CY74FCT2646ATQCT [TI]

8-Bit Registered Transceiver; 8位寄存收发器
CY74FCT2646ATQCT
型号: CY74FCT2646ATQCT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

8-Bit Registered Transceiver
8位寄存收发器

总线驱动器 总线收发器 逻辑集成电路 光电二极管
文件: 总7页 (文件大小:53K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Data sheet acquired from Cypress Semiconductor Corporation.  
Data sheet modified to remove devices not offered.  
CY74FCT2646T  
SCCS043 - September 1994 - Revised March 2000  
8-Bit Registered Transceiver  
Features  
Functional Description  
• Function and pinout compatible with FCT and F logic  
• FCT-C speed at 5.4 ns max.  
FCT-A speed at 6.3 ns max.  
• Reduced VOH (typically = 3.3V) versions of equivalent  
FCT functions  
25output series resistors to reduce transmission line  
reflection noise  
• Reduced VOH (typically=3.3V) versions of equivalent  
FCT functions  
• Edge-rate control circuitry for significantly improved  
noise characteristics  
The FCT2646T consists of a bus transceiver circuit with  
three-state, D-type flip-flops, and control circuitry arranged for  
multiplexed transmission of data directly from the input bus or  
from the internal registers. Data on the A or B bus will be  
clocked into the registers as the appropriate clock pin goes to  
a HIGH logic level. Enable Control G and direction pins are  
provided to control the transceiver function. On-chip termina-  
tion resistors have been added to the outputs to reduce system  
noise caused by reflections so that the FCT2646T can be used  
to replace the FCT646T in an existing design.  
In the transceiver mode, data present at the high impedance  
port may be stored in either the A or B register, or in both.  
Select controls can multiplex stored and real-time (transparent  
mode) data. The direction control determines which bus will  
receive data when the enable control G is Active LOW. In the  
isolation mode (enable control G HIGH), A data may be stored  
in the B register and/or B data may be stored in the A register.  
• Power-off disable feature permits live insertion  
• Matched rise and fall times  
ESD > 2000V  
• Fully compatible with TTL input and output logic levels  
• Sink current  
12 mA  
Source current 15 mA  
The outputs are designed with a power-off disable feature to  
allow for live insertion of boards.  
• Independent register for A and B buses  
Extended commercial temp. range of –40˚C to +85˚C  
• Three-state output  
Pin Configurations  
Functional Block Diagram  
G
QSOP  
Top View  
DIR  
CPBA  
SBA  
CPAB  
SAB  
DIR  
1
24  
23  
22  
21  
V
CC  
CPBA  
SBA  
G
2
3
CPAB  
SAB  
A
1
4
A
2
B
1
5
20  
19  
18  
17  
16  
A
3
B
2
6
A
4
B
3
7
D
C
A
5
B
4
8
A
6
B
5
9
B
6
B
7
B
8
A
7
10  
11  
12  
15  
14  
13  
A
8
GND  
B
1
FCT2646T–3  
A
1
D
C
Logic Block Diagram  
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
CPAB  
SAB  
DIR  
CPBA  
SBA  
TO 7 OTHERCHANNELS  
FCT2646T  
–1  
G
B
B
B
B
B
B
B
B
8
1
2
3
4
5
6
7
FCT2646T–4  
Copyright © 2000, Texas Instruments Incorporated  
CY74FCT2646T  
Pin Description  
Name  
Description  
Data Register A Inputs, Data Register B Outputs  
A
B
Data Register B Inputs, Data Register A Outputs  
Clock Pulse Inputs  
CPAB, CPBA  
SAB, SBA  
DIR, G  
Output Data Source Select Inputs  
Output Enable Inputs  
BUS A  
BUS B  
BUS A  
BUS B  
DIR  
L
G
L
CPAB  
X
CPBA  
X
SAB  
X
SBA  
X
DIR  
H
G
L
CPAB  
X
CPBA  
X
SAB  
L
SBA  
X
Real-Time Transfer  
Bus B to Bus A  
Real-Time Transfer  
Bus A to Bus B  
BUS A  
BUS B  
BUS A  
BUS A  
[1]  
DIR  
H
L
G
L
L
CPAB  
X
CPBA  
X
SAB  
X
X
SBA  
X
X
DIR  
L
H
G
L
L
CPAB  
X
H or L  
CPBA  
H or L  
X
SAB  
X
H
SBA  
H
X
X
H
X
X
Storage from  
A and/or B  
Transfer Stored Data  
to A and/or B  
Note:  
1. Cannot transfer data to A bus and B bus simultaneously.  
2
CY74FCT2646T  
Function Table[2]  
Inputs  
Data I/O[3]  
Operation or Function  
FCT2646T  
G
DIR  
CPAB  
CPBA  
SAB  
SBA  
A1 thru A8  
B1 thru B8  
H
H
X
X
H or L  
H or L  
X
X
X
X
Input  
Output  
Input  
Input  
Isolation  
Store A and B Data  
L
L
L
L
X
X
X
X
X
L
H
Input  
Real Time B Data to A Bus  
Stored B Data to A Bus  
H or L  
L
L
H
H
X
X
X
L
H
X
X
Output  
Real Time A Data to B Bus  
Stored A Data to B Bus  
H or L  
Maximum Ratings[4, 5]  
DC Output Current (Maximum Sink Current/Pin) ......120 mA  
Power Dissipation..........................................................0.5W  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Static Discharge Voltage............................................>2001V  
(per MIL-STD-883, Method 3015)  
Storage Temperature .................................65°C to +150°C  
Ambient Temperature with  
Power Applied.............................................65°C to +135°C  
Operating Range  
Ambient  
Supply Voltage to Ground Potential ............... –0.5V to +7.0V  
DC Input Voltage............................................ –0.5V to +7.0V  
DC Output Voltage......................................... –0.5V to +7.0V  
Range  
Temperature  
VCC  
Commercial  
–40°C to +85°C  
5V ± 5%  
Electrical Characteristics Over the Operating Range  
Parameter  
VOH  
VOL  
ROUT  
VIH  
Description  
Output HIGH Voltage  
Output LOW Voltage  
Output Resistance  
Input HIGH Voltage  
Input LOW Voltage  
Hysteresis[7]  
Test Conditions  
VCC=Min., IOH=–15 mA  
Min.  
Typ[6]  
Max.  
Unit  
2.4  
3.3  
0.3  
25  
V
V
VCC=Min., IOL=12 mA  
VCC=Min., IOL=12 mA  
0.55  
40  
20  
2.0  
V
VIL  
0.8  
V
VH  
All inputs  
0.2  
V
VIK  
Input Clamp Diode Voltage  
Input HIGH Current  
Input HIGH Current  
Input LOW Current  
VCC=Min., IIN=–18 mA  
VCC=Max., VIN=VCC  
VCC=Max., VIN=2.7V  
VCC=Max., VIN=0.5V  
–0.7  
–1.2  
5
V
IIH  
µA  
µA  
µA  
mA  
µA  
IIH  
±1  
IIL  
±1  
IOS  
Output Short Circuit Current[8] VCC=Max., VOUT=0.0V  
–60  
–120  
–225  
±1  
IOFF  
Power-Off Disable VCC=0V, VOUT=4.5V  
Notes:  
2. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care.  
3. The data output functions may be enabled or disabled by various signals at the G or DIR inputs. Data input functions are always enabled, i.e., data at the bus  
pins will be stored on every LOW-to-HIGH transition of the clock inputs.  
4. Unless otherwise noted, these limits are over the operating free-air temperature range.  
5. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.  
6. Typical values are at VCC=5.0V, TA=+25˚C ambient.  
7. This parameter is specified but not tested.  
8. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample  
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting  
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter  
tests, IOS tests should be performed last.  
3
CY74FCT2646T  
Capacitance[7]  
Parameter  
CIN  
Description  
Typ.[6]  
Max.  
10  
Unit  
pF  
Input Capacitance  
Output Capacitance  
6
8
COUT  
12  
pF  
Power Supply Characteristics  
Parameter  
Description  
Test Conditions  
VCC=Max., VIN0.2V,  
INVCC–0.2V  
Typ.[6]  
Max.  
Unit  
ICC  
Quiescent Power Supply Current  
0.1  
0.2  
mA  
V
ICC  
Quiescent Power Supply Current  
(TTL inputs HIGH)  
VCC=Max., VIN=3.4V,[9]  
f1=0, Outputs Open  
0.5  
2.0  
mA  
ICCD  
Dynamic Power Supply Current[10] VCC=Max., One Input Toggling,  
50% Duty Cycle, Outputs Open,  
0.06  
0.12  
mA/  
MHz  
G=DIR=GND, GAB=GBA=GND,  
VIN0.2V or VINVCC–0.2V  
IC  
Total Power Supply Current[11]  
VCC=Max., f0=10 MHz,  
0.7  
1.2  
2.8  
5.1  
1.4  
3.4  
mA  
mA  
mA  
mA  
50% Duty Cycle, Outputs Open,  
One Bit Toggling at f1=5 MHz,  
G=DIR=GND, GAB=GBA=GND,  
VIN0.2V or VINVCC–0.2V  
VCC=Max., f0=10 MHz,  
50% Duty Cycle, Outputs Open,  
One Bit Toggling at f1=5 MHz,  
G=DIR=GND, GAB=GBA=GND,  
VIN=3.4V or VIN=GND  
VCC=Max., f0=10 MHz,  
5.6[12]  
50% Duty Cycle, Outputs Open,  
Eight Bits Toggling at f1=5 MHz,  
G=DIR=GND, GAB=GBA=GND,  
VIN0.2V or VINVCC–0.2V  
VCC=Max., f0=10 MHz,  
14.6[12]  
50% Duty Cycle, Outputs Open,  
Eight Bits Toggling at f1=5 MHz,  
G=DIR=GND, GAB=GBA=GND,  
VIN=3.4V or VIN=GND  
Notes:  
9. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.  
10. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.  
11. IC  
IC  
=
=
=
=
=
=
=
=
=
=
IQUIESCENT + IINPUTS + IDYNAMIC  
ICC+ICCDHNT+ICCD(f0/2 + f1N1)  
Quiescent Current with CMOS input levels  
Power Supply Current for a TTL HIGH input (VIN=3.4V)  
Duty Cycle for TTL inputs HIGH  
ICC  
ICC  
DH  
NT  
ICCD  
f0  
Number of TTL inputs at DH  
Dynamic Current caused by an input transition pair (HLH or LHL)  
Clock frequency for registered devices, otherwise zero  
Input signal frequency  
f1  
N1  
Number of inputs changing at f1  
All currents are in milliamps and all frequencies are in megahertz.  
12. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.  
4
CY74FCT2646T  
Switching Characteristics Over the Operating Range[13]  
CY74FCT2646AT  
CY74FCT2646CT  
Parameter  
tPLH  
Description  
Min.  
Max.  
Min.  
Max.  
Unit  
Fig. No.[14]  
Propagation Delay Bus to Bus  
1.5  
6.3  
1.5  
5.4  
ns  
1, 3  
tPHL  
tPZH  
tPZL  
Output Enable Time Enable to  
Bus and DIR to An or Bn  
1.5  
1.5  
1.5  
1.5  
2.0  
1.5  
5.0  
9.8  
6.3  
6.3  
7.7  
1.5  
1.5  
1.5  
1.5  
2.0  
1.5  
5.0  
7.8  
6.3  
5.7  
6.2  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
1, 7, 8  
1, 7, 8  
1, 5  
1, 5  
4
tPHZ  
tPLZ  
Output Disable Time  
G to Bus and DIR to Bus  
tPLH  
tPHL  
Propagation Delay  
Clock to Bus  
tPLH  
tPHL  
Propagation Delay  
SBA or SAB to A or B  
tS  
Set-Up Time HIGH or LOW, Bus  
to Clock  
tH  
Hold Time HIGH or LOW,  
Bus to Clock  
Pulse Width,[7]  
HIGH or LOW  
4
tW  
5
Notes:  
13. Minimum limits are specified but not tested on Propagation Delays.  
14. See “Parameter Measurement Information” in the General Information section.  
Ordering Information  
Speed  
(ns)  
Package  
Name  
Operating  
Range  
Ordering Code  
CY74FCT2646CTQCT  
CY74FCT2646ATQCT  
Package Type  
5.4  
6.3  
Q13  
Q13  
24-Lead (150-Mil) QSOP  
24-Lead (150-Mil) QSOP  
Commercial  
Commercial  
Document #: 38-00599  
5
CY74FCT2646T  
Package Diagrams  
24-Lead Quarter Size Outline Q13  
6
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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