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CY74FCT16244CTPVCR [TI]

FCT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, PDSO48, 0.300 INCH, 0.635 MM PITCH, GREEN, PLASTIC, SSOP-48;
CY74FCT16244CTPVCR
型号： CY74FCT16244CTPVCR
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

FCT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, PDSO48, 0.300 INCH, 0.635 MM PITCH, GREEN, PLASTIC, SSOP-48

驱动 光电二极管 输出元件 逻辑集成电路
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1CY74FCT16444T/2  
H244T  
Data sheet acquired from Cypress Semiconductor Corporation.  
Data sheet modified to remove devices not offered.  
CY74FCT16244T  
CY74FCT162244T  
CY74FCT162H244T  
SCCS028B - December 1987 - Revised September 2001  
16-Bit Buffers/Line Drivers  
Features  
Functional Description  
• Ioff supports partial-power-down mode operation  
• Edge-rate control circuitry for significantly improved  
noise characteristics  
• Typical output skew < 250 ps  
• ESD > 2000V  
• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)  
packages  
These 16-bit buffers/line drivers are designed for use in  
memory driver, clock driver, or other bus interface applications,  
where high-speed and low power are required. With  
flow-through pinout and small shrink packaging board layout  
is simplified. The three-state controls are designed to allow  
4-bit, 8-bit or combined 16-bit operation.  
This device is fully specified for partial-power-down  
applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device  
when it is powered down.  
• Industrial temperature range of –40˚C to +85˚C  
• VCC = 5V ± 10%  
CY74FCT16244T Features:  
The CY74FCT16244T is ideally suited for driving  
high-capacitance loads and low-impedance backplanes.  
• 64 mA sink current, 32 mA source current  
• Typical VOLP (ground bounce)  
<1.0V at VCC = 5V, TA = 25˚C  
The CY74FCT162244T has 24-mA balanced output drivers  
with current limiting resistors in the outputs. This reduces the  
need for external terminating resistors and provides for mini-  
mal undershoot and reduced ground bounce. The  
CY74FCT162244T is ideal for driving transmission lines.  
CY74FCT162244T Features:  
• Balanced output drivers: 24 mA  
• Reduced system switching noise  
The CY74FCT162H244T is a 24-mA balanced output part that  
has “bus hold” on the data inputs. The device retains the in-  
put’s last state whenever the input goes to high impedance.  
This eliminates the need for pull-up/down resistors and pre-  
vents floating inputs.  
• Typical VOLP (ground bounce)  
<0.6V at VCC = 5V, TA= 25˚C  
CY74FCT162H244T Features:  
• Bus hold on data inputs  
• Eliminates the need for external pull-up or pull-down  
resistors  
Logic Block Diagrams CY74FCT16244T, CY74FCT162244T,  
CY74FCT162H244T  
Pin Configuration  
SSOP/TSSOP  
Top View  
OE  
OE  
3
1
1
2
3
4
48  
47  
46  
OE  
Y
OE  
1
2
1
1
A
1
1
1
A
A
3
1
1
1
1
1
Y
Y
3
1
1
1
1
1
Y
2
A
2
1
GND  
Y
GND  
A
45  
44  
43  
A
2
A
2
3
3
16244T  
162244T  
Y
2
Y
2
5
3
3
1
1
3
1
1
3
Y
4
A
4
6
162H244T  
V
CC  
V
CC  
42  
7
A
3
A
3
Y
3
Y
3
Y
A
1
2
2
1
2
2
41  
8
Y
2
A
2
9
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
A
4
A
4
1
3
Y
4
Y
4
GND  
GND  
1
3
10  
11  
Y
A
3
2
2
3
3
3
2
2
3
3
FCT16244–1  
FCT16244–2  
Y
4
A
4
12  
13  
Y
1
A
1
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
Y
2
A
2
OE  
OE  
4
2
GND  
GND  
Y
A
3
3
3
3
3
A
A
1
2
1
4
4
4
Y
Y
4
1
2
2
2
1
Y
4
A
4
3
V
V
CC  
CC  
Y
A
1
30  
29  
28  
27  
26  
25  
A
2
4
1
4
4
A
2
2
Y
Y
2
2
4
4
Y
2
A
2
4
GND  
Y
GND  
A
A
3
A
2
2
3
Y
Y
3
3
4
4
3
4
3
Y
4
A
4
3
4
OE  
OE  
4
A
4
A
4
4
Y
Y
4
2
4
4
FCT16244–3  
FCT16244–4  
FCT16244–5  
Copyright © 2001, Texas Instruments Incorporated  
CY74FCT16244T  
CY74FCT162244T  
CY74FCT162H244T  
Maximum Ratings [3,4]  
Pin Description  
(Above which the useful life may be impaired. For user  
guidelines, not tested.)  
Name  
Description  
OE  
A
Three-State Output Enable Inputs (Active LOW)  
Data Inputs[1]  
Storage Temperature................................. –55°C to +125°C  
Ambient Temperature with  
Power Applied............................................. –55°C to +125°C  
Y
Three-State Outputs  
DC Input Voltage ........................................... –0.5V to +7.0V  
DC Output Voltage......................................... –0.5V to +7.0V  
Function Table[2]  
DC Output Current  
(Maximum Sink Current/Pin) ........................–60 to +120 mA  
Inputs  
Outputs  
Power Dissipation..........................................................1.0W  
OE  
L
A
L
Y
L
Static Discharge Voltage............................................>2001V  
(per MIL-STD-883, Method 3015)  
L
H
X
H
Z
Ordering Range  
H
Ambient  
Range  
Industrial  
Temperature  
VCC  
– 40°C to +85°C  
5V ± 10%  
Notes:  
1. On CY74FCT162H244T these pins have “bus hold.”  
2. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Importance.  
3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range.  
4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.  
Electrical Characteristics Over the Operating Range  
Parameter  
VIH  
Description  
Input HIGH Voltage  
Test Conditions  
Min.  
Typ.[5]  
Max.  
Unit  
V
2.0  
VIL  
VH  
VIK  
IIH  
Input LOW Voltage  
Input Hysteresis[6]  
0.8  
V
100  
mV  
V
Input Clamp Diode Voltage  
Input HIGH Current  
VCC=Min., IIN=–18 mA  
VCC=Max., VI=VCC  
–0.7  
–1.2  
±1  
Standard  
Bus Hold  
Standard  
Bus Hold  
µA  
±100  
±1  
IIL  
Input LOW Current  
VCC=Max., VI=GND  
µA  
µA  
µA  
±100  
IBBH  
IBBL  
Bus Hold Sustain Current on Bus Hold Input[7]  
VCC=Min.  
VI=2.0V  
VI=0.8V  
–50  
+50  
IBHHO  
IBHLO  
Bus Hold Overdrive Current on Bus Hold Input[7] VCC=Max., VI=1.5V  
TBD  
±1  
mA  
µA  
µA  
IOZH  
High Impedance Output Current  
(Three-State Output pins)  
VCC=Max., VOUT=2.7V  
VCC=Max., VOUT=0.5V  
IOZL  
High Impedance Output Current  
(Three-State Output pins)  
±1  
IOS  
IO  
Short Circuit Current[8]  
Output Drive Current[8]  
Power-Off Disable  
VCC=Max., VOUT=GND  
VCC=Max., VOUT=2.5V  
VCC=0V, VOUT≤4.5V[9]  
–80  
–50  
–140  
–200  
–180  
±1  
mA  
mA  
µA  
IOFF  
2
CY74FCT16244T  
CY74FCT162244T  
CY74FCT162H244T  
Output Drive Characteristics for CY74FCT16244T  
Parameter  
VOH  
Description  
Test Conditions  
VCC=Min., IOH=–3 mA  
VCC=Min., IOH=–15 mA  
VCC=Min., IOH=–32 mA  
VCC=Min., IOL=64 mA  
Min.  
2.5  
Typ.[5]  
3.5  
Max.  
Unit  
V
Output HIGH Voltage  
2.4  
3.5  
V
2.0  
3.0  
V
VOL  
Output LOW Voltage  
0.2  
0.55  
V
Output Drive Characteristics for CY74FCT162244T, CY74FCT162H244T  
Parameter  
IODL  
IODH  
VOH  
Description  
Output LOW Current[8]  
Output HIGH Current[8]  
Output HIGH Voltage  
Output LOW Voltage  
Test Conditions  
VCC=5V, VIN=VIH or VIL, VOUT=1.5V  
VCC=5V, VIN=VIH or VIL, VOUT=1.5V  
VCC=Min., IOH=–24 mA  
Min.  
60  
Typ.[5]  
Max.  
150  
Unit  
mA  
mA  
V
115  
–115  
3.3  
–60  
2.4  
–150  
VOL  
VCC=Min., IOL=24 mA  
0.3  
0.55  
V
Notes:  
5. Typical values are at VCC=5.0V, TA = +25˚C ambient.  
6. This parameter is specified but not tested.  
7. Pins with bus hold are described in Pin Description.  
8. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample  
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting  
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter  
tests, IOS tests should be performed last.  
9. Tested at +25˚C.  
3
CY74FCT16244T  
CY74FCT162244T  
CY74FCT162H244T  
Capacitance[6](TA = +25˚C, f = 1.0 MHz)  
Parameter  
CIN  
Description  
Input Capacitance  
Output Capacitance  
Test Conditions  
Test Conditions  
Typ.[5]  
4.5  
Max.  
6.0  
Unit  
pF  
VIN = 0V  
COUT  
VOUT = 0V  
5.5  
8.0  
pF  
Power Supply Characteristics  
Parameter  
Description  
Typ.[5]  
Max.  
Unit  
ICC  
Quiescent Power Supply Current VCC=Max.  
V
IN≤0.2V,  
5
500  
µA  
VIN≤VCC-0.2V  
∆ICC  
Quiescent Power Supply Current VCC=Max.  
(TTL inputs HIGH)  
VIN=3.4V[10]  
0.5  
60  
1.5  
mA  
ICCD  
Dynamic Power Supply  
Current[11]  
VCC=Max.,OneInputToggling, VIN=VCC or  
50% Duty Cycle, Outputs  
Open, OE=GND  
100  
µA/MHz  
VIN=GND  
IC  
Total Power Supply Current[12]  
VCC=Max., f1=10 MHz,  
50% Duty Cycle, Outputs  
Open, One Bit Toggling,  
OE=GND  
VIN=VCC or  
VIN=GND  
0.6  
0.9  
2.4  
6.4  
1.5  
2.3  
mA  
mA  
mA  
mA  
VIN=3.4V or  
VIN=GND  
VCC=Max., f1=2.5 MHz, 50% VIN=VCC or  
Duty Cycle, Outputs Open, Six- VIN=GND  
teen Bits Toggling,  
VIN=3.4V or  
OE=GND  
4.5[13]  
16.5[13]  
VIN=GND  
Notes:  
10. Per TTL driven input (VIN = 3.4V); all other inputs at VCC or GND.  
11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.  
12. IC=IQUIESCENT + IINPUTS + IDYNAMIC  
IC  
=
=
=
=
=
=
=
=
=
ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)  
ICC  
ICC  
DH  
NT  
ICCD  
f0  
Quiescent Current with CMOS input levels  
Power Supply Current for a TTL HIGH input (VIN=3.4V)  
Duty Cycle for TTL inputs HIGH  
Number of TTL inputs at DH  
Dynamic Current caused by an input transition pair (HLH or LHL)  
Clock frequency for registered devices, otherwise zero  
Input signal frequency  
f1  
N1  
Number of inputs changing at f1  
All currents are in milliamps and all frequencies are in megahertz.  
13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.  
4
CY74FCT16244T  
CY74FCT162244T  
CY74FCT162H244T  
S
Switching Characteristics Over the Operating Range[14]  
CY74FCT16244AT  
CY74FCT162244AT  
CY74FCT162H244AT  
CY74FCT16244T  
CY74FCT162244T  
Parameter  
Description  
Min.  
Max.  
Min.  
Max.  
Unit  
Fig. No.[15]  
tPLH  
tPHL  
Propagation Delay Data to Output  
1.5  
6.5  
1.5  
4.8  
ns  
1, 3  
tPZH  
tPZL  
Output Enable Time  
Output Disable Time  
Output Skew[16]  
1.5  
1.5  
8.0  
7.0  
0.5  
1.5  
1.5  
6.2  
5.6  
0.5  
ns  
ns  
ns  
1, 7, 8  
1, 7, 8  
—
tPHZ  
tPLZ  
tSK(O)  
Switching Characteristics Over the Operating Range[14] (continued)  
CY74FCT16244CT  
CY74FCT162244CT  
CY74FCT162H244CT  
Parameter  
Description  
Propagation Delay Data to Output  
Min.  
Max.  
Unit  
Fig. No.[15]  
tPLH  
tPHL  
1.5  
4.1  
ns  
1, 3  
tPZH  
tPZL  
Output Enable Time  
Output Disable Time  
Output Skew[16]  
1.5  
1.5  
5.8  
5.2  
0.5  
ns  
ns  
ns  
1, 7, 8  
1, 7, 8  
—
tPHZ  
tPLZ  
tSK(O)  
Notes:  
14. Minimum limits are specified but not tested on Propagation Delays.  
15. See “Parameter Measurement Information” in the General Information section.  
16. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.  
5
CY74FCT16244T  
CY74FCT162244T  
CY74FCT162H244T  
Ordering Information CY74FCT16244  
Speed  
Package  
Name  
Operating  
(ns)  
Ordering Code  
CY74FCT16244CTPACT  
CY74FCT16244CTPVC/PVCT  
CY74FCT16244ATPACT  
CY74FCT16244ATPVC/PVCT  
CY74FCT16244TPACT  
Package Type  
Range  
4.1  
Z48  
O48  
Z48  
O48  
Z48  
O48  
48-Lead (240-Mil) TSSOP  
48-Lead (300-Mil) SSOP  
48-Lead (240-Mil) TSSOP  
48-Lead (300-Mil) SSOP  
48-Lead (240-Mil) TSSOP  
48-Lead (300-Mil) SSOP  
Industrial  
4.8  
6.5  
Industrial  
Industrial  
CY74FCT16244TPVC/PVCT  
Ordering Information CY74FCT162244  
Speed  
Package  
Name  
Operating  
Range  
(ns)  
Ordering Code  
74FCT162244CTPACT  
CY74FCT162244CTPVC  
74FCT162244CTPVCT  
74FCT162244ATPACT  
CY74FCT162244ATPVC  
74FCT162244ATPVCT  
CY74FCT162244TPACT  
CY74FCT162244TPVC/PVCT  
Package Type  
4.1  
Z48  
O48  
O48  
Z48  
O48  
O48  
Z48  
O48  
48-Lead (240-Mil) TSSOP  
48-Lead (300-Mil) SSOP  
48-Lead (300-Mil) SSOP  
48-Lead (240-Mil) TSSOP  
48-Lead (300-Mil) SSOP  
48-Lead (300-Mil) SSOP  
48-Lead (240-Mil) TSSOP  
48-Lead (300-Mil) SSOP  
Industrial  
Industrial  
Industrial  
4.8  
6.5  
Ordering Information CY74FCT162H244  
Speed  
(ns)  
Package  
Operating  
Range  
Ordering Code  
74FCT162H244CTPVC/PVCT  
74FCT162H244ATPACT  
Name  
Package Type  
4.1  
4.8  
O48  
48-Lead (300-Mil) SSOP  
48-Lead (240-Mil) TSSOP  
Industrial  
Industrial  
Z48  
Document #: 38-00396-C  
6
CY74FCT16244T  
CY74FCT162244T  
CY74FCT162H244T  
Package Diagrams  
48-Lead Shrunk Small Outline Package O48  
48-Lead ThinShrunk SmallOutline Package Z48  
7
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
74FCT162244ATPACT  
74FCT162244ATPVCG4  
74FCT162244ATPVCT  
74FCT162244CTPACT  
74FCT162244CTPVCG4  
74FCT162244CTPVCT  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
TSSOP  
SSOP  
SSOP  
TSSOP  
SSOP  
SSOP  
DGG  
48  
48  
48  
48  
48  
48  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
FCT162244A  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DL  
DL  
25  
Green (RoHS  
& no Sb/Br)  
FCT162244A  
FCT162244A  
FCT162244C  
FCT162244C  
FCT162244C  
1000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
DGG  
DL  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
DL  
1000  
Green (RoHS  
& no Sb/Br)  
74FCT162244ETPACT  
74FCT162244ETPVCT  
74FCT162244TPACTE4  
OBSOLETE  
OBSOLETE  
ACTIVE  
TSSOP  
SSOP  
DGG  
DL  
48  
48  
48  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
-40 to 85  
TSSOP  
DGG  
2000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
FCT162244  
FCT162244  
FCT162244  
FCT162244  
FCT16244A  
FCT16244A  
FCT16244A  
FCT16244A  
FCT16244C  
FCT16244C  
74FCT162244TPACTG4  
74FCT162244TPVCG4  
74FCT162244TPVCTG4  
74FCT16244ATPACTE4  
74FCT16244ATPACTG4  
74FCT16244ATPVCG4  
74FCT16244ATPVCTG4  
74FCT16244CTPACTE4  
74FCT16244CTPACTG4  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
SSOP  
DGG  
DL  
48  
48  
48  
48  
48  
48  
48  
48  
48  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
Green (RoHS  
& no Sb/Br)  
SSOP  
DL  
1000  
2000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
SSOP  
DGG  
DGG  
DL  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
SSOP  
DL  
1000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
DGG  
DGG  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
74FCT16244CTPVCG4  
74FCT16244TPACTE4  
74FCT16244TPACTG4  
74FCT16244TPVCG4  
74FCT16244TPVCTG4  
74FCT162H244ATPACT  
74FCT162H244CTPVC  
ACTIVE  
SSOP  
TSSOP  
TSSOP  
SSOP  
DL  
48  
48  
48  
48  
48  
48  
48  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
FCT16244C  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DGG  
DGG  
DL  
2000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
FCT16244  
Green (RoHS  
& no Sb/Br)  
FCT16244  
Green (RoHS  
& no Sb/Br)  
FCT16244  
SSOP  
DL  
1000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
FCT16244  
TSSOP  
SSOP  
DGG  
DL  
Green (RoHS  
& no Sb/Br)  
FCT162H244A  
FCT162H244C  
FCT162H244C  
Green (RoHS  
& no Sb/Br)  
74FCT162H244CTPVCT  
74FCT162H244ETPAC  
74FCT162H244ETPACT  
74FCT162H244ETPVC  
74FCT162H244ETPVCT  
CY74FCT162244ATPVC  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
SSOP  
TSSOP  
TSSOP  
SSOP  
SSOP  
SSOP  
DL  
DGG  
DGG  
DL  
48  
48  
48  
48  
48  
48  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
Call TI  
Call TI  
Call TI  
Call TI  
DL  
Call TI  
Call TI  
DL  
25  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
FCT162244A  
FCT162244C  
CY74FCT162244CTPVC  
ACTIVE  
SSOP  
DL  
48  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
-40 to 85  
CY74FCT162244ETPAC  
CY74FCT162244ETPVC  
CY74FCT162244TPACT  
OBSOLETE  
OBSOLETE  
ACTIVE  
TSSOP  
SSOP  
DGG  
DL  
48  
48  
48  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
-40 to 85  
TSSOP  
DGG  
2000  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
FCT162244  
FCT162244  
FCT162244  
FCT16244A  
FCT16244A  
CY74FCT162244TPVC  
CY74FCT162244TPVCT  
CY74FCT16244ATPACT  
CY74FCT16244ATPVC  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
TSSOP  
SSOP  
DL  
DL  
48  
48  
48  
48  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
1000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
DGG  
DL  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
CY74FCT16244ATPVCT  
CY74FCT16244CTPACT  
CY74FCT16244CTPVC  
ACTIVE  
SSOP  
TSSOP  
SSOP  
DL  
48  
48  
48  
1000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
FCT16244A  
ACTIVE  
ACTIVE  
DGG  
DL  
2000  
25  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
FCT16244C  
FCT16244C  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
CY74FCT16244ETPAC  
CY74FCT16244ETPACT  
CY74FCT16244ETPVC  
CY74FCT16244ETPVCT  
CY74FCT16244TPACT  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
TSSOP  
TSSOP  
SSOP  
DGG  
DGG  
DL  
48  
48  
48  
48  
48  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
Call TI  
Call TI  
SSOP  
DL  
Call TI  
Call TI  
TSSOP  
DGG  
2000  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
FCT16244  
CY74FCT16244TPVC  
CY74FCT16244TPVCT  
FCT162244ATPACTE4  
FCT162244ATPACTG4  
FCT162244ATPVCTG4  
FCT162244CTPACTE4  
FCT162244CTPACTG4  
FCT162244CTPVCTG4  
FCT162H244ATPACTE4  
FCT162H244ATPACTG4  
FCT162H244CTPVCG4  
FCT162H244CTPVCTG4  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
DL  
DL  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Call TI  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Call TI  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
FCT16244  
1000  
2000  
2000  
1000  
2000  
2000  
1000  
2000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
FCT16244  
TSSOP  
TSSOP  
SSOP  
DGG  
DGG  
DL  
Green (RoHS  
& no Sb/Br)  
FCT162244A  
FCT162244A  
FCT162244A  
FCT162244C  
FCT162244C  
FCT162244C  
FCT162H244A  
FCT162H244A  
FCT162H244C  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
SSOP  
DGG  
DGG  
DL  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
SSOP  
DGG  
DGG  
DL  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
SSOP  
DL  
TBD  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 4  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
17-Aug-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
74FCT162244ATPACT TSSOP  
74FCT162244ATPVCT SSOP  
74FCT162244CTPACT TSSOP  
74FCT162244CTPVCT SSOP  
DGG  
DL  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
2000  
1000  
2000  
1000  
2000  
2000  
1000  
2000  
1000  
2000  
2000  
1000  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
24.4  
32.4  
24.4  
32.4  
24.4  
24.4  
32.4  
24.4  
32.4  
24.4  
24.4  
32.4  
8.6  
11.35 16.2  
8.6 15.8  
11.35 16.2  
15.8  
1.8  
3.1  
1.8  
3.1  
1.8  
1.8  
3.1  
1.8  
3.1  
1.8  
1.8  
3.1  
12.0  
16.0  
12.0  
16.0  
12.0  
12.0  
16.0  
12.0  
16.0  
12.0  
12.0  
16.0  
24.0  
32.0  
24.0  
32.0  
24.0  
24.0  
32.0  
24.0  
32.0  
24.0  
24.0  
32.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
DGG  
DL  
74FCT162H244ATPACT TSSOP  
CY74FCT162244TPACT TSSOP  
CY74FCT162244TPVCT SSOP  
CY74FCT16244ATPACT TSSOP  
CY74FCT16244ATPVCT SSOP  
CY74FCT16244CTPACT TSSOP  
CY74FCT16244TPACT TSSOP  
DGG  
DGG  
DL  
8.6  
8.6  
15.8  
15.8  
11.35 16.2  
8.6 15.8  
11.35 16.2  
DGG  
DL  
DGG  
DGG  
DL  
8.6  
8.6  
15.8  
15.8  
CY74FCT16244TPVCT  
SSOP  
11.35 16.2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
17-Aug-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
74FCT162244ATPACT  
74FCT162244ATPVCT  
74FCT162244CTPACT  
74FCT162244CTPVCT  
74FCT162H244ATPACT  
CY74FCT162244TPACT  
CY74FCT162244TPVCT  
CY74FCT16244ATPACT  
CY74FCT16244ATPVCT  
CY74FCT16244CTPACT  
CY74FCT16244TPACT  
CY74FCT16244TPVCT  
TSSOP  
SSOP  
DGG  
DL  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
2000  
1000  
2000  
1000  
2000  
2000  
1000  
2000  
1000  
2000  
2000  
1000  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
45.0  
55.0  
45.0  
55.0  
45.0  
45.0  
55.0  
45.0  
55.0  
45.0  
45.0  
55.0  
TSSOP  
SSOP  
DGG  
DL  
TSSOP  
TSSOP  
SSOP  
DGG  
DGG  
DL  
TSSOP  
SSOP  
DGG  
DL  
TSSOP  
TSSOP  
SSOP  
DGG  
DGG  
DL  
Pack Materials-Page 2  
MECHANICAL DATA  
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998  
DGG (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0,27  
0,17  
M
0,08  
0,50  
48  
25  
6,20  
6,00  
8,30  
7,90  
0,15 NOM  
Gage Plane  
0,25  
1
24  
0°–8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
48  
56  
64  
DIM  
A MAX  
12,60  
12,40  
14,10  
13,90  
17,10  
16,90  
A MIN  
4040078/F 12/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
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supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
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