DAC715UG4 [TI]

16-BIT DIGITAL-TO-ANALOG CONVERTER with 16-Bit Bus Interface; 16位数字 - 模拟转换器,具有16位总线接口
DAC715UG4
型号: DAC715UG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

16-BIT DIGITAL-TO-ANALOG CONVERTER with 16-Bit Bus Interface
16位数字 - 模拟转换器,具有16位总线接口

转换器
文件: 总14页 (文件大小:230K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®
DAC715  
DAC715  
DAC715  
16-BIT DIGITAL-TO-ANALOG CONVERTER  
with 16-Bit Bus Interface  
FEATURES  
HIGH-SPEED 16-BIT PARALLEL DOUBLE-  
DESCRIPTION  
The DAC715 is a complete monolithic digital-to-  
analog converter including a +10V temperature com-  
pensated reference, current-to-voltage amplifier, 16-bit  
parallel interface that is double buffered, and an asyn-  
chronous clear function which immediately sets the  
output voltage to one-half of full-scale.  
BUFFERED INTERFACE  
VOLTAGE OUTPUT: 0 to +10V  
13-, 14-, 15-BIT LINEARITY GRADES  
16-BIT MONOTONIC OVER  
TEMPERATURE (L GRADE)  
The output voltage range is 0 to +10V while operating  
from ±12V or ±15V supplies. The gain and bipolar  
offset adjustments are designed so that they can be set  
via external potentiometers or external D/A converters.  
The output amplifier is protected against short circuit to  
ground.  
POWER DISSIPATION: 600mW max  
GAIN AND OFFSET ADJUST: Convenient  
for Auto-Cal D/A Converters  
28-LEAD DIP AND SOIC PACKAGES  
The 28-pin DAC715 is available in a 0.3" plastic DIP  
and wide-body plastic SOIC package. The DAC715P,  
U, PB, and UB are specified over the –40°C to +85°C  
temperature range while the DAC715PK, UK, PL, and  
UL are specified over the 0°C to +70°C range.  
D0  
D15  
A1  
A0  
Input Latch  
16  
WR  
CLR  
D/A Latch  
16  
Reference  
Circuit  
16-Bit D/A Converter  
VOUT  
VREF OUT  
+10V  
Offset Adjust  
Gain Adjust  
International Airport Industrial Park  
Mailing Address: PO Box 11400, Tucson, AZ 85734  
FAXLine: (800) 548-6133 (US/Canada Only)  
Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706  
Tel: (520) 746-1111 • Twx: 910-952-1111  
Internet: http://www.burr-brown.com/  
Cable: BBRCORP  
Telex: 066-6491  
FAX: (520) 889-1510  
Immediate Product Info: (800) 548-6132  
© 1995 Burr-Brown Corporation  
PDS-1306D  
Printed in U.S.A. July, 1997  
SBAS046  
SPECIFICATIONS  
ELECTRICAL  
At TA = +25°C, VCC = ±15V, and after a 10-minute warm-up, unless otherwise noted.  
DAC715P, U  
TYP  
DAC715PB, UB  
TYP  
DAC715PK, UK  
TYP  
DAC715PL, UL  
TYP  
PARAMETER  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
INPUT  
RESOLUTION  
16  
Bits  
DIGITAL INPUTS  
Input Code  
Binary Two’s Complement  
+2.0 +VCC – 1.4  
Logic Levels(1): VIH  
VIL  
V
V
µA  
0
+0.8  
±10  
±10  
IIH (VI = +2.7V)  
IIL (VI = +0.4V)  
µA  
TRANSFER CHARACTERISTICS  
ACCURACY  
Linearity Error  
TMIN to TMAX  
Differential Linearity Error  
TMIN to TMAX  
±4  
±8  
±4  
±8  
±2  
±4  
±2  
±4  
±2  
±2  
±2  
±2  
±2  
±2  
±1  
±1  
LSB  
LSB  
LSB  
LSB  
Monotonicity Over Temp  
Gain Error(3)  
13  
14  
15  
16  
Bits  
%
%
±0.1  
±0.2  
±0.1  
±0.2  
±0.003  
±0.1  
±0.15  
TMIN to TMAX  
Offset Error(3)  
% FSR(2)  
% FSR  
% FSR/%VCC  
PPM FSR/%VCC  
TMIN to TMAX  
Power Supply Sensitivity Of Full Scale  
±30  
DYNAMIC PERFORMANCE  
Settling Time (to ±0.003%FSR,  
5kll 500pF Load)(4)  
10V Output Step  
6
4
10  
10  
µs  
µs  
V/µs  
1 LSB Output Step(5)  
Output Slew Rate  
Total Harmonic Distortion + Noise  
0dB, 1001Hz, fS = 100kHz  
–20dB, 1001Hz, fS = 100kHz  
–60dB, 1001Hz, fS = 100kHz  
SINAD  
0.005  
0.03  
3.0  
%
%
%
1001Hz, fS = 100kHz  
87  
2
15  
dB  
nV-s  
nV-s  
Digital Feedthrough(5)  
Digital-to-Analog Glitch Impulse(5)  
Output Noise Voltage  
(includes Reference)  
120  
nVHz  
ANALOG OUTPUT  
Output Voltage Range  
+VCC, –VCC = ±11.4V  
Output Current  
Output Impedance  
Short Circuit to ACOM  
Duration  
0 to +10  
±5  
V
mA  
0.1  
Indefinite  
REFERENCE VOLTAGE  
Voltage  
TMIN to TMAX  
Output Resistance  
Source Current  
Short Circuit to ACOM, Duration  
+9.975  
+9.960  
+10.000  
1
+10.025  
+10.040  
V
V
2
mA  
Indefinite  
POWER SUPPLY REQUIREMENTS  
Voltage: +VCC  
–VCC  
+11.4  
–16.5  
+15  
–15  
+16.5  
–11.4  
V
V
Current (no load, ±15V Supplies)  
+VCC  
–VCC  
Power Dissipation  
13  
22  
525  
15  
25  
600  
mA  
mA  
mW  
TEMPERATURE RANGE  
Specification All Grades  
–40  
–60  
+85  
+150  
0
+70  
°C  
°C  
Storage  
Thermal Resistance θJA  
DIP Package  
SOIC Package  
75  
75  
°C/W  
°C/W  
Specifications are the same as grade to the left.  
NOTES: (1) Digital inputs are TTL and +5V CMOS compatible over the specification temperature range. (2) FSR means Full Scale Range. For example, for  
a
0 to +10V output, FSR = 10V.  
(3) Errors externally adjustable to zero. (4) Maximum represents greater than the 3σ limit. Not 100% tested for this parameter. (5) For the worst case code changes: FFFFH to 0000H and 0000H to  
FFFFH. These are Binary Two’s Complement (BTC) codes. (6) Typical supply voltages times maximum currents.  
®
2
DAC715  
ABSOLUTE MAXIMUM RATINGS(1)  
TIMING DIAGRAM  
+VCC to COMMON ...................................................................... 0V, +17V  
–VCC to COMMON ...................................................................... 0V, –17V  
+VCC to –VCC ........................................................................................................................... 34V  
Digital Inputs to COMMON .....................................................1V to +VCC  
External Voltage Applied to BPO and Range Resistors..................... ±VCC  
VREF OUT ...................................................... Indefinite Short to COMMON  
VOUT ............................................................ Indefinite Short to COMMON  
Power Dissipation .......................................................................... 750mW  
Storage Temperature ...................................................... –60°C to +150°C  
Lead Temperature (soldering, 10s)................................................ +300°C  
tAW  
tAH  
A0, A1  
tDW  
D0-D15  
WR  
tDH  
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings” may  
cause permanent damage to the device. Exposure to absolute maximum  
conditions for extended periods may affect device reliability.  
tWP  
PACKAGE INFORMATION  
TIMING SPECIFICATIONS  
PACKAGE DRAWING  
TA = –40°C to +85°C, +VCC = +12V or +15V, –VCC = –12V or –15V.  
PRODUCT  
PACKAGE  
NUMBER(1)  
SYMBOL  
PARAMETER  
MIN  
MAX UNITS  
DAC715P  
Plastic DIP  
Plastic SOIC  
Plastic DIP  
Plastic SOIC  
Plastic DIP  
Plastic SOIC  
Plastic DIP  
Plastic SOIC  
246  
217  
246  
217  
246  
217  
246  
217  
DAC715U  
DAC715PB  
DAC715UB  
DAC715PK  
DAC715UK  
DAC715PL  
DAC715UL  
tDW  
tAW  
tAH  
tDH  
Data Valid to End of WR  
A0, A1 Valid to End of WR  
A0, A1 Hold after End of WR  
Data Hold after end of WR  
Write Pulse Width  
50  
50  
10  
10  
50  
ns  
ns  
ns  
ns  
ns  
ns  
(1)  
tWP  
tCP  
CLEAR Pulse Width  
200  
NOTES: (1) For single-buffered operation, tWP is 80ns min. Refer to page 10.  
NOTE: (1) For detailed drawing and dimension table, please see end of data  
sheet, or Appendix C of Burr-Brown IC Data Book.  
TRUTH TABLE  
A0  
A1  
WR  
CLR  
DESCRIPTION  
ORDERING INFORMATION  
0
1
1
0
X
X
1
0
1
0
X
X
1 0 1  
1 0 1  
1 0 1  
1
1
1
1
1
0
Load Input Latch  
Load D/A Latch  
No Change  
Latches Transparent  
No Change  
DIFFERENTIAL  
LINEARITY  
ERROR MAX  
0
1
X
TEMPERATURE  
RANGE  
PRODUCT  
PACKAGE  
at +25°C  
Reset D/A Latch  
DAC715P  
Plastic DIP  
Plastic SOIC  
Plastic DIP  
Plastic SOIC  
Plastic DIP  
Plastic SOIC  
Plastic DIP  
Plastic SOIC  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
0°C to 70°C  
0°C to 70°C  
0°C to 70°C  
0°C to 70°C  
±4LSB  
±4LSB  
±2LSB  
±2LSB  
±2LSB  
±2LSB  
±1LSB  
±1LSB  
DAC715U  
DAC715PB  
DAC715UB  
DAC715PK  
DAC715UK  
DAC715PL  
DAC715UL  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
Electrostatic discharge can cause damage ranging from per-  
formancedegradationtocompletedevicefailure.Burr-Brown  
Corporationrecommendsthatallintegratedcircuitsbehandled  
and stored using appropriate ESD protection methods.  
ESD damage can range from subtle performance degradation  
to complete device failure. Precision integrated circuits may  
be more susceptible to damage because very small parametric  
changes could cause the device not to meet published speci-  
fications.  
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes  
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change  
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant  
any BURR-BROWN product for use in life support devices and/or systems.  
®
3
DAC715  
PIN CONFIGURATION  
PIN DESCRIPTIONS  
PIN  
LABEL  
DESCRIPTION  
1
2
3
4
5
6
7
8
9
DCOM  
ACOM  
VOUT  
Offset Adjust  
VREF OUT  
Gain Adjust  
+VCC  
Digital Ground  
Analog Ground  
0 to +10V D/A Output  
Offset Adjust  
Voltage Reference Output  
Gain Adjust  
+12V to +15V Supply  
–12V to –15V Supply  
CLEAR. Sets D/A output to Half Scale  
(Active Low)  
Write (Active Low)  
Enable for D/A latch (Active Low)  
Enable for Input latch (Active Low)  
Data Bit 15 (Most Significant Bit)  
Data Bit 14  
Data Bit 13  
Data Bit 12  
Data Bit 11  
Data Bit 10  
Data Bit 9  
Data Bit 8  
Data Bit 7  
Data Bit 6  
DCOM  
ACOM  
1
2
3
4
5
6
7
8
9
28 D0 (LSB)  
27 D1  
26 D2  
25 D3  
24 D4  
23 D5  
22 D6  
21 D7  
20 D8  
19 D9  
18 D10  
17 D11  
16 D12  
15 D13  
VOUT  
–VCC  
CLR  
Offset Adjust  
VREF OUT  
Gain Adjust  
+VCC  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
WR  
A1  
A0  
D15  
D14  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
DAC715  
–VCC  
CLR  
WR 10  
A1 11  
A0 12  
Data Bit 5  
Data Bit 4  
Data Bit 3  
Data Bit 2  
Data Bit 1  
Data Bit 0 (Least Significant Bit)  
D15 (MSB) 13  
D14 14  
D0  
®
4
DAC715  
TYPICAL PERFORMANCE CURVES  
At TA = +25°C, and VCC = ±15V, unless otherwise noted.  
POWER SUPPLY REJECTION vs  
POWER SUPPLY RIPPLE FREQUENCY  
1k  
LOGIC vs V LEVEL  
2.0  
–VCC  
100  
10  
1
1.0  
WR, A0, A1  
CLR  
+VCC  
0
DATA  
–1.0  
–2.0  
0.1  
10  
100  
1k  
10k  
100k  
1M  
–0.85  
0
0.85 1.7 2.55 3.4 4.25 5.1 5.95 6.8  
V Digital Input  
Frequency (Hz)  
FULL-SCALE OUTPUT SWING  
SETTLING TIME, +10V TO 0V  
2500  
2000  
1500  
1000  
500  
+5V  
0V  
0
–500  
–1000  
–1500  
–2000  
–2500  
Time (10µs/div)  
Time (1µs/div)  
Spectral Noise Density  
SETTLING TIME, 0V TO +10V  
1000  
2500  
2000  
1500  
1000  
500  
+5V  
0V  
100  
10  
1
0
–500  
–1000  
–1500  
–2000  
–2500  
1
10  
100  
1k  
10k  
100k  
1M  
10M  
Time (1µs/div)  
Frequency (Hz)  
®
5
DAC715  
DIGITAL FEEDTHROUGH  
DISCUSSION OF  
SPECIFICATIONS  
LINEARITY ERROR  
When the D/A is not selected, high frequency logic activity  
on the digital inputs is coupled through the device and shows  
up as output noise. This noise is digital feedthrough.  
Linearity error is defined as the deviation of the analog  
output from a straight line drawn between the end points of  
the transfer characteristic.  
OPERATION  
The DAC715 is a monolithic integrated-circuit 16-bit D/A  
converter complete with 16-bit D/A switches and ladder  
network, voltage reference, output amplifier and micropro-  
cessor bus interface.  
DIFFERENTIAL LINEARITY ERROR  
Differential linearity error (DLE) is the deviation from  
1LSB of an output change from one adjacent state to the  
next. A DLE specification of ±1/2LSB means that the output  
step size can range from 1/2LSB to 3/2LSB when the digital  
input code changes from one code word to the adjacent code  
word. If the DLE is more positive than –1LSB, the D/A is  
said to be monotonic.  
INTERFACE LOGIC  
The DAC715 has double-buffered data latches. The input  
data latch holds a 16-bit data word before loading it into the  
second latch, the D/A latch. This double-buffered organiza-  
tion permits simultaneous update of several D/A converters.  
All digital control inputs are active low. Refer to the block  
diagram shown in Figure 1.  
MONOTONICITY  
A D/A converter is monotonic if the output either increases  
or remains the same for increasing digital input values.  
Monotonicity of DAC715 is guaranteed over the specifica-  
tion temperature range to 13-, 14-, 15-, and 16-bits for  
performance grades DAC715P/U, DAC715PB/UB,  
DAC715PK/UK, and DAC715PL/UL respectively.  
All latches are level-triggered. Data present when the enable  
inputs are logic “0” will enter the latch. When the enable  
inputs return to logic “1”, the data is latched.  
The CLR input resets both the input latch and the D/A latch  
to give a half scale output.  
LOGIC INPUT COMPATIBILITY  
SETTLING TIME  
The DAC715 digital inputs are TTL compatible (1.4V switch-  
ing level), low leakage, and high impedance. Thus the inputs  
are suitable for being driven by any type of 5V logic family,  
such as CMOS logic. An equivalent circuit for the digital  
inputs is shown in Figure 2.  
Settling time is the total time (including slew time) for the  
D/A output to settle to within an error band around its final  
value after a change in input. Settling times are specified to  
within ±0.003% of Full Scale Range (FSR) for an output  
step change of 10V and 1LSB. The 1LSB change is mea-  
sured at the Major Carry (FFFFH to 0000H, and 0000H to  
FFFFH: BTC codes), the input transition at which worst-case  
settling time occurs.  
The inputs will float to logic “0” if left unconnected. It is  
recommended that any unused inputs be connected to DCOM  
to improve noise immunity.  
Digital inputs remain high impedance when power is off.  
TOTAL HARMONIC DISTORTION  
Total harmonic distortion is defined as the ratio of the square  
root of the sum of the squares of the values of the harmonics  
to the value of the fundamental frequency. It is expressed in  
% of the fundamental frequency amplitude at sampling rate  
fS.  
INPUT CODING  
The DAC715 is designed to accept binary two’s comple-  
ment (BTC) input codes. For unipolar analog output con-  
figuration, a digital input of 7FFFH gives a full scale output,  
8000H gives a zero output, and 0000H gives half scale output.  
SIGNAL-TO-NOISE  
AND DISTORTION RATIO (SINAD)  
INTERNAL REFERENCE  
SINAD includes all the harmonic and outstanding spurious  
components in the definition of output noise power in  
addition to quantizing and internal random noise power.  
SINAD is expressed in dB at a specified input frequency and  
sampling rate, fS.  
The DAC715 contains a +10V reference. The reference  
output may be used to drive external loads, sourcing up to  
2mA. The load current should be constant, otherwise the  
gain of the converter will vary.  
OUTPUT VOLTAGE SWING  
DIGITAL-TO-ANALOG GLITCH IMPULSE  
The output amplifier of the DAC715 is committed to a 0 to  
+10V output range. It will provide a 0 to +10V output swing  
while operating on ±11.4V or higher voltage supplies.  
The amount of charge injected into the analog output from  
the digital inputs when the inputs change state. It is mea-  
sured at half scale at the input codes where as many as  
possible switches change state—from FFFFH to 0000H.  
®
6
DAC715  
VREF OUT  
5
+VCC  
7
– VCC  
8
Gain Adjust  
6
170Ω  
15kΩ  
+10V  
Reference  
Offset  
Adjust  
4
3
10kΩ  
5kΩ  
+2.5V  
–VCC  
D/A Switches  
CLR  
9
VOUT  
16-Bit D/A Latch  
16-Bit Input Latch  
A1 11  
A0 12  
WR 10  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
2
1
DCOM  
D0  
D15  
ACOM  
LSB  
MSB  
FIGURE 1. DAC715 Block Diagram.  
Range of  
Gain Adjust  
±0.3%  
+ Full Scale  
+VCC  
ESD Protection Circuit  
R = 1k: A0, A1, WR, CLR  
3k: D0...D15  
Full Scale  
Range  
Gain Adjust  
Rotates the Line  
R
Digital  
Input  
6.8V  
5pF  
–VCC  
Range of  
Offset Adjust  
Zero  
Offset Adj.  
Translates  
the Line  
±0.3%  
8000H  
0000H  
Digital Input  
7FFFH  
FIGURE 2. Equivalent Circuit of Digital Inputs.  
FIGURE 3. Relationship of Offset and Gain Adjustments.  
GAIN AND OFFSET ADJUSTMENTS  
Figure 3 illustrates the relationship of offset and gain adjust-  
ments for a unipolar connected D/A converter. Offset should  
be adjusted first to avoid interaction of adjustments. See  
Table I for calibration values and codes. These adjustments  
have a minimum range of ±0.3%.  
Offset Adjustment  
Apply the digital input code that produces zero output  
voltage and adjust the offset potentiometer or the offset  
adjust D/A converter for 0V.  
®
7
DAC715  
DAC715 CALIBRATION VALUES  
1 LEAST SIGNIFICANT BIT = 152µV  
1
2
DCOM  
ACOM  
VOUT  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
DIGITAL INPUT CODE  
BINARY TWO’S  
COMPLEMENT, BTC  
ANALOG  
OUTPUT  
(V)  
DESCRIPTION  
3
7FFFH  
|
4000H  
|
0001H  
9.999847  
Full Scale –1LSB  
4
7.5  
3/4 Scale  
Half Scale + 1LSB  
Half Scale  
5
VREF OUT  
5.000152  
6
+12V to +15V  
–12V to –15V  
0000H  
5
4.999847  
2.5  
7
+VCC  
–VCC  
FFFFH  
|
C000H  
|
8000H  
Half Scale – 1LSB  
1/4 Scale  
8
+
0.01µF  
9
10  
11  
12  
13  
14  
0.01µF  
0
Zero  
+
TABLE I. Digital Input and Analog Output Voltage Calibra-  
tion Values.  
Gain Adjustment  
Apply the digital input that gives the maximum positive  
voltage output. Adjust the gain potentiometer or the gain  
adjust D/A converter for this positive full scale voltage.  
FIGURE 4. Power Supply Connections.  
well as at +VCC. The capacitors should be located close to the  
package.  
INSTALLATION  
GENERAL CONSIDERATIONS  
The DAC715 has separate ANALOG COMMON and DIGI-  
TAL COMMON pins. The current through DCOM is mostly  
switching transients and are up to 1mA peak in amplitude.  
The current through ACOM is typically 5µA for all codes.  
Due to the high-accuracy of the DAC715, system design  
problems such as grounding and contact resistance become  
very important. A 16-bit converter with a 10V full-scale  
range has a 1LSB value of 152µV. With a load current of  
5mA, series wiring and connector resistance of only 60mΩ  
will cause a voltage drop of 300µV. To understand what this  
means in terms of a system layout, the resistivity of a typical  
1 ounce copper-clad printed circuit board is 1/2 mper  
square. For a 5mA load, a 10 milliinch wide printed circuit  
conductor 60 milliinches long will result in a voltage drop of  
150µV.  
Use separate analog and digital ground planes with a single  
interconnection point to minimize ground loops. The analog  
pins are located adjacent to each other to help isolate analog  
from digital signals. Analog signals should be routed as far  
as possible from digital signals and should cross them at  
right angles. A solid analog ground plane around the D/A  
package, as well as under it in the vicinity of the analog and  
power supply pins, will isolate the D/A from switching  
currents. It is recommended that DCOM and ACOM be  
connected directly to the ground planes under the package.  
The analog output of DAC715 has an LSB size of 152µV  
(–96dB). The noise floor of the D/A must remain below this  
level in the frequency range of interest. The DAC715’s noise  
spectral density (which includes the noise contributed by the  
internal reference) is shown in the Typical Performance  
Curves section.  
If several DAC715s are used or if DAC715 shares supplies  
with other components, connecting the ACOM and DCOM  
lines together once at the power supplies rather than at each  
chip may give better results.  
Wiring to high-resolution D/A converters should be routed  
to provide optimum isolation from sources of RFI and EMI.  
The key to elimination of RF radiation or pickup is small  
loop area. Signal leads and their return conductors should be  
kept close together such that they present a small capture  
cross-section for any external field. Wire-wrap construction  
is not recommended.  
LOAD CONNECTIONS  
Since the reference point for VOUT and VREF OUT is the ACOM  
pin, it is important to connect the D/A converter load  
directly to the ACOM pin. Refer to Figure 5.  
Lead and contact resistances are represented by R1 through  
R3. As long as the load resistance RL is constant, R1 simply  
introduces a gain error and can be removed by gain adjust-  
ment of the D/A or system-wide gain calibration. R2 is part  
of RL if the output voltage is sensed at ACOM.  
POWER SUPPLY AND  
REFERENCE CONNECTIONS  
In some applications it is impractical to return the load to the  
ACOM pin of the D/A converter. Sensing the output voltage  
at the SYSTEM GROUND point is reasonable, because  
there is no change in DAC715 ACOM current, provided that  
Power supply decoupling capacitors should be added as  
shown in Figure 4. Best performance occurs using a 1 to  
10µF tantalum capacitor at –VCC. Applications with less  
critical settling time may be able to use 0.01µF at –VCC as  
®
8
DAC715  
R3 is a low-resistance ground plane or conductor. In this case  
you may wish to connect DCOM to SYSTEM GROUND as  
well.  
converters outputs are at approximately half scale, 0V.  
DIGITAL INTERFACE  
BUS INTERFACE  
GAIN AND OFFSET ADJUST  
Connections Using Potentiometers  
The DAC715 has a 16-bit double-buffered data interface  
with control lines for easy connection to a 16-bit bus. The  
double-buffered feature permits update of several D/As  
simultaneously.  
GAIN and OFFSET adjust pins provide for trim using  
external potentiometers. 15-turn potentiometers provide suf-  
ficient resolution. Range of adjustment of these trims is at  
least ±0.3% of Full Scale Range. Refer to Figure 6.  
A0 is the enable control for the DATA INPUT LATCH. A1  
is the enable for the D/A LATCH. WR is used to strobe data  
into latches enabled by A0, and A1. Refer to the block  
diagram of Figure 1 and to Timing Diagram on page 3.  
Using D/A Converters  
The GAIN ADJUST and OFFSET ADJUST circuits of  
the DAC715 have been arranged so that these points may  
be easily driven by external D/A converters. Refer to  
Figure 7. 12-bit D/A converters provide an OFFSET adjust  
resolution and a GAIN adjust resolution of 30µV to 50µV  
per LSB step.  
CLR sets the INPUT DATA LATCH and D/A LATCH to  
0000H (5V at the D/A output).  
SINGLE-BUFFERED OPERATION  
Nominal values of GAIN and OFFSET occur when the D/A  
DAC715  
10kΩ  
5kΩ  
VREF  
R1  
VOUT  
Bus  
Interface  
Sense  
Output  
RL  
DCOM  
ACOM  
R2  
Alternate Ground  
Sense Connection  
R3  
To +VCC  
0.01µF(1)  
0.01µF  
Analog  
Power  
Supply  
System Ground  
To –VCC  
NOTE: (1) Locate close to DAC715 package.  
FIGURE 5. System Ground Considerations for High-Resolution D/A Converters.  
®
9
DAC715  
To operate the DAC715 interface as a single-buffered latch,  
the DATA INPUT LATCH is permanently enabled by  
connecting A0 to DCOM. If A1 is not used to enable the  
D/A, it should be connected to DCOM also. For this mode  
of operation, the width of WR will need to be at least 80ns  
minimum to pass data through the DATA INPUT LATCH  
and into the D/A LATCH.  
The digital interface of the DAC715 can be made transpar-  
ent by asserting AO, A1, and WR LOW, and asserting CLR  
HIGH.  
TRANSPARENT INTERFACE  
Internal  
+10V Reference  
VREF OUT  
5
P1  
1kΩ  
170Ω  
R1  
100Ω  
Gain Adjust  
+VCC  
6
4
R2  
2MΩ  
Offset Adjust  
P2  
15kΩ  
10k– 100kΩ  
10kΩ  
–VCC  
5kΩ  
R3  
27kΩ  
+2.5V  
3
+10V VOUT  
IDAC  
0-2mA  
For no external adjustments, pins 4 and 6 are not connected.  
External resistors R1 - R4 are standard ±1% values. Range of  
adjustment at least ±0.03% FSR.  
2
ACOM  
FIGURE 6. Manual Offset and Gain Adjust Circuits.  
®
10  
DAC715  
Internal  
+10V Reference  
VREF OUT  
R1  
392Ω  
170Ω  
Gain Adjust  
R2  
33kΩ  
10kΩ  
5kΩ  
Offset Adjust  
15kΩ  
–10 to 10V  
DAC  
R3  
1MΩ  
–10 to 10V  
DAC  
0 to 2mA  
VOUT  
R1 - R3 tolerance: ±1%, Range of  
adjustment at least ±0.3% FSR.  
DAC715  
FIGURE 7. Gain and Offset Adjustment Using D/A Converters.  
®
11  
DAC715  
PACKAGE OPTION ADDENDUM  
www.ti.com  
3-Nov-2011  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
DAC715P  
DAC715PB  
NRND  
NRND  
PDIP  
PDIP  
PDIP  
PDIP  
PDIP  
PDIP  
PDIP  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
NT  
NT  
28  
28  
28  
28  
28  
28  
28  
28  
28  
28  
28  
28  
28  
28  
28  
28  
13  
13  
13  
13  
13  
13  
13  
13  
20  
20  
20  
20  
20  
20  
20  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU N / A for Pkg Type  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
DAC715PBG4  
DAC715PG4  
DAC715PK  
NRND  
NT  
Green (RoHS  
& no Sb/Br)  
NRND  
NT  
Green (RoHS  
& no Sb/Br)  
NRND  
NT  
Green (RoHS  
& no Sb/Br)  
DAC715PKG4  
DAC715PL  
NRND  
NT  
Green (RoHS  
& no Sb/Br)  
NRND  
NT  
Green (RoHS  
& no Sb/Br)  
DAC715PLG4  
DAC715U  
NRND  
NT  
Green (RoHS  
& no Sb/Br)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
Green (RoHS  
& no Sb/Br)  
DAC715UB  
DAC715UBG4  
DAC715UG4  
DAC715UK  
DAC715UKG4  
DAC715UL  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
DAC715ULG4  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
3-Nov-2011  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Audio  
Applications  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
www.ti.com/security  
Medical  
Logic  
Security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense www.ti.com/space-avionics-defense  
microcontroller.ti.com  
www.ti-rfid.com  
Video and Imaging  
www.ti.com/video  
OMAP Mobile Processors www.ti.com/omap  
Wireless Connectivity www.ti.com/wirelessconnectivity  
TI E2E Community Home Page  
e2e.ti.com  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2012, Texas Instruments Incorporated  

相关型号:

DAC715UK

16-BIT DIGITAL-TO-ANALOG CONVERTER with 16-Bit Bus Interface
BB

DAC715UK

16-BIT DIGITAL-TO-ANALOG CONVERTER with 16-Bit Bus Interface
TI

DAC715UKG4

16-BIT DIGITAL-TO-ANALOG CONVERTER with 16-Bit Bus Interface
TI

DAC715UL

16-BIT DIGITAL-TO-ANALOG CONVERTER with 16-Bit Bus Interface
BB

DAC715UL

16-BIT DIGITAL-TO-ANALOG CONVERTER with 16-Bit Bus Interface
TI

DAC715ULG4

16-BIT DIGITAL-TO-ANALOG CONVERTER with 16-Bit Bus Interface
TI

DAC716

16-Bit DIGITAL-TO-ANALOG CONVERTER with Serial Data Interface
BB

DAC716

16-Bit DIGITAL-TO-ANALOG CONVERTER with Serial Data Interface
TI

DAC716P

16-Bit DIGITAL-TO-ANALOG CONVERTER with Serial Data Interface
BB

DAC716P

16-Bit DIGITAL-TO-ANALOG CONVERTER with Serial Data Interface
TI

DAC716PB

16-Bit DIGITAL-TO-ANALOG CONVERTER with Serial Data Interface
BB

DAC716PB

16-Bit DIGITAL-TO-ANALOG CONVERTER with Serial Data Interface
TI