DP83826E [TI]
具有 MII 接口和 ENHANCED 模式的低延迟 10/100Mbps 以太网 PHY;型号: | DP83826E |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有 MII 接口和 ENHANCED 模式的低延迟 10/100Mbps 以太网 PHY 以太网 局域网(LAN)标准 |
文件: | 总154页 (文件大小:3616K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DP83826E, DP83826I
ZHCSKM7F –DECEMBER 2019 –REVISED NOVEMBER 2022
DP83826 确定性、低延迟、低功耗、10/100Mbps 工业以太网PHY
• 符合IEEE 802.3 标准:10BASE-Te、100BASE-
1 特性
TX
• 符合EtherCAT® 标准
• 较低的确定性延迟
– TX 延迟:40ns、RX 延迟:170ns
– 电源循环上的确定性延迟< ±2ns
– 固定相位XI 到TX_CLK 关系< ±2ns
• 强大的小型系统解决方案
– 用于增强EMC 的集成电路
– IEC 61000-4-2 ESD:±8kV 接触,±15kV 空气
– IEC 61000-4-4 EFT:5kHz、100kHz 下为±4kV
– CISPR 22 传导发射B 类
– 符合CISPR 22 B 类辐射发射限制
– 快速链路丢弃< 10µs
2 应用
• 工厂自动化、机器人和运动控制
• 电机驱动器
• 电网基础设施
• 楼宇自动化
• 工业以太网现场总线
3 说明
DP83826 能够提供很低的确定性延迟和低功耗,并支
持 10BASE-Te、100BASE-TX 以太网协议,可以满足
实时工业以太网系统中的严格要求。该器件包含可实现
快速链接的硬件自举、快速链路丢弃检测模式以及用于
对系统上的其他模块进行时钟同步的专用参考
CLKOUT。
– 电缆长度> 150 米
– 电压模式线路驱动器
– MAC 接口上的集成终端
– 电压容限:±10%
• 单个器件中具有两种可选引脚模式
– 用于附加功能的ENHANCED 模式
– 用于通用以太网引脚的BASIC 模式
• 低功耗< 160mW
• MAC 接口:MII、RMII
• 可编程节能模式
两种可配置模式为: 使用通用以太网引脚排列的
BASIC 标准以太网模式,以及支持标准以太网模式和
多个工业以太网现场总线应用(通过附加功能和硬件自
举配置)的ENHANCED 以太网模式。
器件系列信息
– 主动睡眠
– 深度断电
封装尺寸
(NOM)
器件型号(1)
封装
属性
5.00mm ×
5.00mm
– 节能以太网(EEE) IEEE 802.3az
– 局域网唤醒(WoL)
• 诊断工具:电缆诊断、内置自检(BIST)、环回模式
• 3.3V 单电源
• I/O 电压:1.8V 或3.3V
• RMII 背对背中继器模式
超低延迟、通用引
脚
DP83826E/I
DP83825I
VQFN (32)
WQFN (24)
3.00mm ×
3.00mm
小尺寸、经优化的
解决方案成本
5.00mm ×
5.00mm
宽温度范围、光纤
和RGMII 支持
DP83822HF/IF/H/I VQFN (32)
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
• DP83826E 工作温度范围:–40°C 至105°C
• DP83826I 工作温度范围:–40°C 至85°C
25 MHz XTAL/Ref Clock 25/50 MHz
VDDIO: 3.3 V or 1.8 V
VDDA3V3: 3.3 V
Media Types
100BASE-TX
10BASE-Te
Ref Clock: 25/50/125 MHz
Interrupt
Media Dependent
Interface (MDI)
DP83826
RJ-45
MII, RMII (master/slave)
SMI: MDC, MDIO
简化版应用
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SNLS647
DP83826E, DP83826I
ZHCSKM7F –DECEMBER 2019 –REVISED NOVEMBER 2022
www.ti.com.cn
Table of Contents
9.2 Functional Block Diagram.........................................26
9.3 Feature Description...................................................26
9.4 Programming............................................................ 47
9.5 Register Maps...........................................................51
10 Application and Implementation..............................135
10.1 Application Information......................................... 135
10.2 Typical Applications.............................................. 135
11 Power Supply Recommendations............................140
12 Layout.........................................................................141
12.1 Layout Guidelines................................................. 141
13 Device and Documentation Support........................144
13.1 Related Documentation........................................ 144
13.2 Receiving Notification of Documentation Updates144
13.3 Support Resources............................................... 144
13.4 Trademarks...........................................................144
13.5 Electrostatic Discharge Caution............................144
13.6 术语表................................................................... 144
14 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Mode Comparison Tables...............................................4
6 Pin Configuration and Functions (ENHANCED
Mode)............................................................................... 5
7 Pin Configuration and Functions (BASIC Mode)..........8
8 Specifications................................................................ 11
8.1 绝对最大额定值.........................................................11
8.2 ESD 等级...................................................................11
8.3 建议运行条件............................................................ 12
8.4 热性能信息................................................................12
8.5 电气特性....................................................................13
8.6 时序要求....................................................................16
8.7 Timing Diagrams.......................................................19
8.8 Typical Characteristics..............................................24
9 Detailed Description......................................................25
9.1 Overview...................................................................25
Information.................................................................. 145
4 Revision History
注:以前版本的页码可能与当前版本的页码不同
Changes from Revision E (February 2022) to Revision F (November 2022)
Page
• Corrected Reset states for RX_D3, LED0.......................................................................................................... 8
• 更新了热指标.................................................................................................................................................... 12
• Adjusted Power-Up Timing (Power Sequencing) graphic ................................................................................19
• Adjusted RMII Repeater Mode: Master-Slave and RMII Repeater Mode: Slave-Slave graphics .................... 30
• Clarified MDIO pullup resistor values............................................................................................................... 35
• Changed Rlo strap for internal PU pin to 1.5kΩ. Added recommended tolerance for resistor values.............47
• Added Enhanced Bootstrap Flowchart graphic................................................................................................ 49
• Corrected Strap0 default and functionality in Enhanced Mode.........................................................................49
• Updated device registers..................................................................................................................................51
• Adjusted location of Transformer Recommendations .................................................................................... 136
Changes from Revision D (October 2020) to Revision E (February 2022)
Page
• Pin 31 default is changed to LED1, added odd nibble detection and FLD detection mechanisms in hardware
bootstrap differences table..................................................................................................................................4
• Added TX_ER to pin 28......................................................................................................................................5
• Pin 31 default is changed to LED1..................................................................................................................... 8
• Pin 31 default is changed to LED1, updated pin 16 and pin 31 to PU................................................................8
• Added fast link drop modes table, updated description for fast link drop functionality in Included specification
for the different defaults between enhanced and basic mode, added strap8 description.................................45
• Added description that LED1/0 are autopolarity (enhanced), active low by default (basic)..............................46
• Added odd nibble detection table, added strap7 and strap1 interaction to MII MAC mode strap table, added
signal energy alternate function to strap8.........................................................................................................49
• Pin 31 default is changed to LED1, pin 16 default changed to half duplex.......................................................51
• TPI network cap updates................................................................................................................................136
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Changes from Revision C (July 2020) to Revision D (October 2020)
Page
• Updated Electrical Characteristics table........................................................................................................... 11
• Added section.................................................................................................................................................137
Changes from Revision B (March 2020) to Revision C (July 2020)
Page
• Added link to SNLA338 application note............................................................................................................ 4
• Added link to SNLA338.....................................................................................................................................25
• Energy Efficient Ethernet section......................................................................................................................27
• EEE Overview section...................................................................................................................................... 27
• EEE Negotiation section...................................................................................................................................27
• Added EEE for Legacy MACs Not Supporting 802.3az section....................................................................... 28
• Updated device registers..................................................................................................................................51
• Added link to SNLA338 application note........................................................................................................ 135
Changes from Revision A (February 2020) to Revision B (March 2020)
Page
• 还在“电气”部分中添加了DP83826I 温度范围................................................................................................ 1
• 向“器件系列信息”表添加了DP83826I............................................................................................................1
Changes from Revision * (January 2020) to Revision A (February 2020)
Page
• 添加了指向DP83826EVM 用户指南的链接........................................................................................................1
• Deleted pin 18 from 表5-2 .................................................................................................................................4
• Changed ENHANCED Mode pin map and pin functions table to match pin names...........................................5
• Changed BASIC Mode pin map and pin functions table to match pin names.................................................... 8
• Deleted "This pin can be configured to RX_DV in RMII mode to enable RMII Repeater Mode." from Pin
Functions (BASIC Mode)....................................................................................................................................8
• Added the 100BASE-TX Transmit Latency Timing graphic ............................................................................. 19
• Added the 100BASE-TX Receive Latency Timing graphic ..............................................................................19
• Added steps to disable CLKOUT via register configuration in 节9.3.8 ........................................................... 31
• Deleted mentions of "clause 45" from 节9.3.11 and 节9.3.11.1 .....................................................................35
• Deleted "Analog Loopback requires 100-Ω terminations across pins #1 and #2 as well as 100-Ω terminations
across pins #3 and #6 at the RJ45." from 节9.3.14.5 ..................................................................................... 43
• Added row for RMII slave mode configuration in 表9-15 ................................................................................ 51
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5 Mode Comparison Tables
The DP83826 can be strapped to operate in either ENHANCED mode or BASIC mode. ENHANCED mode
allows the DP83826 to support real-time Ethernet applications in addition to standard Ethernet applications.
BASIC mode allows the DP83826 to support standard Ethernet applications. Additionally, the DP83826 pinout in
BASIC mode matches a common PHY pinout used in many applications.
表5-1. Selecting EHANCED Mode or BASIC Mode
ENHANCED Mode
BASIC Mode
Connect ModeSelect (Pin 1) to VDDIO through pullup resistor
Short ModeSelect (Pin 1) to GND
表5-2. Pin Map Difference Between ENHANCED Mode and BASIC Mode
PIN NO.
31
ENHANCED MODE
CLKOUT/LED1
PWRDN/INT
BASIC MODE
LED1/TX_ER
INT
DESCRIPTION
Offers reference clockout 25 MHz at POR. Clock is not
interrupted by RST_N.
21
Offers power down as default pin function
表5-3. Hardware Bootstraps Difference Between ENHANCED Mode and BASIC Mode
HARDWARE BOOTSTRAPS
ENHANCED Mode(3)
BASIC Mode
Fast link-drop enable and disable(1)
Yes
No
MLT3_error and Signal Energy
enabled by default
Fast link-drop detection mechanism
Strap controllable
Auto-MDIX enable and disable(1)
Force MDI/MDIX selection(1)
RMII back-to-back repeater mode configuration(2)
MII or RMII selection
Yes
No
Yes
No
Yes
No
Yes
Yes
Speed selection (10 M or 100 M)
MII isolate enable and disable
Auto-negotiation enable and disable
Number of PHY addresses available
Half or full duplex selection
No
Yes
No
Yes
Yes
Yes
8
8
No
Yes
Yes
No
CLKOUT in place of LED1
Odd Nibble Detection
Strap controllable
Disabled by default
(1) These pin bootstraps enable the ENHANCED mode DP83826 to meet the stringent requirements of real-time Ethernet applications.
(2) This pin bootstrap enables the ENHANCED mode DP83826 to function as an RMII repeater.
(3) ENHANCED mode includes all the modes of operation BASIC mode can be configured to. The difference is, in these modes of
operation, ENHANCED mode may require register configuration.
备注
For a step by step approach on using the DP83826 BASIC mode in existing systems that use a
common standard Ethernet pinout, please refer to SNLA338.
备注
For standardized list of Ethernet related acronyms, refer to Chinese and English Definitions of
Acronyms Related to Ethernet Products.
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ZHCSKM7F –DECEMBER 2019 –REVISED NOVEMBER 2022
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6 Pin Configuration and Functions (ENHANCED Mode)
The ENHANCED mode is one of two modes that the DP83826 can be configured in at start-up. This mode
allows the DP83826 to support real-time Ethernet applications in addition to the standard Ethernet applications.
To configure the DP83826 to ENHANCED mode, leave ModeSelect (pin 1) unconnected or pull up with a resistor
to VDDIO.
32
31
30
29
28
27
26
25
ModeSelect
CEXT
1
2
3
4
5
6
7
8
24 TX_D0
23 TX_EN
VDDA3V3
RD_M
RD_P
22 TX_CLK/Strap5
21 PWRDN/INT
20 RX_ER/Strap6
19 RX_CLK/50MHz_RMII
18 RX_DV/CRS_DV/Strap10
17 VDDIO
TD_M
TD_P
Thermal Pad
(connect to GND)
XO
9
10
11
12
13
14
15
16
(not to scale)
图6-1. RHB Package
32-Pin QFN
(Top View)
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表6-1. Pin Functions (ENHANCED Mode)
PIN
TYPE (1)
DESCRIPTION
NAME
NO
This pin selects the DP83826 operating mode: BASIC mode or ENHANCED mode. For
ENHANCED mode, this pin shall be left NC or pulled-up with a resistor to VDDIO. For BASIC
mode, this pin shall be shorted to GND.
Reset: I, PU
Active: I, PU
ModeSelect
1
CEXT
2
3
A
External capacitor: Connect the CEXT pin through a 2-nF capacitor to GND.
Input analog supply: 3V3. For decoupling capacitor requirements, refer to Power Supply
Recommendations section of data sheet.
VDDA3V3
Power
RD_M
RD_P
TD_M
TD_P
4
5
6
7
A
A
A
A
Differential receive input (physical media dependent: PMD): These differential inputs are
automatically configured to accept either 10BASE-Te, 100BASE-TX specific signaling mode.
Differential transmit output (PMD): These differential outputs are configured to either
10BASE-Te or 100BASE-TX signaling mode based on configuration chosen for PHY.
Crystal output: Reference clock output. XO pin is used for crystal only. Leave this pin floating
when a CMOS-level oscillator is connected to XI.
XO
8
A
Crystal or oscillator input clock:
MII mode, RMII master mode: 25-MHz ±50 ppm-tolerance crystal or oscillator clock.
XI/50MHzIn
9
A
A
RMII slave mode: 50-MHz ±50 ppm-tolerance CMOS-level oscillator clock.
RBIAS
MDIO
10
11
RBIAS ( Bias resistor) value 6.49 kΩwith 1% precision connected to ground.
Management data I/O: Bi-directional management data signal that may be sourced by the
management station or the PHY. This pin has internal pullup resistor of 10 kΩ. An external
pullup resistor can be added if needed.
Reset: I, PU
Active: I/O, PU
Management data clock: Synchronous clock to the MDIO serial management input/output
data. This clock may be asynchronous to the MAC transmit and receive clocks. The
maximum clock rate is 25 MHz. There is no minimum clock rate.
Reset: I, PD
Active: I, PD
MDC
12
13
14
Reset: I, PD
Active: O
Strap7
RX_D3
Reset: I, PD
Active: O
Strap8
RX_D2
RX_D1
Receive data: Symbols received on the cable are decoded and presented on these pins
synchronous to the rising edge of RX_CLK. They contain valid data when RX_DV is asserted.
A nibble RX_D[3:0] is received in MII mode. 2-bits RX_D[1:0] is received in RMII mode.
Reset: I, PD
Active: O
Strap9
15
Reset: I, PU
Active: O
Strap0
RX_D0
VDDIO
16
17
I/O supply voltage: 3.3 V/1.8 V. For decoupling capacitor requirements, refer to Power Supply
Decoupling Recommendations section of data sheet.
Power
Receive data valid: This pin indicates valid data is present on the RX_D[3:0] for MII mode and
on RX_D[1:0] in RMII mode. In MII mode, this pin acts as RX_DV. In RMII mode, this pin acts
as CRS_DV and combines the RMII Carrier and Receive Data Valid indications. This pin can
be configured to RX_DV in RMII mode to enable RMII Repeater Mode.
Reset: I, PD
Active: O
Strap10
RX_DV/
CRS_DV
18
19
MII receive clock: MII Receive Clock provides a 25-MHz reference clock for 100-Mbps speed
and a 2.5-MHz reference clock for 10-Mbps speed, which is derived from the received data
stream.
In RMII Master mode, this provides 50-MHz reference clock. In RMII Slave mode, this pin is
not used and remains Input, pulldown.
RX_CLK/
50MHz_RMII
Reset: I, PD
Active: O
Receive error: This pin indicates that an error symbol has been detected within a received
packet in both MII and RMII mode.
In MII mode, RX_ER is asserted high synchronously to the rising edge of RX_CLK.
In RMII mode, RX_ER is asserted high synchronously to the rising edge of the reference
clock. RX_ER is asserted high for every reception error, including errors during Idle.
This strap only latches on power-up and not on pin reset.
Reset: I, PD
Active: O
Strap6
RX_ER
20
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表6-1. Pin Functions (ENHANCED Mode) (continued)
PIN
TYPE (1)
DESCRIPTION
NAME
NO
Power down (default), interrupt: The default function of this pin is power down. Register
access is required to configure this pin as an interrupt. In power down function, an active low
signal on this pin places the device in power down mode. When this pin is configured as an
interrupt pin, this pin is asserted low when an interrupt condition occurs. The pin has an open-
drain output with a weak internal pullup resistor (9.5 kΩ). Some applications may require an
external PU resistor.
Reset: I, PU
Active: I, PU
PWRDN/INT
21
Reset: I, PD
Active: O
Strap5
MII transmit clock: MII transmit clock provides a 25-MHz reference clock for 100-Mbps speed
and a 2.5-MHz reference clock for 10-Mbps speed. Note that in MII mode, this clock has
constant phase referenced to the input clock. Unused in RMII Mode.
TX_CLK
TX_EN
22
23
Transmit enable: TX_EN is presented on the rising edge of the TX_CLK. TX_EN indicates the
presence of valid data inputs on TX_D[3:0] in MII mode and on TX_D[1:0] in RMII mode.
TX_EN is an active high signal.
Reset: I, PD
Active: I, PD
Reset: I, PD
Active: I, PD
TX_D0
TX_D1
TX_D2
TX_D3
24
25
26
27
Transmit data:
Reset: I, PD
Active: I, PD
In MII mode, the transmit data nibble received from the MAC is synchronous to the rising
edge of TX_CLK.
Reset: I, PD
Active: I, PD
In RMII mode, TX_D[1:0] received from the MAC is synchronous to the rising edge of the
reference clock.
Reset: I, PD
Active: I, PD
Collision Detect (default): In MII mode when the pin is acting as Collision Detect (COL), this
pin is always LOW in Full Duplex mode. In Half Duplex mode, COL is asserted HIGH only
when both transmit and receive media are non-idle. This pin can also be configured as a
second additional LED driver (LED2), the MII TX_ER signal or general purpose I/O (GPIO)
through register configurations.
Reset: I, PD
Active: O
Strap4
COL/LED2/
TX_ER GPIO
28
In RMII mode, this pin acts as LED2 by default.
Carrier sense (default):
In MII mode this pin is asserted high when the receive or transmit medium is non-idle. Carrier
Reset: I, PD
Active: O
Strap3
sense and receive data valid. This pin can be configured as third LED (LED3) through register
configuration.
CRS/LED3
LED0
29
30
In RMII mode, it is configured as LED3 by default.
LED0: This LED indicates transmit and receive activity in addition to the status of the Link.
The LED is ON when link is good. The LED blinks when the transmitter or receiver is active.
LED polarity is auto-detected (Active Low/ Active High) based on external pull-up or pull-down
on the pin.
Reset: I, PD
Active: O
Strap2
This pin provides 25-MHz reference clock from XI as default to clock. The output is not
affected by Resets allowing Application to reset PHY without impacting other system getting
impacted. The output clock switches off only by Deep Power Down.
Reset: I, PU
Active: O
Strap1
The pin can be configured to act as LED1 using strap or register configuration. The strap only
latches on power-up and not on pin reset. The LED is ON when link is 100 M. LED remains
OFF if Link is 10 M or no Link.
CLKOUT/
LED1
31
32
LED polarity is auto-detected (Active Low/ Active High) based on external pull-up or pull-down
on the pin.
Reset low: RST_N pin is an active low reset input. Asserting this pin low for at least 25 μs
forces a reset process to occur. Initiation of reset causes strap pins to be re-scanned and
resets all the internal registers of the PHY to default value.
Reset: I, PU
Active: I, PU
RST_N
(1) I = Input, O = Output, I/O = Input/Ouput, A = Analog, PU or PD = Internal pullup or pulldown: Hardware bootstrap configuration
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7 Pin Configuration and Functions (BASIC Mode)
The BASIC mode is one of two modes that the DP83826 can be configured in at start-up. This mode allows the
DP83826 to support all the standard Ethernet applications and matches a common pinout configuration used in
many of today's applications. To configure the DP83826 to BASIC mode, ModeSelect (pin 1) should be shorted
to GND.
32
31
30
29
28
27
26
25
ModeSelect
CEXT
1
2
3
4
5
6
7
8
24 TX_D0
23 TX_EN
VDDA3V3
RD_M
RD_P
22 TX_CLK/Strap5
21 INT
20 RX_ER/Strap6
19 RX_CLK/50MHz_RMII
18 RX_DV/CRS_DV/Strap10
17 VDDIO
TD_M
TD_P
Thermal Pad
(connect to GND)
XO
9
10
11
12
13
14
15
16
(not to scale)
图7-1. RHB Package
32-Pin QFN
(Top View)
表7-1. Pin Functions (BASIC Mode)
PIN
NO
TYPE (1)
DESCRIPTION
NAME
This pin selects the operating mode: BASIC mode or ENHANCED mode. This pin shall be
shorted to GND to configure DP83826 in BASIC mode. For ENHANCED mode, this pin shall
be left NC or pulled-up with a resistor to VDDIO.
Reset: I, PU
Active: I, PU
ModeSelect
1
CEXT
2
3
A
External capacitor: Connect the CEXT pin through a 2-nF capacitor to GND.
Input analog power supply pin: This pin shall be connected with 3.3 V. For decoupling
capacitor requirements, refer to section of datasheet.
VDDA3V3
Power
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表7-1. Pin Functions (BASIC Mode) (continued)
PIN
NAME
TYPE (1)
DESCRIPTION
NO
4
RD_M
A
A
A
A
Differential receive input (PMD): These differential inputs are automatically configured to
accept either 10BASE-Te or 100BASE-TX specific signaling mode.
RD_P
5
TD_M
6
Differential transmit output (PMD): These differential outputs are configured to either
10BASE-Te or 100BASE-TX signaling mode based on the configuration chosen for the PHY.
TD_P
7
Crystal output: reference clock output. XO pin is used for crystal only. Leave this pin floating
when a CMOS-level oscillator is connected to XI.
XO
8
A
Crystal or oscillator input clock:
MII mode or RMII master mode: 25-MHz ±50 ppm-tolerance crystal or oscillator clock.
XI/50MHzIn
9
A
A
RMII slave mode: 50-MHz ±50 ppm-tolerance CMOS-level oscillator clock.
RBIAS
MDIO
10
11
Bias resistance: RBIAS value 6.49 kΩ1% precision connected to ground.
Management data I/O: Bi-directional management data signal that may be sourced by the
management station or the PHY. This pin has internal pullup resistor of 10 kΩ. An external
pullup resistor can be added if needed.
Reset: I, PU
Active: I/O, PU
Management data clock: Synchronous clock to the MDIO serial management input/output
data. This clock may be asynchronous to the MAC transmit and receive clocks. The
maximum clock rate is 25 MHz. There is no minimum clock rate.
Reset: I, PD
Active: I, PD
MDC
12
13
14
15
Reset: I, PU
Active: O
Strap7
RX_D3
RX_D2
RX_D1
Reset: I, PD
Active: O
Strap8
Receive data: Symbols received on the cable are decoded and presented on these pins
synchronous to the rising edge of RX_CLK. They contain valid data when RX_DV is asserted.
A nibble RX_D[3:0] is received in MII mode. 2-bits RX_D[1:0] is received in RMII mode.
Reset: I, PD
Active: O
Strap9
Reset: I, PU
Active: O
Strap0
RX_D0
VDDIO
16
17
18
I/O supply voltage: 3.3 V or 1.8 V. For decoupling capacitor requirements, refer to section of
datasheet.
Power
Reset: I, PD
Active: O
Strap10
Receive data valid: This pin indicates valid data is present on the RX_D[3:0] for MII mode and
on RX_D[1:0] in RMII mode. In MII mode, this pin acts as RX_DV. In RMII mode, this pin acts
as CRS_DV and combines the RMII carrier and receive data valid indications.
RX_DV/
CRS_DV
MII receive clock: MII receive clock provides a 25-MHz reference clock for 100-Mbps speed
and a 2.5-MHz reference clock for 10-Mbps speed, which is derived from the received data
stream.
In RMII master mode, this provides 50-MHz reference clock. In RMII slave mode, this pin is
not used and remains Input/PD.
RX_CLK/
50MHz_RMII
Reset: I, PD
Active: O
19
20
Receive Error: This pin indicates that an error symbol has been detected within a received
packet in both MII and RMII mode. In MII mode, RX_ER is asserted high synchronously to the
rising edge of RX_CLK. In RMII mode, RX_ER is asserted high synchronously to the rising
edge of the reference clock. RX_ER is asserted high for every reception error, including
errors during Idle.
Reset: I, PD
Active: O
Strap6
RX_ER
The strap only latches upon power-up and not on pin reset.
Interrupt: The default function of this pin is power down. Register access is required to
configure this pin as an interrupt. In power down function, an active low signal on this pin
places the device in power down mode. When this pin is configured as an interrupt pin, this
pin is asserted low when an interrupt condition occurs. The pin has an open-drain output with
a weak internal pullup resistor (9.5 kΩ). Some applications may require an external PU
resistor.
Reset: I, PU;
Active: I, PU
INT
21
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表7-1. Pin Functions (BASIC Mode) (continued)
PIN
TYPE (1)
DESCRIPTION
NAME
NO
MII transmit clock: MII Transmit Clock provides a 25-MHz reference clock for 100-Mbps
speed and a 2.5-MHz reference clock for 10-Mbps speed. Note that in MII mode, this clock
has constant phase referenced to the reference clock. Applications requiring such constant
phase may use this feature. Unused in RMII Mode.
Reset: I, PD
Active: O
Strap5
TX_CLK
22
Transmit enable: TX_EN is presented on the rising edge of the TX_CLK. TX_EN indicates the
presence of valid data inputs on TX_D[3:0] in MII mode and on TX_D[1:0] in RMII mode.
TX_EN is an active high signal.
Reset: I, PD
Active: I, PD
TX_EN
23
Reset: I, PD
Active: I, PD
TX_D0
TX_D1
TX_D2
TX_D3
24
25
26
27
Transmit data:
Reset: I, PD
Active: I, PD
In MII mode, the transmit data nibble received from the MAC is synchronous to the rising
edge of TX_CLK.
Reset: I, PD
Active: I, PD
In RMII mode, TX_D[1:0] received from the MAC is synchronous to the rising edge of the
reference clock.
Reset: I, PD
Active: I, PD
Collision detect:
Reset: I, PD
Active: O
Strap4
In MII mode: For Full-Duplex mode, this pin is always LOW. In Half Duplex mode, this pin is
COL
CRS
28
29
asserted HIGH only when both transmit and receive media are non-idle.
In RMII mode, this pin is not used.
Carrier sense:
Reset: I, PD
Active: O
In MII mode this pin is asserted high when the receive or transmit medium is non-idle.
Strap3
carrier sense or receive data valid. In RMII mode, this pin is not used.
LED0: This LED indicates transmit and receive activity in addition to the status of the Link.
The LED is ON when link is good. The LED blinks when the transmitter or receiver is active.
LED polarity is fixed Active Low. If an external pull-down is required for strapping purposes,
both the strap and LED series resistance will need adjustment for correct operation of both
the LED and the strap. Please see the LED section for further details.
Reset: I, PU
Active: O
Strap2
LED0
30
LED1: The pin acts as LED1 as default. The LED is ON when link is 100 M. LED remains
OFF if the Link is 10 M, or there is no Link. This pin can be configured to TX_ER through
register configuration.
LED polarity is fixed Active Low. If an external pull-down is required for strapping purposes,
both the strap and LED series resistance will need adjustment for correct operation of both
the LED and the strap. Please see the LED section for further details.
Reset: I, PU
Active: O
Strap1
LED1/TX_ER
RST_N
31
32
Reset low: RST_N pin is an active low reset input. Asserting this pin low for at least 25 μs
forces a reset process to occur. Initiation of reset causes strap pins to be re-scanned and
resets all the internal registers of the PHY to default value.
Reset: I, PU
Active: I, PU
(1) I = Input, O = Output, I/O = Input/Ouput, A = Analog, PU or PD = Internal pullup or pulldown: Hardware bootstrap configuration
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8 Specifications
8.1 绝对最大额定值
在自然通风条件下的工作温度范围内测得(除非另有说明)(1)
参数
最小值
–0.3
–0.3
–0.3
-65
最大值
单位
VDDA3V3
4
V
模拟电源电压
VDDIO3V3
VDDIO1V8
Tstg
4
2.1
150
4
V
V
IO 电源电压
IO 电源电压
贮存温度
°C
V
-0.6
MDI 引脚
-0.3
4
V
MAC 接口引脚
MDIO、MDC 接口引脚
XI
-0.3
4
V
-0.3
4
V
-0.3
4
V
复位
(1) 超出“绝对最大额定值”下列出的压力可能会对器件造成永久损坏。这些仅仅是压力额定值,并不表示器件在这些条件下以及在“建议
运行条件”以外的任何其他条件下能够正常运行。长时间处于绝对最大额定条件下可能会影响器件的可靠性。
8.2 ESD 等级
参数
定义
值
单位
人体放电模型(HBM),符合ANSI/ESDA/JEDEC JS-001(1) MDI
(媒体相关接口)引脚
+/- 5
kV
ESD (HBM)(1)
人体放电模型(HBM),符合ANSI/ESDA/JEDEC JS-001(1),除
MDI 以外的所有引脚
+/- 2
±750
kV
V
充电器件模型(CDM),符合JEDEC 规范JESD22-C101,所有
引脚
ESD (CDM)(2)
(1) JEDEC 文档JEP155 指出:500V HBM 可实现在标准ESD 控制流程下安全生产。如果具备必要的预防措施,则可以在低于500V HBM
时进行生产。列为±5kV 和/或±4kV 的引脚实际上可能具有较高的性能。
(2) JEDEC 文件JEP157 指出:250V CDM 可实现在标准ESD 控制流程下安全生产。若部署必要的预防措施,不足250V CDM 时也能进
行生产。列为±500 V 的引脚实际上可能具有更高的性能。
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8.3 建议运行条件
在自然通风条件下的工作温度范围内测得(除非另有说明)
参数
最小值
典型值
3.3
最大值
3.6
单位
V
VDDA3V3
VDDIO3V3
VDDIO1V8
3
3
模拟电源电压
3.3
3.6
V
IO 电源电压
1.62
1.8
1.98
V
自然通风工作温度
(DP83826E)
Ta
Ta
25
25
105
85
C
C
–40
–40
自然通风工作温度
(DP83826I)
TX_EN、TX_D0、TX_D1、TX_D2、TX_D3、
TX_CLK、RX_D0、RX_D1、RX_D2、RX_D3、
RX_DV、RX_ER、MDIO、MDC、COL/LED2、
CRS、CLKOUT/LED1、INT/PWDN、RESET、
TX_ER
VDDIO:1.8v
1.62
1.8
1.98
V
1.62
1.62
1.8
1.8
1.98
1.98
V
V
XI 振荡器输入
LED0
TX_EN、TX_D0、TX_D1、TX_D2、TX_D3、
TX_CLK、RX_D0、RX_D1、RX_D2、RX_D3、
RX_DV、RX_ER、MDIO、MDC、COL/LED2、
CRS、CLKOUT/LED1、INT/PWDN、RESET、
TX_ER
VDDIO:3.3v
3.0
3.3
3.6
V
3.0
3.0
3.3
3.3
3.6
3.6
V
V
XI 振荡器输入
LED0
8.4 热性能信息
(1)
热指标
单位
RθJA
52
°C/W
结至环境热阻
RθJC(top)
RθJC(bot)
RθJB
42
°C/W
°C/W
°C/W
°C/W
°C/W
结至外壳(顶部)热阻
结至外壳(底部)热阻
结至电路板热阻
11.9
31.5
2.1
YJT
结至顶部特征参数
YJB
31.4
结至电路板特征参数
(1) 有关新旧热指标的更多信息,请参阅半导体和IC 封装热指标应用报告。
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8.5 电气特性
在VDDA3V3 = 3V3 的自然通风条件下的工作温度范围内(除非另有说明)(1)
参数
IEEE Tx 一致性(100BaseTx)
差分输出电压
测试条件
最小值
典型值
最大值
单位
950
1050
mV
IEEE Tx 一致性(10BaseTe)
输出差分电压(2)
1.54
1.75
45
1.96
V
功耗基线(活动模式、50% 流量、数据包大小:1518、随机内容、150 米电缆)
I(VDDA3
MII (100BaseTx)
V3=3V3)
53
mA
MII (10BaseTe)
35
45
35
45
35
46
53
46
53
46
mA
mA
mA
mA
mA
RMII 主模式(100BaseTx)
RMII 主模式(10BaseTe)
RMII 从模式(100BaseTx)
RMII 从模式(10BaseTe)
I(VDDIO
MII (100BaseTx)
=3V3)
8
14
mA
MII (10BaseTe)
5
9
9
7
5
12
14
12
8.5
6
mA
mA
mA
mA
mA
RMII 主模式(100BaseTx)
RMII 主模式(10BaseTe)
RMII 从模式(100BaseTx)
RMII 从模式(10BaseTe)
I(VDDIO
MII (100BaseTx)
=1V8)
5
7
mA
MII (10BaseTe)
3
5
5
3
2
6
7
6
6
3
mA
mA
mA
mA
mA
RMII 主模式(100BaseTx)
RMII 主模式(10BaseTe)
RMII 从模式(100BaseTx)
RMII 从模式(10BaseTe)
功耗(工作模式最坏情况,100% 流量,数据包大小:1518、随机内容、150 米电缆)
I(VDDA3
MII (100BaseTx)
V3=3V3)
44
55
mA
MII (10BaseTe)
35
44
35
44
35
48
55
48
55
48
mA
mA
mA
mA
mA
RMII 主模式(100BaseTx)
RMII 主模式(10BaseTe)
RMII 从模式(100BaseTx)
RMII 从模式(10BaseTe)
I(VDDIO
MII (100BaseTx)
=3V3)
10
15
mA
MII (10BaseTe)
5
11
9
12
15
12
12
10
mA
mA
mA
mA
mA
RMII 主模式(100BaseTx)
RMII 主模式(10BaseTe)
RMII 从模式(100BaseTx)
RMII 从模式(10BaseTe)
8
5
I(VDDIO
MII (100BaseTx)
=1V8)
6
2
9
6
mA
mA
MII (10BaseTe)
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8.5 电气特性(continued)
在VDDA3V3 = 3V3 的自然通风条件下的工作温度范围内(除非另有说明)(1)
参数
测试条件
最小值
典型值
最大值
单位
6
9
7
8
6
mA
RMII 主模式(100BaseTx)
RMII 主模式(10BaseTe)
RMII 从模式(100BaseTx)
RMII 从模式(10BaseTe)
5
4
2
mA
mA
mA
功耗(低功耗模式)
I(AVDD3
V3=3V3)
开启LPI 时EEE 模式下的100 BaseTx 链
路
15
mA
100 BaseTx EEE 模式
11
18
mA
mA
mA
IEEE 断电
主动睡眠
复位
12.5
I(VDDIO
=3V3)
开启LPI 时EEE 模式下的100 BaseTx 链
路
6
mA
mA
mA
mA
mA
mA
mA
mA
100 BaseTx EEE 模式
IEEE 断电
I(VDDIO
=3V3)
10.5
10.5
10.5
I(VDDIO
=3V3)
主动睡眠
I(VDDIO
=3V3)
复位
I(VDDIO
=1V8)
开启LPI 时EEE 模式下的100 BaseTx 链
路
4
100 BaseTx EEE 模式
IEEE 断电
I(VDDIO
=1V8)
5.5
5.5
5.5
I(VDDIO
=1V8)
主动睡眠
I(VDDIO
=1V8)
复位
自举直流特性(2 级)
VIH_3v3
1.3
1.3
V
V
V
V
高电平自举阈值:3V3
低电平自举阈值:3V3
高电平自举阈值:1V8
低电平自举阈值:1V8
VIL_3v3
0.6
VIH_1v8
VIL_1v8
0.6
30
晶体振荡器
15
pF
负载电容
IO
VDDIO = 3.3V ±10%
1.7
2.4
V
V
V
V
高电平输入电压
低电平输入电压
高电平输出电压
低电平输出电压
VDDIO = 3.3V ±10%
0.8
0.8
3V3
IOH =-2mA、VDDIO = 3.3V ±10%
IOL= 2mA、VDDIO = 3.3V ±10%
0.65 x
VDDIO
VDDIO = 1.8V ±10%
V
V
V
高电平输入电压
低电平输入电压
高电平输出电压
0.35 x
VDDIO
VDDIO = 1.8V ±10%
1V8
VDDIO -
0.45
IOH =-2mA、VDDIO = 1.8V ±10%
0.45
15
V
IOL= 2mA、VDDIO = 1.8V ±10%
TA = -40℃至85℃,VIN=VDDIO
TA = -40℃至105℃,VIN=VDDIO
低电平输出电压
Iih (VIN=VCC)
Iih (VIN=VCC)
uA
uA
25
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8.5 电气特性(continued)
在VDDA3V3 = 3V3 的自然通风条件下的工作温度范围内(除非另有说明)(1)
参数
测试条件
最小值
典型值
最大值
单位
Iil (VIN=GND)
15
uA
TA = -40℃至85℃,VIN=GND
TA = -40℃至105℃,VIN=GND
三态输出高电流(-40C 至85C)
三态输出高电流(-40C 至105C)
三态输出低电流(-40 至85C)
三态输出低电流(-40 至105C)
Iil (VIN=GND)
25
15
uA
uA
uA
uA
uA
kΩ
kΩ
pF
pF
pF
pF
V
Iozh
Iozh
Iozl
-15
-25
-15
-25
7.5
7.5
25
15
Iozl
25
10
10
1
12.5
12.5
R 下拉
内部下拉电阻
R 上拉
内部上拉电阻器
CIN
输入电容XI
输入电容输入引脚
输出电容XO
CIN
5
COUT
COUT
1
输入电容输入引脚
5
输出电容XO
输出电容输出引脚
0.9
1.65
XI 输入osc 时钟共模VDDIO 1V8
XI 输入osc 时钟共模VDDIO 3V3
V
RX_D[3:0]、RX_ER、RX_DV、
RX_CLK、TX_CLK
Rseries
50
集成MAC 串联终端电阻器
Ω
(1) 由生产测试、特性或设计确保
(2) 要求寄存器0x030E 编程到0x4A40
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8.6 时序要求
(1)
参数
最小值
标称值
最大值
单位
上电时序
T1
0.5
0
50
200
50
ms
ms
ms
ms
ms
V
电压斜坡持续时间(0% 至100% VDDIO)
T2,(2)
T3
电源时序控制VDDA3V3,后跟VDDIO 或VDDIO,后跟VDDA3V3(5)
电压斜坡持续时间(VDDA3V3 的0% 至100%)
POR 释放时间/加电至SMI 就绪:用于寄存器访问的前导码前上电稳定时间
加电至FLP
0.5
T4
50
T5
1500
0.3
2
VDDA3V3 上的基座电压,电源斜升前的VDDIO
复位时序
T1
25
us
ms
ms
ms
ms
复位脉冲宽度:能够复位的最小复位脉冲宽度(无消抖电容)
重置为SMI 就绪:用于寄存器访问的前导码前复位后稳定时间
到FLP 的复位
T2
T3
1500
0.5
重置为100M 信令(捆绑模式)
0.2
重置为RMII 主时钟
快速链路脉冲时序
T1
111
125
62.5
104
16
139
μs
μs
ns
时钟脉冲到时钟脉冲周期
T2
T3
T4
T5
55.5
69.5
时钟脉冲到数据脉冲周期
时钟/数据脉冲宽度
FLP 突发到FLP 突发周期
FLP 突发宽度
8
24
33
ms
ms
2
17
突发宽度脉冲
链路接通时序
使用搭接启用快速链路丢弃,150 米电缆
10
10
10
10
10
11
us
us
us
us
us
us
使用模式1 的快速链路丢弃时间(信号/能量损失指示)
使用模式2 的快速链路丢弃时间(低SNR 阈值)
使用模式3 的快速链路丢弃时间(MLT3 错误计数)(4)
使用模式4 的快速链路丢弃时间(RX 错误计数)
使用模式5 的快速链路丢弃时间(解扰器链路丢弃)(4)
100M EEE 时序
210
20
us
ms
us
睡眠时间
静态时间
36
唤醒时间(Tw_sys_tx)
刷新时间
200
µs
100M MII 接收时序
T1
T2
16
10
20
20
24
30
ns
ns
RX_CLK 高电平/低电平时间
RX_D[3:0],从RX_CLK 上升的RX_ER、RX_DV 延迟
100M MII 传输时序
T1
T2
T3
16
10
0
24
ns
ns
ns
TX_CLK 高电平/低电平时间
TX_D[3:0],TX_ER、TX_EN 设置为TX_CLK
TX_D[3:0],来自TX_CLK 的TX_ER、TX_EN 保持
10M MII 接收时序
RX_CLK 高电平/低电平时间(3)
T1
T2
160
100
200
240
300
ns
ns
RX_D[3:0],从RX_CLK 上升的RX_ER、RX_DV 延迟(3)
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8.6 时序要求(continued)
(1)
参数
最小值
标称值
最大值
单位
10M MII 传输时序
T1
T2
T3
190
25
0
200
210
ns
ns
ns
TX_CLK 高电平/低电平时间
TX_D[3:0],TX_ER、TX_EN 设置为TX_CLK
TX_D[3:0],来自TX_CLK 的TX_ER、TX_EN 保持
100M RMII 主时序
RMII 主时钟周期
RMII 主时钟占空比
100M RMII 时序
20
ns
%
35
65
T2
4
2
4
ns
ns
ns
TX_D[1:0],TX_ER、TX_EN 设置为参考时钟上升沿
来自参考时钟上升沿的TX_D[1:0]、TX_ER、TX_EN 保持
来自参考时钟上升的RX_D[1:0]、RX_ER、CRS_DV 延迟
T3
T4
14
13
SMI 时序
T1
0
10
10
ns
ns
MDC 至MDIO(输出)延迟时间
MDIO(输入)至MDC 建立时间
MDIO(输入)至MDC 保持时间
MDC 频率
T2
T3
ns
T4
2.5
24
MHz
输出时钟时序(50M RMII 主时钟)
频率(PPM)
50
450
5
ppm
ps
抖动(长期500 周期)
上升/下降时间
ns
40
35
60
%
占空比
输出时钟时序(25M 时钟输出)
频率(PPM)
50
65
ppm
%
占空比
4000
5000
300
ps
上升时间
ps
下降时间
ps
抖动(长期:500 个周期)
抖动(短期)
250
ps
25
MHz
频率
25MHz 输入时钟容差
频率容差
-100
100
5
ppm
ns
上升/下降时间
50
ps
抖动容差(RMS)
1kHz 时的输入相位噪声
10kHz 时的输入相位噪声
100kHz 时的输入相位噪声
1MHz 时的输入相位噪声
10MHz 时的输入相位噪声
占空比
-98 dBc/Hz
-113 dBc/Hz
-113 dBc/Hz
-113 dBc/Hz
-113 dBc/Hz
40
60
%
50MHz 输入时钟容差
频率容差
-100
100
5
ppm
ns
上升/下降时间
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8.6 时序要求(continued)
(1)
参数
抖动容差(RMS)
最小值
标称值
最大值
50
单位
ps
ps
源自相位噪声的抖动容差长期抖动(100,000 个周期)
1kHz 时的输入相位噪声
10kHz 时的输入相位噪声
100kHz 时的输入相位噪声
1MHz 时的输入相位噪声
10MHz 时的输入相位噪声
占空比
-87 dBc/Hz
-107 dBc/Hz
-107 dBc/Hz
-107 dBc/Hz
-107 dBc/Hz
40
60
%
延迟时序
MII 100M Tx(MII 到MDI):上升沿TX_CLK 在MDI 上置位TX_EN 至
SSD 符号、启用FAST RX_DV、100 米电缆
38
40
170
540
96
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
MII 100 Rx(MDI 到MII):MDI 上的SSD 符号到RX_CLK 的上升沿、
RX_DV 置位、启用FAST RX_DV、100 米电缆
166
MII 10M Tx(MII 到MDI):在MDI 上设置TX_EN 至SSD 符号的上升沿
TX_CLK
RMII 从器件100M Tx(RMII 到MDI):从器件RMII 上升沿XI 时钟,在
MDI 上置位TX_EN 至SSD 符号,启用FAST RX_DV,100 米电缆
88
88
RMII 主器件100M Tx(RMII 到MDI):主器件RMII 上升沿时钟,在MDI
上置位TX_EN 至SSD 符号,启用FAST RX_DV,100 米电缆
96
RMII 从站10M Tx(RMII 到MDI):从器件RMII 上升沿XI 时钟在MDI 上
置位TX_EN 至SSD 符号
1360
1360
1640
288
270
2152
RMII 主器件10M Tx(RMII 至MDI)主器件RMII 上升沿时钟,在MDI 上
置位TX_EN 至SSD 符号
MII 10M Rx(MDI 至MII):MDI 上的SSD 符号到RX_CLK 的上升沿、
RX_DV 置位、启用FAST RX_DV、100 米电缆
RMII 从器件100M Rx(MDI 到RMII):MDI 上的SSD 符号到XI 时钟的从
器件RMII 上升沿、CRS_DV 置位、启用FAST RX_DV、100 米电缆
268
252
RMII 主器件100M Rx(MDI 到RMII):MDI 上的SSD 符号到主时钟的主
RMII 上升沿,CRS_DV 置位
RMII 从器件10M(MDI 到RMII):MDI 上的SSD 符号到XI 时钟的从器件
RMII 上升沿,CRS_DV (10M) 置位
2110
RMII 主器件10M(MDI 至RMII):MDI 上的SSD 符号到主时钟的主RMII
上升沿,CRS_DV 置位(10M)
2110
0
2152
4
ns
ns
2
MII:XI 至TXCLK 相位差(跨复位、下电上电)
(1) 由设计、生产或特性测试确保
(2) 时钟应在电源的功率斜升开始时可用。如果时钟被延迟,在POR 完成后需要额外的RESET_N。可在100 微秒的时钟稳定和POR 完成
后启动复位
(3) 在接收数据的第一个半字节时,PHY 从本地时钟源切换到恢复时钟源。它会使RX_CLK 和RX_CLK 延伸至RX_DV 延迟
(4) MLT3 和解码器快速链路丢弃需要额外配置。请参阅特性部分
(5) VDDIO 或AVDD 电源都可以一起斜升,也可以将其中任何一个电源的斜升延迟至最大值)
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8.7 Timing Diagrams
T1
VDDIO
0.3V
0V
T3
T2
VDDA3V3
0.3V
0V
Clock in external clock mode shall be available at power ramp. If not
available, it is recommended to hold RESET_N low and release it at least 100
us aꢀer external clock is stable.
XI
Hardware
RESET_N
T4
MDC
FLP Burst
T5
图8-1. Power-Up Timing (Power Sequencing)
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VDDA3V3
XI
tT1
Hardware
RESET_N
32 Clocks
tT2
MDC
T3
FLP Burst
图8-2. Reset Timing (POR)
MDC
tT4t
tT1t
MDIO
(output)
MDC
tT2t
tT3t
MDIO
(input)
Valid Data
图8-3. Serial Management Timing
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tT1t
XI
Master Clock
tT2t
tT3t
TX_D[1:0]
TX_EN
Valid Data
图8-4. RMII Transmit Timing
tT1t
XI
RX_CLK
Master Clock
tT2t
RX_D[1:0]
CRS_DV
RX_DV
Valid Data
RX_ER
图8-5. RMII Receive Timing
tT1t
tT1t
TX_CLK
tT2t
tT3t
TX_D [3:0]
TX_EN
Valid Data
图8-6. 100-M MII Transmit Timing
tT1t
tT1t
RX_CLK
tT2t
RX_D [3:0]
RX_DV
RX_ER
Valid Data
图8-7. 100-M MII Receive Timing
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tT1t
tT1t
TX_CLK
tT2t
tT3t
TX_D [3:0]
TX_EN
Valid Data
图8-8. 10-M MII Transmit Timing
tT1t
tT1t
RX_CLK
tT2t
RX_D [3:0]
RX_DV
RX_ER
Valid Data
图8-9. 10-M MII Receive Timing
tT1t
tT2t
T3
T3
Fast Link
Pulse(s)
Clock
Pulse
Data
Pulse
Clock
Pulse
Data
Pulse
tT4t
tT5t
FLP Bursts
FLP Burst
图8-10. Fast Link Pulse Timing
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TX_CLK
TX_EN
TX_D[3:0]
tT1t
PMD Output
Pair
IDLE
(J/K)
DATA
图8-11. 100BASE-TX Transmit Latency Timing
PMD Input Pair
IDLE
(J/K)
DATA
T2
RX_DV
RX_CLK
图8-12. 100BASE-TX Receive Latency Timing
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8.8 Typical Characteristics
图8-13. 100BASE-TX PMD Eye Waveform
图8-14. 10BASE-Te Link Pulse Waveform
图8-15. Auto-Negotiation Fast Link Pulses Waveform
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9 Detailed Description
9.1 Overview
The DP83826 is a single-port physical layer transceiver compliant to IEEE802.3 10BASE-Te and 100BASE-TX
standards. The DP83826 is designed to meet stringent Industrial fieldbus applications' needs and offers very low
latency, deterministic variation in latency (across reset, power cycle), fixed phase between XI and TX_CLK, low
power, and configuration using hardware bootstraps to achieve fast link up. The device supports the standard
MII and RMII (Master mode and Slave mode) for direct connection to the media access controller (MAC). Its
dedicated CLKOUT pin can be used to clock other modules on the system. In addition, the PWRDN pin controls
the DP83826 link up from power-on-reset (POR) and helps with design of asynchronous power-up of the
DP83826 and host system-on-a-chip (SoC) or field-programmable-gate-array (FPGA) controller.
The device operates from a single 3.3-V power supply and has an integrated LDO to provide voltage rails
needed for internal blocks. The device allows I/O voltage interfaces of 3.3 V or 1.8 V, which in turn enables the
DP83826 to operate as a single-supply PHY. Automatic supply configuration within the DP83826 allows for any
combination of VDDIO supply without the need for additional configuration settings.
The DP83826 uses mixed-signal processing to perform equalization, data recovery, and error correction to
achieve robust operation over a CAT5e twisted-pair cable length greater than 150 meters.
DP83826 offers two modes selectable during the power-up sequence using hardware bootstraps.
• BASIC mode
• ENHANCED mode
BASIC mode provides all the features required for standard Ethernet applications, using a common pinout
configuration used in many of today's applications. This makes it easy to evaluate and test the product on
existing platforms. The integrated MAC and MDI terminations streamline the design of boards when using the
DP83826. All the required clock outputs are generated from a single PLL with a 25-MHz external crystal or
oscillator input.
备注
For a step-by-step approach on using the DP83826 BASIC mode in existing systems that use a
common standard Ethernet pinout, please refer to SNLA338.
ENHANCED mode includes all the modes of operation described in BASIC Mode, however, the change in pins
enable additional features. This makes it easy to use the DP83826 in ENHANCED Mode for Ethernet fieldbus
applications in addition to the standard Ethernet applications. The feature includes:
• Dedicated Reference Clock Output: CLKOUT (pin 31) can be used to synchronize the whole system resulting
in lower latency (reduced FIFO on MAC). This clock is enabled at POR and remains available across the
reset. It also reduces the need for a dedicated clock for other PHYs and the host SoC/FPGA on the board.
• Dedicated HW Strap to use Force Mode, MDI or MDIX for fast link-up from POR and Reset.
• IEEE Power Down Pin: PWRDN (pin 21) helps asynchronous power-up of the DP83826 and host SoC/FPGA
control, and can still manage the DP83826 link-up through this dedicated pin.
• PHY address hardware bootstraps on non MAC interface pins to improve Signal Integrity on MII and RMII
MAC interface pins.
For pin maps of both modes, refer to section 节6and 节7.
To configure the hardware bootstraps for both modes, refer to sections 节9.4.1.1 and 节9.4.1.2.
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9.2 Functional Block Diagram
MII Option
Serial
Management
RMII Option
MII / RMII Interface
TX
RX
Data
TX_CLK
Data
RX_CLK
MII
Registers
10BASE-Te
And
10BASE-Te
And
100BASE-TX
100BASE-TX
Auto-Negotiation
Wake-on-LAN
Energy Efficient Ethernet
Clock
Generation
Transmit Block
Receive Block
DAC
ADC
BIST
LED
Driver
Cable Diagnostics
Auto-MDIX
Reference
Clock
TD
RD
LEDs
9.3 Feature Description
9.3.1 Auto-Negotiation (Speed/Duplex Selection)
Auto-Negotiation provides a mechanism for exchanging configuration information between the two ends of a link
segment. This mechanism is implemented by exchanging fast link pulses (FLP). FLPs are burst pulses that
provide the information used to communicate the abilities between two devices at each end of a link segment.
The DP83826 supports 100BASE-TX and 10BASE-Te modes of operation for auto-negotiation. Auto-negotiation
ensures that the highest common speed is selected based on the advertised abilities of the link partner and the
local device. Auto-negotiation can be enabled or disabled in hardware, using the bootstrap, or by register
configuration, using bit[12] in the BASIC mode Control Register (BMCR, address 0x0000). For further details
regarding auto-negotiation, refer to Clause 28 of the IEEE 802.3 specification.
9.3.2 Auto-MDIX Resolution
The DP83826 can determine if a “straight”or “crossover”cable is used to connect to the link partner. It can
automatically re-assign to Td (MDI) channel and Rd (MDIX) channel to establish link with the link partner. Auto-
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MDIX resolution precedes the actual Auto-Negotiation process that involves exchange of FLPs to advertise
capabilities. Automatic MDI/MDIX is described in IEEE 802.3 Clause 40, section 40.8.2. It is not a required
implementation for 10BASE-Te and 100BASE-TX. Auto-MDIX can also be used when operating the PHY in
Force Mode.
Auto-MDIX can be enabled or disabled in hardware, using the hardware bootstrap, or by register configuration,
using bit[15] of the PHY Control Register (PHYCR, address 0x0019). When Auto-MDIX is disabled, the PMA is
forced to either MDI (“straight”) or MDIX (“crossover”). Manual configuration of MDI or MDIX can also be
accomplished using register configuration, using bit[14] of the PHYCR or hardware bootstraps in ENHANCED
mode.
9.3.3 Energy Efficient Ethernet
9.3.3.1 EEE Overview
Energy Efficient Ethernet (EEE), defined by IEEE 802.3az, is a capability integrated into Layer 1 (Physical Layer)
and Layer 2 (Data Link Layer) to operate in Low Power Idle (LPI) mode. In LPI mode, power is saved during
periods of low packet utilization. EEE defines the protocol to enter and exit LPI mode without dropping the link or
corrupting packets.
The DP83826 EEE supports 100-Mbps and 10-Mbps speeds. It is supported for both MII and RMII MAC
interface. In 10BASE-Te operation, EEE operates with a reduced transmit amplitude that is fully interoperable
with a 10BASE-T PHY.
EEE must be enabled through register programming. The steps below describe how to configure the DP83826
for EEE through the MDC/MDIO interface.
Register Address
001F
Data
8000
0002
008B
4F12
0180
A681
0003
0800
8848
FE00
261D
1F30
2864
FFF2
FE36
0000
0800
3300
203C
04D1
04D3
04DF
033E
033F
0123
031B
0466
04CF
0416
04F5
04E0
031F
0308
04F4
0000
9.3.3.2 EEE Negotiation
EEE is advertised during auto-negotiation. Auto-Negotiation is performed at power up, on management
command, after link failure, or due to user intervention. EEE is supported if and only if both link partners
advertise EEE capabilities. If EEE is not supported, all EEE functions are disabled and the MAC should not
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assert LPI. To advertise EEE capabilities, the PHY needs to exchange an additional formatted next page and
unformatted next page in sequence.
EEE Negotiation can be activated using Register Access. IEEE 802.3az defines MMD3 and MMD7 as the
locations for EEE control and status registers. The MMD3 registers 0x1014, 0x1001, 0x1016, and MMD7
registers 0x203C and 0x203D contain all the required controls and status indications for operating EEE. The
Energy Efficient Ethernet Configuration Register #3 (EEECFG3, address 0x04D1) contains controls for EEE
configuration bypass.
By default, EEE capabilities are bypassed. To advertise EEE based on MMD3 and MMD7 registers, EEE
capabilities bypass needs to be disabled (0x04D1.0 = 1, 0x04D1.3 = 1) and EEE Advertisement shall be enabled
(MMD7 0x203C.1 = 1).
9.3.4 EEE for Legacy MACs Not Supporting 802.3az
The device can be configured to initiate LPI signaling (Idle and Refresh) through register programming as well.
This feature enables the system to perform EEE even when the MAC used is not supporting EEE. In this mode,
responsibility of enabling and disabling LPI signaling lies on the Host Controller Application. While the
*DP83826* is in LPI signaling mode, the application moves the DP83826 into active mode before sending any
data over the MAC interface.
The DP83826 does not have buffering capability to store the data while in LPI signaling mode. To enable EEE
through register configuration, the following registers must be configured:
1. Enable EEE capabilities by writing 0x04D1.0 = 1, 0x04D1.3 = 1
2. Advertise EEE capabilities during auto-negotiation by writing (MMD7 0x203C.1 = 1)
3. Renegotiate the link by writing 0x0000.9 = 1
4. Forced Tx LPI idles by writing 0x04D1.12 = 1
5. Write 0x04D1.12 = 0 to stop transmitting LPI Idles
9.3.5 Wake-on-LAN Packet Detection
Wake-on-LAN (WoL) provides a mechanism to detect specific frames and notify the connected controller through
either register status change, GPIO indication, or an interrupt flag. The WoL feature within the DP83826 device
allows for connected devices residing above the Physical Layer to remain in a low power state until frames with
the qualifying credentials are detected. This device supports WoL Magic Packet™ frame type. When a qualifying
WoL frame is received, the device WoL logic circuit generates a user-defined event (either pulses or level
change) through the GPIO pins or a status interrupt flag to inform a connected controller that a wake event has
occurred. The device includes a cycle redundancy check (CRC) gate to prevent invalid packets from triggering a
wake-up event. The Wake-on-LAN feature includes:
• Identification of WoL frames in all supported speeds (100BASE-TX and 10BASE-Te)
• Wake-up interrupt generation upon reception of a WoL frame
• CRC error checking of WoL frames to prevent interrupt generation from invalid frames
• Magic Packet technology with SecureOn password protection
9.3.5.1 Magic Packet Structure
When configured for Magic Packet detection, the DP83826 scans all incoming frames addressed to the node for
a specific data sequence. This sequence identifies the frame as a Magic Packet frame.
A Magic Packet frame must also meet the basic requirements for the LAN technology chosen, such as SOURCE
ADDRESS, DESTINATION ADDRESS (which may be the receiving station’s IEEE address or a BROADCAST
ADDRESS), and CRC.
The specific Magic Packet sequence consists of 16 duplications of the MAC address of this node, with no breaks
or interruptions, followed by Secure-ON password if security is enabled. This sequence can be located anywhere
within the packet, but must be preceded by a synchronization stream. The synchronization stream is defined as
6 bytes of 0xFF.
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DEST (6 bytes)
SRC (6 bytes)
MISC (X bytes, X >= 0)
FF … FF (6 bytes)
DEST * 16
MAGIC Pattern
Secure-On Password (6 bytes)
MISC (Y bytes, Y >= 0)
CRC (4 bytes)
Only if Secure-On is Enabled
图9-1. Magic Packet Structure
9.3.5.2 Magic Packet Example
The following is an example Magic Packet for a Destination Address of 11h 22h 33h 44h 55h 66h and a
SecureOn password 2Ah 2Bh 2Ch 2Dh 2Eh 2Fh:
DESTINATION SOURCE MISC FF FF FF FF FF FF
11 22 33 44 55 66 11 22 33 44 55 66 11 22 33 44 55 66
11 22 33 44 55 66 11 22 33 44 55 66 11 22 33 44 55 66
11 22 33 44 55 66 11 22 33 44 55 66 11 22 33 44 55 66
11 22 33 44 55 66 11 22 33 44 55 66 11 22 33 44 55 66
11 22 33 44 55 66 11 22 33 44 55 66 11 22 33 44 55 66
11 22 33 44 55 66 2A 2B 2C 2D 2E 2F MISC CRC
9.3.5.3 Wake-on-LAN Configuration and Status
Wake-on-LAN functionality is configured through the Receive Configuration Register (RXFCFG, address
0x04A0). Wake-on-LAN status is reported in the Receiver Status Register (RXFS, address 0x04A1). The Wake-
on-LAN interrupt flag configuration and status is located in the MII Interrupt Status Register #2 (MISR2, address
0x0013).
9.3.6 Low Power Modes
The DP83826 device supports three low power modes. This section discusses the principles behind these low
power modes and configuration to enable them.
9.3.6.1 Active Sleep
Active sleep mode reduces power consumption when no link partner is connected. The feature can be enabled
during initialization of the PHY by writing the correct bit to the PHYSCR register. The feature can be verified by
reading the BISCR register.
Once Active Sleep in enabled and when the PHY does not detect a cable connection, the PHY automatically
enters active sleep mode. When the device enters this mode, all internal circuitry shuts down except for the SMI
circuitry and energy detection circuitry on the TD± and RD± pins. In active sleep mode, the device transmits
normal link pulses (NLP) every 1.4 seconds to check for the presence of a link partner. When a link partner is
detected, the PHY automatically switches back to Normal mode, powering the rest of the internal circuitry.
The device enables active sleep mode by setting bits[14:12] = 0b110 in the PHY Specific Control Register
(PHYSCR, address 0x0011).
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9.3.6.2 IEEE Power-Down
IEEE power-down switch disables all PHY circuitry except the SMI and internal clock circuitry.
IEEE power-down switch can be activated by either register access or through the INTR/PWRDN pin when the
pin is configured for power-down function.
To enable IEEE power-down switch through the INTR/PWRDN pin, the pin must be driven LOW to ground.
To enable IEEE power-down switch through the SMI, set bit[11] = 1 in the BASIC mode Control Register (BMCR,
address 0x0000).
9.3.6.3 Deep Power Down State
A Deep Power Down state (DPD) disables all PHY circuitry except the SMI. In this mode, the device disables the
PHY PLL to further reduce power consumption.
The device uses this sequence to enter DPD state.
1. Enable DPD state (0x0428.2 = 1)
2. Enable IEEE power-down state (pin or 0x0000.11 = 1)
9.3.7 RMII Repeater Mode
The DP83826 device provides the option to enable RMII back-to-back repeater mode functionality to extend
cable reach. Two DP83826 devices can be connected in RMII repeater mode without need of any external
configuration. It provides a hardware strap to configure the CRS_DV pin of RMII interface to RX_DV pin for
back-to-back operation. 图 9-2 and 图 9-3 show the RMII pin connections that enables the device to operate in
repeater mode.
TX_D0
TX_D1
RX_D0
RX_D1
TX_D0
TX_D1
RX_D0
RX_D1
DP83826
(RMII Slave Mode)
DP83826
(RMII Master Mode)
RX_DV
TX_EN
TX_EN
RX_DV
50MHz_RMII
XI
XI
XI 25 MHz
(XTAL/OsC)
图9-2. RMII Repeater Mode: Master-Slave
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TX_D0
TX_D1
RX_D0
RX_D1
TX_D0
TX_D1
RX_D0
RX_D1
DP83826
(RMII Slave Mode)
DP83826
(RMII Slave Mode)
RX_DV
TX_EN
RX_DV
TX_EN
XI
XI
50 MHz
Oscillator
图9-3. RMII Repeater Mode: Slave-Slave
9.3.8 Clock Output
The device has several clock output configuration options. An external crystal or CMOS-level oscillator provides
the stimulus for the internal PHY reference clock. The local reference clock acts as the central source for all
clocking within the device.
Clock output options supported by the device include:
• MAC IF clock
• XI clock
• Free-running clock
• Recovered clock
MAC IF clock operates at the same rate as the MAC interface selected. For RMII operation, MAC IF Clock
frequency is 50 MHz.
XI clock is a pass-through option, which allows for the XI pin clock to be passed to a GPIO pin. Note that the
clock is buffered prior to transmission out of the GPIOs, and output clock amplitude is at the selected VDDIO
level. This clock is available on CLK_OUT/LED1 pin by default after POR release (Refer to T4 in Power-Up
Timing).
The Free-running clock is an internally generated 125-MHz free-running clock generated by the PLL. The free-
running clock is suitable for asynchronous data transmission applications.
The recovered clock is a 125-MHz recovered clock that is recovered from the connected link partner. The PHY
recovers the clock from the data received (transmitted from the link partner).
All clock configuration options are enabled using the LED GPIO configuration registers.
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CLKOUT can be disabled by configuring this pin as an input pin via register configuration. To do this set bit[0] = 1
in the PIN_CFG1 Register (Address = 0x459) and then set bit[0] = 1 in the PIN_CFG2 Register (Address =
0x45A).
9.3.9 Media Independent Interface (MII)
The media-independent interface (MII) is a synchronous 4-bit wide nibble data interface that connects the PHY
to the MAC. The MII is fully compliant with IEEE 802.3-2002 clause 22.
The MII signals are summarized below:
表9-1. MII Signals
FUNCTION
PINS
TX_D[3:0]
RX_D[3:0]
TX_EN
RX_DV
CRS
Data Signals
Transmit and Receive Signals
Line-Status Signals
Error Signals
COL
RX_ER
TX_CLK
TX_EN
TX_D[3:0]
RX_CLK
RX_DV
RX_ER
RX_D[3:0]
CRS
PHY
MAC
COL
图9-4. MII Signaling
Additionally, the MII interface includes the carrier sense signal (CRS), as well as a collision detect signal (COL).
The CRS signal asserts to indicate the reception or transmission of data. The COL signal asserts as an
indication of a collision which can occur during half-duplex mode when both transmit and receive operations
occur simultaneously.
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9.3.10 Reduced Media Independent Interface (RMII)
The DP83826 incorporates the reduced media-independent interface (RMII) as specified in the RMII
specification v1.2. The purpose of this interface is to provide a reduced pin count alternative to the IEEE 802.3
MII as specified in Clause 22. Architecturally, the RMII specification provides an additional reconciliation layer on
either side of the MII, but can be implemented in the absence of an MII. The DP83826 offers two types of RMII
operations: RMII Slave and RMII Master. In RMII Master operation, the DP83826 operates from either a 25-MHz
CMOS-level oscillator connected to XI pin, a 25-MHz crystal connected across XI and XO pins. A 50-MHz output
clock referenced from DP83826 can be connected to the MAC. In RMII Slave operation, the DP83826 operates
from a 50-MHz CMOS-level oscillator connected to the XI pin and shares the same clock as the MAC.
Alternatively, in RMII slave mode, the PHY can operate from a 50-MHz clock provided by the Host MAC
The RMII specification has the following characteristics:
• Supports 100BASE-TX and 10BASE-Te
• Single clock reference sourced from the MAC to PHY (or from an external source)
• Provides independent 2-bit wide transmit and receive data paths
• Uses CMOS signal levels, the same levels as the MII interface
In this mode, data transfers are 2 bits for every clock cycle using the internal 50-MHz reference clock for both
transmit and receive paths.
The RMII signals are summarized below:
表9-2. RMII Signals
FUNCTION
PINS
Receive data lines
TX_D[1:0]
RX_D[1:0]
TX_EN
Transmit data lines
Receive control signal
Transmit control signal
CRS_DV
TX_EN
TX_D[1:0]
PHY
RX_DV (optional)
RX_ER (optional)
RX_D[1:0]
MAC
CRS_DV
XI
50-MHz Reference
Clock
图9-5. RMII Slave Signaling
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TX_EN
TX_D[1:0]
PHY
RX_DV (optional)
RX_ER (optional)
RX_D[1:0]
MAC
CRS_DV
50-MHz Reference Clock
25-MHz Reference
Clock
图9-6. RMII Master Signaling
Data on TX_D[1:0] are latched at the PHY with reference to the 50 MHz-clock in RMII master mode and slave
mode. Data on RX_D[1:0] is provided in reference to 50-MHz clock.
In addition, CRX_DV can be configured as RX_DV signal. It allows a simpler method of recovering receive data
without the need to separate RX_DV from the CRS_DV indication.
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9.3.11 Serial Management Interface
The Serial Management Interface provides access to the DP83826 internal register space for status information
and configuration. The SMI is compatible with IEEE 802.3 clause 22. The implemented register set consists of
the registers required by the IEEE 802.3 plus several others to provide additional visibility and controllability of
the DP83826.
The SMI includes the management clock (MDC) and the management input/output data pin (MDIO). MDC is
sourced by the external management entity, also called Station (STA), and can run at a maximum clock rate of
24 MHz. MDC is not expected to be continuous, and can be turned off by the external management entity when
the bus is idle.
MDIO is sourced by the external management entity and by the PHY. The data on the MDIO pin is latched on the
rising edge of the MDC. MDIO pin requires a pullup resistor (2.2 KΩ or 1.5 KΩ are widely used values), which
pulls MDIO high during IDLE and turnaround.
Up to 8 PHYs can share a common SMI bus. To distinguish between the PHYs, during power up or hardware
reset, the DP83826 latches the Phy_Address[2:0] configuration pins to determine its address.
The management entity must not start an SMI transaction in the first cycle after power up or hardware reset. To
maintain valid operation, the SMI bus must remain inactive at least until 50ms after power-up and at least until
2ms after reset is de-asserted (Refer to T4 in Power-up Timing and T2 in Reset Timing). In normal MDIO
transactions, the register address is taken directly from the management-frame reg_addr field, thus allowing
direct access to 32 16-bit registers (including those defined in IEEE 802.3 and vendor specific). The data field is
used for both reading and writing. The Start code is indicated by a <01> pattern. This pattern makes sure that
the MDIO line transitions from the default idle line state. Turnaround is defined as an idle bit time inserted
between the Register Address field and the Data field. To avoid contention during a read transaction, no device
may actively drive the MDIO signal during the first bit of turnaround. The addressed DP83826 drives the MDIO
with a zero for the second bit of turnaround and follows this with the required data.
For write transactions, the station-management entity writes data to the addressed DP83826, thus eliminating
the requirement for MDIO Turnaround. The turnaround time is filled by the management entity by inserting <10>.
表9-3. SMI Protocol
SMI PROTOCOL
Read Operation
Write Operation
<idle><start><op code><PHY address><reg addr><turnaround><data><idle>
<idle><01><10><AAAAA><RRRRR><Z0><XXXX XXXX XXXX XXXX><idle>
<idle><01><01><AAAAA><RRRRR><10><XXXX XXXX XXXX XXXX><idle>
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9.3.11.1 Extended Register Space Access
The DP83826 SMI function supports read and write access to the extended register set using the Register
Control Register (REGCR, address 0x000D), the Data Register (ADDAR, address 0x000E), and the MDIO
Manageable Device (MMD) indirect method defined in IEEE 802.3ah draft for Clause 22 for accessing the
extended register set.
The standard register set, MDIO registers 0 to 31, is accessed using the normal direct-MDIO access or the
indirect method, except for register REGCR and register ADDAR, which are accessed only using the normal
MDIO transaction. The SMI function ignores indirect access to these registers.
REGCR is the MMD access control. In general, register REGCR[4:0] is the device address DEVAD that directs
any accesses of the ADDAR register to the appropriate MMD.
The DP83826 supports three MMD device addresses:
1. The Vendor-Specific device address DEVAD[4:0] = 11111 is used for general MMD register accesses.
2. DEVAD[4:0] = 00011 is used for Energy Efficient Ethernet MMD register accesses. Register names for
registers accessible at this device address are preceded by MMD3.
3. DEVAD[4:0] = 00111 is used for Energy Efficient Ethernet MMD registers accesses. Register names for
registers accessible at this device address are preceded by MMD7.
All accesses through register REGCR and ADDAR must use the correct DEVAD. Transactions with other
DEVAD are ignored. REGCR[15:14] holds the access function: address (00), data with no post increment (01).
• ADDAR is the address/data MMD register. ADDAR is used in conjunction with REGCR to provide the access
to the extended register set. If register REGCR[15:14] is (00), then ADDAR holds the address of the
extended address space register. Otherwise, ADDAR holds the data as indicated by the contents of its
address register. When REGCR[15:14] is set to (00), accesses to register ADDAR modify the extended
register set address register. This address register must always be initialized in order to access any of the
registers within the extended register set.
• When REGCR[15:14] is set to (01), accesses to register ADDAR access the register within the extended
register set selected by the value in the address register.
The following sections describe how to perform operations on the extended register set using register REGCR
and ADDAR. The descriptions use the device address for general MMD register accesses (DEVAD[4:0] = 11111).
For register accesses to the MMD3 or MMD7 registers the corresponding device address would be used.
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9.3.11.2 Write Address Operation
To set the address register:
1. Write the value 0x001F (address function field = 00, DEVAD = 31) to register REGCR.
2. Write the register address to register ADDAR.
Subsequent writes to register ADDAR (step 2) continue to write the address register.
9.3.11.3 Read Address Operation
To read the address register:
1. Write the value 0x001F (address function field = 00, DEVAD = 31) to register REGCR.
2. Read the register address from register ADDAR.
Subsequent reads to register ADDAR (step 2) continue to read the address register.
9.3.11.4 Write (No Post Increment) Operation
To write a register in the extended register set:
1. Write the value 0x001F (address function field = 00, DEVAD = 31) to register REGCR.
2. Write the desired register address to register ADDAR.
3. Write the value 0x401F (data, no post increment function field = 01, DEVAD = 31) to register REGCR.
4. Write the content of the desired extended register set to register ADDAR.
Subsequent writes to register ADDAR (step 4) continue to rewrite the register selected by the value in the
address register.
备注
Steps (1) and (2) can be skipped if the address register was previously configured.
9.3.11.5 Read (No Post Increment) Operation
To read a register in the extended register set:
1. Write the value 0x001F (address function field = 00, DEVAD = 31) to register REGCR.
2. Write the desired register address to register ADDAR.
3. Write the value 0x401F (data, no post increment function field = 01, DEVAD = 31) to register REGCR.
4. Read the content of the desired extended register set in register ADDAR.
Subsequent reads to register ADDAR (step 4) results in the output of the register set in step 3.
备注
Steps (1) and (2) can be skipped if the address register was previously configured.
9.3.11.6 Example Write Operation (No Post Increment)
This example demonstrates a write operation with no post increment. In this example, the MAC impedance is
adjusted to 99.25 Ωusing the IO MUX GPIO Control Register (IOCTRL, address 0x0461).
1. Write the value 0x001F to register 0x000D.
2. Write the value 0x0461 to register 0x000E (sets desired register to the IOCTRL).
3. Write the value 0x401F to register 0x000D.
4. Write the value 0x0400 to register 0x000E (sets MAC impedance to 99.25 Ω).
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9.3.12 100BASE-TX
9.3.12.1 100BASE-TX Transmitter
The 100BASE-TX transmitter consists of several functional blocks which convert synchronous 4-bit nibble data,
as provided by the MII, to a scrambled MLT-3 125-Mbps serial data stream on the MDI. 4B5B encoding and
decoding is detailed in 表9-4 below.
The transmitter section consists of the following functional blocks:
1. Code-Group Encoder and Injection Block
2. Scrambler Block with Bypass Option
3. NRZ to NRZI Encoder Block
4. Binary to MLT-3 Converter / Common Driver Block
The bypass option for the functional blocks within the 100BASE-TX transmitter provides flexibility for applications
where data conversion is not always required. The DP83826 implements the 100BASE-TX transmit state
machine diagram as specified in the IEEE 802.3 Standard, Clause 24.
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DATA CODES
表9-4. 4B5B Code-Group Encoding / Decoding
NAME
PCS 5B CODE-GROUP
MII 4B NIBBLE CODE
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
11110
01001
10100
10101
01010
01011
01110
01111
10010
10011
10110
10111
11010
11011
11100
11101
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
IDLE AND CONTROL CODES(1)
H
00100
11111
11000
10001
01101
00111
00000
HALT code-group - Error code
Inter-Packet IDLE - 0000
First Start of Packet - 0101
Second Start of Packet - 0101
First End of Packet - 0000
Second End of Packet - 0000
EEE LPI - 0001(2)
I
J
K
T
R
P
INVALID CODES
V
V
V
V
V
V
V
V
V
00001
00010
00011
00101
00110
01000
01100
10000
11001
(1) Control code-groups I, J, K, T and R in data fields are mapped as invalid codes, together with RX_ER asserted.
(2) Energy Efficient Ethernet LPI must also have TX_ER / RX_ER asserted and TX_EN / RX_DV deasserted.
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9.3.12.1.1 Code-Group Encoding and Injection
The code-group encoder converts 4-bit (4B) nibble data generated by the MAC into 5-bit (5B) code-groups for
transmission. This conversion is required to allow control data to be combined with packet data code-groups.
Refer to 表9-4 for 4B to 5B code-group mapping details.
The code-group encoder substitutes the first 8 bits of the MAC preamble with a J/K code-group pair (11000
10001) upon transmission. The code-group encoder continues to replace subsequent 4B preamble and data
nibbles with corresponding 5B code-groups. At the end of the transmit packet, upon the deassertion of transmit
enable (TX_EN) signal from the MAC, the code-group encoder injects the T/R code-group pair (01101 00111)
indicating the end of the frame.
After the T/R code-group pair, the code-group encoder continuously injects IDLEs into the transmit data stream
until the next transmit packet is detected (reassertion of transmit enable).
9.3.12.1.2 Scrambler
The scrambler is required to control the radiated emissions at the media connector and on the twisted-pair cable.
By scrambling the data, the total energy launched onto the cable is randomly distributed over a wide frequency
range. Without the scrambler, energy levels at the MDI and on the cable could peak beyond FCC limitations at
frequencies related to repeating 5B sequences (that is, continuous transmission of IDLEs).
The scrambler is configured as a closed loop linear feedback shift register (LFSR) with an 11-bit polynomial. The
output of the closed loop LFSR is X-ORd with the serial NRZ data from the code-group encoder. The result is a
scrambled data stream with sufficient randomization to decrease radiated emissions at certain frequencies by as
much as 20 dB.
9.3.12.1.3 NRZ to NRZI Encoder
After the transmit data stream has been serialized and scrambled, the data must be NRZI encoded in order to
comply with the TP-PMD standard for 100BASE-TX transmission over Category-5 unshielded twisted pair cable.
There is no ability to bypass this block within the DP83826. The NRZI data is sent to the 100-Mbps Driver.
9.3.12.1.4 Binary to MLT-3 Converter
The binary to MLT-3 conversion is accomplished by converting the serial binary data stream output from the
NRZI encoder into two binary data streams with alternately phased logic one events. These two binary streams
are then fed to the twisted pair output driver which converts the voltage to current and alternately drives either
side of the transmit transformer primary winding, resulting in a minimal current MLT-3 signal.
The 100BASE-TX MLT-3 signal sourced by the PMD output pair common driver is slew rate controlled. This
should be considered when selecting AC coupling magnetics to ensure TP-PMD standard compliant transition
times (3 ns < TRISE (and TFALL) < 5 ns).
9.3.12.2 100BASE-TX Receiver
The 100BASE-TX receiver consists of several functional blocks which convert the scrambled MLT-3 125-Mbps
serial data stream to synchronous to 4-bit data provided to the MII and 2-bit wide data to the RMII.
The receive section consists of the following functional blocks:
• Input and BLW compensation
• Signal detect
• Digital adaptive equalization
• MLT-3 to binary decoder
• Clock recovery module
• NRZI to NRZ decoder
• Descrambler
• Serial-to-parallel data conversion
• Code-group alignment
• 4B/5B decoder
• Link integrity monitor
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• Bad SSD detection
9.3.13 10BASE-Te
The 10BASE-Te transceiver module is IEEE 802.3 compliant. It includes the receiver, transmitter, collision
detection, heartbeat, loopback, jabber, and link integrity functions, as defined in the standard.
备注
When using the DP83826 for 10BASE-Te applications, configure VOD_CFG3 (register address:
0x030E) to 0x4A40.
9.3.13.1 Squelch
Squelch is responsible for determining when valid data is present on the differential receive inputs. The squelch
circuitry employs a combination of amplitude and timing measurements (as specified in the IEEE 802.3 10BASE-
Te standard) to determine the validity of data on the twisted-pair inputs.
The signal at the start of a packet is checked by the squelch, and any pulses not exceeding the squelch level
(either positive or negative, depending upon polarity) are rejected. When this first squelch level is exceeded
correctly, the opposite squelch level must then be exceeded no earlier than 50 ns. Finally, the signal must again
exceed the original squelch level no earlier than 50 ns to qualify as a valid input waveform, and not be rejected.
This checking procedure results in the typical loss of three preamble bits at the beginning of each packet. When
the transmitter is operating, five consecutive transitions are checked before indicating that valid data is present.
At this time, the squelch circuitry is reset.
DP83826 supports both IEEE Preamble Mode and Short Preamble Mode. Refer to the 10M_CFG Register
(address = 0x2A).
9.3.13.2 Normal Link Pulse Detection and Generation
The link pulse generator produces pulses as defined in the IEEE 802.3 10BASE-Te standard. Each link pulse is
nominally 100 ns in duration and transmitted every 16 ms in the absence of transmit data. Link pulses are used
to check the integrity of the connection with the remote end.
9.3.13.3 Jabber
Jabber is a condition in which a station transmits for a period of time longer than the maximum permissible
packet length, usually due to a fault condition. The jabber function monitors the DP83826 output and disables
the transmitter if it attempts to transmit a packet of longer than legal size. A jabber timer monitors the transmitter
and disables the transmission if the transmitter is active for approximately 100 ms. When disabled by the Jabber
function, the transmitter stays disabled for the entire time that the module's internal transmit enable is asserted.
This signal must be de-asserted for approximately 500 ms (unjab time) before the Jabber function re-enables the
transmit outputs. The Jabber function is only available and active in 10BASE-Te Mode.
9.3.13.4 Active Link Polarity Detection and Correction
Swapping the wires within the twisted-pair causes polarity errors. Wrong polarity affects 10BASE-Te
connections. 100BASE-TX is immune to polarity problems because it uses MLT-3 encoding. 10BASE-Te receive
block automatically detects reversed polarity.
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9.3.14 Loopback Modes
There are several loopback options within the DP83826 that test and verify various functional blocks within the
PHY. Enabling loopback modes allow for in-circuit testing of the digital and analog data paths. The DP83826
may be configured to any one of the Near-end Loopback modes or to the far-end (reverse) loopback mode. MII
loopback is configured using the BASIC mode Control Register (BMCR, address 0x0000). All other loopback
modes are enabled using the BIST Control Register (BISCR, address 0x0016). Except where otherwise noted,
loopback modes are supported for all speeds (10/100 Mbps and all MAC interfaces).
Reverse
Loopback
PCS
Loopback
Analog
Loopback
MAC
MII
Loopback
Digital
Loopback
External
Loopback
图9-7. Loopback Test Modes
9.3.14.1 Near-end Loopback
Near-end Loopback provides the ability to loop the transmitted data back to the receiver via the digital or analog
circuitry. The point at which the signal is looped back is selected using loopback control bits[3:0] in the BISCR
register. Auto-Negotiation should be disabled before selecting the Near-end Loopback modes. This constraint
does not apply for External Loopback Mode.
9.3.14.2 MII Loopback
MII Loopback is the shallowest loop through the PHY. It is a useful test mode to validate communications
between the MAC and the PHY. When in MII Loopback, data transmitted from a connected MAC on the TX path
is internally looped back in the DP83826 to the RX pins where it can be checked by the MAC.
MII Loopback is enabled by setting bit[14] in the BMCR and bit[2] in BISCR.
9.3.14.3 PCS Loopback
PCS Loopback occurs in the PCS layer of the PHY. No signal processing is performed when using PCS
Loopback.
PCS Input Loopback is enabled by setting bit[0] in the BISCR.
PCS Output Loopback is enabled by setting bit[1] in the BISCR.
9.3.14.4 Digital Loopback
Digital Loopback includes the entire digital transmit and receive paths. Data is looped back prior to the analog
circuitry.
Digital Loopback is requires following configuration:
• 0x0000 = 0x2100 // Disable Auto-Neg
• 0x0016 = 0x0104 // Digital Loopback
• 0x0122 = 0x2000 /
• 0x0123 = 0x2000
• 0x0130 = 0x47FF
• 0x001F = 0x4000 // Soft Reset
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9.3.14.5 Analog Loopback
When operating in 10BASE-Te or 100BASE-TX mode, signals can be looped back after the analog front-end.
Analog Loopback is enabled by setting bit[3] in the BISCR.
9.3.14.6 Far-End (Reverse) Loopback
Far-End (Reverse) loopback is a special test mode to allow PHY testing with a link partner. In this mode, data
that is received from the Link Partner passes through the PHY’s receiver, is looped back at the MAC interface
and then transmitted back to the Link Partner. While in reverse loopback mode, all data signals that come from
the MAC are ignored.
Reverse Loopback is enabled by setting bit[4] in the BISCR.
9.3.15 BIST Configurations
The DP83826 incorporates an internal PRBS built-in self-test (BIST) circuit to accommodate in-circuit testing and
diagnostics. The BIST circuit can be used to test the integrity of transmit and receive data paths. The BIST can
be performed using both internal loopbacks (digital or analog) or external loopback using a cable fixture. The
BIST simulates pseudo-random data transfer scenarios in format of real packets and inter-packet gap (IPG) on
the lines. The BIST allows full control of the packet lengths and the IPG.
The BIST packet length is controlled using bits[10:0] in the BIST Control and Status Register #2 (BICSR2,
address 0x001C). The BIST IPG length is controlled using bits[7:0] in the BIST Control and Status Register #1
(BICSR1, address 0x001B).
The BIST is implemented with independent transmit and receive paths, with the transmit clock generating a
continuous stream of a pseudo-random sequence. The device generates a 15-bit pseudo-random sequence for
BIST. Received data is compared to the generated pseudo-random data to determine pass/fail status. The
number of error bytes that the PRBS checker received is stored in bits[15:8] of the BICSR1. PRBS lock status
and sync can be read from the BIST Control Register (BISCR, address 0x0016).
The PRBS test can be put in a continuous mode by using bit[14] in the BISCR. In continuous mode, when the
BIST error counter reaches the maximum value, the counter starts counting from zero again. To read the BIST
error count, bit[15] in the BICSR1 must be set to '1'. This setting locks the current value of the BIST errors for
reading. Setting bit[15] also clears the BIST Error Counter.
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9.3.16 Cable Diagnostics
With the vast deployment of Ethernet devices, the need for a reliable, comprehensive and user-friendly cable
diagnostic tool is more important than ever. The wide variety of cables, topologies and connectors deployed
results in the need to non-intrusively identify and report cable faults. The DP83826 offers time domain
reflectometry (TDR) capabilities in its Cable Diagnostic tool kit.
9.3.16.1 Time Domain Reflectometry (TDR)
The DP83826 uses TDR to determine the quality of the cables, connectors and terminations in addition to
estimating the cable length. Some of the possible problems that can be diagnosed include opens, shorts, cable
impedance mismatch, bad connectors, termination mismatches, cross faults, cross shorts and any other
discontinuities along the cable.
The DP83826 transmits a test pulse of known amplitude (1 V) down each of the two pairs of an attached cable.
The transmitted signal continues down the cable and reflects from each cable imperfection, fault, connector and
from the end of the cable itself. After the pulse transmission, the DP83826 measures the return time and
amplitude of all these reflected pulses. This technique enables measuring the distance and magnitude
(impedance) of non-terminated cables (open or short), discontinuities (bad connectors) and improperly
terminated cables with ±1-m accuracy.
For all TDR measurements, the transformation between time of arrival and physical distance is done by the
external host using minor computations (such as multiplication, addition and lookup tables). The host must know
the expected propagation delay of the cable, which depends, among other things, on the cable category (for
example, CAT5, CAT5e, or CAT6).
TDR measurement is allowed in the following scenarios:
• While the link partner is disconnected –cable is unplugged at the other side
• Link partner is connected but remains “quiet”(for example, in power down mode)
• TDR could be automatically activated when the link fails or is dropped
TDR Auto-Run can be enabled by using bit[8] in the Control Regsiter #1 (CR1, address 0x0009). When a link-
drops, TDR automatically executes and stores the results in the respective TDR Cable Diagnostic Location
Result Registers #1 - #5 (CDLRR, addresses 0x0180 to 0x0184) and the Cable Diagnostic Amplitude Result
Registers #1 - #5 (CDLAR, addresses 0x0185 to 0x0189). TDR can also be run manually using bit[15] in the
Cable Diagnostic Control Register (CDCR, address 0x001E). Cable diagnostic status is obtained by reading
bits[1:0] in the CDCR. Additional TDR functions including cycle averaging and crossover disable can be found in
the Cable Diagnostic Specific Control Register (CDSCR, address 0x0170). Refer to the application report
Solving Cable Faults Challenges with TI Ethernet PHYs for details.
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9.3.16.2 Fast Link-Drop Functionality
The DP83826 includes advanced link-drop capabilities that support various real-time applications. The link-drop
mechanism is configurable and includes enhanced modes that allow extremely fast link-drop reaction times.
The DP83826 supports an enhanced link-drop mechanism, also called fast link-drop (FLD), which shortens the
observation window for determining link. There are multiple ways of determining link status, which can be
enabled or disabled based on user preference.
Depending on what mode the DP83826 is in, the default state of FLD will differ. In ENHANCED mode, FLD and
all its detection mechanisms are disabled by default through Strap7. In ENHANCED mode when Strap7 (FLD) is
enabled, all detection mechanisms except MTL3 error count are enabled and FLD is enabled. If Strap1 (Odd
Nibble) and Strap7 (FLD) are both enabled in ENHANCED mode, only SNR and signal/energy loss mechanisms
are enabled. If Strap1 (Odd Nibble) and Strap7 (FLD) are both enabled, Strap8 will toggle the signal energy
detect mechanism. For EtherCAT applications or applications with Fast link drop enabled and expect to handle
Baseline wander packets, it is recommended to disable signal energy detect, which can be done by setting
Strap8. The table below summarizes the modes enabled by strap. Any of the listed modes can be both disabled
or enabled after power-up via register settings.
表9-5. FLD Detection Modes by Strap
Strap Configuration RX Error Count
MLT3 Error Count
Low SNR Threshold Signal/Energy Loss Descrambler Link
Loss
Strap7 (Active High) = Disabled
Disabled
Disabled
Disabled
Disabled
LOW
Strap1 (Active Low) =
X
Strap8 (Active High) =
X
Strap7 (AH) = HIGH Enabled
Strap1 (AL) = HIGH
Disabled
Disabled
Disabled
Enabled
Disabled
Disabled
Enabled
Enabled
Disabled
Enabled
Disabled
Disabled
Strap8 (AH) = LOW
Strap7 (AH) = HIGH Enabled
Strap1 (AL) = LOW
Strap8 (AH) = LOW
Strap7 (AH) = HIGH Enabled
Strap1 (AL) = LOW
Strap8 (AH) = HIGH
In BASIC mode, fast link-drop is enabled by default. The default mechanisms in BASIC mode will be RX error
and signal/energy loss. Any adjustments to FLD in BASIC mode must be changed using register configuration.
In both modes, FLD can be configured using the Control Register #3 (CR3, address 0x000B). Bits[3:0] and
bit[10] allow for various FLD conditions to be enabled. When link-drop occurs, indication of a particular fault
condition can be read from the Fast Link Drop Status Register (FLDS, address 0x000F).
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First Link Failure
Occurrence
Valid Link
Low Quality Data / Link Loss
Link Drop
Link Loss
Indication
(Link LED)
图9-8. Fast Link-Drop
Fast link-drop criteria include:
• RX error count - when a predefined number of 32 RX_ERs occur in a 10-μs window, the link is dropped.
• MLT3 error count - when a predefined number of 20 MLT3 errors occur in a 10-μs window, the link is
dropped. To use the MLT3 error based FLD, please configure register Fast Link Drop Config Register 1
(FLDCFG1, address 0x0117) to 0x0417.
• Low SNR threshold - when a predefined number of 20 threshold crossings occur in a 10-μs window, the link
is dropped.
• Signal/energy loss - when the energy detector indicates energy loss, the link is dropped.
• Descrambler link loss - when the Descrambler loses lock, the link is dropped. To use the Descrambler link
loss based FLD, please configure bits[5:0] of Fast Link Drop Config Register 2 (FLDCFG2, address 0x0131)
to 0x08.
The fast link-drop functionality allows the use of each of these options separately or in any combination.
9.3.17 LED and GPIO Configuration
The DP83826 offers flexible LED and GPIO pins which can be set for various functions using register
configuration. Refer to 图9-9, for details on LED and GPIO configuration.
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Controls for LED0 = MLEDCR_0x25, LEDCR_0x18
Pin30 = led_0_gpio_ctrl = LED_0_CFG_REG_0x303[2:0]
Pin31 = led_1_gpio_ctrl = LED_1_CFG_REG_0x304[2:0]
Pin28 = led_2_gpio_ctrl = LED_2_CFG_REG_0x305[2:0]
Pin29 = led_3_gpio_ctrl = LED_3_CFG_REG_0x306[2:0]
Controls for LED1 = LEDCFG_0x460 , LEDCFG2_0x469
Controls for LED2 = LEDCFG_0x460 , LEDCFG2_0x469
Controls for LED3 = LEDCFG_0x460 , LEDCFG2_0x469
Bypass LED Stretching = PHYCR_0x19[7] – Common for all LED
Blink Rate = LEDCR_0x18[10:9] – Common for all LED
Link status
LED Genera on
Pin30
Pin31
Pin28
Pin29
0
1
2
3
4
5
6
7
Speed
WOL
LOW
INT
WOL
LOW
INT
WOL
COL
INT
WOL
CRS
Clocks
Genera on
INT
LOW
LOW
HIGH
LOW
LOW
HIGH
COL
COL
HIGH
CRS
CRS
HIGH
led_0_clk_source = LED_0_CFG_REG_0x303[5:3]
led_1_clk_source = LED_1_CFG_REG_0x304[5:3]
led_2_clk_source = LED_2_CFG_REG_0x305[5:3]
led_3_clk_source = LED_3_CFG_REG_0x306[5:3]
图9-9. LED and GPIO Configuration
备注
A clock output is available on Pin 28 and 29 in ENHANCED mode only. These pins can be configured
to output only a 25-MHz or 50-MHz clock.
In ENHANCED mode, the LEDs have auto-polarity detection. The LED drive will adjust according to the strap
configured on the pin. For example, if the LED pin is configured for a pull-down strap, then the PHY will assign
the LED polarity as active high. If the LED pin is configured with a pull-up, the PHY will assign the LED polarity
as active low.
In BASIC mode, the LED polarity will always be active low. In the case that the LED pin must be strapped low, a
1 kΩ pull-up resistor in series with the LED should be used and a 5 kΩ pull-down resistor. This will result in the
strap selecting 0. Please note that using higher resistance may decrease the brightness of the LED.
9.4 Programming
The DP83826 provides hardware based configuration (via bootstraps) and the IEEE defined register set for
programming and status indications. It also provides an additional register set to configure other features not
supported through IEEE registers.
9.4.1 Hardware Bootstraps Configuration
DP83826 uses many of the functional pins as strap options to place the device into specific modes of operation.
The values of these pins are sampled at power up or hard reset. During software resets, the strap options are
internally reloaded from the values sampled at power up or hard reset. The strap option pin assignments are
defined below. Configuration of the device may be done through the strap pins or through the management
register interface. A pullup resistor or a pulldown resistor of suggested values may be used to set the voltage
ratio of the strap pin input and the supply to select one of the possible selected modes. All strap pins have two
levels.
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Internal PU pins
Internal PD pins
VDDIO
VDDIO
Rhi
10 kΩ
25%
10 kΩ
25%
Rlo
图9-10. Strap Circuit
表9-6. 2-Level Strap Resistor Ratios
SUGGESTED RESISTORS
Mode (1)
RHI (kΩ)
RLO (kΩ)
INTERNAL 10-kΩPULLDOWN (PD) PINS
0-DEFAULT
OPEN
2.49
OPEN
OPEN
1
INTERNAL 10-kΩPULLUP (PU) PINS
0
OPEN
OPEN
1.5
1-DEFAULT
OPEN
(1) Resistor ratios are only a recommendation. Use the bootstrap threshold values contained within the Electrical Characteristics table for
more precise mode selections. Recommended tolerance is 1%.
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9.4.1.1 DP83826 Bootstrap Configurations (ENHANCED Mode)
This section describes the hardware bootstraps available for some options for DP83826's Enhanced Mode. If no
strap resistors are implemented, the default value is Odd Nibble Enabled, MII mode, FLD disabled. '0'
corresponds to Mode 0 while '1' corresponds to Mode 1.
Strap1
‘1’
‘0’
Odd Nibble Enabled
Strap 8 selects MAC IF
Odd Nibble Disable
PHY automatically in MII
Strap8
‘1’
Strap7
‘0’
‘1’
‘0’
PHY is in
RMII mode
FLD disabled
Strap8 == X
PHY is in
MII mode
FLD
enabled
Strap5
Strap7
Strap8
‘1’
‘0’
‘1’
‘0’
‘1’
‘0’
FLD
Enabled
FLD
Disabled
Signal Energy
Detect Disabled
Signal Energy
Detect Enabled
RMII Slave
RMII Master
Strap7
‘1’
‘0’
Pin 18 is
CRS_DV
(RMII Repeater)
Pin 18 is
RX_DV
图9-11. Enhanced Bootstrap Flowchart
表9-7. PHY Address Strap Table
9.4.1.1.1 Bootstraps for PHY Address
PIN NAME
STRAP NAME
PIN NO.
DEFAULT
Mode
Function
PHY_ADD0
LED0
Strap2
30
0
0
1
0
1
PHY_ADD1
CRS/LED3
COL/LED2
Strap3
Strap4
29
28
0
0
0
1
0
1
PHY_ADD2
0
1
0
1
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表9-8. MAC Mode Selection Strap Table
PIN NAME
STRAP NAME
PIN NO.
DEFAULT
Mode
Function
MII MAC mode
ALT. Function: When Strap1 =0 AND
0
Strap7 =1, Signal Energy Detect enabled
RX_D2
Strap8
14
0
RMII MAC mode
ALT. Function: When Strap1 =0 AND
1
Strap7 =1, Signal Energy Detect disabled
表9-9. MII MAC Mode Strap Table
PIN NAME
STRAP NAME
PIN NO.
DEFAULT
Mode
Function
0
1
fast link-drop disable
fast link-drop enable
All available mechanisms will be enabled
RX_D3
Strap7
13
0
except MLT3_Error.
表9-10. RMII MAC Mode Strap Table
PIN NAME
STRAP NAME
PIN NO.
DEFAULT
Mode
Function
RMII master mode
0
1
0
1
TX_CLK
Strap5
22
0
RMII slave mode
RMII_CRS_DV
RX_D3
Strap7
13
0
RMII_RX_DV (for RMII repeater mode)
表9-11. Auto_Neg Strap Table
PIN NAME
STRAP NAME
PIN NO.
DEFAULT
Mode
Function
0
1
0
auto MDIX enable
auto MDIX disable
auto-negotiation enable
RX_D1
Strap9
15
0
RX_D0
RX_DV
Strap0
16
18
0
0
auto negotiation disable. force mode 100
M enabled
1
0
1
MDIX (applicable only when auto-MDIX is
disabled)
Strap10
MDI (applicable only when auto-MDIX is
disabled)
表9-12. CLKOUT/LED1 Bootstrap
PIN NAME
STRAP NAME
PIN NO.
DEFAULT
Mode
Function
0
1
CLKOUT 25 MHz on Pin 31
LED1 on Pin 31
RX_ER
Strap6
20
0
表9-13. Odd Nibble Detection Bootstrap
PIN NAME
STRAP NAME
PIN NO.
DEFAULT
Mode
Function
Odd Nibble Detection disabled
If Strap7 = 1, only RX_Error and Signal
0
1
CLKOUT/LED1
Strap1
31
1
Energy detect will be enabled for FLD.
Odd Nibble Detection enabled
Note: This strap is latched at POR only. HW reset using pin or register will not re-latch this strap.
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9.4.1.2 DP83826 Strap Configuration (BASIC Mode)
This section describes the strap configuration available for BASIC mode.
9.4.1.2.1 Bootstraps for PHY Address
表9-14. PHY Address Strap Table
PIN NAME
STRAP NAME
PIN NO.
DEFAULT
Mode
Function
PHY_ADD0
RX_D3
Strap7
13
1
0
1
0
1
PHY_ADD1
RX_D2
RX_D1
Strap8
Strap9
14
15
0
0
0
1
0
1
PHY_ADD2
0
1
0
1
表9-15. MAC Mode Selection Strap Table
STRAP
NAME
PIN NAME
PIN NO.
DEFAULT
Strap10
Strap3 Strap4
Function
0
0
0
0
0
1
1
MII MAC mode
RMII master mode
RMII slave mode
COL
Strap4
28
0
0
1
CRS
Strap3
29
18
0
0
other values are reserved
RX_DV
Strap10
表9-16. Auto Negotiation Strap Table
PIN NAME
STRAP NAME
PIN NO.
DEFAULT
Mode
Function
0
1
Auto Negotiation Disable
Auto Negotiation Enable
LED0
Strap2
30
1
表9-17. Speed Strap Table
PIN NAME
STRAP NAME
PIN NO.
DEFAULT
Mode
Function
0
1
Speed 10 M
Speed 100 M
LED1/
TX_ER
Strap1
31
1
表9-18. Full/Half Duplex Table
PIN NAME
STRAP NAME
PIN NO.
DEFAULT
Mode
Function
0
1
Full Duplex
Half Duplex
RX_D0
Strap0
16
1
表9-19. MII Isolate Bootstraps
PIN NAME
STRAP NAME
Strap6
PIN NO.
DEFAULT
Mode
Function
0
1
MII Isolate Disable
MII Isolate Enable
RX_ER
20
0
9.5 Register Maps
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9.5.1 DP83826 Registers
表 9-20 lists the memory-mapped registers for the DP83826 registers. All register offset addresses not listed in
表9-20 should be considered as reserved locations and the register contents should not be modified.
表9-20. DP83826 Registers
Offset
0h
Acronym
Register Name
Section
BMCR Register
BMSR Register
PHYIDR1 Register
PHYIDR2 Register
ANAR Register
ALNPAR Register
ANER Register
ANNPTR Register
ANLNPTR Register
CR1 Register
Basic Mode Control Register
Basic Mode Status Register
PHY Identifier Register #1
节9.5.1.1
节9.5.1.2
节9.5.1.3
节9.5.1.4
节9.5.1.5
节9.5.1.6
节9.5.1.7
节9.5.1.8
节9.5.1.9
节9.5.1.10
节9.5.1.11
节9.5.1.12
节9.5.1.13
节9.5.1.14
节9.5.1.15
节9.5.1.16
节9.5.1.17
节9.5.1.18
节9.5.1.19
节9.5.1.20
节9.5.1.21
节9.5.1.22
节9.5.1.23
节9.5.1.24
节9.5.1.25
节9.5.1.26
节9.5.1.27
节9.5.1.28
节9.5.1.29
节9.5.1.30
节9.5.1.31
节9.5.1.32
节9.5.1.33
节9.5.1.34
节9.5.1.35
节9.5.1.36
节9.5.1.37
节9.5.1.38
节9.5.1.39
1h
2h
3h
PHY Identifier Register #2
4h
Auto-Negotiation Advertisement Register
Auto-Negotiation Link Partner Ability Register
Auto-Negotiation Expansion Register
Auto-Negotiation Next Page Register
Auto-Negotiation Link Partner Ability Next Page Register
Control Register #1
5h
6h
7h
8h
9h
Ah
CR2 Register
Control Register #2
Bh
CR3 Register
Control Register #3
Dh
REGCR Register
ADDAR Register
FLDS Register
PHYSTS Register
PHYSCR Register
MISR1 Register
MISR2 Register
FCSCR Register
RECR Register
BISCR Register
RCSR Register
LEDCR Register
PHYCR Register
10BTSCR Register
BICSR1 Register
BICSR2 Register
CDCR Register
PHYRCR Register
MLEDCR Register
COMPT Regsiter
10M_CFG
Extended Register Control Register
Extended Register Data Register
Fast Link Down Status Register
PHY Status Register
Eh
Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Eh
1Fh
25h
27h
2Ah
117h
131h
170h
171h
173h
175h
PHY Specific Control Register
MII Interrupt Status Register #1
MII Interrupt Status Register #2
False Carrier Sense Counter Register
Receive Error Count Register
BIST Control Register
RMII and Status Register
LED Control Register
PHY Control Register
10Base-Te Status/Control Register
BIST Control and Status Register #1
BIST Control and Status Register #2
Cable Diagnostic Control Register
PHY Reset Control Register
Multi-LED Control Register
Compliance Test Register
FLD_CFG1
FLD_CFG2
CDSCR Register
CDSCR2 Register
CDSCR3 Register
TDR_175 Register
Cable Diagnostic Specific Control Register
Cable Diagnostic Specific Control Register 2
Cable Diagnostic Specific Control Register 3
TDR Control Register #1
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表9-20. DP83826 Registers (continued)
Offset
176h
177h
178h
180h
181h
182h
183h
184h
185h
186h
187h
188h
189h
18Ah
302h
303h
304h
305h
306h
308h
30Bh
30Ch
30Eh
404h
40Dh
456h
460h
461h
467h
468h
469h
4A0h
4A1h
4A2h
4A3h
4A4h
4A5h
4A6h
4A7h
Acronym
Register Name
Section
TDR_176 Register
CDSCR4 Register
TDR_178 Register
CDLRR1 Register
CDLRR2 Register
CDLRR3 Register
CDLRR4 Register
CDLRR5 Register
CDLAR1 Register
CDLAR2 Register
CDLAR3 Register
CDLAR4 Register
CDLAR5 Register
CDLAR6 Register
IO_CFG1 Register
LED0_GPIO_CFG
LED1_GPIO_CFG
LED2_GPIO_CFG
LED3_GPIO_CFG
CLK_OUT_LED_STATUS register
VOD_CFG1 Register
VOD_CFG2 Register
VOD_CFG3 Register
ANA_LD_PROG_SL Register
ANA_RX10BT_CTRL Register
GENCFG Register
LEDCFG Register
IOCTRL Register
TDR Control Register #2
节9.5.1.40
节9.5.1.41
节9.5.1.42
节9.5.1.43
节9.5.1.44
节9.5.1.45
节9.5.1.46
节9.5.1.47
节9.5.1.48
节9.5.1.49
节9.5.1.50
节9.5.1.51
节9.5.1.52
节9.5.1.53
节9.5.1.54
节9.5.1.55
节9.5.1.56
节9.5.1.57
节9.5.1.58
节9.5.1.59
节9.5.1.60
节9.5.1.61
节9.5.1.62
节9.5.1.63
节9.5.1.64
节9.5.1.65
节9.5.1.66
节9.5.1.67
节9.5.1.68
节9.5.1.69
节9.5.1.70
节9.5.1.71
节9.5.1.72
节9.5.1.73
节9.5.1.74
节9.5.1.75
节9.5.1.76
节9.5.1.77
节9.5.1.78
Cable Diagnostic Specific Control Register 4
TDR Control Register #3
Cable Diagnostic Location Result Register #1
Cable Diagnostic Location Result Register #2
Cable Diagnostic Location Result Register #3
Cable Diagnostic Location Result Register #4
Cable Diagnostic Location Result Register #5
Cable Diagnostic Amplitude Result Register #1
Cable Diagnostic Amplitude Result Register #2
Cable Diagnostic Amplitude Result Register #3
Cable Diagnostic Amplitude Result Register #4
Cable Diagnostic Amplitude Result Register #5
Cable Diagnostic Amplitude Result Register #6
GPIO Pin configuration Register #1
CLK_OUT_LED_STATUS configuration Register #3
VoD Config Register #1
VoD Config Register #2
VoD Config Register #3
Line Driver Config Register
Receive Configuration Register 10M
General Configuration Register
LEDs Configuration Register #1
IO MUX GPIO Control Register
Strap Latch-In Register #2
SOR1 Register
SOR2 Register
Strap Latch-In Register #2
LEDCFG2 Register
RXFCFG1 Register
RXFS Register
LEDs Configuration Register #2
Receive Configuration Register #1
Receive Status Register
RXFPMD1 Register
RXFPMD2 Register
RXFPMD3 Register
RXFSOP1 Register
RXFSOP2 Register
RXFSOP3 Register
Receive Perfect Match Data Register #1
Receive Perfect Match Data Register #2
Receive Perfect Match Data Register #3
Receive Secure-ON Password Register #1
Receive Secure-ON Password Register #2
Receive Secure-ON Password Register #3
Complex bit access types are encoded to fit into small table cells. 表 9-21 shows the codes that are used for
access types in this section.
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表9-21. DP83826 Access Type Codes
Access Type
Code
Description
Read Type
H
H
R
Set or cleared by hardware
Read
R
RC
R
C
Read
to Clear
RH
R
H
Read
Set or cleared by hardware
Write Type
W
W
W
W
Write
Write
Write
W, STRAP
W, W1S
W0C
W
Write
0C
0 to clear
W1S
W
Write
1S
1 to set
Reset or Default Value
-n
Value after reset or the default
value
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9.5.1.1 BMCR Register (Offset = 0h) [Reset = 3000h]
BMCR Register is shown in 表9-22.
Return to the 表9-20.
Basic Mode Control Register
表9-22. BMCR Register Field Descriptions
Bit
Field
Type
Reset
Description
15
Reset
HW1S
0h
PHY Software Reset: Writing a 1 to this bit resets the PHY PCS
registers. When the reset operation is completed,, this bit is cleared
to 0 automatically. PHY Vendor Specific registers will not be cleared.
0h = Normal Operation
1h = Initiate software Reset / Reset in Progress
14
13
MII Loopback
R/W
0h
MII Loopback: When MII loopback mode is activated, the transmitted
data presented on MII TXD is looped back to MII RXD internally.
Additionally set following additional bit BISCR 0x0016[4:0] =
0b00100 for 100Base-TX and BISCR 0x0016[4:0] = 00001b for
10Base-Te
0h = Normal Operation
1h = MII Loopback enabled
Speed Selection
R/W,STRAP 1h
R/W,STRAP 1h
Speed Selection: When Auto-Negotiation is disabled (bit [12] = 0 in
Register 0x0000), writing to this bit allows the port speed to be
selected.
In BASIC Mode: It is also determined by strap when Auto-
Negotiation is disabled.
0h = 10 Mbps
1h = 100 Mbps
12
11
Auto-Negotiation Enable
IEEE Power Down
Auto-Negotiation Enable: In BASIC Mode and ENHANCED Mode:
Latched by strap
0h = Disable Auto-Negotiation - bits [8] and [13] determine the port
speed and duplex mode
1h = Enable Auto-Negotiation - bits [8] and [13] of this register are
ignored when this bit is set
R/W
0h
Power Down: The PHY is powered down after this bit is set. Only
register access is enabled during this power down condition. To
control the power down mechanism, this bit is OR'ed with the input
from the INT/PWDN_N (in ENHANCED mode) pin. When the active
low INT/PWDN_N is asserted, this bit is set.
0h = Normal Operation
1h = IEEE Power Down
10
9
Isolate
R/W,STRAP 0h
RH/W,W1S 0h
In BASIC Mode, the value is Latched by strap
0h = Normal Operation
1h = Isolates the port from the MII with the exception of the serial
management interface. It also disables50MHz clock in RMII Master
Mode
Restart Auto-Negotiation
Restart Auto-Negotiation: If Auto-Negotiation is disabled (bit [12] =
0), bit [9] is ignored. This bit is self-clearing and will return a value of
1 until Auto-Negotiation is initiated, whereupon it will self-clear.
Operation of the Auto-Negotiation process is not affected by the
management entity clearing this bit.
0h = Normal Operation
1h = Restarts Auto-Negotiation, Re-initiates the Auto-Negotiation
process
8
Duplex Mode
R/W,STRAP 0h
Duplex Mode: When Auto-Negotiation is disabled, writing to this bit
allows the port Duplex capability to be selected. In BASIC Mode, this
bit is Latched by strap
0h = Half-Duplex
1h = Full-Duplex
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表9-22. BMCR Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
7
Collision Test
R/W
0h
Collision Test: When set, this bit causes the COL signal to be
asserted in response to the assertion of TX_EN within 512 bit times.
The COL signal is de-asserted within 4 bit times in response to the
de-assertion to TX_EN.
0h = Normal Operation
1h = Enable COL Signal Test
6-0
RESERVED
R
0h
Reserved
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9.5.1.2 BMSR Register (Offset = 1h) [Reset = 7849h]
BMSR Register is shown in 表9-23.
Return to the 表9-20.
Basic Mode Status Register
表9-23. BMSR Register Field Descriptions
Bit
Field
Type
Reset
Description
15
100Base-T4
R
0h
100Base-T4 Capable: This protocol is not available. Always reads as
0.
14
13
12
11
100Base-TX Full-Duplex
100Base-TX Half-Duplex
10Base-T Full-Duplex
10Base-T Half-Duplex
RESERVED
R
R
R
R
1h
1h
1h
1h
100Base-TX Full-Duplex Capable:
0h = Device not able to perform Full-Duplex 100Base-TX
1h = Device able to perform Full-Duplex 100Base-TX
100Base-TX Half-Duplex Capable:
0h = Device not able to perform Half-Duplex 100Base-TX
1h = Device able to perform Half-Duplex 100Base-TX
10Base-T Full-Duplex Capable:
0h = Device not able to perform Full-Duplex 10Base-T
1h = Device able to perform Full-Duplex 10Base-T
10Base-T Half-Duplex Capable:
0h = Device not able to perform Half-Duplex 10Base-T
1h = Device able to perform Half-Duplex 10Base-T
10-7
6
R
R
0h
1h
Reserved
SMI Preamble
Suppression
Preamble Suppression Capable: If this bit is set to 1, 32-bits of
preamble needed only once after reset, invalid opcode or invalid
turnaround.
The device requires minimum of 500ns gap between two
transactions, followed by one positive edge of MDC and MDIO=1,
before starting the next transaction.
0h = Device not able to perform management transaction with
preambles suppressed
1h = Device able to perform management transaction with preamble
suppressed
5
4
Auto-Negotiation
Complete
R
H
0h
0h
Auto-Negotiation Complete:
0h = Auto Negotiation process not completed (either still in process,
disabled or reset)
1h = Auto-Negotiation process completed
Remote Fault
Remote Fault: Far End Fault indication or notification from Link
Partner of Remote Fault. This bit is cleared on read or reset.
0h = No remote fault condition detected
1h = Remote fault condition detected
3
2
Auto-Negotiation Ability
Link Status
R
1h
0h
Auto-Negotiation Ability:
0h = Device is not able to perform Auto-Negotiation
1h = Device is able to perform Auto-Negotiation
RC
Link Status:
Last latched value is cleared on read
0h = Link not established
1h = Valid link established (for either 10 Mbps or 100 Mbps
operation)
1
0
Jabber Detect
H
R
0h
1h
Jabber Detect:
0h = No jabber condition detected This bit only has meaning for
10Base-T operation.
1h = Jabber condition detected
Extended Capability
Extended Capability:
0h = Basic register set capabilities only
1h = Extended register capabilities
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9.5.1.3 PHYIDR1 Register (Offset = 2h) [Reset = 2000h]
PHYIDR1 Register is shown in 表9-24.
Return to the 表9-20.
PHY Identifier Register #1
表9-24. PHYIDR1 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
Organizationally Unique
Identifier Bits 21:6
R
2000h
PHY Identifier Register #1
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9.5.1.4 PHYIDR2 Register (Offset = 3h) [Reset = A131h]
PHYIDR2 Register is shown in 表9-25.
Return to the 表9-20.
PHY Identifier Register #2
表9-25. PHYIDR2 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-10
Organizationally Unique
Identifier Bits 5:0
R
28h
PHY Identifier Register #2
9-4
3-0
Model Number
R
R
13h
1h
Vendor Model Number: The six bits of vendor model number are
mapped from bits [9] to [4]
11h = Basic Mode
13h = ENHANCED Mode
Revision Number
Model Revision Number: Four bits of the vendor model revision
number are mapped from bits [3:0]. This field is incremented for all
major device changes.
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9.5.1.5 ANAR Register (Offset = 4h) [Reset = 01E1h]
ANAR Register is shown in 表9-26.
Return to the 表9-20.
Auto-Negotiation Advertisement Register
表9-26. ANAR Register Field Descriptions
Bit
Field
Type
Reset
Description
15
Next Page
R/W
0h
Next Page Indication:
0h = Next Page Transfer not desired
1h = Next Page Transfer desired
14
13
RESERVED
Remote Fault
R
0h
0h
Reserved
R/W
Remote Fault:
0h = No Remote Fault detected
1h = Advertises that this device has detected a Remote Fault. Please
note DP83826 does not support Remote Fault. This bit shall not be
set by Application
12
11
RESERVED
R
0h
0h
Reserved
Asymmetric Pause
R/W
Asymmetric Pause Support For Full-Duplex Links:
0h = Do not advertise asymmetric pause ability
1h = Advertise asymmetric pause ability
10
9
Pause
R/W
R
0h
0h
Pause Support for Full-Duplex Links:
0h = Do not advertise pause ability
1h = Advertise pause ability
100Base-T4
100Base-T4 Support:
0h = Do not advertise 100Base-T4 ability
1h = Advertise 100Base-T4 ability
8
100Base-TX Full-Duplex
R/W,STRAP 1h
100Base-TX Full-Duplex Support:
Values does not matter in force-mode
BASIC Mode : Latched by strap
0h = Do not advertise 100Base-TX Full-Duplex ability Values does
not matter in force-mode
1h = Advertise 100Base-TX Full-Duplex ability
7
6
100Base-TX Half-Duplex R/W,STRAP 1h
100Base-TX Half-Duplex Support:
Values does not matter in force-mode
BASIC Mode: Latched by strap
0h = Do not advertise 100Base-TX Half-Duplex ability Values does
not matter in force-mode
1h = Advertise 100Base-TX Half-Duplex ability
10Base-T Full-Duplex
R/W,STRAP 1h
R/W,STRAP 1h
10Base-T Full-Duplex Support:
Values does not matter in force-mode
BASIC Mode: Latched by strap
0h = Do not advertise 10Base-T Full-Duplex ability Values does not
matter in force-mode
1h = Advertise 10Base-T Full-Duplex ability
5
10Base-T Half-Duplex
Selector Field
10Base-T Half-Duplex Support: Values does not matter in force-
mode BASIC Mode/ENHANCED Mode : Latched by strap
0h = Do not advertise 10Base-T Half-Duplex ability Values does not
matter in force-mode
1h = Advertise 10Base-T Half-Duplex ability
4-0
R/W
1h
Protocol Selection Bits: Technology selector field (IEEE802.3u
<00001>)
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9.5.1.6 ALNPAR Register (Offset = 5h) [Reset = 0000h]
ALNPAR Register is shown in 表9-27.
Return to the 表9-20.
Auto-Negotiation Link Partner Ability Register
表9-27. ALNPAR Register Field Descriptions
Bit
Field
Type
Reset
Description
15
Next Page
R
0h
Next Page Indication:
0h = Link partner does not desire Next Page Transfer
1h = Link partner desires Next Page Transfer
14
13
Acknowledge
Remote Fault
R
R
0h
0h
Acknowledge:
0h = Link partner does not acknowledge reception of link code word
1h = Link partner acknowledges reception of link code word
Remote Fault:
0h = Link partner does not advertise remote fault event detection
1h = Link partner advertises remote fault event detection
12
11
RESERVED
R
R
0h
0h
Reserved
Asymmetric Pause
Asymmetric Pause:
0h = Link partner does not advertise asymmetric pause ability
1h = Link partner advertises asymmetric pause ability
10
9
Pause
R
R
R
R
R
R
R
0h
0h
0h
0h
0h
0h
0h
Pause:
0h = Link partner does not advertise pause ability
1h = Link partner advertises pause ability
100Base-T4
100Base-T4 Support:
0h = Link partner does not advertise 100Base-T4 ability
1h = Link partner advertises 100Base-T4 ability
8
100Base-TX Full-Duplex
100Base-TX Half-Duplex
10Base-T Full-Duplex
10Base-T Half-Duplex
Selector Field
100Base-TX Full-Duplex Support:
0h = Link partner does not advertise 100Base-TX Full-Duplex ability
1h = Link partner advertises 100Base-TX Full-Duplex ability
7
100Base-TX Half-Duplex Support:
0h = Link partner does not advertise 100Base-TX Half-Duplex ability
1h = Link partner advertises 100Base-TX Half-Duplex ability
6
10Base-T Full-Duplex Support:
0h = Link partner does not advertise 10Base-T Full-Duplex ability
1h = Link partner advertises 10Base-T Full-Duplex ability
5
10Base-T Half-Duplex Support:
0h = Link partner does not advertise 10Base-T Half-Duplex ability
1h = Link partner advertises 10Base-T Half-Duplex ability
4-0
Protocol Selection Bits: Technology selector field (IEEE802.3
<00001>)
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9.5.1.7 ANER Register (Offset = 6h) [Reset = 0004h]
ANER Register is shown in 表9-28.
Return to the 表9-20.
Auto-Negotiation Expansion Register
表9-28. ANER Register Field Descriptions
Bit
15-5
4
Field
Type
Reset
Description
RESERVED
R
0h
Reserved
Parallel Detection Fault
H
0h
Parallel Detection Fault:
0h = No fault detected
1h = A fault has been detected during the parallel detection process
3
2
1
0
Link Partner Next Page
Able
R
R
H
R
0h
1h
0h
0h
Link Partner Next Page Ability:
0h = Link partner is not able to exchange next pages
1h = Link partner is able to exchange next pages
Local Device Next Page
Able
Next Page Ability:
0h = Local device is not able to exchange next pages
1h = Local device is able to exchange next pages
Page Received
Link Code Word Page Received:
0h = A new page has not been received
1h = A new page has been received
Link Partner Auto-
Negotiation Able
Link Partner Auto-Negotiation Ability:
0h = Link partner does not support Auto-Negotiation
1h = Link partner supports Auto-Negotiation
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9.5.1.8 ANNPTR Register (Offset = 7h) [Reset = 2001h]
ANNPTR Register is shown in 表9-29.
Return to the 表9-20.
Auto-Negotiation Next Page Register
表9-29. ANNPTR Register Field Descriptions
Bit
Field
Type
Reset
Description
15
Next Page
R/W
0h
Next Page Indication:
0h = Do not advertise desire to send additional next pages
1h = Advertise desire to send additional next pages
14
13
RESERVED
R
0h
1h
Reserved
Message Page
R/W
Message Page:
0h = Current page is an unformatted page
1h = Current page is a message page
12
11
Acknowledge 2
Toggle
R/W
R
0h
0h
Acknowledge2: Acknowledge2 is used by the next page function to
indicate that Local Device has the ability to comply with the message
received.
0h = Cannot comply with message
1h = Will comply with message
Toggle: Toggle is used by the Arbiitration function within Auto-
Negotiation to synchronize with the Link Parnter during Next Page
exchange. This bit always takes the opposite value of the Toggle bit
in the previously exchanged Link Code Word.
0h = Value of toggle bit in previously transmitted Link Code Word
was 1
1h = Value of toggle bit in previously transmitted Link Code Word
was 0
10-0
CODE
R/W
1h
This field represents the code field of the next page transmission. If
the Message Page bit is set (bit [13] of this register), then the code is
interpreted as a Message Page, as defined in annex 28C of IEEE
802.3u. Otherwise, the code is interperated as an Unformatted Page,
and the interpretation is application specific.
The default value of the CODE represents a Null Page as defined in
Annex 28C of IEEE 802.3u.
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9.5.1.9 ANLNPTR Register (Offset = 8h) [Reset = 0000h]
ANLNPTR Register is shown in 表9-30.
Return to the 表9-20.
Auto-Negotiation Link Partner Ability Next Page Register
表9-30. ANLNPTR Register Field Descriptions
Bit
Field
Type
Reset
Description
15
Next Page
R
0h
Next Page Indication:
0h = Do not advertise desire to send additional next pages
1h = Advertise desire to send additional next pages
14
13
12
Acknowledge
Message Page
Acknowledge 2
R
R
R
0h
0h
0h
Acknowledge:
0h = Link partner does not acknowledge reception of link code work
1h = Link partner acknowledges reception of link code word
Message Page:
0h = Current page is an unformatted page
1h = Current page is a message page
Acknowledge2: Acknowledge2 is used by the next page function to
indicate that Local Device has the ability to comply with the message
received.
0h = Cannot comply with message
1h = Will comply with message
11
Toggle
R
0h
Toggle: Toggle is used by the Arbiitration function within Auto-
Negotiation to synchronize with the Link Parnter during Next Page
exchange. This bit always takes the opposite value of the Toggle bit
in the previously exchanged Link Code Word.
0h = Value of toggle bit in previously transmitted Link Code Word
was 1
1h = Value of toggle bit in previously transmitted Link Code Word
was 0
10-0
Message/Unformatted
Field
R
0h
This field represents the code field of the next page transmission. If
the Message Page bit is set (bit 13 of this register), then the code is
interpreted as a Message Page, as defined in annex 28C of IEEE
802.3u. Otherwise, the code is interperated as an Unformatted Page,
and the interpretation is application specific.
The default value of the CODE represents a Null Page as defined in
Annex 28C of IEEE 802.3u.
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9.5.1.10 CR1 Register (Offset = 9h) [Reset = 0000h]
CR1 Register is shown in 表9-31.
Return to the 表9-20.
Control Register #1
表9-31. CR1 Register Field Descriptions
Bit
15-10
9
Field
Type
Reset
Description
Reserved
Reserved
RESERVED
RESERVED
TDR Auto-Run
R
0h
R/W
R/W
0h
8
0h
TDR Auto-Run at Link Down
0h = Disable automatic execution of TDR
1h = Enable execution of TDR procedure after link down event
7
6
5
RESERVED
R/W
R/W
R/W
0h
0h
0h
Reserved
Reserved
RESERVED
Robust Auto MDIX
Robust Auto-MDIX: If link partners are configured for operational
modes that are not supported by normal Auto-MDIX, Robust Auto-
MDIX allows MDI/MDIX resolution and prevents deadlock. When
using in Force Mode, Robust Auto-MDIX shall be enabled
0h = Disable Auto-MDIX
1h = Enable Robust Auto-MDIX
4
3-2
1
RESERVED
R/W
R/W
R/W
0h
0h
0h
Reserved
Reserved
RESERVED
Fast RXDV Detection
Fast RXDV Detection:
0h = Disable Fast RX_DV detection. The PHY operates in normal
mode. RX_DV assertion after detection of /JK/.
1h = Enable assertion high of RX_DV on receive packet due to
detection of /J/ symbol only. If a consecutive /K/ does not appear,
RX_ER is generated.
0
RESERVED
R
0h
Reserved
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9.5.1.11 CR2 Register (Offset = Ah) [Reset = 0102h]
CR2 Register is shown in 表9-32.
Return to the 表9-20.
Control Register #2
表9-32. CR2 Register Field Descriptions
Bit
15
14
13-7
6
Field
Type
R/W
R/W
R/W
R/W
R/W
Reset
Description
RESERVED
RESERVED
RESERVED
RESERVED
0h
Reserved
0h
Reserved
2h
Reserved
0h
Reserved
5
Extended Full-Duplex
Ability
0h
Extended Full-Duplex Ability:
0h = Disable Extended Full-Duplex Ability. Decision to work in Full-
Duplex or Half-Duplex mode follows IEEE specification
1h = Enable Full-Duplex while working with link partner in force
100Base-TX. When the PHY is set to Auto-Negotiation or Force
100Base-TX and the link partner is operated in Force 100Base-TX,
the link is always Full-Duplex
4
3
2
RESERVED
R/W
R/W
R/W
0h
0h
0h
Reserved
Reserved
RESERVED
RX_ER During IDLE
Detection of Receive Symbol Error During IDLE State:
0h = Disable detection of Receive symbol error during IDLE state
1h = Enable detection of Receive symbol error during IDLE state
1
Odd-Nibble Detection
Disable
R/W,STRAP 1h
Detection of Transmit Error. ENHANCED mode: Enabled by default,
can be changed with Strap1 BASIC mode: Disabled
0h = Enable detection of de-assertion of TX_EN on an odd-nibble
boundary. In this case TX_EN is extended by one additional TX_CLK
cycle and behaves as if TX_ER were asserted during that additional
cycle
1h = Disable detection of transmit error in odd-nibble boundary
0
RESERVED
R/W
0h
Reserved
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9.5.1.12 CR3 Register (Offset = Bh) [Reset = 0000h]
CR3 Register is shown in 表9-33.
Return to the 表9-20.
Control Register #3
表9-33. CR3 Register Field Descriptions
Bit
15-11
10
Field
Type
R/W
R/W
Reset
Description
RESERVED
0h
Reserved
Descrambler Fast Link
Down Mode
0h
Descrambler Fast Link Drop:
This option can be enabled in parallel to the other fast link down
modes in bits [3:0].
0h = Do not drop the link on descrambler link loss
1h = Drop the link on descrambler link loss
9
8
7
6
RESERVED
RESERVED
RESERVED
Polarity Swap
R
0h
0h
0h
0h
Reserved
Reserved
Reserved
R/W
R/W
R/W
Polarity Swap:
Port Mirror Function: To enable port mirroring, set this bit and bit [5]
high.
1h = Inverted polarity on both pairs: TD+ and TD-, RD+ and RD- 0h
= Normal polarity
5
MDI/MDIX Swap
R/W
R/W
0h
0h
MDI/MDIX Swap:
Port Mirror Function: To enable port mirroring, set this bit and bit [6]
high.
0h = MDI pairs normal (Receive on RD pair, Transmit on TD pair)
1h = Swap MDI pairs (Receive on TD pair, Transmit on RD pair)
4
RESERVED
Reserved
3-0
Fast Link Down Mode
R/W,STRAP 0h
Fast Link Down Modes:
Bit 3 Drop the link based on RX Error count of the MII interface.
When a predefined number of 32 RX Error occurences in a 10us
interval is reached, the link will be dropped.
Bit 2 Drop the link based on MLT3 Error count (Violation of the MLT3
coding in the DSP output). When a predefined number of 20 MLT3
Error occurences in10us interval is reached, the link will be dropped.
Bit 1 Drop the link based on Low SNR Threshold. When a predefined
number of 20 Threshold crossing occurences in a 10us interval is
reached, the link will be dropped.
Bit 0 Drop the link based on Signal/Energy Loss indication. When the
Energy detector indicates Energy Loss, the link will be dropped.
Typical reaction time is 10us
C : Bit 0 default is 0
NC+ MII: Bit 0 is taken from STRAP in ENHANCED mode
NC + RMII: Bit 0 default is 0
The Fast Link Down function is an OR of all 5 options (bits [10] and
[3:0]), the designer can enable any combination of these conditions.
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9.5.1.13 REGCR Register (Offset = Dh) [Reset = 0000h]
REGCR Register is shown in 表9-34.
Return to the 表9-20.
表9-34. REGCR Register Field Descriptions
Bit
Field
Type
Reset
Description
15-14
Extended Register
Command
R/W
0h
Extended Register Command:
0h = Address
1h = Data, no post increment
2h = Data, post increment on read and write
3h = Data, post increment on write only
13-5
4-0
RESERVED
DEVAD
R
0h
0h
Reserved
R/W
Device Address: Bits [4:0] are the device address, DEVAD, that
directs any accesses of ADDAR register (0x000E) to the appropriate
MMD.
Specifically, the DP83826 uses the vendor specific DEVAD [4:0] =
'11111' for accesses to registers 0x04D1 and lower. For MMD3
access, the DEVAD[4:0] = '00011'. For MMD7 access, the
DEVAD[4:0] = '00111'.
All accesses through registers REGCR and ADDAR should use the
DEVAD for either MMD, MMD3 or MMD7. Transactions with other
DEVAD are ignored.
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9.5.1.14 ADDAR Register (Offset = Eh) [Reset = 0000h]
ADDAR Register is shown in 表9-35.
Return to the 表9-20.
表9-35. ADDAR Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
Address/Data
R/W
0h
If REGCR register bits [15:14] = '00', holds the MMD DEVAD's
address register, otherwise holds the MMD DEVAD's data.
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9.5.1.15 FLDS Register (Offset = Fh) [Reset = 0000h]
FLDS Register is shown in 表9-36.
Return to the 表9-20.
表9-36. FLDS Register Field Descriptions
Bit
15-9
8-4
Field
Type
Reset
Description
RESERVED
Fast Link Down Status
R
0h
Reserved
RC
0h
Fast Link Down Status:
Status Registers that latch high each time a given Fast Link Down
mode is activated and causes a link drop (assuming the modes were
enabled)
1h = Signal/Energy Lost
2h = SNR Level
4h = MLT3 Errors
8h = RX Errors
10h = Descrambler Loss Sync
3-0
RESERVED
R
0h
Reserved
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9.5.1.16 PHYSTS Register (Offset = 10h) [Reset = 0002h]
PHYSTS Register is shown in 表9-37.
Return to the 表9-20.
表9-37. PHYSTS Register Field Descriptions
Bit
15
14
Field
Type
Reset
Description
RESERVED
MDI/MDIX Mode
R
0h
Reserved
R
0h
MDI/MDIX Mode Status:
0h = MDI Pairs normal (Receive on RD pair, Transmit on TD pair)
1h = MDI Pairs swapped (Receive on TD pair, Transmit on RD pair)
13
12
Receive Error Latch
Polarity Status
RC
RC
0h
0h
Receive Error Latch:
This bit will be cleared upon a read of the RECR register
0h = No receive error event has occurred
1h = Receive error event has occurred since last read of RXERCNT
register (0x0015)
Polarity Status:
This bit is a duplication of bit [4] in the 10BTSCR register (0x001A).
This bit will be cleared upon a read of the 10BTSCR register, but not
upon a read of the PHYSTS register.
0h = Correct Polarity detected
1h = Inverted Polarity detected
11
10
False Carrier Sense Latch RC
0h
0h
False Carrier Sense Latch:
This bit will be cleared upon a read of the FCSR register.
0h = No False Carrier event has occurred
1h = False Carrier even has occurred since last read of FCSCR
register (0x0014)
Signal Detect
RC
Signal Detect:
Active high 100Base-TX unconditional Signal Detect indication from
PMD
9
8
Descrambler Lock
Page Received
RC
RC
0h
0h
Descrambler Lock:
Active high 100Base-TX Descrambler Lock indication from PMD
Link Code Word Page Received:
This bit is a duplicate of Page Received (bit [1]) in the ANER register
and it is cleared on read of the ANER register (0x0006).
0h = Link Code Word Page has not been received
1h = A new Link Code Word Page has been received
7
6
5
MII Interrupt
Remote Fault
Jabber Detect
RC
RC
RC
0h
0h
0h
MII Interrupt Pending:
Interrupt source can be determined by reading the MISR register
(0x0012). Reading the MISR will clear this interrupt bit indication.
0h = No interrupt pending
1h = Indicates that an internal interrupt is pending
Remote Fault:
Cleared on read of BMSR register (0x0001) or by reset.
1h = Remote Fault condition detected. Fault criteria: notification from
link partner of Remote Fault via Auto-Negotiation 0h = No Remote
Fault condition detected
Jabber Detection:
This bit is only for 10 Mbps operation. This bit is a duplicate of the
Jabber Detect bit in the BMSR register (0x0001) and will not be
cleared upon a read of the PHYSTS register.
0h = No Jabber
1h = Jabber condition detected
4
3
Auto-Negotiation Status
MII Loopback Status
R
R
0h
0h
Auto-Negotiation Status:
0h = Auto-Negotiation not complete
1h = Auto-Negotiation complete
MII Loopback Status:
0h = Normal operation
1h = Loopback enabled
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表9-37. PHYSTS Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
2
Duplex Status
0h
Duplex Status:
BASIC Mode: Latched by Strap when Auto-Negotiation is disabled
ENHANCED Mode : 1 when Auto-Negotiation is disabled
0h = Half-Duplex mode
1h = Full-Duplex mode
1
0
Speed Status
Link Status
1h
0h
Speed Status:
BASIC Mode : Latched by Strap when Auto-Negotiation is disabled
ENHANCED Mode : 1 when Auto-Negotiation is disabled
0h = 100 Mbps mode
1h = 10 Mbps mode
R
Link Status:
This bit is duplicated from the Link Status bit in the BMSR register
( address 0x0001) and will not be cleared upon a read of the
PHYSTS register.
0h = No link established
1h = Valid link established (for either 10 Mbps or 100 Mbps)
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9.5.1.17 PHYSCR Register (Offset = 11h) [Reset = 0108h]
PHYSCR Register is shown in 表9-38.
Return to the 表9-20.
表9-38. PHYSCR Register Field Descriptions
Bit
Field
Type
Reset
Description
15
Disable PLL
R/W
0h
Disable PLL:
Note: clock circuitry can be disabled only in IEEE power down mode.
0h = Normal operation
1h = Disable internal clocks circuitry
14
Power Save Mode Enable R/W
0h
0h
Power Save Mode Enable:
0h = Normal operation
1h = Enable power save modes
13-12
Power Save Modes
R/W
Power Save Mode:
0h = Normal operation mode. PHY is fully functional
1h = Reserved
2h = Active Sleep, Low Power Active Energy Saving mode that shuts
down all internal circuitry besides SMI and energy detect
functionalities. In this mode the PHY sends NLP every 1.4 seconds
to wake up link partner. Automatic power-up is done when link
partner is detected.
11
Scrambler Bypass
R/W
0h
Scrambler Bypass:
0h = Scrambler bypass disabled
1h = Scrambler bypass enabled
10
RESERVED
R/W
R/W
0h
1h
Reserved
9-8
Loopback FIFO Depth
Far-End Loopback FIFO Depth:
This FIFO is used to adjust RX (receive) clock rate to TX clock rate.
FIFO depth needs to be set based on expected maximum packet
size and clock accuracy. Default value sets to 5 nibbles.
0h = 4 nibbles FIFO
1h = 5 nibbles FIFO
2h = 6 nibbles FIFO
3h = 8 nibbles FIFO
7-5
4
RESERVED
R
0h
0h
Reserved
COL Full-Duplex Enable
R/W
Collision in Full-Duplex Mode:
0h = Disable Collision in Full-Duplex mode. Collision will be active in
Half-Duplex only.
1h = Enable generating Collision signaling in Full-Duplex mode
3
2
Interrupt Polarity
Test Interrupt
R/W
R/W
1h
0h
Interrupt Polarity:
0h = Steady state (normal operation) is 0 logic and during interrupt is
1 logic
1h = Steady state (normal operation) is 1 logic and during interrupt is
0 logic
Test Interrupt:
Forces the PHY to generate an interrupt to facilitate interrupt testing.
Interrupts will continue to be generated as long as this bit remains
set.
0h = Do not generate interrupt
1h = Generate an interrupt
1
0
Interrupt Enable
R/W
R/W
0h
0h
Interrupt Enable:
Enable interrupt dependent on the event enables in the MISR
register (0x0012).
0h = Disable event based interrupts
1h = Enable event based interrupts
Interrupt Output Enable
Interrupt Output Enable:
Enable active low interrupt events via the INTR/PWERDN pin by
configuring the INTR/PWRDN pin as an output( for ENHANCED
mode)
0h = INTR/PWRDN is a Power Down pin
1h = INTR/PWRDN is an interrupt output
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9.5.1.18 MISR1 Register (Offset = 12h) [Reset = 0000h]
MISR1 Register is shown in 表9-39.
Return to the 表9-20.
表9-39. MISR1 Register Field Descriptions
Bit
Field
Type
Reset
Description
15
Link Quality Interrupt
RC
0h
Change of Link Quality Status Interrupt:
0h = Link quality is Good
1h = Change of link quality when link is ON
14
13
12
11
10
9
Energy Detect Interrupt
RC
RC
0h
0h
0h
0h
0h
0h
Change of Energy Detection Status Interrupt:
0h = No change of energy detected
1h = Change of energy detected
Link Status Changed
Interrupt
Change of Link Status Interrupt:
0h = No change of link status
1h = Change of link status interrupt is pending
Speed Changed Interrupt RC
Change of Speed Status Interrupt:
0h = No change of speed status
1h = Change of speed status interrupt is pending
Duplex Mode Changed
Interrupt
RC
RC
RC
Change of Duplex Status Interrupt:
0h = No change of duplex status
1h = Change of duplex status interrupt is pending
Auto-Negotiation
Completed Interrupt
Auto-Negotiation Complete Interrupt:
0h = No Auto-Negotiation complete event is pending
1h = Auto-Negotiation complete interrupt is pending
False Carrier Counter
Half-Full Interrupt
False Carrier Counter Half-Full Interrupt:
0h = False Carrier half-full event is not pending
1h = False Carrier counter (Register FCSCR, address 0x0014)
exceeds half-full interrupt is pending
8
Receive Error Counter
Half-Full Interrupt
RC
0h
Receiver Error Counter Half-Full Interrupt:
0h = Receive Error half-full event is not pending
1h = Receive Error counter (Register RECR, address 0x0015)
exceeds half-full interrupt is pending
7
6
5
4
3
2
Link Quality Interrupt
Enable
R/W
R/W
R/W
0h
0h
0h
0h
0h
0h
Enable interrupt on change of link quality
Enable interrupt on change of energy detection
Enable interrupt on change of link status
Energy Detect Interrupt
Enable
Link Status Changed
Enable
Speed Changed Interrupt R/W
Enable
Enable Interrupt on change of speed status
Enable Interrupt on change of duplex status
Enable Interrupt on Auto-negotiation complete event
Duplex Mode Changed
Interrupt Enable
R/W
R/W
R/W
Auto-Negotiation
Completed Enable
1
0
False Carrier HF Enable
0h
0h
Enable Interrupt on False Carrier Counter Register half-full event
Enable Interrupt on Receive Error Counter Register half-full event
Receive Error HF Enable R/W
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9.5.1.19 MISR2 Register (Offset = 13h) [Reset = 0000h]
MISR2 Register is shown in 表9-40.
Return to the 表9-20.
表9-40. MISR2 Register Field Descriptions
Bit
Field
Type
Reset
Description
15
EEE Error Interrupt
RC
0h
Energy Efficient Ethernet Error Interrupt:
0h = EEE error has not occurred
1h = EEE error has occurred
14
13
12
11
10
9
Auto-Negotiation Error
Interrupt
RC
RC
RC
RC
RC
0h
0h
0h
0h
0h
0h
0h
Auto-Negotiation Error Interrupt:
0h = No Auto-Negotiation error even pending
1h = Auto-Negotiation error interrupt is pending
Page Received Interrupt
Page Receiver Interrupt:
0h = Page has not been received
1h = Page has been received
Loopback FIFO OF/UF
Event Interrupt
Loopback FIFO Overflow/Underflow Event Interrupt:
0h = No FIFO Overflow/Underflow event pending
1h = FIFO Overflow/Underflow event interrupt pending
MDI Crossover Change
Interrupt
MDI/MDIX Crossover Status Change Interrupt:
0h = MDI crossover status has not changed
1h = MDI crossover status changed interrupt is pending
Sleep Mode Interrupt
Sleep Mode Event Interrupt:
0h = No Sleep mode event pending
1h = Sleep mode event interrupt is pending
Inverted Polarity Interrupt / RC
WoL Packet Received
Interrupt
Inverted Polarity Interrupt / WoL Packet Received Interrupt:
0h = No Inverted polarity event pending / No WoL oacket received
1h = Inverted Polarity interrupt pending / WoL packet was recieved
8
Jabber Detect Interrupt
RC
Jabber Detect Event Interrupt:
0h = No Jabber detect event pending
1h = Jabber detect even interrupt pending
7
6
EEE Error Interrupt Enable R/W
0h
0h
Enable interrupt on EEE Error
Auto-Negotiation Error
Interrupt Enable
R/W
R/W
R/W
R/W
Enable Interrupt on Auto-Negotiation error event
5
4
3
Page Received Interrupt
Enable
0h
0h
0h
Enable Interrupt on page receive event
Loopback FIFO OF/UF
Enable
Enable Interrupt on loopback FIFO Overflow/Underflow event
Enable Interrupt on change of MDI/X status
MDI Crossover Change
Enable
2
1
Sleep Mode Event Enable R/W
0h
0h
Enable Interrupt on sleep mode event
Polarity Changed / WoL
Packet Enable
R/W
Enable Interrupt on change of polarity status
0
Jabber Detect Enable
R/W
0h
Enable Interrupt on Jabber detection event
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9.5.1.20 FCSCR Register (Offset = 14h) [Reset = 0000h]
FCSCR Register is shown in 表9-41.
Return to the 表9-20.
表9-41. FCSCR Register Field Descriptions
Bit
15-8
7-0
Field
Type
Reset
Description
RESERVED
R
0h
Reserved
False Carrier Event
Counter
0h
False Carrier Event Counter:
This 8-bit counter increments on every false carrier event. This
counter stops when it reaches its maximum count (FFh).
When the counter exceeds half-full (7Fh), an interrupt event is
generated. This register is cleared on read.
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9.5.1.21 RECR Register (Offset = 15h) [Reset = 0000h]
RECR Register is shown in 表9-42.
Return to the 表9-20.
表9-42. RECR Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
Receive Error Counter
0h
RX_ER Counter:
When a valid carrier is presented (only while RXDV is set), and there
is at least one occurrence of an invalid data symbol, this 16-bit
counter increments for each receive error detected.
The RX_ER counter does not count in MII loopback mode.
The counter stops when it reaches its maximum count (FFh). When
the counter exceeds half-full (7Fh), an interrupt is generated. This
register is cleared on read.
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9.5.1.22 BISCR Register (Offset = 16h) [Reset = 0100h]
BISCR Register is shown in 表9-43.
Return to the 表9-20.
表9-43. BISCR Register Field Descriptions
Bit
15
14
Field
Type
Reset
Description
RESERVED
R
0h
Reserved
BIST Error Counter Mode R/W
0h
BIST Error Counter Mode:
0h = Single mode, when BIST Error Counter reaches its max value,
PRBS checker stops counting.
1h = Continuous mode, when the BIST Error counter reaches its max
value, a pulse is generated and the counter starts counting from zero
again.
13
12
PRBS Checker Config
R/W
0h
0h
PRBS Checker Config:bit[13:12]
0h = PRBS Generator and Checker both are disabled
1h = PRBS Generator Enabled, Trasnmit Single Packet with
Constant Data as configured in register 0x001C. Checker is disabled
2h = PRBS Generation is disabled. PRBS Checker is Enabled
3h = PRBS Generator and Checker both enabled. PRBS Generating
Continous Packets as configured in register 0x001C
Packet Generation Enable R/W
Packet Generation Enable:bit[13:12]
0h = PRBS Generator and Checker both are disabled
1h = PRBS Generator Enabled, Trasnmit Single Packet with
Constant Data as configured in register 0x001C. Checker is disabled
2h = PRBS Generation is disabled. PRBS Checker is Enabled
3h = PRBS Generator and Checker both enabled. PRBS Generating
Continous Packets as configured in register 0x001C
11
10
9
PRBS Checker Lock/Sync
PRBS Checker Sync Loss
Packet Generator Status
Power Mode
R
H
R
R
R
0h
0h
0h
1h
PRBS Checker Lock/Sync Indication:
0h = PRBS checker is not locked
1h = PRBS checker is locked and synced on received bit stream
PRBS Checker Sync Loss Indication:
0h = PRBS checker has not lost sync
1h = PRBS checker has lost sync
Packet Generation Status Indication:
0h = Packet Generator is off
1h = Packet Generator is active and generating packets
8
Sleep Mode Indication:
0h = Indicates that the PHY is in active sleep mode
1h = Indicates that the PHY is in normal power mode
7
6
RESERVED
0h
0h
Reserved
Transmit in MII Loopback R/W
Transmit Data in MII Loopback Mode (valid only at 100 Mbps)
0h = Data is not transmitted to the line in MII loopback
1h = Enable transmission of data from the MAC received on the TX
pins to the line in parallel to the MII loopback to RX pins. This bit may
be set only in MII Loopback mode - setting bit [14] in in BMCR
register (0x0000)
5
RESERVED
R
0h
0h
Reserved
4-0
Loopback Mode
R/W
Loopback Mode Select: The PHY provides several options for
loopback that test and verify various functional blocks within the PHY.
Enabling loopback mode allows in-circuit testing of the DP83826
digital and analog data paths
1h = PCS Input Loopback (Use for 10Base-Te only)
2h = PCS Output Loopback
4h = Digital Loopback ( Use for 100Base-TX Only) Additional
Register writes are required.
8h = Analog Loopback (requires 100Ωtermination)
10h = Reverse Loopback
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9.5.1.23 RCSR Register (Offset = 17h) [Reset = 0041h]
RCSR Register is shown in 表9-44.
Return to the 表9-20.
表9-44. RCSR Register Field Descriptions
Bit
15-13
12
Field
Type
Reset
Description
Reserved
Reserved
Reserved
Reserved
Reserved
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RMII TX Clock Shift
R
0h
R
0h
11
R
0h
10
R
0h
9
R
0h
8
R/W
0h
RMII TX Clock Shift: Applicable only in RMII Slave Mode
0h = Transmit path internal clock shift is disabled
1h = Transmit path internal clock shift is enabled
7
RMII Clock Select
R/W,STRAP 0h
RMII Reference Clock Select:
BASIC Mode: Latched by strap
ENHANCED Modie: Latched by strap
0h = 25MHz clock reference, crystal or CMOS-level oscillator
1h = 50MHz clock reference, CMOS-level oscillator
6
5
4
RESERVED
R/W
1h
Reserved
Reserved
RESERVED
R/W,STRAP 0h
RMII Revision Select
R/W
0h
RMII Revision Select:
0h = (RMII revision 1.2) CRS_DV will toggle at the end of a packet to
indicate de-assertion of CRS
1h = (RMII revision 1.0) CRS_DV will remain asserted until final data
is transferred. CRS_DV will not toggle at the end of a packet
3
2
RMII Overflow Status
RMII Underflow Status
0h
0h
1h
RX FIFO Overflow Status:
0h = Overflow detected
1h = Normal
RX FIFO Underflow Status:
0h = Underflow detected
1h = Normal
1-0
Receive Elasticity Buffer
Size
R/W
Receive Elasticity Buffer Size:
This field controls the Receive Elasticity Buffer which allows for
frequency variation tolerance between the 50MHz RMII clock and the
recovered data. The following values indicate the tolerance in bits for
a single packet. The minimum setting allows for standard Ethernet
frame sizes at +/-50ppm accuracy. For greater frequency tolerance,
the packet lengths may be scaled (for +/-100ppm), divide the packet
lengths by 2).
0h = 14 bit tolerance (up to 16800 byte packets)
1h = 2 bit tolerance (up to 2400 byte packets)
2h = 6 bit tolerance (up to 7200 byte packets)
3h = 10 bit tolerance (up to 12000 byte packets)
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9.5.1.24 LEDCR Register (Offset = 18h) [Reset = 0400h]
LEDCR Register is shown in 表9-45.
Return to the 表9-20.
表9-45. LEDCR Register Field Descriptions
Bit
Field
Type
Reset
Description
15-11
10-9
RESERVED
Blink Rate
R
0h
Reserved
R/W
2h
LED Blinking Rate (ON/OFF duration):
0h = 20Hz (50 ms)
1h = 10Hz (100 ms)
2h = 5Hz (200 ms)
3h = 2Hz (500 ms)
8
7
RESERVED
R/W
0h
Reserved
LED Link Polarity
R/W,STRAP 0h
LED Link Polarity Setting: Link LED polarity is Active Low in BASIC
mode and defined by direction of strapping on this pin in
ENHANCED mode. This register allows for override of this strap
value.
0h = Active Low polarity setting
1h = Active High polarity setting
6-5
4
RESERVED
R/W
R/W
0h
0h
Reserved
Drive Link LED
Drive Link LED Select:
0h = Normal operation
1h = Drive value of ON/OFF bit [1] onto LED0 output pin
3-2
1
RESERVED
R/W
0h
0h
Reserved
Link LED ON/OFF Setting R/W
Value to force on Link LED output
0h = LOW
1h = HIGH
0
RESERVED
R/W
0h
Reserved
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9.5.1.25 PHYCR Register (Offset = 19h) [Reset = 8000h]
PHYCR Register is shown in 表9-46.
Return to the 表9-20.
表9-46. PHYCR Register Field Descriptions
Bit
Field
Type
Reset
Description
15
Auto MDI/X Enable
R/W,STRAP 1h
Auto-MDIX Enable: BASIC Mode: Default to A-MDIX enabled.
ENHANCED Mode : Latched by strap A-MDIX
0h = Disable Auto-Negotiation Auto-MDIX capability
1h = Enable Auto-Negotiation Auto-MDIX capability
14
13
Force MDI/X
R/W,STRAP 0h
Force MDIX: ENHANCED Mode: When A-MDIX strap is disabled,
latched by FORCE MDI/MDIX strap
0h = Normal operation (Receive on RD pair, Transmit on TD pair)
1h = Force MDI pairs to cross (Receive on TD pair, Transmit on RD
pair)
Pause RX Status
R
R
R
0h
0h
0h
Pause Receive Negotiation Status: Indicates that pause receive
should be enabled in the MAC. Based on bits [11:10] in ANAR
register and bits [11:10] in ANLPAR register settings. The function
shall be enabled according to IEEE 802.3 Annex 28B Table 28B-3,
'Pause Resolution', only if the Auto-Negotiation highest common
denominator is a Full-Duplex technology.
12
11
Pause TX Status
MII Link Status
Pause Transmit Negotiated Status: Indicates that pause should be
enabled in the MAC. Based on bits [11:10] in ANAR register and bits
[11:10] in ANLPAR register settings. This function shall be enabled
according to IEEE 802.3 Annex 28B Table 28B-3, 'Pause
Resolution', only if the Auto-Negotiation highest common
denominator is a Full-Duplex technology.
MII Link Status:
0h = No active 100Base-TX Full-Duplex link, established using Auto-
Negotiation
1h = 100Base-TX Full-Duplex link is active and it was established
using Auto-Negotiation
10-8
7
RESERVED
R
0h
0h
Reserved
Bypass LED Stretching
R/W
Bypass LED Stretching: Set this bit to '1' to bypass the LED
stretching, the LED reflects the internal value.
0h = Normal LED operation
1h = Bypass LED stretching
6
5
RESERVED
R/W
R/W
0h
0h
0h
Reserved
LED Configuration
PHY Address
4-0
PHY Address: BASIC Mode: Latched by Strap ENHANCED Mode:
Latched by Strap
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9.5.1.26 10BTSCR Register (Offset = 1Ah) [Reset = 0000h]
10BTSCR Register is shown in 表9-47.
Return to the 表9-20.
表9-47. 10BTSCR Register Field Descriptions
Bit
15-14
13
Field
Type
Reset
Description
RESERVED
R
0h
Reserved
Receiver Threshold
Enable
R/W
0h
Lower Receiver Threshold Enable:
0h = Normal 10Base-T operation
1h = Enable 10Base-T lower receiver threshold to allow operation
with longer cables
12-9
Squelch
R/W
0h
Squelch Configuration: Used to set the Peak Squelch 'ON' threshold
for the 10Base-T receiver. Starting from 200mV to 600mV, step size
of 50mV with some overlapping as shown below:
0h = 200mV
1h = 250mV
2h = 300mV
3h = 350mV
4h = 400mV
5h = 450mV
6h = 500mV
7h = 550mV
8h = 600mV
8
7
RESERVED
NLP Disable
R/W
R/W
0h
0h
Reserved
NLP Transmission Control:
0h = Enable transmission of NLPs
1h = Disable transmission of NLPs
6-5
4
RESERVED
R
R
0h
0h
Reserved
Polarity Status
Polarity Status:
This bit is a duplication of bit [12] in the PHYSTS register (0x0010).
Both bits will be cleared upon a read of 10BTSCR register, but not
upon a read of the PHYSTS register.
0h = Correct Polarity detected
1h = Inverted Polarity detected
3-1
0
RESERVED
R
0h
0h
Reserved
Jabber Disable
R/W
Jabber Disable:
Note: This function is only applicable in 10Base-Te operation.
0h = Jabber function enabled
1h = Jabber function disabled
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9.5.1.27 BICSR1 Register (Offset = 1Bh) [Reset = 007Dh]
BICSR1 Register is shown in 表9-48.
Return to the 表9-20.
表9-48. BICSR1 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-8
BIST Error Count
R
0h
BIST Error Count:
Holds number of errored bytes received by the PRBS checker. Value
in this register is locked and cleared when write is done to bit [15].
When BIST Error Counter Mode is set to '0', count stops on 0xFF
(see register 0x0016)
Note: Writing '1' to bit [15] will lock the counter's value for successive
read operation and clear the BIST Error Counter.
7-0
BIST IPG Length
R/W
7Dh
BIST IPG Length:
Inter Packet Gap (IPG) Length defines the size of the gap (in bytes)
between any 2 successive packets generated by the BIST.
Default value is 0x7D (equal to 125 bytes*4 = 500 bytes).
Binary values shall be multiplied by 4 to get the actual IPG length
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9.5.1.28 BICSR2 Register (Offset = 1Ch) [Reset = 05EEh]
BICSR2 Register is shown in 表9-49.
Return to the 表9-20.
表9-49. BICSR2 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-11
10-0
RESERVED
BIST Packet Length
R
0h
Reserved
R/W
5EEh
BIST Packet Length:
Length of the generated BIST packets. The value of this register
defines the size (in bytes) of every packet that is generated by the
BIST.
Default value is 0x05EE, which is equal to 1518 bytes.
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9.5.1.29 CDCR Register (Offset = 1Eh) [Reset = 0100h]
CDCR Register is shown in 表9-50.
Return to the 表9-20.
表9-50. CDCR Register Field Descriptions
Bit
Field
Type
Reset
Description
15
Cable Diagnostic Start
R/W
0h
Cable Diagnostic Process Start:
Diagnostic Start bit is cleared once Diagnostic Done indication bit is
triggered.
0h = Cable Diagnostic is disabled
1h = Start cable measurement
14
13-2
1
cfg_rescal_en
R/W
R
0h
Resistor calibration Start
Reserved
RESERVED
40h
0h
Cable Diagnostic Status
R
Cable Diagnostic Process Done:
0h = Cable Diagnostic had not completed
1h = Indication that cable measurement process is complete
0
Cable Diagnostic Test Fail
R
0h
Cable Diagnostic Process Fail:
0h = Cable Diagnostic has not failed
1h = Indication that cable measurement process failed
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9.5.1.30 PHYRCR Register (Offset = 1Fh) [Reset = 0000h]
PHYRCR Register is shown in 表9-51.
Return to the 表9-20.
表9-51. PHYRCR Register Field Descriptions
Bit
Field
Type
Reset
Description
15
Software Hard Reset
HW1S
0h
Software Hard Reset:
0h = Normal Operation
1h = Reset PHY. This bit is self cleared and has the same effect as
Hardware reset pin.
14
Digital reset
HW1S
0h
Software Restart:
0h = Normal Operation
1h = Restart PHY. This bit is self cleared and resets all PHY circuitry
except the registers.
13
RESERVED
RESERVED
R/W
R/W
0h
0h
Reserved
Reserved
12-0
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9.5.1.31 MLEDCR Register (Offset = 25h) [Reset = 0041h]
MLEDCR Register is shown in 表9-52.
Return to the 表9-20.
表9-52. MLEDCR Register Field Descriptions
Bit
15-10
9
Field
Type
R/W
R/W
Reset
Description
RESERVED
MLED Polarity Swap
0h
Reserved
0h
MLED Polarity Swap:
The polarity of MLED depends on the routing configuration and the
strap on LED1 pin, but only in ENHANCED mode. If the pin strap is
Pull-Up then polarity is active low. If the pin strap is Pull-Down then
polarity is active high. In BASIC mode, the polarity is always active
low.
8-7
6-3
RESERVED
R/W
R/W
0h
8h
Reserved
LED0 Configuration
MLED Configurations: Selects the source for LED0
0h = LINK OK
1h = RX/TX Activity
2h = TX Activity
3h = RX Activity
4h = Collision
5h = Speed, High for 100BASE-TX
6h = Speed, High for 10BASE-T
7h = Full-Duplex
8h = LINK OK / BLINK on TX/RX Activity
9h = Active Stretch Signal
Ah = MII LINK (100BT+FD)
Bh = LPI Mode (EEE)
Ch = TX/RX MII Error
Dh = Link Lost (remains on until register 0x0001 is read)
Eh = Blink for PRBS error (remains ON for single error, remains until
counter is cleared)
Fh = Reserved
2-1
0
RESERVED
cfg_mled_en
R
0h
1h
Reserved
R/W
MLED Route to LED0:
0h = Reserved
1h = Value routed as per MLEDCR[6:3]
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9.5.1.32 COMPT Regsiter Register (Offset = 27h) [Reset = 0000h]
COMPT Regsiter is shown in 表9-53.
Return to the 表9-20.
表9-53. COMPT Regsiter Register Field Descriptions
Bit
15-4
3-0
Field
Type
R/W
R/W
Reset
0h
0h
Description
Reserved
Compliance Test Configuration Select:
Bit [4] in Register 0x0027 = 1, Enables 10Base-T Test Patterns
Bit [4] in Register 0x0428 = 1, Enables 100Base-TX Test Modes
Bits [3:0] select the 10Base-T test pattern, as follows:
0000 = Single NLP
RESERVED
Compliance Test
Configuration
0001 = Single Pulse 1
0010 = Single Pulse 0
0011 = Repetitive 1
0100 = Repetitive 0
0101 = Preamble (repetitive '10')
0110 = Single 1 followed by TP_IDLE
0111 = Single 0 followed by TP_IDLE
1000 = Repetitive '1001' sequence
1001 = Random 10Base-T data
1010 = TP_IDLE_00
1011 = TP_IDLE_01
1100 = TP_IDLE_10
1101 = TP_IDLE_11
100Base-TX Test Mode is determined by bits {[5] in register 0x0428,
[3:0] in register 0x0027}. The bits determine the number of 0's to
follow a '1'.
0,0001 = Single '0' after a '1'
0,0010 = Two '0' after a '1'
0,0011 = Three '0' after a '1'
0,0100 = Four '0' after a '1'
0,0101 = Five '0' after a '1'
0,0110 = Six '0' after a '1'
0,0111 = Seven '0' after a '1'
...
1,1111 = Thirty one '0' after a '1'
0,0000 = Clears the shift register
Note 1: To reconfigure the 100Base-TX Test Mode, bit [4] must be
cleared in register 0x0428 and then reset to '1' to configure the new
pattern.
Note 2: When performing 100Base-TX or 10Base-T tests modes, the
speed must be force using the Basic Mode Control Register (BMCR),
address 0x0000.
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9.5.1.33 10M_CFG Register (Offset = 2Ah) [Reset = 7998h]
10M_CFG is shown in 表9-54.
Return to the 表9-20.
表9-54. 10M_CFG Register Field Descriptions
Bit
15
14
Field
Type
Reset
Description
RESERVED
10M Preamble Mode
R
0h
Reserved
R/W
1h
The device supports two preamble size for 10Mbps. - (0) Long
Preamble Mode (1) Short Preamble Mode, This does not affect the
100Mbps mode.
In Long Preamble mode, "Long" denotes the number of preamble
received from MDI. In this mode, the receiver takes up to 7 bytes of
preamble to declare this as a valid preamble. The preamble on the
MAC can have lesser preambles than the bytes from MDI. The
device expects at least 7 bytes of preamble to be on the MDI line.
In Short Preamble mode, "Short" denotes the preamble bytes on the
MDI line. In this mode, the receiver can work with shorter preambles
> 3 bytes. If Link Partner is expected to transfer shorter preamble ( <
3 bytes), it is recommended to configure to "Long" preamble mode.
0h = Long Preamble Mode
1h = Short Preamble Mode
13-0
RESERVED
R/W
3998h
Reserved
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9.5.1.34 FLD_CFG1 Register (Offset = 117h) [Reset = 0000h]
FLD_CFG1 is shown in 表9-55.
Return to the 表9-20.
表9-55. FLD_CFG1 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-10
Config MLT3 Error Cnt
Len
R/W
0h
MLT3 Error count window. Sets the window in terns if number of
clocks (8ns). The counter counts in steady state.
0h = Reserved
1h = 2 cycle
3Fh = 64 cycle
9-4
3-0
Config MLT3 Error
Number Cnt
R/W
R
0h
0h
Numbers of MLT3 errors to be counted for link down
0h = Reserved
1h = 1 Error
3Fh = 63 Errors
RESERVED
Reserved
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9.5.1.35 FLD_CFG2 Register (Offset = 131h) [Reset = 0000h]
FLD_CFG2 is shown in 表9-56.
Return to the 表9-20.
表9-56. FLD_CFG2 Register Field Descriptions
Bit
15-6
5-0
Field
Type
R/W
R/W
Reset
Description
RESERVED
0h
Reserved
Config Scrambler
Threshold
0h
Configures the window to declare link down based on descrambler
errors.
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9.5.1.36 CDSCR Register (Offset = 170h) [Reset = 0C12h]
CDSCR Register is shown in 表9-57.
Return to the 表9-20.
表9-57. CDSCR Register Field Descriptions
Bit
15
14
Field
Type
Reset
Description
RESERVED
R
0h
Reserved
Cable Diagnostic Cross
Disable
R/W
0h
Cross TDR Diagnostic Mode:
0h = TDR looks for reflections on channel other than the transmit
channel configured by 0x170[13]
1h = TDR looks for reflections on same channel as transmit channel
configured by 0x170[13]
13
12
cfg_tdr_chan_sel
R/W
0h
0h
TDR TX channel select:
0h = Select channel A as transmit channel.
1h = Select channel B as transmit channel.
cfg_tdr_dc_rem_no_init
RESERVED
R/W
R/W
To make sure DC removal module is not reset before TDR and dc
removal is effective on TDR reflection
11
1h
4h
Reserved
10-8
Cable Diagnostic Average R/W
Cycles
Number of TDR Cycles to Average:
0h = 1 TDR cycle
1h = 2 TDR cycles
2h = 4 TDR cycles
3h = 8 TDR cycles
4h = 16 TDR cycles
5h = 32 TDR cycles
6h = 64 TDR cycles
7h = Reserved
7
RESERVED
R/W
R/W
0h
1h
Reserved
6-4
cfg_tdr_seg_num
Selects cable segment on which TDR is to be performed - 000b =
Reserved 001b = 0m to 10m 010b = 10m to 20m 011b = 20m to 40m
100b = 40m to 80m 101b = 80m and beyond 110b = Reserved 111b
= Reserved
3-0
RESERVED
R/W
2h
Reserved
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9.5.1.37 CDSCR2 Register (Offset = 171h) [Reset = C850h]
CDSCR2 Register is shown in 表9-58.
Return to the 表9-20.
表9-58. CDSCR2 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
RESERVED
R/W
C850h
Reserved
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9.5.1.38 CDSCR3 Register (Offset = 173h) [Reset = 0D04h]
CDSCR3 Register is shown in 表9-59.
Return to the 表9-20.
表9-59. CDSCR3 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-8
cfg_tdr_seg_duration
R/W
Dh
Duration of the segment selected for TDR, calculated by -
(Length_in_meters*2*5.2)/8 For Segment #1, 8'hD For Segment #2,
8'hD For Segment #3, 8'h1A For Segment #4, 8'h34 For Segment
#5, 8'h8F
7-0
cfg_tdr_initial_skip
R/W
4h
No of samples to be avoided before start of segment configured - For
Segment #1, 8'h7 For Segment #2, 8'h14 For Segment #3, 8'h21 For
Segment #4, 8'h3B For Segment #5, 8'h6F
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9.5.1.39 TDR_175 Register (Offset = 175h) [Reset = 1004h]
TDR_175 Register is shown in 表9-60.
Return to the 表9-20.
表9-60. TDR_175 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-14
13-11
RESERVED
cfg_tdr_sdw_avg_loc
R
0h
Reserved
R/W
2h
TDR shadow average location - For Segment #1, 3'h2 For Segment
#2, 3'h2 For Segment #3, 3'h2 For Segment #4, 3'h2 For Segment
#5, 3'h2
10-5
4
RESERVED
R
0h
0h
4h
Reserved
Reserved
RESERVED
R/W
R/W
3-0
cfg_tdr_fwd_shadow
Length of forward shadow for the segment configured (to avoid
shadow of a fault peak be seen as another fault peak) - For Segment
#1, 4'h4 For Segment #2, 4'h4 For Segment #3, 4'h5 For Segment
#4, 4'h8 For Segment #5, 4'hB
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9.5.1.40 TDR_176 Register (Offset = 176h) [Reset = 0005h]
TDR_176 Register is shown in 表9-61.
Return to the 表9-20.
表9-61. TDR_176 Register Field Descriptions
Bit
15-5
4-0
Field
Type
Reset
Description
RESERVED
R
0h
Reserved
cfg_tdr_p_loc_thresh_seg R/W
5h
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9.5.1.41 CDSCR4 Register (Offset = 177h) [Reset = 1E00h]
CDSCR4 Register is shown in 表9-62.
Return to the 表9-20.
表9-62. CDSCR4 Register Field Descriptions
Bit
15-13
12-8
7-0
Field
Type
R/W
R/W
R/W
Reset
Description
RESERVED
Short Cables Threshold
RESERVED
0h
Reserved
1Eh
0h
TH to compensate for strong reflections in short cables
Reserved
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9.5.1.42 TDR_178 Register (Offset = 178h) [Reset = 0002h]
TDR_178 Register is shown in 表9-63.
Return to the 表9-20.
表9-63. TDR_178 Register Field Descriptions
Bit
15-3
2-0
Field
Type
Reset
Description
RESERVED
R
0h
Reserved
cfg_tdr_tx_pulse_width_se R/W
g
2h
TDR TX Pulse width for Segment - For Segment #1, 3'h2 For
Segment #2, 3'h2 For Segment #3, 3'h2 For Segment #4, 3'h2 For
Segment #5, 3'h6
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9.5.1.43 CDLRR1 Register (Offset = 180h) [Reset = 0000h]
CDLRR1 Register is shown in 表9-64.
Return to the 表9-20.
表9-64. CDLRR1 Register Field Descriptions
Bit
15-8
7-0
Field
Type
Reset
Description
RESERVED
TD Peak Location 1
R
0h
Reserved
R
0h
Location of the First peak discovered by the TDR mechanism on
Transmit Channel (TD). The value of these bits need to be translated
into distance from the PHY.
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9.5.1.44 CDLRR2 Register (Offset = 181h) [Reset = 0000h]
CDLRR2 Register is shown in 表9-65.
Return to the 表9-20.
表9-65. CDLRR2 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
RESERVED
R
0h
Reserved
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9.5.1.45 CDLRR3 Register (Offset = 182h) [Reset = 0000h]
CDLRR3 Register is shown in 表9-66.
Return to the 表9-20.
表9-66. CDLRR3 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
RESERVED
R
0h
Reserved
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9.5.1.46 CDLRR4 Register (Offset = 183h) [Reset = 0000h]
CDLRR4 Register is shown in 表9-67.
Return to the 表9-20.
表9-67. CDLRR4 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
RESERVED
R
0h
Reserved
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9.5.1.47 CDLRR5 Register (Offset = 184h) [Reset = 0000h]
CDLRR5 Register is shown in 表9-68.
Return to the 表9-20.
表9-68. CDLRR5 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
RESERVED
R
0h
Reserved
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9.5.1.48 CDLAR1 Register (Offset = 185h) [Reset = 0000h]
CDLAR1 Register is shown in 表9-69.
Return to the 表9-20.
表9-69. CDLAR1 Register Field Descriptions
Bit
15-7
6-0
Field
Type
Reset
Description
RESERVED
TD Peak Amplitude 1
R
0h
Reserved
R
0h
Amplitude of the First peak discovered by the TDR mechanism on
Transmit Channel (TD). The value of these bits is translated into type
of cable fault and/or interference.
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9.5.1.49 CDLAR2 Register (Offset = 186h) [Reset = 0000h]
CDLAR2 Register is shown in 表9-70.
Return to the 表9-20.
表9-70. CDLAR2 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
RESERVED
R
0h
Reserved
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9.5.1.50 CDLAR3 Register (Offset = 187h) [Reset = 0000h]
CDLAR3 Register is shown in 表9-71.
Return to the 表9-20.
表9-71. CDLAR3 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
RESERVED
R
0h
Reserved
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9.5.1.51 CDLAR4 Register (Offset = 188h) [Reset = 0000h]
CDLAR4 Register is shown in 表9-72.
Return to the 表9-20.
表9-72. CDLAR4 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
RESERVED
R
0h
Reserved
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9.5.1.52 CDLAR5 Register (Offset = 189h) [Reset = 0000h]
CDLAR5 Register is shown in 表9-73.
Return to the 表9-20.
表9-73. CDLAR5 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
RESERVED
R
0h
Reserved
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9.5.1.53 CDLAR6 Register (Offset = 18Ah) [Reset = 0000h]
CDLAR6 Register is shown in 表9-74.
Return to the 表9-20.
表9-74. CDLAR6 Register Field Descriptions
Bit
15-12
11
Field
Type
Reset
Description
RESERVED
TD Peak Polarity 1
R
0h
Reserved
R
0h
Polarity of the First peak discovered by the TDR mechanism on
Transmit Channel (TD).
10-6
5
RESERVED
R
R
0h
0h
Reserved
Cross Detect on TD
Cross Reflections were detected on TD. Indicate on Short between
TD+ and TD-
4
3
RESERVED
RESERVED
RESERVED
RESERVED
R
R
R
R
0h
0h
0h
0h
Reserved
Reserved
Reserved
Reserved
2
1-0
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9.5.1.54 IO_CFG1 Register (Offset = 302h) [Reset = 0000h]
IO_CFG1 Register is shown in 表9-75.
Return to the 表9-20.
表9-75. IO_CFG1 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-14
MaC Impedance Control
R/W
0h
MAC Impedance Control: MAC interface impedance control sets the
series termination for the digital pins.
0h = Slow Mode
1h = Fast Mode
13
12-9
8
RESERVED
RESERVED
RESERVED
RESERVED
cfg_clkout25m_off
R/W
R/W
R/W
R/W
R/W
0h
0h
0h
0h
0h
Reserved
Reserved
Reserved
Reserved
7
6
For ENHANCED Mode only : Configure Clockout or LED1
0h = CLKOUT25 available
1h = LED1_GPIO is available
5-0
RESERVED
R
0h
Reserved
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9.5.1.55 LED0_GPIO_CFG Register (Offset = 303h) [Reset = 0008h]
LED0_GPIO_CFG is shown in 表9-76.
Return to the 表9-20.
表9-76. LED0_GPIO_CFG Register Field Descriptions
Bit
15-6
5-3
Field
Type
Reset
Description
RESERVED
cfg_led0_clk_sel
R
0h
Reserved
R/W
1h
Selects one of the internal clock, for output on LED0. This is enabled
when cfg_led0_gpio_ctrl[2:0] = 001b. The possible configurations
are:
0h = Reserved
1h = Reserved
2h = Reserved
3h = Reserved
4h = Reserved
5h = PLL Clock out
6h = Recovered Clock
7h = Reserved
2-0
cfg_led0_gpio_ctrl
R
0h
GPIO Configuration for LED0:
0h = LED0
1h = Clock output selected by register field cfg_led0_clk_sel
2h = WoL
3h = 0
4h = Interrupt
5h = 0
6h = 0
7h = 1
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9.5.1.56 LED1_GPIO_CFG Register (Offset = 304h) [Reset = 0008h]
LED1_GPIO_CFG is shown in 表9-77.
Return to the 表9-20.
表9-77. LED1_GPIO_CFG Register Field Descriptions
Bit
15-6
5-3
Field
Type
Reset
Description
RESERVED
cfg_led1_clk_sel
R
0h
Reserved
R/W
1h
Selects one of the internal clock, for output on LED1. This is enabled
when cfg_led1_gpio_ctrl[2:0] = 001b. The possible configurations
are:
0h = Reserved
1h = Reserved
2h = Reserved
3h = Reserved
4h = Reserved
5h = PLL Clock out
6h = Recovered Clock
7h = Reserved
2-0
cfg_led1_gpio_ctrl
R/W
0h
GPIO Configuration for LED1:
0h = LED1 (default in BASIC mode)
1h = Reserved
2h = WoL
3h = Reserved
4h = Interrupt
5h = TX_ER
6h = CLKOUT25M (default in ENHANCED Mode, selectable by
Strap)
7h = Reserved
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9.5.1.57 LED2_GPIO_CFG Register (Offset = 305h) [Reset = 0008h]
LED2_GPIO_CFG is shown in 表9-78.
Return to the 表9-20.
表9-78. LED2_GPIO_CFG Register Field Descriptions
Bit
15-6
5-3
Field
Type
Reset
Description
Reserved
Reserved
RESERVED
RESERVED
cfg_led2_gpio_ctrl
R
0h
R/W
R/W
1h
2-0
0h
GPIO Configuration for LED2:
0h = LED2
1h = Reserved
2h = WoL
3h = COL
4h = Interrupt
5h = COL
6h = COL
7h = High
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9.5.1.58 LED3_GPIO_CFG Register (Offset = 306h) [Reset = 0008h]
LED3_GPIO_CFG is shown in 表9-79.
Return to the 表9-20.
表9-79. LED3_GPIO_CFG Register Field Descriptions
Bit
15-6
5-3
Field
Type
Reset
Description
Reserved
Reserved
RESERVED
RESERVED
cfg_led3_gpio_ctrl
R
0h
R/W
R
1h
2-0
0h
GPIO Configuration for LED3:
0h = LED3
1h = Reserved
2h = WoL
3h = CRS
4h = Interrupt
5h = CRS
6h = CRS
7h = High
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9.5.1.59 CLK_OUT_LED_STATUS register Register (Offset = 308h) [Reset = 0002h]
CLK_OUT_LED_STATUS register is shown in 表9-80.
Return to the 表9-20.
表9-80. CLK_OUT_LED_STATUS register Register Field Descriptions
Bit
15-1
0
Field
Type
Reset
Description
RESERVED
R/W
1h
Reserved
cfg_clkout_25m_off_status R
0h
This bit is applicable in ENHANCED mode only
0h = CLKOUT25 available
1h = LED1_GPIO is available
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9.5.1.60 VOD_CFG1 Register (Offset = 30Bh) [Reset = 3C00h]
VOD_CFG1 Register is shown in 表9-81.
Return to the 表9-20.
表9-81. VOD_CFG1 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-14
13-12
RESERVED
R
0h
Reserved
cfg_dac_minus_one_val_ R/W
mdix_5_to_4
3h
LD data for mlt3 encoded data of minus one in MDIX mode. The 6 bit
data is split into two fields - {cfg_dac_minus_one_val_mdix_5_to_4,
cfg_dac_minus_one_val_mdix_3_to_0}
28h = 150%
29h = 143.75%
2Ah = 137.50%
2Bh = 131.25%
2Ch = 125%
2Dh = 118.75%
2Eh = 112.50%
2Fh = 106.25%
30h = 100%
31h = 93.75%
32h = 87.50%
33h = 81.25%
34h = 75%
35h = 68.75%
36h = 62.50%
37h = 56.25%
38h = 50%
11-6
cfg_dac_minus_one_val_ R/W
mdi
30h
LD data for mlt3 encoded data of minus one in MDI mode.
28h = 150%
29h = 143.75%
2Ah = 137.50%
2Bh = 131.25%
2Ch = 125%
2Dh = 118.75%
2Eh = 112.50%
2Fh = 106.25%
30h = 100%
31h = 93.75%
32h = 87.50%
33h = 81.25%
34h = 75%
35h = 68.75%
36h = 62.50%
37h = 56.25%
38h = 50%
5-0
cfg_dac_zero_val
R/W
0h
LD data for mlt3 encoded data of zero
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9.5.1.61 VOD_CFG2 Register (Offset = 30Ch) [Reset = 0410h]
VOD_CFG2 Register is shown in 表9-82.
Return to the 表9-20.
表9-82. VOD_CFG2 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-12
cfg_dac_minus_one_val_ R/W
mdix_3_to_0
0h
LD data for mlt3 encoded data of minus one in MDX mode. 6 bit data
is split into two fields - {cfg_dac_minus_one_val_mdix_5_to_4,
cfg_dac_minus_one_val_mdix_3_to_0}
28h = 150%
29h = 143.75%
2Ah = 137.50%
2Bh = 131.25%
2Ch = 125%
2Dh = 118.75%
2Eh = 112.50%
2Fh = 106.25%
30h = 100%
31h = 93.75%
32h = 87.50%
33h = 81.25%
34h = 75%
35h = 68.75%
36h = 62.50%
37h = 56.25%
38h = 50%
11-6
cfg_dac_plus_one_val_md R/W
ix
10h
LD data for mlt3 encoded data of plus one in MDIX mode
08h = 50%
09h = 56.25%
0Ah = 62.50%
0Bh = 68.75%
0Ch = 75%
0Dh = 81.25%
0Eh = 87.50%
0Fh = 93.75%
10h = 100%
11h = 106.25%
12h = 112.50%
13h = 118.75%
14h = 125%
15h = 131.25%
16h = 137.50%
17h = 143.75%
18h = 150%
5-0
cfg_dac_plus_one_val_md R/W
i
10h
LD data for mlt3 encoded data of plus one in MDI mode
08h = 50%
09h = 56.25%
0Ah = 62.50%
0Bh = 68.75%
0Ch = 75%
0Dh = 81.25%
0Eh = 87.50%
0Fh = 93.75%
10h = 100%
11h = 106.25%
12h = 112.50%
13h = 118.75%
14h = 125%
15h = 131.25%
16h = 137.50%
17h = 143.75%
18h = 150%
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9.5.1.62 VOD_CFG3 Register (Offset = 30Eh) [Reset = 0000h]
VOD_CFG3 Register is shown in 表9-83.
Return to the 表9-20.
表9-83. VOD_CFG3 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-12
ld_term_mdi_10M_reg
R/W
0h
10M mode, MDI Termination Value Register
0h = 122
1h = 119
2h = 116
3h = 113
4h = 110
5h = 107
6h = 105
7h = 102
8h = 100
9h = 98
Ah = 96
Bh = 94
Ch = 92
Dh = 90
Eh = 88
Fh = 86
11
ld_term_mdi_10M_en
ld_term_mdix_10M_reg
R/W
R/W
0h
0h
10M mode, MDI Termination Value Register Enable
0h = Disable
1h = Enable
10-7
10M mode, MDIX Termination Value Register
0h = 122
1h = 119
2h = 116
3h = 113
4h = 110
5h = 107
6h = 105
7h = 102
8h = 100
9h = 98
Ah = 96
Bh = 94
Ch = 92
Dh = 90
Eh = 88
Fh = 86
6
ld_term_mdix_10M_en
R/W
0h
10M mode, MDIX Termination Value Register Enable
0h = Disable
1h = Enable
5-2
1-0
RESERVED
RESERVED
R/W
R
0h
0h
Reserved
Reserved
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9.5.1.63 ANA_LD_PROG_SL Register (Offset = 404h) [Reset = 0080h]
ANA_LD_PROG_SL Register is shown in 表9-84.
Return to the 表9-20.
表9-84. ANA_LD_PROG_SL Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
RESERVED
R/W
80h
Reserved
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9.5.1.64 ANA_RX10BT_CTRL Register (Offset = 40Dh) [Reset = 0000h]
ANA_RX10BT_CTRL Register is shown in 表9-85.
Return to the 表9-20.
表9-85. ANA_RX10BT_CTRL Register Field Descriptions
Bit
15-5
4-0
Field
Type
R/W
R/W
Reset
Description
RESERVED
rx10bt_comp_sl
0h
Reserved
0h
10B-T current Gain, common for both POS and NEG, Starting from
200mV to 575mV, step size of 25mV
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9.5.1.65 GENCFG Register (Offset = 456h) [Reset = 0008h]
GENCFG Register is shown in 表9-86.
Return to the 表9-20.
表9-86. GENCFG Register Field Descriptions
Bit
15-4
3
Field
Type
R/W
R/W
Reset
Description
RESERVED
Min IPG Enable
0h
Reserved
1h
Min IPG Enable:
0h = Minimal IPG set to 200 ns
1h = Enable Minimum Interpacket Gap (IPG is set to 120ns instead
of 200ns)
2-0
RESERVED
R/W
0h
Reserved
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9.5.1.66 LEDCFG Register (Offset = 460h) [Reset = 5665h]
LEDCFG Register is shown in 表9-87.
Return to the 表9-20.
表9-87. LEDCFG Register Field Descriptions
Bit
Field
Type
Reset
Description
15-12
LED1 Control
R/W
5h
LED1 Control: Selects the source for LED1.
0h = LINK OK
1h = RX/TX Activity
2h = TX Activity
3h = RX Activity
4h = Collision
5h = Speed, High for 100BASE-TX
6h = Speed, High for 10BASE-T
7h = Full-Duplex
8h = LINK OK / BLINK on TX/RX Activity
9h = Active Stretch Signal
Ah = MII LINK (100BT+FD)
Bh = LPI Mode (Energy Efficient Ethernet)
Ch = TX/RX MII Error
Dh = Link Lost (remains on until register 0x0001 is read)
Eh = Blink for PRBS error (remains ON for single error, remains until
counter is cleared)
Fh = Reserved
11-8
LED2 Control
LED3 Control
RESERVED
R/W
R/W
R/W
6h
6h
5h
LED2 Control: Selects the source for LED2.
0h = LINK OK
1h = RX/TX Activity
2h = TX Activity
3h = RX Activity
4h = Collision
5h = Speed, High for 100BASE-TX
6h = Speed, High for 10BASE-T
7h = Full-Duplex
8h = LINK OK / BLINK on TX/RX Activity
9h = Active Stretch Signal
Ah = MII LINK (100BT+FD)
Bh = LPI Mode (Energy Efficient Ethernet)
Ch = TX/RX MII Error
Dh = Link Lost (remains on until register 0x0001 is read)
Eh = Blink for PRBS error (remains ON for single error, remains until
counter is cleared)
Fh = Reserved
7-4
LED3 Control:Selects the source for LED3.
0h = LINK OK
1h = RX/TX Activity
2h = TX Activity
3h = RX Activity
4h = Collision
5h = Speed, High for 100BASE-TX
6h = Speed, High for 10BASE-T
7h = Full-Duplex
8h = LINK OK / BLINK on TX/RX Activity
9h = Active Stretch Signal
Ah = MII LINK (100BT+FD)
Bh = LPI Mode (Energy Efficient Ethernet)
Ch = TX/RX MII Error
Dh = Link Lost (remains on until register 0x0001 is read)
Eh = Blink for PRBS error (remains ON for single error, remains until
counter is cleared)
Fh = Reserved
3-0
Reserved
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9.5.1.67 IOCTRL Register (Offset = 461h) [Reset = 0010h]
IOCTRL Register is shown in 表9-88.
Return to the 表9-20.
表9-88. IOCTRL Register Field Descriptions
Bit
15
Field
Type
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
Description
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
MAC Impedance Control
0h
14
0h
13-12
11
0h
0h
10-7
6-5
4-0
0h
0h
10h
Controls the Slew Rate of the IO. Only LSB is used.
10h = Fast
11h = Slow
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9.5.1.68 SOR1 Register (Offset = 467h) [Reset = 0000h]
SOR1 Register is shown in 表9-89.
Return to the 表9-20.
表9-89. SOR1 Register Field Descriptions
Bit
15
14
13
12
11
10
Field
Type
Reset
Description
Reserved
Reserved
Reserved
Reserved
Reserved
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
Strap10
R
0h
R
0h
R
0h
R
0h
R
0h
0h
Strap on pin#18
0h = active low,
1h = active high
9
8
7
6
5
4
3
2
1
0
Strap9
Strap8
Strap7
Strap6
Strap5
Strap4
Strap3
Strap2
Strap1
Strap0
0h
0h
0h
0h
0h
0h
0h
0h
0h
0h
Strap on pin#15
0h = active low,
1h = active high
Strap on pin#14
0h = active low,
1h = active high
Strap on pin#13
0h = active low,
1h = active high
Strap on pin#20
0h = active low,
1h = active high
Strap on pin#22
0h = active low,
1h = active high
Strap on pin#28
0h = active low,
1h = active high
Strap on pin#29
0h = active low,
1h = active high
Strap on pin#30
0h = active low,
1h = active high
Strap on pin#31
0h = active low,
1h = active high
Strap on pin#16
0h = active low,
1h = active high
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9.5.1.69 SOR2 Register (Offset = 468h) [Reset = 0287h]
SOR2 Register is shown in 表9-90.
Return to the 表9-20.
表9-90. SOR2 Register Field Descriptions
Bit
15
14
Field
Type
Reset
Description
RESERVED
XMII_ISOLATE_EN
R
0h
Reserved
0h
Applicable in BASIC Mode. Controls the MII Isolation bit field in
register BMCR[10]
0h = No Isolation
1h = MAC pins Isolated
13
12
RESERVED
R
0h
0h
Reserved
CRS_DV_vs_RX_DV
RMII mode RX_DV pin as CRS_DV or RX_DV
0h = RMI CRS_DV
1h = RMII RX_DV
11
10
9
RESERVED
RESERVED
RESERVED
CFG_FLD_EN
R
R
R
0h
0h
1h
0h
Reserved
Reserved
Reserved
8
Configures Fast Link Down Feature. This affects register CR3[3:0].
0h = CR3[10,3:0] is set to 5b00000
1h = CR3[10,3:0] is set to 5b11010
7
CFG_AMDIX
1h
AMDIX Enable. This captures the inversion of AMDIX_DIS strap
0h = AMDIX Disable
1h = AMDIX Enable
6
5
4
RESERVED
R
R
0h
0h
0h
Reserved
Reserved
RESERVED
CFG_RMII_MODE
MII/RMII mode Selection
0h = MII
1h = RMII
3
CFG_XI_50_SLAVE
0h
RMII Master / Slave mode Selection
0h = RMII Master Mode
1h = RMII Slave Mode
2
1
0
CFG_AN_1
CFG_AN_0
CFG_AN_EN
1h
1h
1h
This is to derive ANAR register bit [8:5]
This is to derive ANAR register bit [8:5]
ANEG Enable. This captures the inversion of ANEG_DIS
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9.5.1.70 LEDCFG2 Register (Offset = 469h) [Reset = 0440h]
LEDCFG2 Register is shown in 表9-91.
Return to the 表9-20.
表9-91. LEDCFG2 Register Field Descriptions
Bit
Field
Type
Reset
Description
Reserved
Reserved
Reserved
Reserved
Reserved
15-11
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
LED2_polarity
R
0h
10
9
R/W
R/W
R/W
R
1h
0h
8
0h
7
0h
6
R/W,STRAP 1h
led 2 polarity
0h = active low,
1h = active high
5
4
LED2_drv_val
LED2_drv_en
R/W
R/W
0h
0h
led 2 drive value
led 2 drive enable
0h = Normal operation
1h = drive LED polarity,
3
2
RESERVED
R
0h
Reserved
LED1_polarity
R/W,STRAP 0h
led 1 polarity
0h = active low,
1h = active high
1
0
LED1_drv_val
LED1_drv_en
R/W
R/W
0h
0h
led1 drive value
led 1 drive enable
0h = Normal operation
1h = drive LED polarity,
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9.5.1.71 RXFCFG1 Register (Offset = 4A0h) [Reset = 1081h]
RXFCFG1 Register is shown in 表9-92.
Return to the 表9-20.
表9-92. RXFCFG1 Register Field Descriptions
Bit
15-14
13
Field
Type
Reset
Description
Reserved
Reserved
RESERVED
RESERVED
CRC Gate
R
0h
R
0h
12
R/W
1h
CRC Gate: If Magic Packet has Bad CRC there will be no indication
(status, interrupt, GPIO) when enabled.
0h = Bad CRC does not gate Magic Packet or Pattern Indications
1h = Bad CRC gates Magic Packet and Pattern Indications
11
WoL Level Change
Indication Clear
W0C
R/W
0h
0h
WoL Level Change Indication Clear: If WoL Indication is set for Level
change mode, this bit clears the level upon a write.
0h = Clear
10-9
WoL Pulse Indication
Select
WoL Pulse Indication Select: Only valid when WoL Indication is set
for Pulse mode.
0h = 8 clock cycles (of 125MHz clock)
1h = 16 clock cycles
2h = 32 clock cycles
3h = 64 clock cycles
8
7
WoL Indication Select
WoL Enable
R/W
R/W
0h
1h
WoL Indication Select:
0h = Pulse mode
1h = Level change mode
WoL Enable:
0h = normal operation
1h = Enable Wake-on-LAN (WoL)
6
5
4
3
2
1
0
Bit Mask Flag
Secure-ON Enable
RESERVED
R/W
R/W
R
0h
0h
0h
0h
0h
0h
Bit Mask Flag
Enable Secure-ON password for Magic Packets
Reserved
RESERVED
R
Reserved
RESERVED
R
Reserved
RESERVED
R
Reserved
WoL Magic Packet Enable R/W,STRAP 1h
Enable Interrupt upon reception of Magic Packet
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9.5.1.72 RXFS Register (Offset = 4A1h) [Reset = 1000h]
RXFS Register is shown in 表9-93.
Return to the 表9-20.
表9-93. RXFS Register Field Descriptions
Bit
15-13
12
Field
Type
Reset
Description
RESERVED
WoL Interrupt Source
R
0h
Reserved
R/W
1h
WoL Interrupt Source: Source of Interrupt for bit [1] of register
0x0013. When enabling WoL, this bit is automatically set to WoL
Interrupt.
0h = Data Polarity Interrupt
1h = WoL Interrupt
11-8
7
RESERVED
SFD Error
R
H
0h
0h
Reserved
SFD Error:
0h = No SFD error
1h = Packet with SFD error (without the SFD byte indicated in bit [13]
register 0x04A0)
6
5
Bad CRC
H
H
0h
0h
Bad CRC:
0h = No bad CRC received
1h = Bad CRC was received
Secure-On Hack Flag
Secure-ON Hack Flag:
0h = Valid Secure-ON Password
1h = Invalid Password detected in Magic Packet
4
3
2
1
0
RESERVED
H
H
H
H
H
0h
0h
0h
0h
0h
Reserved
RESERVED
Reserved
RESERVED
Reserved
RESERVED
Reserved
WoL Magic Packet Status
WoL Magic Packet Status:
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9.5.1.73 RXFPMD1 Register (Offset = 4A2h) [Reset = 0000h]
RXFPMD1 Register is shown in 表9-94.
Return to the 表9-20.
表9-94. RXFPMD1 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-8
MAC Destination Address R/W
Byte 4
0h
Perfect Match Data: Configured for MAC Destination Address
7-0
MAC Destination Address R/W
Byte 5 (MSB)
0h
Perfect Match Data: Configured for MAC Destination Address
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9.5.1.74 RXFPMD2 Register (Offset = 4A3h) [Reset = 0000h]
RXFPMD2 Register is shown in 表9-95.
Return to the 表9-20.
表9-95. RXFPMD2 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-8
MAC Destination Address R/W
Byte 2
0h
Perfect Match Data: Configured for MAC Destination Address
Perfect Match Data: Configured for MAC Destination Address
7-0
MAC Destination Address R/W
Byte 3
0h
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9.5.1.75 RXFPMD3 Register (Offset = 4A4h) [Reset = 0000h]
RXFPMD3 Register is shown in 表9-96.
Return to the 表9-20.
表9-96. RXFPMD3 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-8
MAC Destination Address R/W
Byte 0
0h
Perfect Match Data: Configured for MAC Destination Address
7-0
MAC Destination Address R/W
Byte 1
0h
Perfect Match Data: Configured for MAC Destination Address
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9.5.1.76 RXFSOP1 Register (Offset = 4A5h) [Reset = 0000h]
RXFSOP1 Register is shown in 表9-97.
Return to the 表9-20.
May need to be added in 825 also after testing
表9-97. RXFSOP1 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-8
Secure-ON Password
Byte 1
R/W
0h
Secure-ON Password Select: Secure-ON password for Magic
Packets
7-0
Secure-ON Password
Byte 0
R/W
0h
Secure-ON Password Select: Secure-ON password for Magic
Packets
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9.5.1.77 RXFSOP2 Register (Offset = 4A6h) [Reset = 0000h]
RXFSOP2 Register is shown in 表9-98.
Return to the 表9-20.
May need to be added in 825 also after testing
表9-98. RXFSOP2 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-8
Secure-ON Password
Byte 3
R/W
0h
Secure-ON Password Select: Secure-ON password for Magic
Packets
7-0
Secure-ON Password
Byte 2
R/W
0h
Secure-ON Password Select: Secure-ON password for Magic
Packets
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9.5.1.78 RXFSOP3 Register (Offset = 4A7h) [Reset = 0000h]
RXFSOP3 Register is shown in 表9-99.
Return to the 表9-20.
May need to be added in 825 also after testing
表9-99. RXFSOP3 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-8
Secure-ON Password
Byte 5
R/W
0h
Secure-ON Password Select: Secure-ON password for Magic
Packets
7-0
Secure-ON Password
Byte 4
R/W
0h
Secure-ON Password Select: Secure-ON password for Magic
Packets
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10 Application and Implementation
备注
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
10.1 Application Information
The DP83826 is a single-port 10/100-Mbps Ethernet PHY. It supports connections to an Ethernet MAC through
MII and RMII. Connections to the Ethernet media are made via the IEEE 802.3 defined media-dependent
interface.
When using the device for Ethernet applications, it is necessary to meet certain requirements for normal
operation. The following subsections are intended to assist in appropriate component selection and required
circuit connections.
备注
For a step-by-step approach to using the DP83826 BASIC mode in existing systems that use a
common standard Ethernet pinout Refer to SNLA338
10.2 Typical Applications
Following figure shows a typical application for the DP83826.
VDDA3V3
VDDIO
10BASE-Te
100BASE-TX
DP83826
MII/RMII
MAC
10/100 Mbps
Ethernet PHY
RJ-45
25-MHz / 50-MHz
Clock Source
Status
LEDs
图10-1. Typical DP83826 Application
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10.2.1 Twisted-Pair Interface (TPI) Network Circuit
图 10-2 shows the recommended twisted-pair interface network circuit for 10 Mbps or 100 Mbps. Variations with
PCB and component characteristics require that the application be tested to verify that the circuit meets the
requirements of the intended application.
TD+
1:1
PHY
TD+
TD-
TD-
75
2 nF
RJ 45
RD+
RD+
RD-
75
2 nF
0.01μF
RD-
图10-2. TPI Network Circuit
10.2.2 Transformer Recommendations
The following magnetics have been tested using the DP83826.
表10-1. Recommended Transformers
MANUFACTURER
PART NUMBER
HX1198FNL
HX1188NL
Pulse electronics
HX1188FNL
表10-2. Transformer Electrical Specifications
PARAMETER
TEST CONDITIONS
TYP
1:1
UNIT
-
Turn ratio
±2%
1 - 100 MHz
1 - 30 MHz
30 - 60 MHz
60 - 80 MHz
1 - 50 MHz
50 - 150 MHz
30 MHz
dB
dB
dB
dB
dB
dB
dB
dB
Insertion loss
–1
–16
–12
–10
–30
–20
–35
–30
Return loss
Differential to common rejection ratio
Crosstalk
60 MHz
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表10-2. Transformer Electrical Specifications (continued)
PARAMETER
TEST CONDITIONS
TYP
UNIT
Isolation
HPOT
1500
Vrms
10.2.3 Capacitive DC Blocking
In order to meet the operational requirements of transformer-less network applications, the following design
showed in the schematic in 图10-3 should be used.
DC Blocking
Capacitors
TD+
PHY
TD+
33 nF
TD-
TD-
33 nF
RJ 45
RD+
RD+
RD-
33 nF
33 nF
RD-
图10-3. Transformerless DC Blocking Configuration
10.2.4 Design Requirements
The design requirements for the DP83826 in TPI operation (100BASE-TX or 10BASE-Te) are:
• VDDA3V3 supply = 3.3 V
• VDDIO supply = 3.3 V or 1.8 V
• Reference clock input = 25 MHz or 50 MHz (RMII slave)
10.2.4.1 Clock Requirements
The DP83826 supports an external CMOS-level oscillator source or an internal oscillator with an external crystal.
10.2.4.1.1 Oscillator
If an external clock source is used, tie XI to the clock source, and leave XO floating. The amplitude of the
oscillator clock must be a nominal voltage of VDDIO.
10.2.4.1.2 Crystal
The use of a 25-MHz, parallel resonant, 20-pF load crystal is recommended if operating with a crystal. See 图
10-4 for a typical connection diagram for a crystal resonator circuit. The load capacitor values vary with the
crystal vendors; check with the vendor for the recommended loads. Refer to the application report Selection and
specification of crystals for Texas Instruments ethernet physical layer transceivers for more details.
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XI
XO
R1
Crystal
CL1
CL2
图10-4. Crystal Oscillator Circuit
表10-3. 25-MHz Crystal Specification
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Frequency
25
MHz
Including operational temperature, aging and
other factors
Frequency tolerance
100
ppm
–100
Load capacitance
ESR
15
40
50
pF
Ω
10.2.5 Detailed Design Procedure
10.2.5.1 MII Layout Guidelines
1. MII signals are single-ended signals
2. Traces should be routed with 50-Ωimpedance to ground
3. Keep trace lengths as short as possible, less than two inches (~5 cm) is recommended and less than six
inches (~15 cm) maximum
10.2.5.2 RMII Layout Guidelines
• RMII signals are single-ended signals
• Traces should be routed with 50-Ωimpedance to ground
• Keep trace lengths as short as possible, less than two inches (~5 cm) is recommended and less than six
inches (~15 cm) maximum
10.2.5.3 MDI Layout Guidelines
• MDI signals are differential.
• Route traces with 50-Ωimpedance to ground and 100-Ωdifferential controlled impedance.
• Route MDI traces to the transformer on the same layer.
• Use a metal shielded RJ-45 connector and electrically connect the shield to chassis ground.
• Avoid supplies and ground beneath the magnetics.
• Do not overlap the circuit ground and chassis ground planes. Keep chassis ground and circuit ground
isolated by turning chassis ground into an isolated island by leaving a gap between the planes. Connecting a
1206 (size) capacitor between chassis ground and circuit ground is recommended to avoid floating metal.
Capacitors less than 805 (size) can create an arching path for ESD due to a small air-gap.
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10.2.6 Application Curves
图10-5 depicts the DP83826 output pin drive characteristics for I/O supply voltages of 1.8 V and 3.3 V.
图10-5. DP83826 Output Pin Drive Characteristics
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11 Power Supply Recommendations
The DP83826 is capable of operating with a 3.3-V or 1.8-V I/O supply voltage along with an analog supply of 3.3
V. If a 3.3-V I/O supply voltage is desired, the DP83826 can also operate on a single 3.3-V power rail. An internal
LDO generates all the power rails required for the device to operate. The single voltage supply simplifies the
design requirements, decreases the BOM cost and the overall solution size, making the DP83826 a viable
solution in a wide range of applications. The recommended power supply de-coupling network is shown below:
3.3-V or 1.8-V
Supply
Ferrite Bead for
improved EMC
(Optional)
VDDIO
100 nF
10 nF
1 ꢀF
10 ꢀF
Ferrite Bead for
improved EMC
(Optional)
3.3-V Supply
AVDD3V3
10 ꢀF 1 ꢀF
100 nF 10 nF
图11-1. Power Supply Decoupling Recommendation
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12 Layout
12.1 Layout Guidelines
Please see DP83826EVM.
12.1.1 Signal Traces
PCB traces are lossy and long traces can degrade signal quality. Keep all traces as short as possible. Unless
mentioned otherwise, all signal traces must be 50-Ωsingle-ended impedance. Differential traces must be 100-Ω
differential. Take care to ensure impedance is controlled throughout. Impedance discontinuities causes
reflections leading to emissions and signal integrity issues. Stubs should be avoided on all signal traces,
especially differential signal pairs.
图12-1. Differential Signal Traces
Within the differential pairs, trace lengths must be run parallel to each other and be matched in length. Matched
lengths minimize delay differences, avoiding an increase in common mode noise and emissions. Length
matching is also important for MAC interface connections. All MII and RMII transmit signal traces should be
length matched to each other and all MII and RMII receive signal traces should be length matched to each other.
Ideally, there should be no crossover or vias on signal path traces. Vias present impedance discontinuities and
should be minimized when possible. Route trace pairs on the same layer. Signals on different layers should not
cross each other without at least one return path plane between them. Differential pairs should always have a
constant coupling distance between them. For convenience and efficiency, TI recommends routing critical
signals first (that is, MDI differential pairs, reference clock, and MAC IF traces).
12.1.2 Return Path
A general best practice is to have a solid return path beneath all MDI signal traces. This return path can be a
continuous ground or DC power plane. Reducing the width of the return path can potentially affect the
impedance of the signal trace. This effect is more prominent when the width of the return path is comparable to
the width of the signal trace. Avoid breaks in return path between the signal traces at all cost. A signal crossing a
split plane may cause unpredictable return path currents and could impact signal quality and result in emissions
issues.
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图12-2. Differential Signal Pair and Plane Crossing
12.1.3 Transformer Layout
There must be no metal layer running beneath the transformer. Transformers can inject noise into metal beneath
them, which can affect the performance of the system. See 图10-2.
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12.1.4 Metal Pour
All metal pours that are not signals or power must be tied to ground. There must be no floating metal in the
system, and there must be no metal between differential traces.
12.1.5 PCB Layer Stacking
To meet signal integrity and performance requirements, a minimum four-layer PCB is recommended. However, a
six-layer PCB should be used when possible.
图12-3. Recommended Layer Stack-Up
12.1.5.1 Layout Example
See the DP83826EVM for more information regarding layout.
Transfo
rmer
( if not
integrat
ed in
Plan Coupling
Components
RJ-45
PHY
RJ-45)
System Power/ Ground Planes
Chasis Ground Plane
GND
GND
图12-4. Layout Example
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13 Device and Documentation Support
13.1 Related Documentation
For related documentation see the following:
Solving Cable Faults Challenges with TI Ethernet PHYs
Selection and specification of crystals for Texas Instruments ethernet physical layer transceivers
Chinese and English Definitions of Acronyms Related to Ethernet Products
13.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
13.3 Support Resources
13.4 Trademarks
Magic Packet™ is a trademark of Advanced Micro Devices, Inc..
EtherCAT® is a registered trademark of Beckhoff Automation GmbH, Germany.
所有商标均为其各自所有者的财产。
13.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
13.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
Copyright © 2022 Texas Instruments Incorporated
144 Submit Document Feedback
Product Folder Links: DP83826E DP83826I
DP83826E, DP83826I
ZHCSKM7F –DECEMBER 2019 –REVISED NOVEMBER 2022
www.ti.com.cn
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback 145
Product Folder Links: DP83826E DP83826I
PACKAGE OPTION ADDENDUM
www.ti.com
10-Apr-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DP83826ERHBR
DP83826ERHBT
DP83826IRHBR
DP83826IRHBT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VQFN
VQFN
VQFN
VQFN
RHB
RHB
RHB
RHB
32
32
32
32
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 105
-40 to 105
-40 to 85
-40 to 85
826E
826E
826I
826I
Samples
Samples
Samples
Samples
NIPDAU
NIPDAU
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Apr-2023
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DP83826ERHBR
DP83826ERHBT
DP83826IRHBR
DP83826IRHBT
VQFN
VQFN
VQFN
VQFN
RHB
RHB
RHB
RHB
32
32
32
32
3000
250
330.0
180.0
330.0
180.0
12.4
12.4
12.4
12.4
5.3
5.3
5.3
5.3
5.3
5.3
5.3
5.3
1.1
1.1
1.1
1.1
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
Q2
Q2
Q2
Q2
3000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DP83826ERHBR
DP83826ERHBT
DP83826IRHBR
DP83826IRHBT
VQFN
VQFN
VQFN
VQFN
RHB
RHB
RHB
RHB
32
32
32
32
3000
250
367.0
210.0
367.0
210.0
367.0
185.0
367.0
185.0
35.0
35.0
35.0
35.0
3000
250
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RHB 32
5 x 5, 0.5 mm pitch
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224745/A
www.ti.com
PACKAGE OUTLINE
VQFN - 1 mm max height
RHB0032M
PLASTIC QUAD FLATPACK-NO LEAD
A
5.1
4.9
B
5.1
4.9
PIN 1 INDEX AREA
C
1 MAX
SEATING PLANE
0.08 C
0.05
0.00
2X 3.5
(0.2) TYP
ꢀꢀꢀꢁꢂꢃꢄꢂꢃ
9
16
28X 0.5
8
17
SYMM
33
2X
3.5
1
24
0.3
0.2
32X
32
25
PIN 1 ID
(OPTIONAL)
SYMM
0.1
0.05
C A B
C
0.5
0.3
32X
4223725/A 08/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
VQFN - 1 mm max height
RHB0032M
PLASTIC QUAD FLATPACK-NO LEAD
(4.8)
2.1)
(
32
25
32X (0.6)
32X (0.25)
1
24
28X (0.5)
33
SYMM
(4.8)
2X
(0.8)
ꢅꢄꢂꢁꢆ
VIA TYP
8
17
(R0.05) TYP
9
16
2X (0.8)
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 15X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
SOLDER MASK
EXPOSED
METAL
OPENING
EXPOSED
METAL UNDER
SOLDER MASK
METAL
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4223725/A 08/2017
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
VQFN - 1 mm max height
RHB0032M
PLASTIC QUAD FLATPACK-NO LEAD
(4.8)
4X ( 0.94)
32
25
32X (0.6)
32X (0.25)
1
24
28X (0.5)
33
SYMM
(4.8)
2X
(0.57)
METAL
TYP
8
17
(R0.05) TYP
9
16
2X (0.57)
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
80% PRINTED COVERAGE BY AREA
SCALE: 15X
4223725/A 08/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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相关型号:
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IC 2 CHANNEL(S), 100M bps, LOCAL AREA NETWORK CONTROLLER, PQFP80, PLASTIC, QFP-80, Serial IO/Communication Controller
NSC
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