DAC8741HRGET [TI]

符合 HART®、FOUNDATION Fieldbus™ 和 PROFIBUS PA 标准且具有 SPI 接口的调制解调器 | RGE | 24 | -55 to 125;
DAC8741HRGET
型号: DAC8741HRGET
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

符合 HART®、FOUNDATION Fieldbus™ 和 PROFIBUS PA 标准且具有 SPI 接口的调制解调器 | RGE | 24 | -55 to 125

调制解调器
文件: 总48页 (文件大小:2812K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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DAC8740H, DAC8741H  
ZHCSH77D JUNE 2017REVISED MAY 2019  
DAC874xH HART® FOUNDATION Fieldbus™ 以及 PROFIBUS PA 调  
制解调器  
1 特性  
2 应用  
1
兼容 HART 的物理层调制解调器  
工业过程控制和自动化  
PLC DCS I/O 模块  
1200Hz2200Hz HART FSK 正弦波  
现场和传感器变送器  
TX 信号振幅的寄存器编程控制(仅适用于  
DAC8741H)  
3 说明  
集成式 RX 解调器和带通滤波器,具有极少的外  
部组件  
DAC8740H DAC8741H (DAC874xH) 是与 HART  
®FOUNDATION 现场总线PROFIBUS PA 兼  
容的低功耗调制解调器,设计用于工业过程控制和工业  
自动化 应用。  
兼容 FOUNDATION 现场总线的 H1 控制器和介质  
连接单元 (MAU)  
基于曼彻斯特编码总线供电 (MBP) 的  
31.25kbit/s 通信  
HART 模式下,DAC874xH 集成所有必需电路,以  
作为一个半双工 HART 物理层调制解调器,在从配置  
或主配置中使用最少的外部过滤组件运行。在  
FOUNDATION 现场总线模式下,DAC874xH 集成所  
有必需电路,以作为兼容半双工 FOUNDATION 现场  
总线的 H1 控制器和 MAU 运行。  
集成曼彻斯特编码器和解码器  
PROFIBUS PA 兼容  
低静态电流:在典型工业工作温度范围(-40°C 至  
+85°C)下最大值为 180µA  
集成 1.5V 电压基准  
灵活的时钟选项  
内部振荡器  
HARTFOUNDATION 现场总线或 PROFIBUS PA  
模式下,可通过 UART 接口或 SPI 接口接入的集成式  
FIFO 传输来自微控制器的数据流。SPI 接口包括一个  
支持菊链的 SDO 引脚、各种中断以及其他扩展 特  
性。  
外部晶体振荡器  
外部 CMOS 时钟  
数字接口  
DAC8740HUART  
DAC8741HSPI  
器件信息(1)  
可靠性:CRC 位错校验、看门狗计时器(仅适用于  
DAC8741H)  
器件型号  
DAC8740H  
DAC8741H  
封装  
封装尺寸(标称值)  
超薄四方扁平无引线  
(VQFN) (24)  
4mm x 4mm  
宽工作温度范围:–55°C +125°C  
4mm × 4mm QFN 封装  
超薄四方扁平无引线  
(VQFN) (24)  
4mm x 4mm  
(1) 要了解所有可用封装,请参见数据表末尾的封装选项附录。  
简化原理图  
IOVDD  
CLK_CFG0 CLK_CFG1 CLKO  
XEN X1 X2  
REF_EN  
REF  
REG_CAP AVDD  
Clock  
Generator  
Precision  
Oscillator  
Voltage  
Reference  
DAC  
RST  
CD / IRQ  
Transmit  
Modulator  
HART  
Buffer  
MOD_OUT  
MOD_INF  
MOD_IN  
UART_IN / CS  
DUPLEX / SDI  
UART_OUT / SDO  
UART_RTS / SCLK  
IF_SEL  
MUX  
Receive  
Demodulator  
Carrier  
Detect  
Bandpass  
Filter  
PA/FF  
DGND  
BPFEN  
AGND  
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确  
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。  
English Data Sheet: SBAS856  
 
 
 
 
DAC8740H, DAC8741H  
ZHCSH77D JUNE 2017REVISED MAY 2019  
www.ti.com.cn  
目录  
8.4 Device Functional Modes........................................ 19  
8.5 Register Maps......................................................... 23  
Application and Implementation ........................ 31  
9.1 Application Information............................................ 31  
9.2 Typical Application ................................................. 33  
1
2
3
4
5
6
7
特性.......................................................................... 1  
应用.......................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 2  
Device Comparison Table..................................... 3  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 7  
7.1 Absolute Maximum Ratings ...................................... 7  
7.2 ESD Ratings.............................................................. 7  
7.3 Recommended Operating Conditions....................... 7  
7.4 Thermal Information.................................................. 8  
7.5 Electrical Characteristics........................................... 8  
7.6 Timing Requirements.............................................. 11  
7.7 Typical Characteristics............................................ 12  
Detailed Description ............................................ 16  
8.1 Overview ................................................................. 16  
8.2 Functional Block Diagram ....................................... 16  
8.3 Feature Description................................................. 16  
9
10 Power Supply Recommendations ..................... 37  
11 Layout................................................................... 37  
11.1 Layout Guidelines ................................................. 37  
11.2 Layout Example .................................................... 37  
12 器件和文档支持 ..................................................... 39  
12.1 文档支持 ............................................................... 39  
12.2 相关链接................................................................ 39  
12.3 接收文档更新通知 ................................................. 39  
12.4 社区资源................................................................ 39  
12.5 ....................................................................... 39  
12.6 静电放电警告......................................................... 39  
12.7 Glossary................................................................ 39  
13 机械、封装和可订购信息....................................... 39  
8
4 修订历史记录  
注:之前版本的页码可能与当前版本有所不同。  
Changes from Revision C (December 2018) to Revision D  
Page  
Added recommended operating temperature range, TA, to the Recommended Operating Conditions table ........................ 7  
Changed maximum temperature test conditions for all specifications in the Electrical Characteristics table from  
+125to +105................................................................................................................................................................... 8  
Changes from Revision B (June 2018) to Revision C  
Page  
已删除 从数据表中删除了 DAC8742H.................................................................................................................................... 1  
Changes from Revision A (December 2017) to Revision B  
Page  
DAC8741H DAC8742H 已发布至生............................................................................................................................... 1  
Changes from Original (June 2017) to Revision A  
Page  
首次公开发布的完整数据表..................................................................................................................................................... 1  
DAC8740H 已发布至生....................................................................................................................................................... 1  
2
Copyright © 2017–2019, Texas Instruments Incorporated  
 
DAC8740H, DAC8741H  
www.ti.com.cn  
ZHCSH77D JUNE 2017REVISED MAY 2019  
5 Device Comparison Table  
PART NUMBER  
DAC8740H  
DIGITAL INTERFACE  
UART  
SPI  
DAC8741H  
6 Pin Configuration and Functions  
RGE Package: DAC8740H  
24-Pin VQFN  
Top View  
XEN  
CLKO  
1
2
3
4
5
6
18  
17  
16  
15  
14  
13  
AVDD  
MOD_INF  
MOD_IN  
REF  
CLK_CFG0  
CLK_CFG1  
RST  
Thermal pad  
MOD_OUT  
REG_CAP  
CD  
Not to scale  
Pin Functions: DAC8740H  
PIN  
TYPE  
DESCRIPTION  
NO.  
NAME  
Crystal oscillator enable. Logic low on this pin enables the crystal oscillator circuit; in  
this mode, an external crystal is required. Logic high on this pin disables the internal  
crystal oscillator circuit; in this mode an external CMOS clock or the internal oscillator  
are required. No digital input pin should be left floating.  
1
XEN  
Digital input  
Clock output. If using the internal oscillator or an external crystal, this pin can be  
configured as a clock output.  
2
3
4
CLKO  
Digital output  
Digital input  
Digital input  
Clock configuration. This pin is used to configure the input/output clocking scheme.  
No digital input pin should be left floating.  
CLK_CFG0  
CLK_CFG1  
Clock configuration. This pin is used to configure the input/output clocking scheme.  
No digital input pin should be left floating.  
Reset. Logic low on this pin places the DAC874xH into power-down mode and resets  
the device. Logic high returns the device to normal operation. No digital input pin  
should be left floating.  
5
RST  
Digital input  
HART mode.  
Carrier detect. A logic high on this pin indicates a valid carrier is present.  
FF or PA mode.  
6
CD  
Digital output  
While not transmitting, a logic high on this pin indicates a valid carrier is present.  
While transmitting, a logic high on this pin indicates that the jabber inhibitor has  
triggered.  
Copyright © 2017–2019, Texas Instruments Incorporated  
3
DAC8740H, DAC8741H  
ZHCSH77D JUNE 2017REVISED MAY 2019  
www.ti.com.cn  
Pin Functions: DAC8740H (continued)  
PIN  
TYPE  
DESCRIPTION  
NO.  
NAME  
7
UART_IN  
Digital input  
UART data input. No digital input pin should be left floating.  
HART mode.  
Request to send. A logic high on this pin enables the demodulator and disables the  
modulator. A logic low on this pin enables the modulator and disables the  
demodulator. No digital input pin should be left floating.  
Digital input,  
Digital output  
8
UART_RTS  
FF or PA mode.  
This pin reports transmit FIFO threshold information as programmed by the packet  
initiation code.  
Digital input. Logic high enables full-duplex, or internal loop-back, test mode. No  
digital input pin should be left floating.  
9
DUPLEX  
UART_OUT  
IOVDD  
Digital input  
Digital output  
Supply  
10  
11  
UART data output  
Interface supply. Supply voltage for digital input and output circuitry. This voltage sets  
the logical thresholds for the digital interface.  
12  
13  
GND  
Supply  
Digital ground. Ground reference voltage for all digital circuitry of the device.  
Capacitor for internal regulator.  
REG_CAP  
Analog output  
Modem output. FSK output sinusoid in HART mode or Manchester coded data stream  
in FOUNDATION Fieldbus and PROFIBUS PA modes. for stability, this pin requires  
parallel capacitance of 5 nF to 22 nF in HART mode, or 0 pF to 100 pF in  
FOUNDATION Fieldbus and PROFIBUS PA mode.  
14  
MOD_OUT  
Analog output  
Analog input or  
output  
When the internal reference is enabled, this pin outputs the internal reference voltage.  
When the internal reference is disabled, this pin is the external 2.5-V reference input.  
15  
16  
REF  
HART FSK input or FOUNDATION Fieldbus and PROFIBUS PA Manchester coded  
data stream input. If an external filter is used, do not connect this pin.  
MOD_IN  
Analog input  
If using the internal band-pass filter, connect 680 pF to this pin in HART mode, or 120  
pF in FOUNDATION Fieldbus and PROFIBUS PA modes. If using an external filter,  
connect the output of that filter to this pin.  
17  
MOD_INF  
Analog input  
18  
19  
20  
21  
22  
AVDD  
GND  
X2  
Supply  
Supply  
Power supply  
Analog ground. Ground reference voltage for power supply input.  
Crystal stimulus  
Analog input  
Analog input  
Supply  
X1  
Crystal ro clock input  
GND  
Digital ground. Ground reference voltage for all digital circuitry of the device.  
Reference enable. Logic high enables the internal 1.5-V reference. No digital input pin  
should be left floating.  
23  
24  
REF_EN  
BPF_EN  
Digital input  
Digital input  
Supply  
Filter enable. A logic high enables the internal band-pass filter. No digital input pin  
should be left floating.  
Thermal  
pad  
Thermal pad  
Thermal pad. Connected to GND if connected to an electrical potential.  
4
Copyright © 2017–2019, Texas Instruments Incorporated  
DAC8740H, DAC8741H  
www.ti.com.cn  
ZHCSH77D JUNE 2017REVISED MAY 2019  
RGE Package: DAC8741H  
24-Pin VQFN  
Top View  
XEN  
CLKO  
1
2
3
4
5
6
18  
17  
16  
15  
14  
13  
AVDD  
MOD_INF  
MOD_IN  
REF  
CLK_CFG0  
CLK_CFG1  
RST  
Thermal pad  
MOD_OUT  
REG_CAP  
IRQ  
Not to scale  
Pin Functions: DAC8741H  
PIN  
TYPE  
DESCRIPTION  
NO.  
NAME  
Crystal oscillator enable. Logic low on this pin enables the crystal oscillator circuit; in  
this mode, an external crystal is required. Logic high on this pin disables the internal  
crystal oscillator circuit; in this mode, an external CMOS clock or the internal oscillator  
are required. No digital input pin should be left floating.  
1
XEN  
Digital input  
Clock output. If using the internal oscillator or an external crystal, this pin can be  
configured as a clock output.  
2
3
4
CLKO  
Digital output  
Digital input  
Digital input  
Clock configuration. This pin is used to configure the input/output clocking scheme.  
No digital input pin should be left floating.  
CLK_CFG0  
CLK_CFG1  
Clock Configuration. This pin is used to configure the input/output clocking scheme.  
No digital input pin should be left floating.  
Reset. Logic low on this pin places the DAC874xH into power-down mode and resets  
the device. Logic high returns the device to normal operation. No digital input pin  
should be left floating.  
5
6
RST  
IRQ  
Digital input  
Digital Interrupt. The interrupt can be configured as edge sensitive or level sensitive  
with positive or negative polarity, as set by the CONTROL register. Events that trigger  
an interrupt are controlled by the Modem IRQ Mask register.  
Digital output  
SPI chip-select. Data bits are clocked into the serial shift register when CS is low.  
When CS is high, SDO is in a high-impedance state and data on SDI are ignored. No  
digital input pin should be left floating.  
7
8
9
CS  
SCLK  
SDI  
Digital input  
Digital input  
Digital input  
SPI clock. Data can be transferred at rates up to 12.5 MHz. Schmitt-Trigger logic  
input. No digital input pin should be left floating.  
SPI data input. Data are clocked into the 24-bit input shift register on the falling edge  
of the serial clock input. Schmitt-Trigger logic input. No digital input pin should be left  
floating.  
10  
11  
SDO  
Digital output  
Supply  
SPI data output. Data are valid on the falling edge of SCLK.  
Interface supply. Supply voltage for digital input and output circuitry. This voltage sets  
the logical thresholds for the digital interface.  
IOVDD  
12  
13  
GND  
Supply  
Digital ground. Ground reference voltage for all digital circuitry of the device.  
Capacitor for internal regulator  
REG_CAP  
Analog output  
Copyright © 2017–2019, Texas Instruments Incorporated  
5
DAC8740H, DAC8741H  
ZHCSH77D JUNE 2017REVISED MAY 2019  
www.ti.com.cn  
Pin Functions: DAC8741H (continued)  
PIN  
TYPE  
DESCRIPTION  
NO.  
NAME  
Modem output. FSK output sinusoid in HART mode or Manchester coded data stream  
in FOUNDATION Fieldbus and PROFIBUS PA modes. For stability, this pin requires  
parallel capacitance of 5 nF to 22 nF in HART mode, or 0 pF to 100 pF in  
FOUNDATION Fieldbus and PROFIBUS PA mode.  
14  
MOD_OUT  
Analog output  
Analog Input or  
output  
When the internal reference is enabled, this pin outputs the internal reference voltage.  
When the internal reference is disabled, this pin is the external 2.5-V reference input.  
15  
16  
REF  
HART FSK input or FOUNDATION Fieldbus and PROFIBUS PA Manchester coded  
data stream input. If an external filter is used, do not connect this pin.  
MOD_IN  
Analog input  
If using the internal band-pass filter, connect 680 pF to this pin, or 120 pF in  
FOUNDATION Fieldbus and PROFIBUS PA modes. If using an external filter,  
connect the output of that filter to this pin.  
17  
MOD_INF  
Analog input  
18  
19  
20  
21  
22  
AVDD  
GND  
X2  
Supply  
Supply  
Power supply  
Analog ground. Ground reference voltage for power supply input.  
Crystal stimulus  
Analog input  
Analog input  
Supply  
X1  
Crystal or clock input  
GND  
Digital ground. Ground reference voltage for all digital circuitry of the device.  
Reference enable. Logic high enables the internal 1.5-V reference. No digital input pin  
should be left floating.  
23  
24  
REF_EN  
BPF_EN  
Digital input  
Digital input  
Supply  
Filter enable. A logic high enables the internal band-pass filter. No digital input pin  
should be left floating.  
Thermal  
pad  
Thermal pad  
Thermal pad. Connected to GND if connected to an electrical potential.  
6
Copyright © 2017–2019, Texas Instruments Incorporated  
DAC8740H, DAC8741H  
www.ti.com.cn  
ZHCSH77D JUNE 2017REVISED MAY 2019  
7 Specifications  
7.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)(1)  
MIN  
0.3  
0.3  
0.3  
0.3  
0.3  
0.3  
10  
MAX  
UNIT  
AVDD to GND  
6
6
IOVDD to GND  
Input voltage  
V
Analog output voltage to GND  
AVDD + 0.3  
IOVDD + 0.3  
AVDD + 0.3  
IOVDD + 0.3  
10  
Digital output voltage to GND  
Analog output pin to GND  
Output voltage  
V
Digital output pin to GND  
Input current  
Input current to any pin except supply pins  
mA  
Operating junction temperature, TJ  
Storage temperature, Tstg  
55  
125  
60  
150  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
7.2 ESD Ratings  
VALUE  
UNIT  
Human body model (HBM), per  
±8000  
ANSI/ESDA/JEDEC JS-001, all pins(1)  
V(ESD)  
Electrostatic discharge  
V
Charged device model (CDM), per  
JEDEC specification JESD22-C101, all  
pins(2)  
±1500  
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
7.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
NOM  
MAX  
UNIT  
POWER SUPPLY  
AVDD  
2.7  
5.5  
5.5  
V
V
IOVDD  
1.71  
ANALOG INPUTS  
External reference input voltage  
DIGITAL INPUTS  
2.375  
2.5  
2.625  
V
3.6864-MHz clock  
1.2288-MHz clock  
3.6469  
1.2165  
3.6864  
1.2288  
3.7232  
1.2411  
External clock source frequency  
(HART mode)  
MHz  
MHz  
External clock source frequency  
(FF or PA modes)  
3.96  
4
4.04  
TEMPERATURE  
Recommended operating temperature, TA  
40  
105  
Copyright © 2017–2019, Texas Instruments Incorporated  
7
DAC8740H, DAC8741H  
ZHCSH77D JUNE 2017REVISED MAY 2019  
www.ti.com.cn  
7.4 Thermal Information  
DAC8740H, DAC8741H  
THERMAL METRIC(1)  
RGE  
24 PINS  
32.1  
31.8  
9.5  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
RθJC(top)  
RθJB  
ΨJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
0.4  
ΨJB  
9.6  
RθJC(bot)  
1.7  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report.  
7.5 Electrical Characteristics  
all specifications over –40°C to +105°C ambient operating temperature, 2.7 V AVDD 5.5 V, 1.71 V IOVDD 5.5 V,  
internal reference, internal filter (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
POWER REQUIREMENTS  
AVDD and IOVDD Supply Current (HART Mode)  
External clock, –40°C to +85°C  
110  
100  
150  
220  
µA  
µA  
External clock, –55°C to +105  
External clock, –40°C to +85°C, external  
reference  
Demodulator active  
140  
210  
µA  
µA  
External clock, –55°C to +105, external  
reference  
External clock, –40°C to +85°C  
160  
150  
180  
250  
µA  
µA  
External clock, –55°C to +105℃  
External clock, –40°C to +85°C, external  
reference  
Modulator active  
Crystal oscillator  
170  
240  
µA  
µA  
External clock, –55°C to +105, external  
reference  
External crystal, 16 pF at XTAL1 and XTAL2  
External crystal, 36 pF at XTAL1 and XTAL2  
External reference  
40  
40  
65  
65  
µA  
µA  
µA  
Internal oscillator  
SPI interface  
105  
180  
Additional quiescent current required when  
interfacing via SPI (DAC8741H only)  
5
160  
175  
µA  
AVDD and IOVDD Supply Current (FF/PA Mode)  
External clock, –40°C to +85°C  
220  
330  
µA  
µA  
External clock, –55°C to +105℃  
External clock, –40°C to +85°C, external  
reference  
Decoder active  
Encoder active  
200  
320  
µA  
µA  
External clock, –55°C to +105, external  
reference  
External clock, –40°C to +85°C  
175  
165  
250  
360  
µA  
µA  
External clock, –55°C to +105℃  
External clock, –40°C to +85°C, external  
reference  
235  
350  
µA  
µA  
External clock, –55°C to +105, external  
reference  
External crystal, 16 pF at XTAL1 and XTAL2  
External crystal, 36 pF at XTAL1 and XTAL2  
40  
40  
65  
65  
µA  
µA  
Crystal oscillator  
SPI interface  
Additional quiescent current required when  
interfacing via SPI (DAC8741H)  
5
µA  
8
Copyright © 2017–2019, Texas Instruments Incorporated  
DAC8740H, DAC8741H  
www.ti.com.cn  
ZHCSH77D JUNE 2017REVISED MAY 2019  
Electrical Characteristics (continued)  
all specifications over –40°C to +105°C ambient operating temperature, 2.7 V AVDD 5.5 V, 1.71 V IOVDD 5.5 V,  
internal reference, internal filter (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
AVDD and IOVDD Supply Current (All Modes)  
Internal reference disabled, –40°C to +85°C,  
no active clock input  
30  
60  
µA  
µA  
Power-down mode  
Internal reference disabled, –55°C to +105,  
no active clock input  
182  
CLOCK REQUIREMENTS  
EXTERNAL CLOCK (HART MODE)  
3.6864-MHz clock  
1.2288-MHz clock  
3.6469  
1.2165  
3.6864  
1.2288  
3.7232  
1.2411  
MHz  
MHz  
External clock source frequency  
EXTERNAL CLOCK (FF/PA MODE)  
External clock source frequency  
INTERNAL OSCILLATOR  
Frequency  
4-MHz clock  
3.96  
4
4.04  
MHz  
MHz  
–40°C to +105℃  
1.2165  
1.2288  
1.2411  
VOLTAGE REFERENCE  
INTERNAL REFERENCE VOLTAGE  
Internal reference voltage  
Load regulation  
1.47  
1.5  
1.3  
1
1.53  
V
V/mA  
µF  
Capacitive load  
Specified by design  
OPTIONAL EXTERNAL REFERENCE VOLTAGE  
External reference input voltage  
2.375  
2.5  
4.5  
4.5  
4.5  
4.5  
2.625  
V
Demodulator  
µA  
µA  
µA  
µA  
Modulator  
External reference input current  
Internal oscillator  
Power-down  
HART MODEM  
MOD_IN INPUT (HART MODE)  
External reference source, specified by  
design. Signal applied at the input to the dc  
blocking capacitor.  
0
0
1.5  
1.5  
VPP  
Input voltage range  
Receiver sensitivity  
Internal reference source, specified by  
design. Signal applied at the input to the dc  
blocking capacitor.  
VPP  
Threshold for successful carrier detection and  
demodulation, assuming ideal sinusoidal  
input FSK signals with valid preamble using  
internal filter.  
80  
100  
460  
120  
480  
mVPP  
mVPP  
MOD_OUT OUTPUT (HART MODE)  
AC-coupled (2.2 µF), measured at  
MOD_OUT pin with 160-Ω load  
Output voltage  
450  
Mark frequency  
Internal oscillator  
1200  
2200  
Hz  
Hz  
Space frequency  
Frequency error  
Phase continuity error  
Internal oscillator  
Internal oscillator, –40°C to +105℃  
Specified by design  
-1  
1
0
%
Degrees  
160-Ω, ac coupled with 2.2 µF, specified by  
design  
Minimum resistive load  
160  
Ω
Ω
RTS low, measured at the MOD_OUT pin, 1-  
mA measurement current  
13  
Transmit impedance  
RTS high, measured at the MOD_OUT pin,  
±200-nA measurement current  
250  
kΩ  
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Electrical Characteristics (continued)  
all specifications over –40°C to +105°C ambient operating temperature, 2.7 V AVDD 5.5 V, 1.71 V IOVDD 5.5 V,  
internal reference, internal filter (unless otherwise noted)  
PARAMETER  
FF / PA MODEM  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
MOD_IN INPUT (FF/PA MODE)  
External reference source, specified by  
design. Signal applied at the input to the DC  
blocking capacitor.  
0
1
Vp-p  
Input voltage range  
Internal reference enabled, specified by  
design. Signal applied at the input to the DC  
blocking capacitor.  
0
1
Vp-p  
µs  
Edge-to-edge measurement of Manchester  
encoded waveforms  
Receiver jitter tolerance  
Receiver sensitivity  
-3.2  
3.2  
Threshold for successful carrier detection and  
decoding, assuming ideal Manchester  
encoded input trapezoidal signals with 6µs  
rise time, valid preamble byte(s) and start  
delimiter byte, using internal filter.  
75  
mVp-p  
MOD_OUT OUTPUT (FF/PA MODE)  
Output voltage  
800  
mVp-p  
mV  
Maximum difference in positive and negative  
amplitude signals  
Maximum amplitude difference  
Transmit bit rate  
-50  
31.1875  
-0.8  
50  
31.3125  
0.8  
31.25  
kbit/s  
µs  
Measured with respect to ideal crossing of  
high time and low time  
Transmit jitter  
Measured peak to trough distortion for  
positive and negative amplitude voltage  
outputs  
Output signal distortion  
-10  
10  
%
Rise and fall time  
Slew rate  
10% to 90% of peak to peak signal  
10% to 90% of peak to peak signal  
8
µs  
0.2  
V/µs  
DIGITAL REQUIREMENTS  
DIGITAL INPUTS  
0.7 x  
IOVDD  
VIH, input high voltage  
V
V
V
V
0.3 x  
IOVDD  
VIL, input low voltage  
0.8 x  
IOVDD  
CLK_CFG0, input high voltage  
CLK_CFG0, input mid-scale voltage  
CLK_CFG0, input low voltage  
Specified by design  
Specified by design  
Specified by design  
0.4 x  
IOVDD  
0.55 x  
IOVDD  
0.15 x  
IOVDD  
Input current  
-1  
1
µA  
pF  
Input capcitance  
DIGITAL OUTPUTS  
5
IOVDD -  
0.5  
VOH, output high voltage  
VOL, output low voltage  
200-µA source or sink  
200-µA source or sink  
V
V
0.4  
10  
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7.6 Timing Requirements  
all timing conditions specified by design (unless otherwise noted)  
MIN  
NOM  
MAX  
UNIT  
SPI TIMING  
SPI TIMING  
SPI TIMING SPI TIMING SPI TIMING  
SPI TIMING  
tc  
SCLK cycle time  
80  
32  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
us  
ns  
ns  
tw1  
SCLK high time  
tw2  
SCLK low time  
32  
tsu  
CS to SCLK falling edge setup time  
Data setup time  
32  
tsu1  
5
th1  
Data hold time  
5
td1  
SCLK falling edge to CS rising edge  
32  
(1)  
tw3  
Minimum CS high time  
3.06  
32  
tv  
SCLK rising edge to SDO valid  
Reset low time  
trst  
100  
HART MODE TIMING  
Carrier start time. Time from RTS falling edge to  
transmit carrier reaching its first peak.  
tcstart  
5
3
Bit-Times  
Bit-Times  
Carrier stop time. Time from RTS rising edge to  
transmit carrier amplitude falling below the receive  
amplitude.  
tcstop  
Carrier decay time. Time from RTS riding edge to  
carrier amplitude dropping to zero.  
tcdecay  
tcdeton  
tcdetoff1  
6
6
3
Bit-Times  
Bit-Times  
ms  
Carrier detect on. Time from valid carrier on receive  
path to CD rising edge.  
Carrier detect off. Time from valid carrier removed on  
receive path to CD falling edge.  
Carrier detect on when transitioning from transmit  
mode to receive mode in the presence of a constant  
valid receive carrier.  
tcdetoff2  
2.1  
25  
ms  
ms  
Crystal oscillator power-up time from enabling the  
oscillator via clock configuration pins with 16-pF load  
capacitors.  
tcos1  
Crystal oscillator power-up time from enabling the  
oscillator via clock configuration pins with 36-pF load  
capacitors.  
tcos2  
25  
10  
30  
ms  
ms  
µs  
Reference power-up time from enabling via hardware  
pin.  
tref  
Transition time from power-down mode to normal  
operating mode with external clock and external  
reference.  
tpow  
(1) Time between two consecutive CS rising edges must be 3.06 µs.  
tc  
1
2
24  
tw1  
tw2  
td1  
tsu  
th1  
tw3  
tsu1  
MSB  
MSB  
LSB  
LSB  
tw  
trst  
1. SPI Timing Diagram  
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7.7 Typical Characteristics  
0
-5  
0
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
10  
100  
1k  
10k  
100k  
1M  
10  
100  
1k  
10k  
100k  
1M  
Frequency (Hz)  
Frequency (Hz)  
D002  
D003  
2. HART Mode External Band-Pass Filter Response  
3. HART Mode Internal Band-Pass Filter Response  
0
0
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
10  
100  
1k  
10k  
100k  
1M  
10  
100  
1k  
10k  
100k  
1M  
Frequency (Hz)  
Frequency (Hz)  
D004  
D005  
4. FF / PA Mode External Band-Pass Filter Response  
5. FF / PA Mode Internal Band-Pass Filter Response  
1.505  
1.53  
1.52  
1.51  
1.50  
1.49  
1.48  
1.47  
1.504  
1.503  
1.502  
1.501  
1.500  
2.7  
3.1  
3.5  
3.9  
AVDD (V)  
4.3  
4.7  
5.1  
5.5  
-55  
-35  
-15  
5
25  
45  
65  
85  
105 125  
Temperature (oC)  
D006  
D007  
6. Internal Reference Voltage vs AVDD  
7. Internal Reference Voltage vs Temperature  
12  
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Typical Characteristics (接下页)  
nRTS (2V/div)  
nRTS (2V/div)  
MOD OUT (0.2V/div)  
UART IN (2V/div)  
MOD OUT (0.2V/div)  
UART IN (2V/div)  
0.1 ms/ div  
0.1 ms/ div  
D008  
D009  
8. HART TX Carrier Start Time  
9. HART TX Carrier Stop / Decay Time  
MOD IN (0.1V/div)  
CD (2V/ div)  
MOD IN (0.1V/div)  
CD (2V/ div)  
UART OUT (2V/div)  
UART OUT (2V/div)  
0.5 ms/ div  
1 ms/ div  
D010  
D011  
10. HART RX Carrier Detect Off Timing  
11. HART RX Carrier Detect On Timing  
10  
9
8
7
6
5
4
3
2
1
0
130  
120  
110  
100  
90  
Modulator Active  
Demodulator Active  
Modulator Active  
Demodulator Active  
80  
70  
60  
50  
1.5  
2
2.5  
3
3.5  
IOVDD (V)  
4
4.5  
5
5.5  
2.7  
3
3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7  
AVDD (V)  
D012  
D013  
12. HART Mode IOVDD Supply Current vs Voltage With  
13. HART Mode AVDD Supply Current vs Voltage With  
External Reference  
External Reference  
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Typical Characteristics (接下页)  
10  
165  
150  
135  
120  
105  
90  
Modulator Active  
Demodulator Active  
Modulator Active  
9
Demodulator Active  
8
7
6
5
4
3
2
1
0
75  
60  
45  
1.5  
2
2.5  
3
3.5  
IOVDD (V)  
4
4.5  
5
5.5  
2.7  
3
3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7  
AVDD (V)  
D016  
BDP0F17_  
14. HART Mode IOVDD Supply Current vs Voltage With  
15. HART Mode AVDD Supply Current vs Voltage With  
Internal Reference  
Internal Reference  
32  
28  
152  
Transmitting data  
Receiving data  
148  
144  
140  
136  
132  
128  
124  
120  
Transmitting data  
24  
Receiving data  
20  
16  
12  
8
4
0
1.5  
2
2.5  
3
3.5  
IOVDD (V)  
4
4.5  
5
5.5  
2.7  
3
3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7  
AVDD (V)  
D014  
BDP0F15_  
16. FF / PA Mode IOVDD Supply Current vs Voltage With  
17. FF / PA Mode AVDD Supply Current vs Voltage With  
External Reference  
External Reference  
32  
28  
164  
Transmitting data  
Receiving data  
160  
156  
152  
148  
144  
140  
136  
132  
Transmitting data  
24  
Receiving data  
20  
16  
12  
8
4
0
1.5  
2
2.5  
3
3.5  
IOVDD (V)  
4
4.5  
5
5.5  
2.7  
3
3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7  
AVDD (V)  
D018  
BDP0F19_  
18. FF / PA Mode IOVDD Supply Current vs Voltage With  
19. FF / PA Mode AVDD Supply Current vs Voltage With  
Internal Reference  
Internal Reference  
14  
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Typical Characteristics (接下页)  
Time (0.5 ms/div)  
Time (0.5 ms/div)  
D020  
D021  
20. Typical Manchester Encoded Trapezoid, No Filter  
21. Typical Manchester Encoded Trapezoid, With  
Suggested Filter Response  
490  
1.2kHz Signal  
2.2kHz Signal  
485  
480  
475  
470  
465  
460  
455  
100 200 300 400 500 600 700 800 900 1000  
RLOAD (W)  
D025  
22. MOD_OUT Voltage vs RLOAD  
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8 Detailed Description  
8.1 Overview  
The DAC8740H and DAC8741H (DAC874xH) are HART© compliant and FOUNDATION Fieldbus or PROFIBUS  
PA compatible low power modems designed for industrial process control and industrial automation applications.  
In HART mode, the DAC874xH integrates all of the required circuitry to operate as half-duplex HART physical  
layer modems, in either slave or master configurations with minimal external components for filtering. In  
FOUNDATION Fieldbus mode, the DAC874xH integrate all of the required circuitry to operate as half-duplex  
FOUNDATION Fieldbus compliant H1 Controllers and MAUs.  
The HART, FOUNDATION Fieldbus, or PROFIBUS PA, data stream can be transferred from the microcontroller  
through either a UART interface or an integrated FIFO accessed by a SPI interface. The SPI interface includes  
an SDO pin for daisy-chain support, various interrupts, and other extended features.  
8.2 Functional Block Diagram  
IOVDD  
CLK_CFG0 CLK_CFG1 CLKO  
XEN X1 X2  
REF_EN  
REF  
REG_CAP AVDD  
Clock  
Generator  
Precision  
Oscillator  
Voltage  
Reference  
DAC  
RST  
CD / IRQ  
Transmit  
Modulator  
HART  
Buffer  
MOD_OUT  
MOD_INF  
MOD_IN  
UART_IN / CS  
DUPLEX / SDI  
UART_OUT / SDO  
UART_RTS / SCLK  
IF_SEL  
MUX  
Receive  
Demodulator  
Carrier  
Detect  
Bandpass  
Filter  
PA/FF  
DGND  
BPFEN  
AGND  
8.3 Feature Description  
8.3.1 HART Modulator  
In SPI mode, HART data is loaded into a transmit FIFO via the SPI serial interface. In UART mode, the UART  
baud rate matches the HART baud rate, and therefore the FIFO is bypassed. In both cases, the input data are  
translated into the mark and space frequency shift keyed (FSK) analog signals (1200 Hz and 2200 Hz,  
respectively) used in HART communication using an internal HART modulator.  
The HART modulator implements a look-up table containing 32 6-bit signed values that represent a single phase  
continuous sinusoidal cycle. A counter is implemented that incrementally loads the table values to a digital-to-  
analog converter (DAC), at a clock frequency determined by the binary value of the input data, in order to create  
the mark and space analog output signals used to represent HART data.  
The modem operates in half-duplex mode, unless placed in full-duplex mode, where the modulator and  
demodulator are not active simultaneously. The modem arbitrates over which component is active. To request  
that the modulator is activated UART devices toggle the RTS pin low, SPI devices toggle the RTS bit in the  
MODEM CONTROL register. These mechanics are explained in more detail in the respective sections of Device  
Functional Modes.  
In HART mode the MOD_OUT pin requires parallel capacitance of 5 nF to 22 nF, or 0 pF to 100 pF in  
FOUNDATION Fieldbus and PROFIBUS PA mode for stability.  
16  
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Feature Description (接下页)  
8.3.2 HART Demodulator  
The HART demodulator converts the HART FSK input signals applied at the MOD_IN or MOD_INF pins,  
depending on whether an external filter is implemented, to binary data that is loaded into a receive FIFO in SPI  
mode. Data in the receive FIFO can then be read by the host controller via SPI serial interface. In UART mode  
received data is directly fed through to the UART interface.  
When a valid carrier is detected on devices using the UART interfaces, the CD pin will toggle high. For devices  
using the SPI interface, the IRQ pin toggles, indicating an alarm condition. The MODEM STATUS register can  
then be read to determine the source of the interrupt, which includes a bit for carrier detection in DB1. Hysteresis  
is implemented with the carrier detect feature in order to prevent erroneous carrier detection signals. More details  
are explained in the respective Device Functional Modes sections.  
8.3.3 FOUNDATION Fieldbus or PROFIBUS PA Manchester Encoder  
FOUNDATION Fieldbus or PROFIBUS PA data is loaded into a transmit FIFO via UART or SPI interfaces which  
is translated into the Manchester encoded binary analog signals used in both FOUNDATION Fieldbus and  
PROFIBUS PA bus protocols through an internal Manchester encoder.  
The Manchester encoder interacts with the DAC to transmit positive and negative amplitude signals, with respect  
to a positive common mode voltage, to create the Manchester encoded analog outputs at 31.25 kHz baud. A  
binary 0 is represented by a low-to-high transition and a binary 1 is represented by a high-to-low transition.  
In both UART and SPI interfaced device, the encoder is activated any time there is data available in the transmit  
FIFO and the decoder is not receiving data. In order to prevent FIFO buffer overflow, for UART mode the CD pin  
acts as an interrupt to indicate when the FIFO level has exceed a programmed threshold in the packet initiation  
code. In SPI mode the transmit FIFO threshold programmed in the FIFO LEVEL SET register can trigger an  
interrupt on the IRQ pin. Once the IRQ interrupts is triggered, the MODEM STATUS register can then be read to  
determine the source of the interrupt, which includes a bit for the FIFO level in DB4. More details are explained  
in the respective Device Functional Modes sections.  
8.3.4 FOUNDATION Fieldbus or PROFIBUS PA Manchester Decoder  
The FOUNDATION Fieldbus and PROFIBUS PA decoder converts the Manchester encoded data applied at the  
MOD_IN or MOD_INF pins, depending on whether an external filter is implemented, to binary data that is loaded  
into a receive FIFO. Data in the receive FIFO can then be read by the host controller via UART or SPI serial  
interfaces.  
When valid data is provided to the decoder, binary data is read out serially on the UART interface. For SPI  
devices, the receive FIFO is loaded until the threshold programmed in FIFO LEVEL SET is met which will trigger  
an interrupt on the IRQ pin. The MODEM STATUS register can then be read to determine the source of the  
interrupt, which includes a bit for the FIFO level in DB7, indicating that data is ready to be read on the SPI bus.  
More details are explained in the respective Device Functional Modes sections.  
8.3.5 Internal Reference  
An internal reference is included in the DAC874xH. The REF_EN pin is used to enable or disable the internal  
reference, when the internal reference is disabled an external reference must be provided at the REF pin. In SPI  
mode, the PDVREF bit in the CONTROL register can be used to enable or disable the internal reference via  
software. If the REF_EN pin is set high, the register contents of the PDVREF bit is ignored. 1 summarizes  
how to configure the reference in either UART or SPI modes.  
1. Reference Configuration  
INTERFACE  
UART  
UART  
SPI  
PDVREF  
1 (default)  
1 (default)  
1 (default)  
0
REF_EN  
REFERENCE MODE  
External reference  
Internal reference  
Internal reference  
Internal reference  
External reference  
External reference  
0
1
1
1
0
0
SPI  
SPI  
1 (default)  
0
SPI  
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8.3.6 Clock Configuration  
All of the devices in the DAC874xH family support a variety of clocking options in order to provide system  
flexibility and reduce overall current consumption in HART applications. The clocking options include: an internal  
oscillator (HART mode only), an external crystal oscillator, or an external CMOS clock. The selection of the  
clocking scheme is controlled by the XEN, CLK_CFG1, and CLK_CFG0 pins as described in 2.  
The internal oscillator takes approximately 50 ms to start oscillating from when it is enabled. During this time  
period the device is unable to perform modulation or demodulation activities.  
2. Clock Configuration Table  
XEN  
1
CLK_CFG1  
CLK_CFG0  
CLKO  
No output  
DESCRIPTION  
MODE  
0
0
1
1
0
0
1
1
0
1
0
1
0
1
3.6864-MHz CMOS clock connected at XTAL1  
1.2288-MHz CMOS clock connected at XTAL1  
Internal oscillator enabled  
1
No output  
1
0
No output  
1
1
1.2288-MHz output  
No output  
Internal oscillator enabled, CLKO enabled  
Crystal oscillator enabled  
HART  
0
0
0
1
3.6864-MHz output  
1.8432-MHz output  
1.2288-MHz output  
No output  
3.6864-MHz crystal oscillator, CLKO enabled  
3.6864-MHz crystal oscillator, CLKO enabled  
3.6864-MHz crystal oscillator, CLKO enabled  
4-MHz CMOS clock connected at XTAL1  
2-MHz CMOS clock connected at XTAL1  
4-MHz crystal oscillator  
0
0
0
1
1
0.5  
0.5  
0.5  
0.5  
FOUNDATION  
Fieldbus and  
PROFIBUS PA  
1
No output  
0
No output  
0
4-MHz output  
4-MHz crystal oscillator, CLKO enabled  
8.3.7 Reset and Power-Down  
The RST pin functions as both a hardware reset and a power-down. When the pin is brought low a reset is  
issued, restoring all device components to their default state. While the pin is kept low, the device is in a power-  
down state where the internal reference is disabled, the modulator and demodulator or encoder and decoder are  
disabled, serial data output lines are high-impedance, MOD_OUT impedance is set to 70 k, and the clock  
output is disabled. If an external crystal oscillator is used, the crystal oscillator circuit remains active to reduce  
start-up time when exiting the power-down state. Clock configuration pins remain active in power-down allowing  
the crystal oscillator to be disabled if desired.  
8.3.8 Full-Duplex Mode  
In full-duplex mode the modulator and demodulator (HART mode) or encoder and decoder (FOUNDATION  
Fieldbus or PROFIBUS PA mode) are simultaneously enabled. This allows a self-test feature to verify  
functionality of the transmit and receive signal chains to improve system diagnostics.  
8.3.9 I/O Selection  
The DAC8740H implements a UART interface and the DAC8741H implements an SPI interface. The interface  
mode is selected by the IF_SEL pin: a logic high on this pin sets the device to SPI mode and a logic low sets the  
device to UART mode. An internal pull-down resistor is included to make sure the device powers up in a known  
state, by default the pull-down sets the interface to UART mode. If changing I/O modes after power-up, a reset  
command should be issued on RST.  
8.3.10 Jabber Inhibitor  
The DAC874xH implements a Jabber Inhibitor feature in FOUNDATION Fieldbus or PROFIBUS PA modes that  
prevents the encoder from continuously transmitting data on the bus for longer than a programmed threshold  
controlled by the UART or SPI interface. In SPI mode, this threshold is programmed by the PAFF_JABBER  
register. In UART mode, this threshold is programmed by the four-byte initialization sequence before each  
transmission. This information is described in further detail in the Device Functional Modes and Register Maps  
sections.  
18  
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8.4 Device Functional Modes  
8.4.1 UART Interfaced HART  
When interfacing the HART modem via the UART interface, the device can be thought of as a simple UART-to-  
HART or HART-to-UART direct feedthrough converter. The UART data is transmitted and received at 1200 baud,  
which is matched to the HART FSK input and output signals.  
The HART communication protocol is a half-duplex protocol which means that either the modulator or  
demodulator is active, and never simultaneously enabled. The device arbitrates over which component of the  
modem is active at all times based on activity on the HART bus. Bus activity is interfaced to the host controller  
through the CD and RTS pins.  
By default when RTS is high the demodulator is active and the modulator is inactive. When a valid carrier is  
detected and data is being received by the modem, the CD pin is toggled high and binary UART data is provided  
at the output. If a request to send is issued by toggling the RTS pin low while CD is high, the demodulator  
remains at priority and any data provided at the UART input is ignored. When CD is low no valid carrier is  
present and when RTS is brought low the modulator is activated and UART input data is latched into the  
modulator and placed onto the HART bus.  
8.4.2 UART Interfaced FOUNDATION Fieldbus or PROFIBUS PA  
FOUNDATION Fieldbus and PROFIBUS PA are half-duplex communication protocols where only the encoder or  
decoder are active at any time and the DAC874xH arbitrates over which path is active. When interfacing the  
FOUNDATION Fieldbus or PROFIBUS PA modem via the UART interface, data placed in the transmit FIFO is  
automatically placed on the FF/PA bus until the FIFO is empty any time the device is not receiving data,  
assuming correct data format.  
When receiving data the decoder will expect a preamble byte(s) and a start delimiter byte. These bytes, as well  
as the stop byte, will be stripped from the UART communication and only the first data byte will be transmitted to  
start the data packet. The host controller must use a timer to detect the end of the packet. Each byte transmitted  
on the UART will be at 57.6 kHz baud and byte spacing of 256 µs. If a new byte has not been started within 512  
µs it can be assumed that the incoming packet has ended.  
The device expects to see a four byte sequence to initiate transmission: 0xEA followed by 0x80-0x9F, where bits  
4:3 of the second byte configure an interrupt threshold for the transmit FIFO level and bits 2:0 set the number of  
preamble bytes to be transmitted. The third byte contains the information to configure the Jabber Inhibitor  
followed by the final byte of 0xAE. To send inverted Manchester encoded data the first byte, 0xEA, is inverted to  
0x15 and the first three bits of the second byte are inverted such that the range of values for the second byte are  
from 0x60-0x7F. The functionality of bits 4:3 and 2:0 and the Jabber Inhibitor byte remain the same and the final  
byte is inverted to 0x51. The details concerning this four byte sequence are explained in 3 to 5.  
3. B3 and B2 UART Initialization Byte Sequence  
B3  
B2  
D3  
Mode  
Noninverted  
Inverted  
D7:D0  
D7  
1
D6  
0
D5  
0
D4  
D2  
D1  
D0  
1
0
1
0
1
0
0
1
1
0
0
1
1
0
0
1
D2M_LEVEL  
D2M_LEVEL  
PRE_BYTES  
PRE_BYTES  
0
1
1
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4. B1 and B0 UART Initialization Byte Sequence  
B1  
B0  
Mode  
Noninverted  
Inverted  
D7:D0  
D7  
1
D6  
0
D5  
1
D4  
0
D3  
1
D2  
1
D1  
1
D0  
0
JABBER_TIMEOUT  
JABBER_TIMEOUT  
0
1
0
1
0
0
0
1
5. B2 Bit-Field Definitions  
CONTROL BITS  
D2M_LEVEL  
DESCRIPTION  
0
0
1
1
0
1
0
1
Alarm on UART_RTS when transmit FIFO has less than 2 bytes loaded  
Alarm on UART_RTS when transmit FIFO has less than 4 bytes loaded  
Alarm on UART_RTS when transmit FIFO has less than 6 bytes loaded  
Alarm on UART_RTS when transmit FIFO has less than 8 bytes loaded  
PRE_BYTES  
Number of preamble bytes is equivalent to the straight binary decimal value in this register plus one  
The JABBER_TIMEOUT bits control the timeout period for the Jabber Inhibitor. If a value of 0x0 is programmed  
the Jabber Inhibitor is disabled. Otherwise, the timer will be programmed in 2.048 ms increments such that the  
timeout can be calculated as shown below. If the Jabber Inhibitor triggers the CD pin will be taken high. The CD  
pin will be returned to logic low when the silence period of 3 seconds has ended.  
TimeOut = JABBER_TIMEOUT × 2.048 ms  
(1)  
The encoder begins transmitting data after the following conditions are met: a valid four-byte transmission  
initiation sequence has been sent to the device, the FIFO is not empty, and the device is not receiving data.  
Transmission begins by sending the preamble byte or bytes, followed by a start delimiter. Then, the encoder  
begins to remove data from the FIFO, and creates at least a five-byte lag of the encoder with respect to the  
UART.  
During transmission of a packet, the UART must take care to make sure that the FIFO does not become empty  
before the packet is complete. The encoder transmits at a baud rate of 31.25 kHz or 256 µs per byte in the FIFO,  
so the UART must keep up with this rate. The four-byte sequence that initiates a transmission includes setting a  
transmit FIFO threshold in bits 4:3. When the FIFO level is less than or equal to this threshold, the UART_RTS  
pin is taken high; this can be leveraged to make sure the FIFO is not prematurely empty. After the FIFO is  
empty, a stop delimiter is placed on the bus, and a new packet can be initiated with a new four-byte transmission  
initiation sequence.  
The device expects a UART baud rate of 57.6 kHz. This baud rate is faster than the 31.25-kHz baud rate  
specified by FOUNDATION Fieldbus and PROFIBUS PA; therefore, FIFO overflow is possible. To prevent FIFO  
overflow, the UART_RTS pin FIFO threshold alarm can be leveraged by never adding more data to the FIFO  
than the FIFO can contain, based on the programmed alarm threshold.  
8.4.3 SPI Interfaced HART  
When interfacing the HART modem via the SPI interface, the device uses transmit and receive FIFOs that are 9-  
bits wide and 16 locations deep to buffer all HART data.  
The HART communication protocol is half-duplex protocol which means that either the modulator or demodulator  
is active, and never simultaneously enabled. The device arbitrates over which component of the modem is active  
at all times based on activity on the HART bus. Bus activity is interfaced to the host controller through the IRQ  
pin and MODEM STATUS register.  
By default the demodulator is active and the modulator is inactive. When a valid carrier is detected and data is  
being received by the modem, the CD bit (bit 1) in the MODEM STATUS register is set high. If the CD bit (bit 1)  
in the MODEM IRQ MASK register is set to 0, this will also cause the IRQ pin to toggle as programmed in the  
status CONTROL register. The IRQ pin may be programmed to be edge sensitive or level sensitive, the polarity  
of the signal is also programmable. When the IRQ pin toggles, the MODEM STATUS register should be read to  
determine the source of the interrupt. Receive data can be read from the RECEIVE FIFO by issuing an SPI read  
command.  
20  
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Alternatively, the CD pin can be ignored by setting the CD bit (bit 1) in the MODEM IRQ MASK register to a 1. In  
this mode the IRQ pin will not toggle when the CD bit in the MODEM STATUS register is a 1. Instead, a  
RECEIVE FIFO read event can be triggered by the RECEIVE FIFO level threshold. This is achieved by  
programming the FIFO LEVEL SET register (bits 7:4) to the desired threshold value from 1-15, if a full FIFO  
(level 16 threshold) is desired the M2D FIFO FULL alarm can be used instead. If the M2D FIFO LEVEL bit (bit 7)  
in the MODEM IRQ MASK register is set to 0, the IRQ pin will toggle and the MODEM STATUS register should  
be read to determine the source of the interrupt. Receive data can then be read from the RECEIVE FIFO by  
issuing an SPI read command.  
If data is placed in the transmit FIFO while the demodulator is active and the CD bit is high, the data remains in  
the FIFO until the modulator is activated. To request that the modulator is activated and the demodulator is  
deactivated the RTS bit (bit 0) in the MODEM CONTROL register should be set high. When the modulator is  
activated and the demodulator is deactivated the clear to send, or CTS, bit (bit 0) in the MODEM STATUS  
register is set high. If the CTS bit (bit 0) in the MODEM IRQ MASK register is set to a 0 this will cause the IRQ  
pin to toggle, indicating that transmit FIFO data will begin to be placed on the bus.  
The level of the transmit FIFO may be monitored in order to avoid buffer overflow. This can be done either by  
watching for a buffer full or buffer threshold event. To monitor by a FIFO level threshold the FIFO LEVEL SET  
register (bits 3:0) can be programmed to the desired threshold value from 1-15. If the D2M FIFO LEVEL bit (bit  
4) in the MODEM IRQ MASK register is set to a 0, this will cause the IRQ pin to toggle. Similarly an alarm can be  
triggered based on the D2M FIFO FULL bit in the MODEM STATUS register.  
8.4.4 SPI Interfaced FOUNDATION Fieldbus or PROFIBUS PA  
FOUNDATION Fieldbus and PROFIBUS PA are half-duplex communication protocols, where only the encoder or  
decoder are active at any time and the DAC874xH arbitrates over which path is active. When interfacing the  
FOUNDATION Fieldbus or PROFIBUS PA encoder via SPI interface, data are placed in transmit and receive  
FIFOs that are each 16-bytes deep to buffer all data.  
When receiving data, the decoder expects a preamble byte(s) and a start delimiter byte, followed by the data  
bytes for the packet, and concluded with a stop delimiter byte. All of these bytes are placed into the RECEIVE  
FIFO where bits 7:0 represent the data, and bit 8 is used as a special bit to indicate the start of a packet, with  
data 0x014D, the end of a packet, with data 0x0126, or a half-bit slip, with data 0x0100. If a half-bit slip occurs,  
discard the packet. A timer is not necessary to detect the end of receiving a packet in SPI mode because the  
stop delimiter is included in the RECEIVE FIFO data.  
In order to prevent RECEIVE FIFO overflow, alarms are available to watch a threshold of the FIFO or when the  
FIFO is full. If the FIFO is full it is possible for data to be lost. This is achieved by programming the FIFO LEVEL  
SET register (bits 7:4) to the desired threshold value from 1-15, if a full FIFO (level 16 threshold) is desired the  
M2D FIFO FULL alarm can be used instead. If the M2D FIFO LEVEL bit (bit 7) in the MODEM IRQ MASK  
register is set to 0, the IRQ pin will toggle and the MODEM STATUS register should be read to determine the  
source of the interrupt. Receive data can then be read from the RECEIVE FIFO by issuing an SPI read  
command.  
The encoder begins to send data by sending the preamble byte(s) followed by a start delimiter when the  
TRANSMIT FIFO is not empty and the device is not receiving data. The number of preamble bytes used in the  
packet is controlled by the PAFF PREAMBLE bits (bits14:12) in the MODEM CONTROL REGISTER. The  
polarity of the Manchester encoded data can also be programmed by the PAFF POLARITY bit (bit 15) in the  
MODEM CONTROL REGISTER. After transmitting the preamble byte(s) and start delimiter, the encoder begins  
taking data from the TRANSMIT FIFO.  
During transmission, the SPI controller must take care to make sure that the TRANSMIT FIFO does not become  
empty before the packet is complete. When the TRANSMIT FIFO is empty a stop delimiter is placed on the bus.  
The level of the transmit FIFO may be monitored in order to avoid buffer overflow. This monitoring can be done  
either by watching for a buffer full or buffer threshold event. To monitor by a FIFO level threshold, program the  
FIFO LEVEL SET register (bits 3:0) to the desired threshold value from 1-15. If the D2M FIFO LEVEL bit (bit 4)  
in the MODEM IRQ MASK register is set to a 0, the IRQ pin toggles. Similarly, an alarm can be triggered based  
on the D2M FIFO FULL bit in the MODEM STATUS register.  
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The Jabber Inhibitor threshold is programmed by the PAFF_JABBER register (address 0x27). The 8-bit value  
programmed in this register is used to calculate the threshold using 公式 2. When the timeout triggers, the  
JAB_ON bit in the STATUS register is taken high, and transmission is blocked for the 3-second timeout period.  
The JAB_OFF bit goes high when the timeout period has expired. Both JAB_ON and JAB_OFF bits trigger and  
IRQ event, meaning the IRQ pin is triggered for both events.  
TimeOut = JABBER_TIMEOUT × 2.048 ms  
(2)  
8.4.5 Digital Interface  
8.4.5.1 UART  
The behavior of the UART interface changes based on whether the device is operating in HART mode or in  
FOUNDATION Fieldbus and PROFIBUS PA mode.  
In HART mode, the device expects 1 start bit, 8 data bits, 1 odd parity bit, and 1 stop bit or an 8O1 UART  
character format. The transmit path of the device acts as a direct feedthrough of the UART input to the HART  
FSK output, therefore the UART baud rate from the host controller must be 1200 Hz ±1% as required by the  
HART standard. The receive path of the device will also operate at 1200 Hz ±1%.  
In FOUNDATION Fieldbus and PROFIBUS PA mode the UART interface expects 1 start bit, 8 data bits, no parity  
bit, and 1 stop bit or an 8N1 UART character format. In this mode the UART interfaces transmit and receive  
FIFOs so the baud rate is not required to match the 31.25 kHz baud used by FOUNDATION Fieldbus and  
PROFIBUS PA. In this mode the expected transmit and receive UART baud is 57.6 Hz ±2.5%.  
8.4.5.1.1 UART Carrier Detect  
The behavior of the carrier detect or CD pin changes depending on whether the device is in HART mode or  
FOUNDATION Fieldbus and PROFIBUS PA mode.  
In HART mode the pin operates as a carrier detect pin. When a valid carrier is detected and the modem is  
receiving data the CD pin is taken high. When the CD pin is high, UART data sent to the device and the request  
to send, or RTS, pin will be ignored until the carrier is no longer present.  
In FOUNDATION Fieldbus and PROFIBUS PA the CD pin operates as a carrier detect pin when not in transmit  
mode. When the CD pin is high, UART data sent to the device are ignored until the carrier is no longer present.  
When in transmit mode the CD pin functions as an alarm indicator that the jabber inhibitor has triggered and  
further UART transmission data are ignored. In general, if the CD pin is high, the host controller should not be  
sending transmit data to the device.  
8.4.5.2 SPI  
The SPI interface can operate on SCLK speeds up to 12.5 MHz, but the frame-rate must be greater than 2442  
ns in HART mode and 3000 ns in FOUNDATION Fieldbus and PROFIBUS PA mode. Frames must contain at  
least 24-bits without CRC enabled and 32-bits with CRC enabled. The data within the frame are right justified,  
meaning that upon the rising edge of CS the right-most, or last, 24-bits or 32-bits are evaluated as the input data  
word. Two modes of SPI are supported by the interface: clock polarity 0 and clock phase 1, or clock polarity 1  
and clock phase 0.  
The SDO pin will output data on the rising edge of SCLK or the falling edge of CS. SDO will always provide  
information from the previous frame, if the previous frame was a read then the output data will be the requested  
data. If the previous write was a command or register write, that data will be repeated. This allows a method for  
the user to verify what was written to the device. If CRC is enabled and write data is being repeated on SDO, the  
CRC provided during the previous frame will be output – not a newly calculated CRC.  
The SPI frame structure is shown in 6. The frame includes a read/write bit, followed by a 7-bit address, then  
16-bit write data for a write frame or don’t care bits for a read frame. If CRC is enabled, an additional 8-bits are  
placed at the end of the frame containing the CRC word.  
6. SPI Frame Structure  
R/W FRAME  
Write Frame  
Read Frame  
D23  
0
D22:16  
D15:0  
Write Data  
X
7-Bit Address  
7-Bit Address  
1
22  
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8.4.5.2.1 SPI Cyclic Redundancy Check  
The SPI interface includes an optional CRC mode to enhance the reliability of the interface by blocking  
erroneous commands sent to the device due to noise or other errors sources. When writing to or reading from  
the device the last 8-bits in the frame contain the CRC word which is calculated based on the polynomial x8 + x2  
+ x + 1. If a bad CRC word is included in a write-frame to the device, the frame will be ignored. When reading  
from the device, the host controller should check the CRC word to validate the frame.  
Read commands with a bad CRC value will output 0x80000000 and, in the case of a receive FIFO read, prevent  
data from leaving the FIFO and subsequently being lost.  
8.4.5.2.2 SPI Interrupt Request  
SPI interfaced devices include an interrupt request, or IRQ, pin to communicate the occurrence of a variety of  
events to the host controller. The behavior of the IRQ pin is controlled by the CONTROL register and MODEM  
IRQ MASK register.  
The CONTROL register allows the host controller to configure the IRQ pin as level sensitive or edge sensitive via  
the IRQ LEVEL bit (bit 2). For both level sensitive and edge sensitive modes, the polarity of the IRQ pin can be  
set via the IRQ POLARITY bit (bit 3) in the CONTROL register.  
The MODEM IRQ MASK register allows the controller to decide which events are able to trigger the IRQ pin to  
toggle. If a logic 0 is written to the respective bit, that event is allowed to toggle the IRQ pin. If a logic 1 is written  
to the respective bit, the event is masked from the IRQ pin.  
When an event occurs the IRQ pin signal, in the case of level-sensitive configurations, is latched and the IRQ pin  
voltage stays at logic high until the status has been reset, or cleared, by reading the contents of the  
MODEM_STATUS register. In the case of edge-sensitive configurations a pulse is generated any time a new  
event is detected.  
8.5 Register Maps  
Table 7 lists the memory-mapped registers for the DAC8741H. All register offset addresses not listed in Table 7  
should be considered as reserved locations and the register contents should not be modified.  
Table 7. DAC8741H Registers  
Offset  
2h  
Acronym  
Register Name  
Section  
Go  
CONTROL  
CONTROL register  
7h  
RESET  
RESET register  
Go  
20h  
21h  
22h  
23h  
24h  
25h  
27h  
MODEM_STATUS  
MODEM_IRQ_MASK  
MODEM_CONTROL  
FIFO_D2M  
MODEM STATUS register  
MODEM IRQ MASK register  
MODEM CONTROL register  
FIFO D2M register  
Go  
Go  
Go  
Go  
FIFO_M2D  
FIFO M2D register  
Go  
FIFO_LEVEL_SET  
PAFF_JABBER  
FIFO LEVEL SET register  
PAFF JABBER register  
Go  
Go  
Complex bit access types are encoded to fit into small table cells. Table 8 shows the codes that are used for  
access types in this section.  
Table 8. DAC8741H Access Type Codes  
Access Type  
Read Type  
R
Code  
Description  
R
Read  
Write Type  
W
W
Write  
Reset or Default Value  
-n  
Value after reset or the default  
value  
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8.5.1 CONTROL Register (Offset = 2h) [reset = 0x8042]  
This register controls the SPI watchdog timer, internal reference, CRC mode, IRQ pin behavior, and SDO pin  
behavior.  
CONTROL is shown in Figure 23 and described in Table 9.  
Return to Summary Table.  
Figure 23. CONTROL Register  
15  
14  
13  
12  
11  
10  
9
8
WDTO  
R/W  
WDT  
R/W  
RESERVED  
R
7
RESERVED  
R
6
5
RESERVED  
R
4
3
2
1
0
PDVREF  
R/W  
CRC_EN  
R/W  
IRQ_POL  
R/W  
IRQ_LEVEL  
R/W  
SDO_Z  
R/W  
SDO_B  
R/W  
Table 9. CONTROL Register Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
SPI Watchdog Timer (based on 3.6864-MHz clock)  
15-13  
WDTO  
R/W  
100  
D15  
0
D14  
0
D13  
0
Timeout Period  
50 ms  
100 ms  
0
0
1
0
1
0
500 ms  
0
1
1
1 second  
1
0
0
2 seconds (default)  
3 seconds  
4 seconds  
5 seconds  
1
0
1
1
1
0
1
1
1
12  
WDT  
R/W  
0
0 = SPI Watchdog Timer Disabled (default)  
1 = SPI Watchdog Timer Enabled  
11-7  
6
RESERVED  
PDVREF  
R
00000  
1
Reserved  
R/W  
This bit is only functional if the hardware reference enabled is  
enabled.  
0 = Internal reference is powered down  
1 = Internal reference is powered up (default)  
5
4
RESERVED  
CRC_EN  
R
0
0
Reserved  
R/W  
0 = No CRC (default)  
1 = CRC is enabled  
3
2
1
0
IRQ_POL  
IRQ_LEVEL  
SDO_Z  
R/W  
R/W  
R/W  
R/W  
0
0
1
0
0 = IRQ is active low (default)  
1 = IRQ is active high  
0 = IRQ creates a pulse for edge sensitivity (default)  
1 = IRQ asserts to a level until MODEM STATUS is read  
0 = SDO will be driven during writes and read requests  
1 = SDO will be HiZ during writes requests (default)  
SDO_B  
0 = SDO will remain filled from last frame (default)  
1 = SDO will clear with the beginning of each frame  
24  
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8.5.2 RESET Register (Offset = 7h) [reset = 0x0000]  
Writing 0x0001 to this register will reset all registers to their default values and the FIFOs will be emptied.  
RESET is shown in Figure 24 and described in Table 10.  
Return to Summary Table.  
Figure 24. RESET Register  
15  
7
14  
6
13  
5
12  
11  
3
10  
2
9
1
8
RESERVED  
R
4
RESERVED  
R
0
RST  
R/W  
Table 10. RESET Register Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
15-1  
RESERVED  
R/W  
000000000 Reserved  
000000  
0
RST  
W
0
Writing a 1 to this bit triggers a software reset.  
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8.5.3 MODEM_STATUS Register (Offset = 20h) [reset = 0x0000]  
The modem status register is a read/write register. When an event occurs, the corresponding bit to indicate that  
event is set to a logic 1 in this register. The status bits are sticky, meaning they are not cleared unless a 1 is  
written to the corresponding bit position, except for carrier detect, or CD, which responds based on the  
presences of a carrier, the FIFO level registers, which respond based on the conditions of the FIFOs, and  
JAB_OFF and JAB_ON which represent the current status of the jabber inibhior. CTS will assert after RTS is set  
and no carrier is present if not operating in full-duplex mode.  
MODEM_STATUS is shown in Figure 25 and described in Table 11.  
Return to Summary Table.  
Figure 25. MODEM_STATUS Register  
15  
14  
13  
12  
11  
10  
9
8
RST  
R/W  
JAB_OFF  
R/W  
JAB_ON  
R/W  
GAP  
R/W  
FRAME  
R/W  
PARITY  
R/W  
WDT  
R/W  
CRC  
R/W  
7
6
5
FIFO_M2D EMPTY  
R/W  
4
3
2
FIFO_D2M EMPTY  
R/W  
1
CD  
R
0
CTS  
R
FIFO_M2D LEVEL  
R/W  
FIFO_M2D FULL  
R/W  
FIFO_D2M LEVEL  
R/W  
FIFO_D2M FULL  
R/W  
Table 11. MODEM_STATUS Register Field Descriptions  
Bit  
15  
14  
Field  
RST  
Type  
R/W  
R/W  
Reset  
Description  
0
0
A reset has occurred  
JAB_OFF  
This bit goes high when the jabber inhibitor timeout period has  
expired  
13  
12  
11  
10  
9
JAB_ON  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
This bit goes high when the jabber inhibitor has been triggered  
A gap error in HART mode  
GAP  
FRAME  
A frame error in HART mode or a 1/2-bit slip in FF/PA mode  
A Parity error in HART mode  
PARITY  
WDT  
The watchdog timer has expired  
8
CRC  
An incorrect CRC word was provided in a read or write command  
The receive FIFO is at the programmed level  
The receive FIFO is full  
7
FIFO_M2D_LEVEL  
FIFO_M2D_FULL  
FIFO_M2D_EMPTY  
FIFO_D2M_LEVEL  
FIFO_D2M_FULL  
FIFO_D2M_EMPTY  
CD  
6
5
The receive FIFO is empty  
4
The transmit FIFO is at the programmed level  
The transmit FIFO is full  
3
2
The transmit FIFO is empty  
1
In HART mode, a valid carrier has been detected  
0
CTS  
R
In HART mode, the modem is cleared to send data and the  
modulator is active  
26  
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8.5.4 MODEM_IRQ_MASK Register (Offset = 21h) [reset = 0x0024]  
This register controls which MODEM STATUS events are allowed to trigger an interrupt on the IRQ pin. A 0 in  
the respective bit position allows the interrupt event to toggle the IRQ pin. A 1 in the respective bit position blocks  
the interrupt event from toggling the IRQ pin, but the event can still be detected by reading the MODEM STATUS  
register.  
MODEM_IRQ_MASK is shown in Figure 26 and described in Table 12.  
Return to Summary Table.  
Figure 26. MODEM_IRQ_MASK Register  
15  
RESERVED  
R
14  
13  
12  
11  
10  
9
8
JAB_OFF  
R/W  
JAB_ON  
R/W  
GAP  
R/W  
FRAME  
R/W  
PARITY  
R/W  
WDT  
R/W  
CRC  
R/W  
7
6
5
FIFO_M2D EMPTY  
R/W  
4
3
2
FIFO_D2M EMPTY  
R/W  
1
0
FIFO_M2D LEVEL  
R/W  
FIFO_M2D FULL  
R/W  
FIFO_D2M LEVEL  
R/W  
FIFO_D2M FULL  
R/W  
CD  
R/W  
CTS  
R/W  
Table 12. MODEM_IRQ_MASK Register Field Descriptions  
Bit  
15  
14  
Field  
Type  
R/W  
R/W  
Reset  
Description  
RESERVED  
JAB_OFF  
0
0
Reserved  
Writing a 1 to this bit blocks the JAB_OFF event from triggering the  
IRQ pin  
13  
12  
11  
10  
9
JAB_ON  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
0
0
0
0
0
0
0
0
1
0
0
1
Writing a 1 to this bit blocks the JAB_ON event from triggering the  
IRQ pin  
GAP  
Writing a 1 to this bit blocks the GAP event from triggering the IRQ  
pin  
FRAME  
Writing a 1 to this bit blocks the FRAME event from triggering the  
IRQ pin  
PARITY  
Writing a 1 to this bit blocks the PARITY event from triggering the  
IRQ pin  
WDT  
Writing a 1 to this bit blocks the WDT event from triggering the IRQ  
pin  
8
CRC  
Writing a 1 to this bit blocks the CRC event from triggering the IRQ  
pin  
7
FIFO_M2D_LEVEL  
FIFO_M2D_FULL  
FIFO_M2D_EMPTY  
FIFO_D2M_LEVEL  
FIFO_D2M_FULL  
FIFO_D2M_EMPTY  
Writing a 1 to this bit blocks the FIFO_M2D_LEVEL event from  
triggering the IRQ pin  
6
Writing a 1 to this bit blocks the FIFO_M2D_FULL event from  
triggering the IRQ pin  
5
Writing a 1 to this bit blocks the FIFO_M2D_EMPTY event from  
triggering the IRQ pin  
4
Writing a 1 to this bit blocks the FIFO_D2M_LEVEL event from  
triggering the IRQ pin  
3
Writing a 1 to this bit blocks the FIFO_D2M_FULL event from  
triggering the IRQ pin  
2
Writing a 1 to this bit blocks the FIFO_D2M_EMPTY event from  
triggering the IRQ pin  
1
0
CD  
R/W  
R/W  
0
0
Writing a 1 to this bit blocks the CD event from triggering the IRQ pin  
CTS  
Writing a 1 to this bit blocks the CTS event from triggering the IRQ  
pin  
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8.5.5 MODEM_CONTROL Register (Offset = 22h) [reset = 0x0048]  
This register controls various modem features including: FF/PA Manchester data polarity, number of FF/PA  
preamble bits, analog output amplitude, modem enable, duplex mode, and request to send.  
MODEM_CONTROL is shown in Figure 27 and described in Table 13.  
Return to Summary Table.  
Figure 27. MODEM_CONTROL Register  
15  
FFPA_POL  
R/W  
14  
6
13  
FFPA_PREAMBLE  
R/W  
12  
11  
10  
RESERVED  
R
9
8
TX_AMP  
R/W  
7
5
4
3
2
1
RESERVED  
R
0
TX_AMP  
R/W  
MOD_EN  
R/W  
DUP_EN  
R/W  
RTS  
R/W  
Table 13. MODEM_CONTROL Register Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
15  
FFPA_POL  
R/W  
0
Sets the transmitted polarity of the Manchester encoded data  
0 = Logical 1 is transmitted as a transition from high-to-low (default)  
1 = Logical 1 is transmitted as a transition from low-to-high  
14-12  
FFPA_PREAMBLE  
R/W  
0
Number of preamble bytes sent is the value programmed in this  
register plus 1  
11-9  
8-4  
RESERVED  
TX_AMP  
R
0
Reserved  
R/W  
00100  
Unsigned binary value that controls the amplitude (HART mode only)  
of the transmitted waveform in 25-mVPP steps. Default value 00100  
for 500-mVPP output amplitude. Amplitude may vary from 400 mVPP  
to 800 mVPP  
.
3
2
MOD_EN  
DUP_EN  
R/W  
R/W  
1
0
0 = Disables TX/RX of the modem  
1 = Enables TX/RX of the modem (default)  
0 – TX FIFO is not connected to RX FIFO (default)  
1 = Connects TX FIFO to RX FIFO  
1
0
RESERVED  
RTS  
R
0
0
Reserved  
R/W  
0 = No active request to send in HART mode (default)  
1 = Active request to send in HART mode  
28  
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8.5.6 FIFO_D2M Register (Offset = 23h) [reset = 0x0200]  
This register interfaces the FIFO that transmits data from the digital interface to the modem.  
FIFO_D2M is shown in Figure 28 and described in Table 14.  
Return to Summary Table.  
Figure 28. FIFO_D2M Register  
15  
7
14  
6
13  
5
12  
11  
LEVEL_FLAG  
R
10  
FULL_FLAG  
R
9
8
PARITY_BIT  
W
FIFO_LEVEL  
R
EMPTY_FLAG  
R
4
3
2
1
0
DATA  
W
Table 14. FIFO_D2M Register Field Descriptions  
Bit  
Field  
Type  
R
Reset  
Description  
Reads back the current level of the FIFO, read only  
15-12  
11  
10  
9
FIFO_LEVEL  
LEVEL_FLAG  
FULL_FLAG  
EMPTY_FLAG  
PARITY_BIT  
DATA  
0
0
0
1
0
0
R
Indicates the programmed level has been reached, read only  
Indicates the FIFO is full, read only  
R
R
Indicates the FIFO is empty, read only  
8
W
W
Odd parity for 8-bit data read on bus, write only  
Data transmitted from the digital interface to the modem, write only  
7-0  
8.5.7 FIFO_M2D Register (Offset = 24h) [reset = 0x0200]  
This register interfaces the FIFO that receives data from the modem to the digital interface. This register is read  
only  
FIFO_M2D is shown in Figure 29 and described in Table 15.  
Return to Summary Table.  
Figure 29. FIFO_M2D Register  
15  
7
14  
6
13  
5
12  
11  
LEVEL_FLAG  
R
10  
FULL_FLAG  
R
9
8
PARITY_BIT  
R
FIFO_LEVEL  
R
EMPTY_FLAG  
R
4
3
2
1
0
DATA  
R
Table 15. FIFO_M2D Register Field Descriptions  
Bit  
Field  
Type  
R
Reset  
Description  
Reads back the current level of the FIFO, read only  
15-12  
11  
10  
9
FIFO_LEVEL  
LEVEL_FLAG  
FULL_FLAG  
EMPTY_FLAG  
PARITY_BIT  
DATA  
0
0
0
1
0
0
R
Indicates the programmed level has been reached, read only  
Indicates the FIFO is full, read only  
R
R
Indicates the FIFO is empty, read only  
8
R
Odd parity for 8-bit data read on bus, read only  
Data transmitted from the modem to the digital interface, read only  
7-0  
R
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8.5.8 FIFO_LEVEL_SET Register (Offset = 25h) [reset = 0x0000]  
This register programs the alarm threshold for both transmit and receive FIFOs. Each bit field allows for the FIFO  
alarm threshold to be programmed to integer values from 1-15.  
FIFO_LEVEL_SET is shown in Figure 30 and described in Table 16.  
Return to Summary Table.  
Figure 30. FIFO_LEVEL_SET Register  
15  
7
14  
6
13  
5
12  
11  
10  
2
9
1
8
0
RESERVED  
R
4
3
M2D_LEVEL  
R/W  
D2M_LEVEL  
R/W  
Table 16. FIFO_LEVEL_SET Register Field Descriptions  
Bit  
Field  
Type  
R
Reset  
Description  
15-8  
7-4  
RESERVED  
M2D_LEVEL  
00000000  
0000  
Reserved  
R/W  
The binary value in this register sets the modulator FIFO alarm  
threshold  
3-0  
D2M_LEVEL  
R/W  
0000  
The binary value in this register sets the demodulator FIFO alarm  
threshold  
8.5.9 PAFF_JABBER Register (Offset = 27h) [reset = 0x0000]  
This register controls the jabber inhibitor time-out behavior. The time-out can be calculated using the equation in  
Table 17, with PAFF_JABBER in decimal format.  
PAFF_JABBER is shown in Figure 31 and described in Table 17.  
Return to Summary Table.  
Figure 31. PAFF_JABBER Register  
15  
7
14  
6
13  
5
12  
11  
10  
2
9
1
8
0
RESERVED  
R
4
3
PAFF_JABBER  
R/W  
Table 17. PAFF_JABBER Register Field Descriptions  
Bit  
Field  
Type  
R
Reset  
Description  
15-8  
7-0  
RESERVED  
00000000  
00000000  
Reserved  
PAFF_JABBER  
R/W  
TimeOut = JABBER_TIMEOUT * 2.048 ms  
30  
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9 Application and Implementation  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
9.1 Application Information  
The DAC874xH family of devices integrates modem functionality for several largely used Industrial protocols:  
Highway Addressable Remote Transducer (HART), FOUNDATION Fieldbus (FF), and PROFIBUS (PA). The  
different modes are set via the CLK_CFGx pins of the device that allow the device to either enter HART or PAFF  
mode. In HART mode, a 1200-Hz/2200-Hz HART FSK Signal is modulated and demodulated, while the PAFF  
mode communicates thorugh a 31.25 Kbit/s Manchester coded/encoded signal. The small package sizes, wide  
temperature range and low quiescent current make this device an excellent choice for applications in industrial  
process control and automation.  
9.1.1 Design Recommendations  
Local power supply decoupling is recommended by placing 10-µF capacitors on the IOVDD and AVDD supply  
lines, and 0.1-µF capacitors close to the DAC874XH supply pins. Ceramic capacitor types such as C0G or X7R  
are recommended for its optimal performance across temperature, and very low dissipation factor. DC bias  
characteristics of the capacitors should also be considered when selecting passive components, such as the  
voltage rating and equivalent series resistance (ESR).  
9.1.2 Selecting the Crystal or Resonator  
Both communication modes, HART and PAFF, require different clocking frequencies for correct operation:  
HART – 1.2288 MHz or 3.686 MHz, PAFF – 4 MHz. In addition to selecting the communication mode, the  
CLK_CFGx and XEN pins also select whether an internal oscillator or external clock source is configured for  
device operation. The configuration table is explained in 2. Accuracy over the applications temperature range  
should be considered when selecting the external crystal or resonator. Furthermore, crystals with a low drift  
specification over the desired application temperature range should also be selected when using the DAC874xH  
devices in HART, FOUNDATION Fieldbus, and PROFIBUS PA applications as communication timing is critical.  
In order to reduce quiescent current consumption, the XTAL nets should be optimized during layout to reduce  
any length that may increase net capacitance. This increase in capacitance is directly proportion to current  
consumption.  
9.1.3 Included Functions and Filter Selection  
As a highly integrated device, the DAC874xH not only includes the modulation and demodulation capabilities for  
the previously described industrial protocols, but also includes an internal reference, and integrated receive  
bandpass filter, with other aforementioned functions. In HART mode, an internal amplifier provides high output  
drive capability, and can drive a wide range of purely capacitive loads, ranging from 5 nF to 22 nF. Load  
conditions within this range maintain output stability. Two different filter configurations, external and internal, are  
achievable through the BPF_EN digital input -- logic high on this pin enables the internal bandpass filter. The  
external filter configuration is shown in 32. The example provided displays the DAC874XH device configured  
with an external reference and external bandpass filter.  
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Application Information (接下页)  
HART_OUT  
4700pF  
0.022µF  
DAC8740H  
14  
AGND  
MOD_OUT  
EXT REF  
16  
MOD_IN  
17  
MOD_INF  
1
XEN  
X1  
IOVDD  
1.00M  
1.50M  
21  
20  
13  
HART_IN  
150k  
300pF  
X2  
150pF  
AGND  
REG_CAP  
19  
12  
22  
AGND  
AGND  
DGND  
DGND  
1µF  
25  
AGND  
PAD  
AGND  
32. HART Mode: DAC874XH Passive Selection For External Bandpass Filter and External Reference  
The second configuration, which can reduce costs associated with PCB development and BOM component  
counts, additionally aids in the optimization of board space. This optimization gives the user flexibility into  
achieving industrial applications with smaller form factor sizes. The internal filter configuration, with correct  
MOD_IN, MOD_INF, and MOD_OUT connections, is shown in 33.  
HART_OUT  
4700pF  
0.022µF  
DAC8740H  
14  
AGND  
MOD_OUT  
16  
HART_IN  
MOD_IN  
MOD_INF  
17  
2200pF  
680pF  
1
XEN  
X1  
IOVDD  
21  
20  
13  
X2  
AGND  
REF  
REG_CAP  
19  
12  
22  
AGND  
DGND  
DGND  
1µF  
25  
AGND  
PAD  
AGND  
33. HART Mode: DAC874xH Passive Selection For Internal Filter  
32  
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9.2 Typical Application  
The application schematic shown in 34 is described in the following sections.  
C1  
C4  
0.022 µF  
4700pF  
IOVDD  
AVDD  
DAC8740H  
C5  
0.1 µF  
U2  
AVDD  
R1  
1.00M  
C6  
0.1 µF  
18  
11  
14  
AGND  
MOD_OUT  
AGND  
C7  
IOVDD  
16  
17  
MOD_IN  
MOD_INF  
AGND  
5
6
7
9
RST  
CD  
UART_IN  
DUPLEX  
/RST  
2200pF  
CD  
UART_IN  
1
TP5  
XEN  
X1  
IOVDD  
C8  
680pF  
21  
10  
8
UART_OUT  
UART_RTS  
UART_OUT  
/UART_RTS  
AGND  
20  
13  
X2  
AGND  
TP6  
2
3
4
CLKO  
CLK_CFG0  
CLK_CFG1  
5V  
REG_CAP  
U1  
VIN  
C9  
1µF  
19  
12  
22  
AGND  
DGND  
DGND  
1
2
5
AGND  
IOVDD  
23  
24  
VOUT  
REF_EN  
BPF_EN  
C2  
1µF  
C3  
10µF  
1.5V_REF  
15  
25  
AGND  
REF  
PAD  
3
4
Vref  
GND  
GND  
C10  
0.1 µF  
DAC8740HRGE  
AGND  
NC  
AGND  
R2  
100k  
AGND  
TPS7B6933QDBVRQ1  
AGND  
AGND  
24V  
5V  
FB1  
R3  
2.4k  
5V  
C11  
0.1 µF  
600 ohm  
C12  
0.1 µF  
U3A  
OPA335AIDR  
R4  
49.9k  
AGND  
6
AGND  
6
U4  
VDD  
2
Q1  
FCX690BTA  
R5  
R6  
14.3k  
LM4132AMF-4.1  
3
2
R7  
AGND  
8
3
1
3
1
TP1  
11.3k  
VOUT  
5V  
U5  
IN  
4.096V_non_buffer  
5
Vref  
U6A  
OPA333AID  
TP2  
10.0  
4
3
VREF  
VREF  
C13  
0.012 µF  
C14  
300pF  
C15  
1000pF  
C16  
C17  
1µF  
C18  
0.1 µF  
1
C19  
4.7 µF  
5
6
4
2
7
J1  
EN  
NC  
SCLK  
SDI  
CS  
AGND  
DGND  
SCLK  
SDI  
/CS  
R8  
60.4  
5V  
2
1
GND  
AGND  
0.1 µF  
2
1
D1  
-
+
AGND  
CDSOD323-T36SC  
R9  
1.80k  
AGND  
AGND  
AGND  
AGND  
D2  
40V  
ED555/2DS  
IOVDD  
DAC8830IBDR  
R19  
1.00M  
AGND  
R10  
10.0  
AGND  
AGND  
C20  
1000pF  
R11  
180  
R12  
10.0  
24V  
U7A  
5V  
R13  
200  
8
5
1
2
IN  
OUT  
FB  
TP3  
R14  
107k  
FB2  
C21  
1µF  
C22  
0.01 µF  
C23  
10µF  
TP4  
EN  
600 ohm  
EP GND  
AGND  
AGND  
R15  
32.8k  
AGND  
TPS7A4101DGNR  
Copyright © 2017, Texas Instruments Incorporated  
AGND  
34. 2-Wire Transmitter With DAC8740H HART Modem Design Schematic  
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9.2.1 Design Requirements  
The application presented in 34 represents a loop-powered, 2-wire, smart 4-mA to 20-mA transmitter that  
commonly resides in factory control and industrial automation sectors. In this application, the DAC8740H enables  
a smart interface by providing HART communication, which is responsible for modulating two-way digital  
information that encapsulate a wide variety of data, including device/sensor information, calibration data, and  
system diagnostic information. This circuit has been successfully HART certification and registered with the  
FieldComm Group.  
9.2.2 Detailed Design Procedure  
9.2.2.1 DAC8740H HART Modem  
In this design, the DAC8740H internal reference and band-pass filter was chosen to optimize board area,  
consequently reducing form factor and cost. X7R, 10% accurate, bypass capacitances of 1-µF and 0.1-µF values  
were chosen for the reference and supplies, respectively.  
The DAC8740H device interfaces with the MSP430FR5969, or other similar host controller, through a standard  
UART interface. The DAC8740H digital pins connected through this interface include UART_RTS, UART_OUT  
(TX), UART_IN (RX), and CD.  
The remaining portion of the schematic includes other TI devices that aid in the realization of a highly accurate 4-  
mA to 20-mA, 2-wire transmitter. This combination of circuitry is an excellent choice for remote signal  
conditioning of a wide variety of sensors and transducers, including thermocouples, RTDs, thermistors, and strain  
gauge bridges.  
The two-wire transmitter is powered from an external DC power supply that is connected via the two BUS supply  
lines. The transmitter communicates by sourcing a 4-mA to 20-mA current through the connected bus, and back  
to the central host, which is typically a PLC analog input module. This expressed range of 4 mA to 20 mA is  
typically employed to adhere to industry standard, and makes sure that the transmitter receives a minimum of 4  
mA for correct powered operation.  
Vref  
R2  
100k  
VREF/(R2+R3)  
VHART/(R4)  
R3  
2.4k  
R4  
49.9k  
V+  
VDAC/(R5+R6)  
R5  
R6  
14.3k  
R7  
11.3k  
DAC8830  
10.0  
A1  
A2  
C13  
0.012  
µ F  
R8  
60.4  
ILOOP  
R9  
1.80k  
Iq  
R10  
10.0  
1000pF  
I1  
I2  
C20  
R11  
180  
R12  
10.0  
V-  
35. Simplified Schematic of the 2-Wire Current Loop  
34  
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ZHCSH77D JUNE 2017REVISED MAY 2019  
9.2.2.2 2-Wire Current Loop  
The A2 op amp employs negative feedback to drive the potential at both input nodes, V+ and V–, to the same  
voltage. This establishes the set of KCL equations (1) – assuming no HART communication, VHART = 0 V.  
I1 = VDAC / (25.6 kΩ) + VREF / (102.4 kΩ)  
(3)  
A2 also drives the base of the NPN BJT, Q1, which enables current to flow from its collector through emitter pins  
and through the R8 resistor, while maintaining an equivalent potential drop from its input nodes to the net  
represented by TP4. This configuration drives the combined voltage drop across R9 and R11 to the same  
voltage drop across R10 and R12.  
Using this relationship, along with current 公式 3 and 公式 4, IOUT is calculated as follows:  
I2 = I1 * (1.80 kΩ + 180) / (10 + 10) = I1 * (1.980 kΩ / 20) = I1 * 99  
(4)  
(5)  
IOUT = I1 + I2 = [VDAC / (25.6 kΩ) + VREF / (102.4 kΩ)] + I1 * 99 = [VDAC / (25.6 kΩ) + VREF / (102.4 kΩ)] * (100)  
For a VREF value of 4.096 V, the zero-scale portion of the transfer function, [VREF / (102.4 kΩ)] * (100),  
translates to 4 mA, while the span, [VDAC / (25.6 kΩ)] * 100, encompasses 16 mA. This final product is a system  
capable of sourcing 4 mA to 20 mA, which is dependent on DAC output voltage. The value of R4 is responsible  
for converting the 500-mVPP HART signal into a 1-mA  
of the 4-mA to 20-mA analog current signal.  
frequency shift keyed (FSK) signal that resides on top  
PP  
9.2.2.3 Regulator  
The primary supply for the transmitter is the TPS7A4101 device, which is a 50-V input, 50-mA Single output low-  
dropout linear regulator with very low quiescent current, 25 µA. The device supplies a well-regulated voltage rail  
(1% accuracy), operating within an extended temperature range of –40°C to +125°C, and also withstands and  
maintains regulation during very high and fast voltage transients. In this design the LDO converts the external  
supply to a 5-V rail that is used by the DAC8830, LM4132 and OPA333/OPA335. The 200-Ω resistor that  
separates the loop supply from the LDO acts as a current limiting resistor at startup and additionally improves the  
overall receiver impedance of the design.  
Generally, series references are preferred over shunt references because of their lower power consumption; in  
this case the LM4132 exhibits a maximum of 60-µA quiescent current. Moreover, the device has an initial  
accuracy of 0.05% with a specified temperature coefficient of 10 ppm/°C or less, and is capable of operating with  
these metrics at an extended temperature range of –40°C to +125°C.  
In order to generate a 3.3-V supply for the DAC8740H, the TPS7B6933-Q1, a low-dropout linear regulator with  
low quiescent current, is incorporated into the design. This LDO is capable of operating over a wide temperature  
range of –40°C to 125°C, while exhibiting a maximum quiescent value of 25 µA over this temperature range.  
9.2.2.4 DAC  
After sufficient bypass, this precision reference voltage is applied to the VREF pin of the DAC8830 device. An  
accurate reference along with an accurate DAC are largely responsible for the overall accuracy of the current  
loop, as any accuracy errors associated with the DAC will propagate through the rest of the signal chain and  
decrease the accuracy of the solution. In this case, the DAC8830, a 16-bit voltage-output DAC with excellent  
linearity (1 LSB INL), low glitch, low noise, and fast settling was chosen to set the base line performance of the  
design.  
9.2.2.5 Amplifiers  
Next, the voltage output is buffered with the OPA333 CMOS operation amplifier, which features near-zero drift  
over time and temperature, low quiescent current (17 µA), and single supply operation with rail-to-rail output that  
swings within 50 mV of the supply rail.  
As with the OPA333, the OPA335 was chosen due to its excellent DC accuracy specifications. These parameters  
include low input bias current, low offset voltage, and high CMRR/PSRR. In addition to these DC specifications,  
the OPA335 features an operating bandwidth of up to 2 MHz, which provides ample margin for HART  
communication.  
版权 © 2017–2019, Texas Instruments Incorporated  
35  
 
 
DAC8740H, DAC8741H  
ZHCSH77D JUNE 2017REVISED MAY 2019  
www.ti.com.cn  
9.2.2.6 Diodes  
For transient voltage protection, a 40-V bidirectional transient voltage suppressor (TVS) diode is placed across  
the BUS lines of the design. Certain criteria should be considered when making this diode selection, such as the  
diode’s working voltage, breakdown voltage, leakage current and power rating. In addition to these parameters,  
leakage current should also be factored into the design as it will impact the accuracy of the analog current loop.  
2-wire polarity protection is also employed by using the DSRHD10 as a diode bridge rectifier. The placement of  
this component makes sure that the current loop will always correctly operate regardless of the arrangement of  
input connections. As with other elements, consider the leakage and biasing voltages because these voltages  
affect system accuracy and compliance voltage.  
9.2.2.7 Passives  
Among the passives included in the design, the gain setting resistors should be chosen to exhibit tight tolerances  
in order to achieve high accuracy. These resistors -- R4, R5, R6, R9, R11, R10, and R12 -- are primarily  
responsible for setting the gain of the current loop, along with primary path of the output current flow. Since the  
biased transistor, Q1, is responsible for sourcing most of the output current, components in the path of this  
current flow should be chosen with appropriate power ratings. In this case R8 is a 0.25-W resistor.  
9.2.3 Application Curves  
Five hundred data points were taken on five different boards, producing the 4-mA to 20-mA transfer function  
below in 36. The total unadjusted error (TUE) of the transmitters is displayed in 37.  
36. 4-mA to 20-mA Transfer Function  
37. Total Unadjusted Error Graph of Application Circuit  
36  
版权 © 2017–2019, Texas Instruments Incorporated  
 
 
DAC8740H, DAC8741H  
www.ti.com.cn  
ZHCSH77D JUNE 2017REVISED MAY 2019  
10 Power Supply Recommendations  
The DAC874xH can operate with analog supplies from 2.7 V to 5.5 V and digital supplies from 1.71 V to 5.5 V,  
enabling interfacing host controller platforms with low voltage digital logic. For applications that are particularly  
focused on reducing power dissipation in the modem, use the lowest supply voltage available for both analog  
and digital supplies.  
11 Layout  
11.1 Layout Guidelines  
Precision designs require careful layout, the list below provides some insight into good layout practices.  
Bypass all power-supply pins to ground with a low ESR ceramic bypass capacitor. The typical recommended  
bypass capacitance is 0.1 to 1 µF ceramic with a X7R or NP0 dielectric.  
Place power supply and reference bypass capacitors close to the terminals to minimize inductance and  
optimize performance.  
A high-quality ceramic type NP0 or X7R is recommended for its optimal performance across temperature, and  
very low dissipation factor.  
The digital and analog sections should have proper placement with respect to the digital and analog  
components. The separation of analog and digital circuitry allows for better design and practice as it allows  
less coupling into neighboring blocks, and minimizes the interaction between analog and digital return  
currents.  
11.2 Layout Example  
Bypass  
Capacitor  
12  
6
1
18  
24  
Bypass  
Capacitor  
38. DAC8740H Basic Layout Example  
版权 © 2017–2019, Texas Instruments Incorporated  
37  
DAC8740H, DAC8741H  
ZHCSH77D JUNE 2017REVISED MAY 2019  
www.ti.com.cn  
Layout Example (接下页)  
39. 2-Wire Transmitter With DAC8740H HART Modem Layout - Top Layer  
40. 2-Wire Transmitter With DAC8740H HART Modem Layout - Bottom Layer  
38  
版权 © 2017–2019, Texas Instruments Incorporated  
DAC8740H, DAC8741H  
www.ti.com.cn  
ZHCSH77D JUNE 2017REVISED MAY 2019  
12 器件和文档支持  
12.1 文档支持  
12.1.1 相关文档  
请参阅如下相关文档:  
德州仪器 (TI)DAC8742H 评估模块用户指南》(适用于 DAC8740H DAC8741H)  
12.2 相关链接  
18 列出了快速访问链接。类别包括技术文档、支持与社区资源、工具与软件,以及申请样片或购买产品的快速  
链接。  
18. 相关链接  
器件  
产品文件夹  
请单击此处  
请单击此处  
立即订购  
请单击此处  
请单击此处  
技术文档  
请单击此处  
请单击此处  
工具与软件  
请单击此处  
请单击此处  
支持和社区  
请单击此处  
请单击此处  
DAC8740H  
DAC8741H  
12.3 接收文档更新通知  
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产  
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。  
12.4 社区资源  
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective  
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of  
Use.  
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help  
solve problems with fellow engineers.  
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and  
contact information for technical support.  
12.5 商标  
E2E is a trademark of Texas Instruments.  
FOUNDATION 现场总线 is a trademark of FieldComm Group.  
HART is a registered trademark of FieldComm Group.  
All other trademarks are the property of their respective owners.  
12.6 静电放电警告  
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可  
能会损坏集成电路。  
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可  
能会导致器件与其发布的规格不相符。  
12.7 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
13 机械、封装和可订购信息  
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且  
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。  
版权 © 2017–2019, Texas Instruments Incorporated  
39  
 
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
DAC8740HRGER  
DAC8740HRGET  
DAC8741HRGER  
DAC8741HRGET  
ACTIVE  
VQFN  
VQFN  
VQFN  
VQFN  
RGE  
24  
24  
24  
24  
3000 RoHS & Green  
250 RoHS & Green  
3000 RoHS & Green  
250 RoHS & Green  
NIPDAUAG  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
DAC  
8740H  
ACTIVE  
ACTIVE  
ACTIVE  
RGE  
NIPDAUAG  
NIPDAUAG  
NIPDAUAG  
DAC  
8740H  
RGE  
DAC  
8741H  
RGE  
DAC  
8741H  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
20-Apr-2023  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
K0  
P1  
W
B0  
Reel  
Diameter  
Cavity  
A0  
A0 Dimension designed to accommodate the component width  
B0 Dimension designed to accommodate the component length  
K0 Dimension designed to accommodate the component thickness  
Overall width of the carrier tape  
W
P1 Pitch between successive cavity centers  
Reel Width (W1)  
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
Sprocket Holes  
Q1 Q2  
Q3 Q4  
Q1 Q2  
Q3 Q4  
User Direction of Feed  
Pocket Quadrants  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
DAC8740HRGER  
DAC8740HRGET  
DAC8741HRGER  
DAC8741HRGET  
VQFN  
VQFN  
VQFN  
VQFN  
RGE  
RGE  
RGE  
RGE  
24  
24  
24  
24  
3000  
250  
330.0  
180.0  
330.0  
180.0  
12.4  
12.4  
12.4  
12.4  
4.25  
4.25  
4.25  
4.25  
4.25  
4.25  
4.25  
4.25  
1.15  
1.15  
1.15  
1.15  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
Q2  
Q2  
Q2  
Q2  
3000  
250  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
20-Apr-2023  
TAPE AND REEL BOX DIMENSIONS  
Width (mm)  
H
W
L
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
DAC8740HRGER  
DAC8740HRGET  
DAC8741HRGER  
DAC8741HRGET  
VQFN  
VQFN  
VQFN  
VQFN  
RGE  
RGE  
RGE  
RGE  
24  
24  
24  
24  
3000  
250  
346.0  
210.0  
346.0  
210.0  
346.0  
185.0  
346.0  
185.0  
33.0  
35.0  
33.0  
35.0  
3000  
250  
Pack Materials-Page 2  
GENERIC PACKAGE VIEW  
RGE 24  
VQFN - 1 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
Images above are just a representation of the package family, actual package may vary.  
Refer to the product data sheet for package details.  
4204104/H  
PACKAGE OUTLINE  
RGE0024F  
VQFN - 1 mm max height  
S
C
A
L
E
3
.
3
0
0
PLASTIC QUAD FLATPACK - NO LEAD  
4.1  
3.9  
B
A
PIN 1 INDEX AREA  
0.5  
0.3  
4.1  
3.9  
0.30  
0.18  
DETAIL  
OPTIONAL TERMINAL  
TYPICAL  
C
1 MAX  
SEATING PLANE  
0.08  
0.05  
0.00  
2.8 0.1  
2X 2.5  
(0.2) TYP  
12  
7
EXPOSED  
THERMAL PAD  
20X 0.5  
6
13  
2X  
25  
2.5  
1
SEE TERMINAL  
DETAIL  
18  
0.30  
24X  
0.18  
0.1  
24  
19  
PIN 1 ID  
(OPTIONAL)  
C A  
B
0.05  
0.5  
0.3  
24X  
4222437/A 12/2015  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.  
4. Reference JEDEC registration MO-220.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
RGE0024F  
VQFN - 1 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
(
2.8)  
SYMM  
24  
19  
24X (0.6)  
1
18  
24X (0.24)  
(1.15)  
TYP  
25  
SYMM  
(3.8)  
20X (0.5)  
6
13  
(
0.2) TYP  
VIA  
7
12  
(R0.05)  
ALL PAD CORNERS  
(3.8)  
LAND PATTERN EXAMPLE  
SCALE:18X  
0.05 MIN  
ALL AROUND  
0.05 MAX  
ALL AROUND  
SOLDER MASK  
OPENING  
METAL  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
NON SOLDER MASK  
SOLDER MASK  
DEFINED  
DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4222437/A 12/2015  
NOTES: (continued)  
5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature  
number SLUA271 (www.ti.com/lit/slua271).  
6. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations  
are shown.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
RGE0024F  
VQFN - 1 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
4X ( 1.23)  
(0.715) TYP  
19  
(R0.05) TYP  
24  
24X (0.6)  
25  
1
18  
24X (0.24)  
(0.715) TYP  
SYMM  
20X (0.5)  
(3.8)  
13  
6
METAL  
TYP  
7
12  
SYMM  
(3.8)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
EXPOSED PAD 25:  
77% PRINTED SOLDER COVERAGE BY AREA  
SCALE:25X  
4222437/A 12/2015  
NOTES: (continued)  
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
www.ti.com  
重要声明和免责声明  
TI“按原样提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,  
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保。  
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验  
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邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2023,德州仪器 (TI) 公司  

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