CDCF5801

更新时间:2024-09-18 02:08:38
品牌:TI
描述:CLOCK MULTIPLIER WITH DELAY CONTROL AND PHASE ALIGNMENT

CDCF5801 概述

CLOCK MULTIPLIER WITH DELAY CONTROL AND PHASE ALIGNMENT 的时延控制和相位校准时钟乘法器

CDCF5801 数据手册

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CDCF5801  
www.ti.com  
SCAS698DSEPTEMBER 2003REVISED DECEMBER 2004  
CLOCK MULTIPLIER WITH DELAY CONTROL AND PHASE ALIGNMENT  
FEATURES  
APPLICATIONS  
Video Graphics  
Gaming Products  
Datacom  
Low-Jitter Clock Multiplier: ×1, ×2, ×4, ×8  
Programmable Bidirectional Delay Steps of  
1.3 mUI  
Telecom  
Output Frequency Range of 25 MHz to  
280 MHz  
Noise Cancellation Created by FPGAs  
Input Frequency Range of 12.5 MHz to  
240 MHz  
DBQ PACKAGE  
(TOP VIEW)  
Low Jitter Generation  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
VDDREF  
REFCLK  
VDDP  
P0  
P1  
Single-Ended REFCLK Input With Adjustable  
Trigger Level (Works With LVTTL, HSTL, and  
LVPECL)  
2
3
VDDO  
GNDO  
CLKOUT  
NC  
CLKOUTB  
GNDO  
VDDO  
MULT0  
MULT1  
P2  
4
GNDP  
GND  
5
Differential/Single-Ended Output  
6
LEADLAG  
DLYCTRL  
GNDPA  
VDDPA  
VDDPD  
STOPB  
PWRDNB  
Output Can Drive LVPECL, LVDS, and LVTTL  
7
Three Power Operating Modes to Minimize  
Power  
8
9
Low Power Consumption (< 190 mW at  
280 MHz/3.3 V)  
10  
11  
12  
Packaged in a Shrink Small-Outline Package  
(DBQ)  
No External Components Required for PLL  
Spread Spectrum Clock Tracking Ability to  
Reduce EMI (SSC)  
DESCRIPTION  
The CDCF5801 provides clock multiplication from a reference clock (REFCLK) signal with the unique capability  
to delay or advance the CLKOUT/CLKOUTB with steps of only 1.3 mUI through a phase aligner. For every rising  
edge on the DLYCTRL pin the CLKOUT is delayed by a 1.3-mUI step size as long as the LEADLAG input  
detects a low signal at the time of the DLYCTRL rising edge. Similarly for every rising edge on the DLYCTRL pin  
the CLKOUT is advanced by a 1.3-mUI step size as long as the LEADLAG pin is high during the transition. This  
unique capability allows the device to phase align (zero delay) between CLKOUT/CLKOUTB and any one other  
CLK in the system by feeding the clocks that need to be aligned to the DLYCTRL and the LEADLAG pins. Also it  
provides the capability to program a fixed delay by providing the proper number of edges on the DLYCTRL pin,  
while strapping the LEADLAG pin to dc high or low. Further possible applications are:  
Aligning the rising edge of the output clock signal to the input clock rising edge  
Avoiding PLL instability in applications that require very long PLL feedback lines  
Isolation of jitter and digital switching noise  
Limitation of jitter in systems with good ppm frequency stability  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2003–2004, Texas Instruments Incorporated  
CDCF5801  
www.ti.com  
SCAS698DSEPTEMBER 2003REVISED DECEMBER 2004  
The CDCF5801 provides clock multiplication and division from a reference clock (REFCLK) signal. The device is  
optimized to have extremely low jitter impact from input to output. The predivider pins MULT[0:1] and post-divider  
pins P[0:2] provide selection for frequency multiplication and division ratios, generating CLKOUT/CLOUTKB  
frequencies ranging from 25 MHz to 280 MHz with clock input references (REFCLK) ranging from 12.5 MHz to  
240 MHz. See Table 1 for detailed frequency support. The selection of pins MULT[0:1] and P[1:2] determines the  
multiplication value of 1, 2, 4, or 8. The CDCF5801 offers several power-down/ high-impedance modes,  
selectable by pins P0, STOPB and PWRDN. Another unique capability of the CDCF5801 is the high sensitivity  
and wide common-mode range of the clock-input pin REFCLK by varying the voltage on the VDDREF pin. The  
clock signal outputs CLKOUT and CLKOUTB can be used independently to generate single-ended clock signals.  
The CLKOUT/CLKOUTB outputs can also be combined to generate a differential output signal suitable for LVDS,  
LVPECL, or HSTL/SSTL signaling. The CDCF5801 is characterized for operation over free-air temperatures of  
-40°C to 85°C.  
2
CDCF5801  
www.ti.com  
SCAS698DSEPTEMBER 2003REVISED DECEMBER 2004  
FUNCTIONAL BLOCK DIAGRAM  
3
CDCF5801  
www.ti.com  
SCAS698DSEPTEMBER 2003REVISED DECEMBER 2004  
TERMINAL FUNCTIONS  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
NO.  
CLKOUT  
CLKOUTB  
DLYCTRL  
2018  
O
I
Output CLK signal (low-noise CMOS) Complementary output CLK signal (low-noise CMOS)  
7
Every rising edge on this pin delays/advances the CLKOUT/CLKOUTB signal by 1/768th of the  
CLKOUT/CLKOUTB period (1.3 mUI). (E.g., for a 90-degree delay or advancement one needs to  
provide 192 rising edges). See Table 3.  
GND  
5
17, 21  
4
GND for VDDREF and VDDPD  
GNDO  
GNDP  
GND for the output pins (CLKOUT, CLKOUTB)  
GND for the PLL  
GNDPA  
LEADLAG  
8
GND for phase aligner, digital logic, and inputs P[0:2], MULT[0:1], STOPB, PWRDNB  
Controls whether the output CLK is delayed or advanced relative to REFCLK. See Table 3.  
PLL multiplication factor select. See Table 1.  
MULT[0:1] = 10: ×16  
6
I
I
MULT0  
MULT1  
15  
14  
MULT[0:1] = 11: ×8  
MULT[0:1] = 00: ×4  
MULT[0:1] = 01: ×2  
NC  
P0  
19  
24  
Not connected; leave pin floating or tied to GND.  
Mode control pins (see Table 1)  
0 - Normal operation  
I
I
1 - High-Z outputs and other special settings  
Post divider control (see Table 1)  
P[1:2] = 11: div2  
P1  
23  
P[1:2] = 10: div4  
P2  
13  
12  
P[1:2] = 01: div8  
PWRDNB  
I
Active-low power-down state. CLKOUT/CLKOUTB goes low, See Table 2).  
0 - IC in power down  
1 - Normal operation  
REFCLK  
STOPB  
2
I
I
Reference input clock  
11  
Active low output disabler, PLL and PA still running, CLKOUT and CLKOUTB goes to a dc value as  
listed in Table 2.  
0 - Outputs disabled  
1 - Normal operation  
VDDO  
16, 22  
VDD for the output pin (CLKOUT, CLKOUTB) and power down circuit  
VDD for PLL and input buffer  
VDDP  
3
9
VDDPA  
VDDPD  
VDDREF  
VDD for phase aligner, digital logic, and inputs P[0:2], MULT[0:1], and STOPB  
Reference voltage for inputs LEADLAG and DLYCTRL  
Reference voltage for REFCLK  
10  
1
4
CDCF5801  
www.ti.com  
SCAS698DSEPTEMBER 2003REVISED DECEMBER 2004  
Table 1. Input-to-Output Settings  
INPUT FRE-  
QUENCY (MHz)  
OUTPUT FRE-  
QUENCY (MHz)  
PREDIVIDER  
MULT0 MULT1  
POST DIVIDER  
INPUT-TO-OUTPUT MULTIPLI-  
CATION-RATIO  
NOTE  
FROM  
12.5  
12.5  
25  
TO  
35  
FROM  
100  
50  
TO  
280  
156  
280  
78  
P0  
P1  
1
P2  
1
8
4
1
0
39  
1
1
1
1
0
1
0
0
0
1
0
1
0
1
0
1
1
0
70  
100  
25  
1
1
12.5  
25  
39  
0
1
2
1
78  
50  
156  
280  
78  
0
1
0
Normal operation(1)  
50  
140  
78  
100  
25  
1
1
25  
0
1
50  
156  
240  
50  
156  
240  
1
0
100  
100  
1
1
CLKOUT high-impedance  
CLOUOTB high-impedance  
CLKOUT = high  
X
X
X
X
X
X
0
0
1
0
1
1
Special mode of operation  
CLKOUTB = high  
CLKOUT = P2  
X
CLKOUTB = P2  
(1) There is some overlapping of the input frequency ranges for multiplication ratios of 1, 2, and 4. For example, an input frequency of 30  
MHz for a multiplication ratio of four falls within both the 12.5 to 39-MHz range and the 25 to 70-MHz range. For best device operation in  
a case such as this, always select the input frequency range nearer to the top of the table.  
PLL DIVIDER/MULITPLIER SELECTION  
Table 2. Power Down Modes  
STATE  
Power down  
Clock stop  
Normal  
PWRDNB  
STOPB  
CLKOUT and CLKOUTB  
GNDO  
0
1
1
X
0
1
VO, STOP  
See Table 1  
Table 3. Programmable Delay and Phase Alignment  
DLYCTR  
NOTE  
LEADLAG  
CLKOUT and CLKOUTB  
Advanced by one step:  
For every 32 edges, there are one or two  
Each rising  
edge+  
step size: 1/768 of the CLKOUT period (1.3 mUI) at P[1:2] = 11  
1/1536 of the CLKOUT period (0.65 mUI) at P[1:2] = 10  
1/3072 of the CLKOUT period (0.325 mUI) at P[1:2] = 01  
HI  
edges for which the phase aligner does not  
update the phase. Therefore, CLKOUT  
phase is not updated for every 32nd edge.  
The frequency of the DLYCTRL pin should  
always be equal to or less than the  
Delayed by one step:  
Each rising  
edge+  
step size: 1/768 of the CLKOUT period (1.3 mUI) at P[1:2] = 11  
1/1536 of the CLKOUT period (0.65 mUI) at P[1:2] = 10  
1/3072 of the CLKOUT period (0.325 mUI) at P[1:2] = 01  
LO  
frequency of the LEADLAG pin.  
5
CDCF5801  
www.ti.com  
SCAS698DSEPTEMBER 2003REVISED DECEMBER 2004  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature (unless otherwise noted)(1)  
(2)  
VDDx  
Supply voltage range  
-0.5 V to 4 V  
Voltage range at any output terminal  
Voltage range at any input terminal  
Storage temperature range  
-0.5 V to VDD + 0.5 V  
-0.5 V to VDD + 0.5 V  
-65°C to 150°C  
260°C  
Tstg  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds  
(1) Stresses beyond those listed under,, absolute maximum ratings” may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under,, recommended operating  
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values are with respect to the GND terminals.  
POWER DISSIPATION RATING TABLE  
TA25°C POWER DERATING FAC-  
TA = 85°C  
PACK-  
AGE  
RATING  
TOR(1) ABOVE TA POWER RATING  
= 25°C  
DBQ  
830 mW  
8.3 mW/°C  
332 mW  
(1) This is the inverse of the junction-to-ambient thermal resistance  
when board-mounted and with no air flow.  
RECOMMENDED OPERATING CONDITIONS  
MIN  
NOM  
MAX UNIT  
VDDP, VDDPA, VDDO  
VIH (CMOS)  
Supply voltage  
3
3.3  
3.6  
V
V
V
High-level input voltage  
Low-level input voltage  
0.7 VDD  
VIL (CMOS)  
0.3 VDD  
VDDPD  
VIL (DLYCTRL, LEADLAG)  
VIH (DLYCTRL, LEADLAG)  
Input signal low voltage  
Input signal high voltage  
V
* 0.2  
2
VDDPD  
V
V
) 0.2  
2
(VDDPD)  
IOH  
Input reference voltage for DLYCNTRL and LEADLAG  
High-level output current  
1.2  
VDD  
-16 mA  
IOL  
Low-level output current  
16  
mA  
(VDDREF) (see Application  
section)  
Input reference voltage for REFCLK  
REFCLK input low voltage  
1.2  
VDD  
V
VIL (see Application section)  
VDDREF  
2
V
* 0.2  
VDDREF  
2
VIH (see Application section)  
TA  
REFCLK input high voltage  
V
) 0.2  
Operating free-air temperature  
-40  
85  
°C  
TIMING REQUIREMENTS  
PARAMETER  
MIN  
MAX UNIT  
Fmod  
SR  
Input frequency of modulation, (if driven by SSC CLKIN)  
Modulation index, nonlinear maximum 0.5%  
Input slew rate  
33  
0.6%  
4
kHz  
1
40%  
12.5  
25  
V/ns  
Input duty cycle on REFCLK  
60%  
240  
280  
240  
Input frequency on REFCLK  
MHz  
MHz  
MHz  
Output frequency on CLKOUT and CLKOUTB  
Allowable frequency on DLYCTRL  
6
CDCF5801  
www.ti.com  
SCAS698DSEPTEMBER 2003REVISED DECEMBER 2004  
TIMING REQUIREMENTS (continued)  
PARAMETER  
MIN  
MAX UNIT  
Allowable frequency on LEADLAG  
280  
MHz  
Allowable duty cycle on DLYCTRL and LEADLAG pins  
25%  
75%  
ELECTRICAL CHARACTERISTICS  
over recommended operating conditions (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS(1)  
MIN TYP(2)  
MAX UNIT  
VO(STOP)  
VO(X)  
Output voltage during Clkstop mode See Figure 1  
1.1  
2
V
VDDO  
2
VDDO  
2
Output crossing-point voltage  
See Figure 1 and Figure 4  
V
*0.2  
) 0.2  
VO  
Output voltage swing (VOH - VOL  
)
See Figure 1  
VDD = 3 V,  
1.7  
2.9  
V
V
VIK  
Input clamp voltage  
II = -18 mA  
-1.2  
VDD = 3 to 3.6 V, See Figure 1  
VDD = 3 V, IOH = -16 mA  
VDD = 3 to 3.6 V, See Figure 1  
2
2.5  
0.4  
VOH  
High-level output voltage  
Low-level output voltage  
V
V
2.2  
0.6  
0.5  
VOL  
VDD = 3 V,  
IOH = 16 mA  
VO = 1 V  
VDD = 3.135 V,  
VDD = 3.3 V,  
VDD = 3.465 V,  
VDD = 3.135 V,  
VDD = 3.3 V,  
VDD = 3.465 V,  
-32  
43  
-52  
-51  
IOH  
High-level output current  
Low-level output current  
VO = 1.65 V  
VO = 3.135 V  
VO = 1.95 V  
VO = 1.65 V  
VO = 0.4 V  
P1 = P2 = 0  
mA  
mA  
-14.5  
61.5  
65  
-21  
IOL  
25.5  
40  
IOZ  
High-impedance-state output current P0 = 1,  
±10  
µA  
µA  
High-impedance-state output current  
Stop = 0,  
IOZ(STOP)  
VO = GND or VDD  
±100  
during Clk Stop  
High-impedance-state output current  
IOZ(PD)  
IIH  
PWRDNB = 0,  
VO = GND or VDD  
VI = VDD  
-10  
100  
10  
µA  
µA  
in power-down state  
REFCLK; STOPB;  
PWRDNB; P[0:2];  
input current MULT[0:1];  
DLYCTRL; LEADLAG  
High state  
VDD = 3.6 V,  
VDD = 3.6 V,  
High-level  
IIL  
VI =0  
-10  
50  
35  
µA  
Output  
RI at IO-14.5 mA to -16.5 mA  
RI at IO 14.5 mA to 16.5 mA  
15  
10  
35  
17  
impedance  
(single  
ended)  
ZO  
Low state  
PWRDNB = 0  
PWRDNB = 1  
50  
µA  
mA  
pF  
Reference  
current  
IREF  
VDDREF; VDDPD  
VDD = 3.6 V  
0.5  
CI  
Input capacitance  
Output capacitance  
VI = VDD or GND  
VO = GND or VDD  
2
3
CO  
pF  
REFCLK = 0 MHz to 280 MHz;  
PWRDNB = 0; STOPB = 1  
IDD(PD)  
Supply current in power-down state  
4
44  
75  
mA  
mA  
mA  
IDD(CLKSTOP) Supply current in CLK stop state  
BUSCLK configured for 280 MHz  
Supply current (normal operation  
BUSCLK 280 MHz, MULT[0:1] = 10;  
P[0:2] = 011; Load , See Figure 1  
IDD(NORMAL)  
mode)  
(1) VDD refers to any of the following; VDDP, VDDREF, VDDO, VDDPD, and VDDPA  
(2) All typical values are at VDD = 3.3 V, TA = 25°C.  
7
CDCF5801  
www.ti.com  
SCAS698DSEPTEMBER 2003REVISED DECEMBER 2004  
JITTER SPECIFICATION  
over recommended free-air temperature range and VCC range (unless otherwise noted)  
TEST CONDITIONS  
PARAMETER  
TYP (ps)  
MAX (ps)  
REFCLK  
(MHz)  
CLKOUT  
(MHz)  
MULT[0:1] P[0:2]  
NOTES  
Period rms (1-sigma jitter, full  
frequency band)  
25  
25  
11  
11  
00  
00  
01  
001  
001  
010  
010  
011  
20  
48  
Period p-p  
120  
70  
225  
165  
165  
160  
Cycle to cycle +  
Cycle to cycle -  
70  
RMS phase jitter (accumulated,  
100 kHz-12.5 MHz)  
80  
Period rms (1-sigma jitter, full  
frequency band)  
50  
50  
7
15  
Period p-p  
37  
27  
27  
27  
75  
55  
55  
65  
Cycle to cycle +  
Cycle to cycle -  
Phase  
aligner run-  
ning  
(CLKOUT  
tight to  
LEADLAG;  
REFCLK  
tight to  
DLYCTRL).  
All typical  
values are  
at  
VDD = 3.3  
V,  
RMS phase jitter (accumulated,  
100 kHz-25 MHz)  
Period rms (1-sigma jitter, full  
frequency band)  
100  
156  
200  
100  
156  
200  
5
14  
Period p-p  
30  
24  
24  
35  
65  
55  
55  
65  
t(jitter)  
Cycle to cycle +  
Cycle to cycle -  
RMS phase jitter (accumulated,  
100 kHz-40 MHz)  
Period rms (1-sigma jitter, full  
frequency band)  
4
8
TA = 25°C.  
Period p-p  
20  
17  
17  
15  
40  
40  
40  
35  
Cycle to cycle +  
Cycle to cycle -  
RMS phase jitter (accumulated,  
100 kHz-40 MHz)  
Period rms (1-sigma jitter, full  
frequency band)  
8
15  
Period p-p  
38  
5
60  
55  
55  
60  
Cycle to cycle +  
Cycle to cycle -  
35  
30  
RMS phase jitter (accumulated,  
100 kHz-40 MHz)  
8
CDCF5801  
www.ti.com  
SCAS698DSEPTEMBER 2003REVISED DECEMBER 2004  
JITTER SPECIFICATION (continued)  
over recommended free-air temperature range and VCC range (unless otherwise noted)  
TEST CONDITIONS  
PARAMETER  
TYP (ps)  
MAX (ps)  
REFCLK  
(MHz)  
CLKOUT  
(MHz)  
MULT[0:1] P[0:2]  
NOTES  
Period rms (1-sigma jitter, full  
frequency band)  
25  
25  
200  
100  
280  
50  
10  
10  
11  
10  
11  
00  
011  
010  
011  
001  
010  
011  
4
11  
Period p-p  
20  
16  
16  
4
48  
45  
45  
11  
Cycle to cycle +  
Cycle to cycle -  
Period rms (1-sigma jitter, full  
frequency band)  
Period p-p  
22  
15  
15  
4
55  
45  
45  
11  
Cycle to cycle +  
Cycle to cycle -  
Period rms (1-sigma jitter, full  
frequency band)  
70  
Phase  
aligner  
not running  
(LEADLAG  
= 0,  
DLYCTRL =  
0). All typi-  
cal  
values are  
at  
VDD = 3.3  
Period p-p  
18  
15  
15  
6
48  
45  
45  
16  
Cycle to cycle +  
Cycle to cycle -  
t(jitter)  
Period rms (1-sigma jitter, full  
frequency band)  
25  
Period p-p  
34  
20  
20  
3
75  
65  
65  
11  
Cycle to cycle +  
Cycle to cycle -  
V, TA  
=
25°C.  
Period rms (1-sigma jitter, full  
frequency band)  
78  
156  
125  
Period p-p  
15  
13  
13  
6
44  
40  
40  
20  
Cycle to cycle +  
Cycle to cycle -  
Period rms (1-sigma jitter, full  
frequency band)  
62.5  
Period p-p  
35  
25  
25  
80  
75  
75  
Cycle to cycle +  
Cycle to cycle -  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
See Figure 3  
MIN  
TYP  
MAX UNIT  
t(DC)  
tr, tf  
Output duty cycle over 1000 cycles  
42%  
150  
58%  
Output rise and fall times (measured at 20%-80% of output voltage  
See Figure 5  
250  
350  
ps  
STATE TRANSITION LATENCY SPECIFICATIONS  
TEST  
CONDITION  
PARAMETER  
FROM  
TO  
MIN  
TYP  
MAX UNIT  
Delay time, PWRDNBto CLKOUT /  
CLKOUTB settled  
3
t(powerup)  
Power down Normal  
See Figure 6  
ms  
3
Delay time, PWRDNBto internal PLL  
and clock are on and settled  
9
CDCF5801  
www.ti.com  
SCAS698DSEPTEMBER 2003REVISED DECEMBER 2004  
STATE TRANSITION LATENCY SPECIFICATIONS (continued)  
TEST  
CONDITION  
PARAMETER  
FROM  
TO  
MIN  
TYP  
MAX UNIT  
Delay time, power up to CLKOUT  
output settled  
3
t(VDDpowerup)  
VDD  
Normal  
See Figure 6  
ms  
3
Delay time, power up to internal PLL  
and clock are on and settled  
MULT0 and MULT1 change to  
CLKOUT output resettled  
t(MULT)  
Normal  
Normal  
Normal  
See Figure 7  
See Figure 8  
1
ms  
ns  
STOPBto CLKOUT glitch-free clock  
edges  
t(CLKON)  
CLK stop  
10  
STOPBto CLKOUT output settled to  
within 50 ps of the phase before  
STOPB was disabled  
t(CLKSETL)  
CLK stop  
Normal  
See Figure 8  
See Figure 8  
20 cycles  
t(CLKOFF)  
STOPBto CLKOUT output disabled  
Normal  
Normal  
CLK stop  
5
1
ns  
Delay time, PWRDNBto the device in  
the power-down mode  
t(powerdown)  
Power down See Figure 6  
ms  
Maximum time in CLKSTOP (STOPB =  
0) before reentering normal mode  
(STOPB = 1)  
t(STOP)  
STOPB  
Normal  
Normal  
See Figure 8  
See Figure 8  
100  
100  
µs  
Minimum time in normal mode (STOPB  
= 1) before reentering CLKSTOP  
(STOPB = 0)  
t(ON)  
CLK stop  
ms  
PARAMETER MEASUREMENT INFORMATION  
TESTING CONDITIONS  
CLKOUT  
50  
V
CM  
10 pF  
50 Ω  
CLKOUTB  
Figure 1. Test Load and Voltage Definitions VOH, VOL, VO(STOP)  
CLKOUT  
CLKOUTB  
t (i)  
CYCLE  
t (i+1)  
CYCLE  
Cycle-to-Cycle Jitter (t ) = | t (i) - t (i+1) | over 1000 consecutive cycles  
(jitter) CYCLE CYCLE  
Figure 2. Cycle-to-Cycle Jitter  
10  
CDCF5801  
www.ti.com  
SCAS698DSEPTEMBER 2003REVISED DECEMBER 2004  
PARAMETER MEASUREMENT INFORMATION (continued)  
CLKOUT  
CLKOUTB  
t
PW+  
t
CYCLE  
Duty Cycle = (t  
/t  
)
PW+ CYCLE  
Figure 3. Output Duty Cycle  
CLKOUT  
V
V
V
O(X)+  
O(X), nom  
O(X)-  
CLKOUTB  
Figure 4. Crossing Point Voltage  
V
OH  
80%  
20%  
V
OL  
t
r
t
f
Figure 5. Voltage Waveforms  
PWRDNB  
t
(powerdown)  
t
(powerup)  
CLKOUT  
CLKOUTB  
Figure 6. PWRDNB Transition Timings  
MULT0  
and/or  
MULT1  
t
(MULT)  
CLKOUT  
CLKOUTB  
Figure 7. MULT Transition Timings  
11  
CDCF5801  
www.ti.com  
SCAS698DSEPTEMBER 2003REVISED DECEMBER 2004  
PARAMETER MEASUREMENT INFORMATION (continued)  
t
(ON)  
t
(STOP)  
STOPB  
t
(CLKSETL)  
t
(CLKOFF)  
t
(CLKON)  
(see Note A)  
(see Note A)  
CLKOUT  
CLKOUTB  
Output clock  
not specified  
glitches ok  
Clock output settled  
within 50 ps of the  
phase before disabled  
Clock enabled  
and glitch free  
A. Vref = VO±200 mV  
Figure 8. STOPB Transition Timings  
12  
CDCF5801  
www.ti.com  
SCAS698DSEPTEMBER 2003REVISED DECEMBER 2004  
APPLICATION INFORMATION  
APPLICATION EXAMPLE  
The following figure shows an example of using the CDCF5801 as a ×4 multiplier with the phase aligner  
de-skewing the unknown buffer delay of the two CDCV304s in the circuit. This circuitry would not be possible  
with a simple PLL because the feedback of the PLL would have the second CDCV304 in the loop, causing  
instability of the PLL due to a long delay.  
Z = 50 ; Length = L1  
30 Ω  
25 MHz  
CDCV304  
Clock Buffer  
25 MHz  
Z = 50 Ω  
CLK  
Outputs are Phase Aligned  
Between the Two Buffers  
CDCF5801  
VDDREF  
P0  
P1  
3.3 V  
3.3 V  
REFCLK  
VDDP  
CDCV304  
3.3 V  
VDDO  
GNDO  
Clock Buffer  
25 MHz  
25 MHz  
Z = 50 Ω  
GNDP  
GND  
CLKOUT  
CLK  
35 Ω  
LEADLAG  
DLYCTRL  
GNDPA  
VDDPA  
VDDPD  
STOPB  
PWRDNB  
NC  
CLKOUTB  
GNDO  
VDDO  
3.3 V  
3.3 V  
MULT0  
MULT1  
P2  
Z = 50 ; Length = L1  
Figure 9. Application Example  
NOTE:  
If an active element (microcontroller, ASIC, DSP< FPYA, DSP, etc.) is used in the  
CDCF5801 CLKOUT to DLYCTRL feedback loop, see application report SCAA075.  
SELECTING VDDREF  
Generally, VDDREF can be set to any value between 1.2 V and VDD. The setting of VDDREF directly influences  
the trigger voltage of the input. Special care must be taken when using small signal swings to drive the  
CVDCF5801 input (e.g., PECL). It is recommended to connect VDDREF directly to VDD, ac-couple the REFCLK  
input, and rebias the signal.  
The following circuit is recommended to drive the CDCF5801 from a differential clock signal like PECL.  
13  
CDCF5801  
www.ti.com  
SCAS698DSEPTEMBER 2003REVISED DECEMBER 2004  
APPLICATION INFORMATION (continued)  
3.3 V ± 10%  
R1  
150  
100 Ω  
CDCF5801  
VDDREF  
Z = 50 Ω  
REFCLK  
PECL  
R2  
100 Ω  
GNDP  
GND  
150 Ω  
A. NOTE: If more signal swing is required and an unterminated transmission is on option, then R1 and R2 can both be  
replaced with 10-kresistors.  
14  
PACKAGE OPTION ADDENDUM  
www.ti.com  
30-Mar-2005  
PACKAGING INFORMATION  
Orderable Device  
CDCF5801DBQ  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SSOP/  
QSOP  
DBQ  
24  
24  
24  
50  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1YEAR/  
Level-1-220C-UNLIM  
CDCF5801DBQR  
CDCF5801DBQRG4  
SSOP/  
QSOP  
DBQ  
DBQ  
2500  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1YEAR/  
Level-1-220C-UNLIM  
SSOP/  
QSOP  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
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power.ti.com  
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Copyright 2005, Texas Instruments Incorporated  

CDCF5801 替代型号

型号 制造商 描述 替代类型 文档
CDCF5801A TI CLOCK MULTIPLIER WITH DELAY CONTROL AND PHASE ALIGNMENT 功能相似

CDCF5801 相关器件

型号 制造商 描述 价格 文档
CDCF5801A TI CLOCK MULTIPLIER WITH DELAY CONTROL AND PHASE ALIGNMENT 获取价格
CDCF5801ADBQ TI CLOCK MULTIPLIER WITH DELAY CONTROL AND PHASE ALIGNMENT 获取价格
CDCF5801ADBQG4 TI CLOCK MULTIPLIER WITH DELAY CONTROL AND PHASE ALIGNMENT 获取价格
CDCF5801ADBQR TI CLOCK MULTIPLIER WITH DELAY CONTROL AND PHASE ALIGNMENT 获取价格
CDCF5801ADBQRG4 TI CLOCK MULTIPLIER WITH DELAY CONTROL AND PHASE ALIGNMENT 获取价格
CDCF5801DBQ TI CLOCK MULTIPLIER WITH DELAY CONTROL AND PHASE ALIGNMENT 获取价格
CDCF5801DBQG4 TI Low Jitter PLL Based Multiplier/Divider with programmable delay lines down to sub 10ps 24-SSOP -40 to 85 获取价格
CDCF5801DBQR TI CLOCK MULTIPLIER WITH DELAY CONTROL AND PHASE ALIGNMENT 获取价格
CDCF5801DBQRG4 TI CLOCK MULTIPLIER WITH DELAY CONTROL AND PHASE ALIGNMENT 获取价格
CDCF5801_14 TI CLOCK MULTIPLIER 获取价格

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