DAC34SH84_15 [TI]
Quad-Channel, 16-Bit, 1.5 GSPS Digital-to-Analog Converter (DAC);型号: | DAC34SH84_15 |
厂家: | TEXAS INSTRUMENTS |
描述: | Quad-Channel, 16-Bit, 1.5 GSPS Digital-to-Analog Converter (DAC) |
文件: | 总77页 (文件大小:1012K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DAC34SH84
www.ti.com
SLAS808B –FEBRUARY 2012–REVISED JULY 2012
Quad-Channel, 16-Bit, 1.5 GSPS Digital-to-Analog Converter (DAC)
Check for Samples: DAC34SH84
1
FEATURES
DESCRIPTION
The DAC34SH84 is a very low-power, high-dynamic
range, quad-channel, 16-bit digital-to-analog
converter (DAC) with a sample rate as high as
1.5 GSPS.
•
Low Power: 1.8 W at 1.5 GSPS, Full Operating
Condition
•
•
Multi-DAC Synchronization
Selectable 2×, 4×, 8×, 16× Interpolation Filter
The device includes features that simplify the design
of complex transmit architectures: 2× to 16× digital
interpolation filters with over 90 dB of stop-band
attenuation simplify the data interface and
reconstruction filters. Independent complex mixers
allow flexible carrier placement. A high-performance
low-jitter clock multiplier simplifies clocking of the
device without significant impact on the dynamic
range. The digital quadrature modulator correction
(QMC) enables complete IQ compensation for gain,
offset and phase between channels in direct
upconversion applications.
–
Stop-Band Attenuation > 90 dBc
•
Flexible On-Chip Complex Mixing
–
–
Two Independent Fine Mixers With 32-Bit
NCOs
Power-Saving Coarse Mixers: ±n × fS / 8
•
•
High-Performance, Low-Jitter Clock-
Multiplying PLL
Digital I and Q Correction
–
Gain, Phase and Offset
•
•
Digital Inverse Sinc Filters
Digital data is input to the device through a 32-bit
wide LVDS data bus with on-chip termination. The
wide bus allows the processing of high-bandwidth
signals. The device includes a FIFO, data pattern
checker, and parity test to ease the input interface.
The interface also allows full synchronization of
multiple devices.
32-Bit DDR Flexible LVDS Input Data Bus
–
–
–
–
8-Sample Input FIFO
Supports Data Rates up to 750 MSPS
Data Pattern Checker
Parity Check
•
•
•
Temperature Sensor
The device is characterized for operation over the
entire industrial temperature range of –40°C to 85°C
and is available in a 196-ball, 12-mm × 12-mm, 0.8-
mm pitch BGA package.
Differential Scalable Output: 10 mA to 30 mA
196-Ball, 12-mm × 12-mm BGA
The DAC34SH84 low-power, high-bandwidth support,
superior crosstalk, high dynamic range, and features
are an ideal fit for next-generation communication
systems.
APPLICATIONS
•
•
•
Cellular Base Stations
Diversity Transmit
Wideband Communications
Space
Space
Space
Space
Space
Space
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ADVANCE INFORMATION concerns new products in the sampling
or preproduction phase of development. Characteristic data and
other specifications are subject to change without notice.
Copyright © 2012, Texas Instruments Incorporated
DAC34SH84
SLAS808B –FEBRUARY 2012–REVISED JULY 2012
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
DACCLKP
EXTIO
BIASJ
Low Jitter
PLL
LVPECL
LVDS
Clock Distribution
1.2-V
Reference
DACCLKN
DATACLKP
AB
32-Bit NCO
Programmable
Delay
QMC
A-offset
cos
sin
DATACLKN
DAB15P
FIR0
FIR1
FIR2
FIR3
FIR4
LVDS
IOUTA1
IOUTA2
x
16-b
DACA
x2
x2
x2
x2
sin(x)
16
DAB15N
•
•
•
•
•
•
•
•
•
AB-Channel
59 taps
x2
23 taps
11 taps
11 taps
x2
9 taps
LVDS
LVDS
DAB0P
IOUTB1
IOUTB2
x
16-b
DACB
x2
x2
sin(x)
16
16
DAB0N
QMC
B-offset
DCD15P
DCD15N
CMIX Control
( nꢀFs/8)
DAC
Gain
2x–16x Interpolation
•
•
•
•
•
•
•
•
•
QMC
C-offset
FIR0
x2
FIR1
FIR2
FIR3
x2
FIR4
LVDS
LVDS
LVDS
LVDS
DCD0P
IOUTC1
IOUTC2
x
16-b
DACC
x2
x2
sin(x)
16
DCD0N
SYNCP
CD-Channel
SYNCN
59 taps
x2
23 taps
11 taps
11 taps
x2
9 taps
IOUTD1
IOUTD2
x
PARITYCDP
16-b
DACD
x2
x2
sin(x)
PARITYCDN
QMC
D-offset
cos
sin
ISTR/PARITYABP
CD
32-Bit NCO
ISTR/PARITYABN
OSTRP
Temp
Sensor
AVDD
LVPECL
Control Interface
OSTRN
B0460-01
2
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SLAS808B –FEBRUARY 2012–REVISED JULY 2012
PINOUT
ZAY Package
(Top View)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
IOUT
AP
IOUT
AN
IOUT
BN
IOUT
BP
IOUT
CP
IOUT
CN
IOUT
DN
IOUT
DP
14
13
12
11
10
9
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
DAC
CLKP
CLK
VDD
CLK
VDD
IO
VDD2
LPF
PLL
GND EXTIO BIASJ
GND ALARM SDO
DAC
CLKN
PLL
AVDD AVDD
TEST
MODE
AVDD AVDD AVDD AVDD AVDD AVDD
GND SLEEP SDIO
RESET
DAC
VDD
DAC
VDD
DAC
VDD
DAC
VDD
DAC
VDD
DAC
VDD
GND
GND
GND
GND
AVDD
AVDD
GND
SDENB
B
OSTR OSTR
N
DAC
VDD
DAC
VDD
DAC
VDD
DAC
VDD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND TXENA SCLK
P
SYNC SYNC
P
PARITY PARITY
GND
8
GND
GND
GND
GND
N
CDP
CDN
DAB
15P
DAB
15N
DIG
VDD
DIG
VDD
DCD
0P
DCD
0N
7
GND VFUSE
VFUSE GND
DAB
14P
DAB
14N
IO
GND
DIG
VDD
DIG
VDD
IO
DCD
1P
DCD
1N
6
GND
VDD
VDD
DAB
13P
DAB
13N
IO
GND
DIG
VDD
DIG
VDD
IO
VDD
IO
VDD
DIG
VDD
DIG
VDD
IO
DCD
2P
DCD
2N
5
GND
VDD
VDD
DAB
12P
DAB
12N
DAB
8P
DAB
6P
DAB
4P
DAB
2P
DAB
0P
DCD
15P
DCD
14P
DCD
12P
DCD
10P
DCD
8P
DCD
3P
DCD
3N
4
DAB
11P
DAB
11N
DAB
8N
DAB
6N
DAB
4N
DAB
2N
DAB
0N
DCD
15N
DCD
14N
DCD
12N
DCD
10N
DCD
8N
DCD
4P
DCD
4N
3
ISTR/
PARITY
ABP
DAB
10P
DAB
10N
DAB
7P
DAB
5P
DAB
3P
DAB
1P
DATA
CLKP
DCD
13P
DCD
11P
DCD
9P
DCD
7P
DCD
5P
DCD
5N
2
ISTR/
PARITY
ABN
DAB
9P
DAB
9N
DAB
7N
DAB
5N
DAB
3N
DAB
1N
DATA
CLKN
DCD
13N
DCD
11N
DCD
9N
DCD
7N
DCD
6P
DCD
6N
1
DAC Output
Clock Input
Data Input
3.3V Supply
1.2V Supply
(except for IOVDD2)
CMOS Pins
Miscellaneous
Sync/Parity Input
Ground
P0134-01
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PIN FUNCTIONS
PIN
I/O
DESCRIPTION
NAME
NO.
D10, E11,
F11, G11,
H11, J11,
K11, L10
AVDD
I
Analog supply voltage. (3.3 V)
CMOS output for ALARM condition. The ALARM output functionality is defined through the config7
register. Default polarity is active-high, but can be changed to active-low via the config0
alarm_out_pol control bit.
ALARM
N12
O
Full-scale output current bias. For 30-mA full-scale output current, connect 1.28 kΩ to ground.
Change the full-scale output current through coarse_dac(3:0) in config3, bit<15:12>.
BIASJ
H12
O
I
Internal clock buffer supply voltage. (1.35 V). It is recommended to isolate this supply from DIGVDD
and DACVDD.
CLKVDD
C12, K12
LVDS positive input data bits 0 through 15 for the AB-channel path. Internal 100-Ω termination
resistor. Data format relative to DATACLKP/N clock is double data rate (DDR).
A7, A6, A5,
A4, A3, A2,
A1, C4, C2,
D4, D2, E4,
E2, F4, F2,
G4
DAB15P is the most-significant data bit (MSB).
DAB0P is the least-significant data bit (LSB).
DAB[15..0]P
DAB[15..0]N
DCD[15..0]P
DCD[15..0]N
I
I
I
I
The order of the bus can be reversed via the config2 revbus bit.
B7, B6, B5,
B4, B3, B2,
B1, C3, C1,
D3, D1, E3,
E1, F3, F1,
G3
LVDS negative input data bits 0 through 15 for the AB-channel path. (See the preceding DAB[15:0]P
description.)
H4, J4, J2,
K4, K2, L4,
L2, M4, M2,
N1, N2, N3,
N4, N5, N6,
N7
LVDS positive input data bits 0 through 15 for the CD-channel path. Internal 100-Ω termination
resistor. Data format relative to DATACLKP/N clock is double data rate (DDR).
DCD15P is the most-significant data bit (MSB).
DCD0P is the least-significant data bit (LSB).
The order of the bus can be reversed via the config2 revbus bit.
H3, J3, J1,
K3, K1, L3,
L1, M3, M1,
P1, P2, P3,
P4, P5, P6,
P7
LVDS negative input data bits 0 through 15 for the CD-channel path. (See the preceding DCD[15:0]P
description.)
DACCLKP
DACCLKN
A12
A11
I
I
Positive external LVPECL clock input for DAC core with a self-bias
Complementary external LVPECL clock input for DAC core. (See the DACCLKP description.)
D9, E9, E10,
F10, G10,
H10, J10,
DAC core supply voltage. (1.35 V). It is recommended to isolate this supply from CLKVDD and
DIGVDD.
DACVDD
I
K10, K9, L9
LVDS positive input data clock. Internal 100-Ω termination resistor. Input data DAB[15:0]P/N and
DCD[15:0]P/N are latched on both edges of DATACLKP/N (double data rate).
DATACLKP
DATACLKN
G2
G1
I
I
LVDS negative input data clock. (See the DATACLKP description.)
E5, E6, E7,
F5, J5, K5,
K6, K7
DIGVDD
EXTIO
I
Digital supply voltage. (1.3 V). It is recommended to isolate this supply from CLKVDD and DACVDD.
Used as an external reference input when the internal reference is disabled through config27
G12
I/O extref_ena = 1. Used as an internal reference output when config27 extref_ena = 0 (default).
Requires a 0.1-μF decoupling capacitor to AGND when used as a reference output.
LVDS input strobe positive input. Internal 100-Ω termination resistor
The main functions of this input are to sync the FIFO pointer, to provide a sync source to the digital
blocks, and/or to act as a parity input for the AB-data bus.
These functions are captured with the rising edge of DATACLKP/N. This signal should be edge-
aligned with DAB[15:0]P/N and DCD[15:0]P/N.
The PARITY, SYNC, and ISTR inputs are rotated to allow complete reversal of the data interface
when setting the rev_interface bit in register config1.
ISTRP/
PARITYABP
H2
H1
I
I
ISTRN/
PARITYABN
LVDS input strope negative input. (See the ISTRP/PARITYABP description.)
4
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NAME
SLAS808B –FEBRUARY 2012–REVISED JULY 2012
PIN FUNCTIONS (continued)
PIN
I/O
DESCRIPTION
NO.
A10, A13,
A14, B10,
B11, B12,
B13, C5, C6,
C7, C8, C9,
C10, C13,
D8, D13,
D14, E8,
E12, E13,
F6, F7, F8,
F9, F12, F13,
G6, G7, G8,
G9, G13,
GND
I
These pins are ground for all supplies.
G14, H6, H7,
H8, H9, H13,
H14, J6, J7,
J8, J9, J12,
J13, K8, K13,
L8, L13, L14,
M5, M6, M7,
M8, M9,
M10, M11,
M12, M13,
N13, P13,
P14
IOUTAP
IOUTAN
IOUTBP
IOUTBN
IOUTCP
IOUTCN
IOUTDP
IOUTDN
B14
C14
F14
E14
J14
O
O
O
O
O
O
O
O
A-channel DAC current output. Connect directly to ground if unused.
A-channel DAC complementary current output. Connect directly to ground if unused.
B-channel DAC current output. Connect directly to ground if unused.
B-channel DAC complementary current output. Connect directly to ground if unused.
C-channel DAC current output. Connect directly to ground if unused.
K14
N14
M14
C-channel DAC complementary current output. Connect directly to ground if unused.
D-channel DAC current output. Connect directly to ground if unused.
D-channel DAC complementary current output. Connect directly to ground if unused.
D5, D6, G5,
H5, L5. L6
IOVDD
I
I
Supply voltage for all LVDS I/O. (3.3 V)
Supply voltage for all CMOS I/O. (1.8 V to 3.3 V) This supply can range from 1.8 V to 3.3 V to change
the input and output levels of the CMOS I/O.
IOVDD2
LPF
L12
D12
I/O PLL loop filter connection. If not using the clock-multiplying PLL, the LPF pin can be left unconnected.
Optional LVPECL output strobe positive input. This positive-negative pair is captured with the rising
OSTRP
OSTRN
A9
B9
I
edge of DACCLKP/N. It is used to sync the divided-down clocks and FIFO output pointer in dual-
sync-sources mode. If unused it can be left unconnected.
I
Optional LVPECL output strobe negative input. (See the OSTRP description.)
Optional LVDS positive input parity bit for the CD-data bus. The PARITYCDP/N LVDS pair has an
internal 100-Ω termination resistor. If unused, it can be left unconnected.
The PARITY, SYNC, and ISTR inputs are rotated to allow complete reversal of the data interface
when setting the rev_interface bit in register config1.
PARITYCDP N8
PARITYCDN P8
I
I
I
I
I
Optional LVDS negative input parity bit for the CD-data bus.
PLL analog supply voltage (3.3 V)
PLLAVDD
SCLK
C11, D11
P9
Serial interface clock. Internal pulldown
SDENB
P10
Active-low serial data enable, always an input to the DAC34SH84. Internal pullup
Serial interface data. Bidirectional in 3-pin mode (default) and unidirectional 4-pin mode. Internal
pulldown
SDIO
P11
I/O
Unidirectional serial interface data in 4-pin mode. The SDO pin is in the high-impedance state in 3-pin
interface mode (default).
SDO
P12
N11
O
I
SLEEP
Active-high asynchronous hardware power-down input. Internal pulldown
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PIN FUNCTIONS (continued)
PIN
I/O
DESCRIPTION
NAME
NO.
LVDS SYNC positive input. Internal 100-Ω termination resistor. If unused it can be left unconnected.
The PARITY, SYNC, and ISTR inputs are rotated to allow complete reversal of the data interface
when setting the rev_interface bit in register config1.
SYNCP
A8
I
SYNCN
B8
I
I
LVDS SYNC negative input
RESETB
N10
Active-low input for chip RESET. Internal pullup
Transmit enable active-high input. Internal pulldown
To enable analog output data transmission, set sif_txenable in register config3 to 1 or pull the CMOS
TXENA
N9
I
TXENA pin to high.
To disable analog output, set sif_txenable to 0 and pull the CMOS TXENA pin to low. The DAC
output is forced to midscale.
TESTMODE L11
VFUSE D7, L7
I
I
This pin is used for factory testing. Internal pulldown. Leave unconnected for normal operation
Digital supply voltage. This supply pin is also used for factory fuse programming. Connect to
DACVDD or DIGVDD for normal operation
ORDERING INFORMATION(1)
TA
–40°C to 85°C
ORDER CODE
DAC34SH84IZAY
DAC34SH84IZAYR
PACKAGE DRAWING/TYPE
TRANSPORT MEDIA
Tray
QUANTITY
160
ZAY / 196 NFBGA
Tape and reel
1000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VALUE
UNIT
MIN
–0.5
–0.5
–0.5
–0.5
MAX
1.5
1.5
4
DACVDD, DIGVDD, CLKVDD
VFUSE
V
V
V
V
Supply voltage
range(2)
IOVDD, IOVDD2
AVDD, PLLAVDD
4
DAB[15..0]P/N, DCD[15..0]P/N, DATACLKP/N, ISTRP/N, PARITYCDP/N,
SYNCP/N
–0.5
–0.5
–0.5
IOVDD + 0.5
CLKVDD + 0.5
IOVDD2 + 0.5
V
V
V
DACCLKP/N, OSTRP/N
ALARM, SDO, SDIO, SCLK, SDENB, SLEEP, RESETB, TESTMODE,
TXENA
Pin voltage range(2)
IOUTAP/N, IOUTBP/N, IOUTCP/N, IOUTDP/N
–1.0
–0.5
–0.5
AVDD + 0.5
V
V
EXTIO, BIASJ
LPF
AVDD + 0.5
PLLAVDD + 0.5
V
Peak input current (any input)
20
mA
mA
°C
°C
Peak total input current (all inputs)
Absolute maximum junction temperature, TJ
Storage temperature range, Tstg
–30
150
150
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of these or any other conditions beyond those indicated under Recommended Operating Conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Measured with respect to GND
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SLAS808B –FEBRUARY 2012–REVISED JULY 2012
THERMAL INFORMATION
DAC34SH84
THERMAL METRIC(1)
BGA
UNIT
(196 ball) PINS
θJA
Junction-to-ambient thermal resistance(2)
Junction-to-case (top) thermal resistance(3)
Junction-to-case (bottom) thermal resistance(4)
Junction-to-board thermal resistance(5)
Junction-to-top characterization parameter(6)
Junction-to-board characterization parameter(7)
37.6
6.8
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
θJCtop
θJCbot
θJB
N/A
16.8
0.2
ψJT
ψJB
16.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
(5) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(6) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
°C
Recommended operating junction temperature
Maximum rated operating junction temperature(1)
Recommended free-air temperature
105
TJ
125
–40
TA
25
85
°C
(1) Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate.
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ELECTRICAL CHARACTERISTICS – DC SPECIFICATIONS(1)
over recommended operating free-air temperature range, nominal supplies, IOUTFS = 20 mA (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
Resolution
16
Bits
DC ACCURACY
DNL
INL
Differential nonlinearity
Integral nonlinearity
±2
±4
LSB
LSB
1 LSB = IOUTFS / 216
ANALOG OUTPUT
Coarse gain linearity
±0.04
±0.001
±2
LSB
%FSR
%FSR
%FSR
%FSR
mA
Offset error
Mid-code offset
With external reference
With internal reference
With internal reference
Gain error
±2
Gain mismatch
±2
Full-scale output current
Output compliance range
Output resistance
10
20
30
–0.5
0.6
V
300
5
kΩ
Output capacitance
pF
REFERENCE OUTPUT
VREF
Reference output voltage
Reference output current(2)
1.2
V
100
nA
REFERENCE INPUT
VEXTIO Input voltage range
0.6
1.2 1.25
V
External reference mode
Input resistance
1
472
100
MΩ
kHz
pF
Small-signal bandwidth
Input capacitance
TEMPERATURE COEFFICIENTS
Offset drift
±1
±15
±30
±8
ppm / °C
ppm / °C
ppm / °C
ppm / °C
With external reference
With internal reference
Gain drift
Reference voltage drift
POWER SUPPLY(3)
AVDD, IOVDD, PLLAVDD
DIGVDD
3.14
1.25
1.3
3.3 3.46
1.3 1.35
V
V
CLKVDD, DACVDD
IOVDD2
1.35
3.3 3.45
±0.25
1.4
V
V
1.71
PSRR
Power-supply rejection ratio
DC tested
Mode 1
%FSR / V
POWER CONSUMPTION
I(AVDD)
I(DIGVDD)
I(DACVDD)
I(CLKVDD)
P
Analog supply current(4)
135 165
885 950
mA
mA
mA
mA
mW
Digital supply current
DAC supply current
Clock supply current
Power dissipation
fDAC = 1.5 GSPS, 2× interpolation,
mixer on, QMC on, invsinc on,
PLL enabled, 20-mA FS output, IF = 200 MHz
45
60
127 145
1828 2056
(1) Measured differentially across IOUTP/N with 25 Ω each to GND.
(2) Use an external buffer amplifier with high-impedance input to drive any external load.
(3) To ensure power supply accuracy and to account for power supply filter network loss at operating conditions, the use of the ATEST
function in register config27 to check the internal power supply nodes is recommended.
(4) Includes AVDD, PLLAVDD, and IOVDD
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SLAS808B –FEBRUARY 2012–REVISED JULY 2012
ELECTRICAL CHARACTERISTICS – DC SPECIFICATIONS (continued)
over recommended operating free-air temperature range, nominal supplies, IOUTFS = 20 mA (unless otherwise noted)
PARAMETER
Analog supply current(4)
Digital supply current
DAC supply current
Clock supply current
Power dissipation
Analog supply current(4)
Digital supply current
DAC supply current
Clock supply current
Power dissipation
Analog supply current(4)
Digital supply current
DAC supply current
Clock supply current
Power dissipation
Analog supply current(4)
Digital supply current
DAC supply current
Clock supply current
Power dissipation
Analog supply current(5)
Digital supply current
DAC supply current
Clock supply current
Power dissipation
Analog supply current(4)
Digital supply current
DAC supply current
Clock supply current
Power dissipation
TEST CONDITIONS
MIN
TYP MAX
115
770
40
UNIT
mA
mA
mA
mA
mW
mA
mA
mA
mA
mW
mA
mA
mA
mA
mW
mA
mA
mA
mA
mW
mA
mA
mA
mA
mA
mA
mA
mA
mA
mW
mA
mA
mA
mA
mW
I(AVDD)
I(DIGVDD)
I(DACVDD)
I(CLKVDD)
P
Mode 2
fDAC = 1.47456 GSPS, 2× interpolation,
mixer on, QMC on, invsinc on,
PLL disabled, 20-mA FS output, IF = 7.3 MHz
95
1562
115
470
21
I(AVDD)
I(DIGVDD)
I(DACVDD)
I(CLKVDD)
P
Mode 3
fDAC = 737.28 MSPS, 2x interpolation,
mixer on, QMC on, invsinc off,
PLL disabled, 20-mA FS output, IF = 7.3 MHz
55
1093
40
I(AVDD)
I(DIGVDD)
I(DACVDD)
I(CLKVDD)
P
Mode 4
710
50
fDAC = 1.47456 GSPS, 2× interpolation,
mixer on, QMC on, invsinc on,
PLL enabled, IF = 7.3 MHz, channels A/B/C/D
output sleep
90
1160
28
I(AVDD)
I(DIGVDD)
I(DACVDD)
I(CLKVDD)
P
Mode 5
17
Power-down mode: no clock, DAC on sleep
mode (clock receiver sleep),
channels A/B/C/D output sleep, static data
pattern
0
20
142
130
570
25
I(AVDD)
I(DIGVDD)
I(DACVDD)
I(CLKVDD)
P
Mode 6
fDAC = 1 GSPS, 2x interpolation,
mixer off, QMC off, invsinc off,
PLL enabled, 20-mA FS output, IF = 7.3 MHz
98
1336
115
335
23
I(AVDD)
I(DIGVDD)
I(DACVDD)
I(CLKVDD)
P
Mode 7
fDAC = 1 GSPS, 2x interpolation,
mixer off,QMC off, invsinc off,
PLL disabled, 20-mA FS output, IF = 7.3 MHz
70
940
45
I(AVDD)
I(DIGVDD)
I(DACVDD)
I(CLKVDD)
P
Analog supply current
Digital supply current
DAC supply current
Clock supply current
Power dissipation
Mode 8
655
30
fDAC = 1.47456 GSPS, 2× interpolation,
mixer on, QMC on, invsinc on,
PLL disabled, IF = 7.3 MHz, channels A/B/C/D
output sleep
95
1169
(5) Includes AVDD, PLLAVDD, and IOVDD
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ELECTRICAL CHARACTERISTICS – DIGITAL SPECIFICATIONS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
LVDS INPUTS: DAB[15:0]P/N, DCD[15:0]P/N, DATACLKP/N, ISTRP/N, SYNCP/N, PARITYCDP/N(1)
Logic-high differential
VA,B+
input voltage
threshold
200
mV
Logic-low differential
input voltage
VA,B–
–200
mV
threshold
VCOM
ZT
Input common mode
Internal termination
1
1.2
1.6
V
85
110
135
Ω
LVDS input
capacitance
CL
2
pF
Interleaved LVDS
data transfer rate
fINTERL
fDATA
1500 MSPS
750 MSPS
Input data rate
CLOCK INPUT (DACCLKP/N)
Duty cycle
40%
0.4
60%
V
Differential voltage(2) |DACCLKP - DACCLKN|
1
Internally biased
common-mode
voltage
0.2
V
Single-ended swing
level
–0.4
V
DACCLKP/N input
frequency
1500 MHz
OUTPUT STROBE (OSTRP/N)
fOSTR = fDACCLK / (n × 8 × interp) where n is any positive
integer,
fDACCLK
/
fOSTR
Frequency
(8× MHz
fDACCLK is DACCLK frequency in MHz
interp)
Duty cycle
50%
1.0
Differential voltage
|OSTRP-OSTRN|
0.4
V
V
Internally biased
common-mode
voltage
0.2
Single-ended swing
level
–0.4
V
CMOS INTERFACE: ALARM, SDO, SDIO, SCLK, SDENB, SLEEP, RESETB, TXENA
High-level input
voltage
0.7 ×
IOVDD2
VIH
V
V
Low-level input
voltage
0.3 ×
IOVDD2
VIL
High-level input
current
IIH
–40
–40
40
40
µA
µA
pF
V
Low-level input
current
IIL
CMOS input
capacitance
CI
2
IOVDD2 –
0.2
Iload = –100 μA
VOH
ALARM, SDO, SDIO
ALARM, SDO, SDIO
0.8 ×
IOVDD2
Iload = –2 mA
V
Iload = 100 μA
0.2
0.5
V
V
VOL
Iload = 2 mA
(1) See LVDS INPUTS section for terminology.
(2) Driving the clock input with a differential voltage lower than 1 V may result in degraded performance.
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SLAS808B –FEBRUARY 2012–REVISED JULY 2012
ELECTRICAL CHARACTERISTICS – DIGITAL SPECIFICATIONS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
DIGITAL INPUT TIMING SPECIFICATIONS
Timing LVDS inputs: DAB[15:0]P/N, DCD[15:0]P/N, ISTRP/N, SYNCP/N, PARITYCDP/N, double edge latching
Config36 Setting
datadly
clkdly
0
0
0
0
0
0
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
0
0
0
0
0
0
30
–10
–50
–90
–130
–170
–210
–250
50
Setup time,
DAB[15:0]P/N,
DCD[15:0]P/N,
ISTRP/N, SYNCP/N,
and PARITYCDP/N,
valid to either edge of
DATACLKP/N
ISTRP/N and SYNCP/N reset latched
only on rising edge of DATACLKP/N
ts(DATA)
ps
90
130
170
210
250
290
Config36 Setting
datadly
clkdly
0
0
0
0
0
0
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
0
0
0
0
0
0
200
240
280
320
360
400
440
480
190
150
110
70
Hold time,
DAB[15:0]P/N,
DCD[15:0]P/N,
ISTRP/N, SYNCP/N
and PARITYCDP/N
valid after either edge
of DATACLKP/N
ISTRP/N and SYNCP/N reset latched
only on rising edge of DATACLKP/N
th(DATA)
ps
30
–10
–50
ISTRP/N and
t(ISTR_SYNC) SYNCP/N pulse
duration
1 /
2fDATACLK
fDATACLK is DATACLK frequency in MHz
ns
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MAX UNIT
ELECTRICAL CHARACTERISTICS – DIGITAL SPECIFICATIONS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
TIMING OUTPUT STROBE INPUT: DACCLKP/N rising edge LATCHING(3)
Setup time, OSTRP/N
ts(OSTR)
valid to rising edge of
DACCLKP/N
–80
220
ps
ps
Hold time, OSTRP/N
valid after rising edge
of DACCLKP/N
th(OSTR)
(4)
TIMING SYNC INPUT: DACCLKP/N rising edge LATCHING
Setup time, SYNCP/N
ts(SYNC_PLL) valid to rising edge of
DACCLKP/N
150
250
ps
ps
Hold time, SYNCP/N
th(SYNC_PLL) valid after rising edge
of DACCLKP/N
TIMING SERIAL PORT
Setup time, SDENB to
ts(SDENB)
20
10
ns
ns
rising edge of SCLK
Setup time, SDIO
ts(SDIO)
valid to rising edge of
SCLK
Hold time, SDIO valid
to rising edge of
SCLK
th(SDIO)
5
ns
Register config6 read (temperature sensor read)
1
µs
ns
t(SCLK)
Period of SCLK
All other registers
100
Data output delay
after falling edge of
SCLK
td(Data)
10
25
ns
ns
Minimum RESETB
pulsewidth
tRESET
(3) OSTR is required in dual-sync-sources mode. In order to minimize the skew, it is recommended to use the same clock distribution
device such as Texas Instruments CDCE62005 to provide the DACCLK and OSTR signals to all the DAC34SH84 devices in the system.
Swap the polarity of the DACCLK outputs with respect to the OSTR ones to establish proper phase relationship.
(4) SYNC is required to synchronize the PLL circuit in mulitple devices. The SYNC signal must meet the timing relationship with respect to
the reference clock (DACCLKP/N) of the on-chip PLL circuit.
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SLAS808B –FEBRUARY 2012–REVISED JULY 2012
ELECTRICAL CHARACTERISTICS – AC SPECIFICATIONS
over recommended operating free-air temperature range, nominal supplies, IOUTFS = 20 mA (unless otherwise noted)
PARAMETER
TEST CONDITIONS / COMMENTS
MIN
TYP
MAX
UNIT
ANALOG OUTPUT(1)
fDAC
Maximum DAC rate
1500
MSPS
ns
ts(DAC)
Output settling time to 0.1%
Transition: code 0x0000 to 0xFFFF
10
2
DAC outputs are updated on the falling edge of the DAC
clock. Does not include digital latency (see following).
tpd
Output propagation delay
ns
tr(IOUT)
tf(IOUT)
Output rise time 10% to 90%
Output fall time 90% to 10%
220
220
ps
ps
No interpolation, FIFO on, mixer off, QMC off, inverse
sinc off
128
2× interpolation
216
376
726
1427
24
4× interpolation
DAC clock
cycles
8× interpolation
Digital latency
16× interpolation
Fine mixer
QMC
16
Inverse sinc
20
DAC wake-up time
DAC sleep time
IOUT current settling to 1% of IOUTFS from output sleep
2
Power-up
time
μs
IOUT current settling to less than 1% of IOUTFS in output
sleep
2
AC PERFORMANCE(2)
fDAC = 1.5 GSPS, fOUT = 20 MHz
fDAC = 1.5 GSPS, fOUT = 50 MHz
fDAC = 1.5 GSPS, fOUT = 70 MHz
fDAC = 1.5 GSPS, fOUT = 30 ± 0.5 MHz
fDAC = 1.5 GSPS, fOUT = 50 ± 0.5 MHz
fDAC = 1.5 GSPS, fOUT = 100 ± 0.5 MHz
fDAC = 1.5 GSPS, fOUT = 10 MHz
fDAC = 1.5 GSPS, fOUT = 80 MHz
fDAC = 1.47456 GSPS, fOUT = 30 MHz
fDAC = 1.47456 GSPS, fOUT = 153 MHz
fDAC = 1.47456 GSPS, fOUT = 30 MHz
fDAC = 1.47456 GSPS, fOUT = 153 MHz
fDAC = 1.5 GSPS, fOUT = 40 MHz
78
74
Spurious-free dynamic range,
(0 to fDAC / 2) tone at 0 dBFS
SFDR
dBc
71
87
Third-order two-tone intermodulation
distortion,
each tone at –12 dBFS
IMD3
NSD
85
dBc
78
Noise spectral density,(3)
tone at 0 dBFS
160
158
76
dBc / Hz
Adjacent-channel leakage ratio, single
carrier
75
ACLR(3)
dBc
dBc
86
Alternate-channel leakage ratio, single
carrier
82
Channel isolation
101
(1) Measured single-ended into 50-Ω load.
(2) 4:1 transformer output termination, 50-Ω doubly terminated load
(3) Single carrier, W-CDMA with 3.84-MHz BW, 5-MHz spacing, centered at IF, PAR = 12 dB. TESTMODEL 1, 10 ms
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TYPICAL CHARACTERISTICS
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
6
5
5
4
4
3
3
2
2
1
1
0
0
−1
−2
−3
−4
−5
−6
−1
−2
−3
−4
−5
0
10k
20k
30k
Code
40k
50k
60k
0
10k
20k
30k
Code
40k
50k
60k
Figure 1. Integral Nonlinearity
Figure 2. Differential Nonlinearity
90
100
90
80
70
60
50
40
30
20
0dBFS
−6dBFS
−12dBFS
0dBFS
−6dBFS
−12dBFS
80
70
60
50
40
30
20
10
0
100
200
300
400
500
600
0
100
200
300
400
500
600
Output Frequency (dB)
Output Frequency (MHz)
G003
G004
Figure 3. SFDR vs Output Frequency Over Input Scale
Figure 4. Second-Harmonic Distortion vs Output Frequency
Over Input Scale
110
110
FDAC = 750 MSPS, 1x interpolation
0dBFS
−6dBFS
−12dBFS
100
100
90
80
70
60
50
40
30
FDAC = 1500 MSPS, 2x interpolation
FDAC = 1500 MSPS, 4x interpolation
FDAC = 1500 MSPS, 8x interpolation
FDAC = 1500 MSPS, 16x interpolation
90
80
70
60
50
40
30
0
100
200
300
400
500
600
0
100
200
300
400
500
600
Output Frequency (MHz)
Output Frequency (MHz)
G005
G006
Figure 5. Third Harmonic Distortion vs Output Frequency
Over Input Scale
Figure 6. SFDR vs Output Frequency Over Interpolation
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SLAS808B –FEBRUARY 2012–REVISED JULY 2012
TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
100
90
80
70
60
50
40
30
20
100
90
80
70
60
50
40
30
20
fDAC = 800 MSPS
fDAC = 1000 MSPS
fDAC = 1200 MSPS
fDAC = 1500 MSPS
Iout FS = 10 mA, 4:1 Transformer
Iout FS = 20 mA, 4:1 Transformer
Iout FS = 30 mA, 2:1 Transformer
0
100
200
300
400
500
0
100
200
300
400
500
Output Frequency (MHz)
Output Frequency (MHz)
G007
G008
G010
G012
Figure 7. SFDR vs Output Frequency Over fDAC
Figure 8. SFDR vs Output Frequency Over IOUTFS
10
0
10
NCO bypassed
QMC bypassed
fDAC = 1500 MSPS
fout = 20 MHz
NCO bypassed
QMC bypassed
fDAC = 1500 MSPS
fout = 70 MHz
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−10
−20
−30
−40
−50
−60
−70
−80
−90
10
110
210
310
410
510
610
710 800
10
110
210
310
410
510
610
710 800
Frequency (MHz)
Frequency (MHz)
G009
Figure 9. Single-Tone Spectral Plot
Figure 10. Single-Tone Spectral Plot
10
0
10
0
fDAC = 1500 MSPS
fout = 150 MHz
fDAC = 1500 MSPS
fout = 200 MHz
−10
−20
−30
−40
−50
−60
−70
−80
−90
−10
−20
−30
−40
−50
−60
−70
−80
−90
10
110
210
310
410
510
610
710 800
10
110
210
310
410
510
610
710 800
Frequency (MHz)
Frequency (MHz)
G011
Figure 11. Single-Tone Spectral Plot
Figure 12. Single-Tone Spectral Plot
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
10
100
90
80
70
60
50
40
30
20
PLL enabled w/ PFD of 46.875 MHz
fDAC = 1500 MSPS
fout = 200 MHz
PLL disabled
PLL enabled w/ PFD of 46.875 MHz
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
10
110
210
310
410
510
610
710 800
0
100
200
300
400
500
600
Frequency (MHz)
Output Frequency (MHz)
G013
G014
Figure 13. Single-Tone Spectral Plot
Figure 14. SFDR vs Output Frequency Over Clocking
Options
100
90
80
70
60
50
40
30
20
100
90
80
70
60
0dB FS
−6dB FS
−12dB FS
50
FDAC = 750 MSPS, 1x interpolation
FDAC = 1500 MSPS, 2x interpolation
FDAC = 1500 MSPS, 4x interpolation
FDAC = 1500 MSPS, 8x interpolation
FDAC = 1500 MSPS, 16x interpolation
40
30
20
0
100
200
300
400
500
600
0
100
200
300
400
500
600
Output Frequency (MHz)
Output Frequency (MHz)
G015
G016
Figure 15. IMD3 vs Output Frequency Over Input Scale
Figure 16. IMD3 vs Output Frequency Over Interpolation
100
90
80
70
60
50
100
Iout FS = 10 mA, 4:1 Transformer
Iout FS = 20 mA, 4:1 Transformer
Iout FS = 30 mA, 2:1 Transformer
90
80
70
60
50
40
30
20
fDAC = 800 MSPS
40
fDAC = 1000 MSPS
fDAC = 1200 MSPS
fDAC = 1500 MSPS
30
20
0
100
200
300
400
500
0
100
200
300
400
500
Output Frequency (MHz)
Output Frequency (MHz)
G017
G018
Figure 17. IMD3 vs Output Frequency Over fDAC
Figure 18. IMD3 vs Output Frequency Over IOUTFS
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SLAS808B –FEBRUARY 2012–REVISED JULY 2012
TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−100
−110
10
NCO bypassed
QMC bypassed
fDAC = 1500 MSPS
fout = 70 MHz
Tone spacing = 1 MHz
NCO bypassed
QMC bypassed
fDAC = 1500 MSPS
fout = 200 MHz
Tone spacing = 1 MHz
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−100
−110
64
66
68
70
72
74
76
194
196
198
200
202
204
206
Frequency (MHz)
Frequency (MHz)
G019
G020
Figure 19. Two-Tone Spectral Plot
Figure 20. Two-Tone Spectral Plot
100
90
80
70
60
50
40
30
20
170
160
150
140
130
120
110
PLL disabled
PLL enabled w/ PFD of 46.875 MHz
0dBFS
−6dBFS
−12dBFS
0
100
200
300
400
500
0
100
200
300
400
500
600
Output Frequency (MHz)
Output Frequency (dB)
G021
G022
Figure 21. IMD3 vs Output Frequency Over Clocking
Options
Figure 22. NSD vs Output Frequency Over Input Scale
170
160
150
170
160
150
140
140
FDAC = 750 MSPS, 1x interpolation
FDAC = 1500 MSPS, 2x interpolation
fDAC = 800 MSPS
FDAC = 1500 MSPS, 4x interpolation
FDAC = 1500 MSPS, 8x interpolation
FDAC = 1500 MSPS, 16x interpolation
fDAC = 1000 MSPS
fDAC = 1200 MSPS
fDAC = 1500 MSPS
130
120
130
120
0
100
200
300
400
500
600
0
100
200
300
400
500
Output Frequency (MHz)
Output Frequency (MHz)
G023
G024
Figure 23. NSD vs Output Frequency Over Interpolation
Figure 24. NSD vs Output Frequency Over fDAC
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
180
170
160
150
140
130
170
160
150
140
130
120
Iout FS = 10 mA, 4:1 Transformer
Iout FS = 20 mA, 4:1 Transformer
Iout FS = 30 mA, 2:1 Transformer
PLL disabled
PLL enabled w/ PFD of 46.875 MHz
0
100
200
300
400
500
0
100
200
300
400
500
600
Output Frequency (MHz)
Output Frequency (MHz)
G025
G026
Figure 25. NSD vs Output Frequency Over IOUTFS
Figure 26. NSD vs Output Frequency Over Clocking Options
−20
−30
PLL disabled
PLL disabled
PLL enabled w/ PFD of 46.08 MHz
PLL enabled w/ PFD of 46.08 MHz
−30
−40
−50
−60
−70
−80
−90
−40
−50
−60
−70
−80
−90
−100
fDAC = 1474.56 MSPS
100 200
fDAC = 1474.56 MSPS
100 200
0
300
400
500
0
300
400
500
Output Frequency (MHz)
Output Frequency (MHz)
G027
G028
Figure 27. Single-Carrier WCDMA ACLR (Adjacent) vs
Output Frequency Over Clocking Options
Figure 28. Single-Carrier WCDMA ACLR (Alternate) vs
Output Frequency Over Clocking Options
Figure 29. Single-Carrier WCDMA Test Mode1
Figure 30. Single-Carrier WCDMA Test Mode1
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
Figure 31. Single-Carrier WCDMA Test Mode1
vs
Figure 32. Four-Carrier WCDMA Test Mode1
Figure 33. Four-Carrier WCDMA Test Mode1
Figure 34. Four-Carrier WCDMA Test Mode1
Figure 35. 10-MHz Single-Carrier LTE Test Mode3.1
Figure 36. 10-MHz Single-Carrier LTE Test Mode3.1
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
Figure 37. 20-MHz Single-Carrier LTE Test Mode3.1
Figure 38. 20-MHz Single-Carrier LTE Test Mode3.1
1800
1800
1x interpolation
2x interpolation
4x interpolation
8x interpolation
16x interpolation
1x interpolation
2x interpolation
4x interpolation
8x interpolation
16x interpolation
1600
1400
1200
1000
800
1600
1400
1200
1000
800
Baseband input = 10 MHz
NCO disabled
QMC disabled
Baseband input = 0 MHz
NCO enabled w/ 10 MHz mixing
QMC enabled
600
600
400
300
400
300
500
700
900
1100
1300
1500
500
700
900
1100
1300
1500
G039
G040
fDAC (MHz)
fDAC (MHz)
Figure 39. Power vs fDAC Over Interpolation
Figure 40. Power vs fDAC Over Interpolation
260
240
220
200
180
160
140
120
100
80
200
180
160
140
120
100
80
QMC enabled
NCO enabled
QMC enabled
NCO enabled
60
60
40
40
20
20
0
300
0
300
500
700
900
1100
1300
1500
500
700
900
1100
1300
1500
G041
G042
fDAC (dB)
fDAC (dB)
Figure 41. Power Consumption vs fDAC Over Digital
Processing Functions
Figure 42. DIGVDD Current vs fDAC Over Digital Processing
Functions
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TYPICAL CHARACTERISTICS (continued)
All plots are at 25°C, nominal supply voltage, fDAC = 1500 MSPS, 2× interpolation, NCO enabled, mixer gain disabled, QMC
enabled with gain set at 1446 for both I/Q channels, 0-dBFS digital input, 20-mA full-scale output current with 4:1 transformer
(unless otherwise noted)
800
700
600
500
400
300
200
100
800
700
600
500
400
300
200
100
1x interpolation
2x interpolation
4x interpolation
8x interpolation
16x interpolation
1x interpolation
2x interpolation
4x interpolation
8x interpolation
16x interpolation
Baseband input = 10 MHz
NCO disabled
QMC disabled
Baseband input = 0 MHz
NCO enabled w/ 10 MHz mixing
QMC enabled
300
500
700
900
1100
1300
1500
300
500
700
900
1100
1300
1500
G043
G044
f(MHz)
f(MHz)
Figure 43. DIGVDD Current vs fDAC Over Interpolation
Figure 44. DIGVDD Current vs fDAC Over Interpolation
40
100
90
80
70
60
50
40
30
20
30
20
10
0
300
500
700
900
1100
1300
1500
300
500
700
900
1100
1300
1500
G045
G046
fDAC (MHz)
fDAC (MHz)
Figure 45. DACVDD Current vs fDAC Over Interpolation
Figure 46. CLKVDD Current vs fDAC
140
130
120
110
100
90
120
NCO Enabled
Channel AB and CD Outputs Are 1 MHz Apart
Measured With TSW30SH84 EVM
110
100
90
80
70
80
60
Channel AB Suppressing Channel CD
Channel CD Suppressing Channel AB
70
50
60
300
40
500
700
900
1100
1300
1500
0
100
200
300
400
500
IF (MHz)
G047
G048
fDAC (MHz)
Figure 47. AVDD Current vs fDAC
Figure 48. Channel Isolation vs IF
DEFINITION OF SPECIFICATIONS
Adjacent-Carrier Leakage Ratio (ACLR): Defined for a 3.84-Mcps 3GPP W-CDMA input signal measured in a
3.84-MHz bandwidth at a 5-MHz offset from the carrier with a 12-dB peak-to-average ratio
Analog and Digital Power Supply Rejection Ratio (APSSR, DPSSR): Defined as the percentage error in the
ratio of the delta IOUT and delta supply voltage normalized with respect to the ideal IOUT current
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Differential Nonlinearity (DNL): Defined as the variation in analog output associated with an ideal 1-LSB
change in the digital input code
Gain Drift: Defined as the maximum change in gain, in terms of ppm of full-scale range (FSR) per °C, from the
value at ambient (25°C) to values over the full operating temperature range
Gain Error: Defined as the percentage error (in FSR%) for the ratio between the measured full-scale output
current and the ideal full-scale output current
Integral Nonlinearity (INL): Defined as the maximum deviation of the actual analog output from the ideal output,
determined by a straight line drawn from zero scale to full scale
Intermodulation Distortion (IMD3): The two-tone IMD3 is defined as the ratio (in dBc) of the third-order
intermodulation distortion product to either fundamental output tone.
Offset Drift: Defined as the maximum change in dc offset, in terms of ppm of full-scale range (FSR) per °C, from
the value at ambient (25°C) to values over the full operating temperature range
Offset Error: Defined as the percentage error (in FSR%) for the ratio between the measured mid-scale output
current and the ideal mid-scale output current
Output Compliance Range: Defined as the minimum and maximum allowable voltage at the output of the
current-output DAC. Exceeding this limit may result in reduced reliability of the device or adversely affect
distortion performance.
Reference Voltage Drift: Defined as the maximum change of the reference voltage in ppm per degree Celsius
from the value at ambient (25°C) to values over the full operating temperature range
Spurious-Free Dynamic Range (SFDR): Defined as the difference (in dBc) between the peak amplitude of the
output signal and the peak spurious signal within the first Nyquist zone
Noise Spectral Density (NSD): Defined as the difference of power (in dBc) between the output tone signal
power and the noise floor of 1-Hz bandwidth within the first Nyquist zone
SERIAL INTERFACE
The serial port of the DAC34SH84 is a flexible serial interface which communicates with industry-standard
microprocessors and microcontrollers. The interface provides read/write access to all registers used to define the
operating modes of the DAC34SH84. It is compatible with most synchronous transfer formats and can be
configured as a three- or four-pin interface by sif4_ena in register config2. In both configurations, SCLK is the
serial-interface input clock and SDENB is serial-interface enable. For the three-pin configuration, SDIO is a
bidirectional pin for both data in and data out. For the four-pin configuration, SDIO is data-in only and SDO is
data-out only. Data is input into the device with the rising edge of SCLK. Data is output from the device on the
falling edge of SCLK.
Each read/write operation is framed by the serial-data enable bar (SDENB) signal asserted low. The first frame
byte is the instruction cycle which identifies the following data transfer cycle as read or write as well as the 7-bit
address to be accessed. Table 1 indicates the function of each bit in the instruction cycle and is followed by a
detailed description of each bit. The data transfer cycle consists of two bytes.
Table 1. Instruction Byte of the Serial Interface
MSB
7
LSB
0
Bit
6
5
4
3
2
1
Description
R/W
A6
A5
A4
A3
A2
A1
A0
R/W
Identifies the following data transfer cycle as a read or write operation. A high indicates a read
operation from the DAC34SH84 and a low indicates a write operation to the DAC34SH84.
[A6 : A0]
Identifies the address of the register to be accessed during the read or write operation.
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Figure 49 shows the serial interface timing diagram for a DAC34SH84 write operation. SCLK is the serial interface clock input to DAC34SH84. Serial data
enable SDENB is an active low input to DAC34SH84. SDIO is serial data in. Input data to DAC34SH84 is clocked on the rising edges of SCLK.
Instruction Cycle
Data Transfer Cycle
SDENB
SCLK
SDIO
rwb
A6
A5
A4
A3
A2
A1
A0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
tS(SDENB)
t(SCLK)
SDENB
SCLK
SDIO
tH(SDIO)
tS(SDIO)
T0521-01
Figure 49. Serial-Interface Write Timing Diagram
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Figure 50 shows the serial interface timing diagram for a DAC34SH84 read operation. SCLK is the serial interface clock input to the DAC34SH84. Serial-
data enable SDENB is an active-low input to the DAC34SH84. SDIO is serial data-in during the instruction cycle. In the three-pin configuration, SDIO is
data out from the DAC34SH84 during the data transfer cycle, whereas SDO is in a high-impedance state. In the four-pin configuration, SDO is data-out
from the DAC34SH84 during the data transfer cycle. At the end of the data transfer, SDIO and SDO output low on the final falling edge of SCLK until the
rising edge of SDENB, when SDO goes into the high-impedance state.
Instruction Cycle
Data Transfer Cycle
SDENB
SCLK
SDIO
SDO
rwb
A6
A5
A4
A3
A2
A1
A0
D15
D15
D14
D14
D13
D13
D12
D12
D11
D11
D10
D10
D9
D9
D8
D8
D7
D7
D6
D6
D5
D5
D4
D4
D3
D3
D2
D2
D1
D1
D0
D0
SDENB
SCLK
SDIO
SDO
Data n
Data n – 1
td(Data)
T0522-01
Figure 50. Serial-Interface Read Timing Diagram
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Table 2. Register Map(1)
(MSB)
Bit 15
(LSB)
Bit 0
Name
Address
Default
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
fifo_ena
dacA_
Bit 6
reserved
dacB_
Bit 5
reserved
dacC_
Bit 4
Bit 3
Bit 2
Bit 1
qmc_
qmc_
qmc_
corrAB_
ena
qmc_
corrCD_
ena
alarm_out_ alarm_out clkdiv_sync_ invsincAB_
ena
invsincCD_
ena
config0
0x00
0x049C
offsetAB_ offsetCD_
ena
interp(3:0)
pol
ena
ena
ena
single_
dual_
parity
alarm_
2away_
ena
alarm_
1away_
ena
alarm_
collision_
ena
parity_
ena
iotest_
ena
64cnt_en oddeven_
rev_
interface
dacD_
config1
config2
0x01
0x02
0x040E
0x7000
reserved
reserved
reserved
a
parity
complement complement complement complement
dacclk
dataclk
collision_
reserved
reserved
reserved
reserved
reserved
sif4_ena
mixer_ena
mixer_gain
nco_ena
reserved
revbus
reserved
twos
reserved
gone_ena gone_ena gone_ena
config3
config4
0x03
0x04
0xF000
NA
coarse_dac(3:0)
reserved
sif_txenable
iotest_results(15:0)
alarm_
from_
zerochk
alarm_
from_
iotest
alarm_
dacclk_
gone
alarm_
dataclk_
gone
alarm_
output_
gone
alarm_
Bparity
alarm_
from_pll
alarm_
Aparity
alarm_
Cparity
alarm_
Dparity
config5
0x05
NA
reserved
alarms_from_fifo(2:0)
reserved
reserved
reserved
config6
config7
0x06
0x07
0x08
0x09
0x0A
0x0B
0x0C
0x0D
0x0E
0x0F
0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
NA
tempdata(7:0)
reserved
reserved
0xFFFF
0x0000
0x8000
0x0000
0x0000
0x0400
0x0400
0x0400
0x0400
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
alarms_mask(15:0)
config8
reserved
reserved
fifo_offset(2:0)
reserved
reserved
qmc_offsetA(12:0)
qmc_offsetB(12:0)
qmc_offsetC(12:0)
qmc_offsetD(12:0)
config9
config10
config11
config12
config13
config14
config15
config16
config17
config18
config19
config20
config21
config22
config23
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
qmc_gainA(10:0)
qmc_gainB(10:0)
qmc_gainC(10:0)
qmc_gainD(10:0)
cmix(3:0)
reserved
reserved
reserved
output_delayAB(1:0)
output_delayCD(1:0)
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
qmc_phaseAB(11:0)
qmc_phaseCD(11:0)
phase_offsetAB(15:0)
phase_offsetCD(15:0)
phase_addAB(15:0)
phase_addAB(31:16)
phase_addCD(15:0)
phase_addCD(31:16)
pll_
config24
0x18
NA
reserved
reserved
pll_reset ndivsync_
ena
pll_ena
reserved
pll_cp(1:0)
pll_p(2:0)
pll_lfvolt(2:0)
sleepC
config25
config26
0x19
0x1A
0x0440
0x0020
pll_m(7:0)
pll_n(3:0)
pll_sleep
pll_vcoitune(1:0)
reserved
bias_
sleep
tsense_
sleep
clkrecv_
sleep
pll_vco(5:0)
reserved
reserved
reserved
reserved
sleepA
sleepB
sleepD
extref_
ena
fuse_
sleep
config27
0x1B
0x0000
reserved
reserved
reserved
reserved
reserved
reserved
config28
config29
config30
0x1C
0x1D
0x1E
0x0000
0x0000
0x1111
reserved
reserved
reserved
reserved
syncsel_qmoffsetAB(3:0)
syncsel_qmoffsetCD(3:0)
syncsel_qmcorrAB(3:0)
syncsel_qmcorrCD(3:0)
(1) Unless otherwise noted, all reserved registers should be programmed to default values.
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Table 2. Register Map (continued)
(MSB)
Bit 15
(LSB)
Bit 0
Name
Address
0x1F
Default
0x1140
0x2400
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
config31
config32
syncsel_mixerAB(3:0)
syncsel_fifoin(3:0)
syncsel_mixerCD(3:0)
syncsel_fifoout(3:0)
syncsel_nco(3:0)
syncsel_fifo_input
sif_sync
reserved
clkdiv_
sync_sel
0x20
reserved
config33
config34
config35
config36
config37
config38
config39
config40
config41
config42
config43
config44
0x21
0x22
0x23
0x24
0x25
0x26
0x27
0x28
0x29
0x2A
0x2B
0x2C
0x0000
0x1B1B
0xFFFF
0x0000
0x7A7A
0xB6B6
0xEAEA
0x4545
0x1A1A
0x1616
0xAAAA
0xC6C6
reserved
pathA_in_set(1:0)
pathB_in_set(1:0)
pathC_in_set(1:0)
clkdly(2:0)
pathD_in_set(1:0)
DACA_out_set(1:0)
sleep_cntl(15:0)
DACB_out_set(1:0)
reserved
DACC_out_set(1:0)
DACD_out_set(1:0)
datadly(2:0)
iotest_pattern0
iotest_pattern1
iotest_pattern2
iotest_pattern3
iotest_pattern4
iotest_pattern5
iotest_pattern6
iotest_pattern7
ostrtodig_
sel
config45
0x2D
0x0004
reserved
ramp_ena
reserved
sifdac_ena
config46
config47
config48
version
0x2E
0x2F
0x30
0x7F
0x0000
0x0000
0x0000
0x5409
grp_delayA(7:0)
grp_delayC(7:0)
grp_delayB(7:0)
grp_delayD(7:0)
sifdac(15:0)
reserved
reserved
reserved
reserved
deviceid(1:0)
versionid(2:0)
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REGISTER DESCRIPTIONS
Register name: config0 – Address: 0x00, Default: 0x049C
Register
Name
Default
Value
Address
Bit
Name
Function
config0
0x00
15
qmc_offsetAB_ena When set, the digital quadrature modulator correction (QMC) offset
correction for the AB data path is enabled.
0
14
13
12
qmc_offsetCD_ena When set, the digital QMC offset correction for the CD data path is
enabled.
0
0
qmc_corrAB_ena
When set, the QMC phase and gain correction circuitry for the AB
data path is enabled.
qmc_corrCD_ena
When set, the QMC phase and gain correction circuitry for the CD
data path is enabled.
0
11:8 interp(3:0)
These bits define the interpolation factor.
0100
interp
0000
0001
0010
0100
1000
Interpolation Factor
1×
2×
4×
8×
16×
7
fifo_ena
When set, the FIFO is enabled. When the FIFO is disabled.
DACCCLKP/N and DATACLKP/N must be aligned (not
recommended).
1
6
5
4
Reserved
Reserved for factory use
Reserved for factory use
0
0
1
Reserved
alarm_out_ena
When set, the ALARM pin becomes an output. When cleared, the
ALARM pin is in the high-impedance state.
3
2
alarm_out_pol
This bit changes the polarity of the ALARM signal.
MM 0: Negative logic
MM 1: Positive logic
1
1
clkdiv_sync_ena
When set, enables the syncing of the clock divider and the FIFO
output pointer using the sync source selected by register config32.
The internal divided-down clocks are phase-aligned after syncing.
See the Power-Up Sequence section for more detail.
1
0
invsincAB_ena
invsincCD_ena
When set, the inverse sinc filter for the AB data path is enabled.
When set, the inverse sinc filter for the CD data path is enabled.
0
0
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Register name: config1 – Address: 0x01, Default: 0x040E
Register
www.ti.com
Default
Value
Address
Bit
Name
Function
Name
config1
0x01
15
iotest_ena
When set, enables the data pattern checker test. The outputs are
0
deactivated regardless of the state of TXENA and sif_txenable.
14
13
12
Reserved
Reserved
64cnt_ena
Reserved for factory use
Reserved for factory use
0
0
0
When set, enables resetting of the alarms after 64 good samples
with the goal of removing unnecessary errors. For instance, when
checking setup or hold through the pattern checker test, there may
initially be errors. Setting this bit removes the need for a SIF write to
clear the alarm register.
11
oddeven_parity
Selects between odd and even parity check
MM 0: Even parity
0
MM 1: Odd parity
10
9
parity_ena
When set, enables parity checking of each input word using the 1
PARITYP/N parity input. It should match the oddeven_parity
register setting.
1
0
0
single_dual_parity
rev_interface
When set, enables dual parity checking; otherwise, single parity
checking. The parity bit should match the oddeven_parity register
setting. parity_ena must be set for dual parity to function.
8
When set, the PARITY, SYNC, and ISTR inputs are rotated to allow
complete reversal of the data interface when setting the
rev_interface bit.
When rev_interface = 1, the following changes occurs
MM 1. SYNCP/N becomes ISTRP/N.
MM 2. PARITYP/N becomes SYNCP/N.
MM 3. ISTRP/N becomes PARITYP/N.
7
6
5
4
3
2
1
0
dacA_complement
dacB_complement
dacC_complement
dacD_complement
alarm_2away_ena
alarm_1away_ena
alarm_collision_ena
Reserved
When set, the DACA output is complemented. This allows effectively
changing the + and – designations of the LVDS data lines.
0
0
0
0
1
1
1
0
When set, the DACB output is complemented. This allows effectively
changing the + and – designations of the LVDS data lines.
When set, the DACC output is complemented. This allows effectively
changing the + and – designations of the LVDS data lines.
When set, the DACD output is complemented. This allows effectively
changing the + and – designations of the LVDS data lines.
When set, the alarm from the FIFO indicating the write and read
pointers being 2 away is enabled.
When set, the alarm from the FIFO indicating the write and read
pointers being 1 away is enabled.
When set, the alarm from the FIFO indicating a collision between the
write and read pointers is enabled.
Reserved for factory use
28
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Register name: config2 – Address: 0x02, Default: 0x7000
Register
Name
Default
Value
Address
Bit
Name
Reserved
Function
config2
0x02
15
14
Reserved for factory use
0
1
dacclkgone_ena
dataclkgone_ena
collisiongone_ena
When set, the DACCLK-gone signal from the clock monitor circuit can
be used to shut off the DAC outputs. The corresponding alarms,
alarm_dacclk_gone and alarm_output_gone, must not be masked
(i.e., config7, bit <10> and bit <8> must set to 0).
13
12
When set, the DATACLK-gone signal from the clock monitor circuit
can be used to shut off the DAC outputs. The corresponding alarms,
alarm_dataclk_gone and alarm_output_gone, must not be masked
(i.e., config7, bit <9> and bit <8> must set to 0).
1
1
When set, the FIFO collision alarms can be used to shut off the DAC
outputs. The corresponding alarms, alarm_fifo_collision and
alarm_output_gone, must not be masked (i.e., config7, bit <13> and
bit <8> must set to 0).
11
10
9
Reserved
Reserved
Reserved
Reserved
sif4_ena
Reserved for factory use
Reserved for factory use
Reserved for factory use
Reserved for factory use
0
0
0
0
0
8
7
When set, the serial interface (SIF) is a 4-bit interface; otherwise, it is
a 3-bit interface.
6
5
4
3
mixer_ena
mixer_gain
nco_ena
revbus
When set, the mixer block is enabled.
0
0
0
0
When set, a 6-dB gain is added to the mixer output.
When set, the NCO is enabled. This is not required for coarse mixing.
When set, the input bits for the data bus are reversed. MSB becomes
LSB.
2
1
Reserved
twos
Reserved for factory use
0
0
When set, the input data format is expected to be 2s-complement.
When cleared, the input is expected to be offset-binary.
0
Reserved
Reserved for factory use
0
Register name: config3 – Address: 0x03, Default: 0xF000
Register
Name
Default
Value
Address
Bit
Name
Function
config3
0x03
15:12 coarse_dac(3:0)
Scales the output current in 16 equal steps.
1111
VEXTIO
IFS
=
´ 2´ coarse _ dac +1
(
)
RBIAS
11:8
7:1
0
Reserved
Reserved
sif_txenable
Reserved for factory use
0000
0000 000
0
Reserved for factory use
When set, the internal value of TXENABLE is set to 1.
To enable analog output data transmission, set sif_txenable to 1 or
pull the CMOS TXENA pin (N9) to high. To disable analog output,
set sif_txenable to 0 and pull the CMOS TXENA pin (N9) to low.
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Register name: config4 – Address: 0x04, Default: No RESET Value (WRITE TO CLEAR)
Register
Name
Default
Value
Address
Bit
Name
Function
config4
0x04
15:0
iotest_results(15:0)
Bits in iotest_results with a logic value of 1 tell which bit in either DAB[15:0]
bus or DCD[15:0] bus failed during the pattern checker test.
No RESET
value
iotest_results(15:8) correspond to the data bits on both DAB[15:8] and
DCD[15:8].
iotest_results(7:0) correspond to the data bits on both DAB[7:0] and DCD[7:0].
Register name: config5 – Address: 0x05, Default: Setup and Power-Up Conditions Dependent (WRITE TO
CLEAR)
Register Address
Name
Default
Value
Bit
Name
Function
config5
0x05
15
alarm_from_zerochk
This alarm indicates the 8-bit FIFO write pointer address has an all-
zeros pattern. Due to the pointer address being a shift register, this
is not a valid address and causes the write pointer to be stuck until
the next sync. This error is typically caused by a timing error or
improper power start-up sequence. If this alarm is asserted,
resynchronization of the FIFO is necessary. See the Power-Up
Sequence section for more detail.
NA
14
Reserved
Reserved for factory use
NA
NA
13:11 alarms_from_fifo(2:0)
Alarm indicating FIFO pointer collisions and nearness:
MM 000: All fine
MM 001: Pointers are 2 away.
MM 01x: Pointers are 1 away.
MM 1xx: FIFO pointer collision
If the FIFO pointer collision alarm is set when collisiongone_ena is
enabled, the FIFO must be re-synchronized and the bits must be
cleared to resume normal operation.
10
9
alarm_dacclk_gone
alarm_dataclk_gone
alarm_output_gone
Alarm indicating the DACCLK has been stopped.
If the bit is set when dacclkgone_ena is enabled, DACCLK must
resume and the bit must be cleared to resume normal operation.
NA
NA
NA
Alarm indicating the DATACLK has been stopped.
If the bit is set when dataclkgone_ena is enabled, DATACLK must
resume and the bit must be cleared to resume normal operation.
8
Alarm indicating either alarm_dacclk_gone, alarm_dataclk_gone, or
alarm_fifo_collision are asserted. It controls the output. When high,
it outputs 0x8000 for each output connected to the DAC. If the bit is
set when dacclkgone_ena, dataclkgone_ena, or collisiongone_ena
are enabled, then the corresponding errors must be fixed and the
bits must be cleared to resume normal operation.
7
alarm_from_iotest
Alarm indicating the input data pattern does not match the pattern in
the iotest_pattern registers. When the data pattern checker mode is
enabled, this alarm in register config5, bit7 is the only valid alarm.
Other alarms in register config5 are not valid and can be
disregarded.
NA
6
5
Reserved
Reserved for factory use
NA
NA
alarm_from_pll
Alarm indicating the PLL has lost lock. For version ID 001,
alarm_from_PLL may not indicate the correct status of the PLL. See
pll_lfvolt(2:0) in register config24 for proper PLL lock indication.
4
3
alarm_Aparity
alarm_Bparity
In dual-parity mode, an alarm indicating a parity error on the A
word. In single-parity mode, an alarm on the 32-bit data captured on
the rising edge of DATACLKP/N.
NA
NA
In dual-parity mode, an alarm indicating a parity error on the B
word. In single-parity mode, an alarm on the 32-bit data captured on
the falling edge of DATACLKP/N.
2
1
0
alarm_Cparity
alarm_Dparity
Reserved
In dual-parity mode, an alarm indicating a parity error on the C
word.
NA
NA
NA
In dual-parity mode, an alarm indicating a parity error on the D
word.
Reserved for factory use
30
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Register name: config6 – Address: 0x06, Default: No RESET Value (READ ONLY)
Register
Name
Default
Value
Address
Bit
Name
tempdata(7:0)
Function
config6
0x06
15:8
This is the output from the chip temperature sensor. The value of this register in
2s-complement format represents the temperature in degrees Celsius. This
register must be read with a minimum SCLK period of 1 μs.
No
RESET
Value
7:2
1
Reserved
Reserved
Reserved
Reserved for factory use
Reserved for factory use
Reserved for factory use
0000 00
0
0
0
Register name: config7 – Address: 0x07, Default: 0xFFFF
Register
Name
Default
Value
Address
Bit
Name
Function
config7
0x07
15:0 alarms_mask(15:0)
These bits control the masking of the alarms. (0 = not masked, 1 = masked)
0xFFFF
alarm_mask
Alarm That Is Masked
alarm_from_zerochk
Not used
15
14
13
12
11
10
9
alarm_fifo_collision
alarm_fifo_1away
alarm_fifo_2away
alarm_dacclk_gone
alarm_dataclk_gone
alarm_output_gone
alarm_from_iotest
Not used
8
7
6
5
alarm_from_pll
alarm_Aparity
4
3
alarm_Bparity
2
alarm_Cparity
1
alarm_Dparity
0
Not used
Register name: config8 – Address: 0x08, Default: 0x0000 (CAUSES AUTO-SYNC)
Register
Name
Default
Value
Address
Bit
Name
Reserved
Function
config8
0x08
15
14
13
Reserved for factory use
Reserved for factory use
Reserved for factory use
0
Reserved
Reserved
0
0
12:0 qmc_offsetA(12:0)
DACA offset correction. The offset is measured in DAC LSBs. If enabled in config30,
writing to this register causes an auto-sync to be generated. This loads the values of
the QMC offset registers (config8–config9) into the offset block at the same time.
When updating the offset values for the AB channel, config8 should be written last.
Programming config9 does not affect the offset setting.
All zeros
Register name: config9 – Address: 0x09, Default: 0x8000
Register
Name
Default
Value
Address
Bit
Name
Function
config9
0x09
15:13 fifo_offset(2:0)
When the sync to the FIFO occurs, this is the value loaded into the FIFO read pointer. With
this value, the initial difference between write and read pointers can be controlled. This may
be helpful in syncing multiple chips or controlling the delay through the device.
100
12:0 qmc_offsetB(12:0) DACB offset correction. The offset is measured in DAC LSBs.
All zeros
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Register name: config10 – Address: 0x0A, Default: 0x0000 (CAUSES AUTO-SYNC)
Register
Name
Default
Value
Address
Bit
Name
Reserved
Function
config10
0x0A
15
14
13
Reserved for factory use
Reserved for factory use
Reserved for factory use
0
Reserved
Reserved
0
0
12:0 qmc_offsetC(12:0)
DACC offset correction. The offset is measured in DAC LSBs. If enabled in config30
writing to this register causes an auto-sync to be generated. This loads the values of
the CD-channel QMC offset registers (config10-config11) into the offset block at the
same time. When updating the offset values for the CD-channel config10 should be
written last. Programming config11 does not affect the offset setting.
All zeros
Register name: config11 – Address: 0x0B, Default: 0x0000
Register
Name
Default
Value
Address
Bit
Name
Reserved
Function
config11
0x0B
15
14
Reserved for factory use
Reserved for factory use
Reserved for factory use
0
Reserved
0
0
13
Reserved
12:0
qmc_offsetD(12:0)
DACD offset correction. The offset is measured in DAC LSBs.
All zeros
Register name: config12 – Address: 0x0C, Default: 0x0400
Register
Name
Default
Value
Address
Bit
Name
Reserved
Function
config12
0x0C
15
14
Reserved for factory use
Reserved for factory use
Reserved for factory use
Reserved for factory use
Reserved for factory use
0
0
0
0
0
Reserved
13
Reserved
12
Reserved
11
Reserved
10:0
qmc_gainA(10:0)
QMC gain for DACA. The full 11-bit qmc_gainA(10:0) word is formatted as UNSIGNED
with a range of 0 to 1.9990. The implied decimal point for the multiplication is between bit
9 and bit 10.
100 0000
0000
Register name: config13 – Address: 0x0D, Default: 0x0400
Register
Name
Default
Value
Address
Bit
Name
Function
Sets the mixing function of the coarse mixer.
config13
0x0D
15:12
cmix_mode(3:0)
0000
MM Bit 15: fS / 8 mixer
MM Bit 14: fS / 4 mixer
MM Bit 13: fS / 2 mixer
MM Bit 12: –fS / 4 mixer
The various mixers can be combined together to obtain a ±n × fS / 8 total mixing factor.
11
Reserved
Reserved for factory use
0
10:0
qmc_gainB(10:0)
QMC gain for DACB. The full 11-bit qmc_gainB(10:0) word is formatted as UNSIGNED
with a range of 0 to 1.9990. The implied decimal point for the multiplication is between
bit 9 and bit 10.
100 0000
0000
Register name: config14 – Address: 0x0E, Default: 0x0400
Register
Name
Default
Value
Address
Bit
Name
Reserved
Function
config14
0x0E
15
14
Reserved for factory use
Reserved for factory use
Reserved for factory use
Reserved for factory use
Reserved for factory use
0
0
0
0
0
Reserved
13
Reserved
12
Reserved
11
Reserved
10:0
qmc_gainC(10:0)
QMC gain for DACC. The full 11-bit qmc_gainC(10:0) word is formatted as UNSIGNED
with a range of 0 to 1.9990. The implied decimal point for the multiplication is between
bit 9 and bit 10.
100 0000
0000
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Register name: config15 – Address: 0x0F, Default: 0x0400
Register
Name
Default
Value
Address
Bit
Name
Function
config15
0x0F
15:14 output_
Delays the AB data path outputs from 0 to 3 DAC clock cycles
Delays the CD data path outputs from 0 to 3 DAC clock cycles
Reserved for factory use
00
delayAB(1:0)
13:12 output_
00
delayCD(1:0)
Reserved
11
0
10:0
qmc_gainD(10:0)
QMC gain for DACD. The full 11-bit qmc_gainD(10:0) word is formatted as UNSIGNED
with a range of 0 to 1.9990. The implied decimal point for the multiplication is between
bit 9 and bit 10.
100 0000
0000
Register name: config16 – Address: 0x10, Default: 0x0000 (CAUSES AUTO-SYNC)
Register
Name
Default
Value
Address
Bit
Name
Reserved
Function
config16
0x10
15
14
Reserved for factory use
Reserved for factory use
Reserved for factory use
Reserved for factory use
0
Reserved
0
13
Reserved
0
0
12
Reserved
11:0
qmc_phaseAB(11:0)
QMC correction phase for the AB data path. The 12-bit qmc_phaseAB(11:0) word is
formatted as 2s-complement and scaled to occupy a range of –0.5 to 0.49975 and a
default phase correction of 0.00. To accomplish QMC phase correction, this value is
multiplied by the current B sample, then summed into the A sample. If enabled in
config30, writing to this register causes an auto-sync to be generated. This
loads the values of the QMC offset registers (config12, config13, and config16)
into the QMC block at the same time. When updating the QMC values for the
AB channel, config16 should be written last. Programming config12 and
config13 does not affect the QMC settings.
All zeros
Register name: config17 – Address: 0x11, Default: 0x0000 (CAUSES AUTO-SYNC)
Register
Name
Default
Value
Address
Bit
Name
Reserved
Function
config17
0x11
15
14
Reserved for factory use
Reserved for factory use
Reserved for factory use
Reserved for factory use
0
Reserved
0
13
Reserved
0
0
12
Reserved
11:0
qmc_phaseCD(11:0)
QMC correction phase for the CD data path. The 12-bit qmc_gainCD(11:0) word is
formatted as 2s-complement and scaled to occupy a range of –0.5 to 0.49975 and
a default phase correction of 0.00. To accomplish QMC phase correction, this value
is multiplied by the current D sample, then summed into the C sample. If enabled
in config30, writing to this register causes an auto-sync to be generated. This
loads the values of the CD-channel QMC block registers (config14, config15,
and config17) into the QMC block at the same time. When updating the QMC
values for the CD-channel, config17 should be written last. Programming
config14 and config15 does not affect the QMC settings.
All zeros
Register name: config18 – Address: 0x12, Default: 0x0000 (CAUSES AUTO-SYNC)
Register
Name
Default
Value
Address
Bit
Name
Function
config18
0x12
15:0
phase_offsetAB(15:0) Phase offset added to the AB data path NCO accumulator before the generation of
the SIN and COS values. The phase offset is added to the upper 16 bits of the NCO
accumulator results, and these 16 bits are used in the sin and cos lookup tables. If
enabled in config31, writing to this register causes an auto-sync to be
generated. This loads the values of the fine mixer block registers (config18,
config20, and config21) at the same time. When updating the mixer values,
config18 should be written last. Programming config20 and config21 does not
affect the mixer settings.
0x0000
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Register name: config19 – Address: 0x13, Default: 0x0000 (CAUSES AUTO-SYNC)
Register
Name
Default
Value
Address
Bit
Name
Function
config19
0x13
15:0
phase_offsetCD(15:0)
Phase offset added to the CD data path NCO accumulator before the generation of
the SIN and COS values. The phase offset is added to the upper 16 bits of the NCO
accumulator results, and these 16 bits are used in the sin and cos lookup tables. If
enabled in config31, writing to this register causes an auto-sync to be
generated. This loads the values of the CD-channel fine mixer block registers
(config19, config22, and config23) at the same time. When updating the mixer
values for the CD-channel, config19 should be written last. Programming
config22 and config23 does not affect the mixer settings.
0x0000
Register name: config20 – Address: 0x14, Default: 0x0000
Register
Name
Default
Value
Address
Bit
Name
Function
config20
0x14
15:0
phase_ addAB(15:0)
The phase_addAB(15:0) value is used to determine the NCO frequency. The 2s-
complement formatted value can be positive or negative. Each LSB represents an fS
/ (232) frequency step.
0x0000
Register name: config21 – Address: 0x15, Default: 0x0000
Register
Name
Default
Value
Address
Bit
Name
Function
config21
0x15
15:0
phase_ addAB(31:16)
See config20.
0x0000
Register name: config22 – Address: 0x16, Default: 0x0000
Register
Name
Default
Value
Address
Bit
Name
Function
config22
0x16
15:0
phase_ addCD(15:0)
The phase_addCD(15:0) value is used to determine the NCO frequency. The 2s-
complement formatted value can be positive or negative. Each LSB represents an fS
/ (232) frequency step.
0x0000
Register name: config23 – Address: 0x17, Default: 0x0000
Register
Name
Default
Value
Address
Bit
Name
Function
config23
0x17
15:0
phase_ addCD(31:16)
See config22 above.
0x0000
34
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Register name: config24 – Address: 0x18, Default: NA
Register
Name
Default
Address
Bit
Name
Function
Value
001
0
config24
0x18
15:13
12
Reserved
pll_reset
Reserved for factory use
When set, the PLL loop filter (LPF) is pulled down to 0 V. Toggle from 1 to 0 to
restart the PLL if an overspeed lockup occurs. Overspeed can happen when the
process is fast, the supplies are higher than nominal, etc., resulting in the feedback
dividers missing a clock.
11
10
pll_ndivsync_ena
pll_ena
When set, the LVDS SYNC input is used to sync the PLL N dividers.
When set, the PLL is enabled. When cleared, the PLL is bypassed.
Reserved for factory use
1
0
9:8
7:6
Reserved
00
00
pll_cp(1:0)
PLL pump charge select
MM 00: No charge pump
MM 01: Single pump charge
MM 10: Not used
MM 11: Dual pump charge
5:3
pll_p(2:0)
PLL pre-scaler dividing module control
MM 010: 2
001
MM 011: 3
MM 100: 4
MM 101: 5
MM 110: 6
MM 111: 7
MM 000: 8
2:0
pll_lfvolt(2:0)
PLL loop filter voltage. This 3-bit read-only indicator has step size of 0.4125 V. The
entire range covers from 0 V to 3.3 V. The optimal lock range of the PLL is from 010
to 101 (i.e., 0.825 V to 2.063 V). Adjust pll_vco(5:0) for optimal lock range.
NA
Register name: config25 – Address: 0x19, Default: 0x0440
Register
Name
Default
Value
Address
Bit
Name
pll_m(7:0)
Function
M portion of the M/N divider of the PLL.
config25
0x19
15:8
0x04
If pll_m<7> = 0, the M divider value has the range of pll_m<6:0>, spanning from
4 to 127. (i.e., 0, 1, 2, and 3 are not valid.)
If pll_m<7> = 1, the M divider value has the range of 2 × pll_m<6:0>, spanning
from 8 to 254. (i.e., 0, 2, 4, and 6 are not valid. The M divider has even values
only.)
7:4
pll_n(3:0)
N portion of the M/N divider of the PLL.
MM 0000: 1
0100
MM 0001: 2
MM 0010: 3
MM 0011: 4
MM 0100: 5
MM 0101: 6
MM 0110: 7
MM 0111: 8
MM 1000: 9
MM 1001: 10
MM 1010: 11
MM 1011: 12
MM 1100: 13
MM 1101: 14
MM 1110: 15
MM 1111: 16
3:2
1:0
pll_vcoitune(1:0)
Reserved
PLL VCO bias tuning bits. Set to 01 for normal PLL operation
Reserved for factory use
00
00
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Register name: config26 – Address: 0x1A, Default: 0x0020
Register
www.ti.com
Default
Value
Address
Bit
Name
Function
Name
config26
0x1A
15:10
pll_vco(5:0)
VCO frequency coarse-tuning bits.
Reserved for factory use
0000 00
9
8
7
6
5
4
Reserved
0
0
0
0
1
0
Reserved
Reserved for factory use
bias_sleep
tsense_sleep
pll_sleep
When set, the bias amplifier is put into sleep mode.
Turns off the temperature sensor when asserted.
When set, the PLL is put into sleep mode.
clkrecv_sleep
When asserted, the clock input receiver is put into sleep mode. This affects the
OSTR receiver as well.
3
2
1
0
sleepA
sleepB
sleepC
sleepD
When set, the DACA is put into sleep mode.
When set, the DACB is put into sleep mode.
When set, the DACC is put into sleep mode.
When set, the DACD is put into sleep mode.
0
0
0
0
Register name: config27 – Address: 0x1B, Default: 0x0000
Register
Name
Default
Value
Address
Bit
Name
extref_ena
Function
config27
0x1B
15
Allows the device to use an external reference or the internal reference.
0: Internal reference
0
1: External reference
14
13
12
11
Reserved
Reserved
Reserved
fuse_sleep
Reserved for factory use
Reserved for factory use
Reserved for factory use
0
0
0
0
Put the fuses to sleep when set high.
Note: Default value is 0. Must be set to 1 for proper operation
10
9
Reserved
Reserved
Reserved
Reserved
Reserved
atest
Reserved for factory use
Reserved for factory use
Reserved for factory use
Reserved for factory use
Reserved for factory use
0
0
8
0
7
0
0
6
5:0
ATEST mode allows the user to check for the internal die voltages to ensure the
supply voltages are within range. When the ATEST mode is programmed, the
internal die voltages can be measured at the TXENA pin. The TXENA pin (N9) must
be floating without any pullup or pulldown resistors.
000000
In ATEST mode, the TXENA and sif_txenable logic is bypassed, and the output is
active at all times.
Config27, bit<5:0>
00 1110
00 1111
01 0000
01 0110
01 0111
01 1000
01 1110
01 1111
10 0000
10 0110
10 0111
10 1000
11 0000
00 0101
Description
DACA AVSS
DACA DVDD
DACA AVDD
DACB AVSS
DACB DVDD
DACB AVDD
DACC AVSS
DACC DVDD
DACC AVDD
DACD AVSS
DACD DVDD
DACD AVDD
1.3VDIG
Expected Nominal Voltage
0 V
1.35 V
3.3 V
0 V
1.35 V
3.3 V
0 V
1.35 V
3.3 V
0 V
1.35 V
3.3 V
1.3 V
1.35 V
1.35VCLK
36
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Register name: config28 – Address: 0x1C, Default: 0x0000
Register
Name
Default
Address
Bit
Name
Function
Value
0x00
0x00
config28
0x1C
15:8
7:0
Reserved
Reserved
Reserved for factory use
Reserved for factory use
Register name: config29 – Address: 0x1D, Default: 0x0000
Register
Name
Default
Value
Address
Bit
Name
Function
config29
0x1D
15:8
7:0
Reserved
Reserved
Reserved for factory use
Reserved for factory use
0x00
0x00
Register name: config30 – Address: 0x1E, Default: 0x1111
Register
Name
Default
Value
Address
Bit
Name
Function
config30
0x1E
15:12 syncsel_qmoffsetAB(3:0) Selects the syncing source(s) of the AB data path double-buffered QMC offset
registers. A 1 in the bit enables the signal as a sync source. More than one sync
source is permitted.
0001
0001
0001
0001
MM Bit 15: sif_sync (via config31)
MM Bit 14: SYNC
MM Bit 13: OSTR
MM Bit 12: Auto-sync from register write
11:8
syncsel_qmoffsetCD(3:0) Selects the syncing source(s) of the CD data path double-buffered QMC offset
registers. A 1 in the bit enables the signal as a sync source. More than one sync
source is permitted.
MM Bit 11: sif_sync (via config31)
MM Bit 10: SYNC
MM Bit 9: OSTR
MM Bit 8: Auto-sync from register write
7:4
syncsel_qmcorrAB(3:0)
syncsel_qmcorrCD(3:0)
Selects the syncing source(s) of the AB data path double buffered QMC offset
registers. A 1 in the bit enables the signal as a sync source. More than one sync
source is permitted.
MM Bit 7: sif_sync (via config31)
MM Bit 6: SYNC
MM Bit 5: OSTR
MM Bit 4: Auto-sync from register write
3:0
Selects the syncing source(s) of the CD data path double buffered QMC offset
registers. A 1 in the bit enables the signal as a sync source. More than one sync
source is permitted.
MM Bit 3: sif_sync (via config31)
MM Bit 2: SYNC
MM Bit 1: OSTR
MM Bit 0: Auto-sync from register write
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Register name: config31 – Address: 0x1F, Default: 0x1140
Register
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Default
Value
Address
Bit
Name
Function
Name
config31
0x1F
15:12 syncsel_mixerAB(3:0)
Selects the syncing source(s) of the AB data path double buffered mixer
registers. A 1 in the bit enables the signal as a sync source. More than one sync
source is permitted.
MM Bit 15: sif_sync (via config31)
MM Bit 14: SYNC
MM Bit 13: OSTR
MM Bit 12: Auto-sync from register write
0001
0001
11:8
syncsel_mixerCD(3:0)
Selects the syncing source(s) of the CD data path double buffered mixer
registers. A 1 in the bit enables the signal as a sync source. More than one sync
source is permitted.
MM Bit 11: sif_sync (via config31)
MM Bit 10: SYNC
MM Bit 9: OSTR
MM Bit 8: Auto-sync from register write
7:4
3:2
syncsel_nco(3:0)
Selects the syncing source(s) of the two NCO accumulators. A 1 in the bit
enables the signal as a sync source. More than one sync source is permitted.
MM Bit 7: sif_sync (via config31)
MM Bit 6: SYNC
MM Bit 5: OSTR
MM Bit 4: ISTR
0100
syncsel_fifo_input(1:0)
Selects either the ISTR or SYNC LVDS signal to be routed to the internal
FIFO_ISTR path if syncsel_fifoin(3:0) is set to be ISTR (i.e. syncsel_fifoin(3:0) =
0010). In conjunction with config1 register bit(8), this allows flexibility of external
LVDS signal routing to the internal FIFO. The syncsel_fifo_input(1:0) can only
have one bit active at a time.
00
MM 00: external LVDS ISTR signal to internal FIFO_ISTR path
MM 01: external LVDS SYNC signal to internal FIFO_ISTR path
MM 10: external LVDS ISTR signal to internal FIFO_ISTR path
MM 11: external LVDS SYNC signal to internal FIFO_ISTR path
1
0
sif_sync
SIF created sync signal. Set to 1 to cause a sync and then clear to 0 to remove
it.
0
0
Reserved
Reserved for factory use
Register name: config32 – Address: 0x20, Default: 0x2400
Register
Name
Default
Value
Address
Bit
Name
Function
config32
0x20
15:12
syncsel_fifoin(3:0)
Selects the syncing source(s) of the FIFO input side. A 1 in the bit enables the
signal as a sync source. More than one sync source is permitted.
0010
MM Bit 15: sif_sync (via config31)
MM Bit 14: Always zero
MM Bit 13: ISTR
MM Bit 12: SYNC
11:8
syncsel_fifoout(3:0)
Selects the syncing source(s) of the FIFO output side. A 1 in the bit enables the
signal as a sync source. More than one sync source is permitted. clkdiv_sync_ena
must be set to 1 for the FIFO output pointer sync to occur.
0100
MM Bit 11: sif_sync (via config31)
MM Bit 10: OSTR – Dual-sync-sources mode
MM Bit 9: ISTR – Single-sync-source mode
MM Bit 8: SYNC – Single-sync-source mode
7:1
0
Reserved
Reserved for factory use
0000
0
clkdiv_sync_sel
Selects the signal source for clock divider synchronization
clkdiv_sync_sel
Sync Source
0
1
OSTR
ISTR, SYNC, or SIF SYNC, based on syncsel_fifoin
source selection
(config32, bits<15:12>)
Register name: config33 – Address: 0x21, Default: 0x0000
Register
Name
Default
Value
Address
Bit
Name
Reserved
Function
config33
0x21
15:0
Reserved for factory use
0x0000
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Register name: config34 – Address: 0x22, Default: 0x1B1B
Register
Name
Default
Value
Address
Bit
Name
Function
config34
0x22
15:14
13:12
11:10
9:8
pathA_in_sel(1:0)
pathB_in_sel(1:0)
pathC_in_sel(1:0)
pathD_in_sel(1:0)
DACA_out_sel(1:0)
DACB_out_sel(1:0)
DACC_out_sel(1:0)
DACD_out_sel(1:0)
Selects the word used for the A channel path
Selects the word used for the B channel path
Selects the word used for the C channel path
Selects the word used for the D channel path
Selects the word used for the DACA output
Selects the word used for the DACB output
Selects the word used for the DACC output
Selects the word used for the DACD output
00
01
10
11
7:6
00
5:4
01
3:2
10
1:0
11
Register name: config35 – Address: 0x23, Default: 0xFFFF
Register
Name
Default
Value
Address
Bit
Name
Function
config35
0x23
15:0
sleep_cntl(15:0)
Controls the routing of the CMOS SLEEP signal (pin N11) to different blocks. When a
bit in this register is set, the SLEEP signal is sent to the corresponding block. The
block is only disabled when the SLEEP is logic HIGH and the corresponding bit is set
to 1.
0xFFFF
These bits do not override the SIF bits in config26 that control the same sleep function.
sleep_cntl(bit)
Function
DACA sleep
15
14
DACB sleep
13
DACC sleep
12
DACD sleep
11
Clock receiver sleep
PLL sleep
10
9
LVDS data sleep
LVDS control sleep
Temp sensor sleep
Reserved
8
7
6
5
Bias amplifier sleep
Not used
All others
Register name: config36 – Address: 0x24, Default: 0x0000
Register
Name
Default
Value
Address
Bit
Name
Function
config36
0x24
15:13 datadly(2:0)
Controls the delay of the data inputs through the LVDS receivers. Each LSB adds
approximately 40 ps
000
0: Minimum
12:10 clkdly(2:0)
Controls the delay of the data clock through the LVDS receivers. Each LSB adds
approximately 40 ps
000
0: Minimum
9:0
Reserved
Reserved for factory use
0x000
Register name: config37 – Address: 0x25, Default: 0x7A7A
Register
Name
Default
Value
Address
Bit
Name
Function
config37
0x25
15:0
iotest_pattern0
Dataword0 in the IO test pattern. It is used with the seven other words to test the input data.
0x7A7A
At the start of the IO test pattern, this word should be aligned with rising edge of ISTR or
SYNC signal to indicate sample 0.
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Register name: config38 – Address: 0x26, Default: 0xB6B6
Register
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Default
Value
Address
Bit
Name
Function
Name
config38
0x26
15:0
iotest_pattern1
Dataword1 in the IO test pattern. It is used with the seven other words to test the input data.
0xB6B6
Register name: config39 – Address: 0x27, Default: 0xEAEA
Register
Name
Default
Value
Address
Bit
Name
Function
config39
0x27
15:0
iotest_pattern2
Dataword2 in the IO test pattern. It is used with the seven other words to test the input
data.
0xEAEA
Register name: config40 – Address: 0x28, Default: 0x4545
Register
Name
Default
Value
Address
Bit
Name
Function
Dataword3 in the IO test pattern. It is used with the seven other words to test the input data.
config40
0x28
15:0
iotest_pattern3
0x4545
Register name: config41 – Address: 0x29, Default: 0x1A1A
Register
Name
Default
Value
Address
Bit
Name
Function
config41
0x29
15:0
iotest_pattern4 Dataword4 in the IO test pattern. It is used with the seven other words to test the input data.
0x1A1A
Register name: config42 – Address: 0x2A, Default: 0x1616
Register
Name
Default
Value
Address
Bit
Name
Function
config42
0x2A
15:0
iotest_pattern5
Dataword5 in the IO test pattern. It is used with the seven other words to test the input
data.
0x1616
Register name: config43 – Address: 0x2B, Default: 0xAAAA
Register
Name
Default
Value
Address
Bit
Name
Function
config43
0x2B
15:0
iotest_pattern6
Dataword6 in the IO test pattern. It is used with the seven other words to test the input
data.
0xAAAA
Register name: config44 – Address: 0x2C, Default: 0xC6C6
Register
Name
Default
Value
Address
Bit
Name
Function
config44
0x2C
15:0
iotest_pattern7
Dataword7 in the IO test pattern. It is used with the seven other words to test the input
data.
0xC6C6
Register name: config45 – Address: 0x2D, Default: 0x0004
Register
Name
Default
Value
Address
Bit
Name
Reserved
Function
config45
0x2D
15
14
Reserved for factory use
0
0
ostrtodig_sel
When set, the OSTR signal is passed directly to the digital block. This is the signal that
is used to clock the dividers.
13
ramp_ena
Reserved
When set, a ramp signal is inserted in the input data at the FIFO input.
Reserved for factory use
0
12:1
0000
0000
0010
0
sifdac_ena
When set, the DAC output is set to the value in sifdac(15:0) in register config48.
0
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SLAS808B –FEBRUARY 2012–REVISED JULY 2012
Register name: config46 – Address: 0x2E, Default: 0x0000
Register
Name
Default
Value
Address
Bit
Name
Reserved
Function
config46
0x2E
15:0
Reserved for factory use
0x00
Register name: config47 – Address: 0x2F, Default: 0x0000
Register
Name
Default
Value
Address
Bit
Name
Reserved
Function
config47
0x2F
15:0
Reserved for factory use
0x00
Register name: config48 – Address: 0x30, Default: 0x0000
Register
Name
Default
Value
Address
Bit
Name
sifdac(15:0)
Function
config48
0x30
15:0
Value sent to the DACs when sifdac_ena is asserted. DATACLK must be running to
latch this value into the DACs. The format would be based on twos in register config2.
0x0000
Register name: version– Address: 0x7F, Default: 0x5409 (READ ONLY)
Register
Name
Default
Value
Address
Bit
Name
Function
version
0x7F
15:10
9
Reserved
Reserved
Reserved
Reserved
Reserved for factory use
Reserved for factory use
Reserved for factory use
Reserved for factory use
Returns 01 for DAC34SH84
0101 01
0
8:7
6:5
4:3
2:0
00
00
deviceid(1:0)
versionid(2:0)
01
A hardwired register that contains the version of the chip
001
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DATA INTERFACE
The DAC34SH84 has a 32-bit LVDS bus that accepts quad, 16-bit data in word-wide format. The quad, 16-bit
data can be input to the device using a dual-bus, 16-bit interface. The bus accepts LVDS transfer rates up to 1.5
GSPS, which corresponds to a maximum data rate of 750 MSPS per data channel. The default LVDS bus input
assignment is shown in Table 3.
Table 3. LVDS Bus Input Assignment
Data Paths
A and B
Pins
DAB[15..0]
DCD[15..0]
C and D
Data is sampled by the LVDS double-data-rate (DDR) clock DATACLK. Setup and hold requirements must be
met for proper sampling. A and C data are captured on the rising edge of DATACLK. B and D data are captured
on the falling edge of DATACLK.
For both input bus modes, a sync signal, either ISTR or SYNC, is required to sync the FIFO read and/or write
pointers.
The sync signal, either ISTR or SYNC, can be either a pulse or a periodic signal where the sync period
corresponds to multiples of eight samples. ISTR or SYNC is sampled by a rising edge in DATACLK. The pulse
duration t(ISTR_SYNC) must be at least equal to one-half of the DATACLK period.
DATA FORMAT
The 16-bit data for channels A and B is interleaved in the form A0[15:0], B0[15:0], A1[15:0], B1[15:0], A2[15:0]…
into the DAB[15:0]P/N LVDS inputs. Similarly, data for channels C and D is interleaved into the DCD[15:0]P/N
LVDS inputs. Data into the DAC34SH84 is formatted according to the diagram shown in Figure 51, where index
0 is the data LSB and index 15 is the data MSB.
SAMPLE 0
SAMPLE 1
SAMPLE 2
SAMPLE 3
A0
B0
A1
B1
A2
B2
A3
B3
DAB[15:0]P/N
DCD[15:0]P/N
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
C0
D0
C1
D1
C2
D2
C3
D3
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
DATACLKP/N (DDR)
t(ISTR_SYNC)
Sync
Option #1
ISTRP/N
t(ISTR_SYNC)
Sync
SYNCP/N
Option #2
T0530-01
Figure 51. Data Transmission Format
The FIFO read and write pointer can also be synced by SIF SYNC as the third sync option if multi-device
synchronization is not needed. In this sync mode, the syncsel_fifoin(3:0) and syncsel_fifoout(3:0) in register
config32 need to be both set to 1000 for the SIF SYNC option.
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INPUT FIFO
The DAC34SH84 includes a 4-channel, 16-bit-wide and 8-sample-deep input FIFO which acts as an elastic
buffer. The purpose of the FIFO is to absorb any timing variations between the input data and the internal DAC
data-rate clock, such as the ones resulting from clock-to-data variations from the data source.
Figure 52 shows a simplified block diagram of the FIFO.
Clock Handoff
Input Side
Clocked by DATACLK
Output Side
Clocked by FIFO Out Clock
(DACCLK/Interpolation Factor)
FIFO:
4 x 16-Bits Wide
8-Samples deep
16-Bit
DAB[15:0]
Initial
Position
Sample 0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
A0[15:0], B0[15:0], C0[15:0], D0[15:0]
16-Bit
A-Data, 16-Bit
FIFO A Output
Sample 0
A1[15:0], B1[15:0], C1[15:0], D1[15:0]
16-Bit
16-Bit
16-Bit
B-Data, 16-Bit
C-Data, 16-Bit
D-Data, 16-Bit
64-Bit
FIFO B Output
FIFO C Output
FIFO D Output
64-Bit
16-Bit
16-Bit
Sample 0
A2[15:0], B2[15:0], C2[15:0], D2[15:0]
De-Interleave
DCD[15:0]
Sample 0
A3[15:0], B3[15:0], C3[15:0], D3[15:0]
Initial
Position
Sample 0
A4[15:0], B4[15:0], C4[15:0], D4[15:0]
Sample 0
A5[15:0], B5[15:0], C5[15:0], D5[15:0]
16-Bit
Sample 0
A6[15:0], B6[15:0], C6[15:0], D6[15:0]
Read Pointer Reset
Write Pointer Reset
ISTR/
SYNC
Sample 0
A7[15:0], B7[15:0], C7[15:0], D7[15:0]
FIFO Reset
fifo_offset(2:0)
syncsel_fifoout
S
M
OSTR
syncsel_fifoin
S (Single Sync Sources Mode): Reset handoff from
input side to output side
M (Dual Sync Source Mode): OSTR resets read
pointer. Allows Multi-DAC synchronization
B0461-01
Figure 52. DAC34SH84 FIFO Block Diagram
Data is written to the device 32 bits at a time on the rising and falling edges of DATACLK. In order to form a
complete 64-bit wide sample (16-bit A-data, 16-bit B-data, 16-bit C-data, and 16-bit D-data) one DATACLK
period is required. Each 64-bit-wide sample is written into the FIFO at the address indicated by the write pointer.
Similarly, data from the FIFO is read by the FIFO-out clock 64 bits at a time from the address indicated by the
read pointer. The FIFO-out clock is generated internally from the DACCLK signal and its rate is equal to
DACCLK / interpolation. Each time a FIFO write or FIFO read is done, the corresponding pointer moves to the
next address.
The reset position for the FIFO read and write pointers is set by default to addresses 0 and 4 as shown in
Figure 52. This offset gives optimal margin within the FIFO. The default read pointer location can be set to
another value using fifo_offset(2:0) in register config9 (address 4 by default). Under normal conditions, data is
written to and read from the FIFO at the same rate and consequently, the write and read pointer gap remains
constant. If the FIFO write and read rates are different, the corresponding pointers cycle at different speeds,
which could result in pointer collision. Under this condition, the FIFO attempts to read and write data from the
same address at the same time, which results in errors and thus must be avoided.
The write pointer sync source is selected by syncsel_fifoin(3:0) in register config32. In most applications either
ISTR or SYNC are used to reset the write pointer. Unlike DATA, the sync signal is latched only on the rising
edges of DATACLK. A rising edge on the sync signal source causes the pointer to return to its original position.
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Similarly, the read pointer sync source is selected by syncsel_fifoout(3:0). The write pointer sync source can be
set to reset the read pointer as well. In this case, the FIFO-out clock recaptures the write pointer sync signal to
reset the read pointer. This clock domain transfer (DATACLK to FIFO Out Clock) results in phase ambiguity of
the sync signal. This limits the precise control of the output timing and makes full synchronization of multiple
devices difficult.
To alleviate this, the device offers the alternative of resetting the FIFO read pointer independently of the write
pointer by using the OSTR signal. The OSTR signal is sampled by DACCLK and must satisfy the timing
requirements in the specifications table. In order to minimize the skew it is recommended to use the same clock
distribution device such as Texas Instruments CDCE62005 to provide the DACCLK and OSTR signals to all the
DAC34SH84 devices in the system. Swapping the polarity of the DACCLK outputs with respect to the OSTR
ones establishes proper phase relationship.
The FIFO pointers reset procedure can be done periodically or only once during initialization as the pointers
automatically return to the initial position when the FIFO has been filled. To reset the FIFO periodically, it is
necessary to have the ISTR, SYNC, and OSTR signals to repeat at multiples of 8 FIFO samples. To disable
FIFO reset, set syncsel_fifoin(3:0) and syncsel_fifoout(3:0) to 0000.
The frequency limitation for ISTR and SYNC signals are the following:
fsync = fDATACLK / (n × 8), where n = 1, 2, …
The frequency limitation for the OSTR signal is the following:
fOSTR = fDAC / (n × interpolation × 8) where n = 1, 2, …
The frequencies above are at maximum when n = 1. This is when the ISTR, SYNC, or OSTR have a rising edge
transition every 8 FIFO samples. The occurrence can be made less frequent by setting n > 1, for example, every
n × 8 FIFO samples.
D[15:0]P/N
tS(DATA)
tH(DATA)
tS(DATA)
tH(DATA)
DATACLKP/N
(DDR)
tH(DATA)
tS(DATA)
ISTRP/N
SYNCP/N
Resets Write Pointer to Position 0
DACCLKP/N
2x Interpolation
tS(OSTR)
tH(OSTR)
OSTRP/N
(optionally internal
sync from Write Reset)
Resets Read Pointer to Position
Set by fifo_offset (4 by Default)
T0531-01
Figure 53. FIFO Write and Read Descriptions
FIFO MODES OF OPERATION
The DAC34SH84 input FIFO can be completely bypassed through registers config0 and config32. The register
configuration for each mode is described in Table 4.
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Register
config0
Control Bits
fifo_ena
config32
syncsel_fifoout(3:0)
Table 4. FIFO Operation Modes
config0 and config32 FIFO Bits
FIFO Mode
syncsel_fifoout
fifo_ena
Bit 3: sif_sync
Bit 2: OSTR
Bit 1: ISTR
Bit 0: SYNC
Dual Sync Sources
1
1
0
0
1
0
0
Single Sync
Source
1 or 0 Depends on the sync
source
1 or 0 Depends on the
sync source
0
0
Bypass
X
X
X
X
DUAL-SYNC-SOURCES MODE
This is the recommended mode of operation for those applications that require precise control of the output
timing. In Dual Sync Sources mode, the FIFO write and read pointers are reset independently. The FIFO write
pointer is reset using the LVDS ISTR or SYNC signal, and the FIFO read pointer is reset using the LVPECL
OSTR signal. This allows LVPECL OSTR signal to control the phase of the output for either a single chip or
multiple chips. Multiple devices can be fully synchronized in this mode.
SINGLE-SYNC-SOURCE MODE
In single-sync-source mode, the FIFO write and read pointers are reset from the same source, either LVDS ISTR
or LVDS SYNC signal. This mode has a possibility of up to 2 DAC clocks offset between the multiple DAC
outputs. Applications requiring exact output timing control need dual-sync-sources mode instead of single-sync-
source mode. A single rising edge for FIFO and clock divider sync is recommended. Periodic sync signal is not
recommended due to the non-deterministic latency of the sync signal through the clock domain transfer.
In this mode, there is a chance for FIFO pointers 2 away alarm (or possibly 1 away alarm) to occur at initial setup
or syncing. This is the result of single-sync-source mode having 0 to 3 address location slip, which is caused by
the asynchronous handoff of the sync signal occurring between the DATACLK zone and the DACCLK zone. The
asynchronous relationship between the clock domains means there could be a slip (from nominal) in the READ
and WRITE pointers at initial syncing. For example, with the default programming of FIFO offset of 4, the actual
FIFO offset may be 3, 2, or in some instances, 1. Please note that in this mode, the nominal address location slip
is 0 with the possibility getting less for each increase in slip amount. Also, the slip does not continue to occur as
the device functions, but the READ/WRITE pointers may not be at optimal settings. If an alarm occurs:
1. Adjust the FIFO offset accordingly and resynchronize the FIFO, data formatter, etc., such that there are no
alarms reported or at least only the 2-away alarm is reported.
2. The FIFO collision alarm is a warning of the system, because the read and write processes occur at the
same pointer. However, the FIFO 1-away and 2-away alarms are informational for the system designer. The
important thing for these two alarms is that the alarm should not get closer to collision during normal
operation. If the 1-away alarm or collision alarm starts to occur, it is a warning to check for system errors.
The system should have an interrupt or algorithm to fix the error and resynchronize the alarm appropriately.
BYPASS MODE
In FIFO bypass mode, the FIFO block is not used. As a result, the input data is handed off from the DATACLK to
the DACCLK domain without any compensation. In this mode, the relationship between DATACLK and DACCLK
is critical and used as a synchronizing mechanism for the internal logic. Due to this constraint, this mode is not
recommended. In bypass mode, the pointers have no effect on the data path or handoff.
CLOCKING MODES
The DAC34SH84 has a dual-clock setup in which a DAC clock signal is used to clock the DAC cores and internal
digital logic, and a separate DATA clock is used to clock the input LVDS receivers and FIFO input. The
DAC34SH84 DAC clock signal can be sourced directly or generated through an on-chip low-jitter phase-locked
loop (PLL).
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In those applications requiring extremely low noise it is recommended to bypass the PLL and source the DAC
clock directly from a high-quality external clock to the DACCLK input. In most applications, system clocking can
be simplified by using the on-chip PLL to generate the DAC core clock while still satisfying performance
requirements. In this case, the DACCLK pins are used as the reference frequency input to the PLL.
16-Bit
DACI
PLL
DACCLK
Clock Distribution
to Digital
16-Bit
DACQ
VCO/
Dividers
pll_ena
B0452-01
Figure 54. Top-Level Clock Diagram
PLL BYPASS MODE
In PLL bypass mode, a very high-quality clock is sourced to the DACCLK inputs. This clock is used to directly
source the DAC34SH84 DAC sample-rate clock. This mode gives the device best performance and is
recommended for extremely demanding applications.
The bypass mode is selected by setting the following:
1. pll_ena bit in register config24 to 0 to bypass the PLL circuitry.
2. pll_sleep bit in register config26 to 1 to put the PLL and VCO into sleep mode.
PLL MODE
In this mode, the clock at the DACCLKP/N input functions as a reference clock source to the on-chip PLL. The
on-chip PLL then multiplies this reference clock to supply a higher-frequency DAC sample-rate clock. Figure 55
shows the block diagram of the PLL circuit.
OSTR (Internally Generated)
External Loop
Filter
DACCLKP
REFCLK
DACCLKN
PFD
and
CP
N
Divider
Prescaler
DACCLK
SYNCP
SYNCN
SYNC_PLL
VCO
Internal Loop
Filter
Note:
The PLL generates internal OSTR signal. In this mode
external LVPECL OSTR signal is not required.
M
Divider
If the DAC is configured with PLL enabled with Dual Sync
Sources mode, then the PFD frequency has to be the pre-
defined OSTR frequency.
B0453-01
Figure 55. PLL Block Diagram
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The DAC34SH84 PLL mode is selected by setting the following:
1. pll_ena bit in register config24 to 1 to route to the PLL clock path.
2. pll_sleep bit in register config26 to 0 to enable the PLL and VCO.
The output frequency of the VCO is designed to be the in the range from 2.7 GHz to 3.3 GHz. The prescaler
value, pll_p(2:0) in register config24, should be chosen such that the product of the prescaler value and DAC
sample rate clock is within the VCO range. To maintain optimal PLL loop, the coarse-tuning bits, pll_vco(5:0) in
register config26, can adjust the center frequency of the VCO toward the product of the prescaler value and DAC
sample-rate clock. Figure 56 shows a typical relationship between the coarse-tuning bits and VCO center
frequency.
3300
VCO Frequency MHz - 2673
)
(
Coarse-Tuning Bits @
9.7
3200
3100
3000
2900
2800
2700
0
8
16
32
Coarse-Tuning Bits
40
48
56
64
24
Figure 56. Typical PLL/VCO Lock Range vs Coarse-Tuning Bits
Common wireless infrastructure frequencies (614.4MHz, 737.28MHz, 983.04 MHz, and so forth) are generated
from this VCO frequency in conjunction with the prescaler setting as shown in Table 5.
Table 5. VCO Operation
VCO Frequency (MHz)
2949.12
Pre-Scale Divider
Desired DACCLK (MHz)
pll_p(2:0)
110
6
5
4
3
2
491.52
614.4
3072
101
2949.12
737.28
983.04
1474.56
100
2949.12
011
2949.12
010
The M divider is used to determine the phase-frequency-detector (PFD) and charge-pump (CP) frequency.
Table 6. PFD and CP Operation
DACCLK Frequency
M Divider
PFD Update Rate (MHz)
pll_m(7:0)
(MHz)
491.52
491.52
491.52
491.52
4
8
122.88
61.44
30.72
15.36
0000 0100
0000 1000
0001 0000
0010 0000
16
32
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The N divider in the loop allows the PFD to operate at a lower frequency than the reference clock. Both M and N
dividers can keep the PFD frequency below 155 MHz for peak operation.
The overall divide ratio inside the loop is the product of the pre-scale and M dividers (P × M), and the following
guidelines should be followed:
•
•
•
The overall divide ratio range is from 24 to 480.
When the overall divide ratio is less than 120, the internal loop filter can assure a stable loop.
When the overall divide ratio is greater than 120, an external loop filter or double charge pump is required to
ensure loop stability.
The single- and double-charge-pump current options are selected by setting pll_cp in register config24 to 01 and
11, respectively. When using the double-charge-pump setting, an external loop filter is not required. If an external
loop filter is required, the following filter should be connected to the LPF pin (A1):
LPF
R = 1 kΩ
C2 = 1 nF
C1 = 100 nF
S0514-01
Figure 57. Recommended External Loop Filter
The PLL generates an internal OSTR signal and does not require the external LVPECL OSTR signal. The OSTR
signal is buffered from the N-divider output in the PLL block, and the frequency of the signal is the same as the
PFD frequency. Therefore, using the PLL with dual-sync-sources mode would require the PFD frequency to be
the pre-defined OSTR frequency. This allows the FIFO to be synced correctly by the internal OSTR.
MULTI-DEVICE SYNCHRONIZATION
In various applications, such as multi antenna systems where the various transmit channels information is
correlated, it is required that multiple DAC devices are completely synchronized such that their outputs are phase
aligned. The DAC34SH84 architecture supports this mode of operation.
MULTI-DEVICE SYNCHRONIZATION: PLL BYPASSED WITH DUAL SYNC SOURCES MODE
For single- or multi-device synchronization it is important that delay differences in the data are absorbed by the
device so that latency through the device remains the same. Furthermore, to ensure that the outputs from each
DAC are phase aligned it is necessary that data is read from the FIFO of each device simultaneously. In the
DAC34SH84 this is accomplished by operating the multiple devices in Dual Sync Sources mode. In this mode
the additional OSTR signal is required by each DAC34SH84 to be synchronized.
Data into the device is input as LVDS signals from one or multiple baseband ASICs or FPGAs. Data into multiple
DAC devices can experience different delays due to variations in the digital source output paths or board level
wiring. These different delays can be effectively absorbed by the DAC34SH84 FIFO so that all outputs are phase
aligned correctly.
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DACCLKP/N
OSTRP/N
DAB[15:0]P/N
DCD[15:0]P/N
FPGA
DAC34SH84 DAC1
ISTRP/N
Delay 1
LVPECL Outputs
DATACLKP/N
Outputs are
Phase Aligned
Variable delays due to variations in the FPGA(s) output
paths or board level wiring or temperature/voltage deltas
PLL/
DLL
Clock Generator
LVPECL Outputs
DAB[15:0]P/N
DCD[15:0]P/N
ISTRP/N
DATACLKP/N
OSTRP/N
Delay 2
DAC34SH84 DAC2
DACCLKP/N
B0454-04
Figure 58. Synchronization System in Dual Sync Sources Mode With PLL Bypassed
For correct operation both OSTR and DACCLK must be generated from the same clock domain. The OSTR
signal is sampled by DACCLK and must satisfy the timing requirements in the specifications table. If the clock
generator does not have the ability to delay the DACCLK to meet the OSTR timing requirement, the polarity of
the DACCLK outputs can be swapped with respect to the OSTR ones to create 180 degree phase delay of the
DACCLK. This may help establish proper setup and hold time requirement of the OSTR signal.
Careful board layout planning must be done to ensure that the DACCLK and OSTR signals are distributed from
device to device with the lowest skew possible as this will affect the synchronization process. In order to
minimize the skew across devices it is recommended to use the same clock distribution device to provide the
DACCLK and OSTR signals to all the DAC devices in the system.
DACCLKP/N(1)
tS(OSTR)
tH(OSTR)
tSKEW ~ 0
OSTRP/N(1)
DACCLKP/N(2)
OSTRP/N(2)
tS(OSTR)
tH(OSTR)
•
•
•
•
T0526-04
Figure 59. Timing Diagram for LVPECL Synchronization Signals
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The following steps are required to ensure the devices are fully synchronized. The procedure assumes all the
DAC34SH84 devices have a DACCLK and OSTR signal and must be carried out on each device.
1. Start-up the device as described in the power-up sequence. Set the DAC34SH84 in Dual Sync Sources
mode and select OSTR as the clock divider sync source (clkdiv_sync_sel in register config32).
2. Sync the clock divider and FIFO pointers.
3. Verify there are no FIFO alarms either through register config5 or through the ALARM pin.
4. Disable clock divider sync by setting clkdiv_sync_ena to 0 in register config0.
After these steps all the DAC34SH84 outputs will be synchronized.
MULTI-DEVICE SYNCHRONIZATION: PLL ENABLED WITH DUAL SYNC SOURCES MODE
The DAC34SH84 allows exact phase alignment between multiple devices even when operating with the internal
PLL clock multiplier. In PLL clock mode, the PLL generates the DAC clock and an internal OSTR signal from the
reference clock applied to the DACCLK inputs so there is no need to supply an additional LVPECL OSTR signal.
For this method to operate properly the SYNC signal should be set to reset the PLL N dividers to a known state
by setting pll_ndivsync_ena in register config24 to 1. The SYNC signal resets the PLL N dividers with a rising
edge, and the timing relationship ts(SYNC_PLL) and th(SYNC_PLL) are relative to the reference clock presented on the
DACCLK pin.
Both SYNC and DACCLK can be set as low frequency signals to greatly simplifying trace routing (SYNC can be
just a pulse as a single rising edge is required, if using a periodic signal it is recommended to clear the
pll_ndivsync_ena bit after resetting the PLL dividers). Besides the ts(SYNC_PLL) and th(SYNC_PLL) requirement
between SYNC and DACCLK, there is no additional required timing relationship between the SYNC and ISTR
signals or between DACCLK and DATACLK. The only restriction as in the PLL disabled case is that the DACCLK
and SYNC signals are distributed from device to device with the lowest skew possible.
DACCLKP/N
SYNCP/N
DAB[15:0]P/N
DCD[15:0]P/N
FPGA
DAC34SH84 DAC1
ISTRP/N
Delay 1
Outputs
DATACLKP/N
Outputs are
Phase Aligned
Variable delays due to variations in the FPGA(s) output
paths or board level wiring or temperature/voltage deltas
PLL/
DLL
Clock Generator
Outputs
DAB[15:0]P/N
DCD[15:0]P/N
ISTRP/N
DATACLKP/N
SYNCP/N
Delay 2
DAC34SH84 DAC2
DACCLKP/N
B0455-04
Figure 60. Synchronization System in Dual Sync Sources Mode With PLL Enabled
The following steps are required to ensure the devices are fully synchronized. The procedure assumes all the
DAC34SH84 devices have a DACCLK and OSTR signal and must be carried out on each device.
1. Start up the device as described in the power-up sequence. Set the DAC34SH84 in Dual Sync Sources
mode and enable SYNC to reset the PLL dividers (set pll_ndivsync_ena in register config24 to 1).
2. Reset the PLL dividers with a rising edge on SYNC.
3. Disable PLL dividers resetting.
4. Sync the clock divider and FIFO pointers.
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5. Verify there are no FIFO alarms either through register config5 or through the ALARM pin.
6. Disable clock divider sync by setting clkdiv_sync_ena to 0 in register config0.
After these steps all the DAC34SH84 outputs will be synchronized.
MULTI-DEVICE OPERATION: SINGLE SYNC SOURCE MODE
In Single Sync Source mode, the FIFO write and read pointers are reset from the same sync source, either ISTR
or SYNC. Although the FIFO in this mode can still absorb the data delay differences due to variations in the
digital source output paths or board level wiring it is impossible to guarantee data will be read from the FIFO of
different devices simultaneously thus preventing exact phase alignment.
In Single Sync Source mode the FIFO read pointer reset is handoff between the two clock domains (DATACLK
and FIFO OUT CLOCK) by simply re-sampling the write pointer reset. Since the two clocks are asynchronous
there is a small but distinct possibility of a meta-stablility during the pointer handoff. This meta-stability can cause
the outputs of the multiple devices to slip by up to 2 DAC clock cycles.
When the PLL is enabled with Single Sync Source mode, the FIFO read pointer is not synchronized by the
OSTR signal. Therefore, there is no restriction on the PLL PFD frequency as described in the previous section.
DACCLKP/N
DAB[15:0]P/N
DCD[15:0]P/N
FPGA
DAC34SH84 DAC1
ISTRP/N
Delay 1
LVPECL Outputs
DATACLKP/N
Variable delays due to variations in the FPGA(s) output
paths or board level wiring or temperature/voltage deltas
PLL/
DLL
Clock Generator
LVPECL Outputs
0 to 2 DAC Clock Cycles
DAB[15:0]P/N
DCD[15:0]P/N
ISTRP/N
Delay 2
DATACLKP/N
DAC34SH84 DAC2
DACCLKP/N
B0456-04
Figure 61. Multi-Device Operation in Single Sync Source Mode
FIR FILTERS
Figure 62 through Figure 65 show the magnitude spectrum response for the FIR0, FIR1, FIR2 and FIR3
interpolating filters where fIN is the input data rate to the FIR filter. Figure 66 to Figure 69 show the composite
filter response for 2x, 4x, 8x and 16x interpolation. The transition band for all interpolation settings is from 0.4 to
0.6 x fDATA (the input data rate to the device) with < 0.001dB of pass-band ripple and > 90 dB stop-band
attenuation.
The DAC34SH84 also has a 9-tap inverse sinc filter (FIR4) that runs at the DAC update rate (fDAC) that can be
used to flatten the frequency response of the sample-and-hold output. The DAC sample-and-hold output sets the
output current and holds it constant for one DAC clock cycle until the next sample, resulting in the well-known
sin(x) / x or sinc(x) frequency response (Figure 70, red line). The inverse sinc filter response (Figure 70, blue
line) has the opposite frequency response from 0 to 0.4 x Fdac, resulting in the combined response (Figure 70,
green line). Between 0 to 0.4 x fDAC, the inverse sinc filter compensates the sample-and-hold roll-off with less
than 0.03 dB error.
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The inverse sinc filter has a gain > 1 at all frequencies. Therefore, the signal input to FIR4 must be reduced from
full scale to prevent saturation in the filter. The amount of back-off required depends on the signal frequency, and
is set such that at the signal frequencies the combination of the input signal and filter response is less than 1 (0
dB). For example, if the signal input to FIR4 is at 0.25 x fDAC, the response of FIR4 is 0.9 dB, and the signal must
be backed off from full scale by 0.9 dB to avoid saturation. The gain function in the QMC blocks can be used to
reduce the amplitude of the input signal. The advantage of FIR4 having a positive gain at all frequencies is that
the user is then able to optimize the back-off of the signal based on its frequency.
The filter taps for all digital filters are listed in Table 4. Note that the loss of signal amplitude may result in lower
SNR due to decrease in signal amplitude.
20
0
20
0
–20
–20
–40
–40
–60
–60
–80
–80
–100
–120
–140
–160
–100
–120
–140
–160
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
f/fIN
1
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
f/fIN
1
G048
G049
Figure 62. Magnitude Spectrum for FIR0
Figure 63. Magnitude Spectrum for FIR1
20
0
20
0
–20
–40
–60
–80
–20
–40
–60
–80
–100
–100
–120
–140
–160
–120
–140
–160
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
f/fIN
1
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
f/fIN
1
G050
G051
Figure 64. Magnitude Spectrum for FIR2
Figure 65. Magnitude Spectrum for FIR3
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20
0
20
0
–20
–20
–40
–40
–60
–60
–80
–80
–100
–120
–140
–160
–100
–120
–140
–160
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
f/fDATA
1
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
f/fDATA
G052
G053
Figure 66. 2x Interpolation Composite Response
Figure 67. 4x Interpolation Composite Response
20
0
20
0
–20
–20
–40
–40
–60
–60
–80
–80
–100
–120
–140
–160
–100
–120
–140
–160
0
0.5
1
1.5
2
2.5
3
3.5
4
0
1
2
3
4
5
6
7
8
f/fDATA
f/fDATA
G054
G055
Figure 68. 8x Interpolation Composite Response
Figure 69. 16x Interpolation Composite Response
4
3
FIR4
2
1
Corrected
0
–1
–2
–3
–4
sin(x)/x
0
0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5
f/fDAC
G056
Figure 70. Magnitude Spectrum for Inverse Sinc Filter
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Table 7. FIR Filter Coefficients
Non-Interpolating
Inverse-SINC Filter
Interpolating Half-band Filters
FIR0
FIR1
FIR2
FIR3
FIR4
59 Taps
23 Taps
11 Taps
11 Taps
9 Taps
6
0
6
–12
0
–12
0
29
0
29
0
3
0
3
0
1
–4
1
0
–4
–19
0
–19
84
84
–214
0
–214
0
–25
0
–25
0
13
13
0
0
0
–50
592(1)
–50
47
47
–336
0
–336
0
1209
2048(1)
1209
150
256(1)
150
0
0
–100
0
–100
0
1006
0
1006
0
192
0
192
0
–2691
0
–2691
0
–342
0
–342
0
10141
16,384(1)
10141
572
0
572
0
–914
0
–914
0
1409
0
1409
0
–2119
0
–2119
0
3152
0
3152
0
–4729
0
–4729
0
7420
0
7420
0
–13,334
0
–13,334
0
41,527
65,536(1)
41,527
(1) Center taps are highlighted in BOLD
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COMPLEX SIGNAL MIXER
The DAC34SH84 has two paths of complex signal mixer blocks that contain two full complex mixer (FMIX) blocks
and power saving coarse mixer (CMIX) blocks. The signal path is shown in Figure 71.
16
16
16
16
I Data In
(A)
I Data Out
(A)
Complex
Signal
Multiplier
Fs/2
Mixer
Fs/4
Mixer
16
16
16
16
Q Data In
(B)
Q Data Out
(B)
sine
16
cosine
16
CMIX<1>
CMIX<2> CMIX<0>
CMIX<3>
sine
16
cosine sine
16 16
cosine
16
(AB)
Numerically
Controlled
Oscillator
Fixed Fs/8
Oscillator
NCO_ENA
B0471-02
Note: Channel CD data path not shown
Figure 71. Path of Complex Signal Mixer
FULL COMPLEX MIXER
The two FMIX blocks operate with independent Numerically Controlled Oscillators (NCOs) and enable flexible
frequency placement without imposing additional limitations in the signal bandwidth. The NCOs have 32-bit
frequency registers (phaseaddAB(31:0) and phaseaddCD(31:0)) and 16-bit phase registers (phaseoffsetAB(15:0)
and phaseoffsetCD(15:0)) that generate the sine and cosine terms for the complex mixing. The NCO block
diagram is shown in Figure 72.
32
16
sin
Accumulator
32
16
32
32
16
Look-Up
Table
Frequency
Register
Σ
Σ
16
cos
CLK
RESET
16
fDAC
Phase
Register
NCO SYNC
via
syncsel_NCO[3:0]
B0026-03
Figure 72. NCO Block Diagram
Synchronization of the NCOs occurs by resetting the NCO accumulators to zero. The synchronization source is
selected by syncsel_NCO(3:0) in config31. The frequency word in the phaseaddAB(31:0) and phaseaddCD(31:0)
registers is added to the accumulators every clock cycle, fDAC. The output frequency of the NCO is:
freq´ fNCO _ CLK
fNCO
=
232
(1)
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With the complex mixer enabled, the two channels in the mixer path are treated as complex vectors of the form
IIN(t) + j QIN(t). The complex signal multiplier (shown in Figure 73) will multiply the complex channels with the sine
and cosine terms generated by the NCO. The resulting output, IOUT(t) + j QOUT(t), of the complex signal multiplier
is:
IOUT(t) = (IIN(t)cos(2πfNCOt + δ) – QIN(t)sin(2πfNCOt + δ)) × 2(mixer_gain – 1)
QOUT(t) = (IIN(t)sin(2πfNCOt + δ) + QIN(t)cos(2πfNCOt + δ)) × 2(mixer_gain – 1)
where t is the time since the last resetting of the NCO accumulator, δ is the phase offset value and mixer_gain is
either 0 or 1. δ is given by:
δ = 2π × phase_offsetAB/CD(15:0) / 216
The mixer_gain option allows the output signals of the multiplier to reduce by half (6 dB). See Mixer Gain section
for details.
16
16
16
IIN(t)
IOUT(t)
Q
IN(t)
16
QOUT(t)
16
16
cosine
sine
B0472-02
Figure 73. Complex Signal Multiplier
COARSE COMPLEX MIXER
In addition to the full complex mixers, the DAC34SH84 also has coarse mixer blocks capable of shifting the input
signal spectrum by the fixed mixing frequencies ±n × fS / 8. Using the coarse mixer instead of the full mixers
lowers power consumption.
The output of the fS / 2, fS / 4, and –fS / 4 mixer block is:
IOUT(t) = I(t)cos(2πfCMIXt) – Q(t)sin(2πfCMIXt)
QOUT(t) = I(t)sin(2πfCMIXt) + Q(t)cos(2πfCMIXt)
Since the sine and the cosine terms are a function of fS / 2, fS / 4, or –fS / 4 mixing frequencies, the possible
resulting value of the terms can only be 1, –1, or 0. The simplified mathematics allows the complex signal
multiplier to be bypassed in any one of the modes, thus mixer gain is not available. The fS / 2, fS / 4, and –fS / 4
mixer blocks performs mixing through negating and swapping of I/Q channel on certain sequence of samples.
Table 8 shows the algorithm used for those mixer blocks.
Table 8. fS / 2, fS / 4, and –fS / 4 Mixing Sequence
MODE
MIXING SEQUENCE
Iout = {I1, I2, I3, I4…}
Normal (mixer bypassed)
Qout = {Q1, Q2, Q3, Q4…}
Iout = {I1, –I2, I3, –I4…}
Qout = {Q1, –Q2, Q3, –Q4…}
Iout = {I1, –Q2, –I3, Q4…}
Qout = {Q1, I2, –Q3, –I4…}
Iout = {I1, Q2, –I3, –Q4…}
Qout = {Q1, –I2, –Q3, I4…}
fS / 2
fS / 4
–fS / 4
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The fS / 8 mixer can be enabled along with various combinations of fS / 2, fS / 4, and –fS / 4 mixer. Because the fS
/ 8 mixer uses the complex signal multiplier block with fixed fS / 8 sine and cosine term, the output of the
multiplier is:
IOUT(t) = (IIN(t)cos(2πfNCOt + δ) – QIN(t)sin(2πfNCOt + δ)) × 2(mixer_gain – 1)
QOUT(t) = (IIN(t)sin(2πfNCOt + δ) + QIN(t)cos(2πfNCOt + δ)) × 2(mixer_gain – 1)
where fCMIX is the fixed mixing frequency selected by cmix(3:0). The mixing combinations are described in
Table 9. The mixer_gain option allows the output signals of the multiplier to reduce by half (6dB). See Mixer Gain
section for details.
Table 9. Coarse Mixer Combinations
fS / 8 Mixer
cmix(3)
fS / 4 Mixer
cmix(2)
fS / 2 Mixer
cmix(1)
–fS / 4 Mixer
cmix(0)
cmix(3:0)
Mixing Mode
0000
0001
Disabled
Disabled
Disabled
Disabled
Enabled
Enabled
Enabled
Enabled
–
Disabled
Disabled
Disabled
Enabled
Disabled
Disabled
Enabled
Enabled
–
Disabled
Disabled
Enabled
Disabled
Disabled
Enabled
Disabled
Enabled
–
Disabled
Enabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
–
No mixing
–fS / 4
0010
fS / 2
0100
fS / 4
1000
fS / 8
1010
–3fS / 8
1100
3fS / 8
1110
–fS / 8
All others
Not recommended
MIXER GAIN
The maximum output amplitude out of the complex signal multiplier (i.e., FMIX mode or CMIX mode with fS / 8
mixer enabled) occurs if IIN(t) and QIN(t) are simultaneously full scale amplitude and the sine and cosine
arguments are equal to 2π x fMIXt + δ (2N-1) x π / 4, where N = 1, 2, 3, etc....
sine
cosine
Max output occurs when both
sine and cosine are 0.707
M0221-01
Figure 74. Maximum Output of the Complex Signal Multiplier
With mixer_gain = 1 and both IIN(t) and QIN(t) are simultaneously full scale amplitude, the maximum output
possible out of the complex signal multiplier is 0.707 + 0.707 = 1.414 (or 3dB). This configuration can cause
clipping of the signal and should therefore be used with caution.
With mixer_gain = 0 in config2, the maximum output possible out of the complex signal multiplier is 0.5 × (0.707
+ 0.707) = 0.707 (or –3 dB). This loss in signal power is in most cases undesirable, and it is recommended that
the gain function of the QMC block be used to increase the signal by 3 dB to compensate.
REAL CHANNEL UPCONVERSION
The mixer in the DAC34SH84 treats the A, B, C, and D inputs are complex input data and produces a complex
output for most mixing frequencies. The real input data for each channel can be isolated only when the mixing
frequency is set to normal mode or fS / 2 mode. See Table 8 for details.
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QUADRATURE MODULATION CORRECTION (QMC)
GAIN AND PHASE CORRECTION
The DAC34SH84 includes a Quadrature Modulator Correction (QMC) block. The QMC blocks provide a mean for
changing the gain and phase of the complex signals to compensate for any I and Q imbalances present in an
analog quadrature modulator. The block diagram for the QMC block is shown in Figure 75. The QMC block
contains 3 programmable parameters.
Registers qmc_gainA/B(10:0) and qmc_gainC/D(10:0) controls the I and Q path gains and is an 11-bit unsigned
value with a range of 0 to 1.9990 and the default gain is 1.0000. The implied decimal point for the multiplication
is between bit 9 and bit 10.
Register qmc_phaseAB/CD(11:0) control the phase imbalance between I and Q and are a 12-bit values with a
range of –0.5 to approximately 0.49975. The QMC phase term is not a direct phase rotation but a constant that is
multiplied by each Q sample then summed into the I sample path. This is an approximation of a true phase
rotation in order to keep the implementation simple.
LO feed-through can be minimized by adjusting the DAC offset feature described below.
qmc_gainA[10:0]
11
16
16
I Data In
(A)
I Data Out
(A)
Σ
12
qmc_phaseAB[11:0]
16
16
Q Data In
(B)
Q Data Out
(B)
11
qmc_gainB[10:0]
qmc_gainC[10:0]
11
16
16
I Data In
(C)
I Data Out
(C)
Σ
12
qmc_phaseCD[11:0]
16
16
Q Data In
(D)
Q Data Out
(D)
11
qmc_gainD[10:0]
B0164-03
Figure 75. QMC Block Diagram
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OFFSET CORRECTION
Registers qmc_offsetA(12:0), qmc_offsetB(12:0), qmc_offsetC(12:0) and qmc_offsetD(12:0) can be used to
independently adjust the dc offsets of each channel. The offset values are in represented in 2s-complement
format with a range from –4096 to 4095.
The offset value adds a digital offset to the digital data before digital-to-analog conversion. Because the offset is
added directly to the data it may be necessary to back off the signal to prevent saturation. Both data and offset
values are LSB aligned.
qmc_offsetA
{–4096, –4095, ..., 4095}
13
16
16
16
16
A Data In
B Data In
A Data Out
B Data Out
Σ
Σ
13
qmc_offsetB
{–4096, –4095, ..., 4095}
qmc_offsetC
{–4096, –4095, ..., 4095}
13
16
16
16
16
C Data In
D Data In
C Data Out
D Data Out
Σ
Σ
13
qmc_offsetD
{–4096, –4095, ..., 4095}
B0165-03
Figure 76. Digital Offset Block Diagram
TEMPERATURE SENSOR
The DAC34SH84 incorporates a temperature sensor block which monitors the temperature by measuring the
voltage across 2 transistors. The voltage is converted to an 8-bit digital word using a successive-approximation
(SAR) analog to digital conversion process. The result is scaled, limited and formatted as a twos complement
value representing the temperature in degrees Celsius.
The sampling is controlled by the serial interface signals SDENB and SCLK. If the temperature sensor is enabled
(tsense_sleep = 0 in register config26) a conversion takes place each time the serial port is written or read. The
data is only read and sent out by the digital block when the temperature sensor is read in tempdata(7:0) in
config6. The conversion uses the first eight clocks of the serial clock as the capture and conversion clock, the
data is valid on the falling eighth SCLK. The data is then clocked out of the chip on the rising edge of the ninth
SCLK. No other clocks to the chip are necessary for the temperature sensor operation. As a result the
temperature sensor is enabled even when the device is in sleep mode.
In order for the process described above to operate properly, the serial port read from config6 must be done with
an SCLK period of at least 1 μs. If this is not satisfied the temperature sensor accuracy is greatly reduced.
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DATA PATTERN CHECKER
The DAC34SH84 incorporates a simple pattern checker test in order to determine errors in the data interface.
The main cause of failures is setup and/or hold timing issues. The test mode is enabled by asserting iotest_ena
in register config1. In test mode the analog outputs are deactivated regardless of the state of TXENA or
sif_texnable in register config3.
The data pattern key used for the test is 8 words long and is specified by the contents of iotest_pattern[0:7] in
registers config37 through config44. The data pattern key can be modified by changing the contents of these
registers.
The first word in the test frame is determined by a rising edge transition in ISTR or SYNC, depending on the
syncsel_fifoin(3:0) setting in config32. At this transition, the pattern0 word should be input to the data DAB[15:0]
pins, and pattern2 should be input to the data DCD[15:0] pins. Patterns 1, 4, and 5 of DAB[15:0] bus and pattern
3, 6, and 7 of DCD[15:0] bus should follow sequentially on each edge of DATACLK (rising and falling). The
sequence should be repeated until the pattern checker test is disabled by setting iotest_ena back to 0. It is not
necessary to have a rising ISTR or SYNC edge aligned with every four DATACLK cycle, just the first one to mark
the beginning of the series.
Start cycle again with optional rising edge of ISTR or SYNC
Pattern 0 Pattern 1 Pattern 4 Pattern 5 Pattern 0 Pattern 1 Pattern 4 Pattern 5
DAB[15:0]P/N
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
Pattern 2 Pattern 3 Pattern 6 Pattern 7 Pattern 2 Pattern 3 Pattern 6 Pattern 7
[15:0] [15:0] [15:0] [15:0] [15:0] [15:0] [15:0] [15:0]
DCD[15:0]P/N
DATACLKP/N (DDR)
ISTRP/N
Sync
Option #1
Sync
Option #2
SYNCP/N
T0532-01
Figure 77. IO Pattern Checker Data Transmission Format
The test mode determines if the all the patterns on the two 16-bit LVDS data buses (DAB[15:0]P/N and
DCD[15:0]P/N) were received correctly by comparing the received data against the data pattern key. If any bits in
either of the two 16-bit data buses were received incorrectly, the corresponding bits in iotest_results(15:0) in
register config4 will be set to 1 to indicate bit error location. The user can check the corresponding bit location on
both 16-bit data buses and implement the fix accordingly. Furthermore, the error condition will trigger the
alarm_from_iotest bit in register config5 to indicate a general error in the data interface. When data pattern
checker mode is enabled, this alarm in register config5, bit7 is the only valid alarm. Other alarms in register
config5 are not valid and can be disregarded.
For instance, pattern0 is programmed to the default of 0x7A7A. If the received Pattern 0 is 0x7A7B, then bit 0 in
iotest_results(15:0) will be set to 1 to indicate an error in bit 0 location. The alarm_from_iotest will also be set to
1 to report the data transfer error. Note that iotest_results(15:0) does not indicate which of the 16-bit buses has
the error. The user needs to check both 16-bit buses and then narrow down the error from the bit location
information.
The alarms can be cleared by writing 0x0000 to iotest_results(15:0) and 0 to alarm_from_iotest through the serial
interface. The serial interface will read back 0s if there are no errors or if the errors are cleared. The
corresponding alarm bit will remain a 1 if the errors remain.
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It is recommended to enable the pattern checker and then run the pattern sequence for 100 or more complete
cycles before clearing the iotest_results(15:0) and alarm_from_iotest. This will eliminate the possibility of false
alarms generated during the setup sequence.
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iotest_pattern0
iotest_pattern1
iotest_pattern2
iotest_pattern3
iotest_pattern4
iotest_pattern5
iotest_pattern6
iotest_pattern7
Pattern 0
Bit-by-Bit Compare
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
Pattern 1
Bit-by-Bit Compare
32-Bit
8-Bit
Input
DAB[15:0]
DCD[15:0]
Pattern 2
Bit-by-Bit Compare
iotest_results[15]
16-Bit
Pattern 3
Bit-by-Bit Compare
32-Bit
16-Bit
Input
Bit 15
Results
ISTR
or
SYNC
LVDS
Drivers
Data
Format
Only one
edge needed
Pattern 4
Bit-by-Bit Compare
•
•
•
•
•
•
•
•
•
alarm_from
Pattern 5
Bit-by-Bit Compare
All Bits
Results
16-Bit
DATACLK
iotest_results[0]
Pattern 6
Bit-by-Bit Compare
8-Bit
Input
Bit 0
Results
Pattern 7
Bit-by-Bit Compare
Go back to 0 after cycle or new
rising edge on ISTR or SYNC
Figure 78. DAC34SH84 Pattern Check Block Diagram
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PARITY CHECK TEST
The DAC34SH84 has a parity check test that enables continuous validity monitoring of the data received by the
DAC. Parity check testing in combination with the data pattern checker offer an excellent solution for detecting
board assembly issues due to missing pad connections.
For the parity check test, an extra parity bit is added to the data bits to ensure that the total number of set bits
(bits with value 1) is even or odd. This simple scheme is used to detect single or any other odd number of data
transfer errors. Parity testing is implemented in the DAC34SH84 in two ways: 32-bit parity and dual 16-bit parity.
32-BIT PARITY
In the 32-bit mode the additional parity bit is sourced to the parity input (PARITYP/N) for the 32-bit data transfer
into the DAB[15:0]P/N and DCD[15:0]P/N inputs. This mode is enabled by setting parity_ena = 1 and
single_dual_parity = 0 in register config1. The input parity value is defined to be the total number of logic 1s on
the 33-bit data bus – the DAB[15:0]P/N inputs, the DCD[15:0]P/N inputs, and the PARITYP/N input. This value,
the total number of logic 1s, must match the parity test selected in the oddeven_parity bit in register config1.
For example, if the oddeven_parity bit is set to 1 for odd parity, then the number of 1s on the 33-bit data bus
should be odd. The DAC will check the data transfer through the parity input. If the data received has odd
number of 1s, then the parity is correct. If the data received has even number of 1s, then the parity is incorrect.
The corresponding alarm for parity error will be set accordingly.
Figure 79 shows the simple XOR structure used to check word parity. Parity is tested independently for data
captured on both rising and falling edges of DATACLK (alarm_Aparity and alarm_Bparity, respectively). Testing
on both edges helps in determining a possible setup or hold issue. Both alarms are captured individually in
register config5.
PARITY
DAB[15:0]
DCD[15:0]
alarm_Aparity
oddeven_parity
alarm_Bparity
Parity Block
DATACLK
B0458-02
Figure 79. DAC34SH84 32-Bit Parity Check
DUAL 16-BIT PARITY
In the dual 16-bit mode, each 16-bit LVDS data bus input will be accompanied by a parity bit for error checking.
The DAB[15:0]P/N and ISTRP/N are one 17-bit data path, and the DCD[15:0]P/N and PARITYP/N are another
path. This mode is enabled by setting parity_ena = 1 and single_dual_parity = 1 in register config1. The input
parity value is defined to be the total number of logic 1s on each 17-bit data bus. This value, the total number of
logic 1s, must match the parity test selected in the oddeven_parity bit in register config1.
For example, if the oddeven_parity bit is set to 1 for odd parity, then the number of 1s on each 17-bit data bus
should be odd. The DAC will check the data transfer through the parity input. If the data received has odd
number of 1s, then the parity is correct. If the data received has even number of 1s, then the parity is incorrect.
The corresponding alarm for parity error will be set accordingly.
Figure 80 shows the simple XOR structure used to check word parity. Parity is tested independently for data
captured on both rising and falling edges of DATACLK for each data path (alarm_Aparity, alarm_Bparity,
alarm_Cparity, and alarm_Dparity, respectively). Testing on both edges and both data buses helps in
determining a possible setup or hold issue. All of the alarms are captured individually in register config5.
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In this mode the ISTR signal functions as a parity signal and cannot be used to sync the FIFO pointer
simultaneously. It is recommended to use the SYNC to sync the FIFO pointer. If ISTR has to be used to sync the
FIFO pointer, the ISTR sync can only be possible upon start-up when dual 16-bit parity function is disabled.
Once the initialization is finished, disable the FIFO pointer sync through ISTR (by configuring syncsel_fifoin and
syncsel_fifoout in config32) and enable the dual 16-bit parity function afterwards.
alarm_Aparity
ISTR
oddeven_parity
DAB[15:0]
alarm_Bparity
Parity Block
DATACLK
alarm_Cparity
PARITY
oddeven_parity
DCD[15:0]
alarm_Dparity
Parity Block
DATACLK
B0463-01
Figure 80. DAC34SH84 Dual 16-Bit Parity Check
DAC34SH84 ALARM MONITORING
The DAC34SH84 includes a flexible set of alarm monitoring that can be used to alert of a possible malfunction
scenario. All the alarm events can be accessed either through the config5 register or through the ALARM pin.
Once an alarm is set, the corresponding alarm bit in register config5 must be reset through the serial interface to
allow further testing. The set of alarms includes the following conditions:
Zero check alarm
•
Alarm_from_zerochk. Occurs when the FIFO write pointer has an all zeros pattern. Since the write pointer is a
shift register, all zeros will cause the input point to be stuck until the next sync event. When this happens a
sync to the FIFO block is required.
FIFO alarms
alarm_from_fifo. Occurs when there is a collision in the FIFO pointers or a collision event is close.
•
–
–
–
alarm_fifo_2away. Pointers are within two addresses of each other.
alarm_fifo_1away. Pointers are within one address of each other.
alarm_fifo_collision. Pointers are equal to each other.
Clock alarms
clock_gone. Occurs when either the DACCLK or DATACLOCK have been stopped.
•
–
–
alarm_dacclk_gone. Occurs when the DACCLK has been stopped.
alarm_dataclk_gone. Occurs when the DATACLK has been stopped.
Pattern checker alarm
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•
alarm_from_iotest. Occurs when the input data pattern does not match the pattern key.
PLL alarm
•
alarm_from_pll. Occurs when the PLL is out of lock.
Parity alarms
•
alarm_Aparity: In dual parity mode, alarm indicating a parity error on the A word. In single parity mode, alarm
on the 32-bit data captured on the rising edge of DATACLKP/N.
•
alarm_Bparity: In dual parity mode, alarm indicating a parity error on the B word. In single parity mode, alarm
on the 32-bit data captured on the falling edge of DATACLKP/N.
•
•
alarm_Cparity: In dual parity mode, alarm indicating a parity error on the C word.
alarm_Dparity: In dual parity mode, alarm indicating a parity error on the D word.
To prevent unexpected DAC outputs from propagating into the transmit channel chain, the clock and alarm_
fifo_collision alarms can be set in config2 to shut-off the DAC output automatically regardless of the state of
TXENA or sif_txenable.
Alarm monitoring is implemented as follows:
•
•
•
•
•
Power up the device using the recommended power-up sequence.
Clear all the alarms in config5 by setting them to zeros.
Unmask those alarms that will generate a hardware interrupt through the ALARM pin in config7.
Enable automatic DAC shut-off in register config2 if required.
In the case of an alarm event, the ALARM pin will trigger. If automatic DAC shut-off has been enabled the
DAC outputs will be disabled.
•
•
•
•
•
Read registers config5 to determine which alarm triggered the ALARM pin.
Correct the error condition and re-synchronize the FIFO.
Clear the alarms in config5.
Re-read config5 to ensure the alarm event has been corrected.
Keep clearing and reading config5 until no error is reported.
POWER-UP SEQUENCE
The following startup sequence is recommended to power-up the DAC34SH84:
1. Set TXENA low
2. Supply all 1.35V voltages (DACVDD, CLKVDD), 1.3V voltages (DIGVDD, VFUSE), and 3.3V voltages
(AVDD, IOVDD, and PLLAVDD). The 1.2V and 3.3V supplies can be powered up simultaneously or in any
order. There are no specific requirements on the ramp rate for the supplies.
3. Provide all LVPECL inputs: DACCLKP/N and the optional OSTRP/N. These inputs can also be provided after
the SIF register programming.
4. Toggle the RESETB pin for a minimum 25 ns active low pulse width.
5. Program the SIF registers.
6. Program fuse_sleep (config27, bit<11>) to put the internal fuses to sleep.
7. FIFO configuration needed for synchronization:
(a) Program syncsel_fifoin(3:0) (config32, bit<15:12>) to select the FIFO input pointer sync source.
(b) Program syncsel_fifoout(3:0) (config32, bit<11:8>) to select the FIFO output pointer sync source.
(c) Program syncsel_fifo_input(1:0) (config31, bit<3:2>) to select the FIFO input sync source.
8. Clock divider configuration needed for synchronization:
(a) Program clkdiv_sync_sel (config32, bit<0>) to select the clock divider sync source.
(b) Program clkdiv_sync_ena (config0, bit<2>) to 1 to enable clock divider sync.
(c) For multi-DAC synchronization in PLL mode, program pll_ndivsync_ena (config24, bit<11>) to 1 to
synchronize the PLL N-divider.
9. Provide all LVDS inputs (D[15:0]P/N, DCD[15:0]P/N, DATACLKP/N, ISTRP/N, SYNCP/N and PARITYP/N)
simultaneously. Synchronize the FIFO and clock divider by providing the pulse or periodic signals needed.
(a) For Single Sync Source Mode where either ISTRP/N or SYNCP/N is used to sync the FIFO, a single
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rising edge for FIFO and clock divider sync is recommended. Periodic sync signal is not recommended
due to the non-deterministic latency of the sync signal through the clock domain transfer.
(b) For Dual Sync Sources Mode, both single pulse or periodic sync signals can be used.
(c) For multi-DAC synchronization in PLL mode, the LVDS SYNCP/N signal is used to sync the PLL N-
divider and can be sourced from either the FPGA/ASIC pattern generator or clock distribution circuit as
long as the t(SYNC_PLL) setup and hold timing requirement is met with respect to the reference clock
source at DACCLKP/N pins. The LVDS SYNCP/N signal can be provided at this point.
10. FIFO and clock divider configurations after all the sync signals have provided the initial sync pulses needed
for synchronization:
(a) For Single Sync Source Mode where the clock divider sync source is either ISTRP/N or SYNCP/N, clock
divider syncing must be disabled after DAC34SH84 initialization and before the data transmission by
setting clkdiv_sync_ena (config0, bit 2) to 0.
(b) For Dual Sync Sources Mode, where the clock divider sync source is from the OSTR signal (either from
external OSTRP/N or internal PLL N divider output), the clock divider syncing may be enabled at all time.
(c) Optionally, to prevent accidental syncing of the FIFO when sending the ISTRP/N or SYNCP/N pulse to
other digital blocks such as NCO, QMC, etc, disable FIFO syncing by setting syncsel_fifoin(3:0) and
syncsel_fifoout(3:0) to 0000 after the FIFO input and output pointers are initialized. If the FIFO and sync
remain enabled after initialization, the ISTRP/N or SYNCP/N pulse must occur in ways to not disturb the
FIFO operation. Refer to the INPUT FIFO section for detail.
(d) Disable PLL N-divider syncing by setting pll_ndivsync_ena (config24, bit<11>) to 0.
11. Enable transmit of data by asserting the TXENA pin or set sif_txenable to 1.
12. At any time, if any of the clocks (that is, DATACLK or DACCLK) is lost or a FIFO collision alarm is detected,
a complete resynchronization of the DAC is necessary. Set TXENABLE low and repeat steps 7 through 11.
Program the FIFO configuration and clock divider configuration per steps 7 and 8 appropriately to accept the
new sync pulse or pulses for the synchronization.
EXAMPLE START-UP ROUTINE
DEVICE CONFIGURATION
fDATA = 737.28 MSPS
Interpolation = 2×
Input data = baseband data
fOUT = 122.88 MHz
PLL = Enabled
Full Mixer = Enabled
NCO = Enabled
Dual Sync Sources Mode
PLL CONFIGURATION
fREFCLK = 737.28 MHz at the DACCLKP/N LVPECL pins
fDACCLK = fDATA × Interpolation = 1474.56 MHz
fVCO = 2 × fDACCLK = 2949.12 MHz (keep fVCO between 2.7 GHz and 3.3
GHz)
PFD = fOSTR = 46.08 MHz
N = 16, M = 32, P = 2, single charge pump
pll_vco(5:0) = 01 1100 (28)
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NCO CONFIGURATION
fNCO = 122.88 MHz
fNCO_CLK = 1474.56 MHz
freq = fNCO × 232 / 1228.8 = 357,913,941 = 0x1555 5555
phaseaddAB(31:0) and/or phaseaddCD(31:0) = 0x1555 5555
NCO SYNC = sif_sync
EXAMPLE START-UP SEQUENCE
Table 10. Example Start-Up Sequence Description
STEP
READ/WRITE
ADDRESS
N/A
VALUE
N/A
DESCRIPTION
1
2
3
4
N/A
N/A
N/A
N/A
Set TXENA low
N/A
N/A
Power up the device
N/A
N/A
Apply LVPECL DACCLKP/N for PLL reference clock
Toggle RESETB pin
N/A
N/A
QMC offset and correction enabled, 2x int, FIFO enabled, Alarm enabled,
clock divider sync enabled, inverse sinc filter enabled.
5
6
7
Write
Write
Write
0x00
0x01
0x02
0xF19F
0x040E
0x7052
Single parity enabled, FIFO alarms enabled (2 away, 1 away, and collision).
Output shut-off when DACCLK gone, DATACLK gone, and FIFO collision.
Mixer block with NCO enabled, twos complement.
Output current set to 20 mAFS with internal reference and 1.28-kΩ RBIAS
resistor.
8
9
Write
Write
0x03
0x07
0xA000
0xD8FF
Un-mask FIFO collision, DACCLK-gone, and DATACLK-gone alarms to the
Alarm output.
Program the desired channel A QMC offset value. (Causes auto-sync for
QMC AB-channels offset block)
10
11
12
Write
Write
Write
0x08
0x09
0x0A
N/A
N/A
N/A
Program the desired FIFO offset value and channel B QMC offset value.
Program the desired channel C QMC offset value. (Causes auto-sync for
QMC CD-channels offset block)
13
14
Write
Write
0x0B
0x0C
N/A
N/A
Program the desired channel D QMC offset value.
Program the desired channel A QMC gain value.
Coarse mixer mode not used. Program the desired channel B QMC gain
value.
15
Write
0x0D
N/A
16
17
Write
Write
0x0E
0x0F
N/A
N/A
Program the desired channel B QMC gain value.
Program the desired channel C QMC gain value.
Program the desired channel AB QMC phase value. (Causes Auto-Sync
QMC AB-Channels Correction Block)
18
19
20
21
Write
Write
Write
Write
0x10
0x11
0x12
0x13
N/A
N/A
N/A
N/A
Program the desired channel CD QMC phase value. (Causes Auto-Sync for
the QMC CD-Channels Correction Block)
Program the desired channel AB NCO phase offset value. (Causes Auto-
Sync for Channel AB NCO Mixer)
Program the desired channel CD NCO phase offset value. (Causes Auto-
Sync for Channel CD NCO Mixer)
22
23
24
25
Write
Write
Write
Write
0x14
0x15
0x16
0x17
0x5555
0x1555
0x5555
0x1555
Program the desired channel AB NCO frequency value
Program the desired channel AB NCO frequency value
Program the desired channel CD NCO frequency value
Program the desired channel CD NCO frequency value
PLL enabled, PLL N-dividers sync enabled, single charge pump, prescaler =
2.
26
Write
0x18
0x2C50
27
28
29
Write
Write
Write
0x19
0x1A
0x1B
0x20F4
0x7010
0x0800
M = 32, N = 16, PLL VCO bias tune = "01"
PLL VCO coarse tune = 28
Internal reference
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Table 10. Example Start-Up Sequence Description (continued)
STEP
READ/WRITE
ADDRESS
VALUE
DESCRIPTION
QMC offset AB, QMC offset CD, QMC correction AB, and QMC correction
CD can be synced by sif_sync or auto-sync from register write
30
Write
0x1E
0x9999
Mixer AB and CD values synced by SYNCP/N. NCO accumulator synced by
SYNCP/N.
31
32
Write
Write
0x1F
0x20
0x4440
0x2400
FIFO Input Pointer Sync Source = ISTR FIFO Output Pointer Sync Source =
OSTR (from PLL N-divider output) Clock Divider Sync Source = OSTR
Provide all the LVDS DATA and DATACLK Provide rising edge ISTRP/N
and rising edge SYNCP/N to sync the FIFO input pointer and PLL N-
dividers.
33
N/A
N/A
N/A
Read back pll_lfvolt(2:0). If the value is not optimal, adjust pll_vco(5:0) in
0x1A.
34
35
Read
Write
0x18
0x05
N/A
0x0000
Clear all alarms in 0x05.
Read back all alarms in 0x05. Check for PLL lock, FIFO collision, DACCLK-
gone, DATACLK-gone, etc. Fix the error appropriately. Repeat step 34 and
35 as necessary.
36
Read
0x05
N/A
Sync all the QMC blocks using sif_sync. These blocks can also be synced
via auto-sync through appropriate register writes.
37
Write
0x1F
0x4442
38
39
40
41
42
Write
Write
Write
Write
N/A
0x00
0x1F
0x20
0x18
N/A
0xF19B
0x4448
0x0000
0x2450
N/A
Disable clock divider sync.
Set sif_sync to 0 for the next sif_sync event.
Disable FIFO input and output pointer sync.
Disable PLL N-dividers sync.
Set TXENA high. Enable data transmission.
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SLAS808B –FEBRUARY 2012–REVISED JULY 2012
LVPECL INPUTS
Figure 81 shows an equivalent circuit for the DAC input clock (DACCLKP/N) and the output strobe clock
(OSTRP/N).
CLKVDD
250 Ω
2 kΩ
2 kΩ
DACCLKP
OSTRP
DACCLKN
OSTRN
Internal
Digital In
250 Ω
SLEEP
GND
S0515-01
Figure 81. DACCLKP/N and OSTRP/N Equivalent Input Circuit
Figure 82 shows the preferred configuration for driving the CLKIN/CLKINC input clock with a differential ECL or
PECL source.
CAC
0.1 μF
+
CLKIN
Differential
ECL
CAC
or
100 Ω
0.1 μF
(LV)PECL
Source
–
CLKINC
RT
RT
150 Ω
150 Ω
S0029-02
Figure 82. Preferred Clock Input Configuration With a Differential ECL or PECL Clock Source
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LVDS INPUTS
The DAB[15:0]P/N, DCD[15:0]P/N, DATACLKP/N, SYNCP/N, PARITYP/N, and ISTRP/N LVDS pairs have the
input configuration shown in Figure 83. Figure 84 shows the typical input levels and common-move voltage used
to drive these inputs.
IOVDD
LVDS
Receiver
Internal Digital In
100 Ω
GND
S0516-01
Figure 83. DAB[15:0]P/N, DCD[15:0]P/N, DATACLKP/N, ISTRP/N, SYNCP/N and PARITYP/N LVDS Input
Configuration
Example
VA
VB
1.4 V
1 V
DAC34SH84
LVDS
Receiver
VA, B
100 Ω
400 mV
0 V
VA, B
VA
VCOM = (VA + VB)/2
–400 mV
VB
GND
1
0
Logical Bit
Equivalent
B0459-04
Figure 84. LVDS Data Input Levels
Table 11. Example LVDS Data Input Levels
Resulting Differential
Voltage
Resulting Common-Mode
Voltage
Applied Voltages
Logical Bit Binary
Equivalent
VA
VB
VA,B
VCOM
1.4 V
1.0 V
1.2 V
0.8 V
1.0 V
1.4 V
0.8 V
1.2 V
400 mV
–400 mV
400 mV
–400 mV
1
0
1
0
1.2 V
1.0 V
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SLAS808B –FEBRUARY 2012–REVISED JULY 2012
CMOS DIGITAL INPUTS
Figure 85 shows a schematic of the equivalent CMOS digital inputs of the DAC34SH84. SDIO, SCLK, SLEEP
and TXENA have pull-down resistors while SDENB and RESETB have pull-up resistors internal to the
DAC34SH84. All the CMOS digital inputs and outputs are referred to the IOVDD2 supply, which can vary from
1.8V to 3.3V. This facilitates the I/O interface and eliminates the need of level translation. See the specification
table for logic thresholds. The pull-up and pull-down circuitry is approximately equivalent to 100kΩ.
IOVDD2
IOVDD2
100 kΩ
SDIO
SCLK
SLEEP
TXENA
400 Ω
400 Ω
Internal
Digital In
Internal
Digital In
SDENB
RESETB
100 kΩ
GND
GND
S0027-04
Figure 85. CMOS Digital Equivalent Input
REFERENCE OPERATION
The DAC34SH84 uses a bandgap reference and control amplifier for biasing the full-scale output current. The
full-scale output current is set by applying an external resistor RBIAS to pin BIASJ. The bias current IBIAS through
resistor RBIAS is defined by the on-chip bandgap reference voltage and control amplifier. The default full-scale
output current equals 64 times this bias current and can thus be expressed as:
IOUTFS = 64 × IBIAS = 64 × (VEXTIO / RBIAS ) / 2
The DAC34SH84 has a 4-bit coarse gain control coarse_dac(3:0) in the config3 register. Using gain control, the
IOUTFS can be expressed as:
IOUTFS = (coarse_dac + 1) / 16 × IBIAS × 64 = (coarse_dac + 1) / 16 × (VEXTIO / RBIAS) / 2 × 64
where VEXTIO is the voltage at terminal EXTIO. The bandgap reference voltage delivers an accurate voltage of
1.2V. This reference is active when extref_ena = 0 in config27. An external decoupling capacitor CEXT of 0.1 µF
should be connected externally to terminal EXTIO for compensation. The bandgap reference can additionally be
used for external reference operation. In that case, an external buffer with high impedance input should be
applied in order to limit the bandgap load current to a maximum of 100 nA. The internal reference can be
disabled and overridden by an external reference by setting the extref_ena control bit. Capacitor CEXT may hence
be omitted. Terminal EXTIO thus serves as either input or output node.
The full-scale output current can be adjusted from 30 mA down to 10 mA by varying resistor RBIAS, programming
coarse_dac(3:0), or changing the externally applied reference voltage.
NOTE
With internal reference, the minimum Rbias resistor value is 1.28kΩ. Resistor value below
1.28kΩ is not recommended sice it will program the full-scale current to go above 30mA
and potentially damages the device.
DAC TRANSFER FUNCTION
The CMOS DACs consist of a segmented array of PMOS current sources, capable of sourcing a full-scale output
current up to 30 mA. Differential current switches direct the current to either one of the complementary output
nodes IOUTP or IOUTN. Complementary output currents enable differential operation, thus canceling out
common mode noise sources (digital feed-through, on-chip and PCB noise), dc offsets, even order distortion
components, and increasing signal output power by a factor of two.
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The full-scale output current is set using external resistor RBIAS in combination with an on-chip bandgap voltage
reference source (+1.2 V) and control amplifier. Current IBIAS through resistor RBIAS is mirrored internally to
provide a maximum full-scale output current equal to 64 times IBIAS
The relation between IOUTP and IOUTN can be expressed as:
IOUTFS = IOUTP + IOUTN
.
We will denote current flowing into a node as – current and current flowing out of a node as + current. Since the
output stage is a current source the current flows from the IOUTP and IOUTN pins. The output current flow in
each pin driving a resistive load can be expressed as:
IOUTP = IOUTFS × CODE / 65,536
IOUTN = IOUTFS × (65,535 – CODE) / 65,536
where CODE is the decimal representation of the DAC data input word
For the case where IOUTP and IOUTN drive resistor loads RL directly, this translates into single ended voltages
at IOUTP and IOUTN:
VOUTP = IOUT1 x RL
VOUTN = IOUT2 x RL
Assuming that the data is full scale (65,535 in offset binary notation) and the RL is 25 Ω, the differential voltage
between pins IOUTP and IOUTN can be expressed as:
VOUTP = 20mA x 25 Ω = 0.5 V
VOUTN = 0mA x 25 Ω = 0 V
VDIFF = VOUTP – VOUTN = 0.5V
Note that care should be taken not to exceed the compliance voltages at node IOUTP and IOUTN, which would
lead to increased signal distortion.
ANALOG CURRENT OUTPUTS
The DAC34SH84 can be easily configured to drive a doubly terminated 50 Ω cable using a properly selected RF
transformer. Figure 86 and Figure 87 show the 50 Ω doubly terminated transformer configuration with 1:1 and 4:1
impedance ratio, respectively. Note that the center tap of the primary input of the transformer has to be grounded
to enable a DC current flow. Applying a 20 mA full-scale output current would lead to a 0.5 Vpp for a 1:1
transformer and a 1 Vpp output for a 4:1 transformer. The low dc-impedance between IOUTP or IOUTN and the
transformer center tap sets the center of the ac-signal to GND, so the 1 Vpp output for the 4:1 transformer
results in an output between –0.5 V and +0.5 V.
50 Ω
1:1
IOUTP
RLOAD
50 Ω
100 Ω
AGND
IOUTN
50 Ω
S0517-01
Figure 86. Driving a Doubly Terminated 50 Ω Cable Using a 1:1 Impedance Ratio Transformer
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100 Ω
4:1
IOUTP
IOUTN
RLOAD
50 Ω
AGND
100 Ω
S0518-01
Figure 87. Driving a Doubly Terminated 50 Ω Cable Using a 4:1 Impedance Ratio Transformer
PACKAGE OPTION ADDENDUM
ORDERABLE
DEVICE
PACKAGE
TYPE
PACKAGE
QUANTITY
LEAD/BALL
FINISH
MSL PEAK
TEMPERATURE
STATUS
Active
PINS
196
ECO PLAN
Green (RoHS and no
Sb/Br)
DAC34SH84IZAY
DAC34SH84IZAYR
NFBGA
NFBGA
800
SNAGCU
SNAGCU
MSL3 260C
MSL3 260C
Green (RoHS and no
Sb/Br)
Active
196
1000
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REVISION HISTORY
Changes from Revision A (June 2012) to Revision B
Page
•
•
•
•
Added thermal information to the Absolute Maximum Ratings table .................................................................................... 6
Deleted TJ row from top of thermal table .............................................................................................................................. 7
Added Recommended Operating Conditions table .............................................................................................................. 7
Deleted OPERATING RANGE section from bottom of Electrical Characteristics - DC Specifications table ....................... 9
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PACKAGE OPTION ADDENDUM
www.ti.com
12-Jul-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
DAC34SH84IZAY
DAC34SH84IZAYR
XDAC34SH84IZAY
PREVIEW
PREVIEW
PREVIEW
NFBGA
NFBGA
NFBGA
ZAY
ZAY
ZAY
196
196
196
160
1000
160
Green (RoHS
& no Sb/Br)
SNAGCU Level-3-260C-168 HR
Green (RoHS
& no Sb/Br)
SNAGCU Level-3-260C-168 HR
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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