CY74FCT163H952 [TI]

16-Bit Registered Transceivers; 16位寄存收发器
CY74FCT163H952
型号: CY74FCT163H952
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

16-Bit Registered Transceivers
16位寄存收发器

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1CY74FCT163952  
Data sheet acquired from Cypress Semiconductor Corporation.  
Data sheet modified to remove devices not offered.  
CY74FCT163952  
CY74FCT163H952  
SCCS048 - March 1997 - Revised March 2000  
16-Bit Registered Transceivers  
Features  
Functional Description  
• Low power, pin-compatible replacement for LCX and  
LPT families  
• 5V tolerant inputs and outputs  
These 16-bit registered transceivers are high-speed,  
low-power devices. 16-bit operation is achieved by connecting  
the control lines of the two 8-bit registered transceivers  
together. For data flow from bus A-to-B, CEAB must be LOW  
to allow data to be stored when CLKAB transitions from  
LOW-to-HIGH. The stored data will be present on the output  
when OEAB is LOW. Control of data from B-to-A is similar and  
is controlled by using the CEBA, CLKBA, and OEBA inputs.  
The outputs are 24-mA balanced output drivers with current  
limiting resistors to reduce the need for external terminating  
resistors and provide for minimal undershoot and reduced  
ground bounce.  
• 24 mA balanced drive outputs  
• Power-off disable outputs permits live insertion  
• Edge-rate control circuitry for reduced noise  
• FCT-C speed at 4.4 ns  
• Latch-up performance exceeds JEDEC standard no. 17  
• Typical output skew < 250 ps  
• Industrial temperature range of –40˚C to +85˚C  
• TSSOP (19.6-mil pitch) or SSOP (25-mil pitch)  
The CY74FCT163H952 has “bus hold” on the data inputs,  
which retains the input’s last state whenever the source driving  
the input goes to high impedance. This eliminates the need for  
pull-up/down resistors and prevents floating inputs.  
• TypicalV  
olp  
(groundbounce)performanceexceedsMil  
Std 883D  
• VCC = 2.7V to 3.6V  
• ESD (HBM) > 2000V  
CY74FCT163H952  
The CY74FCT163952 is designed with inputs and outputs  
capable of being driven by 5.0V buses, allowing its use in  
mixed voltage systems as a translator. The outputs are also  
designed with a power off disable feature enabling its use in  
applications requiring live insertion.  
• Bus hold on data inputs  
• Eliminates the need for external pull-up or pull-down  
resistors  
• Devices with bus hold are not recommended for trans-  
lating rail-to-rail CMOS signals to 3.3V logic levels  
Pin Configuration  
Logic Block Diagrams; CY74FCT163952, CY74FCT163H952  
SSOP/TSSOP  
Top View  
OEAB  
1
2
56  
55  
OEBA  
CLKBA  
1
1
1
CEBA  
CEBA  
2
2
1
CLKAB  
1
CEAB  
1
CEBA  
3
4
54  
53  
1
CLKBA  
OEAB  
CLKBA  
OEAB  
1
GND  
A
GND  
B
1
2
5
6
7
52  
51  
50  
1
1
1
1
CEAB  
CEAB  
1
2
B
2
A
1
1
2
V
V
CC  
CC  
A
CLKAB  
OEBA  
CLKAB  
OEBA  
2
1
2
B
3
8
9
49  
48  
1
3
1
A
B
4
1
1
4
1
B
5
A
5
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
1
C
C
1
A
A
2 1  
CE  
D
CE  
D
GND  
B
1
1
GND  
A
B
B
2
1
1
1
1
1
6
1
1
6
C
CE  
D
C
CE  
D
A
7
B
7
A
B
1 8  
1
8
A
B
2 1  
2
1
B
A
2
2
2
2
2
B
3
A
2
3
GND  
A
GND  
B
TO7 OTHERCHANNELS  
TO7 OTHERCHANNELS  
2
4
2
4
A
5
B
2 5  
2
B
A
2
6
2
6
V
CC  
V
CC  
B
7
A
2
2
2
7
B
8
A
24  
25  
26  
27  
28  
33  
32  
31  
30  
29  
2
8
GND  
GND  
CEBA  
2
CEAB  
2
CLKAB  
CLKBA  
OEBA  
2
2
2
OEAB  
2
Copyright © 2000, Texas Instruments Incorporated  
CY74FCT163952  
CY74FCT163H952  
Maximum Ratings[5, 6]  
Pin Description  
Name  
Description  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
OEAB  
OEBA  
CEAB  
CEBA  
CLKAB  
CLKBA  
A
A-to-B Output Enable Input (Active LOW)  
B-to-A Output Enable Input (Active LOW)  
A-to-B Clock Enable Input (Active LOW)  
B-to-A Clock Enable Input (Active LOW)  
A-to-B Clock Input  
Storage Temperature ..................................–55°C to +125°C  
Ambient Temperature with  
Power Applied .............................................–55°C to +125°C  
Supply Voltage Range......................................0.5V to +4.6V  
DC Input Voltage ............................................–0.5V to +7.0V  
DC Output Voltage .........................................–0.5V to +7.0V  
B-to-A Clock Input  
A-to-B Data Inputs or B-to-A Three-State  
Outputs[1]  
DC Output Current  
(Maximum Sink Current/Pin)........................ –60 to +120 mA  
B
B-to-A Data Inputs or A-to-B Three-State  
Outputs[1]  
Power Dissipation.......................................................... 1.0W  
Function Table[2, 3]  
For A-to-B (Symmetric with B-to-A)  
Operating Range  
Inputs  
Outputs  
Ambient  
CEAB  
CLKAB  
OEAB  
A
X
X
L
B
B[4]  
B[4]  
L
Range  
Industrial  
Temperature  
VCC  
H
X
L
X
L
L
L
L
L
H
–40°C to +85°C  
2.7V to 3.6V  
L
H
X
H
X
X
Z
Electrical Characteristics for Non Bus Hold Devices Over the Operating Range VCC=2.7V to 3.6V  
Parameter  
Description  
Input HIGH Voltage  
Test Conditions  
All Inputs  
Min.  
Typ.[7] Max.  
Unit  
V
VIH  
VIL  
VH  
VIK  
IIH  
2.0  
5.5  
Input LOW Voltage  
Input Hysteresis[8]  
0.8  
V
100  
mV  
V
Input Clamp Diode Voltage  
Input HIGH Current  
VCC=Min., IIN=–18 mA  
VCC=Max., VI=5.5  
–0.7  
–1.2  
±1  
µA  
IIL  
Input LOW Current  
VCC=Max., VI=GND  
±1  
±1  
µA  
µA  
IOZH  
High Impedance Output Current  
(Three-State Output pins)  
VCC=Max., VOUT=5.5V  
IOZL  
High Impedance Output Current  
(Three-State Output pins)  
VCC=Max., VOUT=GND  
±1  
µA  
IOS  
Short Circuit Current[9]  
VCC=Max., VOUT=GND  
–60  
–135  
–240  
±100  
10  
mA  
µA  
µA  
IOFF  
ICC  
Power-Off Disable  
VCC=0V, VOUT4.5V  
Quiescent Power Supply Current  
VIN0.2V,  
VCC=Max.  
0.1  
2.0  
VIN>VCC–0.2V  
VIN=VCC–0.6V[10] VCC=Max.  
ICC  
Quiescent Power Supply Current  
(TTL inputs HIGH)  
30  
µA  
Notes:  
1. On the CY74FCT163H952, these pins have bus hold.  
2. A-to-B data flow is shown: B-to-A data flow is similar but uses, CEBA, CLKBA, and OEBA.  
3. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. = LOW-to-HIGH Transition. Z = HIGH Impedance.  
4. Level of B before the indicated steady-state input conditions were established.  
5. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature.  
6. With the exception of inputs with bus hold, unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground,  
7. Typical values are at VCC=3.3V, TA = +25˚C ambient.  
8. This parameter is specified but not tested.  
9. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample  
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of  
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter  
tests, IOS tests should be performed last.  
10. Per TTL driven input; all other inputs at VCC or GND.  
2
CY74FCT163952  
CY74FCT163H952  
Electrical Characteristics For Bus Hold Devices Over the Operating Range VCC=2.7V to 3.6V  
Parameter  
Description  
Input HIGH Voltage  
Test Conditions  
All Inputs  
Min. Typ.[7] Max. Unit  
VIH  
VIL  
VH  
VIK  
IIH  
2.0  
VCC  
0.8  
V
V
Input LOW Voltage  
Input Hysteresis[8]  
100  
mV  
V
Input Clamp Diode Voltage  
Input HIGH Current  
VCC=Min., IIN=–18 mA  
VCC=Max., VI=VCC  
–0.7 – 1.2  
±100  
µA  
IIL  
Input LOW Current  
±100  
µA  
µA  
µA  
µA  
IBBH  
IBBL  
Bus Hold Sustain Current on Bus Hold Input[11] VCC=Min.  
VI=2.0V  
VI=0.8V  
–50  
+50  
IBHHO  
IBHLO  
Bus Hold Overdrive Current on Bus Hold Input[11] VCC=Max., VI=1.5V  
±500  
IOZH  
High Impedance Output Current  
(Three-State Output pins)  
VCC=Max., VOUT=VCC  
±1  
±1  
µA  
µA  
IOZL  
High Impedance Output Current  
(Three-State Output pins)  
VCC=Max., VOUT=GND  
IOS  
Short Circuit Current[9]  
VCC=Max., VOUT=GND  
–60  
–135 –240  
±100  
mA  
µA  
µA  
IOFF  
ICC  
Power-Off Disable  
VCC=0V, VOUT4.5V  
Quiescent Power Supply Current  
VIN0.2V VCC  
VCC=Max.  
+40  
VIN>VCC–0.2V  
Quiescent Power supply Current  
(TTL inputs HIGH)  
VIN=VCC–0.6V[10] VCC=Max.  
+350  
µA  
ICC  
Electrical Characteristics For Balanced Drive Devices Over the Operating Range VCC=2.7V to 3.6V  
Parameter  
Description  
Test Conditions  
Min.  
Typ.[7] Max.  
Unit  
IODL  
Output LOW Dynamic Current[9]  
VCC=3.3V, VIN=VIH  
or VIL, VOUT=1.5V  
50  
90  
200  
mA  
IODH  
VOH  
Output HIGH Dynamic Current[9]  
Output HIGH Voltage  
VCC=3.3V, VIN=VIH  
or VIL, VOUT=1.5V  
–36  
–60  
–110  
mA  
VCC=Min., IOH= –0.1 mA VCC–0.2  
V
V
V
V
VCC=Min., IOH= –8 mA  
VCC=3.0V, IOH= –24 mA  
VCC=Min., IOL= 0.1mA  
VCC=Min., IOL= 24 mA  
2.4[12]  
3.0  
3.0  
2.0  
VOL  
Output LOW Voltage  
0.2  
0.3  
0.55  
Notes:  
11. Pins with bus hold are described in Pin Description.  
12. OH=VCC–0.6 V at rated current  
V
Capacitance[8](TA = +25˚C, f = 1.0 MHz)  
Parameter  
CIN  
Description  
Input Capacitance  
Output Capacitance  
Test Conditions  
Typ.[7]  
Max.  
Unit  
VIN = 0V  
4.5  
5.5  
6.0  
8.0  
pF  
pF  
COUT  
VOUT = 0V  
3
CY74FCT163952  
CY74FCT163H952  
Power Supply Characteristics  
Parameter  
Description  
Test Conditions  
Typ.[7]  
Max.  
Unit  
ICCD  
Dynamic Power Supply  
Current[13]  
VCC=Max., One Input Toggling, VIN=VCC or  
50  
75  
µA/MHz  
50% Duty Cycle,  
VIN=GND  
Outputs Open, OE=GND  
IC  
Total Power Supply  
Current[14]  
VCC=Max., f1=10 MHz, 50%  
Duty Cycle, Outputs Open, One VIN=GND  
Bit Toggling, OE=GND  
VIN=VCC or  
0.5  
0.5  
2.0  
2.0  
0.8  
0.8  
mA  
mA  
mA  
mA  
VIN=VCC–0.6V or  
VIN=GND  
VCC=Max., f1=2.5 MHz, 50%  
Duty Cycle, Outputs Open, Six- VIN=GND  
teen Bits Toggling, OE=GND  
VIN=VCC or  
3.0[15]  
3.3[15]  
VIN=VCC–0.6V or  
VIN=GND  
Switching Characteristics Over the Operating Range VCC=3.0V to 3.6V[16,17]  
CY74FCT163952C  
CY74FCT163952A  
CY74FCT163H952C  
Parameter  
tPLH  
tPHL  
Description  
Min.  
Max.  
Min.  
Max.  
Unit  
Fig. No.[18]  
Propagation Delay Data to  
Output  
1.5  
4.8  
1.5  
4.4  
ns  
ns  
ns  
ns  
1, 3  
tPZH  
tPZL  
Output Enable Time  
Output Disable Time  
Output Skew[19]  
1.5  
1.5  
6.2  
5.6  
0.5  
1.5  
1.5  
5.8  
5.2  
0.5  
1, 7, 8  
1, 7, 8  
tPHZ  
tPLZ  
tSK(O)  
Notes:  
13. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.  
14. IC  
IC  
=
=
=
=
=
=
=
=
=
=
IQUIESCENT + IINPUTS + IDYNAMIC  
ICC+ICCDHNT+ICCD(f0/2 + f1N1)  
Quiescent Current with CMOS input levels  
Power Supply Current for a TTL HIGH input (VIN=3.4V)  
Duty Cycle for TTL inputs HIGH  
ICC  
ICC  
DH  
NT  
ICCD  
f0  
Number of TTL inputs at DH  
Dynamic Current caused by an input transition pair (HLH or LHL)  
Clock frequency for registered devices, otherwise zero  
Input signal frequency  
f1  
N1  
Number of inputs changing at f1  
All currents are in milliamps and all frequencies are in megahertz.  
15. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.  
16. Minimum limits are specified but not tested on Propagation Delays.  
17. For VCC =2.7, propagation delay, output enable and output disable times should be degraded by 20%.  
18. See “Parameter Measurement Information” in the General Information section.  
19. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.  
Ordering Information CY74FCT163952  
Speed  
(ns)  
Package  
Name  
Operating  
Range  
Ordering Code  
Package Type  
48-Lead (240-Mil) TSSOP  
48-Lead (300-Mil) SSOP  
48-Lead (300-Mil) SSOP  
4.1  
CY74FCT163952CPACT  
Z48  
O48  
O48  
Industrial  
CY74FCT163952CPVC/PVCT  
CY74FCT163952APVC/PVCT  
4.8  
Industrial  
Ordering Information CY74FCT163H952  
Speed  
(ns)  
Package  
Operating  
Range  
Ordering Code  
74FCT163H952CPACT  
CY74FCT163H952CPVC  
74FCT163H952CPVCT  
Name  
Package Type  
48-Lead (240-Mil) TSSOP  
48-Lead (300-Mil) SSOP  
48-Lead (300-Mil) SSOP  
4.1  
Z48  
Industrial  
O48  
O48  
4
CY74FCT163952  
CY74FCT163H952  
Package Diagrams  
56-Lead Shrunk Small Outline Package O56  
56-Lead Thin Shrunk Small Outline Package Z56  
5
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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