DAC8805Q [TI]
14-Bit, Dual, Parallel Input, Multiplying Digital-to-Analog Converter;
| 型号： | DAC8805Q |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 14-Bit, Dual, Parallel Input, Multiplying Digital-to-Analog Converter |
| 文件： | 总25页 (文件大小：798K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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DAC8805
SBAS391A–DECEMBER 2006–REVISED MAY 2007
14-Bit, Dual, Parallel Input, Multiplying
Digital-to-Analog Converter
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
±0.5LSB DNL
The DAC8805 dual, multiplying digital-to-analog
converter (DAC) is designed to operate from a single
2.7V to 5.5V supply.
±0.5LSB INL
Low Noise: 12nV/√Hz
The applied external reference input voltage VREF
determines the full-scale output current. An internal
Low Power: IDD = 1µA per channel at 2.7V
2mA Full-Scale Current, with VREF = 10V
Settling Time: 0.5µs
feedback resistor (RFB
)
provides temperature
tracking for the full-scale output when combined with
an external, current-to-voltage (I/V) precision
amplifier.
14-Bit Monotonic
4-Quadrant Multiplying Reference Inputs
Reference Bandwidth: 10MHz
Reference Input: ±18V
A RSTSEL pin allows system reset assertion (RS) to
force all registers to zero code when RSTSEL = '0',
or to mid-scale code when RSTSEL
=
'1'.
Reference Dynamics: –105 THD
Midscale or Zero Scale Reset
Analog Power Supply: +2.7V to +5.5V
TSSOP-38 Package
Additionally, an internal power-on reset forces all
registers to zero or mid-scale code at power-up,
depending on the state of the RSTSEL pin.
A
parallel
interface
offers
high-speed
communications. The DAC8805 is packaged in a
space-saving TSSOP-38 package and has an
industry-standard pinout. The device is specified
from –40°C to +125°C.
Industry-Standard Pin Configuration
Pin Compatible with the 16-Bit DAC8822
Temperature Range: –40°C to +125°C
For
DAC8822.
a 16-bit, pin-compatible version, see the
APPLICATIONS
•
•
•
•
Automatic Test Equipment
Instrumentation
Digitally Controlled Calibration
Industrial Control PLCs
DGND
VDD
R1A RCOM
A
VREFA ROFS
A
RFBA
R1A
R2A
ROFSA
RFBA
D0
Input A
DAC A
Parallel
Bus
D13
DAC A
DAC B
IOUT
A
Register
Register
WR
A0
Interface
AGNDA
A1
Input B
DAC B
Register
Register
IOUTB
RS
LDAC
Control
Logic
AGNDB
R1B
R2B
ROFSB
RFBB
Power-On
Reset
RSTSEL
R1B
RCOMB
VREFB ROFS
B
RFBB
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2007, Texas Instruments Incorporated
DAC8805
www.ti.com
SBAS391A–DECEMBER 2006–REVISED MAY 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION(1)
RELATIVE
ACCURACY
(LSB)
DIFFERENTIAL
NONLINEARITY
(LSB)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE-LEAD
(DESIGNATOR)
PACKAGE
MARKING
PRODUCT
TSSOP-38
(DBT)
DAC8805Q
±1
±1
–40°C to +125°C
DAC8805
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
DAC8805
–0.3 to +7
–0.3 to +VDD + 0.3
–0.3 to +VDD + 0.3
±25
UNIT
V
VDD to GND
Digital input voltage to GND
V (IOUT) to GND
V
V
REF, ROFS, RFB, R1, RCOM to AGND, DGND
Operating temperature range
Storage temperature range
Junction temperature range (TJ max)
Power dissipation
V
–40 to +125
–65 to +150
+150
°C
°C
°C
W
(TJ max – TA) / RθJA
53
Thermal impedance, RθJA
°C/W
V
Human Body Model (HBM)
ESD rating
4000
Charged Device Model (CDM)
500
V
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
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SBAS391A–DECEMBER 2006–REVISED MAY 2007
ELECTRICAL CHARACTERISTICS
All specifications at TA = –40°C to +125°C, VDD = +2.7V to +5.5V, IOUT = virtual GND, GND = 0V, and VREF = 10V, unless otherwise noted.
DAC8805
PARAMETER
STATIC PERFORMANCE
CONDITIONS
MIN
TYP
MAX
UNITS
Resolution
14
Bits
LSB
LSB
nA
Relative accuracy
Differential nonlinearity
Output leakage current
Output leakage current
INL
±0.5
±0.5
±1
±1
DNL
Data = 0000h, TA = +25°C
10
Data = 0000h, Full temperature range
Unipolar, data = 3FFFh
20
nA
±1
±1
±4
mV
Full-scale gain error
Bipolar, data = 3FFFh
±4
mV
Full-scale temperature coefficient
Bipolar zero error
±1
±2
ppm/°C
mV
TA = +25°C
±1
±3
Full temperature range
±1
±3
mV
Power-supply rejection ratio
OUTPUT CHARACTERISTICS(1)
Output current
PSRR VDD = 5V ±10%
±0.1
±0.5
LSB/V
2
mA
pF
Output capacitance
Code dependent
50
REFERENCE INPUT
Reference voltage range
Input resistance (unipolar)
Input capacitance
VREF
RREF
–18
4
18
6
V
5
5
kΩ
pF
kΩ
kΩ
R1, R2
4
8
5
6
Feedback and offset resistance
LOGIC INPUTS AND OUTPUT(1)
ROFS, RFB
10
12
VIL VDD = +2.7V
VIL VDD = +5V
VIH VDD = +2.7V
VIH VDD = +5V
IIL
0.6
0.8
V
V
Input low voltage
Input high voltage
2.1
2.4
V
V
Input leakage current
Input capacitance
0.001
1
8
µA
pF
CIL
POWER REQUIREMENTS
Supply voltage
VDD
2.7
5.5
6
V
Supply current
IDD Normal operation, logic inputs = 0V
VIH = VDD and VIL = GND
VIH = VDD and VIL = GND
3
3
1
µA
µA
µA
VDD = +4.5V to +5.5V
VDD = +2.7V to +3.6V
AC CHARACTERISTICS(1)(2)
6
3
To 0.1% of full-scale,
Data = 0000h to 3FFFh to 0000h
Output current settling time
tS
0.3
µs
To 0.006% of full-scale,
Data = 0000h to 3FFFh to 0000h
tS
0.5
10
5
µs
Reference multiplying BW
DAC glitch impulse
BW – 3dB VREF = 5VPP, Data = 3FFFh, 2-quadrant mode
MHz
nV–s
VREF = 0V to 10V,
Data = 1FFFh to 2000h to 1FFFh
Data = 0000h, VREF = 100kHz, ±10VPP
2-quadrant mode
,
Feedthrough error
Crosstalk error
VOUT/VREF
–70
–100
1
dB
dB
VOUTA/VREF
B
Data = 0000h, VREFB = 100mVRMS, f = 100kHz
LDAC = Logic low, VREF = –10V to + 10V
Any code change
Digital feedthrough
nV–s
Total harmonic distortion
Output noise density
THD VREF = 6VRMS, Data = 3FFFh, f = 1kHz
eN f = 1kHz, BW = 1Hz, 2-quadrant mode
–105
12
dB
nV/√Hz
(1) Specified by design and characterization; not production tested.
(2) All ac characteristic tests are performed in a closed-loop system using a THS4011 I-to-V converter amplifier.
3
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SBAS391A–DECEMBER 2006–REVISED MAY 2007
PIN ASSIGNMENTS
DBT PACKAGE
TSSOP-38
(TOP VIEW)
1
2
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
NC
NC
D0
D1
3
R
OFSA
D2
4
RFB
A
D3
5
R1A
D4
6
RCOM
VREF
IOUT
A
A
A
D5
7
D6
8
D7
9
AGNDA
DGND
D8
DAC8805
10
11
12
13
14
15
16
17
18
19
VDD
D9
AGNDB
IOUT
VREF
RCOM
B
B
B
D10
D11
D12
D13
RS
R1B
RFB
B
B
ROFS
RSTSEL
LDAC
A1
WR
A0
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SBAS391A–DECEMBER 2006–REVISED MAY 2007
PIN ASSIGNMENTS (continued)
Table 1. TERMINAL FUNCTIONS
PIN #
NAME
DESCRIPTION
1, 2
NC
No connection
Bipolar Offset Resistor A. Accepts up to ±18V.
3
4
5
ROFS
RFB
A
In 2-quadrant mode, ROFSA ties to RFBA.
In 4-quadrant mode, ROFSA ties to R1A and the external reference.
A
Internal Matching Feedback Resistor A. Connects to the external op amp for I-V conversion.
4-Quadrant Resistor.
In 2-quadrant mode, R1A shorts to the VREFA pin.
In 4-quadrant mode, R1A ties to ROFSA and the reference input.
R1A
Center Tap Point of the Two 4-Quadrant Resistors, R1A and R2A.
In 2-quadrant mode, RCOMA shorts to the VREF pin.
6
RCOMA
In 4-quadrant mode, RCOMA ties to the inverting node of the reference amplifier.
DAC A Reference Input in 2-Quadrant Mode, R2 Terminal in 4-Quadrant Mode.
In 2-quadrant mode, VREFA is the reference input with constant input resistance versus code.
In 4-quadrant mode, VREFA is driven by the external reference amplifier.
7
8
VREFA
DAC A Current Output. Connects to the inverting terminal of external precision I-V op amp for voltage
output.
IOUT
A
9
AGNDA
DGND
DAC A Analog Ground.
Digital Ground.
10
11
AGNDB
DAC B Analog Ground.
DAC B Current Output. Connects to the inverting terminal of external precision I-V op amp for voltage
output.
12
IOUTB
DAC B Reference Input in 2-Quadrant Mode, R2 Terminal in 4-Quadrant Mode.
In 2-quadrant mode, VREFB is the reference input with constant input resistance versus code.
In 4-quadrant mode, VREFB is driven by the external reference amplifier.
13
VREF
B
Center Tap Point of the Two 4-Quadrant Resistors, R1B and R2B.
In 2-quadrant mode, RCOMB shorts to the VREF pin.
14
RCOMB
In 4-quadrant mode, RCOMB ties to the inverting node of the reference amplifier.
4-Quadrant Resistor.
15
16
17
R1B
In 2-quadrant mode, R1B shorts to the VREFB pin.
In 4-quadrant mode, R1B ties to ROFSB and the reference input.
RFB
B
Internal Matching Feedback Resistor B. Connects to external op amp for I-V conversion.
Bipolar Offset Resistor B. Accepts up to ±18V.
In 2-quadrant mode, ROFSB ties to RFBB.
ROFS
B
In 4-quadrant mode, ROFSB ties to R1B and the external reference.
Write Control Digital Input In, Active Low. WR enables input registers.
Signal level must be ≤ VDD + 0.3V.
18
WR
19
20
A0
A1
Address 0. Signal level must be ≤ VDD + 0.3V.
Address 1. Signal level must be ≤ VDD + 0.3V.
Digital Input Load DAC Control. Signal level must be ≤ VDD + 0.3V. See the Function of Control Inputs
table for details.
21
LDAC
Power-On Reset State.
RSTSEL = 0 corresponds to zero-scale reset.
RSTSEL = 1 corresponds to mid-scale reset.
The signal level must be ≤ VDD + 0.3V.
22
RSTSEL
Reset. Active low resets both input and DAC registers.
Resets to zero-scale if RSTSEL= 0, and to mid-scale if RSTSEL = 1.
Signal level must be equal to or less than VDD + 0.3 V.
23
RS
24-28, 30-38
29
D0-D13
VDD
Digital Input Data Bits D0 to D13. Signal level must be ≤ VDD +0.3V. D13 is MSB.
Positive Power Supply Input. The specified range of operation is 2.7V to 5.5V.
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SBAS391A–DECEMBER 2006–REVISED MAY 2007
TIMING AND FUNCTIONAL INFORMATION
tWR
WR
A0/1
tAS
tAH
DATA
tDS
tDH
tLWD
LDAC
RS
tLDAC
tRST
Figure 1. Timing Diagram
TIMING CHARACTERISTICS
All specifications at TA = –40°C to +125°C, IOUT = virtual GND, GND = 0V, and VREF = 10V, unless otherwise noted
DAC8805
PARAMETER
Data to WR setup time
CONDITIONS
VDD = +5.0V
VDD = +2.7V
VDD = +5.0V
VDD = +2.7V
VDD = +5.0V
VDD = +2.7V
VDD = +5.0V
VDD = +2.7V
VDD = +5.0V
VDD = +2.7V
VDD = +5.0V
VDD = +2.7V
VDD = +5.0V
VDD = +2.7V
VDD = +5.0V
VDD = +2.7V
MIN
10
10
10
10
0
TYP
MAX
UNITS
ns
tDS
ns
ns
A0/1 to WR setup time
Data to WR hold time
A0/1 to WR hold time
WR pulse width
tAS
ns
ns
tDH
0
ns
0
ns
tAH
0
ns
10
10
10
10
10
10
0
ns
tWR
ns
ns
LDAC pulse width
RS pulse width
tLDAC
tRST
tLWD
ns
ns
ns
ns
WR to LDAC delay time
0
ns
6
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SBAS391A–DECEMBER 2006–REVISED MAY 2007
Table 2. Address Decoder Pins
A1
0
A0
0
OUTPUT UPDATE
DAC A
0
1
None
1
0
DAC A and DAC B
DAC B
1
1
Table 3. Function of Control Inputs
CONTROL INPUTS
RS
WR
LDAC
REGISTER OPERATION
Asynchronous operation. Reset the input and DAC register to '0' when the RSTSEL pin is tied to DGND, and to
0
X
X
midscale when RSTSEL is tied to VDD
.
1
1
1
0
1
0
0
1
1
Load the input register with all 14 data bits.
Load the DAC register with the contents of the input register.
The input and DAC register are transparent.
LDAC and WR are tied together and programmed as a pulse. The 14 data bits are loaded into the input register on
the falling edge of the pulse and then loaded into the DAC register on the rising edge of the pulse.
1
1
1
0
No register operation.
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SBAS391A–DECEMBER 2006–REVISED MAY 2007
TYPICAL CHARACTERISTICS: VDD = +5V
Channel A
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
1.0
0.8
TA = +25°C
TA = +25°C
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
0
0
0
2048 4096 6144 8192 10240 12288 14336 16383
Code
0
0
0
2048 4096 6144 8192 10240 12288 14336 16383
Code
Figure 2.
Figure 3.
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
TA = -40°C
TA = -40°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
2048 4096 6144 8192 10240 12288 14336 16383
Code
2048 4096 6144 8192 10240 12288 14336 16383
Code
Figure 4.
Figure 5.
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
TA = +125°C
TA = +125°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
−0.2
−0.4
−0.6
−0.8
−1.0
-0.2
-0.4
-0.6
-0.8
-1.0
2048 4096 6144 8192 10240 12288 14336 16383
Code
2048 4096 6144 8192 10240 12288 14336 16383
Code
Figure 6.
Figure 7.
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Channel B
1.0
SBAS391A–DECEMBER 2006–REVISED MAY 2007
TYPICAL CHARACTERISTICS: VDD = +5V (continued)
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
TA = +25°C
TA = +25°C
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
0
0
0
2048 4096 6144 8192 10240 12288 14336 16383
Code
0
0
0
2048 4096 6144 8192 10240 12288 14336 16383
Code
Figure 8.
Figure 9.
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
T
A = -40°C
T
A = -25°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
2048 4096 6144 8192 10240 12288 14336 16383
Code
2048 4096 6144 8192 10240 12288 14336 16383
Code
Figure 10.
Figure 11.
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
T
A = +125°C
T
A = +125°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
2048 4096 6144 8192 10240 12288 14336 16383
Code
2048 4096 6144 8192 10240 12288 14336 16383
Code
Figure 12.
Figure 13.
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SBAS391A–DECEMBER 2006–REVISED MAY 2007
TYPICAL CHARACTERISTICS: VDD = +5V (continued)
MIDSCALE DAC GLITCH
MIDSCALE DAC GLITCH
VREF = +10V
VREF = +10V
Code: 1FFFh to 2000h
Code: 2000h to 1FFFh
Time (0.2ms/div)
Time (0.2ms/div)
Figure 14.
Figure 15.
FULL-SCALE ERROR
vs TEMPERATURE
BIPOLAR-ZERO ERROR
vs TEMPERATURE
3
2
4
3
2
1
1
DAC A
DAC B
DAC A
0
0
-1
-2
-3
-4
-1
-2
-3
DAC B
-50 -30 -10
10
30
50
70
90
110 130
-50 -30 -10
10
30
50
70
90
110 130
Temperature (°C)
Temperature (°C)
Figure 16.
Figure 17.
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SBAS391A–DECEMBER 2006–REVISED MAY 2007
TYPICAL CHARACTERISTICS: VDD = +2.7V
Channel A
LINEARITY ERROR
vs DIGITAL INPUT CODE
LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
1.0
0.8
T
T
T
A = +25°C
T
T
T
A = +25°C
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
0
0
0
2048 4096 6144 8192 10240 12288 14336 16383
Code
0
0
0
2048 4096 6144 8192 10240 12288 14336 16383
Code
Figure 18.
Figure 19.
LINEARITY ERROR
vs DIGITAL INPUT CODE
LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
A = -40°C
A = -40°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
2048 4096 6144 8192 10240 12288 14336 16383
Code
2048 4096 6144 8192 10240 12288 14336 16383
Code
Figure 20.
Figure 21.
LINEARITY ERROR
vs DIGITAL INPUT CODE
LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
A = +125°C
A = +125°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
2048 4096 6144 8192 10240 12288 14336 16383
Code
2048 4096 6144 8192 10240 12288 14336 16383
Code
Figure 22.
Figure 23.
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TYPICAL CHARACTERISTICS: VDD = +2.7V (continued)
Channel B
LINEARITY ERROR
vs DIGITAL INPUT CODE
LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
1.0
0.8
T
T
T
A = +25°C
T
T
T
A = +25°C
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
0
0
0
2048 4096 6144 8192 10240 12288 14336 16383
Code
0
0
0
2048 4096 6144 8192 10240 12288 14336 16383
Code
Figure 24.
Figure 25.
LINEARITY ERROR
vs DIGITAL INPUT CODE
LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
A = -40°C
A = -40°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
2048 4096 6144 8192 10240 12288 14336 16383
Code
2048 4096 6144 8192 10240 12288 14336 16383
Code
Figure 26.
Figure 27.
LINEARITY ERROR
vs DIGITAL INPUT CODE
LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
A = +125°C
A = +125°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
2048 4096 6144 8192 10240 12288 14336 16383
Code
2048 4096 6144 8192 10240 12288 14336 16383
Code
Figure 28.
Figure 29.
12
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TYPICAL CHARACTERISTICS: VDD = +2.7V (continued)
DAC GLITCH
DAC GLITCH
VREF = +10V
VREF = +10V
Code: 1FFFh to 2000h
Code: 2000h to 1FFFh
Time (0.2ms/div)
Time (0.2ms/div)
Figure 30.
Figure 31.
FULL-SCALE ERROR
vs TEMPERATURE
BIPOLAR-ZERO ERROR
vs TEMPERATURE
3
2
4
3
2
1
1
DAC A
0
DAC B
DAC A
0
-1
-2
-3
-4
-1
-2
-3
DAC B
-50 -30 -10
10
30
50
70
90
110 130
-50 -30 -10
10
30
50
70
90
110 130
Temperature (°C)
Temperature (°C)
Figure 32.
Figure 33.
13
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TYPICAL CHARACTERISTICS: VDD = +2.7V and +5V
SUPPLY CURRENT
vs LOGIC INPUT VOLTAGE
REFERENCE MULTIPLYING BANDWIDTH
UNIPOLAR MODE
180
160
140
120
100
80
6
0
0x3FFF
0x2000
0x1000
0x0800
0x0400
0x0200
0x0100
0x0080
0x0040
0x0020
0x0010
0x0008
0x0004
0x0002
0x0001
-6
-12
-18
-24
-30
-36
-42
-48
-54
-60
-66
-72
-78
-84
-90
-96
-102
-108
-114
VDD = +5.0V
60
40
VDD = +2.7V
20
0x0000
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Logic Input Voltage (V)
10
100
1k
10k
100k
1M
10M
100M
Bandwidth (Hz)
Figure 34.
Figure 35.
REFERENCE MULTIPLYING BANDWIDTH
BIPOLAR MODE
REFERENCE MULTIPLYING BANDWIDTH
BIPOLAR MODE
6
0
6
0
0x3FFF
0x0000
0x1000
0x1800
0x1C00
0x1E00
0x1F00
0x1F80
0x1FC0
0x1FE0
0x1FF0
0x1FF8
0x1FFC
0x1FFE
0x1FFF
0x2000
-6
0x3000
0x2800
0x2400
0x2200
0x2100
0x2080
0x2040
0x2020
0x2010
0x2008
0x2004
0x2002
0x2001
0x2000
-6
-12
-18
-24
-30
-36
-42
-48
-54
-60
-66
-72
-78
-84
-90
-96
-102
-108
-114
-12
-18
-24
-30
-36
-42
-48
-54
-60
-66
-72
-78
-84
-90
-96
-102
-108
-114
DAC 0V output
limited by bipolar
zero error to
DAC 0V output
limited by bipolar
zero error to
-84dB typical
(-76dB max).
-84dB typical
(-76dB max).
Codes from Midscale
to Positive Full-Scale
Codes from Negative
Full-Scale to Midscale
10
100
1k
10k
100k
1M
10M
100M
10
100
1k
10k
100k
1M
10M
100M
Bandwidth (Hz)
Bandwidth (Hz)
Figure 36.
Figure 37.
SUPPLY CURRENT vs TEMPERATURE
DAC SETTLING TIME
6
5
4
3
2
1
0
VDD = 5.0V
Unipolar Mode
Voltage Output Settling
VDD = 2.7V
Trigger Pulse
Time (0.5ms/div)
-50 -30 -10
10
30
50
70
90
110 130
Temperature (°C)
Figure 38.
Figure 39.
14
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SBAS391A–DECEMBER 2006–REVISED MAY 2007
THEORY OF OPERATION
The DAC8805 is a multiplying, dual-channel, current output, 14-bit DAC. The architecture, illustrated in
Figure 40, is an R-2R ladder configuration with the three MSBs segmented. Each 2R leg of the ladder is either
switched to GND or to the IOUT terminal. The IOUT terminal of the DAC is held at a virtual GND potential by the
use of an external I/V converter op amp. The R-2R ladder is connected to an external reference input (VREF) that
determines the DAC full-scale output current. The R-2R ladder presents a code-independent load impedance to
the external reference of 5kΩ ± 25%. The external reference voltage can vary in a range of –18V to +18V, thus
providing bipolar IOUT current operation. By using an external I/V converter op amp and the RFB resistor in the
DAC8805, an output voltage range of –VREF to +VREF can be generated.
R
R
R
VREF
2R
2R
2R
2R
2R
2R
2R
2R
2R
2R
2R
2R
RFB
IOUT
GND
Figure 40. Equivalent R-2R DAC Circuit
The DAC output voltage is determined by VREF and the digital data (D) according to Equation 1:
D
16384
VOUTA/B = -VREF
´
(1)
Each DAC code determines the 2R-leg switch position to either GND or IOUT. The external I/V converter op amp
noise gain will also change because the DAC output impedance (as seen looking into the IOUT terminal) changes
versus code. Because of this change in noise gain, the external I/V converter op amp must have a sufficiently
low offset voltage such that the amplifier offset is not modulated by the DAC IOUT terminal impedance change.
External op amps with large offset voltages can produce INL errors in the transfer function of the DAC8805
because of offset modulation versus DAC code. For best linearity performance of the DAC8805, an op amp
(such as the OPA277) is recommended, as shown in Figure 41. This circuit allows VREF to swing from –10V to
+10V.
VDD
U1
VDD ROFS RFB
+15V
U2
V+
OPA277
VREF
IOUTA/B
DAC8805
VOUT
V-
GND
-15V
Figure 41. Voltage Output Configuration
15
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SBAS391A–DECEMBER 2006–REVISED MAY 2007
APPLICATION INFORMATION
DIGITAL INTERFACE
The parallel bus interface of the DAC8805 is comprised of a 14-bit data bus, D0—D13, address lines A0 and A1,
and a WR control signal. Timing and control functionality are shown in Figure 1, and described in Table 2 and
Table 3. The address lines must be set up and stable before the WR signal goes low, to prevent loading
improper data to an undesired input register.
Both channels of the DAC8805 can be simultaneously updated by control of the LDAC signal, as shown in
Figure 1. Reset control (RS) and reset select control (RSTSEL) signals are provided to allow user reset ability to
either zero scale or midscale codes of both the input and DAC registers.
STABILITY CIRCUIT
For a current-to-voltage (I/V) design, as shown in Figure 42, the DAC8805 current output (IOUT) and the
connection with the inverting node of the op amp should be as short as possible and laid out according to
correct printed circuit board (PCB) layout design. For each code change, there is an output step function. If the
gain bandwidth product (GBP) of the op amp is limited and parasitic capacitance is excessive at the inverting
node, then gain peaking is possible. Therefore, a compensation capacitor C1 (4pF to 20pF, typ) can be added to
the design for circuit stability, as shown in Figure 42.
VDD
U1
VDD ROFS RFB
C1
U2
VREF
VREF
IOUTA/B
DAC8805
VOUT
OPA277
GND
Figure 42. Gain Peaking Prevention Circuit with Compensation Capacitor
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APPLICATION INFORMATION (continued)
BIPOLAR OUTPUT CIRCUIT
The DAC8805, as a 4-quadrant multiplying DAC, can be used to generate a bipolar output. The polarity of the
full-scale output (IOUT) is the inverse of the input reference voltage at VREF
.
Using a dual op amp, such as the OPA2277, full 4-quadrant operation can be achieved with minimal
components. Figure 43 demonstrates a ±10VOUT circuit with a fixed +10V reference. The output voltage is
shown in Equation 2:
D
8192
+ ǒ
Ǔ
VOUT
*1 VREF
(2)
VREF
U1
OPA2277
VDD
DGND
R1A
RCOMA
ROFSA
R
FBA
VREFA
R1A
R2A
ROFSA
RFB
A
DAC8805
C1
D0
IOUT
A
U2
OPA2277
DAC A
Parallel
Bus
Interface
D13
Input A
Register
DAC A
Register
VOUT
WR
A0
AGNDA
A1
RS
LDAC
Control
Logic
RSTSEL
Figure 43. Bipolar Output Circuit
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APPLICATION INFORMATION (continued)
PROGRAMMABLE CURRENT SOURCE CIRCUIT
The DAC8805 can be integrated into the circuit in Figure 44 to implement an improved Howland current pump
for precise V/I conversions. Bidirectional current flow and high-voltage compliance are two features of the circuit.
With a matched resistor network, the load current of the circuit is shown by Equation 3:
(R2 + R3) / R1
D
ILA/B =
´ VREF ´
16384
R3
(3)
The value of R3 in the previous equation can be reduced to increase the output current drive of U3. U3 can drive
±20mA in both directions with voltage compliance limited up to 15V by the U3 voltage supply. Elimination of the
circuit compensation capacitor (C1) in the circuit is not suggested as a result of the change in the output
impedance (ZO), according to Equation 4:
(
)
R1ȀR3 R1)R2
ZO +
(
)
(
)
R1 R2Ȁ)R3Ȁ * R1Ȁ R2)R3
(4)
As shown in Equation 4, ZO with matched resistors is infinite and the circuit is optimum for use as a current
source. However, if unmatched resistors are used, ZO is positive or negative with negative output impedance
being a potential cause of oscillation. Therefore, by incorporating C1 into the circuit, possible oscillation problems
are eliminated. The value of C1 can be determined for critical applications; for most applications, however, a
value of several pF is suggested.
R2´
15kW
C1
10pF
VDD
R1´
U3
R3´
150kW
50W
U1
VOUT
OPA2277
C2
VDD ROFS RFB
10pF
R3
U2
R1
R2
50W
150kW
15kW
VREF
VREF
IOUTA/B
DAC8805
IL
OPA2277
LOAD
GND
Figure 44. Programmable Bidirectional Current Source Circuit
CROSS-REFERENCE
The DAC8805 has an industry-standard pinout. Table 4 provides the cross-reference information.
Table 4. Cross-Reference
SPECIFIED
TEMPERATURE
RANGE
CROSS-
REFERENCE
PART
INL
DNL
PACKAGE
DESCRIPTION
PACKAGE
OPTION
PRODUCT
BIT
(LSB)
(LSB)
DAC8805Q
14
1
1
–40°C to +125°C
TSSOP-38
DBT
AD5557
18
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
DAC8805QDBT
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
TSSOP
TSSOP
TSSOP
DBT
38
38
38
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
DAC8805
DAC8805QDBTG4
DAC8805QDBTR
ACTIVE
ACTIVE
DBT
DBT
50
Green (RoHS
& no Sb/Br)
-40 to 125
DAC8805
DAC8805
2000
Green (RoHS
& no Sb/Br)
-40 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DAC8805QDBTR
TSSOP
DBT
38
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
TSSOP DBT 38
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 38.0
DAC8805QDBTR
2000
Pack Materials-Page 2
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