLLs and the Clock-Input-Stage are going into power-down mode, all outputs are in 3-State, all actual register
settings will be maintained and SMBus stays active. Power-Down Mode overwrites 3-State or Low-State of S0 and S1 setting in Byte 10.
Byte 13 to 18, Bit [6:0]: Outputs Switch Matrix - 6x7-Bit Divider P0-P5
DIVYx6
DIVYx5
DIVYx4
DIVYx3
DIVYx2
DIVYx1
DIVYx0
Div by
Default(1)(2)
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
Not allowed
1
2
•
•
•
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
0
1
125
126
127
(1) Unless customer specific setting.
(2) Default setting of divider P0 = 10, P1 = 20, P2 = 8, P3 = 9, P4 = 32, and P5 = 4
Byte 19 to 24, Bit [5:4]: LVCMOS Output Rise/Fall Time Setting at Y0-Y5
SRCYx1
SRCYx0
Yx
Default(1)
0
0
1
1
0
1
0
1
Nominal +3 ns (tr0/tf0)
Nominal +2 ns (tr1/tf1)
Nominal +1 ns (tr2/tf2)
Nominal (tr3/tf3)
Yes
(1) Unless customer specific setting.
Byte 19 to 24, Bit [2:0]: Outputs Switch Matrix (6 x 6 Switch B) Divider (P0-P5) Selection for Outputs Y0-Y5
SWBYx2
SWBYx1
SWBYx0
Any Output Yx
Divider P0
Divider P1
Divider P2
Divider P3
Divider P4
Divider P5
Reserved
Default(1)
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Y0, Y1, Y2, Y3, Y4, Y5
Reserved
(1) Unless customer specific setting.
Byte 19 to 24, Bit [3]: Output Y0-Y5 Enable or Low-State
ENDISYx
Output Yx
Default(1)
0
1
Disable to low
Enable
Yes
(1) Unless customer specific setting.
Byte 19 to 24, Bit [6]: Output Y0-Y5 Non-Inverting/Inverting
INVYx
Output Yx Status
Non-inverting
Inverting
Default(1)
0
1
Yes
(1) Unless customer specific setting.
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Byte 25, Bit [3:0]: SSC Modulation Frequency Selection in the Range of 30 kHz 60 kHz(1)
Modulation
fvco [MHz]
140
FSSC3 FSSC2 FSSC1
FSSC0
Default(2)
Factor
100
17.6
18.5
19.4
20.5
21.7
23.0
24.6
26.3
28.3
30.4
33.3
36.6
40.6
45.5
51.9
60.2
110
19.4
20.3
21.4
22.6
23.9
25.3
27.0
28.9
31.1
33.5
36.7
40.3
44.6
50.1
57.1
66.3
120
21.1
22.2
23.3
24.6
26.0
27.6
29.5
31.5
33.9
36.5
40.0
43.9
48.7
54.6
62.2
72.3
130
22.9
24.0
25.3
26.7
28.2
30.0
31.9
34.2
36.8
39.6
43.3
47.6
52.8
59.2
67.4
78.3
150
26.4
27.7
29.2
30.8
32.6
34.6
36.8
39.4
42.4
45.6
50.0
54.9
60.9
68.3
77.8
90.4
160
28.2
29.6
31.1
32.8
34.7
36.9
39.3
42.1
45.2
48.7
53.3
58.6
64.9
72.9
83.0
167
29.4
30.9
32.5
34.2
36.2
38.5
41.0
43.9
47.2
50.8
55.7
61.1
67.8
76.0
86.6
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
5680
5412
5144
4876
4608
4340
4072
3804
3536
3286
3000
2732
2464
2196
1928
1660
24.6
25.9
27.2
28.7
30.4
32.3
34.4
36.8
39.6
42.6
46.7
51.2
56.8
63.8
72.6
84.3
fmod
[kHz]
Yes
96.4 100.6
(1) The PLL has to be bypassed (turned off) when changing SSC Modulation Frequency Factor on-the-fly. This can be done by following
programming sequence: bypass PLL2 (Byte 3, Bit 6 = 1); write new Modulation Factor (Byte 25); re-activate PLL2 (Byte 3, Bit 6 = 0).
(2) Unless customer specific setting.
(1)
Byte 25, Bit [6:4]: SSC Modulation Amount
SSC2
SSC1
SSC0
Function
Default(2)
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
SSC Modulation Amount 0% = SSC bypass for PLL(3)
SSC Modulation Amount ±0.1% (center spread)
SSC Modulation Amount ±0.25% (center spread)
SSC Modulation Amount ±0.4% (center spread)
SSC Modulation Amount 1% (down spread)
SSC Modulation Amount 1.5% (down spread)
SSC Modulation Amount 2% (down spread)
SSC Modulation Amount 3% (down spread)
Yes
(1) The PLL has to be bypassed (turned off) when changing SSC Modulation Amount on-the-fly. This can be done by following
programming sequence: bypass PLL2 (Byte 3, Bit 6 = 1); write new Modulation Amount (Byte 25); re-activate PLL2 (Byte 3, Bit 6 = 0).
(2) Unless customer specific setting.
(3) If SSC bypass is selected, SSC circuitry of PLL2 is powered-down and the SSC output is reset to logic low. The non-SSC output of
PLL2 is not affected by this mode and can still be used.
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Byte 26, Bit [6:0]: Byte Count(1)
BC6
BC5
BC4
BC3
BC2
BC1
BC0
No. of Bytes
Default(2)
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
Not allowed
1
2
3
•
•
•
0
0
1
1
0
1
1
27
Yes
•
•
•
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
0
1
125
126
127
(1) Defines the number of Bytes, which will be sent from this device at the next Block Read protocol.
(2) Unless customer specific setting.
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FUNCTIONAL DESCRIPTION
Zero ppm Audio and Video System Clock Generation and Divider Setting
The CDC906 is ideally suited for audio and video applications. It consists of a triple PLL clock generator which
generates up to six audio, video and system clocks from i.e. a 27-MHz master clock. The output frequencies are
programmable to meet different application requirements. The master clock can be either a crystal oscillator or
an external input clock signal. The CDC906 provides a very low jitter, high accuracy clock with zero ppm for the
common audio and video clocks. The following table shows the system clocks versus the standard sampling
frequency and the corresponding divider settings.
Divider
N
Divider
N
Audio Rate
[kHz]
fs x 256
[MHz]
fs x 384
[MHz]
Error ppm
Error ppm
M
P
M
P
27
15
18
12
10
9
16
22.05
24
4.096
5.6448
6.144
375
75
2048
392
36
25
27
18
10
12
6
0
0
0
0
0
0
0
6.144
8.4672
9.216
125
125
125
375
125
125
375
768
0
0
0
0
0
0
0
588
125
375
375
375
375
768
768
32
8.192
2048
1568
2048
2048
12.288
16.9344
18.432
36.864
2048
784
44.1
48
11.2896
12.288
24.576
768
96
2048
4
Divider
N
Divider
N
Audio Rate
[kHz]
fs x 512
[MHz]
fs x 768
[MHz]
Error ppm
Error ppm
M
P
18
10
12
9
M
P
12
10
9
16
22.05
24
8.192
11.2896
12.288
16.384
22.5792
24.576
49.152
375
375
375
375
375
375
375
2048
1568
2048
2048
1568
2048
2048
0
0
0
0
0
0
0
12.288
16.9344
18.432
24.576
33.8688
36.864
73.728
375
125
125
375
125
375
375
2048
784
0
0
0
0
0
0
0
768
32
2048
784
6
44.1
48
5
5
6
2048
2048
4
96
3
2
NOTE: Input frequency is 27 MHz.
Video
Rate
[MHz]
Divider
Divider
Divider
2
Error
ppm
1
Error
ppm
0.5
[MHz]
Error
ppm
[MHz]
[MHz]
M
N
P
M
N
P
M
N
P
27
54
1
8
4
0
27
-
-
1
0
13.5
-
-
2
0
Typical applications for the CDC906 are digital HDTV systems, gaming consoles, DVD players, DVD add-on
cards for multimedia PCs, and step-top boxes.
i.e. audio rate: 44.1 kHz
64 MHz
CDC906
CPU Clock
16.9344 MHz (384fs)
33.8688 MHz (768fs)
27 MHz
Crystal
11.2896 MHz (256fs)
27 MHz
Karaoke
DSP
Front
MPEG/AC−3
Audio Dec
Surround
Center
Subwoofer
DVD−DSP
PCM1716
Figure 14. CDC906 System Application Block Diagram
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Clock Inputs (CLK_IN0 and CLK_IN1)
The CDC906 features two clock inputs which can be used as:
•
•
•
Crystal oscillator input (default setting)
Two independent single-ended LVCMOS inputs
Differential signal input
The dedicated clock input can be selected by the input signal source Bit [7:6] of Byte 11.
Crystal Oscillator Inputs
The input frequency range in crystal mode is 8 MHz to 54 MHz. The CDC906 uses a Pierce-type oscillator
circuitry with included feedback resistance for the inverting amplifier. The user, however, has to add external
capacitors CX0, CX1) to match the input load capacitor from the crystal (see Figure 15). The required values can
be calculated:
CX0 = CX1 = 2 × CL– CICB
,
where CL is the crystal load capacitor as specified for the crystal unit and CICB is the input capacitance of the
device including the board capacitance (stray capacitance of PCB).
For example, for a fundamental 27-MHz crystal with CL of 9 pF and CICB of 4 pF,
CX0 = CX1 = (2 × 9 pF) – 3 pF = 15 pF.
It is important to use a short PCB trace from the device to the crystal unit to keep the stray capacitance of the
oscillator loop to a minimum.
Input source select
(from SMBUS Register)
CLK_IN0
CICB
XO
or
CX0
crystal
unit
2LVCMOS
or
Differential
Input
CLK_IN1
CICB
CX1
Figure 15. Crystal Input Circuitry
In order to ensure a stable oscillating, a certain drive power must be applied. The CDC906 features an input
oscillator with adaptive gain control which relieves the user to manually program the gain. The drive level is the
amount of power dissipated by the oscillating crystal unit and is usually specified in terms of power dissipated by
the resonator (equivalent series resistance (ESR)). Figure 16 gives the resulting drive level vs crystal frequency
and ESR.
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100
90
80
70
60
50
40
30
20
10
0
C = 18 pF
= 300 mV
ERS = 60 W
ERS = 50 W
ERS = 40 W
ERS = 30 W
ERS = 25 W
ERS = 15 W
U
pk
~21 mW
5
10
15
20
25
30
35
40
45
50
55
Frequency − MHz
Figure 16. Crystal Drive Power
For example, if a 27-MHz crystal with ESR of 50 Ω is used and 2 × CL is 18 pF, the drive power is 21 µW. Drive
level should be held to a minimum to avoid over driving the crystal. The maximum power dissipation is specified
for each type of crystal in the oscillator specifications, i.e., 100 µW for the example above.
Single-Ended LVCMOS Clock Inputs
When selecting the LVCMOS clock mode, CLK_IN0 and CLK_IN1 act as regular clock inputs pins and can be
driven up to 167 MHz. Both clock inputs circuitry are equal in design and can be used independently to each
other (see Figure 17). The internal clock select bit, Byte 10, Bit [4], selects one of the two input clocks. CLK_IN0
is the default selection. There is also the option to program the external control pin S0/CLK_SEL as clock select
pin, Byte 10, Bit [1:0].
The two clock inputs can be used for redundancy switching, i.e. to switch between a primary clock and
secondary clock. Note a phase difference between the clock inputs may require PLL correction. Also in case of
different frequencies between the primary and secondary clock, the PLL has to re-lock to the new frequency.
Input Source Select
(From SMBUS Register)
CLK_IN0
XO
or
2LVCMOS
or
Differential
CLK_IN1
input
(A)
CLK_SEL
A. CLK_SEL is optional and can be configured by SMBus setting.
Figure 17. LVCMOS Clock Input Circuitry
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Differential Clock Inputs
The CDC906 supports differential signaling as well. In this mode, CLK_IN0 and CLK_IN1 pin serve as
differential signal inputs and can be driven up to 167 MHz.
The minimum magnitude of the differential input voltage is 100 mV over a differential common-mode input
voltage range of 200 mV to VCC– 0.6. If LVDS or LVPECL signal levels are applied, ac-coupling and a biasing
structure is recommended to adjust the different physical layers (see Figure 18). The capacitor removes the dc
component of the signal (common-mode voltage), while the ac component (voltage swing) is passed on. A
resistor pull-up and/or pull-down network represents the biasing structure used to set the common-mode voltage
on the receiver side of the ac-coupling capacitor. DC coupling is also possible.
Input source select
(from SMBUS)
CLK_IN0
XO
or
2LVCMOS
or
Differential
CLK_IN1
input
Figure 18. Differential Clock Input Circuitry
PLL Configuration and Setting
The CDC906 includes three PLLs which are equal in function and performance. Except PLL2 which in addition
supports spread spectrum clocking (SSC) generation. Figure 19 shows the block diagram of the PLL.
VCO Bypass
PLLx
9−Bit Divider M
1 .. 511
Input Clock
PFD
MUX
PLL output
Filter
VCO
12−Bit Divider N
1 .. 4095
SSC output
(PLL2 Only)
SSC
(PLL2 only)
Programming
Figure 19. PLL Architecture
All three PLLs are designed for easiest configuration. The user just has to define the input and output
frequencies or the divider (M, N, P) setting respectively. All other parameters, such as charge-pump current,
filter components, phase margin, or loop bandwidth are controlled and set by the device itself. This assures
optimized jitter attenuation and loop stability.
The PLL support normal-speed mode (80 MHz ≤ fVCO ≤ 200 MHz) and high-speed mode (180 MHz ≤ fVCO ≤ 300
MHz) which can be selected by PLLxFVCO (Bit [7:5] of Byte 6). The respective speed option assures stable
operation and lowest jitter.
The divider M and divider N operates internally as fractional divider for fVCO up to 250 MHz. This allows fractional
divider ratio for zero ppm output clock error.
In case of fVCO > 250 MHz, it is recommended that integer factors of N/M are used only.
For optimized jitter performance, keep divider M as small as possible. Also, the fractional divider concept
requires a PLL divider configuration, M ≤ N (or N/M ≥ 1).
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Additionally, each PLL supports two bypass options:
•
•
PLL Bypass and
VCO Bypass
In PLL bypass mode, the PLL completely is bypassed, so that the input clock is switched directly to the
Output-Switch-A (SWAPxx of Byte 9 to12). In the VCO bypass mode, only the VCO of the respective PLL is
bypassed by setting PLLxMUX to 1 (Bit [7:5] of Byte 3). But the divider M still is useable and expands the output
divider by additional 9-bits. This gives a total divider range of M x P = 511 × 127 = 64897. In VCO bypass mode
the respective PLL block is powered down and minimizes current consumption.
Table 3. Example for Divide, Multiplication, and Bypass Operation
Function
Equation(1)
fIN
[MHz]
fOUT-desired
[MHz]
fOUT-actual
[MHz]
Divider
fVCO [MHz]
M
16
1
N
P
1
N/M
5.0625
6
Fractional(2)
Integer Factor(3)
fOUT = fIN x (N/M)/P
fOUT = fIN x (N/M)/P
fOUT = fIN/(M x P)
30.72
27
155.52
162
155.52
162
81
6
155.52
162
1
VCO bypass
30.72
0.06
0.06
8
—
64
—
—
(1) P-divider of Output-Switch-Matrix is included in the calculation.
(2) Fractional operation for fVCO ≤ 250 MHz.
(3) Integer operation for fVCO > 250 MHz.
Spread Spectrum Clocking and EMI Reduction
In addition to the basic PLL function, PLL2 supports spread spectrum clocking (SSC) as well. Thus, PLL 2
features two outputs, a SSC output and a non-SSC output. Both outputs can be used in parallel. The mean
phase of the Center Spread SSC modulated signal is equal to the phase of the non-modulated input frequency.
SSC is selected by Output-Switch-A (SWAPxx of Byte 9 to 12).
SSC also is bypass-able (Byte 25, Bit [6:4]), which powers-down the SSC output and set it to logic low state.
The non-SSC output of PLL2 is not affected by this mode and can still be used.
SSC is an effective method to reduce electro-magnetic interference (EMI) noise in high-speed applications. It
reduces the RF energy peak of the clock signal by modulating the frequency and spread the energy of the signal
to a broader frequency range. Because the energy of the clock signal remains constant, a varying frequency that
broadens the overtones necessarily lowers their amplitudes. Figure 20 shows the effect of SSC on a 54-MHz
clock signal for DSP
+
Center Spread 0.4%
9th Harmonic, fm = 60 kHz
Down Spread 3%
9th Harmonic, fm = 60 kHz
7dB
11.3dB
Figure 20. Spread Spectrum Clocking With Center Spread and Down Spread
The peak amplitude of the modulated clock is 11.3 dB lower than the non-modulated carrier frequency for down
spread and radiated less electro-magnetic energy.
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In SSC mode, the user can select the SSC modulation amount and SSC modulation frequency. The modulation
amount is the frequency deviation based to the carrier (min/max frequency), whereas the modulation frequency
determines the speed of the frequency variation. In SSC mode, the maximum VCO frequency is limited to 167
MHz.
SSC Modulation Amount
The CDC906 supports center spread modulation and down spread modulation. In center spread, the clock is
symmetrically shifted around the carrier frequency and can be ±0.1%, ±0.25%, and ±0.4%. At down spread, the
clock frequency is always lower than the carrier frequency and can be 1%, 1.5%, 2%, and 3%. The down spread
is preferred if a system can not tolerate an operating frequency higher than the nominal frequency (over-clocking
problem).
Example:
Modulation Type
Minimum
Frequency
Center
Frequency
Maximum
Frequency
A
B
C
±0.25% center spread
53.865 MHz
53.46 MHz
53.73 MHz
54 MHz
—
54.135 MHz
54 MHz
1% down spread
0.5% down spread(1)
53.865 MHz
54 MHz
(1) A down spread of 0.5% of a 54-MHz carrier is equivalent to 59.865 MHz at a center spread of ±0.25%.
SSC Modulation Frequency
The modulation frequency (sweep rate) can be selected between 30 kHz and 60 kHz. It is also based on the
VCO frequency as shown in the SSC Modulation Frequency Selection. As shown in Figure 21, the damping
increases with higher modulation frequencies. It may be limited by the tracking skew of a downstream PLL. The
CDC906 uses a triangle modulation profile which is one of the common profiles for SSC.
12
3% Down Spread
11
2% Down Spread
10
9
8
+0.4 Center Spread
7
6
+0.25 Center Spread
5
4
3
30
40
50
60
fmodulation − kHz
Figure 21. EMI Reduction vs fModulation and fAmount
Further EMI Reduction
The optimum damping is a combination of modulation amount, modulation frequency and the harmonics which
are considered. Note that higher order harmonic frequencies results in stronger EMI reduction because of
respective higher frequency deviation.
As seen in Figure 22 and Figure 23, a slower output slew rate and/or smaller output signal amplitude helps to
reduce EMI emission even more. Both measures reduce the RF energy of clock harmonics. The CDC906 allows
slew rate control in four steps between 0.6 ns and 3.3 ns (Byte 19-24, Bit [5:4]). The output amplitude is set by
the two independent output supply voltage pins, VCCOUT1 and VCCOUT2, and can vary from 2.3 V to 3.6 V. Even a
lower output supply voltage down to 1.8 V works, but the maximum frequency has to be considered.
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Slew-Rate for VCCOUT = 2.5 V
Slew-Rate for VCCOUT = 3.3 V
−2.5dB
5.6dB
−3dB
6.4dB
nom−1
nom
nom−1
nom
nom+2
nom+2
Figure 22. EMI Reduction vs Slew-Rate and Vccout
5
4
3
2
1
0
−1
2.5 V
3 V
3.6 V
V
CCOUT
Figure 23. EMI Reduction vs Vccout
Multi-Function Control Inputs S0 and S1
The CDC906 features two user definable inputs pins which can be used as external control pins or address pins.
When programmed as control pins, they can function as clock select pin, enable/disable pin or device
power-down pin. If both pins used as address-bits, up to four devices can be connected to the same SMBus.
The respective function is set in Byte 10; Bit [3:0]. Table 4 shows the possible setting for the different output
conditions, clock select and device addresses.
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Table 4. Configuration Setting of Control Inputs
Configuration Bits
External Control Pins
Device Function
Byte 10,
Bit [3:2]
Byte 10,
Bit [1:0]
S11
S10
S01
S00
S1
(Pin 2)
S0
(Pin 1)
Yx Outputs
Power
Down
Pin 2
Pin 1
0
0
0
0
0
X
0
0
0
0
0
0
X
X
X
0
1
0
0
X
0
1
1
1
0
0
Active
Low/High(1)
3-State
No
No
Output ctrl
Output ctrl
Output ctrl
Output ctrl
Output ctrl
Output ctrl
Output ctrl
1
Outputs only
PLL, inputs and outputs
PLL only
Output ctrl
X
X
3-State
Output ctrl and pd
PLL and Div bypass
1
S10=0: low/high(1)
S10=1: 3-State
0
0
X
X
0
1
1
0
1
0
0
Active
PLL only
No
Output ctrl
Output ctrl
PLL and Div bypass
CLK_SEL
0/1(2)
S10=0: Low/High(1)
S10=1: 3-State
0
X
1
0
1
0/1(2)
Active
No
Output ctrl
CLK_SEL
(1) A non-inverting output will be set to low and an inverting output will be set to high.
(2) If S0 is 0, CLK_IN0 is selected; if S0 is 1, CLK_IN1 is selected.
As shown in Table 4, there is a specific order of the different output condition: Power-down mode overwrites
3-state, 3-state overwrites low-state, and low-state overwrites active-state.
Output Switching Matrix
The flexible architecture of the output switch matrix allows the user to switch any of the internal clock signal
sources via a free-selectable post-divider to any of the six outputs.
As shown in Figure 24, the CDC906 is based on two banks of switches and six post-dividers. Switch A
comprises six 5-Input-Muxes which selects one of the four PLL clock outputs or directly selects the input clock
and feed it to one of the 7-bit post-divider (P-Divider). Switch B is made up of six 6-Input-Muxes which takes any
post-divider and feeds it to one of the six outputs, Yx.
Switch B was added to the output switch matrix to ensure that outputs frequencies derive from one P-divider are
100% phase aligned. Also, the P-divider is built in a way that every divide factor is automatically duty-cycle
corrected. Changing the divider value on the fly may cause a glitch on the output.
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Internal Clock Sources
Output Switch Matrix
7-Bit Divider
Outputs
5x6 − Switch A
6x6 − Switch B
P0
Y0
Y1
Y2
Y3
Y4
Y5
(1..127)
Input CLK
(PLL Bypass)
P1
(1..127)
PLL 1
P2
(1..127)
PLL 2
non SSC
P3
(1..127)
P4
(1..127)
PLL 2
w/ SSC
P5
(1..127)
PLL 3
Programming
Output Selection:
Active/Low/3-State/
PLL/Input_Clk
Selection
P-Divider
Setting
P-Divider
Selection
Inverting/Non-Inverting
Slew Rate/V
CCOUT
Figure 24. CDC906 Output Switch Matrix
In addition, the outputs can be switched active, low or 3-state and/or 180 degree phase shifted. Also the outputs
slew-rate and the output-voltage is user selectable.
LVCMOS Output Configuration
The output stage of the CDC906 supports all common output setting, such as enable, disable, low-state and
signal inversion (180 degree phase shift). It further features slew-rate control (0.6 ns to 3.3 ns) and variable
output supply voltage (2.3 V to 3.6 V).
Clock
V
/V
CCOUT1 CCOUT2
div by 3
Inverting
P−div(0) output
P−div(1) output
P−div(2) output
P−div(3) output
P−div(4) output
P−div(5) output
M
U
X
Buffer
Sel
Yx
S1
Slew Rate
P−Divider Select
Inversion Select
Slew-Rate Control
Low Select
Low Select
Enable/Disable
(Optional all
outputs low
or 3−State)
Enable/Disable
Figure 25. Block Diagram of Output Architecture
Figure 26. Example for Output Waveforms
All output settings are programmable via SMBus:
•
•
•
•
•
enable, disable, low-state via external control pins S0 and S1 → Byte 10, Bit[3:0]
enable or disable-to-low → Byte 19 to 24, Bit[3]
inverting/non-inverting → Byte 19 to 24, Bit[6]
slew-rate control → Byte 19 to 24, Bit[5:4]
output swing → external pins VCCOUT1 (Pin 14) and VCCOUT2 (Pin 18)
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Performance Data: Output Skew, Jitter, Cross Coupling, Noise Rejection (Spur-Suppression),
and Phase Noise
Output Skew
Skew is an important parameter for clock distribution circuits. It is defined as the time difference between outputs
that are driven by the same input clock. Table 5 shows the output skew (tsk(o)) of the CDC906 for high-to-low and
low-to-high transitions over the entire range of supply voltages, operating temperature and output voltage swing.
Table 5. Output Skew
PARAMETER
Vccout
2.5 V
3.3 V
TYP
130
130
MAX
250
UNIT
ps
tsk(o)
200
ps
Jitter Performance
Jitter is a major parameter for PLL-based clock driver circuits. This becomes important as speed increases and
timing budget decreases. The PLL and internal circuits of CDC906 are designed for lowest jitter. The
peak-to-peak period jitter is only 60 ps (typical). Table 6 gives the peak-to-peak and rms deviation of
cycle-to-cycle jitter, period jitter and phase jitter as taken during characterization.
Table 6. Jitter Performance of CDC906
PARAMETER
fout
TYP(1)
MAX(1)
UNIT
Peak-Peak
rms
Peak-Peak
rms
(one sigma)
(one sigma)
tjit(cc)
50 MHz
133 MHz
50 MHz
133 MHz
50 MHz
133 MHz
55
50
–
–
75
85
–
–
ps
ps
ps
tjit(per)
60
4
76
7
55
5
84
11
115
175
tjit(phase)
730
930
90
130
840
1310
(1) All typical and maximum values are at VCC = 3.3 V, temperature = 25°C, Vccout = 3.3 V; one output is switching, data taken over several
10000 cycles.
Figure 27, Figure 28, and Figure 29 show the relationship between cycle-to-cycle jitter, period jitter, and phase
jitter over 10000 samples. The jitter varies with a smaller or wider sample window. The cycle-to-cycle jitter and
period jitter show the measured value whereas the phase jitter is the accumulated period jitter.
Cycle-to-Cycle jitter (tjit(cc)) is the variation in cycle time of a clock signal between adjacent cycles, over a random
sample of adjacent cycle pairs. Cycle-to-cycle jitter will never be greater than the period jitter. It is also known as
adjacent cycle jitter.
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40
30
20
10
0
−10
−20
−30
−40
1
1001
2001
3001
4001
5001
6001
7001
8001
9001
10001
Cycle
Figure 27. Snapshot of Cycle-to-Cycle Jitter
Period jitter (tjit(per)) is the deviation in cycle time of a clock signal with respect to the ideal period (1/fo) over a
random sample of cycles. In reference to a PLL, period jitter is the worst-case period deviation from the ideal
that would ever occur on the PLLs outputs. This is also referred to as short-term jitter.
25
20
15
10
5
0
−5
−10
−15
−20
−25
1
1001
2001
3001
4001
5001
6001
7001
8001
9001
10001
Cycle
Figure 28. Snapshot of Period Jitter
Phase jitter (tjit(phase)) is the long-term variation of the clock signal. It is the cumulative deviation in t(Θ) for a
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controlled edge with respect to a t(Θ) mean in a random sample of cycles. Phase jitter, Time Interval Error (TIE),
or Wander are used in literature to describe long-term variation in frequency. As of ITU-T: G.810, wander is
defined as phase variation at rates less than 10 Hz while jitter is defined as phase variation greater than 10 Hz.
The measurement interval must be long enough to gain a meaningful result. Wander can be caused by
temperature drift, aging, supply voltage drift, etc.
300
250
200
150
100
50
0
−50
−100
−150
−200
−250
−300
1
1001
2001
3001
4001
5001
6001
7001
8001
9001
10001
Cycle
Figure 29. Snapshot of Phase Jitter
Jitter also depends on the VCO frequency (fVCO) of the PLL. A higher fVCO results in better jitter performance
compared to a lower fVCO. The VCO frequency can be defined via the M- and N-divider of the PLL.
As the CDC906 supports a pretty wide frequency range, the device offers a VCO Frequency Selection Bit, Bit
[7:5] of Byte 6. This bit defines the jitter-optimized frequency range of each PLL. The user can select between
the normal-speed mode (80 MHz to 200 MHz) and the high-speed mode (180 MHz to 300 MHz). Figure 30
shows the jitter performance over fVCO for the two frequency ranges.
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300
280
260
240
220
200
180
160
140
120
100
80
T
= 25oC,
= 3.3 V,
A
V
CC
M div = 4,
N div = 15,
P div = 3
f
Frequency Range
VCO
for Normal-Speed Mode
f
Frequency Range
VCO
for High-Speed Mode
High-Speed Mode
180 MHz
60
40
Normal-Speed Mode
200 MHz
20
0
0
20
40
60
80 100 120 140 160 180 200 220 240 260 280 300 320 340 360
VCO − MHz Set Point
f
Figure 30. Period Jitter vs fVCO for Normal-Speed Mode and High-Speed Mode
The TI Pro Clock software automatically calculates the PLL parameter for jitter-optimized performance.
Cross Coupling, Spur Suppression, and Noise Rejection
Cross-Coupling in ICs occurs through interactions between several parts of the chip such as between output
stages, metal lines, bond wires, substrate, etc. The coupling can be capacitive, inductive and resistive (ohmic)
induced by output switching, leakage current, ground bouncing, power supply transients, etc.
The CDC906 is designed in BiCMOS process technology incorporating silicon-germanium (SiGe) technology.
This process gives excellent performance in linearity, low power consumption, best-in-class noise performance
and good isolation characteristic between the on-chip components.
The good isolation was a major criteria to use BiCMOS process as it minimizes the coupling effect. Even if all
three PLLs are active and all outputs are on, the noise suppression is clearly above 50 dB. Figure 31 and
Figure 32 show an example of noise coupling, spur-suppression, and power supply noise rejection of CDC906.
Die respective measurement conditions are shown in Figure 31 and Figure 32.
33
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SCAS828–SEPTEMBER 2006
•
•
•
•
•
Measured Y1: 48 MHz
Y0 is 27 MHz (XTAL buffered ,loaded by 50O)
Y2 is 56.448 MHz (loaded by 50O)
Y3 is 33.33 MHz (loaded by 50O)
Y4, Y5 tri−stated
carrier
48MHz
2nd harmonic
spur at
27MHz&54MHz
Figure 31. Noise Coupling and Spur Suppression
w Measured Y0: 48 MHz
w Y1, Y2, Y3, Y4 & Y5 tri−stated
w Inserted 30mV 1MHz @ Vcc = 3.3V
carrier
48MHz
carrier
48MHz
spurs at
47MHz&49MHz
spur 47MHz and
fundamental at 1MHz
Figure 32. Power Supply Noise Rejection
Phase Noise Characteristic
In high-speed communication systems, the phase noise characteristic of the PLL frequency synthesizer is of
high interest. Phase noise describes the stability of the clock signal in the frequency domain, similar to the jitter
specification in the time domain.
Phase noise is a result of random and discrete noise causing a broad slope and spurious peaks. The discrete
spurious components could be caused by known clock frequencies in the signal source, power line interference,
and mixer products. The broadening caused by random noise fluctuation is due to phase noise. It can be the
result of thermal noise, shot noise and/or flicker noise in active and passive devices.
Important factor for PLL synthesizer is the loop bandwidth (–3 dB cut-off frequency) — large loop bandwidth
(LBW) results in fast transient response but have less reference spur attenuation. The LBW of the CDC906 is
about 100 kHz to 250 kHz, dependent on selected PLL parameter.
For the CDC906, two phase noise characteristics are of interest: The phase noise of the crystal-input stage and
the phase noise of the internal PLL (VCO). Figure 33 shows the respective phase noise characteristic.
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SCAS828–SEPTEMBER 2006
−50
−60
−70
Phase Noise Comparison
135 MHz
f
OUT
135 MHz vs 270 MHz
f
VCO
CDC906 f
135 MHz
OUT
135 MHz
f
VCO
CDC906 f
135 MHz
OUT
270 MHz
−80
−90
f
VCO
−100
−110
−120
−130
−140
−150
CDC906 Cyrstal 27 MHz Input
27 MHz Buffered Output
1.0E+01
1.0E+02
1.0E+03
1.0E+04
- [Hz]
1.0E+05
1.0E+06
1.0E+07
f
offset
Figure 33. Phase Noise Characteristic
PLL Lock-Time
Some applications use frequency switching, i.e. to change frequency in TV application (switching between
channels) or change the PCI-X frequency in computers. The time spent by the PLL in achieving the new
frequency is of main interest. The lock time is the time it takes to jump from one specified frequency to another
specified frequency within a given frequency tolerance (Figure 34). It should be low, because a long lock time
impacts the data rate of the system.
The PLL Lock Time depends on the device configuration and can be changed by the VCO frequency, i.e. by
changing the M/N divider values. Table 7 gives the typical lock times of the CDC906 and Figure 34 shows a
snapshot of a frequency switch.
Table 7. CDC906 PLL Lock-Times
Description
Lock Time (Typical)
Unit
µs
Frequency change via reprogramming of N/M counter
Frequency change via CLK_SEL pin (switching between CLK_IN0 and CLK_IN1)
Power-up lock time with system clock
100
100
µs
50
µs
Power-up lock time with 27-MHz Crystal at CLK_IN0 and CLK_IN1
300(1)
µs
(1) Is the result of crystal power up (200 µs) and PLL Lock Time (100 µs).
35
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SCAS828–SEPTEMBER 2006
fVCO (MHz)
Start Condition:
Acknowledge of
N-Divider Byte
Frequency
Response
Curve of Y0
297
EVM Board Configuration:
81
• Y0 (PLL1), Y1 3 state
• CLK_IN: Crystal 27 MHz
• measured Channel: Y0
Measurement:
60
t [ms]
0
ƒ
= 10, N = 30) = 81 MHz
• Start Condition: (M
• Byte 2 write: N = 30 (81 MHz) ³ N = 110 (297 MHz)
Result:
• 60 ms to PLL Pull In
• 90 ms to PLL Phase Lock
20 ms/div
Figure 34. Snapshot of the PLL Lock-Time
Power Supply Sequence
The CDC906 includes the following three power supply pins: VCC, VCCOUT1, and VCCOUT2. There are no power
supply sequencing requirements, as the three power nodes are separated from each other. So, power can be
supplied in any order to the three nodes.
Also, the part has a power-up circuitry which switches the device on if VCC exceeds 2.1 V (typical) and switches
the device off at VCC < 1.7 V (typical). In power-down mode, all outputs and clock inputs are switched off.
EVM and Programming SW
The CDC906 EVM is a development kit consisting of a performance evaluation module, the TI Pro Clock
software, and the User's Guide. Contact Texas Instruments sales or marketing representative for more
information.
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PACKAGE OPTION ADDENDUM
www.ti.com
8-Jan-2007
PACKAGING INFORMATION
Orderable Device
CDC906PW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
PW
20
20
20
20
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CDC906PWG4
CDC906PWR
TSSOP
TSSOP
TSSOP
PW
PW
PW
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CDC906PWRG4
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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