CLC020BCQ/NOPB [TI]

具有集成电缆驱动器的 SMPTE 259M 数字视频串行器 | FN | 28 | 0 to 70;
CLC020BCQ/NOPB
型号: CLC020BCQ/NOPB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
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具有集成电缆驱动器的 SMPTE 259M 数字视频串行器 | FN | 28 | 0 to 70

驱动 商用集成电路 驱动器
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CLC020  
www.ti.com  
SNLS046E FEBRUARY 2000REVISED APRIL 2013  
CLC020 SMPTE 259M Digital Video Serializer with Integrated Cable Driver  
Check for Samples: CLC020  
1
FEATURES  
DESCRIPTION  
The CLC020 SMPTE 259M Digital Video Serializer  
with Integrated Cable Driver is a monolithic integrated  
circuit that encodes, serializes and transmits bit-  
parallel digital data conforming to SMPTE 125M and  
SMPTE 267M component video and SMPTE 244M  
composite video standards. The CLC020 can also  
serialize other 8 or 10-bit parallel data. The CLC020  
operates at data rates from below 100 Mbps to over  
400 Mbps. The serial data clock frequency is  
internally generated and requires no external  
frequency setting components, trimming or filtering*.  
Functions performed by the CLC020 include: parallel-  
to-serial data conversion, data encoding using the  
polynomial (X9+X4+1), data format conversion from  
NRZ to NRZI, parallel data clock frequency  
multiplication and encoding with the serial data, and  
coaxial cable driving. Input for sync (TRS) detection  
disabling and a PLL lock detect output are provided.  
The CLC020 has an exclusive built-in self-test (BIST)  
and video test pattern generator (TPG) with 4  
component video test patterns, reference black, PLL  
and EQ pathologicals and modified colour bars, in 4:3  
and 16:9 raster and both NTSC and PAL formats*.  
Separate power pins for the output driver, VCO and  
the digital logic improve power supply rejection,  
output jitter and noise performance.  
2
SMPTE 259M Serial Digital Video Standard  
Compliant  
No External Serial Data Rate Setting or VCO  
Filtering Components Required(1)  
Built-In Self-Test (BIST) and Video Test Pattern  
Generator (TPG) with 16 Internal Patterns(1)  
Supports All NTSC and PAL Standard  
Component and Composite Serial Video Data  
Rates  
HCMOS/TTL-Compatible Data and Control  
Inputs and Outputs  
75ECL-Compatible, Differential, Serial Cable-  
Driver Outputs  
Fast VCO Lock Time: <75 µs  
Single +5V TTL or 5V ECL Supply Operation  
Low Power: 235 mW Typical  
28-Lead PLCC Package  
Commercial Temperature Range 0°C to +70°C  
APPLICATIONS  
SMPTE 259M Parallel-to-Serial Digital Video  
Interfaces for:  
The CLC020 is the ideal complement to the  
CLC011B SMPTE 259M Serial Digital Video  
Decoder, CLC014 Active Cable Equalizer, CLC016  
Data Retiming PLL (clock-data separator), CLC018  
8X8 Digital Crosspoint Switch and CLC006 or  
CLC007 Cable Drivers, for a complete parallel-serial-  
Video Cameras  
VTRs  
Telecines  
Video Test Pattern Generators and Digital  
Video Test Equipment  
parallel,  
high-speed  
data  
processing  
and  
Non-SMPTE Video Applications  
transmission system.  
Other High Data Rate Parallel/Serial Video and  
Data Systems  
The CLC020 is powered from a single 5V supply.  
Power dissipation is typically 235 mW including two  
75back-matched output loads. The device is  
packaged in a JEDEC 28-lead PLCC.  
(1) Patents Applications Made or Pending.  
TYPICAL APPLICATION  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2000–2013, Texas Instruments Incorporated  
CLC020  
SNLS046E FEBRUARY 2000REVISED APRIL 2013  
www.ti.com  
BLOCK DIAGRAM  
CONNECTION DIAGRAM  
Figure 1. 28-Pin PLCC  
See Package Number FN0028A  
2
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
(1)(2)  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage (VDDVSS  
)
6.0V  
0.5V to (VDD + 0.5V)  
0.5V to (VDD + 0.5V)  
5 mA  
CMOS/TTL Input Voltage (VI)  
CMOS/TTL Output Voltage (VO)  
CMOS/TTL Input Current (single input)  
VI = VSS 0.5V  
VI = VDD +0.5V  
+5 mA  
Input Current, Other Inputs  
±1 mA  
CMOS/TTL Output Source/Sink Current  
SDO Output Source Current  
±10 mA  
20 mA  
Package Thermal Resistance  
θJA 28-lead PLCC  
θJC 28-lead PLCC  
85°C/W  
35°C/W  
Storage Temp. Range  
Junction Temperature  
Lead Temperature (Soldering 4 Sec)  
ESD Rating (HBM)  
65°C to +150°C  
+150°C  
+260°C  
>2.5 kV  
ESD Rating (MM)  
>200 V  
Transistor Count  
33,400  
(1) Absolute Maximum Ratings are those parameter values beyond which the life and operation of the device cannot be ensured. The  
stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values.  
The table of Electrical Characteristics specifies acceptable device operating conditions.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and  
specifications.  
RECOMMENDED OPERATING CONDITIONS  
Supply Voltage (VDDVSS  
CMOS/TTL Input Voltage  
PCLK Frequency Range  
PCLK Duty Cycle  
)
5.0V ±10%  
VSS to VDD  
10 to 40MHz  
45 to 55%  
DN and PCLK Rise/Fall Time  
1.0 to 3.0 ns  
3.0V ±10%  
0°C to +70°C  
Maximum DC Bias on SDO pins  
Operating Free Air Temperature (TA)  
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DC ELECTRICAL CHARACTERISTICS  
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)(2)  
Symbol  
VIH  
Parameter  
Conditions  
Reference  
Min  
2.0  
Typ  
Max  
VDD  
0.8  
Units  
V
Input Voltage High Level  
Input Voltage Low Level  
Input Current High Level  
Input Current Low Level  
D0 through D9,  
PCLK, TPG_EN  
and Sync.  
VIL  
VSS  
V
IIH  
VIH = VDD  
+40  
-1  
+60  
-20  
µA  
µA  
V
Detect Enable  
IIL  
VIL = VSS  
VOH  
CMOS Output Voltage  
High Level  
IOH = 10 mA  
Lock Detect,  
Test Out  
2.4  
0.0  
700  
4.7  
VDD  
VOL  
CMOS Output Voltage Low  
Level  
IOL = +10 mA  
0.3  
VSS + 0.5V  
900  
V
VSDO  
Serial Driver Output  
Voltage  
RL = 751%,  
RREF = 1.69 k1%,  
See Figure 3  
SDO, SDO  
800  
mVP-P  
IDD  
Power Supply Current,  
Total  
RL = 751%,  
RREF = 1.69 k1%,  
47  
60  
mA  
PCLK = 27 MHz, See Figure 3,  
NTSC Colour Bar Pattern  
(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated  
referenced to VSS = 0V.  
(2) Typical values are stated for VDD = +5.0V and TA = +25°C.  
AC ELECTRICAL CHARACTERISTICS  
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)  
Symbol  
Parameter  
Conditions  
Reference  
Min  
Typ  
Max  
Units  
BRSDO  
Serial data rate  
RL = 75, AC coupled(2)  
SDO, SDO  
100  
400  
Mbps  
FP  
CLK  
Reference Clock  
Input Frequency  
PCLK  
10  
40  
MHz  
%
Reference Clock Duty  
Cycle  
PCLK  
45  
50  
55  
tr, tf  
tj  
Rise time, Fall time  
Serial output jitter  
Serial output jitter  
Rise time, Fall time  
Output overshoot  
Lock time  
10%–90%  
DN, PCLK  
1.0  
1.5  
220  
100  
800  
1
3.0  
ns  
psP-P  
psP-P  
ps  
270 Mbps(3), See Figure 3  
See(4)(2)  
20%–80%(2)(4)  
tjit  
200  
SDO, SDO  
tr, tf  
500  
1500  
%
tLOCK  
tSU  
270 Mbps(2)(5)  
See Figure 4  
See Figure 4  
See(4)  
75  
2
µs  
Setup time  
DN to PCLK  
3
ns  
tHLD  
Hold time  
DN from PCLK  
1.5  
1
ns  
LGEN  
RGEN  
Output inductance  
Output resistance  
6
nH  
SDO, SDO  
See(4)  
25k  
(1) Typical values are stated for VDD = +5.0V and TA = +25°C.  
(2) RL = 75, AC-coupled @ 270 Mbps, RREF = 1.69 k1%, See TEST LOADS and Figure 3.  
(3) CLC020 mounted in the SD020EVK board, configured in BIST mode (NTSC color bars) with PCLK = 27MHz derived from Tektronix  
TG2000 black-burst reference. Timing jitter measured with Tektronix VM700T using jitter measurement FFT mode, frame rate, 1kHz  
filter bandwidth, Hanning window.  
(4) Specification is ensured by design.  
(5) Measured from rising-edge of first PCLK cycle until Lock Detect output goes high (true).  
4
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TEST LOADS  
All resistors in Ohms, 1% tolerance.  
Figure 2. Test Loads  
Figure 3. Test Circuit  
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TIMING DIAGRAM  
Figure 4. Setup and Hold Timing  
DEVICE OPERATION  
The CLC020 SMPTE 259M Digital Video Serializer is used in digital video signal origination and processing  
equipment: cameras, video tape recorders, telecines, video test equipment and others. It converts parallel  
component or composite digital video signals into serial format. Logic levels within this equipment are normally  
TTL-compatible as produced by CMOS or bipolar logic devices. The encoder outputs ECL-compatible serial  
digital video (SDV) signals conforming to SMPTE 259M-1997. The CLC020 operates at all standard SMPTE and  
ITU-R parallel data rates.  
VIDEO DATA PROCESSING CIRCUITS  
The input data register accepts 8 or 10-bit parallel data and clock signals having CMOS/TTL-compatible signal  
levels. Parallel data may conform to any of several standards: SMPTE 125M, SMPTE 267M, SMPTE 244M or  
ITU-R BT.601. If data is 8-bit, it is converted to a 10-bit representation according to the type of data being input:  
component 4:2:2 per SMPTE 259M paragraph 7.1.1, composite NTSC per paragraph 8.1.1 or composite PAL  
per paragraph 9.1.1. Output from this register feeds the SMPTE polynomial generator/serializer and sync  
detector. All CMOS inputs including the PCLK input have internal pull-down devices.  
The sync detector or TRS character detector accepts data from the input register. The detection function is  
controlled by Sync Detect Enable, a low-true, TTL-compatible, external signal. Synchronization words, the timing  
reference signals (TRS), start-of-active-video (SAV) and end-of-active-video (EAV) are defined in SMPTE 125M-  
1995 and 244M. The sync detector supplies control signals to the SMPTE polynomial generator that identify the  
presence of valid video data. The sync detector performs input TRS character LSB-clipping as prescribed in ITU-  
R-BT.601. LSB-clipping causes all TRS characters with a value between 000h and 003h to be forced to 000h  
and all TRS characters with a value between 3FCh and 3FFh to be forced to 3FFh. Clipping is done prior to  
encoding.  
The SMPTE polynomial generator accepts the parallel video data and encodes it using the polynomial X9+X4+1  
as specified in SMPTE 259M–1997, paragraph 5 and Annex C. The scrambled data is then serialized for output.  
The NRZ-to-NRZI converter accepts serial NRZ data from the SMPTE polynomial genertor and converts it to  
NRZI using the polynomial X + 1 per SMPTE 259M–1997, paragraph 5.2 and Annex C. The transmission bit  
order is LSB first, per paragraph 6. The converter's output feeds the output driver amplifier.  
PHASE-LOCKED LOOP AND VCO  
The phase-locked loop (PLL) system generates the output serial data clock at 10× the parallel data clock  
frequency. This system consists of a VCO, divider chain, phase-frequency detector and internal loop filter. The  
VCO free-running frequency is internally set. The PLL automatically generates the appropriate frequency for the  
serial clock rate using the parallel data clock (PCLK) frequency as its reference. Loop filtering is internal to the  
CLC020. The VCO has separate VSSO and VDDO power supply feeds, pins 15 and 16, which may be supplied  
power independently via an external low-pass filter, if desired. The PLL acquisition (lock) time is less than 75 µs  
@ 270 Mbps.  
6
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LOCK DETECT  
The Lock Detect output of the phase-frequency detector indicates the PLL lock condition. It is a logic HIGH  
when the loop is locked. The output is CMOS/TTL-compatible and is suitable for driving other CMOS devices or  
a LED indicator.  
SERIAL DATA OUTPUT BUFFER  
The current-mode serial data outputs provide low-skew complimentary or differential signals. The output buffer  
design can drive 75coaxial cables (AC-coupled) or 10k/100k ECL/PECL-compatible devices (DC-coupled).  
Output levels are 800 mVP-P ±10% into 75AC-coupled, back-matched loads. The output level is 400 mVP-P  
±10% when DC-coupled into 75(See APPLICATION INFORMATION for details). The 75resistors connected  
to the SDO outputs are back-matching resistors. No series back-matching resistors should be used. SDO output  
levels are controlled by the value of RREF connected to pin 19. The value of RREF is normally 1.69 k, ±1%. The  
output buffer is static when the device is in an out-of-lock condition. Separate VSSSD and VDDSD power feeds, pins  
21 and 24, are provided for the serial output driver.  
POWER-ON RESET  
The CLC020 has an internally controlled, automatic, power-on reset circuit. This circuit clears TRS detection  
circuitry, all latches, registers, counters and polynomial generators and disables the serial output. The SDO  
outputs are tri-stated during power-on reset. The part will remain in the reset condition until the parallel input  
clock is applied.  
It is recommended that PCLK not be asserted until at least 30 µs after power has reached VDDmin. See Figure 5.  
VDDmin  
VDD  
VSS  
30ms min  
PCLK  
10%  
VSS  
Figure 5. Power-On Reset Sequence  
BUILT-IN SELF-TEST (BIST)  
The CLC020 has a built-in self-test (BIST) function. The BIST performs a comprehensive go-no-go test of the  
device. The test uses either a full-field color bar for NTSC or a PLL pathological for PAL as the test data pattern.  
Data is input internally to the input data register, processed through the device and tested for errors. Table 1  
gives device pin functions and Table 2 gives the test pattern codes used for this function. The signal level at  
Test_Output, pin 26, indicates a pass or fail condition.  
The BIST is initiated by applying the code for the desired BIST to D0 throught D3 (D9 through D4 are 00h) and a  
27 MHz clock at the PCLK input. Since all parallel data inputs are equipped with an internal pull-down device, only  
those inputs D0 through D3 which require a logic-1 need be pulled high. After the Lock_Detect output goes high  
(true) indicating the VCO is locked on frequency, TPG_Enable, pin 17, is then taken to a logic high. TPG_Enable  
may be temporarily connected to the Lock_Detect output to automate BIST operation. Test_Output, pin 26, is  
monitored for a pass/fail indication. If no errors have been detected, this output will go to a logic high level  
approximately 2 field intervals after TPG_Enable is taken high. If errors have been detected in the internal  
circuitry of the CLC020, Test_Output will remain low until the test is terminated. The BIST is terminated by taking  
TPG_Enable to a logic low. Continuous serial data output is available during the test.  
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TEST PATTERN GENERATOR  
The CLC020 features an on-board test pattern generator (TPG). Four full-field component video test patterns  
for both NTSC and PAL standards, and 4x3 and 16x9 raster sizes are produced. The test patterns are: flat-field  
black, PLL pathological, equalizer (EQ) pathological and a modified 75%, 8-color vertical bar pattern. The  
pathologicals follow recommendations contained in SMPTE RP 178–1996 regarding the test data used. The  
color bar pattern does not incorporate bandwidth limiting coding in the chroma and luma data when transitioning  
between the bars. For this reason, it may not be suitable for use as a visual test pattern or for input to video D-to-  
A conversion devices unless measures are taken to restrict the production of out-of-band frequency components.  
The TPG is operated by applying the code for the desired test pattern to D0 through D3 (D4 through D9 are  
00h). Since all parallel data inputs are equipped with an internal pull-down device, only those inputs D0 through  
D3 which require a logic-1 need be pulled high. Next, apply a 27 or 36 MHz signal, appropriate to the raster size  
desired, at the PCLK input and wait until the Lock_Detect output goes true indicating the VCO is locked on-  
frequency. Then, take TPG_Enable, pin 17, to a logic high. The serial test pattern data appears on the SDO  
outputs. TPG_Enable may be temporarily connected to the Lock_Detect output to automate TPG operation. The  
TPG mode is exited by taking TPG_Enable to a logic low. Table 1 gives device pin functions for this mode.  
Table 2 gives the available test patterns and selection codes.  
Figure 6. Built-In Self-Test Control Sequence  
Figure 7. Test Pattern Generator Control Sequence  
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Table 1. BIST and Test Pattern Generator Control  
Functions  
Pin  
3
Name  
D0  
Function  
TPG code input LSB  
TPG code input  
4
D1  
5
D2  
TPG code input  
6
D3  
TPG code input MSB  
TPG Enable, active high true  
17  
26  
TPG_EN  
Test_Out  
BIST Pass/Fail output. Pass=High (See text  
for timing requirements)  
Table 2. Component Video Test Pattern Selection(1)  
Standard  
NTSC  
NTSC  
NTSC  
NTSC  
PAL  
Frame  
4x3  
Test Pattern  
D3  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
D2  
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
D1  
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
D0  
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Flat-field black  
4x3  
PLL pathological  
4x3  
EQ pathological  
4x3  
Color bars, 75%, 8-bars (modified, see text), BIST  
Flat-field black  
4x3  
PAL  
4x3  
PLL pathological, BIST  
EQ pathological  
PAL  
4x3  
PAL  
4x3  
Color bars, 75%, 8-bars (modified, see text)  
Flat-field black  
NTSC  
NTSC  
NTSC  
NTSC  
PAL  
16x9  
16x9  
16x9  
16x9  
16x9  
16x9  
16x9  
16x9  
PLL pathological  
EQ pathological  
Color bars, 75%, 8-bars (modified, see text)  
Flat-field black  
PAL  
PLL pathological  
PAL  
EQ pathological  
PAL  
Color bars, 75%, 8-bars (modified, see text)  
(1) D9 through D4 = 0 (binary)  
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PIN DESCRIPTIONS(1)  
Pin #  
1
Name  
Description  
VDD  
Positive power supply input (digital logic)  
Positive power supply input (digital logic)  
Parallel data input/Test pattern select (LSB)  
Parallel data input/Test pattern select  
Parallel data input/Test pattern select  
Parallel data input/Test pattern select (MSB)  
Parallel data input  
2
VDD  
3
D0  
4
D1  
5
D2  
6
D3  
7
D4  
8
D5  
Parallel data input  
9
D6  
Parallel data input  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
D7  
Parallel data input  
D8  
Parallel data input  
D9  
Parallel data input  
PCLK  
Lock Detect  
VSSO  
Parallel clock input  
VCO Lock Detect output (high-true)  
Negative power supply input (PLL supply)  
Positive power supply input (PLL supply)  
Test Pattern Generator (TPG) Enable input (high-true)  
Negative power supply input (PLL digital supply)  
Output driver level control  
VDDO  
TPG_EN  
VSSOD  
RREF  
VDDOD  
VSSSD  
SDO  
Positive power supply input (PLL digital supply)  
Negative power supply input (Output driver)  
Serial data true output  
SDO  
Serial data complement output  
VDDSD  
Sync Detect Enable  
Test_Out  
VSS  
Positive power supply input (Output driver)  
Parallel data sync detection enable input (low true)  
BIST Pass/Fail output  
Negative power supply input (digital logic)  
Negative power supply input (digital logic)  
VSS  
(1) All CMOS/TTL inputs have internal pull-down devices.  
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APPLICATION INFORMATION  
A typical application circuit for the CLC020 is shown in Figure 8. This circuit demonstrates the capabilities of the  
CLC020 and allows its evaluation in a variety of configurations. An assembled demonstration board with more  
comprehensive evaluation options is available, part number SD020EVK. The board may be ordered through any  
of Texas Instruments's sales offices. Complete circuit board layouts and schematics, for the SD020EVK are  
available on Texas Instruments' WEB site in the application information for this device.  
APPLICATION CIRCUIT  
Figure 8. Typical Application Circuit  
Several different input and output drive and loading options can be constructed on the SD020EVK application  
circuit board, Figure 9. Pin headers are provided for input cabling and control signal access. The appropriate  
value resistor packs, 220 and 330for TTL or 50for signal sources requiring such loading, should be installed  
at RP1-4 before applying input signals.  
The board's outputs may be DC interfaced to PECL inputs by first installing 124resistors at R1B and R2B,  
changing R1A and R2A to 187and replacing C1 and C2 with short circuits. The PECL inputs should be directly  
connected to J1 and J2 without cabling. If 75cabling is used to connect the CLC020 to the PECL inputs, the  
voltage dividers used on the CLC020 outputs must be removed and re-installed on the circuit board where the  
PECL device is mounted. This will provide correct termination for the cable and biasing for both the CLC020's  
outputs and the PECL inputs. It is most important to note that a 75or equivalent DC loading (measured with  
respect to the negative supply rail) must always be installed at both of the CLC020's SDO outputs to obtain  
proper signal levels from device. When using 75Thevenin-equivalent load circuits, the DC bias applied to the  
SDO outputs should not exceed +3V with respect to the negative supply rail. Serial output levels should be  
reduced to 400 mVp-p by changing RREF to 3.4 k.  
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The Test Out output is intended for monitoring by equipment presenting high impedance loading (>500). When  
monitoring the Lock Detect output, the attached monitoring circuit should present a DC resistance greater than 5  
kso that Lock Detect indicator operation is not affected.  
Connect LOCK DETECT to TPG ENABLE for test pattern generator function.  
Remove RP1 & RP3 and replace RP2 & RP4 with 50resistor packs for coax interfacing.  
Install RP1-4 when using ribbon cable for input interfacing.  
This board is designed for use with TTL power supplies only.  
For optional ECL compatible load: R1A = R2A = 187; R1B = R2B = 124.  
All resistances & impedances in Ohms. Values with 3 significant digits are 1%; with 2 digits 5%.  
Figure 9. SD020EVK Schematic Diagram  
MEASURING JITTER  
The test method used to obtain the timing jitter value given in the AC Electrical Specification table is based on  
procedures and equipment described in SMPTE RP 192-1996. The recommended practice discusses several  
methods and indicator devices. An FFT method performed by standard video test equipment was used to obtain  
the data given in this data sheet. As such, the jitter characteristics (or jitter floor) of the measurement equipment,  
particularly the measurement analyzer, become integral to the resulting jitter value. The method and equipment  
were chosen so that the test can be easily duplicated by the design engineer using most standard digital video  
test equipment. In so doing, similar results should be achieved. The intrinsic jitter floor of the CLC020's PLL is  
approximately 25% of the typical jitter given in the electrical specifications. In production, device jitter is  
measured on automatic IC test equipment (ATE) using a different method compatible with that equipment. Jitter  
measured using this ATE yields values approximately 50% of those obtained using the video test equipment.  
12  
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SNLS046E FEBRUARY 2000REVISED APRIL 2013  
The jitter test setup used to obtain values quoted in the data sheet consists of:  
Texas Instruments SD020EVK, CLC020 evaluation kit  
Tektronix TG2000 signal generation platform with DVG1 option  
Tektronix VM700T Option 1S Video Measurement Set  
Tektronix TDS 794D, Option C2 oscilloscope  
Tektronix P6339A passive probe  
75 Ohm coaxial cable, 3ft., Belden 8281 or RG59 (2 required)  
ECL-to-TTL/CMOS level converter/amplifier, Figure 11  
Apply the black-burst reference clock from the TG2000 signal generator's BG1 module 27MHz clock output to the  
level converter input. The clock amplitude converter schematic is shown in Figure 10. Adjust the input bias  
control to give a 50% duty cycle output as measured on the oscilloscope/probe system. Connect the level  
translator to the SD020EVK board, connector P1, PCLK pins (the outer-most row of pins is ground). Configure the  
SD020EVK to operate in the NTSC colour bars, BIST mode. Configure the VM700T to make the jitter  
measurement in the jitter FFT mode at the frame rate with 1kHz filter bandwidth and Hanning window. Configure  
the setup as shown in Figure 10. Switch the test equipment on (from standby mode) and allow all equipment  
temperatures stabilize per manufacturer's recommendation. Measure the jitter value after allowing the  
instrument's reading to stabilize (about 1 minute). Consult the VM700T Video Measurement Set Option 1S Serial  
Digital Measurements User Manual (document number 071-0074-00) for details of equipment operation.  
The VM700T measurement system's jitter floor specification at 270Mbps is given as 200ps ±20% (100ps ±5%  
typical) of actual components from 50Hz to 1MHz and 200ps +60%, -30% of actual components from 1MHz to  
10MHz. To obtain the actual residual jitter of the CLC020, a root-sum-square adjustment of the jitter reading  
must be made to compensate for the measurement system's jitter floor specification. For example, if the jitter  
reading is 250ps, the CLC020 residual jitter is the square root of (2502 2002) = 150ps. The accuracy limits of  
the reading as given above apply.  
Figure 10. Jitter Test Circuit  
Figure 11. ECL-to-TTL/CMOS level converter/amplifer  
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CLC020  
SNLS046E FEBRUARY 2000REVISED APRIL 2013  
www.ti.com  
Figure 12. Jitter Plots  
PCB LAYOUT AND POWER SYSTEM BYPASS RECOMMENDATIONS  
Circuit board layout and stack-up for the CLC020 should be designed to provide noise-free power to the device.  
Good layout practice also will separate high frequency or high level inputs and outputs to minimize unwanted  
stray noise pickup, feedback and interference. Power system performance may be greatly improved by using thin  
dielectrics (4 to 10 mils) for power/ground sandwiches. This increases the intrinsic capacitance of the PCB power  
system which improves power supply filtering, especially at high frequencies, and makes the value and  
placement of external bypass capacitors less critical. External bypass capacitors should include both RF ceramic  
and tantalum electrolytic types. RF capacitors may use values in the range 0.01 µF to 0.1 µF. Tantalum  
capacitors may be in the range 2.2 µF to 10 µF. Voltage rating for tantalum capacitors should be at least 5× the  
power supply voltage being used. It is recommended practice to use two vias at each power pin of the CLC020  
as well as all RF bypass capacitor terminals. Dual vias reduce the interconnect inductance by up to half, thereby  
reducing interconnect inductance and extending the effective frequency range of the bypass components.  
14  
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CLC020  
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SNLS046E FEBRUARY 2000REVISED APRIL 2013  
The outer layers of the PCB may be flooded with additional VSS (ground) plane. These planes will improve  
shielding and isolation as well as increase the intrinsic capacitance of the power supply plane system. Naturally,  
to be effective, these planes must be tied to the VSS power supply plane at frequent intervals with vias. Frequent  
via placement also improves signal integrity on signal transmission lines by providing short paths for image  
currents which reduces signal distortion. The planes should be pulled back from all transmission lines and  
component mounting pads a distance equal to the width of the widest transmission line or the thickness of the  
dielectric separating the transmission line from the internal power or ground plane(s) whichever is greater. Doing  
so minimizes effects on transmission line impedances and reduces unwanted parasitic capacitances at  
component mounting pads.  
In especially noisy power supply environments, such as is often the case when using switching power supplies,  
separate filtering may be used at the CLC020's VCO and output driver power pins. The CLC020 was designed  
for this situation. The digital section, VCO and output driver power supply feeds are independent (see PIN  
DESCRIPTIONS table and Pinout Drawing for details). Supply filtering may take the form of L-section or pi-  
section, L-C filters in series with these VDD inputs. Such filters are available in a single package from several  
manufacturers. Despite being independent feeds, all device power supplies should be applied simultaneously as  
from a common source. The CLC020 is free from power supply latch-up caused by circuit-induced delays  
between the device's three separate power feed systems.  
REPLACING THE GENNUM GS9022  
The CLC020 is form-fit-function compatible with the Gennum GS9022. The CLC020 can improve the  
performance of GS9022 applications using the existing PCB layout with the removal of certain components or  
changes to component values. New layouts using the CLC020 will benefit from the greatly reduced ancilliary  
component count and more compact layout.  
The CLC020 does not require external VCO filtering components. The external VCO filtering components at pin  
17 of the GS9022 may remain connected to the CLC020 without complications. It is suggested that these be  
removed from the circuit board. The CLC020 uses pin 17 for its test pattern generator enable function. You will  
find the TPG function very useful when you make this change.  
Remove the COSC capacitor used by the GS9022 at pin 26. The CLC020 uses pin 26 as the BIST pass/fail  
indicator output. You may attach a LED as an indicator to this pin, if desired. LED current should be limited to 10  
mA maximum. The same LED type and current limiting resistor shown in Figure 9 at the Lock Detect output may  
be used for this indicator function.  
Remove any capacitor attached to pin 19. A capacitor attached to pin 19 will cause distortion of the output VOH  
level. The former data rate setting resistor, RVCO, at pin 19 now functions as the output level setting resistor,  
RREF. It must be changed to a 1.69 k, 1% value for correct output level setting.  
The input series resistors and the PCLK risetime filter capacitor used with the GS9022 are not needed for the  
CLC020. These components should be removed from the circuit board and the resistors replaced by short  
circuits (0resistors). These series resistors will increase input signal rise and fall times if left on the board.  
The CLC020 has current-mode serial cable driver outputs. These outputs have very high internal generator  
resistance as one would expect of a current source. Though these current-mode outputs can produce the  
equivalent drive voltages into the load, it is necessary to change and simplify the typical GS9022 output circuit  
normally recommended for that device. The output load resistors at pins 22 and 23 must be changed to 75Ω, 1%  
values. These resistors become the back-matching loads across which the CLC020's outputs develop drive  
voltage. The series back-matching resistors used on the GS9022 should be removed and replaced with short  
circuits. The risetime compensating capacitors across these resistors should be removed.  
Pin 28 on the CLC020 is VSS and must be connected to the negative supply or ground. On layouts designed to  
mount the GS9022, the series R-C network connected to this pin should be replaced by short circuits (0Ω  
resistors). The pull-up resistor connected to the Lock Detect output, pin 14, should be removed. It may be  
replaced by a LED and current limiting resistor connected to VSS if a visual lock indicator is desired.  
The CLC020 has an internal pull-down at the Sync Detect Enable input and may be left unconnected in SMPTE  
video-only applications.  
The CLC020 has independent power supply pins for the VCO, VSSO, pin 15 and VDDO, pin 16. The CLC020 has  
an output driver negative supply, VSSSD, at pin 21. The output driver positive supply, VDDSD, is pin 24 (as on the  
GS9022). On new layouts, additional power supply filtering may be added at these pins, if desired.  
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REVISION HISTORY  
Changes from Revision D (April 2013) to Revision E  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 15  
16  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
CLC020BCQ/NOPB  
ACTIVE  
PLCC  
FN  
28  
35  
RoHS & Green  
SN  
Level-2A-245C-4  
WEEK  
0 to 70  
CLC020BCQ  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Jan-2022  
TUBE  
*All dimensions are nominal  
Device  
Package Name Package Type  
FN PLCC  
Pins  
SPQ  
L (mm)  
W (mm)  
T (µm)  
B (mm)  
CLC020BCQ/NOPB  
28  
35  
466  
15  
14859  
7.62  
Pack Materials-Page 1  
PACKAGE OUTLINE  
FN0028A  
PLCC - 4.57 mm max height  
SCALE 1.000  
PLASTIC CHIP CARRIER  
.180 MAX  
[4.57]  
B
.450-.456  
[11.43-11.58]  
NOTE 3  
.020 MIN  
[0.51]  
A
(.008)  
[0.2]  
4
1
28  
5
25  
PIN 1 ID  
(OPTIONAL)  
.450-.456  
[11.43-11.58]  
NOTE 3  
.382-.438  
[9.71-11.12]  
11  
19  
12  
18  
.090-.120 TYP  
[2.29-3.04]  
28X .026-.032  
[0.66-0.81]  
C
SEATING PLANE  
.004 [0.1] C  
28X .013-.021  
[0.33-0.53]  
24X .050  
[1.27]  
.007 [0.18]  
C A B  
.485-.495  
[12.32-12.57]  
TYP  
4215153/B 05/2017  
NOTES:  
1. All linear dimensions are in inches. Any dimensions in brackets are in millimeters. Any dimensions in parenthesis are for reference only.  
Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. Dimension does not include mold protrusion. Maximum allowable mold protrusion .01 in [0.25 mm] per side.  
4. Reference JEDEC registration MS-018.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
FN0028A  
PLCC - 4.57 mm max height  
PLASTIC CHIP CARRIER  
SYMM  
1
(R.002 ) TYP  
[0.05]  
4
28  
28X (.094)  
[2.4]  
28X (.026 )  
[0.65]  
5
25  
SYMM  
(.429 )  
[10.9]  
24X (.050 )  
[1.27]  
19  
11  
12  
18  
(.429 )  
[10.9]  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE:6X  
.002 MIN  
[0.05]  
ALL AROUND  
.002 MAX  
[0.05]  
ALL AROUND  
EXPOSED METAL  
EXPOSED METAL  
METAL UNDER  
SOLDER MASK  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL  
SOLDER MASK  
DEFINED  
NON SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4215153/B 05/2017  
NOTES: (continued)  
5. Publication IPC-7351 may have alternate designs.  
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
FN0028A  
PLCC - 4.57 mm max height  
PLASTIC CHIP CARRIER  
SYMM  
1
(R.002 ) TYP  
[0.05]  
28X (.094)  
[2.4]  
4
28  
28X (.026 )  
[0.65]  
5
25  
SYMM  
(.429 )  
[10.9]  
24X (.050 )  
[1.27]  
11  
19  
12  
18  
(.429 )  
[10.9]  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
SCALE:6X  
4215153/B 05/2017  
NOTES: (continued)  
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
8. Board assembly site may have different recommendations for stencil design.  
www.ti.com  
IMPORTANT NOTICE AND DISCLAIMER  
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE  
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”  
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
standards, and any other safety, security, regulatory or other requirements.  
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an  
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license  
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