CY74FCT377TSOIC [TI]

8-Bit Register; 8位寄存器
CY74FCT377TSOIC
型号: CY74FCT377TSOIC
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

8-Bit Register
8位寄存器

文件: 总7页 (文件大小:74K)
中文:  中文翻译
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1CY54/74FCT377T  
Data sheet acquired from Cypress Semiconductor Corporation.  
Data sheet modified to remove devices not offered.  
CY54/74FCT377T  
8-Bit Register  
SCCS023 - May1994 - Revised March 2000  
Clock Enable for address and data synchronization  
Features  
application  
Function, pinout and drive compatible with FCT and  
• Eight edge-triggered D flip-flops  
Extended commercial range of 40˚C to +85˚C  
F logic  
FCT-C speed at 5.2 ns max. (Com’l)  
FCT-A speed at 7.2 ns max. (Com’l)  
Reduced VOH (typically = 3.3V) versions of equivalent  
FCT functions  
Edge-rate control circuitry for significantly improved  
noise characteristics  
Power-off disable feature  
Matched rise and fall times  
ESD > 2000V  
Functional Description  
The FCT377T has eight triggered D-type flip-flops with  
individual D inputs. The common buffered clock inputs (CP)  
loads all flip-flops simultaneously when the Clock Enable (CE)  
is LOW. The register is fully edge-triggered. The state of each  
D input, one set-up time before the LOW-to-HIGH clock  
transition, is transferred to the corresponding flip-flop’s O out-  
put. The CE input must be stable only one set-up time prior to  
the LOW-to-HIGH clock transition for predictable operation.  
Fully compatible with TTL input and output logic levels  
• Sink Current  
64 mA (Com’l),  
32 mA (Mil)  
32 mA (Com’l),  
12 mA (Mil)  
The outputs are designed with a power-off disable feature to  
allow for live insertion of boards.  
Source Current  
Logic Block Diagram  
D
0
D
D
2
D
D
D
5
D
D
7
1
3
4
6
CE  
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
CP  
CP  
CP  
CP  
CP  
CP  
CP  
CP  
CP  
O
0
O
1
O
2
O
3
O
4
O
5
O
6
O
7
Pin Configurations  
Logic Symbol  
SOIC/QSOP  
Top View  
LCC  
Top View  
CE  
1
V
20  
19  
18  
17  
16  
CC  
O
0
O
2
3
4
5
6
7
7
6
D
0
D
D
7
6 5 4  
8
D
D
O
D
O
D
O
D
D
O
D
O
D
O
0
1
2
3
4
5
6
7
D
1
O
D
0
3
9
3
2
1
CP  
O
1
O
O
D
6
5
GND  
CP  
O
0
10  
11  
CE  
O
2
CE  
O
15  
14  
O
4
V
CC  
D
2
12  
13  
O
4
20  
19  
7
5
4
0
1
2
3
5
6
7
D
O
7
4
D
3
D
8
13  
12  
11  
1516 17 18  
14  
O
3
O
9
4
GND  
10  
CP  
Copyright © 2000, Texas Instruments Incorporated  
CY54/74FCT377T  
Supply Voltage to Ground Potential............... –0.5V to +7.0V  
DC Input Voltage ........................................... –0.5V to +7.0V  
DC Output Voltage......................................... –0.5V to +7.0V  
DC Output Current (Maximum Sink Current/Pin) ......120 mA  
Power Dissipation..........................................................0.5W  
Function Table[1]  
Inputs  
Outputs  
Operating  
Mode  
Load “1”  
Load “0“  
Hold  
CP  
CE  
D
h
l
O
H
L
l
l
Static Discharge Voltage............................................>2001V  
(per MIL-STD-883, Method 3015)  
h
H
X
X
No Change  
No Change  
X
Operating Range  
Maximum Ratings[2, 3]  
Ambient  
(Above which the useful life may be impaired. For user  
guidelines, not tested.)  
Range  
Range  
Temperature  
–40°C to +85°C  
–55°C to +125°C  
VCC  
Commercial All  
Military[4]  
5V ± 5%  
5V ± 10%  
Storage Temperature .................................65°C to +150°C  
All  
Ambient Temperature  
with Power Applied......................................65°C to +135°C  
Electrical Characteristics Over the Operating Range  
Parameter  
Description  
Test Conditions  
VCC=Min., IOH=–32 mA  
Min.  
2.0  
Typ.[5]  
Max.  
Unit  
V
VOH  
Output HIGH Voltage  
Com’l  
Com’l  
Mil  
VCC=Min., IOH=–15 mA  
VCC=Min., IOH=–12 mA  
VCC=Min., IOL=64 mA  
VCC=Min., IOL=32 mA  
2.4  
3.3  
3.3  
0.3  
0.3  
V
2.4  
V
VOL  
Output LOW Voltage  
Com’l  
Mil  
0.55  
0.55  
V
V
VIH  
VIL  
VH  
VIK  
II  
Input HIGH Voltage  
Input LOW Voltage  
Hysteresis[6]  
2.0  
V
0.8  
V
All inputs  
0.2  
V
Input Clamp Diode Voltage  
Input HIGH Current  
Input HIGH Current  
Input LOW Current  
VCC=Min., IIN=–18 mA  
VCC=Max., VIN=VCC  
VCC=Max., VIN=2.7V  
VCC=Max., VIN=0.5V  
–0.7  
–1.2  
5
V
µA  
µA  
µA  
mA  
µA  
IIH  
IIL  
±1  
±1  
IOS  
Output Short Circuit Current[7] VCC=Max., VOUT=0.0V  
–60  
–120  
–225  
±1  
IOFF  
Power-Off Disable VCC=0V., VOUT=4.5V  
Notes:  
1.  
H
h
L
l
X
Z
= HIGH Voltage Level  
= HIGH Voltage Level one set-up time prior to the LOW-to-HIGH Clock Transition  
= LOW Voltage Level  
= LOW Voltage Level one set-up time prior to the LOW-to-HIGH Clock Transition  
= Don’t Care  
= HIGH Impedance  
= LOW-to-HIGH clock transition  
2. Unless otherwise noted, these limits are over the operating free-air temperature range.  
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.  
4. TA is the “instant on” case temperature.  
5. Typical values are at VCC=5.0V, TA=+25˚C ambient.  
6. This parameter is specified but not tested.  
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample  
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of  
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter  
tests, IOS tests should be performed last.  
2
CY54/74FCT377T  
Capacitance[2]  
Parameter  
CIN  
Description  
Typ.[5]  
Max.  
10  
Unit  
pF  
Input Capacitance  
Output Capacitance  
5
9
COUT  
12  
pF  
Power Supply Characteristics  
Parameter  
ICC  
Description  
Test Conditions  
Typ.[5]  
0.1  
Max.  
Unit  
mA  
mA  
Quiescent Power Supply Current  
VCC=Max., VIN0.2V, VIN VCC–0.2V  
VCC=Max., VIN=3.4V, f1=0, Outputs Open[8]  
0.2  
2.0  
ICC  
Quiescent Power Supply Current  
(TTL inputs HIGH)  
0.5  
ICCD  
Dynamic Power Supply Current[9] VCC=Max., One Bit Toggling,  
50% Duty Cycle, Outputs Open,  
0.06  
0.7  
0.12  
1.4  
mA/MHz  
mA  
CE=GND, VIN 0.2V or VIN VCC–0.2V  
IC  
Total Power Supply Current[10]  
VCC=Max., f0=10 MHz,  
50% Duty Cycle, Outputs Open,  
One Bit Toggling at f1=5 MHz,  
CE=GND, VIN0.2V or VIN VCC–0.2V  
VCC=Max., f0=10 MHz,  
1.2  
1.6  
3.9  
3.4  
mA  
mA  
mA  
50% Duty Cycle, Outputs Open,  
One Bit Toggling at f1=5 MHz, CE=GND,  
VIN=3.4V or VIN=GND  
VCC=Max., f0=10 MHz,  
3.2[11]  
50% Duty Cycle, Outputs Open,  
Eight Bits Toggling at f1=2.5 MHz,  
CE=GND, VIN0.2V or VINVCC–0.2V  
[11]  
VCC=Max., f0=10 MHz,  
12.2  
50% Duty Cycle, Outputs Open,  
Eight Bits Toggling at f1=2.5 MHz,  
CE=GND, VIN=3.4V or VIN=GND  
Notes:  
8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.  
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.  
10. IC  
IC  
=
=
=
=
=
=
=
=
=
=
IQUIESCENT + IINPUTS + IDYNAMIC  
ICC+ICCDHNT+ICCD(f0/2 + f1N1)  
Quiescent Current with CMOS input levels  
Power Supply Current for a TTL HIGH input (VIN=3.4V)  
Duty Cycle for TTL inputs HIGH  
ICC  
ICC  
DH  
NT  
ICCD  
f0  
Number of TTL inputs at DH  
Dynamic Current caused by an input transition pair (HLH or LHL)  
Clock frequency for registered devices, otherwise zero  
Input signal frequency  
f1  
N1  
Number of inputs changing at f1  
All currents are in milliamps and all frequencies are in megahertz.  
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.  
3
CY54/74FCT377T  
Switching Characteristics Over the Operating Range[12, 13]  
FCT377T  
FCT377AT  
Commercial  
Commercial  
Military  
Min. Max.  
Fig.  
Parameter  
Description  
Min.  
Max.  
Min.  
Max.  
Unit No.[14]  
tPLH  
tPHL  
Propagation Delay Clock to  
Output  
2.0  
13.0  
2.0  
2.0  
1.5  
3.5  
1.5  
7.0  
8.3  
2.0  
7.2  
ns  
ns  
ns  
ns  
ns  
ns  
1, 5  
4
tS  
Set-Up Time HIGH or LOW  
Data to CP  
2.0  
1.5  
3.5  
1.5  
6.0  
2.0  
1.5  
3.5  
1.5  
6.0  
tH  
Hold Time HIGH or LOW  
Data to CP  
4
tW  
tW  
tW  
Set-Up Time HIGH or LOW  
CE to CP  
4
Set-Up Time HIGH or LOW  
CE to CP  
Clock Pulse Width[15] HIGH or  
LOW  
4
6
FCT377CT  
Military  
Commercial  
Fig.  
Parameter  
Description  
Propagation Delay Clock to Output  
Min.  
Max.  
Min.  
Max.  
Unit  
No.[14]  
tPLH  
tPHL  
2.0  
5.5  
2.0  
5.2  
ns  
1, 5  
tS  
Set-Up Time, HIGH or LOW, Data to CP  
Hold Time, HIGH or LOW, Data to CP  
Set-Up Time, HIGH or LOW, CE to CP  
Set-Up Time HIGH or LOW, CE to CP  
Clock Pulse Width[15] HIGH or LOW  
2.0  
1.5  
3.5  
1.5  
7.0  
2.0  
1.5  
3.5  
1.5  
6.0  
ns  
ns  
ns  
ns  
ns  
4
4
4
4
6
tH  
tW  
tW  
tW  
Notes:  
12. AC Characteristics specified with CL=50 pF as shown in Figure 1 of the “Parameter Measurement Information” in the General Information section.  
13. Minimum limits are specified but not tested on Propagation Delays.  
14. See “Parameter Measurement Information” in the General Information section.  
15. With one data channel toggling, tW(L)=tW(H)=4.0 ns and tr=tf=1.0 ns.  
Ordering Information—FCT377T  
Speed  
(ns)  
Package  
Name  
Operating  
Range  
Ordering Code  
CY74FCT377CTQCT  
CY74FCT377CTSOC/SOCT  
CY54FCT377CTLMB  
CY74FCT377ATQCT  
CY74FCT377ATSOC/SOCT  
CY54FCT377TLMB  
Package Type  
20-Lead (150-Mil) QSOP  
5.2  
Q5  
S5  
Commercial  
20-Lead (300-Mil) Molded SOIC  
20-Pin Square Leadless Chip Carrier  
20-Lead (150-Mil) QSOP  
5.5  
7.2  
L61  
Q5  
S5  
Military  
Commercial  
20-Lead (300-Mil) Molded SOIC  
20-Pin Square Leadless Chip Carrier  
20-Lead (150-Mil) QSOP  
8.3  
L61  
Q5  
Military  
13.0  
CY74FCT377TQCT  
Commercial  
Document #: 38-00279-B  
4
CY54/74FCT377T  
Package Diagrams  
20-Pin Square Leadless Chip Carrier L61  
MIL–STD–1835 C–2A  
20-Lead Quarter Size Outline Q5  
5
CY54/74FCT377T  
Package Diagrams (continued)  
20-Lead (300-Mil) Molded SOIC S5  
6
IMPORTANT NOTICE  
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any product or service without notice, and advise customers to obtain the latest version of relevant information  
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pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
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BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
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party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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