CY54FCT245ATLMB [TI]

8-Bit Transceiver; 8位收发器
CY54FCT245ATLMB
型号: CY54FCT245ATLMB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

8-Bit Transceiver
8位收发器

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中文:  中文翻译
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Data sheet acquired from Cypress Semiconductor Corporation.  
Data sheet modified to remove devices not offered.  
CY54/74FCT245T  
SCCS018 - May 1994 - Revised February 2000  
8-Bit Transceiver  
Functional Description  
Features  
Function, pinout, and drive compatible with FCT, and  
The FCT245T contains eight non-inverting bidirectional buff-  
ers with three-state outputs and is intended for bus oriented  
applications. For the FCT245T, current sinking capability is 64  
mA at the A and B ports.  
F logic  
• FCT-D speed at 3.8 ns max. (Com’l),  
FCT-C speed at 4.1 ns max. (Com’l),  
FCT-A speed at 4.6 ns max. (Com’l)  
• Reduced VOH (typically = 3.3V) versions of equivalent  
FCT functions  
• Edge-rate control circuitry for significantly improved  
noise characteristics  
• Power-off disable feature  
The Transmit/Receiver (T/R) input determines the direction of  
data flow through bidirectional transceiver. Transmit (Active  
HIGH) enables data from A ports to B ports. The output enable  
(OE), when HIGH, disables both the A and B ports by putting  
them in a High Z condition.  
The outputs are designed with a power-off disable feature to  
allow for live insertion of boards.  
• ESD > 2000V  
• Matched rise and fall times  
• Fully compatible with TTL input and output logic levels  
• Extended commercial range of 40˚C to +85˚C  
• Sink current  
Source current  
64 mA (Com’l), 48 mA (Mil)  
32 mA (Com’l), 12 mA (Mil)  
Logic Block Diagram  
Pin Configurations  
T/R  
OE  
A
0
B
0
DIP/SOIC/QSOP  
Top View  
LCC  
A
1
Top View  
T/R  
V
CC  
1
B
B
20  
1
2
A
0
OE  
2
3
4
5
6
19  
A
2
A
1
B
0
18  
17  
16  
7
6 5 4  
8
A
A
2
B
B
B
B
B
B
B
7
1
2
3
4
5
6
7
A
9
1
3
2
1
GND  
A
0
A
3
10  
11  
A
3
B
B
7
T/R  
A
4
15  
14  
B
3
12  
13  
V
CC  
20  
19  
6
5
A
5
7
B
OE  
A
4
A
6
8
13  
12  
11  
1516 17 18  
14  
A
7
9
B
B
4
5
GND  
10  
A
5
A
6
B
B
6
7
A
7
Function Table[1]  
OE  
L
T/R  
L
Operation  
B Data to Bus A  
A Data to Bus B  
High Z State  
L
H
H
X
Note:  
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care.  
Copyright © 2000, Texas Instruments Incorporated  
CY54/74FCT245T  
Maximum Ratings[2,3]  
Power Dissipation..........................................................0.5W  
Static Discharge Voltage............................................>2001V  
(per MIL-STD-883, Method 3015)  
(Above which the useful life may be impaired. For user  
guidelines, not tested.)  
Storage Temperature .....................................65°C to +150°C  
Operating Range  
Ambient Temperature with  
Power Applied..................................................65°C to +135°C  
Ambient  
Temperature  
Range  
Range  
VCC  
Supply Voltage to Ground Potential..................−0.5V to +7.0V  
DC Input Voltage .................................................−0.5V to +7.0V  
DC Output Voltage ..............................................−0.5V to +7.0V  
DC Output Current (Maximum Sink Current/Pin).......120 mA  
Commercial DT  
0°C to +70°C  
5V ± 5%  
5V ± 5%  
5V ± 10%  
Commercial T, AT, CT  
40°C to +85°C  
55°C to +125°C  
Military[4]  
All  
Electrical Characteristics Over the Operating Range  
Parameter  
Description  
Test Conditions  
VCC=Min., IOH=32 mA  
Min.  
2.0  
Typ.[5]  
Max.  
Unit  
V
VOH  
Output HIGH Voltage  
Com’l  
Com’l  
Mil  
VCC=Min., IOH=15 mA  
VCC=Min., IOH=12 mA  
VCC=Min., IOL=64 mA  
VCC=Min., IOL=48mA  
2.4  
3.3  
3.3  
0.3  
0.3  
V
2.4  
V
VOL  
Output LOW Voltage  
Com’l  
Mil  
0.55  
0.55  
V
V
VIH  
VIL  
VH  
VIK  
II  
Input HIGH Voltage  
Input LOW Voltage  
Hysteresis[6]  
2.0  
V
0.8  
V
All inputs  
0.2  
V
Input Clamp Diode Voltage  
Input HIGH Current  
Input HIGH Current  
Input LOW Current  
VCC=Min., IIN=18 mA  
VCC=Max., VIN=VCC  
VCC=Max., VIN=2.7V  
VCC=Max., VIN=0.5V  
0.7  
1.2  
5
V
µA  
µA  
µA  
mA  
µA  
IIH  
±1  
IIL  
±1  
IOS  
IOFF  
Output Short Circuit Current[7] VCC=Max., VOUT=0.0V  
60  
120  
225  
±1  
Power-Off Disable  
VCC=0V, VOUT=4.5V  
Capacitance[6]  
Parameter  
Description  
Typ.[5]  
Max.  
10  
Unit  
CIN  
Input Capacitance  
Output Capacitance  
5
9
pF  
pF  
COUT  
12  
Notes:  
2. Unless otherwise noted, these limits are over the operating free-air temperature range.  
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.  
4. TA is the “instant on” case temperature.  
5. Typical values are at VCC=5.0V, TA=+25˚C ambient.  
6. This parameter is specified but not tested.  
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample  
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of  
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter  
tests, IOS tests should be performed last.  
2
CY54/74FCT245T  
Power Supply Characteristics  
Parameter  
ICC  
Description  
Test Conditions  
Typ.[5]  
0.1  
Max.  
0.2  
Unit  
mA  
mA  
Quiescent Power Supply Current  
VCC=Max., VIN0.2V, VINVCC0.2V  
VCC=Max., VIN=3.4V,[8]  
f1=0, Outputs Open  
ICC  
Quiescent Power Supply Current  
(TTL inputs HIGH)  
0.5  
2.0  
ICCD  
Dynamic Power Supply Current[9]  
VCC=Max., One Input Toggling,  
50% Duty Cycle, Outputs Open,  
T/R or OE=GND and  
0.06  
0.7  
0.12  
1.4  
mA/MHz  
V
IN0.2V or VINVCC0.2V  
IC  
Total Power Supply Current[10]  
VCC=Max., 50% Duty Cycle, Outputs Open,  
One Bit Toggling at f1=10 MHz,  
T/R or OE=GND and  
mA  
V
IN0.2V or VINVCC0.2V  
VCC=Max., 50% Duty Cycle, Outputs Open,  
One Bit Toggling at f1=10 MHz,  
T/R or OE=GND and VIN=3.4V or VIN=GND  
1.2  
1.3  
3.4  
mA  
mA  
VCC=Max., 50% Duty Cycle, Outputs Open,  
Eight Bits Toggling at f1=2.5 MHz,  
T/R or OE=GND and  
2.6[11]  
V
IN0.2V or VINVCC0.2V  
VCC=Max., 50% Duty Cycle, Outputs Open,  
Eight Bits Toggling at f1=2.5 MHz,  
3.3  
10.6[11]  
mA  
T/R or OE=GND and VIN=3.4V or VIN=GND  
Notes:  
8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.  
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.  
10. IC  
IC  
=
=
=
=
=
=
=
=
=
=
IQUIESCENT + IINPUTS + IDYNAMIC  
ICC+ICCDHNT+ICCD(f0/2 + f1N1)  
Quiescent Current with CMOS input levels  
Power Supply Current for a TTL HIGH input (VIN=3.4V)  
Duty Cycle for TTL inputs HIGH  
ICC  
ICC  
DH  
NT  
ICCD  
f0  
Number of TTL inputs at DH  
Dynamic Current caused by an input transition pair (HLH or LHL)  
Clock frequency for registered devices, otherwise zero  
Input signal frequency  
f1  
N1  
Number of inputs changing at f1  
All currents are in milliamps and all frequencies are in megahertz.  
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.  
3
CY54/74FCT245T  
Switching Characteristics Over the Operating Range  
FCT245T  
FCT245AT  
Military Commercial  
Min.[12] Max. Min.[12] Max. Min.[12] Max. Min.[12] Max.  
Military  
Commercial  
Fig.  
Parameter  
Description  
Unit  
No.[13]  
tPLH  
tPHL  
Propagation Delay  
A to B or B to A  
1.5  
1.5  
1.5  
7.5  
1.5  
1.5  
1.5  
7.0  
9.5  
7.5  
1.5  
1.5  
1.5  
4.9  
6.5  
6.0  
1.5  
1.5  
1.5  
4.6  
6.2  
5.0  
ns  
1, 3  
tPZH  
tPZL  
Output Enable Time  
OE or T/R to A or B  
10.0  
10.0  
ns  
ns  
1, 7, 8  
1, 7, 8  
tPHZ  
tPLZ  
Output Disable Time  
OE or T/R to A or B  
Switching Characteristics Over the Operating Range (continued)  
FCT245CT  
FCT245DT  
Military  
Commercial  
Commercial  
Fig.  
Parameter  
Description  
Propagation Delay  
A to B or B to A  
Min.[12] Max. Min.[12] Max. Min.[12] Max.  
Unit  
No.[13]  
tPLH  
tPHL  
1.5  
1.5  
1.5  
4.5  
6.2  
5.2  
1.5  
1.5  
1.5  
4.1  
5.8  
4.8  
1.5  
1.5  
1.5  
3.8  
5.0  
4.3  
ns  
ns  
ns  
1, 3  
tPZH  
tPZL  
Output Enable Time  
OE or T/R to A or B  
1, 7, 8  
1, 7, 8  
tPHZ  
tPLZ  
Output Disable Time  
OE or T/R to A or B  
Ordering Information  
Speed  
(ns)  
Package  
Name  
Operating  
Range  
Ordering Code  
Package Type  
3.8  
CY74FCT245DTQCT  
CY74FCT245DTSOC/SOCT  
CY74FCT245CTQCT  
CY74FCT245CTSOC/SOCT  
CY54FCT245CTDMB  
CY54FCT245CTLMB  
CY74FCT245ATPC  
Q5  
S5  
20-Lead (150-Mil) QSOP  
Commercial  
Commercial  
Military  
20-Lead (300-Mil) Molded SOIC  
20-Lead (150-Mil) QSOP  
4.1  
4.5  
4.6  
Q5  
S5  
20-Lead (300-Mil) Molded SOIC  
20-Lead (300-Mil) CerDIP  
D6  
L61  
P5  
20-Square Leadless Chip Carrier  
20-Lead (300-Mil) Molded DIP  
20-Lead (150-Mil) QSOP  
Commercial  
CY74FCT245ATQCT  
CY74FCT245ATSOC/SOCT  
CY54FCT245ATDMB  
CY54FCT245ATLMB  
CY74FCT245TQCT  
Q5  
S5  
20-Lead (300-Mil) Molded SOIC  
20-Lead (300-Mil) CerDIP  
4.9  
7.0  
D6  
L61  
Q5  
S5  
Military  
20-Square Leadless Chip Carrier  
20-Lead (150-Mil) QSOP  
Commercial  
Military  
CY74FCT245TSOC/SOCT  
CY54FCT245TDMB  
20-Lead (300-Mil) Molded SOIC  
20-Lead (300-Mil) CerDIP  
7.5  
D6  
L61  
CY54FCT245TLMB  
20-Square Leadless Chip Carrier  
Notes:  
12. Minimum limits are specified but not tested on Propagation Delays.  
13. See “Parameter Measurement Information” in the General Information section.  
Document #: 3800318B  
4
CY54/74FCT245T  
Package Diagrams  
20-Lead (300-Mil) CerDIP D6  
MILSTD1835 D8 Config.A  
20-Pin Square Leadless Chip Carrier L61  
MILSTD1835 C2A  
20-Lead (300-Mil) Molded DIP P5  
5
CY54/74FCT245T  
Package Diagrams (continued)  
20-Lead Quarter Size Outline Q5  
20-Lead (300-Mil) Molded SOIC S5  
6
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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