CY74FCT2541TSOCG4 [TI]

FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, GREEN, PLASTIC, SOIC-20;
CY74FCT2541TSOCG4
型号: CY74FCT2541TSOCG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, GREEN, PLASTIC, SOIC-20

驱动 光电二极管 输出元件 逻辑集成电路
文件: 总15页 (文件大小:618K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀꢁꢂ ꢃ ꢄ ꢀꢅꢆ ꢇꢃ ꢈꢅ  
ꢉ ꢊꢋꢌ ꢅ ꢋꢍꢄ ꢄ ꢎꢏꢐ ꢑ ꢌꢒ ꢎ ꢓ ꢏꢌ ꢔ ꢎꢏ  
ꢕ ꢌꢅ ꢖ ꢗ ꢊꢘꢅꢙꢅ ꢎ ꢚ ꢍꢅ ꢛꢍ ꢅꢘ  
SCCS041B – SEPTEMBER 1994 – REVISED SEPTEMBER 2001  
Q OR SO PACKAGE  
(TOP VIEW)  
D
D
D
D
Function and Pinout Compatible With FCT  
and F Logic  
25-Output Series Resistors to Reduce  
Transmission-Line Reflection Noise  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
OE  
V
CC  
OE  
A
D
D
D
D
D
D
D
D
0
1
2
3
4
5
6
7
B
Reduced V  
of Equivalent FCT Functions  
(Typically = 3.3 V) Versions  
O
OH  
0
O
O
O
O
O
O
O
1
2
3
4
5
6
7
Edge-Rate Control Circuitry for  
Significantly Improved Noise  
Characteristics  
D
D
I
Supports Partial-Power-Down Mode  
off  
Operation  
GND  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
D
D
Matched Rise and Fall Times  
Fully Compatible With TTL Input and  
Output Logic Levels  
D
D
12-mA Output Sink Current  
15-mA Output Source Current  
3-State Outputs  
description  
The CY74FCT2541T is an octal buffer and line driver designed to be employed as a memory-address driver,  
clock driver, and bus-oriented transmitter/receiver. On-chip termination resistors at the outputs reduce system noise  
caused by reflections. The CY74FCT2541T can replace the CY74FCT541T to reduce noise in an existing design.  
The speed of the CY74FCT2541T is comparable to bipolar logic counterparts, while reducing power dissipation.  
Input and output voltage levels allow direct interface with TTL and CMOS devices without external components.  
This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,  
off  
off  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
SPEED  
(ns)  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
QSOP – Q  
Tape and reel  
Tube  
4.1  
4.1  
4.1  
4.8  
4.8  
4.8  
8
CY74FCT2541CTQCT  
CY74FCT2541CTSOC  
CY74FCT2541CTSOCT  
CY74FCT2541ATQCT  
CY74FCT2541ATSOC  
CY74FCT2541ATSOCT  
CY74FCT2541TQCT  
CY74FCT2541TSOC  
CY74FCT2541TSOCT  
FCT2541C  
SOIC – SO  
QSOP – Q  
FCT2541C  
FCT2541A  
Tape and reel  
Tape and reel  
Tube  
–40°C to 85°C  
SOIC – SO  
QSOP – Q  
FCT2541A  
FCT2541  
Tape and reel  
Tape and reel  
Tube  
8
SOIC – SO  
FCT2541  
Tape and reel  
8
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
availableat www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2001, Texas Instruments Incorporated  
ꢅꢧ  
ꢣꢧ ꢤ ꢣ ꢜꢝ ꢱ ꢟꢞ ꢢ ꢪꢪ ꢨꢢ ꢠ ꢢ ꢡ ꢧ ꢣꢧ ꢠꢤ ꢬ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢄ ꢀꢅ ꢆ ꢇꢃ ꢈꢅ  
ꢉꢊ ꢋꢌ ꢅ ꢋ ꢍꢄ ꢄ ꢎ ꢏꢐ ꢑ ꢌ ꢒꢎ ꢓꢏ ꢌ ꢔꢎ ꢏ  
ꢕꢌ ꢅ ꢖ ꢗ ꢊꢘꢅꢙꢅ ꢎ ꢚ ꢍꢅꢛ ꢍꢅ ꢘ  
SCCS041B SEPTEMBER 1994 REVISED SEPTEMBER 2001  
FUNCTION TABLE  
INPUTS  
OUTPUT  
OE  
OE  
D
A
B
L
L
H
L
L
H
L
H
X
L
H
Z
H = High logic level, L = Low logic level,  
X = Dont care, Z = High-impedance state  
logic diagram (positive logic)  
1
OE  
OE  
A
B
19  
2
3
18  
17  
O
O
O
D
D
0
1
2
0
1
4
5
16  
15  
D
2
D
3
D
4
O
O
O
O
O
3
4
5
6
7
6
14  
7
8
13  
12  
D
5
D
6
D
7
9
11  
absolute maximum rating over operating free-air temperature range (unless otherwise noted)  
Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA  
Package thermal impedance, q (see Note 1): Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W  
JA  
SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W  
Ambient temperature range with power applied, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 135°C  
A
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functionaloperation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not implied.  
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁꢂ ꢃ ꢄ ꢀꢅꢆ ꢇꢃ ꢈꢅ  
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ꢕ ꢌꢅ ꢖ ꢗ ꢊꢘꢅꢙꢅ ꢎ ꢚ ꢍꢅ ꢛꢍ ꢅꢘ  
SCCS041B SEPTEMBER 1994 REVISED SEPTEMBER 2001  
recommended operating conditions (see Note 2)  
MIN NOM  
MAX  
UNIT  
V
V
V
V
Supply voltage  
4.75  
2
5
5.25  
CC  
High-level input voltage  
Low-level input voltage  
High-level output current  
Low-level output current  
Operating free-air temperature  
V
IH  
0.8  
15  
12  
V
IL  
I
I
mA  
mA  
°C  
OH  
OL  
T
A
40  
85  
NOTE 2: All unused inputs of the device must be held at V or GND to ensure proper device operation.  
CC  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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ꢉꢊ ꢋꢌ ꢅ ꢋ ꢍꢄ ꢄ ꢎ ꢏꢐ ꢑ ꢌ ꢒꢎ ꢓꢏ ꢌ ꢔꢎ ꢏ  
ꢕꢌ ꢅ ꢖ ꢗ ꢊꢘꢅꢙꢅ ꢎ ꢚ ꢍꢅꢛ ꢍꢅ ꢘ  
SCCS041B SEPTEMBER 1994 REVISED SEPTEMBER 2001  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
PARAMETER  
TEST CONDITIONS  
= 18 mA  
MIN TYP  
MAX  
UNIT  
V
V
V
V
V
CC  
V
CC  
V
CC  
V
CC  
= 4.75 V,  
= 4.75 V,  
= 4.75 V,  
= 4.75 V,  
I
I
I
I
0.7  
3.3  
0.3  
25  
1.2  
IK  
IN  
= 15 mA  
= 12 mA  
= 12 mA  
2.4  
20  
V
OH  
OL  
OH  
OL  
OL  
0.55  
40  
V
R
out  
V
hys  
All inputs  
0.2  
V
I
I
I
I
I
I
I
I
V
V
V
V
V
V
V
V
V
V
= 5.25 V,  
= 5.25 V,  
= 5.25 V,  
= 5.25 V,  
= 5.25 V,  
= 5.25 V,  
= 0 V,  
V
V
V
V
V
V
V
V
= V  
CC  
5
±1  
µA  
µA  
µA  
µA  
µA  
mA  
µA  
mA  
mA  
I
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
IN  
IN  
IN  
= 2.7 V  
= 0.5 V  
IH  
±1  
IL  
= 2.7 V  
= 0.5 V  
15  
OZH  
OZL  
OUT  
15  
225  
±1  
OUT  
0 V  
60  
120  
OS  
OUT =  
= 4.5 V  
OUT  
0.2 V,  
off  
= 5.25 V,  
V V  
IN CC  
0.2 V  
0.1  
0.5  
0.2  
2
CC  
IN  
§
I  
= 5.25 V, V = 3.4 V , f = 0, Outputs open  
IN  
CC  
1
= 5.25 V at 50% duty cycle, Outputs open, One bit switching,  
mA/  
MHz  
I
0.06  
0.12  
CCD  
OE = OE = GND, V 0.2 V or V V  
0.2 V  
A
B
IN  
IN CC  
One bit switching  
at f = 10 MHz,  
1
at 50% duty cycle  
V
IN  
V
IN  
V
IN  
V
IN  
0.2 V or V V 0.2 V  
0.7  
1
1.4  
2.4  
IN  
CC  
V
= 5.25 V,  
= 3.4 V or GND  
CC  
#
Outputs open,  
I
C
mA  
||  
2.6  
Eight bits switching  
at f = 2.5 MHz,  
1
at 50% duty cycle  
0.2 V or V V  
0.2 V  
1.3  
OE = OE = GND  
IN  
CC  
A
B
||  
= 3.4 V or GND  
3.3 10.6  
C
C
5
9
10  
12  
pF  
pF  
i
o
Typical values are at V  
= 5 V, T = 25°C.  
A
CC  
Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or  
sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged  
shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence  
of parameter tests, I  
OS  
tests should be performed last.  
§
#
Per TTL-driven input (V = 3.4 V); all other inputs at V  
or GND  
IN CC  
This parameter is derived for use in total power-supply calculations.  
= I + I × D × N + I (f /2 + f × N )  
I
C
CC CC CCD  
H
T
0
1
1
Where:  
I
I
I  
D
N
= Total supply current  
= Power-supply current with CMOS input levels  
C
CC  
CC  
H
T
= Power-supply current for a TTL high input (V = 3.4 V)  
IN  
= Duty cycle for TTL inputs high  
= Number of TTL inputs at D  
H
I
f
f
= Dynamic current caused by an input transition pair (HLH or LHL)  
= Clock frequency for registered devices, otherwise zero  
= Input signal frequency  
CCD  
0
1
N
= Number of inputs changing at f  
1
1
All currents are in milliamperes and all frequencies are in megahertz.  
||  
Values for these conditions are examples of the I  
formula.  
CC  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁꢂ ꢃ ꢄ ꢀꢅꢆ ꢇꢃ ꢈꢅ  
ꢉ ꢊꢋꢌ ꢅ ꢋꢍꢄ ꢄ ꢎꢏꢐ ꢑ ꢌꢒꢎ ꢓ ꢏꢌ ꢔ ꢎꢏ  
ꢕ ꢌꢅ ꢖ ꢗ ꢊꢘꢅꢙꢅ ꢎ ꢚ ꢍꢅ ꢛꢍ ꢅꢘ  
SCCS041B SEPTEMBER 1994 REVISED SEPTEMBER 2001  
switching characteristics over operating free-air temperature range (see Figure 1)  
CY74FCT2541T  
CY74FCT2541AT  
CY74FCT2541CT  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
ns  
MIN  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
MAX  
8
MIN  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
MAX  
4.8  
4.8  
6.2  
6.2  
5.6  
5.6  
MIN  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
MAX  
4.1  
4.1  
5.8  
5.8  
5.2  
5.2  
t
t
t
t
t
t
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
D
O
O
O
8
10  
10  
9.5  
9.5  
ns  
OE  
OE  
ns  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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ꢉꢊ ꢋꢌ ꢅ ꢋ ꢍꢄ ꢄ ꢎ ꢏꢐ ꢑ ꢌ ꢒꢎ ꢓꢏ ꢌ ꢔꢎ ꢏ  
ꢕꢌ ꢅ ꢖ ꢗ ꢊꢘꢅꢙꢅ ꢎ ꢚ ꢍꢅꢛ ꢍꢅ ꢘ  
SCCS041B SEPTEMBER 1994 REVISED SEPTEMBER 2001  
PARAMETER MEASUREMENT INFORMATION  
7 V  
Open  
GND  
S1  
500 Ω  
From Output  
Under Test  
From Output  
Under Test  
Test  
Point  
TEST  
/t  
S1  
t
Open  
7 V  
Open  
PLH PHL  
C
L
= 50 pF  
C
L
= 50 pF  
500 Ω  
500 Ω  
t
t
/t  
PLZ PZL  
/t  
(see Note A)  
(see Note A)  
PHZ PZH  
LOAD CIRCUIT FOR  
TOTEM-POLE OUTPUTS  
LOAD CIRCUIT FOR  
3-STATE OUTPUTS  
3 V  
0 V  
1.5 V  
Timing Input  
Data Input  
t
w
t
h
t
su  
3 V  
3 V  
0 V  
1.5 V  
Input  
1.5 V  
1.5 V  
1.5 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
3 V  
0 V  
3 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Input  
t
t
t
t
t
t
PLH  
PHL  
PZL  
PLZ  
3.5 V  
V
Output  
Waveform 1  
(see Note B)  
OH  
In-Phase  
Output  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
V
+ 0.3 V  
OL  
V
OL  
V
OL  
t
t
PHL  
PLH  
PZH  
PHZ  
V
V
V
OH  
OH  
Output  
Waveform 2  
(see Note B)  
Out-of-Phase  
Output  
V
0.3 V  
OH  
1.5 V  
1.5 V  
0 V  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A.  
C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. The outputs are measured one at a time with one input transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Aug-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
CY74FCT2541ATQCT  
CY74FCT2541ATQCTE4  
CY74FCT2541ATQCTG4  
CY74FCT2541ATSOC  
CY74FCT2541ATSOCE4  
CY74FCT2541ATSOCG4  
CY74FCT2541CTQCT  
CY74FCT2541CTQCTE4  
CY74FCT2541CTQCTG4  
CY74FCT2541CTSOC  
CY74FCT2541CTSOCE4  
CY74FCT2541CTSOCG4  
CY74FCT2541TQCT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
SSOP  
SOIC  
SOIC  
SOIC  
SSOP  
SSOP  
SSOP  
SOIC  
SOIC  
SOIC  
SSOP  
SSOP  
SSOP  
SOIC  
SOIC  
DBQ  
DBQ  
DBQ  
DW  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
2500  
2500  
2500  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
DW  
25  
Green (RoHS  
& no Sb/Br)  
DW  
25  
Green (RoHS  
& no Sb/Br)  
DBQ  
DBQ  
DBQ  
DW  
2500  
2500  
2500  
25  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
DW  
25  
Green (RoHS  
& no Sb/Br)  
DW  
25  
Green (RoHS  
& no Sb/Br)  
DBQ  
DBQ  
DBQ  
DW  
2500  
2500  
2500  
25  
Green (RoHS  
& no Sb/Br)  
CY74FCT2541TQCTE4  
CY74FCT2541TQCTG4  
CY74FCT2541TSOC  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
CY74FCT2541TSOCE4  
DW  
25  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Aug-2012  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
CY74FCT2541TSOCG4  
CY74FCT2541TSOCT  
CY74FCT2541TSOCTE4  
CY74FCT2541TSOCTG4  
SOIC  
SOIC  
SOIC  
SOIC  
DW  
DW  
DW  
DW  
20  
20  
20  
20  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
2000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
16-Aug-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
CY74FCT2541ATQCT  
CY74FCT2541CTQCT  
CY74FCT2541TQCT  
CY74FCT2541TSOCT  
SSOP  
SSOP  
SSOP  
SOIC  
DBQ  
DBQ  
DBQ  
DW  
20  
20  
20  
20  
2500  
2500  
2500  
2000  
330.0  
330.0  
330.0  
330.0  
16.4  
16.4  
16.4  
24.4  
6.5  
6.5  
9.0  
9.0  
2.1  
2.1  
2.1  
2.7  
8.0  
8.0  
16.0  
16.0  
16.0  
24.0  
Q1  
Q1  
Q1  
Q1  
6.5  
9.0  
8.0  
10.8  
13.0  
12.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
16-Aug-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CY74FCT2541ATQCT  
CY74FCT2541CTQCT  
CY74FCT2541TQCT  
CY74FCT2541TSOCT  
SSOP  
SSOP  
SSOP  
SOIC  
DBQ  
DBQ  
DBQ  
DW  
20  
20  
20  
20  
2500  
2500  
2500  
2000  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
38.0  
38.0  
38.0  
45.0  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should  
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semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time  
of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
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TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which  
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Audio  
Applications  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
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Communications and Telecom www.ti.com/communications  
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DLP® Products  
DSP  
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Copyright © 2012, Texas Instruments Incorporated  

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