CY74FCT841CTSOCG4 [TI]

FCT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, GREEN, SOIC-24;
CY74FCT841CTSOCG4
型号: CY74FCT841CTSOCG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

FCT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, GREEN, SOIC-24

驱动 光电二极管 输出元件 逻辑集成电路
文件: 总12页 (文件大小:306K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CY54FCT841T, CY74FCT841T  
10-BIT LATCHES  
WITH 3-STATE OUTPUTS  
SCCS035A – SEPTEMBER 1994 – REVISED OCTOBER 2001  
CY54FCT841T . . . D PACKAGE  
CY74FCT841T . . . P, Q, OR SO PACKAGE  
(TOP VIEW)  
Function, Pinout, and Drive Compatible  
With FCT, F, and AM29841 Logic  
Reduced V  
Equivalent FCT Functions  
(Typically = 3.3 V) Versions of  
OH  
OE  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
V
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
CC  
0
D
2
Edge-Rate Control Circuitry for  
Significantly Improved Noise  
Characteristics  
0
D
1
3
1
D
4
2
2
D
D
D
D
D
D
D
5
3
4
5
6
7
8
9
3
I
Supports Partial-Power-Down Mode  
off  
6
4
Operation  
7
5
Matched Rise and Fall Times  
8
6
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
9
7
10  
11  
8
9
– 1000-V Charged-Device Model (C101)  
GND 12  
13 LE  
Fully Compatible With TTL Input and  
Output Logic Levels  
High-Speed Parallel Latches  
Buffered Common Latch-Enable Input  
3-State Outputs  
CY54FCT841T  
– 32-mA Output Sink Current  
– 12-mA Output Source Current  
CY74FCT841T  
– 64-mA Output Sink Current  
– 32-mA Output Source Current  
description  
The ’FCT841T bus-interface latches are designed to eliminate additional packages required to buffer existing  
latches and provide additional data width for wider address/data paths or buses carrying parity. The ’FCT841T  
devices are buffered 10-bit-wide versions of the FCT373 function.  
TheFCT841Tdeviceshigh-performanceinterfaceisdesignedforhigh-capacitance-loaddrivecapability, while  
providing low-capacitance bus loading at both inputs and outputs. Outputs are designed for low-capacitance  
bus loading in the high-impedance state.  
These devices are fully specified for partial-power-down applications using I . The I circuitry disables the  
off  
off  
outputs, preventing damaging current backflow through the device when it is powered down.  
PIN DESCRIPTION  
NAME  
I/O  
DESCRIPTION  
D
I
Latch data inputs  
Latch-enable input. The latches are transparent when LE is high.  
Input data is latched on the high-to-low transition.  
LE  
Y
I
O
I
3-state latch outputs  
Output-enable control. When OE is low, the outputs are enabled.  
When OE is high, the outputs are in the high-impedance (off) state.  
OE  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2001, Texas Instruments Incorporated  
On products compliant to MIL-PRF-38535, all parameters are tested  
unless otherwise noted. On all other products, production  
processing does not necessarily include testing of all parameters.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CY54FCT841T, CY74FCT841T  
10-BIT LATCHES  
WITH 3-STATE OUTPUTS  
SCCS035A SEPTEMBER 1994 REVISED OCTOBER 2001  
ORDERING INFORMATION  
SPEED  
(ns)  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
QSOP Q  
SOIC SO  
DIP P  
Tape and reel  
Tube  
5.5  
5.5  
5.5  
6.5  
9
CY74FCT841CTQCT  
CY74FCT841CTSOC  
CY74FCT841CTSOCT  
CY74FCT841BTPC  
CY74FCT841ATSOC  
CY74FCT841ATSOCT  
CY54FCT841ATDMB  
FCT841C  
FCT841C  
Tape and reel  
Tube  
40°C to 85°C  
55°C to 125°C  
CY74FCT841BTPC  
FCT841A  
Tube  
SOIC SO  
Tape and reel  
Tube  
9
CDIP D  
10  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
FUNCTION TABLE  
INTERNAL  
INPUTS  
OUTPUTS  
FUNCTION  
OE  
H
H
H
H
L
LE  
X
D
X
L
O
X
Y
Z
H
H
L
L
Z
Z
H
X
L
H
Z
NC  
L
Z
Latched (Z)  
Transparent  
Latched  
H
H
L
L
L
H
X
H
H
NC  
L
NC  
H = High logic level, L = Low logic level, X = Dont care,  
NC = No change, Z = High-impedance state  
logic diagram (positive logic)  
1
OE  
13  
LE  
23  
LE  
D
Q
Y
0
2
D
0
To Nine Other Channels  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CY54FCT841T, CY74FCT841T  
10-BIT LATCHES  
WITH 3-STATE OUTPUTS  
SCCS035A SEPTEMBER 1994 REVISED OCTOBER 2001  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V  
DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA  
Package thermal impedance, θ  
(see Note 1): P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W  
(see Note 2): Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W  
(see Note 2): SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W  
JA  
Ambient temperature range with power applied, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 135°C  
A
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The package thermal impedance is calculated in accordance with JESD 51-3.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions (see Note 3)  
CY54FCT841T  
CY74FCT841T  
MIN NOM MAX  
UNIT  
MIN NOM  
MAX  
V
V
V
Supply voltage  
4.5  
2
5
5.5  
4.75  
2
5
5.25  
V
V
CC  
High-level input voltage  
Low-level input voltage  
High-level output current  
Low-level output current  
Operating free-air temperature  
IH  
0.8  
12  
32  
0.8  
32  
64  
V
IL  
I
I
mA  
mA  
°C  
OH  
OL  
T
A
55  
125  
40  
85  
NOTE 3: All unused inputs of the device must be held at V  
or GND to ensure proper device operation.  
CC  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CY54FCT841T, CY74FCT841T  
10-BIT LATCHES  
WITH 3-STATE OUTPUTS  
SCCS035A SEPTEMBER 1994 REVISED OCTOBER 2001  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
CY54FCT841T  
CY74FCT841T  
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN TYP  
MAX  
MIN TYP  
MAX  
V
V
V
= 4.5 V,  
= 4.75 V,  
= 4.5 V,  
I
I
I
I
I
I
I
= 18 mA  
= 18 mA  
0.7  
1.2  
CC  
CC  
CC  
IN  
V
V
IK  
0.7  
1.2  
IN  
= 12 mA  
= 32 mA  
= 15 mA  
= 32 mA  
= 64 mA  
2.4  
3.3  
OH  
OH  
OH  
OL  
OL  
2
V
OH  
V
V
CC  
= 4.75 V  
2.4  
3.3  
V
V
= 4.5 V,  
0.3  
0.2  
0.55  
CC  
V
V
V
V
OL  
= 4.75 V,  
0.3  
0.2  
0.55  
CC  
All inputs  
hys  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 5.5 V,  
= 5.25 V,  
= 5.5 V,  
= 5.25 V,  
= 5.5 V,  
= 5.25 V,  
= 5.5 V,  
= 5.25 V,  
= 5.5 V,  
= 5.25 V,  
= 5.5 V,  
= 5.25 V,  
= 0 V,  
V
V
V
V
V
V
V
V
V
V
V
V
V
= V  
= V  
5
±1  
IN  
IN  
IN  
IN  
IN  
IN  
CC  
CC  
I
I
I
I
I
µA  
I
5
±1  
= 2.7 V  
= 2.7 V  
= 0.5 V  
= 0.5 V  
µA  
µA  
µA  
µA  
IH  
±1  
IL  
±1  
= 2.7 V  
= 2.7 V  
= 0.5 V  
= 0.5 V  
= 0 V  
10  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OZH  
OZL  
10  
10  
225  
10  
60  
120  
mA  
µA  
I
I
OS  
= 0 V  
60  
120  
225  
±1  
= 4.5 V  
±1  
off  
V
V
V
V
V
= 5.5 V,  
V
0.2 V,  
V
V
V  
V  
0.2 V  
0.2 V  
0.1  
0.5  
0.2  
CC  
CC  
CC  
CC  
CC  
IN  
IN  
IN  
CC  
I
mA  
CC  
= 5.25 V,  
V
0.2 V,  
0.1  
0.5  
0.2  
2
IN  
CC  
§
= 5.5 V, V = 3.4 V , f = 0, Outputs open  
IN  
2
1
I  
mA  
CC  
§
= 5.25 V, V = 3.4 V , f = 0, Outputs open  
IN  
1
= 5.5 V, One input switching at 50% duty cycle,  
Outputs open, OE = GND, LE = V  
,
0.06  
0.12  
CC  
V
IN  
0.2 V or V V  
0.2 V  
mA/  
MHz  
IN CC  
I
CCD  
V
CC  
= 5.25 V, One input switching at 50% duty cycle,  
Outputs open, OE = GND, LE = V  
,
0.06  
0.12  
CC  
V
IN  
0.2 V or V V  
0.2 V  
IN CC  
Typical values are at V  
= 5 V, T = 25°C.  
CC  
A
Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus  
and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise,  
prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In  
any sequence of parameter tests, I  
tests should be performed last.  
OS  
§
Per TTL-driven input (V = 3.4 V); all other inputs at V  
or GND  
IN CC  
This parameter is derived for use in total power-supply calculations.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CY54FCT841T, CY74FCT841T  
10-BIT LATCHES  
WITH 3-STATE OUTPUTS  
SCCS035A SEPTEMBER 1994 REVISED OCTOBER 2001  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted) (continued)  
CY54FCT841T  
CY74FCT841T  
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN TYP  
MAX  
MIN TYP  
MAX  
V
V
0.2 V or  
V 0.2 V  
CC  
One bit switching  
IN  
IN  
0.7  
1
1.4  
at f = 10 MHz  
1
V
CC  
= 5.5 V,  
at 50% duty cycle  
10 bits switching  
V
IN  
= 3.4 V or GND  
2.4  
Outputs open,  
OE = GND,  
V
IN  
V
IN  
0.2 V or  
||  
3.2  
1
LE = V  
CC  
V  
CC  
0.2 V  
at f = 2.5 MHz  
1
at 50% duty cycle  
||  
V
IN  
= 3.4 V or GND  
4.1 13.2  
#
I
C
mA  
V
V
0.2 V or  
One bit switching  
at f = 10 MHz  
1
at 50% duty cycle  
IN  
IN  
0.7  
1
1.4  
2.4  
V  
CC  
0.2 V  
V
= 5.25 V,  
CC  
V
IN  
= 3.4 V or GND  
Outputs open,  
OE = GND,  
LE = V  
CC  
V
IN  
V
IN  
0.2 V or  
10 bits switching  
at f = 2.5 MHz  
1
at 50% duty cycle  
||  
||  
1
3.2  
V  
0.2 V  
CC  
V
IN  
= 3.4 V or GND  
4.1 13.2  
C
C
5
9
10  
12  
5
9
10  
12  
pF  
pF  
i
o
#
Typical values are at V  
= 5 V, T = 25°C.  
A
CC  
H
I
C
= I  
+ I  
CC  
× D × N + I  
(f /2 + f × N )  
CC  
T
CCD 0 1 1  
Where:  
I
I
I  
D
N
= Total supply current  
= Power-supply current with CMOS input levels  
= Power-supply current for a TTL high input (V = 3.4 V)  
IN  
= Duty cycle for TTL inputs high  
C
CC  
CC  
H
T
= Number of TTL inputs at D  
H
I
f
f
= Dynamic current caused by an input transition pair (HLH or LHL)  
= Clock frequency for registered devices, otherwise zero  
= Input signal frequency  
CCD  
0
1
N
= Number of inputs changing at f  
1
1
All currents are in milliamperes and all frequencies are in megahertz.  
||  
Values for these conditions are examples of the I  
CC  
formula.  
timing requirements over recommended operating free-air temperature range (unless otherwise  
noted) (see Figure 1)  
CY54FCT841AT CY74FCT841AT CY74FCT841BT CY74FCT841CT  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
t
w
t
su  
t
h
Pulse duration, LE high  
Setup time, data before LE↑  
Hold time, data after LE↑  
5
4
4
4
ns  
ns  
ns  
2.5  
3
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CY54FCT841T, CY74FCT841T  
10-BIT LATCHES  
WITH 3-STATE OUTPUTS  
SCCS035A SEPTEMBER 1994 REVISED OCTOBER 2001  
switching characteristics over operating free-air temperature range (see Figure 1)  
CY54FCT841AT CY74FCT841AT  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
TEST LOAD  
UNIT  
ns  
MIN  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
MAX  
10  
10  
15  
15  
13  
13  
20  
20  
13  
13  
25  
25  
9
MIN  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
MAX  
9
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PZH  
PZL  
PZH  
PZL  
PHZ  
PLZ  
PHZ  
PLZ  
C
R
= 50 pF,  
= 500 Ω  
L
L
D
Y
Y
Y
Y
Y
Y
Y
Y
9
13  
13  
12  
12  
16  
16  
11.5  
11.5  
23  
23  
7
C
R
= 300 pF,  
L
D
ns  
= 500 Ω  
L
C
R
= 50 pF,  
= 500 Ω  
L
L
LE  
LE  
OE  
OE  
OE  
OE  
ns  
C
R
= 300 pF,  
L
ns  
= 500 Ω  
L
C
R
= 50 pF,  
= 500 Ω  
L
L
ns  
C
R
= 300 pF,  
L
ns  
= 500 Ω  
L
C
= 5 pF,  
= 500 Ω  
L
ns  
R
9
7
L
10  
10  
8
C
R
= 50 pF,  
= 500 Ω  
L
L
ns  
8
switching characteristics over operating free-air temperature range (see Figure 1)  
CY74FCT841BT CY74FCT841CT  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
TEST LOAD  
UNIT  
ns  
MIN  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
MAX  
6.5  
6.5  
13  
13  
8
MIN  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
MAX  
5.5  
5.5  
13  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PLH  
PHL  
PZH  
PZL  
PZH  
PZL  
PHZ  
PLZ  
PHZ  
PLZ  
C
R
= 50 pF,  
= 500 Ω  
L
L
D
Y
Y
Y
Y
Y
Y
Y
Y
C
R
= 50 pF,  
= 500 Ω  
L
L
D
ns  
13  
6.4  
6.4  
15  
C
R
= 50 pF,  
= 500 Ω  
L
L
LE  
LE  
OE  
OE  
OE  
OE  
ns  
8
15.5  
15.5  
8
C
R
= 300 pF,  
L
ns  
= 500 Ω  
15  
L
6.5  
6.5  
12  
C
R
= 50 pF,  
= 500 Ω  
L
L
ns  
8
14  
14  
6
C
R
= 300 pF,  
L
ns  
= 500 Ω  
12  
L
5.7  
5.7  
6
C
= 5 pF,  
= 500 Ω  
L
ns  
R
6
L
7
C
= 50 pF  
= 500 Ω,  
L
ns  
R
L
7
6
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CY54FCT841T, CY74FCT841T  
10-BIT LATCHES  
WITH 3-STATE OUTPUTS  
SCCS035A SEPTEMBER 1994 REVISED OCTOBER 2001  
PARAMETER MEASUREMENT INFORMATION  
7 V  
Open  
GND  
S1  
500 Ω  
From Output  
Under Test  
From Output  
Under Test  
Test  
Point  
TEST  
S1  
t
/t  
Open  
7 V  
PLH PHL  
t /t  
C
= 50 pF  
C
= 50 pF  
L
L
500 Ω  
500 Ω  
PLZ PZL  
/t  
(see Note A)  
(see Note A)  
t
Open  
PHZ PZH  
LOAD CIRCUIT FOR  
TOTEM-POLE OUTPUTS  
LOAD CIRCUIT FOR  
3-STATE OUTPUTS  
3 V  
0 V  
1.5 V  
Timing Input  
Data Input  
t
w
t
h
t
3 V  
su  
3 V  
0 V  
1.5 V  
Input  
1.5 V  
1.5 V  
1.5 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
3 V  
0 V  
3 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Input  
t
t
t
t
t
t
PLH  
PHL  
PLH  
PZL  
PZH  
PLZ  
3.5 V  
V
Output  
Waveform 1  
(see Note B)  
OH  
In-Phase  
Output  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
V
V
+ 0.3 V  
OL  
V
OL  
V
OL  
t
t
PHL  
PHZ  
V
V
V
OH  
OH  
Output  
Waveform 2  
(see Note B)  
Out-of-Phase  
Output  
0.3 V  
OH  
1.5 V  
1.5 V  
0 V  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. The outputs are measured one at a time with one input transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
LCCC  
CDIP  
LCCC  
SOIC  
Drawing  
5962-88575013A  
CY54FCT841ATDMB  
CY54FCT841ATLMB  
CY74FCT841ATSOC  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
FK  
28  
24  
28  
24  
1
1
1
TBD  
TBD  
TBD  
POST-PLATE N / A for Pkg Type  
A42 N / A for Pkg Type  
POST-PLATE N / A for Pkg Type  
JT  
FK  
DW  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CY74FCT841ATSOCE4  
CY74FCT841ATSOCG4  
CY74FCT841ATSOCT  
CY74FCT841ATSOCTE4  
CY74FCT841ATSOCTG4  
CY74FCT841BTPC  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
DW  
DW  
DW  
DW  
DW  
NT  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
15  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CY74FCT841BTPCE4  
CY74FCT841CTQCT  
NT  
15  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SSOP/  
QSOP  
DBQ  
DBQ  
DBQ  
DW  
DW  
DW  
DW  
DW  
DW  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
CY74FCT841CTQCTE4  
CY74FCT841CTQCTG4  
CY74FCT841CTSOC  
SSOP/  
QSOP  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SSOP/  
QSOP  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CY74FCT841CTSOCE4  
CY74FCT841CTSOCG4  
CY74FCT841CTSOCT  
CY74FCT841CTSOCTE4  
CY74FCT841CTSOCTG4  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
CY74FCT841ATSOCT  
CY74FCT841CTQCT  
SOIC  
DW  
24  
24  
2000  
2500  
330.0  
330.0  
24.4  
16.4  
10.75  
6.5  
15.7  
9.0  
2.7  
2.1  
12.0  
8.0  
24.0  
16.0  
Q1  
Q1  
SSOP/  
QSOP  
DBQ  
CY74FCT841CTSOCT  
SOIC  
DW  
24  
2000  
330.0  
24.4  
10.75  
15.7  
2.7  
12.0  
24.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CY74FCT841ATSOCT  
CY74FCT841CTQCT  
CY74FCT841CTSOCT  
SOIC  
SSOP/QSOP  
SOIC  
DW  
DBQ  
DW  
24  
24  
24  
2000  
2500  
2000  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
41.0  
33.0  
41.0  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Applications  
Audio  
Automotive  
Broadband  
Digital Control  
Medical  
Military  
Optical Networking  
Security  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
www.ti.com/audio  
Data Converters  
DLP® Products  
DSP  
Clocks and Timers  
Interface  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/medical  
www.ti.com/military  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
dsp.ti.com  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
power.ti.com  
microcontroller.ti.com  
www.ti-rfid.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
Telephony  
Video & Imaging  
Wireless  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2009, Texas Instruments Incorporated  

相关型号:

CY74FCT841CTSOCR

Bus Driver, FCT Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24
CYPRESS

CY74FCT841CTSOCT

10-Bit Latch
TI

CY74FCT841CTSOCTE4

FCT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, GREEN, SOIC-24
TI

CY74FCT841T

10-Bit Latch
TI

CY74FCT841TDIP

10-Bit Latch
TI

CY74FCT841TQSOP

10-Bit Latch
TI

CY74FCT841TSOIC

10-Bit Latch
TI

CY74S189DC

x4 SRAM
ETC

CY74UBL5911PAC

Logic Circuit, CMOS, PDSO56, 0.240 INCH, 0.0196 INCH PITCH, TSSOP-56
CYPRESS

CY74UBL5911PVC

Logic Circuit, CMOS, PDSO56, 0.300 INCH, 0.025 INCH PITCH, SSOP-56
CYPRESS

CY750

Stepper System Controller
ETC

CY7A

Quartz Crystal Leaded HC49 Crystal
CRYSTEKMICROW