CDCVF2509A [TI]
3.3-V PHASE-LOCK LOOP CLOCK DRIVER WITH POWER DOWN MODE; 3.3 -V锁相环时钟掉电模式驱动程序
| 型号： | CDCVF2509A |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3.3-V PHASE-LOCK LOOP CLOCK DRIVER WITH POWER DOWN MODE |
| 文件： | 总12页 (文件大小：163K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CDCVF2509A
www.ti.com
SCAS765A–APRIL 2004–REVISED JULY 2004
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
WITH POWER DOWN MODE
FEATURES
FEATURES
•
•
•
DRAM Applications
PLL Based Clock Distributors
Non-PLL Clock Buffer
•
Designed to Meet and Exceed PC133
SDRAM Registered DIMM Specification
Rev. 1.1
•
•
•
Spread Spectrum Clock Compatible
PW PACKAGE
(TOP VIEW)
Operating Frequency 20 MHz to 175 MHz
Static Phase Error Distribution at 66 MHz to
166 MHz Is ±125 ps
AGND
CLK
AV
1
24
23
22
21
20
19
18
V
CC
2
•
•
Jitter (cyc - cyc) at 66 MHz to 166 MHz Is
|70| ps
CC
1Y0
1Y1
1Y2
GND
GND
1Y3
3
V
CC
2Y0
2Y1
GND
GND
4
Advanced Deep Submicron Process
Results in More Than 40% Lower Power
Consumption Versus Current Generation
PC133 Devices
5
6
7
8
17 2Y2
16 2Y3
•
Auto Frequency Detection to Disable
Device (Power-Down Mode)
1Y4
9
V
CC
10
11
12
15
14
13
V
CC
•
•
Available in Plastic 24-Pin TSSOP
1G
FBOUT
2G
FBIN
Phase-Lock Loop Clock Distribution for
Synchronous DRAM Applications
•
•
•
Distributes One Clock Input to One Bank of
Five and One Bank of Four Outputs
Separate Output Enable for Each Output
Bank
External Feedback (FBIN) Terminal Is Used
to Synchronize the Outputs to the Clock
Input
•
•
•
25-Ω On-Chip Series Damping Resistors
No External RC Network Required
Operates at 3.3 V
DESCRIPTION
The CDCVF2509A is a high-performance, low-skew, low-jitter, phase-lock loop (PLL) clock driver. It uses a PLL
to precisely align, in both frequency and phase, the feedback (FBOUT) output to the clock (CLK) input signal. It is
specifically designed for use with synchronous DRAMs. The CDCVF2509A operates at a 3.3-V VCC. It also
provides integrated series-damping resistors that make it ideal for driving point-to-point loads.
One bank of five outputs and one bank of four outputs provide nine low-skew, low-jitter copies of CLK. Output
signal duty cycles are adjusted to 50%, independent of the duty cycle at CLK. Each bank of outputs is enabled or
disabled separately via the control (1G and 2G) inputs. When the G inputs are high, the outputs switch in phase
and frequency with CLK; when the G inputs are low, the outputs are disabled to the logic-low state. The device
automically goes into power-down mode when no input signal (< 1 MHz) is applied to CLK; the outputs go into a
low state.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
CDCVF2509A
www.ti.com
SCAS765A–APRIL 2004–REVISED JULY 2004
Unlike many products containing PLLs, the CDCVF2509A does not require external RC networks. The loop filter
for the PLL is included on-chip, minimizing component count, board space, and cost.
Because it is based on PLL circuitry, the CDCVF2509A requires a stabilization time to achieve phase lock of the
feedback signal to the reference signal. This stabilization time is required following power up and application of a
fixed-frequency, fixed-phase signal at CLK, and following any changes to the PLL reference or feedback signals.
The PLL can be bypassed by strapping AVCC to ground to use as a simple clock buffer.
The CDCVF2509A is characterized for operation from 0°C to 85°C.
For application information, see application reports High Speed Distribution Design Techniques for
CDC509/516/2509/2510/2516 (SLMA003) and Using CDC2509A/2510A PLL with Spread Spectrum Clocking
(SSC) (SCAA039).
FUNCTION TABLE
Inputs
1G/2G
Outputs
PLL
AVDD
GND
CLK
1Y/2Y
FBOUT
H
H
L
L
L
L
H
L
Bypassed / Off
GND
H
H
Bypassed / Off
GND
L
L
Bypassed / Off
GND
L
H
Toggling
H
L
H
Bypassed / Off
GND
L
L
Toggling in phase to CLK
Bypassed / Off
3.3 V (nom)
3.3 V (nom)
3.3 V (nom)
3.3 V (nom)
3.3 V (nom)
3.3 V (nom)
L
L
L
On
On
On
On
On
Off
L
Toggling
L
L
Toggling in phase to CLK
H
H
H
X
L
L
H
H
H
Toggling
< 1 MHz
Toggling in phase to CLK
L
Toggling in phase to CLK
L
2
CDCVF2509A
www.ti.com
SCAS765A–APRIL 2004–REVISED JULY 2004
FUNCTIONAL BLOCK DIAGRAM
11
1G
3
1Y0
4
1Y1
5
1Y2
8
1Y3
9
1Y4
14
2G
21
2Y0
20
2Y1
17
24
13
2Y2
CLK
PLL
16
2Y3
FBIN
12
FBOUT
23
AV
CC
AVAILABLE OPTIONS
PACKAGE
TA
SMALL OUTLINE (PW)
CDCVF2509APWR
CDCVF2509APW
0°C to 85°C
3
CDCVF2509A
www.ti.com
SCAS765A–APRIL 2004–REVISED JULY 2004
Terminal Functions
TERMINAL
TYPE
DESCRIPTION
NAME
NO.
Clock input. CLK provides the clock signal to be distributed by the CDCVF2509A clock driver. CLK
is used to provide the reference signal to the integrated PLL that generates the clock output signals.
CLK must have a fixed frequency and fixed phase for the PLL to obtain phase lock. Once the circuit
is powered up and a valid CLK signal is applied, a stabilization time is required for the PLL to phase
lock the feedback signal to its reference signal.
CLK
24
I
Feedback input. FBIN provides the feedback signal to the internal PLL. FBIN must be hard-wired to
FBOUT to complete the PLL. The integrated PLL synchronizes CLK and FBIN so that there is
nominally zero phase error between CLK and FBIN.
FBIN
13
I
I
Output bank enable. 1G is the output enable for outputs 1Y(0:4). When 1G is low, outputs 1Y(0:4)
are disabled to a logic-low state. When 1G is high, all outputs 1Y(0:4) are enabled and switch at the
same frequency as CLK.
1G
11
Output bank enable. 2G is the output enable for outputs 2Y(0:3). When 2G is low, outputs 2Y(0:3)
are disabled to a logic low state. When 2G is high, all outputs 2Y(0:3) are enabled and switch at the
same frequency as CLK.
2G
14
12
I
Feedback output. FBOUT is dedicated for external feedback. It switches at the same frequency as
CLK. When externally wired to FBIN, FBOUT completes the feedback loop of the PLL. FBOUT has
an integrated 25-Ω series-damping resistor.
FBOUT
1Y (0:4)
2Y (0:3)
AVCC
O
O
O
Clock outputs. These outputs provide low-skew copies of CLK. Output bank 1Y(0:4) is enabled via
the 1G input. These outputs can be disabled to a logic-low state by deasserting the 1G control
input. Each output has an integrated 25-Ω series-damping resistor.
3, 4, 5, 8, 9
16, 17, 21, 20
23
Clock outputs. These outputs provide low-skew copies of CLK. Output bank 2Y(0:3) is enabled via
the 2G input. These outputs can be disabled to a logic-low state by deasserting the 2G control
input. Each output has an integrated 25-Ω series-damping resistor.
Analog power supply. AVCC provides the power reference for the analog circuitry. In addition, AVCC
Power can be used to bypass the PLL. When AVCC is strapped to ground, PLL is bypassed and CLK is
buffered directly to the device outputs.
AGND
VCC
1
Ground Analog ground. AGND provides the ground reference for the analog circuitry.
2, 10, 15, 22
6, 7, 18, 19
Power Power supply
Ground Ground
GND
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
UNIT
AVCC < VCC +0.7 V
–0.5 V to 4.3 V
–0.5 V to 4.6 V
–0.5 V to VCC + 0.5 V
–50 mA
(2)
AVCC Supply voltage range
VCC
VI
Supply voltage range
(3)
Input voltage range
VO
IIK
Voltage range applied to any output in the high or low state(3)(4)
Input clamp current (VI< 0)
IOK
IO
Output clamp current (VO< 0 or VO > VCC
)
±50 mA
Continuous output current (VO = 0 to VCC
)
±50 mA
Continuous current through each VCC or GND
Maximum power dissipation at TA = 55°C (in still air)(5)
Storage temperature range
±100 mA
0.7 W
Tstg
–65°C to 150°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) AVCCmust not exceed VCC+ 0.7 V
(3) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) This value is limited to 4.6 V maximum.
(5) The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils. For
more information, see the Package Thermal Considerations application note in the ABT Advanced BiCMOS Technology Data Book
(SCBD002).
4
CDCVF2509A
www.ti.com
SCAS765A–APRIL 2004–REVISED JULY 2004
RECOMMENDED OPERATING CONDITIONS(1)
MIN MAX UNIT
VCC, AVCC
Supply voltage
3
2
3.6
V
V
VIH
VIL
VI
High-level input voltage
Low-level input voltage
Input voltage
0.8
VCC
–12
12
V
0
0
V
IOH
IOL
TA
High-level output current
Low-level output current
Operating free-air temperature
mA
mA
°C
85
(1) Unused inputs must be held high or low to prevent them from floating.
TIMING REQUIUREMENTS
over recommended ranges of supply voltage and operating free-air temperature
MIN MAX UNIT
fclk
Clock frequency
20 175
40% 60%
1
MHz
Input clock duty cycle
Stabilization time(1)
ms
(1) The time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal. For phase lock to be
obtained, a fixed-frequency, fixed-phase reference signal must be present at CLK. Until phase lock is obtained, the specifications for
propagation delay, skew and jitter parameters given in the switching characteristics table are not applicable. This parameter does not
apply for input modulation under SSC application.
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
Input clamp voltage
TEST CONDITIONS
II = -18 mA
VCC, AVCC
3 V
MIN TYP(1)
MAX UNIT
VIK
–1.2
V
IOH = -100 µA
IOH = -12 mA
IOH = -6 mA
IOL = 100 µA
IOL = 12 mA
IOL = 6 mA
MIN to MAX
3 V
VCC–0.2
VOH
High-level output voltage
Low-level output voltage
High-level output current
Low-level output current
2.1
2.4
V
3 V
MIN to MAX
3 V
0.2
0.8
VOL
V
3 V
0.55
VO= 1 V
3 V
–28
30
IOH
VO = 1.65 V
VO = 3.135 V
VO= 1.95 V
VO = 1.65 V
VO = 0.4 V
3.3 V
3.6 V
3 V
–36
40
mA
mA
-8
IOL
3.3 V
3.6 V
3.6 V
10
II
Input current
VI = VCC or GND
±5
µA
µA
VI = VCC or GND, IO = 0,
Outputs: low or high
(2)
ICC
Supply current (static, output not switching)
3.6 V, 0 V
40
One input at VCC - 0.6 V,
Other inputs at VCC or GND
∆ICC
Change in supply current
3.3 V to 3.6 V
500
µA
Ci
Input capacitance
Output capacitance
VI = VCC or GND
VO = VCC or GND
3.3 V
3.3 V
2.5
2.8
pF
pF
Co
(1) For conditions shown as MIN or MAX, use the appropriate value specified under the recommended operating conditions section.
(2) For dynamic ICC vs Frequency, see Figure 8 and Figure 9.
5
CDCVF2509A
www.ti.com
SCAS765A–APRIL 2004–REVISED JULY 2004
SWITCHING CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature, CL = 25 pF (see Figure 1 and Figure 2)(1)(2)
VCC, AVCC = 3.3 V
FROM
(INPUT)
TO
(OUTPUT)
± 0.3 V
PARAMETER
UNIT
MIN TYP MAX
Phase error time- static (normalized) (see
Figure 3 through Figure 6)
Output skew time(3)
CLK↑ = 66 MHz to166 MHz
FBIN↑
–125
125
ps
ps
tsk(o)
Any Y
Any Y
100
50
(4)
Phase error time-jitter
Any Y or FBOUT
Any Y or FBOUT
Any Y or FBOUT
Any Y or FBOUT
Any Y or FBOUT
Any Y or FBOUT
–50
CLK = 66 MHz to 100 MHz
|70|
|65|
ps
Jitter(cycle-cycle) (see Figure 7)
CLK = 100 MHz to 166 MHz
f(CLK) > 60 MHz
Duty cycle
Rise time
Fall time
45%
0.3
55%
tr
tf
VO = 0.4 V to 2 V
1.1 ns/V
1.1 ns/V
VO = 2 V to 0.4 V
0.3
Low-to-high propagation delay time, bypass
mode
tPLH
tPHL
CLK
CLK
Any Y or FBOUT
Any Y or FBOUT
1.8
1.8
3.9
3.9
ns
ns
High-to-low propagation delay time, bypass
mode
(1) The specifications for parameters in this table are applicable only after any appropriate stabilization time has elapsed.
(2) These parameters are not production tested.
(3) The tsk(o) specification is only valid for equal loading of all outputs.
(4) Calculated per PC DRAM SPEC (tphase error, static-jitter(cycle-to-cycle)).
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
50% V
CC
t
pd
From Output
Under Test
V
V
OH
2 V
0.4 V
2 V
Output
500 W
50% V
CC
0.4 V
25 pF
OL
t
r
t
f
LOAD CIRCUIT FOR OUTPUTS
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
NOTES: A. C includes probe and jig capacitance.
L
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 133 MHz, Z = 50 Ω, t ≤ 1.2 ns, t ≤ 1.2 ns.
O
r
f
C. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
CDCVF2509A
www.ti.com
SCAS765A–APRIL 2004–REVISED JULY 2004
PARAMETER MEASUREMENT INFORMATION (continued)
CLKIN
FBIN
t
phase error
FBOUT
Any Y
t
sk(o)
Any Y
Any Y
t
sk(o)
Figure 2. Phase Error and Skew Calculations
7
CDCVF2509A
www.ti.com
SCAS765A–APRIL 2004–REVISED JULY 2004
TYPICAL CHARACTERISTICS
STATIC PHASE ERROR
STATIC PHASE ERROR
vs
LOAD CAPACITANCE
vs
LOAD CAPACITANCE
600
400
600
V
= 3.3 V
V
= 3.3 V
CC
CC
f = 100 MHz
f = 133 MHz
c
C
T = 25°C
A
c
C
T
A
= 25 pF || 500 Ω
= 25 pF || 500 Ω
(LY1−n)
(LY1−n)
400
= 25°C
See Notes A, B, and C
See Notes A, B, and C
200
0
200
0
CLK to Y1−n
CLK to Y1−n
−200
−200
CLK to FBOUT
CLK to FBOUT
−400
−600
−400
−600
3
8
13
18
23
28
33
38
3
8
13
18
23
28
33
38
C
(LF)
− Load Capacitance − pF
C
(LF)
− Load Capacitance − pF
Figure 3.
Figure 4.
STATIC PHASE ERROR
vs
SUPPLY VOLTAGE AT FBOUT
STATIC PHASE ERROR
vs
CLOCK FREQUENCY
0
−50
0
−50
V
C
C
= 3.3 V
f = 133 MHz
CC
c
= 25 pF || 500 Ω
C
(LY)
= 25 pF || 500 Ω
= 12 pF || 500 Ω
(LY)
= 12 pF || 500 Ω
C
(LF)
(LF)
T = 25°C
See Notes A, B, and C
T = 25°C
See Notes A, B, and C
A
A
−100
−100
−150
−200
−250
−150
−200
−250
CLK to FBOUT
CLK to FBOUT
−300
−350
−400
−300
−350
−400
50
75
100
125
150
175
200
3
3.1
3.2
3.3
3.4
3.5
3.6
f − Clock Frequency − MHz
c
V
CC
− Supply Voltage at FBOUT − V
Figure 5.
Figure 6.
A. Trace length FBOUT to FBIN = 5 mm, ZO = 50Ω
B. C(LY) = Lumped capacitive load Y1-n
C. C(LFx) = Lumped feedback capacitance at FBOUT = FBIN
8
CDCVF2509A
www.ti.com
SCAS765A–APRIL 2004–REVISED JULY 2004
TYPICAL CHARACTERISTICS (continued)
JITTER
ANALOG SUPPLY CURRENT
vs
vs
CLOCK FREQUENCY AT FBOUT
CLOCK FREQUENCY
140
25
V
CC
= 3.3 V
AV = V = 3.6 V
Bias = 0/3 V
CC
CC
C
C
= 25 pF || 500 Ω
= 12 pF || 500 Ω
= 25°C
(LY)
120
100
(LF)
C
C
T
= 25 pF || 500 Ω
= 12 pF || 500 Ω
= 25°C
(LY)
(LF)
T
A
20
15
10
See Notes C and D
A
See Notes A and B
80
60
Cycle to Cycle
40
5
0
20
0
50
75
100
125
150
175
200
0
25
50
75 100 125 150
175 200
f − Clock Frequency at FBOUT − MHz
c
f − Clock Frequency − MHz
c
Figure 7.
Figure 8.
SUPPLY CURRENT
vs
CLOCK FREQUENCY
250
AV = V = 3.6 V
CC
CC
Bias = 0/3 V
C
C
= 25 pF || 500 Ω
= 12 pF || 500 Ω
= 25°C
(LY)
(LF)
200
150
100
T
A
See Notes A and B
50
0
0
25
50
75 100 125 150
175 200
f − Clock Frequency − MHz
c
Figure 9.
A. Trace length FBOUT to FBIN = 5 mm, ZO = 50Ω
B. C(LY) = Lumped capacitive load Y1-n
C. C(LFx) = Lumped feedback capacitance at FBOUT = FBIN
D. C(LFx) = Lumped feedback capacitance at FBOUT = FBIN.
9
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
PACKAGING INFORMATION
Orderable Device
CDCVF2509APW
CDCVF2509APWR
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
PW
24
60
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
TSSOP
PW
24
2000
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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