首页 |元器件品牌

DRV5032FADBZT [TI]

低功耗（5Hz、<1µA）、低电压（最高 5.5V）开关 | DBZ | 3 | -40 to 85;
DRV5032FADBZT
型号： DRV5032FADBZT
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

低功耗（5Hz、<1µA）、低电压（最高 5.5V）开关 | DBZ | 3 | -40 to 85

开关
文件： 总40页 (文件大小：1727K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
 查看货源
Support &  
Community  
Reference  
Design  
Product  
Folder  
Order  
Now  
Tools &  
Software  
Technical  
Documents  
DRV5032  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
DRV5032 Ultra-Low-Power Digital-Switch Hall Effect Sensor  
1 Features  
3 Description  
The DRV5032 device is an ultra-low-power digital-  
switch Hall effect sensor, designed for the most  
compact and battery-sensitive systems. The device is  
offered in multiple magnetic thresholds, sampling  
rates, output drivers, and packages to accommodate  
various applications.  
1
•
Industry-leading ultra-low power consumption  
–
–
5-Hz version: 0.54 µA with 1.8 V  
20-Hz versions: 1.6 µA with 3 V  
•
•
1.65-V to 5.5-V operating VCC range  
Magnetic threshold options (maximum BOP):  
When the applied magnetic flux density exceeds the  
BOP threshold, the device outputs a low voltage. The  
output stays low until the flux density decreases to  
less than BRP, and then the output either drives a  
high voltage or becomes high impedance, depending  
on the device version. By incorporating an internal  
oscillator, the device samples the magnetic field and  
updates the output at a rate of 20 Hz, or 5 Hz for the  
lowest current consumption. Omnipolar and unipolar  
magnetic responses are available.  
–
–
–
–
3.9 mT, highest sensitivity  
4.8 mT, high sensitivity  
9.5 mT, medium sensitivity  
63 mT, lowest sensitivity  
•
•
•
•
•
Omnipolar and unipolar options  
20-Hz and 5-Hz sampling rate options  
Open-drain and push-pull output options  
SOT-23, X2SON and TO-92 package options  
–40°C to +85°C operating temperature range  
The device operates from a VCC range of 1.65 V to  
5.5 V, and is packaged in a standard SOT-23, TO-92  
and small X2SON.  
2 Applications  
Device Information(1)  
•
•
•
•
•
•
•
Battery-critical position sensing  
Electricity meter tamper detection  
Cell Phone, laptop, or tablet case sensing  
E-locks, smoke detectors, appliances  
Medical devices, IoT systems  
PART NUMBER  
PACKAGE  
BODY SIZE (NOM)  
2.92 mm × 1.30 mm  
1.10 mm × 1.40 mm  
4.00 mm × 3.15 mm  
SOT-23 (3)  
DRV5032  
X2SON (4)  
TO-92 (3)  
Valve or solenoid position detection  
Contactless diagnostics or activation  
(1) For all available packages, see the orderable addendum at  
the end of the data sheet.  
Current Consumption of 5-Hz Version  
Typical Schematic  
1.4  
distance  
VCC  
1.2  
1
DRV5032  
VCC  
Controller  
N
S
OUT  
GND  
GPIO  
0.8  
0.6  
0.4  
Copyright © 2017, Texas Instruments Incorporated  
1.65 V  
3 V  
5.5 V  
0.2  
0
-40  
-10  
20  
Temperature (èC)  
50  
80  
D011  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 
 
 
 
 
DRV5032  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
www.ti.com  
Table of Contents  
8.4 Device Functional Modes........................................ 16  
Application and Implementation ........................ 17  
9.1 Application Information............................................ 17  
9.2 Typical Applications ............................................... 17  
9.3 Do's and Don'ts....................................................... 21  
1
2
3
4
5
6
7
Features.................................................................. 1  
Applications ........................................................... 1  
Description ............................................................. 1  
Revision History..................................................... 2  
Device Comparison Table..................................... 3  
Pin Configuration and Functions......................... 4  
Specifications......................................................... 6  
7.1 Absolute Maximum Ratings ...................................... 6  
7.2 ESD Ratings ............................................................ 6  
7.3 Recommended Operating Conditions....................... 6  
7.4 Thermal Information.................................................. 6  
7.5 Electrical Characteristics........................................... 7  
7.6 Magnetic Characteristics........................................... 8  
7.7 Typical Characteristics.............................................. 9  
Detailed Description ............................................ 12  
8.1 Overview ................................................................. 12  
8.2 Functional Block Diagram ....................................... 12  
8.3 Feature Description................................................. 13  
9
10 Power Supply Recommendations ..................... 22  
11 Layout................................................................... 22  
11.1 Layout Guidelines ................................................. 22  
11.2 Layout Examples................................................... 22  
12 Device and Documentation Support ................. 23  
12.1 Documentation Support ........................................ 23  
12.2 Receiving Notification of Documentation Updates 23  
12.3 Support Resources ............................................... 23  
12.4 Trademarks........................................................... 23  
12.5 Electrostatic Discharge Caution............................ 23  
12.6 Glossary................................................................ 23  
8
13 Mechanical, Packaging, and Orderable  
Information ........................................................... 23  
4 Revision History  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Revision D (November 2017) to Revision E  
Page  
•
•
•
Added LPG (TO-92) package ................................................................................................................................................ 1  
Added notes for the DU and FD package magnetic threshold operate points in the Magnetic Characteristics table .......... 8  
Added probability density function plots for BOP, BRP, and BHYS to the Typical Characteristics section............................... 10  
Changes from Revision C (September 2017) to Revision D  
Page  
•
Added the DU device version to the data sheet .................................................................................................................... 3  
Changes from Revision B (August 2017) to Revision C  
Page  
•
Changed the status of the AJ device version from Preview to Active ................................................................................... 3  
Changes from Revision A (May 2017) to Revision B  
Page  
•
Added the ZE device version and the preview AJ device version ......................................................................................... 3  
Changes from Original (April 2017) to Revision A  
Page  
•
Added the FA and FD device versions................................................................................................................................... 1  
2
Submit Documentation Feedback  
Copyright © 2017–2020, Texas Instruments Incorporated  
Product Folder Links: DRV5032  
 
DRV5032  
www.ti.com  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
5 Device Comparison Table  
MAXIMUM  
VERSION  
MAGNETIC  
RESPONSE  
OUTPUT  
TYPE  
SAMPLING  
RATE  
PACKAGES  
AVAILABLE  
THRESHOLD  
DRV5032DU  
DRV5032FA  
DRV5032FB  
DRV5032FC  
DRV5032FD  
DRV5032AJ  
DRV5032ZE  
3.9 mT  
Unipolar  
Omnipolar  
Omnipolar  
Omnipolar  
Unipolar  
Push-pull  
Push-pull  
Push-pull  
Open-drain  
Push-pull  
Open-drain  
Open-drain  
20 Hz  
20 Hz  
5 Hz  
SOT-23, X2SON, TO-92  
SOT-23, X2SON, TO-92  
SOT-23, TO-92  
4.8 mT  
20 Hz  
20 Hz  
20 Hz  
20 Hz  
SOT-23, TO-92  
X2SON, TO-92  
9.5 mT  
63 mT  
Omnipolar  
Omnipolar  
SOT-23, X2SON, TO-92  
SOT-23, TO-92  
Copyright © 2017–2020, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Links: DRV5032  
DRV5032  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
www.ti.com  
6 Pin Configuration and Functions  
FA, FB, FC, AJ, ZE Versions DBZ Package  
DU Version DBZ Package  
3-Pin SOT-23  
3-Pin SOT-23  
Top View  
Top View  
VCC  
1
VCC  
1
3
2
3
GND  
GND  
OUT  
2
OUT2  
FA, AJ Versions DMR Package  
4-Pin X2SON  
DU, FD Versions DMR Package  
4-Pin X2SON  
Top View  
Top View  
VCC  
1
OUT  
4
VCC OUT1  
1
4
Thermal  
Pad  
Thermal  
Pad  
2
3
2
3
GND  
NC  
GND OUT2  
FA, FB, FC, AJ, ZE Versions LPG Package  
DU, FD Versions LPG Package  
3-Pin TO-92  
3-Pin TO-92  
Top View  
Top View  
3
2
1
OUT  
GND  
VCC  
3
2
1
OUT2  
GND  
VCC  
4
Submit Documentation Feedback  
Copyright © 2017–2020, Texas Instruments Incorporated  
Product Folder Links: DRV5032  
DRV5032  
www.ti.com  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
Pin Functions  
PIN  
TO-92  
(FA, FB,  
FC, AJ,  
ZE)  
SOT-23  
(FA, FB,  
FC, AJ, ZE)  
I/O  
DESCRIPTION  
SOT-23  
(DU)  
TO-92  
(DU, FD)  
X2SON  
(FA, AJ) (DU, FD)  
X2SON  
NAME  
GND  
OUT  
3
2
3
2
3
2
2
4
2
—
O
Ground reference  
—
—
—
Omnipolar output that responds to north and south magnetic poles  
Unipolar output that responds to north magnetic poles near the top  
of the package  
OUT1  
OUT2  
—
—
—
2
—
—
—
3
—
—
4
3
O
O
Unipolar output that responds to south magnetic poles near the  
top of the package  
No-connect. This pin is not connected to the silicon. It should be  
left floating or tied to ground. It should be soldered to the board for  
mechanical support.  
NC  
—
—
—
—
3
—
—
1.65-V to 5.5-V power supply. TI recommends connecting this pin  
to a ceramic capacitor to ground with a value of at least 0.1 µF.  
VCC  
1
1
1
1
1
1
—
—
Therma  
l Pad  
No-connect. This pin should be left floating or tied to ground. It  
should be soldered to the board for mechanical support.  
—
—
—
—
PAD  
PAD  
Copyright © 2017–2020, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Links: DRV5032  
DRV5032  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
www.ti.com  
7 Specifications  
7.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)(1)  
MIN  
MAX  
UNIT  
V
Power supply voltage  
Power supply voltage slew rate  
Output voltage  
VCC  
–0.3  
5.5  
VCC  
Unlimited  
Unlimited  
V / µs  
V
OUT, OUT1, OUT2  
OUT, OUT1, OUT2  
–0.3  
–5  
VCC + 0.3  
5
Output current  
mA  
T
Magnetic flux density, BMAX  
Junction temperature, TJ  
Storage temperature, Tstg  
105  
150  
°C  
–65  
°C  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
7.2 ESD Ratings  
VALUE  
UNIT  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
±6000  
V(ESD)  
Electrostatic discharge  
V
Charged-device model (CDM), per JEDEC specification  
JESD22-C101(2)  
±750  
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
7.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
1.65  
0
MAX  
5.5  
5.5  
5
UNIT  
V
VCC  
VO  
IO  
Power supply voltage  
Output voltage  
V
Output current  
–5  
mA  
°C  
TA  
Operating ambient temperature  
–40  
85  
7.4 Thermal Information  
DRV5032  
THERMAL METRIC(1)  
DBZ (SOT-23)  
3 PINS  
DMR (X2SON)  
4 PINS  
LPG (TO-92)  
3 PINS  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
356  
159  
183.1  
°C/W  
°C/W  
RθJC(to  
p)  
128  
77  
74.2  
RθJB  
Junction-to-board thermal resistance  
94  
11.4  
92  
102  
0.9  
158.8  
15.2  
°C/W  
°C/W  
°C/W  
ψJT  
ψJB  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
100  
158.8  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report.  
6
Submit Documentation Feedback  
Copyright © 2017–2020, Texas Instruments Incorporated  
Product Folder Links: DRV5032  
 
DRV5032  
www.ti.com  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
7.5 Electrical Characteristics  
for VCC = 1.65 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
PUSH-PULL OUTPUT DRIVER  
VOH  
VOL  
High-level output voltage  
Low-level output voltage  
IOUT = –1 mA  
VCC – 0.35 VCC – 0.1  
0.1  
V
V
IOUT = 1 mA  
0.3  
OPEN-DRAIN OUTPUT  
High impedance output leakage  
current  
IOZ  
VCC = 5.5 V, OUT = 5.5 V  
IOUT = 1 mA  
5
100  
0.3  
nA  
V
VOL  
Low-level output voltage  
0.1  
DU, FA, FC, FD, AJ, ZE VERSIONS  
fS  
tS  
Frequency of magnetic sampling  
13.3  
27  
20  
50  
37  
75  
Hz  
ms  
Period of magnetic sampling  
Average current consumption  
VCC = 1.8 V  
VCC = 3 V  
VCC = 5 V  
1.3  
1.6  
2.3  
ICC(AVG)  
3.5  
µA  
FB VERSION  
fS  
tS  
Frequency of magnetic sampling  
3.5  
5
200  
8.5  
Hz  
ms  
Period of magnetic sampling  
Average current consumption  
117  
286  
VCC = 1.8 V  
VCC = 3 V  
VCC = 5 V  
0.54  
0.69  
1.06  
ICC(AVG)  
1.8  
µA  
ALL VERSIONS  
ICC(PK) Peak current consumption  
tON  
2
55  
40  
2.7  
mA  
µs  
Power-on time (see Figure 20)  
100  
tACTIVE  
Active time period (see Figure 20)  
µs  
Copyright © 2017–2020, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Links: DRV5032  
DRV5032  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
www.ti.com  
7.6 Magnetic Characteristics  
for VCC = 1.65 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)(1)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
DU VERSION  
OUT1 pin (north)(2)  
–3.9  
1.2  
–2.5  
2.5  
–1.2  
3.9  
BOP  
Magnetic threshold operate point  
Magnetic threshold release point  
mT  
OUT2 pin (south)  
OUT1 pin (north)(2)  
OUT2 pin (south)  
Each output  
–3.5  
0.9  
–1.8  
1.8  
–0.9  
3.5  
BRP  
mT  
mT  
BHYS  
Magnetic hysteresis: |BOP – BRP  
|
0.1  
0.7  
1.9  
FA, FB, FC VERSIONS  
BOP  
BRP  
Magnetic threshold operate point  
Magnetic threshold release point  
±1.5  
±0.5  
0.8  
±3  
±1.5  
1.5  
±4.8  
±3  
3
mT  
mT  
mT  
BHYS  
Magnetic hysteresis: |BOP – BRP|  
FD VERSION  
OUT1 pin (north)(2)  
OUT2 pin (south)  
OUT1 pin (north)(2)  
OUT2 pin (south)  
Each output  
–4.8  
1.5  
–3  
–3  
3
–1.5  
4.8  
–0.5  
3
BOP  
Magnetic threshold operate point  
Magnetic threshold release point  
mT  
–1.5  
1.5  
1.5  
BRP  
mT  
mT  
0.5  
0.8  
BHYS  
Magnetic hysteresis: |BOP – BRP  
|
3
AJ VERSION  
BOP  
BRP  
Magnetic threshold operate point  
Magnetic threshold release point  
±4  
±3  
±7  
±5.6  
1.4  
±9.5  
±7.5  
3
mT  
mT  
mT  
BHYS  
Magnetic hysteresis: |BOP – BRP  
|
0.5  
ZE VERSION  
BOP  
BRP  
Magnetic threshold operate point  
Magnetic threshold release point  
±33  
±30  
1.2  
±47  
±43  
4
±63  
±58  
8.5  
mT  
mT  
mT  
BHYS  
Magnetic hysteresis: |BOP – BRP|  
(1) For a graphical description of magnetic thresholds, see the Magnetic Response section.  
(2) X2SON package only.  
8
Submit Documentation Feedback  
Copyright © 2017–2020, Texas Instruments Incorporated  
Product Folder Links: DRV5032  
DRV5032  
www.ti.com  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
7.7 Typical Characteristics  
1.4  
1.2  
1
3
2.5  
2
0.8  
0.6  
0.4  
0.2  
0
1.5  
1
1.65 V  
3 V  
5.5 V  
1.65 V  
3 V  
5.5 V  
0.5  
0
-40  
-10  
20  
Temperature (èC)  
50  
80  
-40  
-10  
20  
Temperature (èC)  
50  
80  
D016  
D011  
Figure 1. ICC(AVG) vs Temperature (20-Hz versions)  
Figure 2. ICC(AVG) vs Temperature (5-Hz version)  
8
7
6
5
4
3
2
6
5
4
3
2
1
FA, FB, FC, FD Versions  
AJ Version  
DU Version  
FA, FB, FC, FD Versions  
AJ Version  
DU Version  
-40  
-20  
0
20 40  
Temperature (°C)  
60  
80  
100  
-40  
-20  
0
20 40  
Temperature (°C)  
60  
80  
100  
D023  
D025  
Figure 3. |BOP| vs Temperature  
Figure 4. |BRP| vs Temperature  
8
7
6
5
4
3
2
6
5
4
3
2
1
FA, FB, FC, FD Versions  
AJ Version  
DU Version  
FA, FB, FC, FD Versions  
AJ Version  
DU Version  
1.5  
2.5  
3.5  
Supply Voltage (V)  
4.5  
5.5  
1.5  
2.5  
3.5  
Supply Voltage (V)  
4.5  
5.5  
D022  
D024  
Figure 5. |BOP| vs VCC  
Figure 6. |BRP| vs VCC  
Copyright © 2017–2020, Texas Instruments Incorporated  
Submit Documentation Feedback  
9
Product Folder Links: DRV5032  
DRV5032  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
www.ti.com  
Typical Characteristics (continued)  
60  
60  
55  
50  
45  
40  
35  
30  
55  
50  
45  
40  
35  
30  
-40  
-10  
20  
Temperature (°C)  
50  
80  
-40  
-10  
20  
Temperature (°C)  
50  
80  
D020  
D021  
Figure 7. ZE Version |BOP| vs Temperature  
Figure 8. ZE Version |BRP| vs Temperature  
50  
45  
44  
43  
42  
41  
40  
49  
48  
47  
46  
45  
1.5  
2.5  
3.5  
Supply Voltage (V)  
4.5  
5.5  
1.5  
2.5  
3.5  
Supply Voltage (V)  
4.5  
5.5  
D018  
D019  
Figure 9. ZE Version |BOP| vs VCC  
Figure 10. ZE Version |BRP| vs VCC  
2
1.5  
1
2
1.5  
1
0.5  
0
0.5  
0
4
5
6
Magnetic Threshold Operate Point (mT)  
7
8
9
9.5  
3
4
5
Magnetic Threshold Release Point (mT)  
6
7
7.5  
D102  
D103  
TA = 25°C, VCC = 1.65 V to 5.5 V  
TA = 25°C, VCC = 1.65 V to 5.5 V  
Figure 11. AJ Version BOP Probability Density Function  
Figure 12. AJ Version BRP Probability Density Function  
10  
Submit Documentation Feedback  
Copyright © 2017–2020, Texas Instruments Incorporated  
Product Folder Links: DRV5032  
DRV5032  
www.ti.com  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
Typical Characteristics (continued)  
5
4
3
2
1
0
0.5  
1
1.5 2  
Magnetic Hysteresis (mT)  
2.5  
3
D101  
TA = 25°C, VCC = 1.65 V to 5.5 V  
Figure 13. AJ Version BHYS Probability Density Function  
Copyright © 2017–2020, Texas Instruments Incorporated  
Submit Documentation Feedback  
11  
Product Folder Links: DRV5032  
DRV5032  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
www.ti.com  
8 Detailed Description  
8.1 Overview  
The DRV5032 device is a magnetic sensor with a digital output that indicates when the magnetic flux density  
threshold has been crossed. The device integrates a Hall effect element, analog signal conditioning, and a low-  
frequency oscillator that enables ultra-low average power consumption. By operating from a 1.65-V to 5.5-V  
supply, the device periodically measures magnetic flux density, updates the output, and enters a low-power sleep  
state.  
8.2 Functional Block Diagram  
0.1 ꢀF  
(min)  
VCC  
(1)  
VCC  
Ultra-low-power  
Voltage  
Oscillator  
Regulator  
OUT/OUT1  
Output  
Control  
REF  
(1)  
Element Bias  
VCC  
Offset  
Amp  
Cancellation  
OUT2  
Temperature  
Compensation  
(1) Output type depends on device version  
GND  
Copyright © 2017, Texas Instruments Incorporated  
12  
Submit Documentation Feedback  
Copyright © 2017–2020, Texas Instruments Incorporated  
Product Folder Links: DRV5032  
DRV5032  
www.ti.com  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
8.3 Feature Description  
8.3.1 Magnetic Flux Direction  
The DRV5032 device is sensitive to the magnetic field component that is perpendicular to the top of the package  
(as shown in Figure 14).  
TO-92  
B
B
B
SOT-23  
X2SON  
PCB  
Figure 14. Direction of Sensitivity  
The magnetic flux that travels from the bottom to the top of the package is considered positive in this data sheet.  
This condition exists when a south magnetic pole is near the top of the package. The magnetic flux that travels  
from the top to the bottom of the package results in negative millitesla values.  
positive B  
negative B  
N
S
S
N
PCB  
PCB  
Figure 15. Flux Direction Polarity  
Copyright © 2017–2020, Texas Instruments Incorporated  
Submit Documentation Feedback  
13  
Product Folder Links: DRV5032  
 
DRV5032  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
www.ti.com  
Feature Description (continued)  
8.3.2 Device Version Comparison  
The following table lists the available device versions.  
MAXIMUM  
THRESHOLD  
MAGNETIC  
RESPONSE  
OUTPUT  
TYPE  
SAMPLING  
RATE  
PACKAGES  
VERSION  
AVAILABLE  
SOT-23, X2SON, TO-92  
SOT-23, X2SON, TO-92  
SOT-23, TO-92  
DRV5032DU  
DRV5032FA  
DRV5032FB  
DRV5032FC  
DRV5032FD  
DRV5032AJ  
DRV5032ZE  
3.9 mT  
Unipolar  
Omnipolar  
Omnipolar  
Omnipolar  
Unipolar  
Push-pull  
Push-pull  
Push-pull  
Open-drain  
Push-pull  
Open-drain  
Open-drain  
20 Hz  
20 Hz  
5 Hz  
4.8 mT  
20 Hz  
20 Hz  
20 Hz  
20 Hz  
SOT-23, TO-92  
X2SON, TO-92  
9.5 mT  
63 mT  
Omnipolar  
Omnipolar  
SOT-23, X2SON, TO-92  
SOT-23, TO-92  
8.3.2.1 Magnetic Threshold  
Devices that have a lower magnetic threshold detect magnets at a farther distance. Higher thresholds generally  
require a closer distance or larger magnet.  
8.3.2.2 Magnetic Response  
The FA, FB, FC, AJ, and ZE device versions have omnipolar functionality, and these versions all respond to the  
north and south poles the same way as shown in Figure 16.  
OUT  
BHYS  
BHYS  
VCC  
0V  
0 mT  
B
BOP BRP  
BRP BOP  
north  
south  
Figure 16. Omnipolar Functionality  
The DU and FD device versions have unipolar functionality. Pin OUT1 only responds to flux in the top-down  
direction (north), and pin OUT2 only responds to flux in the bottom-up direction (south).  
OUT1  
OUT2  
BHYS  
BHYS  
VCC  
VCC  
0V  
0 mT  
0V  
0 mT  
B
B
BOP BRP  
BRP BOP  
north  
south  
north  
south  
Figure 17. Unipolar Functionality  
14  
Submit Documentation Feedback  
Copyright © 2017–2020, Texas Instruments Incorporated  
Product Folder Links: DRV5032  
 
DRV5032  
www.ti.com  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
8.3.2.3 Output Type  
The DU, FA, FB, and FD device versions have push-pull CMOS outputs that can drive a VCC or ground level.  
The FC, AJ, and ZE device versions have open-drain outputs that can become high impedance or drive ground.  
For these versions, an external pullup resistor must be used.  
VCC  
Output  
Output  
Control  
Output  
Output  
Control  
Figure 18. Push-Pull Output (Simplified)  
Figure 19. Open-Drain Output (Simplified)  
8.3.2.4 Sampling Rate  
When the DRV5032 device powers up, it measures the first magnetic sample and sets the output within the tON  
time. The output is latched, and the device enters an ultra-low-power sleep state. After each tS time, the device  
measures a new sample and updates the output, if necessary. If the magnetic field does not change between  
periods, the output does not change.  
VCC  
1.65 V  
tON  
time  
tACTIVE  
tS  
tS  
ICC  
ICC(PK)  
time  
Output  
VCC  
2nd sample  
3rd sample  
Invalid  
1st sample  
GND  
time  
Figure 20. Timing Diagram  
Copyright © 2017–2020, Texas Instruments Incorporated  
Submit Documentation Feedback  
15  
Product Folder Links: DRV5032  
DRV5032  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
www.ti.com  
8.3.3 Hall Element Location  
The sensing element inside the device is in the center of both packages when viewed from the top. Figure 21  
shows the tolerances and side-view dimensions.  
SOT-23  
Top View  
SOT-23  
Side View  
centered  
650 µm  
70 µm  
80 µm  
X2SON  
Top View  
X2SON  
Side View  
centered  
60 µm  
250 µm  
50 µm  
TO-92  
Top View  
2 mm  
2 mm  
TO-92  
Side View  
1.54 mm  
1.61 mm  
±50 µm  
1030 µm  
115 µm  
Figure 21. Hall Element Location  
8.4 Device Functional Modes  
The DRV5032 device has one mode of operation that applies when the Recommended Operating Conditions are  
met.  
16  
Submit Documentation Feedback  
Copyright © 2017–2020, Texas Instruments Incorporated  
Product Folder Links: DRV5032  
 
DRV5032  
www.ti.com  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
9 Application and Implementation  
NOTE  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
9.1 Application Information  
The DRV5032 device is typically used to detect the proximity of a magnet. The magnet is often attached to a  
movable component in the system.  
9.1.1 Output Type Tradeoffs  
The push-pull output allows for the lowest system power consumption because there is no current leakage path  
when the output drives high or low. The open-drain output involves a leakage path through the external pullup  
resistor when the output drives low.  
The open-drain outputs of multiple devices can be tied together to form a logical AND. In this setup, if any sensor  
drives low, the voltage on the shared node becomes low. This can allow a single GPIO to measure an array of  
sensors.  
9.2 Typical Applications  
9.2.1 General-Purpose Magnet Sensing  
distance  
VCC  
DRV5032  
VCC  
Controller  
GPIO  
N
S
OUT  
GND  
Copyright © 2017, Texas Instruments Incorporated  
Figure 22. Typical Application Diagram  
9.2.1.1 Design Requirements  
For this design example, use the parameters listed in Table 1.  
Table 1. Design Parameters  
DESIGN PARAMETER  
VCC  
EXAMPLE VALUE  
3.3 V  
Magnet  
1-cm Cube NdFeB  
2.5 cm  
Closest magnet distance  
Magnetic flux density at closest distance  
Magnetic flux density when magnet moves away  
7.8 mT  
Close to 0 mT  
Copyright © 2017–2020, Texas Instruments Incorporated  
Submit Documentation Feedback  
17  
Product Folder Links: DRV5032  
 
DRV5032  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
www.ti.com  
9.2.1.2 Detailed Design Procedure  
When designing a digital-switch magnetic sensing system, the user should consider these three variables: the  
magnet, sensing distance, and threshold of the sensor.  
The DRV5032 device has a detection threshold specified by parameter BOP. To reliably activate the sensor, the  
magnet must apply greater than the maximum specified BOP. In such a system, the sensor typically detects the  
magnet before it has moved to the closest position. When the magnet moves away from the sensor, it must apply  
less than the minimum specified BRP to reliably release the sensor.  
Magnets are made from various ferromagnetic materials that have trade-offs in cost, drift with temperature,  
absolute max temperature ratings, remanence or residual induction (Br), and coercivity (Hc). The Br and the  
dimensions of a magnet determine the magnetic flux density (B) it produces in 3-dimensional space. For simple  
magnet shapes, such as rectangular blocks and cylinders, there are simple equations that solve B at a given  
distance centered with the magnet.  
Thickness  
Thickness  
Width  
Distance  
Distance  
Diameter  
S
N
Length  
S
N
B
B
Figure 23. Rectangular Block and Cylinder Magnets  
Use Equation 1 for the rectangular block shown in Figure 23:  
Br  
Œ ( (  
WL  
2D 4D2 + W2 + L2  
WL  
2(D + T) 4(D + T)2 + W2 + L2  
B =  
arctan  
œ arctan  
) (  
))  
(1)  
Use Equation 2 for the cylinder shown in Figure 23:  
Br  
2
D + T  
(0.5C)2 + (D + T)2  
D
B =  
œ
(
)
(0.5C)2 + D2  
where  
•
•
•
•
•
W is width.  
L is length.  
T is thickness (the direction of magnetization).  
D is distance.  
C is diameter.  
(2)  
An online tool that uses these formulas is located at http://www.ti.com/product/drv5033.  
All magnetic materials generally have a lower Br at higher temperatures. Systems should have margin to account  
for this, as well as for mechanical tolerances.  
18  
Submit Documentation Feedback  
Copyright © 2017–2020, Texas Instruments Incorporated  
Product Folder Links: DRV5032  
 
 
 
DRV5032  
www.ti.com  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
9.2.1.3 Application Curve  
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
0
1
1.5  
2
2.5  
3
Distance (cm)  
3.5  
4
4.5  
5
D017  
Figure 24. Magnetic Profile of a 1-cm Cube NdFeB Magnet  
9.2.2 Three-Position Switch  
This application uses the DRV5032FD for a three-position switch.  
1
2
3
PCB  
Figure 25. Three-Position Slider Switch With Embedded Magnet  
9.2.2.1 Design Requirements  
For this design example, use the parameters listed in Table 2.  
Table 2. Design Parameters  
DESIGN PARAMETER  
Hall effect device  
VCC  
EXAMPLE VALUE  
DRV5032FD  
5 V  
Switch travel distance  
Magnet  
5 mm in each direction  
10-mm cylinder  
±0.5 mm  
Mechanical tolerance per position  
9.2.2.2 Detailed Design Procedure  
A standard 2-pole magnet produces strong perpendicular flux components near the outer edges of the poles, and  
no perpendicular flux near the center at the north-south pole boundary. When the DRV5032FD is below the  
center of the magnet, it receives close to 0 mT, and both outputs drive high. If the switch with the embedded  
magnet moves left or right, the sensor receives a north or south field, and OUT1 or OUT2 drive low. This  
provides 3 digital states of detection.  
The length of the magnet should ideally be two times the distance of travel toward each side. Then, when the  
switch is pushed to either side, the outer edge of the magnet is positioned directly above the sensor where it  
applies the strongest perpendicular flux component.  
To determine the magnitude of magnetic flux density for a given magnet and distance, TI recommends to either  
use simulation software, test with a linear Hall effect sensor, or test with a gaussmeter.  
Copyright © 2017–2020, Texas Instruments Incorporated  
Submit Documentation Feedback  
19  
Product Folder Links: DRV5032  
 
DRV5032  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
www.ti.com  
9.2.2.3 Application Curve  
Figure 26 shows the typical magnetic flux lines around a 2-pole magnet.  
Figure 26. Typical Magnetic Flux Lines  
20  
Submit Documentation Feedback  
Copyright © 2017–2020, Texas Instruments Incorporated  
Product Folder Links: DRV5032  
 
DRV5032  
www.ti.com  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
9.3 Do's and Don'ts  
The Hall element is sensitive to magnetic fields that are perpendicular to the top of the package, therefore a  
correct magnet approach must be used for the sensor to detect the field. Figure 27 shows correct and incorrect  
approaches.  
CORRECT  
S
N
S
N
N
S
INCORRECT  
N
S
Figure 27. Correct and Incorrect Magnet Approaches  
Copyright © 2017–2020, Texas Instruments Incorporated  
Submit Documentation Feedback  
21  
Product Folder Links: DRV5032  
 
DRV5032  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
www.ti.com  
10 Power Supply Recommendations  
The DRV5032 device is powered from 1.65-V to 5.5-V DC power supplies. A decoupling capacitor close to the  
device must be used to provide local energy with minimal inductance. TI recommends using a ceramic capacitor  
with a value of at least 0.1 µF.  
11 Layout  
11.1 Layout Guidelines  
Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. It is common  
practice to embed Hall effect sensors within plastic or aluminum enclosures and sensing magnets on the outside.  
Magnetic fields also easily pass through most printed-circuit boards, which makes placing the magnet on the  
opposite side possible.  
11.2 Layout Examples  
VCC  
SEL  
VCC  
Thermal  
Pad  
GND  
VCC  
GND  
OUT  
GND  
OUT  
OUT  
Figure 28. Layout Examples  
22  
Submit Documentation Feedback  
Copyright © 2017–2020, Texas Instruments Incorporated  
Product Folder Links: DRV5032  
DRV5032  
www.ti.com  
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020  
12 Device and Documentation Support  
12.1 Documentation Support  
12.1.1 Related Documentation  
For related documentation see the following:  
•
•
•
•
•
Texas Instruments, DRV5032-SOLAR-EVM user's guide  
Texas Instruments, Power Gating Systems with Magnetic Sensors TI TechNote  
Texas Instruments, Low-Power Door and Window Sensor With Sub-1GHz and 10-Year Coin Cell Battery Life  
Texas Instruments, Magnetic Tamper Detection Using Low-Power Hall Effect Sensors  
Texas Instruments, Fault Monitoring for Overhead Fault Indicators Using Ultra-Low-Power  
12.2 Receiving Notification of Documentation Updates  
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper  
right corner, click on Alert me to register and receive a weekly digest of any product information that has  
changed. For change details, review the revision history included in any revised document.  
12.3 Support Resources  
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight  
from the experts. Search existing answers or ask your own question to get the quick design help you need.  
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do  
not necessarily reflect TI's views; see TI's Terms of Use.  
12.4 Trademarks  
E2E is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
12.5 Electrostatic Discharge Caution  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
12.6 Glossary  
SLYZ022 — TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
13 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical, packaging, and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
Copyright © 2017–2020, Texas Instruments Incorporated  
Submit Documentation Feedback  
23  
Product Folder Links: DRV5032  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Aug-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
3000  
250  
(1)  
(2)  
(3)  
(4/5)  
(6)  
DRV5032AJDBZR  
DRV5032AJDBZT  
DRV5032AJDMRR  
DRV5032AJDMRT  
DRV5032AJLPG  
ACTIVE  
SOT-23  
SOT-23  
X2SON  
X2SON  
TO-92  
DBZ  
3
3
4
4
3
3
3
3
4
4
3
3
3
3
4
4
Green (RoHS  
& no Sb/Br)  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
(1M6W, 2AJ)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DBZ  
Green (RoHS  
& no Sb/Br)  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
(1M6W, 2AJ)  
2AJ  
DMR  
DMR  
LPG  
3000  
250  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
2AJ  
1000  
3000  
3000  
250  
Green (RoHS  
& no Sb/Br)  
32AJ  
DRV5032AJLPGM  
DRV5032DUDBZR  
DRV5032DUDBZT  
DRV5032DUDMRR  
DRV5032DUDMRT  
DRV5032DULPG  
DRV5032DULPGM  
DRV5032FADBZR  
DRV5032FADBZT  
DRV5032FADMRR  
DRV5032FADMRT  
TO-92  
LPG  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
32AJ  
SOT-23  
SOT-23  
X2SON  
X2SON  
TO-92  
DBZ  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
2DU  
DBZ  
Green (RoHS  
& no Sb/Br)  
2DU  
DMR  
DMR  
LPG  
3000  
250  
Green (RoHS  
& no Sb/Br)  
2DU  
Green (RoHS  
& no Sb/Br)  
2DU  
1000  
3000  
3000  
250  
Green (RoHS  
& no Sb/Br)  
32DU  
TO-92  
LPG  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
32DU  
SOT-23  
SOT-23  
X2SON  
X2SON  
DBZ  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
(1LVW, 2FA)  
(1LVW, 2FA)  
2FA  
DBZ  
Green (RoHS  
& no Sb/Br)  
DMR  
DMR  
3000  
250  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
2FA  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Aug-2020  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
LPG  
LPG  
DBZ  
DBZ  
LPG  
LPG  
DBZ  
DBZ  
LPG  
LPG  
DMR  
DMR  
LPG  
LPG  
DBZ  
DBZ  
LPG  
Qty  
1000  
3000  
3000  
250  
(1)  
(2)  
(3)  
(4/5)  
(6)  
DRV5032FALPG  
DRV5032FALPGM  
DRV5032FBDBZR  
DRV5032FBDBZT  
DRV5032FBLPG  
DRV5032FBLPGM  
DRV5032FCDBZR  
DRV5032FCDBZT  
DRV5032FCLPG  
DRV5032FCLPGM  
DRV5032FDDMRR  
DRV5032FDDMRT  
DRV5032FDLPG  
DRV5032FDLPGM  
DRV5032ZEDBZR  
DRV5032ZEDBZT  
DRV5032ZELPG  
ACTIVE  
TO-92  
TO-92  
3
3
3
3
3
3
3
3
3
3
4
4
3
3
3
3
3
Green (RoHS  
& no Sb/Br)  
SN  
N / A for Pkg Type  
N / A for Pkg Type  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
N / A for Pkg Type  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
N / A for Pkg Type  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
N / A for Pkg Type  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
32FA  
32FA  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SN  
SOT-23  
SOT-23  
TO-92  
Green (RoHS  
& no Sb/Br)  
(1LWW, 2FB)  
(1LWW, 2FB)  
32FB  
Green (RoHS  
& no Sb/Br)  
1000  
3000  
3000  
250  
Green (RoHS  
& no Sb/Br)  
TO-92  
Green (RoHS  
& no Sb/Br)  
32FB  
SOT-23  
SOT-23  
TO-92  
Green (RoHS  
& no Sb/Br)  
(1M7W, 2FC)  
(1M7W, 2FC)  
32FC  
Green (RoHS  
& no Sb/Br)  
1000  
3000  
3000  
250  
Green (RoHS  
& no Sb/Br)  
TO-92  
Green (RoHS  
& no Sb/Br)  
32FC  
X2SON  
X2SON  
TO-92  
Green (RoHS  
& no Sb/Br)  
2FD  
Green (RoHS  
& no Sb/Br)  
2FD  
1000  
3000  
3000  
250  
Green (RoHS  
& no Sb/Br)  
32FD  
TO-92  
Green (RoHS  
& no Sb/Br)  
32FD  
SOT-23  
SOT-23  
TO-92  
Green (RoHS  
& no Sb/Br)  
(1M8W, 2ZE)  
(1M8W, 2ZE)  
32ZE  
Green (RoHS  
& no Sb/Br)  
1000  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Aug-2020  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
DRV5032ZELPGM  
ACTIVE  
TO-92  
LPG  
3
3000  
Green (RoHS  
& no Sb/Br)  
SN  
N / A for Pkg Type  
-40 to 85  
32ZE  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Apr-2020  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
DRV5032AJDBZR  
DRV5032AJDBZR  
DRV5032AJDBZT  
DRV5032AJDBZT  
DRV5032AJDMRR  
DRV5032AJDMRT  
DRV5032DUDBZR  
DRV5032DUDBZT  
DRV5032DUDMRR  
DRV5032DUDMRT  
DRV5032FADBZR  
DRV5032FADBZR  
DRV5032FADBZT  
DRV5032FADBZT  
DRV5032FADMRR  
DRV5032FADMRT  
DRV5032FBDBZR  
DRV5032FBDBZR  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
X2SON  
X2SON  
SOT-23  
SOT-23  
X2SON  
X2SON  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
X2SON  
X2SON  
SOT-23  
SOT-23  
DBZ  
DBZ  
DBZ  
DBZ  
DMR  
DMR  
DBZ  
DBZ  
DMR  
DMR  
DBZ  
DBZ  
DBZ  
DBZ  
DMR  
DMR  
DBZ  
DBZ  
3
3
3
3
4
4
3
3
4
4
3
3
3
3
4
4
3
3
3000  
3000  
250  
178.0  
180.0  
180.0  
178.0  
179.0  
179.0  
180.0  
180.0  
180.0  
180.0  
178.0  
180.0  
180.0  
178.0  
179.0  
180.0  
180.0  
178.0  
9.0  
8.4  
8.4  
9.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
9.0  
8.4  
8.4  
9.0  
8.4  
8.4  
8.4  
9.0  
3.15  
3.15  
3.15  
3.15  
1.27  
1.27  
3.15  
3.15  
1.27  
1.27  
3.15  
3.15  
3.15  
3.15  
1.27  
1.27  
3.15  
3.15  
2.77  
2.77  
2.77  
2.77  
1.57  
1.57  
2.77  
2.77  
1.57  
1.57  
2.77  
2.77  
2.77  
2.77  
1.57  
1.57  
2.77  
2.77  
1.22  
1.22  
1.22  
1.22  
0.5  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q1  
Q1  
Q3  
Q3  
Q1  
Q1  
Q3  
Q3  
Q3  
Q3  
Q1  
Q1  
Q3  
Q3  
250  
3000  
250  
0.5  
3000  
250  
1.22  
1.22  
0.5  
3000  
250  
0.5  
3000  
3000  
250  
1.22  
1.22  
1.22  
1.22  
0.5  
250  
3000  
250  
0.5  
3000  
3000  
1.22  
1.22  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Apr-2020  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
DRV5032FBDBZT  
DRV5032FBDBZT  
DRV5032FCDBZR  
DRV5032FCDBZR  
DRV5032FCDBZT  
DRV5032FCDBZT  
DRV5032FDDMRR  
DRV5032FDDMRT  
DRV5032ZEDBZR  
DRV5032ZEDBZR  
DRV5032ZEDBZT  
DRV5032ZEDBZT  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
X2SON  
X2SON  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DMR  
DMR  
DBZ  
DBZ  
DBZ  
DBZ  
3
3
3
3
3
3
4
4
3
3
3
3
250  
250  
180.0  
178.0  
180.0  
178.0  
180.0  
178.0  
179.0  
180.0  
178.0  
180.0  
178.0  
180.0  
8.4  
9.0  
8.4  
9.0  
8.4  
9.0  
8.4  
8.4  
9.0  
8.4  
9.0  
8.4  
3.15  
3.15  
3.15  
3.15  
3.15  
3.15  
1.27  
1.27  
3.15  
3.15  
3.15  
3.15  
2.77  
2.77  
2.77  
2.77  
2.77  
2.77  
1.57  
1.57  
2.77  
2.77  
2.77  
2.77  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
0.5  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q1  
Q1  
Q3  
Q3  
Q3  
Q3  
3000  
3000  
250  
250  
3000  
250  
0.5  
3000  
3000  
250  
1.22  
1.22  
1.22  
1.22  
250  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
DRV5032AJDBZR  
DRV5032AJDBZR  
DRV5032AJDBZT  
DRV5032AJDBZT  
DRV5032AJDMRR  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
X2SON  
DBZ  
DBZ  
DBZ  
DBZ  
DMR  
3
3
3
3
4
3000  
3000  
250  
180.0  
183.0  
183.0  
180.0  
203.0  
180.0  
183.0  
183.0  
180.0  
203.0  
18.0  
20.0  
20.0  
18.0  
35.0  
250  
3000  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Apr-2020  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
DRV5032AJDMRT  
DRV5032DUDBZR  
DRV5032DUDBZT  
DRV5032DUDMRR  
DRV5032DUDMRT  
DRV5032FADBZR  
DRV5032FADBZR  
DRV5032FADBZT  
DRV5032FADBZT  
DRV5032FADMRR  
DRV5032FADMRT  
DRV5032FBDBZR  
DRV5032FBDBZR  
DRV5032FBDBZT  
DRV5032FBDBZT  
DRV5032FCDBZR  
DRV5032FCDBZR  
DRV5032FCDBZT  
DRV5032FCDBZT  
DRV5032FDDMRR  
DRV5032FDDMRT  
DRV5032ZEDBZR  
DRV5032ZEDBZR  
DRV5032ZEDBZT  
DRV5032ZEDBZT  
X2SON  
SOT-23  
SOT-23  
X2SON  
X2SON  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
X2SON  
X2SON  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
X2SON  
X2SON  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DMR  
DBZ  
DBZ  
DMR  
DMR  
DBZ  
DBZ  
DBZ  
DBZ  
DMR  
DMR  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DMR  
DMR  
DBZ  
DBZ  
DBZ  
DBZ  
4
3
3
4
4
3
3
3
3
4
4
3
3
3
3
3
3
3
3
4
4
3
3
3
3
250  
3000  
250  
203.0  
183.0  
183.0  
203.0  
203.0  
180.0  
183.0  
183.0  
180.0  
203.0  
203.0  
183.0  
180.0  
202.0  
180.0  
183.0  
180.0  
202.0  
180.0  
203.0  
203.0  
180.0  
183.0  
180.0  
183.0  
203.0  
183.0  
183.0  
203.0  
203.0  
180.0  
183.0  
183.0  
180.0  
203.0  
203.0  
183.0  
180.0  
201.0  
180.0  
183.0  
180.0  
201.0  
180.0  
203.0  
203.0  
180.0  
183.0  
180.0  
183.0  
35.0  
20.0  
20.0  
35.0  
35.0  
18.0  
20.0  
20.0  
18.0  
35.0  
35.0  
20.0  
18.0  
28.0  
18.0  
20.0  
18.0  
28.0  
18.0  
35.0  
35.0  
18.0  
20.0  
18.0  
20.0  
3000  
250  
3000  
3000  
250  
250  
3000  
250  
3000  
3000  
250  
250  
3000  
3000  
250  
250  
3000  
250  
3000  
3000  
250  
250  
Pack Materials-Page 3  
4203227/C  
PACKAGE OUTLINE  
DBZ0003A  
SOT-23 - 1.12 mm max height  
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR  
C
2.64  
2.10  
1.12 MAX  
1.4  
1.2  
B
A
0.1 C  
PIN 1  
INDEX AREA  
1
0.95  
3.04  
2.80  
1.9  
3
2
0.5  
0.3  
3X  
0.10  
0.01  
(0.95)  
TYP  
0.2  
C A B  
0.25  
GAGE PLANE  
0.20  
0.08  
TYP  
0.6  
0.2  
TYP  
SEATING PLANE  
0 -8 TYP  
4214838/C 04/2017  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. Reference JEDEC registration TO-236, except minimum foot length.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
DBZ0003A  
SOT-23 - 1.12 mm max height  
SMALL OUTLINE TRANSISTOR  
PKG  
3X (1.3)  
1
3X (0.6)  
SYMM  
3
2X (0.95)  
2
(R0.05) TYP  
(2.1)  
LAND PATTERN EXAMPLE  
SCALE:15X  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
METAL  
0.07 MIN  
ALL AROUND  
0.07 MAX  
ALL AROUND  
NON SOLDER MASK  
DEFINED  
SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4214838/C 04/2017  
NOTES: (continued)  
4. Publication IPC-7351 may have alternate designs.  
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
DBZ0003A  
SOT-23 - 1.12 mm max height  
SMALL OUTLINE TRANSISTOR  
PKG  
3X (1.3)  
1
3X (0.6)  
SYMM  
3
2X(0.95)  
2
(R0.05) TYP  
(2.1)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 THICK STENCIL  
SCALE:15X  
4214838/C 04/2017  
NOTES: (continued)  
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
7. Board assembly site may have different recommendations for stencil design.  
www.ti.com  
PACKAGE OUTLINE  
DMR0004A  
X2SON - 0.4 mm max height  
SCALE 9.000  
PLASTIC SMALL OUTLINE - NO LEAD  
1.15  
1.05  
A
B
PIN 1 INDEX AREA  
1.45  
1.35  
C
0.4 MAX  
SEATING PLANE  
0.08 C  
0.05  
0.00  
2X 0.5  
SYMM  
2
3
EXPOSED  
THERMAL PAD  
5
SYMM  
0.6±0.05  
0.25  
0.15  
4X  
PIN 1 ID  
(OPTIONAL)  
4
1
0.27  
0.17  
4X  
0.8±0.05  
0.1  
C B  
C
A
0.05  
4222825/A 03/2016  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
DMR0004A  
X2SON - 0.4 mm max height  
PLASTIC SMALL OUTLINE - NO LEAD  
2X (0.5)  
4X (0.22)  
4X (0.4)  
(R0.05) TYP  
1
4
5
SYMM  
(1.4)  
(0.6)  
(
0.2) VIA  
2
3
SYMM  
(0.8)  
LAND PATTERN EXAMPLE  
SCALE:35X  
0.05 MAX  
ALL AROUND  
0.05 MIN  
ALL AROUND  
METAL  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
NON SOLDER MASK  
DEFINED  
SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4222825/A 03/2016  
NOTES: (continued)  
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature  
number SLUA271 (www.ti.com/lit/slua271).  
5. Vias are optional depending on application, refer to device data sheet. If all or some are implemented, recommended via locations are shown.  
It is recommended that vias under paste be filled, plugged or tented.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
DMR0004A  
X2SON - 0.4 mm max height  
PLASTIC SMALL OUTLINE - NO LEAD  
2X (0.5)  
4X (0.22)  
4X (0.4)  
(R0.05) TYP  
1
4
5
SYMM  
(1.4)  
(0.57)  
METAL  
TYP  
2
3
SYMM  
(0.76)  
SOLDER PASTE EXAMPLE  
BASED ON 0.1 mm THICK STENCIL  
EXPOSED PAD 5:  
90% PRINTED SOLDER COVERAGE BY AREA  
SCALE:50X  
4222825/A 03/2016  
NOTES: (continued)  
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
www.ti.com  
PACKAGE OUTLINE  
LPG0003A  
TO-92 - 5.05 mm max height  
S
C
A
L
E
1
.
3
0
0
TRANSISTOR OUTLINE  
4.1  
3.9  
3.25  
3.05  
0.55  
0.40  
3X  
5.05  
MAX  
3
1
3X (0.8)  
3X  
15.5  
15.1  
0.48  
0.35  
0.51  
0.36  
3X  
3X  
2X 1.27 0.05  
2.64  
2.44  
2.68  
2.28  
1.62  
1.42  
2X (45 )  
1
3
2
0.86  
0.66  
(0.5425)  
4221343/C 01/2018  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
LPG0003A  
TO-92 - 5.05 mm max height  
TRANSISTOR OUTLINE  
FULL R  
TYP  
0.05 MAX  
ALL AROUND  
TYP  
(1.07)  
METAL  
TYP  
3X ( 0.75) VIA  
2X  
METAL  
(1.7)  
2X (1.7)  
2X  
SOLDER MASK  
OPENING  
2
3
1
2X (1.07)  
(R0.05) TYP  
(1.27)  
SOLDER MASK  
OPENING  
(2.54)  
LAND PATTERN EXAMPLE  
NON-SOLDER MASK DEFINED  
SCALE:20X  
4221343/C 01/2018  
www.ti.com  
TAPE SPECIFICATIONS  
LPG0003A  
TO-92 - 5.05 mm max height  
TRANSISTOR OUTLINE  
0
1
13.0  
12.4  
0
1
1 MAX  
21  
18  
2.5 MIN  
6.5  
5.5  
9.5  
8.5  
0.25  
0.15  
19.0  
17.5  
3.8-4.2 TYP  
0.45  
0.35  
6.55  
6.15  
12.9  
12.5  
4221343/C 01/2018  
www.ti.com  
IMPORTANT NOTICE AND DISCLAIMER  
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE  
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”  
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you  
permission to use these resources only for development of an application that uses the TI products described in the resource. Other  
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third  
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,  
damages, costs, losses, and liabilities arising out of your use of these resources.  
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on  
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable  
warranties or warranty disclaimers for TI products.  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2020, Texas Instruments Incorporated  

相关型号：

SI9130DB

 5- and 3.3-V Step-Down Synchronous Converters

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135LG-T1

 SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135LG-T1-E3

 SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135_11

 SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9136_11

 Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130CG-T1-E3

 Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130LG-T1-E3

 Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130_11

 Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137DB

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明