CY74FCT825ATSOC [TI]

具有三态输出的 8 位总线接口触发器 | DW | 24 | -40 to 85;
CY74FCT825ATSOC
型号: CY74FCT825ATSOC
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有三态输出的 8 位总线接口触发器 | DW | 24 | -40 to 85

驱动 触发器 总线驱动器 总线收发器
文件: 总10页 (文件大小:88K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Data sheet acquired from Cypress Semiconductor Corporation.  
Data sheet modified to remove devices not offered.  
CY74FCT821T  
CY74FCT823T  
CY74FCT825T  
SCCS033 - May 1994 - Revised March 2000  
8-/9-/10-Bit Bus Interface Registers  
Features  
Functional Description  
• Function, pinout, and drive compatible with FCT, F, and  
Am29821/23/25 logic  
• FCT-C speed at 6.0 ns max.  
FCT-B speed at 7.5 ns max.  
• Reduced VOH (typically = 3.3V) versions of equivalent  
FCT functions  
• Edge-rate control circuitry for significantly improved  
noise characteristics  
These bus interface registers are designed to eliminate the  
extra packages required to buffer existing registers and  
provide extra data width for wider address/data paths or buses  
carrying parity. The FCT821T is a buffered, 10-bit wide version  
of the popular FCT374 function. The FCT823T is a 9-bit wide  
buffered register with clock enable (EN) and clear (CLR) ideal  
for parity bus interfacing in high-performance micropro-  
grammed systems. The FCT825T is an 8-bit buffered register  
with all the FCT823T controls plus multiple enables (OE1,  
OE2, OE3) to allow multiuser control of the interface, e.g., CS,  
DMA, and RD/WR. They are ideal for use as an output port  
• Power-off disable feature  
• Matched rise and fall times  
• Fully compatible with TTL input and output logic levels  
• ESD > 2000V  
requiring high IOL/IOH  
.
These devices are designed for high-capacitance load drive  
capability, while providing low-capacitance bus loading at both  
inputs and outputs. Outputs are designed for low-capacitance  
bus loading in the high-impedance state and are designed with  
a power-off disable feature to allow for live insertion of boards.  
• Sink current  
Source current  
64 mA  
32 mA  
• High-speed parallel registers with positive  
edge-triggered D-type flip-flops  
• Bufferedcommonclockenable(EN)andasynchronous  
clear input (CLR)  
• Extended commercial range of 40˚C to +85˚C  
Logic Block Diagram  
D
0
D
D
4
D
5
D
D
3
D
N- 1  
D
N
1
2
[1]  
EN  
[1]  
CLR  
CL  
CL  
CL  
CL  
CL  
CL  
CL  
CL  
D
Q
Q
D
Q
Q
D
Q
Q
D
Q
D
Q
Q
D
Q
Q
D
Q
Q
D
Q
Q
CP  
CP  
CP  
CP  
CP  
CP  
CP  
CP  
Q
CP  
OE  
Y
0
Y
1
Y
4
Y
5
Y
2
Y
3
Y
n-  
Y
n
1
Note:  
1. Not on FCT821.  
Copyright © 2000, Texas Instruments Incorporated  
CY74FCT821T  
CY74FCT823T  
CY74FCT825T  
Logic Diagrams  
Pin Configurations  
FCT821T (10-Bit Register)  
DIP/QSOP/SOIC  
Top View  
10  
D
D
10  
1
Q
Y
OE  
24  
V
CC  
2
3
4
D
0
23  
22  
21  
CP  
Y
0
D
1
Y
1
CP  
OE  
D
2
Y
2
D
3
5
6
7
8
9
Y
3
20  
19  
18  
17  
16  
FCT821T  
D
4
Y
4
D
5
Y
5
D
6
Y
6
D
7
Y
7
D
8
Y
10  
11  
12  
8
15  
14  
13  
D
9
Y
9
CP  
GND  
FCT823T (9-Bit Register)  
DIP/QSOP/SOIC  
Top View  
9
D
D
9
Q
Y
1
OE  
24  
V
CC  
CP EN CLR  
2
3
4
5
6
D
0
23  
22  
21  
Y
0
CP  
EN  
D
1
Y
1
D
2
Y
2
D
3
Y
3
20  
19  
18  
17  
16  
CLR  
OE  
D
4
Y
4
FCT823T  
D
5
Y
5
7
8
9
D
6
Y
6
D
7
Y
7
D
8
Y
8
10  
11  
12  
15  
14  
13  
CLR  
EN  
CP  
GND  
FCT825T (8-Bit Register)  
DIP/QSOP/SOIC  
Top View  
8
D
D
8
Q
Y
1
2
3
4
5
6
24  
23  
22  
21  
OE  
V
CC  
1
CP EN CLR  
OE  
2
OE  
3
CP  
EN  
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
Y
0
Y
1
20  
19  
18  
17  
16  
Y
2
FCT825T  
CLR  
Y
3
Y
4
7
OE  
1
Y
5
8
OE  
2
Y
6
9
OE  
3
Y
7
10  
11  
12  
15  
14  
CLR  
EN  
CP  
GND  
13  
2
CY74FCT821T  
CY74FCT823T  
CY74FCT825T  
Pin Description  
Name  
I/O  
Description  
D
I
I
The D flip-flop data inputs.  
CLR  
When CLR is LOW and OE is LOW, the Q outputs are LOW. When CLR is HIGH, data can be  
entered into the register.  
CP  
Y
O
O
I
Clock Pulse for the register; enters data into the register on the LOW-to-HIGH transition.  
The register three-state outputs.  
EN  
Clock Enable. When EN is LOW, data on the D input is transferred to the Q output on the  
LOW-to-HIGH clock transition. When EN is HIGH, the Q outputs do not change state,  
regardless of the data or clock input transitions.  
OE  
I
Output Control. When OE is HIGH, the Y outputs are in the high-impedance state. When OE  
is LOW, the TRUE register data is present at the Y outputs.  
Function Table[2]  
Inputs  
EN  
Internal Outputs  
OE  
CLR  
D
CP  
Q
Y
Function  
H
H
H
H
L
L
L
H
L
H
Z
Z
High Z  
H
L
L
L
X
X
X
X
X
X
L
L
Z
L
Clear  
Hold  
Load  
H
L
H
H
H
H
X
X
X
X
NC  
NC  
Z
NC  
H
H
L
H
H
H
H
L
L
L
L
L
H
L
L
H
L
Z
Z
L
L
H
H
H
Maximum Ratings[3,4]  
DC Output Current (Maximum Sink Current/Pin) ......120 mA  
Power Dissipation..........................................................0.5W  
(Above which the useful life may be impaired. For user  
guidelines, not tested.)  
Static Discharge Voltage............................................>2001V  
(per MIL-STD-883, Method 3015)  
Storage Temperature ............................. −65°C to +150°C  
Ambient Temperature with  
Power Applied........................................ −65°C to +135°C  
Operating Range  
Ambient  
Supply Voltage to Ground Potential ............. −0.5V to +7.0V  
DC Input Voltage ....................................... −0.5V to +7.0V  
DC Output Voltage..................................... −0.5V to +7.0V  
Range  
Range  
Temperature  
VCC  
Commercial All  
40°C to +85°C  
5V ± 5%  
Notes:  
2. H = HIGH Voltage Level, L = LOW Voltage Level, X = Don’t Care, NC = No Change,  
3. Unless otherwise noted, these limits are over the operating free-air temperature range.  
= LOW-to-HIGH Transition, Z = HIGH Impedance.  
4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.  
3
CY74FCT821T  
CY74FCT823T  
CY74FCT825T  
Electrical Characteristics Over the Operating Range  
Parameter  
VOH  
VOH  
VOL  
VIH  
Description  
Output HIGH Voltage  
Output HIGH Voltage  
Output LOW Voltage  
Input HIGH Voltage  
Input LOW Voltage  
Hysteresis[6]  
Test Conditions  
VCC = Min., IOH = 32 mA  
VCC = Min., IOH = 15 mA  
VCC = Min., IOL = 64 mA  
Min.  
2.0  
Typ.[5]  
Max.  
Unit  
V
2.4  
3.3  
0.3  
V
0.55  
0.8  
V
2.0  
V
VIL  
V
VH  
All inputs  
0.2  
V
VIK  
Input Clamp Diode Voltage  
Input HIGH Current  
Input HIGH Current  
Input LOW Current  
VCC = Min., IIN = 18 mA  
VCC = Max., VIN = VCC  
VCC = Max., VIN = 2.7V  
VCC = Max., VIN = 0.5V  
VCC = Max., VOUT = 2.7V  
0.7  
1.2  
5
V
II  
µA  
µA  
µA  
µA  
IIH  
±1  
±1  
10  
IIL  
IOZH  
Off State HIGH-Level Output  
Current  
IOZL  
Off State LOW-Level  
Output Current  
VCC = Max., VOUT = 0.5V  
10  
µA  
IOS  
Output Short Circuit Current[7]  
VCC = Max., VOUT = 0.0V  
VCC = 0V, VOUT = 4.5V  
60  
120  
225  
±1  
mA  
IOFF  
Power-Off Disable  
µA  
Capacitance[6]  
Parameter  
Description  
Typ.[5]  
Max.  
Unit  
CIN  
Input Capacitance  
Output Capacitance  
5
9
10  
12  
pF  
pF  
COUT  
Notes:  
5. Typical values are at VCC=5.0V, TA=+25˚C ambient.  
6. This parameter is specified but not tested.  
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample  
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of  
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter  
tests, IOS tests should be performed last.  
4
CY74FCT821T  
CY74FCT823T  
CY74FCT825T  
Power Supply Characteristics  
Parameter  
Description  
Test Conditions  
Typ.[5]  
Max.  
Unit  
ICC  
Quiescent Power Supply  
Current  
VCC=Max., VIN0.2V, VINVCC0.2V  
0.1  
0.2  
mA  
ICC  
Quiescent Power Supply  
Current (TTL inputs HIGH)  
VCC=Max., VIN=3.4V,[8]  
f1=0, Outputs Open  
0.5  
2.0  
mA  
ICCD  
Dynamic Power Supply  
Current[9]  
VCC=Max., One Bit Toggling, 50% Duty Cycle,  
Outputs Open, OE=EN=GND,  
0.06  
0.12  
mA/MHz  
VIN0.2V or VINVCC0.2V  
IC  
Total Power Supply Current[10] VCC=Max., f0=10 MHz, 50% Duty Cycle,  
Outputs Open, One Bit Toggling  
0.7  
1.4  
mA  
at f1=5 MHz, OE=EN=GND,  
VIN0.2V or VINVCC0.2V  
VCC=Max., f0=10 MHz, 50% Duty Cycle,  
Outputs Open, One Bit Toggling at f1=5 MHz,  
OE=EN=GND, VIN=3.4V or VIN=GND  
1.2  
1.6  
3.4  
mA  
mA  
VCC=Max., f0=10 MHz, 50% Duty Cycle,  
Outputs Open, Eight Bits Toggling  
at f1=2.5 MHz, OE=EN=GND,  
3.2[11]  
VIN0.2V or VINVCC0.2V  
VCC=Max., f0=10 MHz,50% Duty Cycle,  
Outputs Open, Eight Bits Toggling  
at f1=2.5 MHz, OE=EN=GND,  
VIN=3.4V or VIN=GND  
3.9  
12.2[11]  
mA  
Notes:  
8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.  
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.  
10. IC = IQUIESCENT + IINPUTS + IDYNAMIC  
IC = ICC+ICCDHNT+ICCD(f0/2 + f1N1)  
ICC = Quiescent Current with CMOS input levels  
ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)  
DH = Duty Cycle for TTL inputs HIGH  
NT = Number of TTL inputs at DH  
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)  
f0 = Clock frequency for registered devices, otherwise zero  
f1 = Input signal frequency  
N1 = Number of inputs changing at f1  
All currents are in milliamps and all frequencies are in megahertz.  
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.  
5
CY74FCT821T  
CY74FCT823T  
CY74FCT825T  
Switching Characteristics Over the Operating Range[12]  
CY74FCT821AT CY74FCT821BT CY74FCT821CT  
CY74FCT823AT CY74FCT823BT CY74FCT823CT  
CY74FCT825AT CY74FCT825BT CY74FCT825CT  
Commercial  
Commercial  
Commercial  
Param.  
Description  
Test Load  
Min.  
Max.  
Min.  
Max.  
Min.  
Max. Unit Fig. No.[13]  
tPLH  
tPHL  
Propagation Delay  
CP to Y, (OE=LOW)  
CL=50 pF  
RL=500Ω  
10.0  
20.0  
14.0  
12.0  
23.0  
7.0  
7.5  
15.0  
9.0  
6.0  
12.5  
8.0  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
1, 5  
tPLH  
tPHL  
Propagation Delay  
CL=300 pF  
RL=500Ω  
1, 5  
CP to Y, (OE=LOW)[6]  
tPLH  
Propagation Delay  
CLR to Y  
CL=50 pF  
RL=500Ω  
1, 5  
tPZH  
tPZL  
Output Enable Time  
OE to Y  
CL=50 pF  
RL=500Ω  
8.0  
7.0  
1, 7, 8  
1, 7, 8  
1, 7, 8  
1, 7, 8  
tPZH  
tPZL  
Output Enable Time  
OE to Y[6]  
CL=300 pF  
RL=500Ω  
15.0  
6.5  
12.5  
6.0  
tPHZ  
tPHL  
Output Disable Time  
OE to Y[6]  
CL=5 pF  
RL=500Ω  
tPHZ  
tPHL  
Output Disable Time  
OE to Y  
CL=50 pF  
RL=500Ω  
8.0  
7.5  
6.5  
tSU  
tH  
Data to CP, Set-Up Time  
Data to CP, Hold Time  
4.0  
2.0  
4.0  
3.0  
1.5  
3.0  
3.0  
1.5  
3.0  
ns  
ns  
ns  
4
4
4
tSU  
Enable EN to CP,  
Set-Up Time  
tH  
Enable EN to CP,  
Hold Time  
2.0  
6.0  
0.0  
6.0  
0.0  
6.0  
ns  
ns  
4
6
CL=50 pF  
RL=500Ω  
tREM  
tW  
Clear Recovery Time,  
CLR to CP  
Clock Pulse Width  
7.0  
6.0  
6.0  
6.0  
6.0  
6.0  
ns  
ns  
5
5
tW  
CLR Pulse Width LOW  
Notes:  
12. Minimum limits are specified but not tested on Propagation Delays.  
13. See “Parameter Measurement Information.”  
6
CY74FCT821T  
CY74FCT823T  
CY74FCT825T  
Ordering Information—FCT821T  
Speed  
Package  
Name  
Operating  
Range  
(ns)  
Ordering Code  
CY74FCT821CTQCT  
Package Type  
24-Lead (150-Mil) QSOP  
6.0  
Q13  
S13  
Commercial  
Commercial  
Commercial  
CY74FCT821CTSOC/SOCT  
CY74FCT821BTPC  
24-Lead (300-Mil) Molded SOIC  
24-Lead (300-Mil) Molded DIP  
24-Lead (300-Mil) Molded SOIC  
24-Lead (150-Mil) QSOP  
7.5  
P13/13A  
S13  
CY74FCT821BTSOC/SOCT  
CY74FCT821ATQCT  
10.0  
Q13  
CY74FCT821ATSOC/SOCT  
S13  
24-Lead (300-Mil) Molded SOIC  
Ordering Information—FCT823T  
Speed  
Package  
Name  
Operating  
Range  
(ns)  
Ordering Code  
CY74FCT823CTQCT  
CY74FCT823CTSOC/SOCT  
CY74FCT823BTPC  
Package Type  
24-Lead (150-Mil) QSOP  
6.0  
Q13  
S13  
Commercial  
24-Lead (300-Mil) Molded SOIC  
24-Lead (300-Mil) Molded DIP  
24-Lead (300-Mil) Molded DIP  
24-Lead (150-Mil) QSOP  
7.5  
P13/13A  
P13/13A  
Q13  
Commercial  
Commercial  
10.0  
CY74FCT823ATPC  
CY74FCT823ATQCT  
CY74FCT823ATSOC/SOCT  
S13  
24-Lead (300-Mil) Molded SOIC  
Ordering Information—FCT825T  
Speed  
(ns)  
Package  
Name  
Operating  
Range  
Ordering Code  
Package Type  
6.0  
CY74FCT825CTQCT  
Q13  
24-Lead (150-Mil) QSOP  
Commercial  
Document #: 3800282B  
7
CY74FCT821T  
CY74FCT823T  
CY74FCT825T  
Package Diagrams  
24-Lead (300-Mil) Molded DIP P13/P13A  
24-Lead Quarter Size Outline Q13  
8
CY74FCT821T  
CY74FCT823T  
CY74FCT825T  
Package Diagrams (continued)  
24-Lead (300-Mil) Molded SOIC S13  
9
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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