CY74FCT16245ETPAC [TI]
16-Bit Transceivers; 16位收发器
| 型号： | CY74FCT16245ETPAC |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 16-Bit Transceivers |
| 文件： | 总17页 (文件大小：318K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1CY74FCT16445T/2
H245T
Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
SCCS026B - July 1994 - Revised September 2001
16-Bit Transceivers
Features
Functional Description
• Ioff supports partial-power-down mode operation
• Edge-rate control circuitry for significantly improved
noise characteristics
• Typical output skew < 250 ps
• ESD > 2000V
• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages
These 16-bit transceivers are designed for use in bidirectional
synchronous communication between two buses, where high
speed and low power are required. With the exception of the
CY74FCT16245T, these devices can be operated either as
two independent octals or a single 16-bit transceiver. Direction
of data flow is controlled by (DIR), the Output Enable (OE)
transfers data when LOW and isolates the buses when HIGH.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device
when it is powered down.
• Industrial temperature range of –40˚C to +85˚C
• VCC = 5V ± 10%
CY74FCT16245T Features:
The CY74FCT16245T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.
• 64 mA sink current, 32 mA source current
• Typical VOLP (ground bounce)<1.0V at VCC = 5V,
TA = 25˚C
The CY74FCT162245T has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for mini-
mal undershoot and reduced ground bounce. The
CY74FCT162245T is ideal for driving transmission lines.
CY74FCT162245T Features:
• Balanced output drivers: 24 mA
• Reduced system switching noise
• Typical VOLP (ground bounce) <0.6V at VCC = 5V,
The CY74FCT162H245T is a 24-mA balanced output part that
has bus hold on the data inputs. The device retains the input’s
last state whenever the input goes to high impedance. This
eliminates the need for pull-up/down resistors and prevents
floating inputs.
TA= 25˚C
CY74FCT162H245T Features:
• Bus hold on data inputs
• Eliminates the need for external pull-up or pull-down
resistors
Logic Block Diagrams CY74FCT16245T,CY74FCT162245T,
CY74FCT162H245T
Pin Configuration
SSOP/TSSOP
Top View
DIR
DIR
2
1
OE
OE
1
2
3
4
48
47
46
DIR
B
OE
1
2
1
1
1
1
A
1
1
1
1
2
A
A
1
1
1
2
B
A
2
GND
B
GND
A
45
44
43
42
41
B
B
B
B
1
1
2
2
1
5
6
7
8
9
1
1
3
4
1
3
A
A
2
1
1
2
2
2
B
A
4
1
V
CC
V
CC
1
2
2
16245T
162245T
B
A
5
1
1
5
6
1
1
A
3
A
3
162H245T
B
A
6
40
39
38
B
B
3
1
3
2
GND
GND
10
11
B
A
7
1
1
7
8
1
1
A
A
4
1
4
2
2
B
A
8
12
13
37
36
35
34
B
B
B
4
B
5
1
1
4
5
2
2
B
B
A
1
2
2
1
2
2
14
15
16
17
18
A
2
A
A
5
2
1
5
GND
GND
33
32
31
30
29
28
27
26
25
B
3
B
4
A
3
2
2
2
2
A
A
6
A
4
1
6
2
2
V
V
CC
CC
B
B
B
B
B
6
B
7
B
8
1
1
1
6
7
8
2
2
2
A
5
19
20
21
22
23
24
2
5
6
2
2
A
A
7
B
A
6
1
7
2
GND
B
GND
A
2
2
7
8
2
7
A
A
8
B
A
1
8
2
2
2
8
DIR
OE
2
FCT16245–3
FCT16245–1
FCT16245–2
Copyright © 2001, Texas Instruments Incorporated
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
Maximum Ratings[3, 4]
Pin Description
(Above which the useful life may be impaired. For user
guidelines, not tested.)
Name
Description
OE
DIR
A
Three-State Output Enable Inputs (Active LOW)
Storage Temperature ........................Com’l -55°C to +125°C
Direction Control
Ambient Temperature with
Power Applied....................................Com’l -55°C to +125°C
Inputs or Three-State Outputs[1]
Inputs or Three-State Outputs[1]
DC Input Voltage ........................................... –0.5V to +7.0V
DC Output Voltage......................................... –0.5V to +7.0V
B
Function Table[2]
DC Output Current
(Maximum Sink Current/Pin) ........................–60 to +120 mA
Inputs
Power Dissipation..........................................................1.0W
OE
L
DIR
L
Outputs
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Bus B Data to Bus A
Bus A Data to Bus B
High Z State
L
H
Operating Range
H
X
Ambient
Range
Industrial
Temperature
VCC
–40°C to +85°C
5V ± 10%
Notes:
1. On CY74FCT162H245T these pins have bus hold.
2. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Impedance.
3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range.
4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
Electrical Characteristics Over the Operating Range
Parameter
Description
Input HIGH Voltage
Test Conditions
Min.
Typ.[5]
Max.
Unit
V
VIH
VIL
VH
VIK
IIH
2.0
Input LOW Voltage
Input Hysteresis[6]
0.8
V
100
mV
V
Input Clamp Diode Voltage
Input HIGH Current
VCC=Min., IIN=–18 mA
VCC=Max., VI=VCC
–0.7
–1.2
±1
Standard
Bus Hold
Standard
Bus Hold
µA
±100
±1
IIL
Input LOW Current
VCC=Max., VI=GND
µA
µA
µA
±100
IBBH
IBBL
Bus Hold Sustain Current on Bus Hold Input[7] VCC=Min.
VI=2.0V
VI=0.8V
–50
+50
IBHHO
IBHLO
Bus Hold Overdrive Current on Bus Hold Input[7] VCC=Max., VI=1.5V
TBD
±1
mA
µA
µA
IOZH
High Impedance Output Current
(Three-State Output pins)
VCC=Max., VOUT=2.7V
VCC=Max., VOUT=0.5V
IOZL
High Impedance Output Current
(Three-State Output pins)
±1
IOS
IO
Short Circuit Current[8]
Output Drive Current[8]
Power-Off Disable
VCC=Max., VOUT=GND
VCC=Max., VOUT=2.5V
VCC=0V, VOUT≤4.5V[9]
–80
–50
–140
–200
–180
±1
mA
mA
µA
IOFF
2
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
Output Drive Characteristics for CY74FCT16245T
Parameter
Description
Test Conditions
VCC=Min., IOH=–3 mA
Min.
2.5
Typ.[5]
3.5
Max.
Unit
V
VOH
Output HIGH Voltage
VCC=Min., IOH=–15 mA
VCC=Min., IOH=–32 mA
VCC=Min., IOL=64 mA
2.4
3.5
V
2.0
3.0
V
VOL
Output LOW Voltage
0.2
0.55
V
Output Drive Characteristics for CY74FCT162245T, CY74FCT162H245T
Parameter
IODL
Description
Output LOW Current[8]
Output HIGH Current[8]
Output HIGH Voltage
Output LOW Voltage
Test Conditions
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
VCC=Min., IOH=–24 mA
Min.
60
Typ.[5]
115
Max.
150
Unit
mA
mA
V
IODH
–60
2.4
–115
3.3
–150
VOH
VOL
VCC=Min., IOL=24 mA
0.3
0.55
V
Notes:
5. Typical values are at VCC=5.0V, TA=+25˚C ambient.
6. This parameter is specified but not tested.
7. Pins with bus hold are described in Pin Description.
8. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
9. Tested at +25˚C.
Capacitance[6] (TA = +25˚C, f = 1.0 MHz)
Parameter
CIN
Description
Input Capacitance
Output Capacitance
Test Conditions
Typ.[5] Max.
Unit
pF
VIN = 0V
4.5
5.5
6.0
8.0
COUT
VOUT = 0V
pF
3
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
Power Supply Characteristics
Parameter
Description
Test Conditions
VIN<0.2V,
Typ.[5]
Max.
Unit
ICC
Quiescent Power Supply Current VCC=Max.
5
500
µA
VIN>VCC-0.2V
∆ICC
Quiescent Power Supply Current VCC=Max.
(TTL inputs HIGH)
VIN=3.4V[10]
0.5
60
1.5
mA
ICCD
Dynamic Power Supply
Current[11]
VCC=Max., One Input Toggling, VIN=VCC or
50% Duty Cycle, Outputs Open, VIN=GND
OE=DIR=GND
100
µA/MHz
IC
Total Power Supply Current[12]
VCC=Max., f1=10 MHz,
50% Duty Cycle, Outputs Open, VIN=GND
One Bit Toggling,
OE=DIR=GND
VIN=GND
VIN=VCC or
0.6
0.9
2.4
6.4
1.5
2.3
mA
mA
mA
mA
VIN=3.4V or
VCC=Max., f1=2.5 MHz, 50%
Duty Cycle, Outputs Open,
Sixteen Bits Toggling,
OE=DIR=GND
VIN=VCC or
VIN=GND
4.5[13]
16.5[13]
VIN=3.4V or
VIN=GND
Notes:
10. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
12. IC
IC
= IQUIESCENT + IINPUTS + IDYNAMIC
= ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
DH = Duty Cycle for TTL inputs HIGH
NT = Number of TTL inputs at DH
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
f0
f1
= Clock frequency for registered devices, otherwise zero
= Input signal frequency
N1 = Number of inputs changing at f1
All currents are in milliamps and all frequencies are in megahertz.
13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
4
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
]
Switching Characteristics Over the Operating Range[14]
74FCT16245T
74FCT162245T
74FCT16245AT
74FCT162245AT
74FCT162H245AT
Fig.
Parameter
tPLH
tPHL
Description
Min.
Max.
Min.
Max.
Unit
No.[15]
Propagation Delay Data to Output
A to B, B to A
1.5
7.0
1.5
4.5
ns
1, 3
1, 7, 8
1, 7, 8
1, 7, 8
1, 7, 8
—
tPZH
tPZL
Output Enable Time
OE to A or B
1.5
1.5
1.5
1.5
9.5
7.5
9.5
7.5
0.5
1.5
1.5
1.5
1.5
6.2
5.0
6.2
5.0
0.5
ns
ns
ns
ns
ns
tPHZ
tPLZ
Output Disable Time
OE to A or B
tPZH
tPZL
Output Enable Time
DIR to A or B
tPHZ
tPLZ
Output Disable Time
DIR to A or B
Output Skew[16]
tSK(O)
74FCT16245CT
74FCT162245CT
74FCT162H245CT
Fig.
Parameter
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
tPZH
tPZL
tPHZ
tPLZ
Description
Min.
Max.
Unit
No.[15]
Propagation Delay Data to Output
A to B, B to A
1.5
4.1
ns
1, 3
1, 7, 8
1, 7, 8
1, 7, 8
1, 7, 8
—
Output Enable Time
OE to A or B
1.5
1.5
1.5
1.5
5.8
4.8
5.8
4.8
0.5
ns
ns
ns
ns
ns
Output Disable Time
OE to A or B
Output Enable Time
DIR to A or B
Output Disable Time
DIR to A or B
Output Skew[16]
tSK(O)
Note:
14. Minimum limits are specified but not tested on Propagation Delays.
15. See “Parameter Measurement Information” in the General Information section.
16. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.
Ordering Information CY74FCT16245
Speed
(ns)
Package
Name
Operating
Range
Ordering Code
CY74FCT16245CTPACT
CY74FCT16245CTPVC/PVCT
CY74FCT16245ATPACT
CY74FCT16245ATPVC/PVCT
CY74FCT16245TPACT
Package Type
48-Lead (240-Mil) TSSOP
4.1
4.5
7.0
Z48
O48
Z48
O48
Z48
O48
Industrial
Industrial
Industrial
48-Lead (300-Mil) SSOP
48-Lead (240-Mil) TSSOP
48-Lead (300-Mil) SSOP
48-Lead (240-Mil) TSSOP
48-Lead (300-Mil) SSOP
CY74FCT16245TPVC/PVCT
5
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
Ordering Information CY74FCT162245
Speed
Package
Name
Operating
Range
(ns)
Ordering Code
CY74FCT162245CTPACT
CY74FCT162245CTPVC
74FCT162245CTPVCT
74FCT162245ATPACT
Package Type
48-Lead (240-Mil) TSSOP
4.1
Z48
O48
O48
Z48
O48
O48
Z48
O48
Industrial
Industrial
Industrial
48-Lead (300-Mil) SSOP
48-Lead (300-Mil) SSOP
48-Lead (240-Mil) TSSOP
48-Lead (300-Mil) SSOP
48-Lead (300-Mil) SSOP
48-Lead (240-Mil) TSSOP
48-Lead (300-Mil) SSOP
4.5
7.0
CY74FCT162245ATPVC
74FCT162245ATPVCT
CY74FCT162245TPACT
CY74FCT162245TPVC/PVCT
Ordering Information CY74FCT162H245
Speed
(ns)
Package
Operating
Range
Ordering Code
74FCT162H245CTPACT
CY74FCT162H245CTPVC
74FCT162H245CTPVCT
74FCT162H245ATPACT
CY74FCT162H245ATPVC
74FCT162H245ATPVCT
Name
Package Type
4.1
Z48
48-Lead (240-Mil) TSSOP
48-Lead (300-Mil) SSOP
48-Lead (300-Mil) SSOP
48-Lead (240-Mil) TSSOP
48-Lead (300-Mil) SSOP
48-Lead (300-Mil) SSOP
Industrial
O48
O48
Z48
4.5
Industrial
O48
O48
6
CY74FCT16245T/2245T
CY74FCT16445T/2H245T
Package Diagrams
48-Lead Shrunk Small Outline Package O48
7
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
Package Diagrams
48-Lead Thin Shrunk Small Outline Package Z48
8
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
74FCT162245ATPACT
74FCT162245ATPVCG4
74FCT162245ATPVCT
74FCT162245CTPACT
74FCT162245CTPVCG4
74FCT162245CTPVCT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
DGG
48
48
48
48
48
48
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
SSOP
TSSOP
SSOP
SSOP
DL
DL
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74FCT162245ETPACT
74FCT162245ETPVCT
74FCT162245TPACTE4
OBSOLETE TSSOP
DGG
DL
48
48
48
TBD
TBD
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OBSOLETE
ACTIVE
SSOP
TSSOP
DGG
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74FCT162245TPACTG4
74FCT162245TPVCG4
74FCT162245TPVCTG4
74FCT16245ATPACTE4
74FCT16245ATPACTG4
74FCT16245ATPVCG4
74FCT16245ATPVCTG4
74FCT16245CTPACTE4
74FCT16245CTPACTG4
74FCT16245CTPVCG4
74FCT16245CTPVCTG4
74FCT16245TPACTE4
74FCT16245TPACTG4
74FCT16245TPVCG4
74FCT16245TPVCTG4
74FCT162H245ATPACT
74FCT162H245ATPVC
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
SSOP
DGG
DL
48
48
48
48
48
48
48
48
48
48
48
48
48
48
48
48
48
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
SSOP
DGG
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
SSOP
DGG
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
SSOP
DGG
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
SSOP
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
74FCT162H245ATPVCT
74FCT162H245CTPACT
74FCT162H245CTPVC
74FCT162H245CTPVCT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
TSSOP
SSOP
SSOP
DL
DGG
DL
48
48
48
48
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74FCT162H245ETPAC
74FCT162H245ETPACT
74FCT162H245ETPVC
74FCT162H245ETPVCT
CY74FCT162245ATPVC
OBSOLETE TSSOP
OBSOLETE TSSOP
DGG
DGG
DL
48
48
48
48
48
TBD
TBD
TBD
TBD
Call TI
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OBSOLETE
OBSOLETE
ACTIVE
SSOP
SSOP
SSOP
DL
DL
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT162245CTPVC
ACTIVE
SSOP
DL
48
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT162245ETPAC
CY74FCT162245ETPVC
CY74FCT162245TPACT
OBSOLETE TSSOP
DGG
DL
48
48
48
TBD
TBD
Call TI
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OBSOLETE
ACTIVE
SSOP
TSSOP
DGG
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT162245TPVC
CY74FCT162245TPVCT
CY74FCT16245ATPACT
CY74FCT16245ATPVC
CY74FCT16245ATPVCT
CY74FCT16245CTPACT
CY74FCT16245CTPVC
CY74FCT16245CTPVCT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
TSSOP
SSOP
SSOP
TSSOP
SSOP
SSOP
DL
DL
48
48
48
48
48
48
48
48
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT16245ETPAC
CY74FCT16245ETPACT
CY74FCT16245ETPVC
CY74FCT16245ETPVCT
CY74FCT16245TPACT
OBSOLETE TSSOP
OBSOLETE TSSOP
DGG
DGG
DL
48
48
48
48
48
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
OBSOLETE
OBSOLETE
ACTIVE
SSOP
SSOP
DL
TSSOP
DGG
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT16245TPVC
CY74FCT16245TPVCT
FCT162245ATPACTE4
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
DL
DL
48
48
48
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
DGG
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
Orderable Device
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
FCT162245ATPACTG4
FCT162245ATPVCTG4
FCT162245CTPACTE4
FCT162245CTPACTG4
FCT162245CTPVCTG4
FCT162H245ATPACTE4
FCT162H245ATPACTG4
FCT162H245ATPVCG4
FCT162H245ATPVCTG4
FCT162H245CTPACTE4
FCT162H245CTPACTG4
FCT162H245CTPVCG4
FCT162H245CTPVCTG4
TSSOP
DGG
48
48
48
48
48
48
48
48
48
48
48
48
48
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
TSSOP
TSSOP
SSOP
DL
DGG
DGG
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
SSOP
DGG
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
SSOP
DGG
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
74FCT162245ATPACT TSSOP
74FCT162245ATPVCT SSOP
74FCT162245CTPACT TSSOP
74FCT162245CTPVCT SSOP
DGG
DL
48
48
48
48
48
48
48
48
48
48
48
48
48
48
48
48
2000
1000
2000
1000
2000
1000
2000
1000
2000
1000
2000
1000
2000
1000
2000
1000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
24.4
32.4
24.4
32.4
24.4
32.4
24.4
32.4
24.4
32.4
24.4
32.4
24.4
32.4
24.4
32.4
8.6
11.35
8.6
15.8
16.2
15.8
16.2
15.8
16.2
15.8
16.2
15.8
16.2
15.8
16.2
15.8
16.2
15.8
16.2
1.8
3.1
1.8
3.1
1.8
3.1
1.8
3.1
1.8
3.1
1.8
3.1
1.8
3.1
1.8
3.1
12.0
16.0
12.0
16.0
12.0
16.0
12.0
16.0
12.0
16.0
12.0
16.0
12.0
16.0
12.0
16.0
24.0
32.0
24.0
32.0
24.0
32.0
24.0
32.0
24.0
32.0
24.0
32.0
24.0
32.0
24.0
32.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
DGG
DL
11.35
8.6
74FCT162H245ATPACT TSSOP
74FCT162H245ATPVCT SSOP
74FCT162H245CTPACT TSSOP
74FCT162H245CTPVCT SSOP
CY74FCT162245TPACT TSSOP
CY74FCT162245TPVCT SSOP
CY74FCT16245ATPACT TSSOP
CY74FCT16245ATPVCT SSOP
CY74FCT16245CTPACT TSSOP
CY74FCT16245CTPVCT SSOP
CY74FCT16245TPACT TSSOP
DGG
DL
11.35
8.6
DGG
DL
11.35
8.6
DGG
DL
11.35
8.6
DGG
DL
11.35
8.6
DGG
DL
11.35
8.6
DGG
DL
CY74FCT16245TPVCT
SSOP
11.35
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
74FCT162245ATPACT
74FCT162245ATPVCT
74FCT162245CTPACT
74FCT162245CTPVCT
74FCT162H245ATPACT
74FCT162H245ATPVCT
74FCT162H245CTPACT
74FCT162H245CTPVCT
CY74FCT162245TPACT
CY74FCT162245TPVCT
CY74FCT16245ATPACT
CY74FCT16245ATPVCT
CY74FCT16245CTPACT
CY74FCT16245CTPVCT
CY74FCT16245TPACT
CY74FCT16245TPVCT
TSSOP
SSOP
DGG
DL
48
48
48
48
48
48
48
48
48
48
48
48
48
48
48
48
2000
1000
2000
1000
2000
1000
2000
1000
2000
1000
2000
1000
2000
1000
2000
1000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
41.0
49.0
41.0
49.0
41.0
49.0
41.0
49.0
41.0
49.0
41.0
49.0
41.0
49.0
41.0
49.0
TSSOP
SSOP
DGG
DL
TSSOP
SSOP
DGG
DL
TSSOP
SSOP
DGG
DL
TSSOP
SSOP
DGG
DL
TSSOP
SSOP
DGG
DL
TSSOP
SSOP
DGG
DL
TSSOP
SSOP
DGG
DL
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
0.0135 (0,343)
0.008 (0,203)
0.005 (0,13)
M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
0°–ā8°
1
24
0.040 (1,02)
0.020 (0,51)
A
Seating Plane
0.004 (0,10)
0.008 (0,20) MIN
PINS **
0.110 (2,79) MAX
28
48
0.630
56
DIM
0.380
(9,65)
0.730
A MAX
A MIN
(16,00) (18,54)
0.370
(9,40)
0.620
0.720
(15,75) (18,29)
4040048/E 12/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
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