DS110RT410SQ/NOPB [TI]

DS110RT410 Low Power Multi-Rate Quad Channel Retimer; DS110RT410低功耗多速率四通道重定时器
DS110RT410SQ/NOPB
型号: DS110RT410SQ/NOPB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

DS110RT410 Low Power Multi-Rate Quad Channel Retimer
DS110RT410低功耗多速率四通道重定时器

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DS110RT410  
www.ti.com  
SNLS460 MAY 2013  
DS110RT410 Low Power Multi-Rate Quad Channel Retimer  
Check for Samples: DS110RT410  
1
FEATURES  
APPLICATIONS  
Each channel independently locks to data  
rates from 8.5 to 11.3 Gbps and submultiples  
Front port SFF 8431 (SFP+) optical and direct  
attach copper  
Support for subrates of divide by 2/4/8  
Backplane reach extension, data retimer  
Ethernet: 10GbE, 1GbE  
Fast lock operation based on protocol-select  
mode  
Fibre-Channel, InfiniBand  
Low latency (~300ps)  
Other Propriety Data Rates up to 11.3 Gbps  
Adaptive equalization up to 34 dB boost at 5  
GHz  
DESCRIPTION  
The DS110RT410 is four channel retimer with  
integrated signal conditioning. The device includes a  
fully adaptive Continuous-Time Linear Equalizer  
(CTLE), Clock and Data Recovery (CDR), and  
transmit De-Emphasis (DE) driver to enable data  
transmission over long, lossy and crosstalk-impaired  
highspeed serial links to achieve BER < 1×10-15. For  
channels with high amount of crosstalk, the  
DS110DF410 should be used which has self  
calibrating 5-tap DFE.  
Adjustable transmit VOD : 600 to 1300 mVp-p  
Adjustable transmit de-emphasis to -12 dB  
Typical Power Dissipation (EQ+CDR+DE): 150  
mW / channel  
Programmable output polarity inversion  
Input signal detection, CDR lock  
detection/indicator  
On-chip Eye Monitor (EOM), PRBS generator  
Single 2.5 V ±5% power supply  
Each channel can independently lock to data rates  
from 8.5 to 11.3 Gbps, and associated sub rates (div  
by 2, 4 and 8) to support a variety of communication  
protocols. A 25 MHz crystal oscillator clock is used to  
speed up the CDR lock process. This clock is not  
used for training the PLL and does not need to be  
synchronous with the serial data.  
SMBus/EEPROM configuration modes  
Operating temperature range of -40 to 85°C  
RHS (QFN) 48-pin 7 mm x 7 mm package  
Easy pin compatible upgrade between  
repeater and retimers  
DS100RT410 (EQ+CDR+DE): 10.3125 Gbps  
The programmable settings can be applied using the  
SMBus (I2C) interface, or they can be loaded via an  
external EEPROM. An on-chip eye monitor and a  
PRBS generator allow real-time measurement of  
high-speed serial data for system bring-up or field  
tuning.  
DS100DF410 (EQ+DFE+CDR+DE): 10.3125  
Gbps  
DS110RT410 (EQ+CDR+DE): 8.5 - 11.3 Gbps  
DS110DF410 (EQ+DFE+CDR+DE): 8.5 - 11.3  
Gbps  
The device is offered in a RHS (QFN) 48-pin, 7 mm x  
7 mm package. A flow-through pinout for the high  
speed signals and a single power supply makes the  
DS110RT410 easy to use.  
DS125RT410 (EQ+CDR+DE): 9.8 - 12.5 Gbps  
DS125DF410 (EQ+DFE+CDR+DE): 9.8 - 12.5  
Gbps  
DS100BR410 (EQ+DE): Up to 10.3125 Gbps  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2013, Texas Instruments Incorporated  
DS110RT410  
SNLS460 MAY 2013  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
Typical Application Diagram  
Line Card  
Switch Fabric  
Optical Modules  
DS110RT410  
x4  
x4  
10GbE  
Fibre Channel  
InfiniBand  
SONET  
SFP+ (SFF8431)  
ASIC  
ASIC  
Others  
x4  
x4  
Back  
DS110RT410  
Passive Copper  
Plane/  
Mid  
Plane  
Clean Signal  
Noisy Signal  
2
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Connection Diagram  
RXP0  
1
2
3
TXP0  
TXN0  
GND  
TXP1  
TXN1  
GND  
GND  
TXP2  
TXN2  
GND  
TXP3  
TXN3  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
RXN0  
VDD  
RXP1  
4
RXN1  
VDD  
5
6
DS110RT410  
VDD  
RXP2  
RXN2  
VDD  
7
7 mm x 7 mm, 0.5 mm pitch  
8
TOP VIEW  
DAP = GND  
9
10  
11  
12  
RXP3  
RXN3  
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Pin Functions  
Pin Descriptions  
Pin Name  
Pin #  
I/O, Type  
Description  
HIGH-SPEED DIFFERENTIAL I/O  
RXP0  
RXN0  
1
2
I, CML  
I, CML  
I, CML  
I, CML  
O, CML  
O, CML  
O, CML  
O, CML  
Inverting and non-inverting CML-compatible differential inputs to the equalizer.  
Nominal differential input impedance = 100.  
RXP1  
RXN1  
4
5
Inverting and non-inverting CML-compatible differential inputs to the equalizer.  
Nominal differential input impedance = 100.  
RXP2  
RXN2  
8
9
Inverting and non-inverting CML-compatible differential inputs to the equalizer.  
Nominal differential input impedance = 100.  
RXP3  
RXN3  
11  
12  
Inverting and non-inverting CML-compatible differential inputs to the equalizer.  
Nominal differential input impedance = 100.  
TXP0  
TXN0  
36  
35  
Inverting and non-inverting CML-compatible differential outputs from the driver.  
Nominal differential output impedance = 100.  
TXP1  
TXN1  
33  
32  
Inverting and non-inverting CML-compatible differential outputs from the driver.  
Nominal differential output impedance = 100.  
TXP2  
TXN2  
29  
28  
Inverting and non-inverting CML-compatible differential outputs from the driver.  
Nominal differential output impedance = 100.  
TXP3  
TXN3  
26  
25  
Inverting and non-inverting CML-compatible differential outputs from the driver.  
Nominal differential output impedance = 100.  
LOOP FILTER CONNECTION PINS  
LPF_CP_0  
LPF_REF_0  
47  
48  
I/O, analog  
I/O, analog  
I/O, analog  
I/O, analog  
Loop filter connection  
Place a 22 nF ± 10% Capacitor between LPF_CP_0 and LPF_REF_0  
LPF_CP_1  
LPF_REF_1  
38  
37  
Loop filter connection  
Place a 22 nF ± 10% Capacitor between LPF_CP_1 and LPF_REF_1  
LPF_CP_2  
LPF_REF_2  
23  
24  
Loop filter connection  
Place a 22 nF ± 10% Capacitor between LPF_CP_2 and LPF_REF_2  
LPF_CP_3  
LPF_REF_3  
14  
13  
Loop filter connection  
Place a 22 nF ± 10% Capacitor between LPF_CP_3 and LPF_REF_3  
REFERENCE CLOCK I/O  
REFCLK_IN  
19  
42  
I, 2.5V analog Input is 2.5 V, 25 MHz ± 100 ppm reference clock from external oscillator  
No stringent phase noise requirement  
REFCLK_OUT  
O, 2.5V analog Output is 2.5 V, buffered replica of reference clock input for connecting multiple  
DS110RT410s on a board  
LOCK INDICATOR PINS  
LOCK_0  
LOCK_1  
LOCK_2  
LOCK_3  
45  
40  
21  
16  
O, 2.5V  
LVCMOS  
Output is 2.5 V, the pin is high when CDR lock is attained on the corresponding  
channel.  
Note that these pins are shared with SMBus address strap input functions read  
at startup.  
SMBus MASTER MODE PINS  
ALL_DONE  
41  
O, 2.5V  
LVCMOS  
Output is 2.5 V, the pin goes low to indicate that the SMBus master EEPROM  
read has been completed.  
READ_EN  
44  
43  
I, 2.5V  
LVCMOS  
Input is 2.5 V, a transition from high to low starts the load from the external  
EEPROM.  
The READ_EN pin must be tied low when in SMBus slave mode.  
INTERRUPT OUTPUT  
INT  
O, 3.3V Open Used to signal horizontal or vertical eye opening out of tolerance, loss of signal  
Drain  
detect, or CDR unlock  
External 2KΩ to 5KΩ pull-up resistor is required.  
Pin is 3.3 V LVCMOS tolerant.  
SERIAL MANAGEMENT BUS (SMBus) INTERFACE  
EN_SMB  
20  
I, 2.5V analog Input is 2.5 V, selects SMBus master mode or SMBus slave mode.  
EN_SMB = High for slave mode  
EN_SMB = Float for master mode  
Tie READ_EN pin low for SMBus slave mode. See Table 3  
SDA  
18  
I/O, 3.3V  
Data Input / Open Drain Output  
LVCMOS, Open External 2KΩ to 5KΩ pull-up resistor is required.  
Drain  
Pin is 3.3 V LVCMOS tolerant.  
4
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SNLS460 MAY 2013  
Pin Descriptions (continued)  
Pin Name  
Pin #  
I/O, Type  
I/O, 3.3V  
LVCMOS, Open External 2KΩ to 5KΩ pull-up resistor is required.  
Description  
SDC  
17  
Clock Input / Open Drain Clock Output  
Drain  
Pin is 3.3 V LVCMOS tolerant.  
ADDR_0  
ADDR_1  
ADDR_2  
ADDR_3  
45  
40  
21  
16  
I, 2.5V  
LVCMOS  
Input is 2.5 V, the ADDR_[3:0] pins set the SMBus address for the retimer.  
These pins are strap inputs. Their state is read on power-up to set the SMBus  
address in SMBus control mode.  
Note that these pins are shared with the lock indicator functions. See Table 4  
POWER  
VDD  
3, 6, 7,  
10, 15, 46  
Power  
Power  
VDD = 2.5 V ± 5%  
Ground reference.  
GND  
DAP  
22, 27,  
30, 31,  
34, 39  
PAD  
Power  
Ground reference. The exposed pad at the center of the package must be  
connected to ground plane of the board with at least 4 vias to lower the ground  
impedance and improve the thermal performance of the package.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
(1)  
Absolute Maximum Ratings  
Supply Voltage (VDD  
)
-0.5V to +2.75V  
-0.5V to +2.75V  
2.5 I/O Voltage  
(LVCMOS and Analog)  
3.3 LVCMOS I/O Voltage  
(SDA, SDC, INT)  
-0.5V to +4.0V  
Signal Input Voltage (RXPn, RXNn)  
Signal Output Voltage (TXPn, TXNn)  
Junction Temperature  
-0.5V to +2.75V  
-0.5V to +2.75V  
+150°C  
Storage Temperature  
-65°C to +150°C  
ESD Rating  
HBM, STD - JESD22-A114F  
MM, STD - JESD22-A115-A  
CDM, STD - JESD22-C101-D  
6 kV  
250 V  
1250 V  
Thermal Resistance  
θJA, No Airflow,  
4 layer JEDEC, 9 thermal vias  
26.1 °C/W  
For soldering specifications: see http://www.ti.com/lit/an/snoa549c/snoa549c.pdf  
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of  
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or  
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating  
Conditions indicate conditions at which the device is functional and the device should not be operated outside these conditions.  
Recommended Operating Conditions  
Min  
2.375  
-40  
Typ  
2.5  
25  
Max  
2.625  
+85  
Units  
V
Supply Voltage (VDD to GND)  
Ambient Temperature  
°C  
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Electrical Characteristics  
Over recommended operating supply and temperature ranges with default register settings unless otherwise specified.  
(1)  
Symbol  
POWER  
PD  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
(2)  
Power Supply Consumption  
Average Power Consumption  
660  
500  
mW  
mA  
Max Transient Power Supply Current  
610  
(3)  
(4)  
NTPS  
Supply Noise Tolerance  
50 Hz to 100 Hz  
100 Hz to 10 MHz  
10 MHz to 5.0 GHz  
100  
40  
mVP-P  
mVP-P  
mVP-P  
10  
2.5V LVCMOS DC SPECIFICATIONS  
VIH  
VIL  
High Level Input Voltage  
Low Level Input Voltage  
High Level Output Voltage  
Low Level Output Voltage  
Input Leakage Current  
1.75  
GND  
2.0  
VDD  
0.7  
V
V
VOH  
VOL  
IIN  
IOH = -3mA  
IOL = 3mA  
VIN = VDD  
VIN = GND  
VIN = VDD  
VIN = GND  
V
0.4  
V
+10  
μA  
μA  
μA  
μA  
-10  
IIH  
IIL  
Input High Current (EN_SMB pin)  
Input Low Current (EN_SMB pin)  
+55  
-110  
3.3V LVCMOS DC SPECIFICATIONS (SDA, SDC, INT)  
VIH  
VIL  
VOL  
IIH  
High Level Input Voltage  
Low Level Input Voltage  
Low Level Output Voltage  
Input High Current  
VDD = 2.5 V  
1.75  
3.6  
0.7  
V
V
VDD = 2.5 V  
GND  
IPULLUP = 3mA  
0.4  
V
VIN = 3.6 V, VDD = 2.5 V  
VIN = GND, VDD = 2.5 V  
+20  
-10  
+40  
+10  
400  
μA  
μA  
KHz  
IIL  
Input Low Current  
fSDC  
SMBus clock rate  
100  
DATA BIT RATES  
RB  
Bit Rate Range  
8.5  
11.3  
Gbps  
mVp-p  
SIGNAL DETECT  
SDH  
Signal Detect ON Threshold Level  
Default differential input signal level to  
assert signal detect, 10.3125 Gbps,  
PRBS-31  
70  
10  
SDL  
Signal Detect OFF Threshold Level  
Default differential input signal level to  
de-assert signal detect, 10.3125 Gbps,  
PRBS-31  
mVp-p  
(1) Typical values represent most likely parametric norms at VDD = 2.5V, TA = 25°C., and at the Recommended Operation Conditions at the  
time of product characterization.  
(2) VDD= 2.5V, TA = 25°C. All four channels active and locked.  
(3) Maximum power supply current during lock acquisition. All four channels active, all four channels unlocked, all registers at default  
settings.  
(4) Allowed supply noise (mVP-P sine wave) under typical conditions.  
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Electrical Characteristics (continued)  
Over recommended operating supply and temperature ranges with default register settings unless otherwise specified. (1)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
RECEIVER INPUTS (RXPn, RXNn)  
(5)  
(5)  
(6)  
(7)  
VTX2, min  
VTX2, max  
VTX1, max  
VTX0, max  
LRI  
Minimum Source Transmit Launch  
Signal Level (IN, diff)  
600  
1000  
1200  
1600  
-15  
mVP-P  
mVP-P  
mVP-P  
mVP-P  
dB  
Maximum Source Transmit Launch  
Signal Level (IN, diff)  
Maximum Source Transmit Launch  
Signal Level (IN, diff)  
Maximum Source Transmit Launch  
Signal Level (IN, diff)  
Maximum Differential Input Return  
Loss - |SDD11|  
100 MHz – 6 GHz(8)  
ZD  
ZS  
Differential Input Impedance  
Single-ended Input Impedance  
100 MHz – 6 GHz  
100 MHz – 6 GHz  
100  
50  
DRIVER OUTPUTS (TXPn, TXNn)  
VOD0  
Differential output voltage  
Differential measurement with OUT+  
and OUT- terminated by 50to GND,  
AC-Coupled,  
SMBus register VOD control (Register  
0x2d bits 2:0) set to 0, minimum VOD  
De-emphasis control set to minimum (0  
dB)  
400  
675  
mVP-P  
VOD7  
Differential output voltage  
Differential measurement with OUT+  
and OUT- terminated by 50to GND,  
AC-Coupled  
SMBus register VOD control (Register  
0x2d bits 2:0) set to 7, maximum VOD  
De-emphasis control set to minimum (0  
dB)  
1000  
mVP-P  
VOD_DE  
De-emphasis level  
Differential measurement with OUT+  
and OUT- terminated by 50to GND,  
AC-Coupled  
(9)  
Set by SMBus register control to  
maximum de-emphasis setting  
Relative to the nominal 0 dB de-  
emphasis level set at the minimum de-  
emphasis setting  
-12  
dB  
tR, tF  
Transition time (rise and fall times)(9) Transition time control = Full Slew  
39  
50  
ps  
ps  
(10)  
Rate  
Transition time control = Limited Slew  
Rate  
(8)  
LRO  
Maximum Differential Output Return  
Loss - |SDD22|  
100 MHz – 6 GHz  
-15  
300  
75  
dB  
ps  
ps  
ps  
tDP  
Propagation Delay  
De-emphasis pulse duration(12)  
Retimed data(11)  
TDE  
Measured at VOD = 1000 mVP-P, de-  
emphasis setting = -12 dB  
Measured at BER = 10-12 (13)  
TJ  
Output total jitter  
10  
(5) Differential signal amplitude at the transmitter output providing < 1x10-12 bit error rate. Measured at 10.3125 Gbps with a PRBS-31 data  
pattern. Input transmission channel is 40-inch long FR-4 stripline, 4-mil trace width.  
(6) Differential signal amplitude at the transmitter output providing < 1x10-12 bit error rate. Measured at 10.3125 Gbps with a PRBS-31 data  
pattern. Input transmission channel is 30-inch long FR-4 stripline, 4-mil trace width.  
(7) Differential signal amplitude at the transmitter output providing < 1x10-12 bit error rate. Measured at 10.3125 Gbps with a PRBS-31 data  
pattern. No input transmission channel.  
(8) Measured with 10 MHz clock pattern output.  
(9) Measured with clock-like {11111 00000} pattern.  
(10) Slew rate is controlled by SMBus register settings.  
(11) Typical at 10.3125 Gbps bit rate.  
(12) De-emphasis pulse width varies with VOD and de-emphasis settings.  
(13) Typical with no output de-emphasis, minimum output transmission channel.  
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Electrical Characteristics (continued)  
Over recommended operating supply and temperature ranges with default register settings unless otherwise specified. (1)  
Symbol  
TSKEW  
Parameter  
Intra Pair Skew  
Conditions  
Min  
Typ  
Max  
Units  
Difference in 50% crossing between  
TXPn and TXNn for any output  
3
ps  
CLOCK AND DATA RECOVERY  
BWPLL  
PLL Bandwidth  
-3 dB  
Measured at 10.3125 Gbps  
Measured at BER = 10-15  
5
MHz  
UI  
JTOL  
Input sinusoidal jitter tolerance  
10 kHz to 250 MHz sinusoidal jitter  
frequency  
0.6  
JTRANS  
Jitter Transfer  
Measured at BER = 10-15  
Sinusoidal jitter at 10 MHz jitter  
frequency  
-6  
2
dB  
ms  
ms  
TLOCK  
CDR Lock Time,  
Ref_mode 3,  
Fixed (manual setting) of CTLE,  
HEO/VEO lock monitor disabled  
Fixed Data Rate (eg. 10.3125 Gbps) (register 0x3e, bit 7 set to 0)  
Fixed (manual setting) of CTLE,  
HEO/VEO lock monitor enabled  
(register 0x3e, bit 7 set to 1 - default)  
12  
Medium (20 inch) channel loss with  
CTLE adaption, HEO/VEO lock  
monitor must be enabled  
74  
90  
ms  
°C  
(14)  
TEMPLOCK CDR Lock,  
Ref_mode 3, 10.3125 Gbps  
Lock Temperature Range  
tested at -5°C to +85°C  
(14) The CDR lock time is when the input has a valid signal to when the output sends retimed data. The CDR lock time is after the CTLE  
adaption is completed.  
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FUNCTIONAL DESCRIPTION  
The DS110RT410 is a low-power multi-rate 4-channel retimer. Each of the four channels operates independently.  
Each channel includes a Continuous-Time Linear Equalizer (CTLE) which compensates for the presence of a  
dispersive transmission channel between the source and the DS110RT410's input.  
Each channel includes an independent Voltage-Controlled Oscillator (VCO) and Phase-Locked Loop (PLL) which  
produce a clean clock. The clean clock produced by the VCO and the PLL is phase-locked to the incoming data  
clock, but the high-frequency jitter on the incoming data is attenuated by the PLL, producing a clean clock with  
substantially reduced jitter. This clean clock is used to retime the incoming data, removing high-frequency jitter  
from the data stream and producing a data output signal with reduced jitter.  
Each channel of the DS110RT410 features an output driver with programable differential output voltage and  
output de-emphasis control. The output de-emphasis compensates for dispersion in the transmission channel at  
the output.  
There are functions together make up the data path for the DS110RT410.  
RETIMER  
CDR  
EQ  
DRIVER  
RXPn  
RXNn  
TXPn  
TXNn  
100  
100ꢀ  
SMBus  
SMBus  
SMBus  
SDC  
SDA  
Signal  
Detect  
Figure 1. DS110RT410 Data Path Block Diagram — One of Four Channels  
Device Data Path Operation  
The data path operation of the DS110RT410 comprises three functional sections as shown in the data path block  
diagram of Figure 1. The three functional sections are as follows.  
Channel Equalization  
Clock and Data Recovery  
Output Driver  
Channel Equalization  
Physical transmission media such as traces on printed circuit boards (PCBs) or copper cables exhibit a low-pass  
frequency response characteristic. The magnitude of the high-frequency loss varies with the length of the  
transmission media and with the loss of the materials which comprise it. This differential high-frequency loss and  
the frequency-dependent group delay of the transmission media introduce inter-symbol interference in the high-  
speed broadband signals propagating through the transmission media.  
The DS110RT410 applies a frequency-response equalization function to the incoming data stream. The  
equalization function reduces the effect of the frequency-dependent loss in the transmission media between the  
transmitter output and the input of the DS110RT410. The device includes a Continuous Time Linear Equalizer or  
CTLE which applies the frequency-response equalization. The CTLE is designed to provide a controlled-amount  
of high-frequency boost to the signal in the frequency domain to compensate for the frequency-dependent loss in  
the transmission media.  
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The CTLE is a four-stage variable boost high-gain amplifier with a quasi-high-pass characteristic. Each of the  
four stages can be set to provide various amounts of high-frequency boost with the overall transfer function of  
the CTLE set by the cascade of all four sections. The high-frequency boost of each CTLE stage is variable. The  
optimum boost for each stage is one that causes the transfer function magnitude of the transmission channel and  
the CTLE in cascade to be flat over a band of frequencies extending up to half the data rate which is commonly  
referred to as the “Nyquist” frequency. In normal operation, the DS110RT410 sets the boost of the CTLE  
automatically to approximate the optimum cascaded response.  
Clock and Data Recovery  
The DS110RT410 performs its clock and data recovery function by detecting the bit transitions in the incoming  
data stream and locking its internal VCO to the clock represented by the mean arrival times of these bit  
transitions. This process produces a recovered clock with greatly reduced jitter at jitter frequencies outside the  
bandwidth of the CDR Phase-Locked Loop (PLL). This is the primary benefit of using the DS110RT410 in a  
system. It significantly reduces the jitter present in the data stream, in effect resetting the jitter budget for the  
system.  
Output Driver  
The DS110RT410 is commonly used in applications where lossy transmission media exist both at the input and  
the output of the DS110RT410. The CTLE compensates for lossy transmission media at the input to the  
DS110RT410. The output de-emphasis compensates for the lossy transmission media at the output of the  
DS110RT410.  
When there is a transition in the output data stream, the output differential voltage reaches its configured  
maximum value within the configured rise/fall time of the output driver. Following this, the differential voltage  
rapidly falls off until it reaches the configured VOD level minus the configured de-emphasis level. This  
accentuates the high-frequency components of the output driver signal at the expense of the low-frequency  
components. This pre-distorted signal, with its high-frequency components emphasized relative to its low-  
frequency components, travels down the dispersive transmission media at the output of the DS110RT410 with  
less inter-symbol interference than an undistorted signal would exhibit.  
The output driver is capable of driving variable output voltages with variable amounts of analog de-emphasis.  
The output voltage and de-emphasis level can be configured by writing registers over the SMBus. The  
DS110RT410 cannot determine independently the appropriate output voltage or de-emphasis setting, so the user  
is responsible for configuring these parameters. They can be set for each channel independently.  
An idealized transmit waveform with analog de-emphasis applied is shown in Figure 2.  
1.0  
0.5  
0.0  
-0.5  
-1.0  
0
1
2
3
4
5
6
7
8
9 10  
TIME (UI)  
Figure 2. Idealized De-Emphasis Waveform  
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DEVICE CONFIGURATION INFORMATION  
The DS110RT410 can be configured by the user to optimize its operation. The four channels can be optimized  
independently in SMBus master or SMBus slave mode. The operational settings available for user configuration  
include the following.  
CTLE boost setting  
Data Rate and Standard Setting  
Reference clock setting  
Driver output voltage  
Driver output de-emphasis  
Driver output rise/fall time  
Configuration of the DS110RT410 is accomplished by writing the appropriate values into various device registers  
over the SMBus. This can either be done while the device is operating or upon initial power-up. When the  
DS110RT410 is operating it behaves like an SMBus slave device, and its register contents can be read or written  
over the SMBus. Optionally, when the DS110RT410 first powers up, it can behave like an SMBus master and  
read its register contents autonomously from an external EEPROM.  
CTLE Boost Setting  
The CTLE is a four-stage amplifier with an adjustable, quasi-high-pass transfer function on each stage. The  
overall frequency response of the CTLE is set by adjusting the boost of each stage independently. Each stage of  
the CTLE can be set to one of four boost settings. The amount of high-frequency boost supplied by each stage  
generally increases with increasing boost settings.  
The CTLE can also be configured to adapt automatically to provide the optimum boost level for its input signal.  
Automatic adaptation of the CTLE only is the default mode of operation for the DS110RT410.  
Data Rate and Standard Setting  
Register 0x2f, bits 7:4, Register 0x36, bits 2:0, and Registers 0x60, 0x61, 0x62, 0x63, and 0x64  
The DS110RT410 is part of a family of retimer devices differentiated by different VCO frequency ranges. Each  
device in the retimer family is designed for operation in specific frequency bands and with specific data rate  
standards.  
The DS110RT410 is designed to lock rapidly to any valid signal present at its inputs. It is also designed to detect  
incorrect lock conditions which can arise when the input data signals are strongly periodic. This condition is  
referred to as “false lock”. The DS110RT410 discriminates against false lock by using its 25 MHz reference to  
ensure that the VCO frequency resulting from its internal phase-locking process is correct.  
To determine the correct VCO frequency, the digital circuitry in the DS110RT410 requires some user-supplied  
information about the expected data rate or data rates. This information is provided by writing several device  
register using the SMBus.  
Standards-Based Modes  
The DS110RT410 is designed to automatically operate with various multi-band data standards.  
The first set of register writes constrain the coarse VCO tuning and the VCO divider ratios. When these registers  
are set as indicated in Table 1, the DS110RT410 restricts its coarse VCO tuning to a set of coarse tuning values.  
It also restricts the VCO divider ratio to the set of divider ratios required to cover the frequency bands for the  
desired data rate standard. This enables the DS110RT410 to acquire phase lock more quickly than would be  
possible if the coarse tuning range were unrestricted.  
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Table 1. Standards-Based Modes Register Settings  
Standards  
Ethernet  
Data Rates (Gbps)  
1.25, 10.3125  
2.125, 4.25, 8.5, 10.51875  
2.5, 5, 10  
VCO Frequencies (GHz)  
Divider Ratios  
Register 0x2F Value (hex)  
10.0, 10.3125  
8.5, 10.51875  
10.0  
1, 8  
0x04  
0x14  
0x24  
0x54  
0x74  
0x84  
0xC4  
0xD4  
Fibre-Channel  
InfiniBand  
SDH/SONET  
PROP1a  
1, 2, 4  
1, 2, 4  
2.48832, 9.95328  
8.25  
9.5328  
1, 4  
1
8.25  
PROP1b  
8.5  
8.5  
1
Interlaken 2  
SFF-8431  
10.3125  
10.3125  
9.95328  
1
9.95328  
1
As an example of the usage of the registers in Table 1, assume that the retimer is required to operate in 10 GbE  
or 1GbE mode. By setting register 0x2f, bits 7:4, to 4'b0000, the DS110RT410 will automatically set its divider  
ratio and its coarse VCO tuning setting to lock to either a 10 GbE signal (at 10.3125 Gb/s) or a 1 GbE signal (at  
1.25 Gb/s) at its input.  
For Fibre-Channel, the standard requiring a 10.51875 GHz VCO frequency and the standard requiring an 8.5  
GHz VCO frequency require different settings for the registers shown in the table. The retimer cannot  
automatically switch between these two standards.  
For the some standards shown in the table above, the required VCO frequency is the same for each data rate in  
the standard. Only the divider ratios are different. The retimer can automatically switch between the required  
divider ratios with a single set of register settings.  
For other data rates, it is also necessary to set the expected PPM count and the PPM count tolerance. These are  
the values the retimer uses to detect a valid frequency lock.  
For the 10 GbE and 1 GbE mode shown in the table above, two frequency groups are defined. These two  
frequency groups are referred to as “Group 0”, for 1 GbE, and “Group 1”, for 10 GbE. This same frequency group  
structure is present for all frequency modes, but for some modes the expected frequency for both groups is the  
same. The expected PPM count information for Group 0 is set in registers 0x60 and 0x61. For Group 1, it is set  
in registers 0x62 and 0x63. For both groups, the PPM count tolerance is set in register 0x64.  
The value of the PPM count for either group is computed the same way from the expected data rate in Gbps,  
RGbps. The PPM count value, denoted NPPM, is computed by NPPM = RGbps X 1280.  
As an example we consider the PPM count setup for 10 GbE and 1 GbE. The expected PPM count for Group 0,  
which in this case is 1 GbE, is set in registers 0x60 and 0x61. The expected VCO frequency for 1 GbE is 10.0  
GHz. The actual data rate for 1 GbE, which is 8B/10B coded, is 1.25 Gbps. With a VCO divide ratio of 8, which is  
the divide ratio automatically used by the retimer for 1 GbE, this yields a VCO frequency of 10.0 GHz.  
We compute the PPM count as NPPM = 10.0 X 1280 = 12,800. This is a decimal value. In hexadecimal, this is  
0x3200.  
The lower-order byte is loaded into register 0x60. The higher order byte, 0x32, is loaded into the 7 least-  
significant bits of register 0x61. In addition, bit 7 of register 0x61 is set, indicating manual load of the PPM count.  
When this is complete, register 0x60 will contain 0x00. Register 0x61 will contain 0xb2.  
For the example we are considering, Group 1 is for 10 GbE. Here the actual data rate for the 64/66B encoded 10  
GbE data is 10.3125 Gbps. For 10 GbE, the retimer automatically uses a divide ratio of 1, so the VCO frequency  
is also 10.3125 GHz. For 10 GbE, we compute the expected PPM count as NPPM = 10.3125 X 1280 = 13,200.  
Again, this is a decimal value. In hexadecimal, this is 0x3390.  
The lower order byte for Group 1, 0x90, is loaded into register 0x62. The higher-order byte, 0x33, is loaded into  
the 7 least-significant bits of register 0x63. As with the Group 0 settings, bit 7 of register 0x63 is also set.  
When this is complete, register 0x62 will contain 0x90. Register 0x63 will contain 0xb3.  
Finally, register 0x64 should be set to a value of 0xff. This is the PPM count tolerance. The resulting tolerance in  
parts per million is given by TolPPM = (1 X 10^-6 X NTOL) / NPPM. In this equation, NTOL is the 4-bit tolerance value  
loaded into the upper or lower four bits of register 0x64. For the example we are using here, both of these values  
are 0xf, or decimal 15. For a PPM count value of 12,800, for Group 0, this yields a tolerance of 1172 parts per  
million. For a PPM count value of 13,200, for Group 1, this yields a tolerance of 1136 parts per million.  
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These tolerance values can be reduced if it is known that the frequency accuracy of the system and of the 25  
MHz reference clock are very good. For most applications, however, a value of 0xff in register 0x64 will give  
robust performance.  
For all the other standards shown in Table 1 the expected PPM count for Group 0 (registers 0x60 and 0x61) and  
Group 1 (registers 0x62 and 0x63) will be set the same, since there is only one VCO frequency for these  
standards. The expected PPM count and tolerance are computed as described above for 10 GbE and 1 GbE.  
The same values are written to each pair of PPM count registers for these standards.  
As is the case with the standards-based mode of operation, the expected PPM count value and the PPM count  
tolerance must be written to registers 0x60, 0x61, 0x62, 0x63, and 0x64. These are computed exactly as  
described above for the standards-based mode of operation. Since the frequency-range-based mode of  
operation uses both Group 0 and Group 1 with the same expected PPM count, the same values should be  
loaded into the pairs of registers 0x60 and 0x62, and 0x61 and 0x63.  
As an example, suppose that the expected data rate is 8.5 Gbps. The VCO frequency for the frequency-range-  
based mode of operation is also 8.5 GHz. So we compute NPPM = 8.5 X 1280 = 10,880. This is a decimal value.  
In hexadecimal this is 0x2a80.  
We write the lower-order byte, 0x80 into registers 0x60 and 0x62. We write the higher order byte, 0x2a, into the  
least-significant 7 bits of registers 0x61 and 0x63. We also set bit 7 of registers 0x61 and 0x63. When this  
operation is complete, registers 0x60 and 0x62 will contain a value of 0x80. Registers 0x61 and 0x63 will contain  
a value of 0xaa.  
We also write the PPM tolerance into both the upper and lower four bits of register 0x64. If we write this register  
to a value of 0xff, then the PPM count tolerance in parts per million will be given by TolPPM = (1 X 10^-6 X NTOL) /  
NPPM = 1379 parts per million. This value will be appropriate for most systems.  
In summary, for data rates that correspond to the pre-defined standards for the DS110RT410, the standards-  
based mode of operation can be used. This mode offers automatic switching of the divide ratio (and, for 10 GbE  
and 1 GbE, the VCO frequency) to easily accommodate operation over harmonically-related data rates. For data  
rates that are not covered by the pre-defined standards, the frequency-range-based mode of operation can be  
used. This mode works with a fixed divider ratio, which is nominally 1. However, the divider ratio can be forced to  
other values if desired.  
The register configuration procedure is as follow:  
1. Select the desired channel of the DS110RT410 by writing the appropriate value to register 0xff.  
2. Set bits 5:4 of register 0x36 to a value of 2'b11 as described above to enable the 25 MHz reference clock.  
3. Write registers 0x2f, to set the dividers for group 0 and group 1.  
4. Compute the expected PPM count values for Group 0 and Group 1 as described above.  
5. Write the expected PPM count values into registers 0x60-0x63 as described above, setting bit 7 of both  
registers 0x61 and 0x63.  
6. Set the value 0xff into register 0x64 for an approximate PPM count tolerance of 1100-1400 PPM.  
7. Reset the retimer CDR by setting and then clearing bits 3:2 of register 0x0a.  
If there is a signal at the correct data rate present at the input to the DS110RT410, the retimer will lock to it.  
In ref_mode 3, bits 5:4 of register 0x36 are set to 2'b11, it is not necessary to set the CAP DAC values the  
DS110RT410 determines the correct CAP DAC values automatically.  
Because it is not necessary to set the CAP DAC values for Group 0 and Group 1 a-priori in ref_mode 3, the  
DS110RT410 can be set up to use automatically switching divider ratios and arbitrary VCO frequencies in this  
mode. The mapping of values in register 0x2f, bits 7:4, versus the divider ratios used for each of the two groups  
is shown in Table 2.  
Table 2. Divider Ratio Settings versus Register 0x2f Setting  
Register 0x2f, Bits 7:4  
4'b0000  
Divider Ratio Group 0  
Divider Ratio Group 1  
8
1
1
4'b0001  
1, 2, 4  
1, 2, 4  
2, 4  
4'b0010  
1, 2, 4  
2, 4  
4'b0100  
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Table 2. Divider Ratio Settings versus Register 0x2f Setting (continued)  
Register 0x2f, Bits 7:4  
Divider Ratio Group 0  
Divider Ratio Group 1  
4'b0101  
4'b0110  
4'b0111  
4'b1000  
4'b1010  
4'b1100  
4'b1101  
1, 4  
1, 4  
1, 2, 4, 8  
1, 2, 4, 8  
1
1
2
1
1
1
1
2
1
1
Note that for the entries in Table 2 where the divider ratios are the same for the two groups, the expected PPM  
count for the two groups does not have to be the same. Therefore, in ref_mode 3, a single set of register settings  
can be used to specify multiple VCO frequencies either with the same divider ratio or with different divider ratios.  
Ref_mode 3 Mode (reference clock required)  
Ref_mode 3 requires an external 25 MHz clock. This mode of operation is set in register 0x36 bits [5:4] = 2'b11  
and is the default setting. In ref_mode 3, the external reference clock is used to aid initial phase lock, and to  
determine when its VCO is properly phase-locked. An external oscillator should be used to generate a 2.5V, 25  
MHz reference signal which is connected to the DS110RT410 on the reference clock input pin (pin 19). The  
DS110RT410 does not include a crystal oscillator circuit, so a stand-alone external oscillator is required.  
The reference clock speeds up the initial phase lock acquisition. The DS110RT410 is set to phase lock to a  
known data rate, or a constrained set of known data rates, and the digital circuitry in the DS110RT410  
preconfigures the VCO frequency. This enables the DS110RT410 phase-lock to the incoming signal very quickly.  
The reference clock is used to calibrate the VCO coarse tuning. However, the reference clock is not synchronous  
to the data stream, and the quality of the reference clock does not affect the jitter on the output retimed data. The  
retimed data clock for each channel is synchronous to the VCO internal to that channel of the DS110RT410.  
The phase noise of the reference clock is not critical. Any commercially-available 25 MHz oscillator can provide  
an acceptable reference clock. The reference clock can be daisy-chained from one retimer to another so that  
only one reference oscillator is required in a system.  
False Lock Detector Setting  
The register 0x2F, bit 1 is set to 1 by default, which disables the false lock detector. This bit must be set to 0 to  
enable the false lock detector function.  
Reference Clock In  
REFCLK_IN pin 19 is for reference clock input. A 25 MHz oscillator should be connected to pin 19. See Electrical  
Characteristics for the requirements on the 25 MHz clock. The frequency of the reference clock should always be  
25 MHz no matter what data rate or mode of operation is used.  
Reference Clock Out  
REFCLK_OUT pin 42 is the reference clock output pin. The DS110RT410 drives a buffered replica of the 25  
MHz reference clock input on this output pin. If there are multiple DS100DF410 in the system, the REFCLK_OUT  
pin can be directly connected to the REFCLK_IN pin of another DS110RT410 in a daisy chain connection. With  
an input REFLCK_IN of 50/50 duty cycle, the REFCLK_OUT output from the buffer can have a slight duty cycle  
distortion of 46/54, which is about 1.6 ns duty cycle distortion for the 25 MHz clock (period = 40 ns). The number  
of daisy chain connection should be limited to 12 or less. If there are more device used in the system, the best  
option is to connect the external 25 MHz oscillator to a clock fanout buffer to distribute the 25 MHz clock to each  
DS110RT410, which would insures there is a reference clock for the DS110RT410.  
Driver Output Voltage  
The differential output voltage of the DS110RT410 can be configured from a nominal setting of 600 mV peak-to-  
peak differential to a nominal setting of 1.3 V peak-to-peak differential, depending upon the application. The  
driver output voltage as set is the typical peak-to-peak differential output voltage with no de-emphasis enabled.  
Driver Output De-Emphasis  
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The output de-emphasis level of the DS110RT410 can be configured from a nominal setting of 0 dB to a nominal  
setting of -12 dB depending upon the application. Larger absolute values of the de-emphasis setting provide  
more pre-distortion of the output driver waveform, accentuating the high-frequency components of the output  
driver waveform relative to the low-frequency components. Greater values of de-emphasis can compensate for  
greater dispersion in the transmission media at the output of the DS110RT410. The output de-emphasis level as  
set is the typical value to which the output signal will settle following the de-emphasis pulse interval in dB relative  
to the output VOD.  
Driver Output Rise/Fall Time  
In some applications, a longer rise/fall time for the output signal is desired. This can reduce electromagnetic  
interference (EMI) generated by fast switching waveforms. This is necessary in some applications for regulatory  
compliance. In others, it can reduce the crosstalk in the system.  
The DS110RT410 can be configured to operate with a nominal rise/fall time corresponding to the maximum slew  
rate of the output drivers into the load capacitance. Alternatively, the DS110RT410 can be configured to operate  
with a slightly greater rise/fall time if desired. For the typical specifications on rise/fall time, see Electrical  
Characteristics.  
INT  
The INT line is an open-drain, 3.3V tolerant, LVCMOS active-low output. The INT lines from multiple  
DS110RT410 can be wired together and connected to an external controller.  
The Horizontal Eye Opening/Vertical Eye Opening (HEO/VEO) interrupt can be enabled using SMBus control for  
each channel independently. This interrupt is disabled by default. The thresholds for horizontal and vertical eye  
opening that will trigger the interrupt can be set using the SMBus control for each channel.  
If any interrupt occurs, registers in the DS110RT410 latch in information about the event that caused the  
interrupt. This can then be read out by the controller over the SMBus.  
LOCK_3, LOCK_2, LOCK_1, and LOCK_0  
Each channel of the DS110RT410 has an independent lock indication pin. These lock indication pins, LOCK_3,  
LOCK_2, LOCK_1, and LOCK_0, are pin 16, pin 21, pin 40, and pin 45 respectively. These pins are shared with  
the SMBus address strap lines. After the address values have been latched in on power-up, these lines revert to  
their lock indication function.  
When the corresponding channel of the DS110RT410 is locked to the incoming data stream, the lock indication  
pin goes high. This pin can be used to drive an LED on the board, giving a visual indication of the lock status, or  
it can be connected to other circuitry which can interpret the lock status of the channel.  
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DEVICE CONFIGURATION MODES  
The DS110RT410 can be configured using two different methods.  
SMBus Master Configuration Mode  
SMBus Slave Configuration Mode  
The configuration mode is selected by the state of the SMBus Enable pin (pin 20) when the DS110RT410 is  
powered-up. This pin should be either left floating or tied to the device VDD through an optional 1Kresistor. The  
effect of each of these settings is shown in Table 3.  
Table 3. SMBus Enable Settings  
Pin Setting  
Configuration Mode  
Description  
Float  
SMBus Master Mode  
Device reads its configuration from an  
external EEPROM on power-up  
High (1)  
SMBus Slave Mode  
Device is configured over the SMBus by an  
external controller  
SMBus Master Mode and SMBus Slave Mode  
In SMBus master mode the DS110RT410 reads its initial configuration from an external EEPROM upon power-  
up. A description of the operation of this mode appears in a separate application note.  
Some of the pins of the DS110RT410 perform the same functions in SMBus master and SMBus slave mode.  
Once the DS110RT410 has finished reading its initial configuration from the external EEPROM in SMBus master  
mode it reverts to SMBus slave mode and can be further configured by an external controller over the SMBus.  
There are two pins that provide unique functions in SMBus master mode. These are as follows:  
ALL_DONE  
READ_EN  
These pins are meant to work together. When the DS110RT410 is powered up in SMBus master mode, it reads  
its configuration from the external EEPROM when the READ_EN pin goes low. When the DS110RT410 finish  
reading its configuration from the external EEPROM, it drives its ALL_DONE pin low. In this mode, as the name  
suggests, the DS100DF410 acts as an SMBus master during the time it is reading its configuration from the  
external EEPROM. After the DS110RT410 has finished reading its configuration from the EEPROM, it releases  
control of the SMBus and becomes a SMBus slave. In applications where there is more than one DS110RT410  
on the same SMBus, bus contention can result if more than one device tries to take command of the SMBus at  
the same time. The READ_EN and ALL_DONE pins prevent this bus contention.  
The system should be designed so that the READ_EN pin of the first device in the system is driven low on  
power-up. This first DS110RT410 will take command of the SMBus on power-up and will read its initial  
configuration from the external EEPROM. When it is finished reading its configuration, it will set its ALL_DONE  
pin low. This pin should be connected to the READ_EN pin of another DS110RT410. When this DS110RT410  
senses its READ_EN pin driven low, it will take command of the SMBus and read its initial configuration from the  
external EEPROM, after which it will set its ALL_DONE pin low. By connecting the ALL_DONE pin of each  
DS110RT410 to the READ_EN pin of the next DS110RT410, each DS110RT410 can read its initial configuration  
from the EEPROM without causing bus contention.  
For SMBus slave mode, the READ_EN pin must be tied low. Do not leave it floating or tie it high.  
A connection diagram showing several DS110RT410s along with an external EEPROM and an external SMBus  
master is shown in Figure 3 below. The SMBus master must be prevented from trying to take control of the  
SMBus until the DS110RT410s have finished reading their initial configurations from the EEPROM.  
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SDA  
SDC  
From External  
SMBus Master  
EEPROM  
DS110RT410  
DS110RT410  
Set to unique  
SMBus  
address  
Set to unique  
SMBus  
address  
One or both of these lines should  
float for an EEPROM larger than  
256 bytes  
DS110RT410  
DS110RT410  
DS110RT410  
Set to unique  
SMBus  
Set to unique  
SMBus  
Set to unique  
SMBus  
address  
address  
address  
Figure 3. Connection Diagram for Multiple DS110RT410s in SMBus Master Mode  
In SMBus master mode after the DS110RT410 has finished reading its initial configuration from the external  
EEPROM it reverts to SMBus slave mode. In either mode the SMBus data and clock lines, SDA and SDC, are  
used. Also, in either mode, the SMBus address is latched in on the address strap lines on power-up. In SMBus  
slave mode, if the READ_EN pin is not tied low, the DS110RT410 will not latch in the address on its address  
strap lines. It will instead latch in an SMBus write address of 0x30 regardless of the state of the address strap  
lines. This is a test feature. Obviously a system with multiple retimers cannot operate properly if all the retimers  
are responding to the same SMBus address. Tie the READ_EN pin low when operating in SMBus slave mode to  
avoid this condition.  
The DS110RT410 reads its SMBus address upon power-up from the SMBus address lines.  
Address Lines <ADDR_[3:0]>  
In either SMBus master or SMBus slave mode the DS110RT410 must be assigned an SMBus address. A unique  
address should be assigned to each device on the SMBus.  
The SMBus address is latched into the DS110RT410 on power-up. The address is read in from the state of the  
<ADDR_[3:0]> lines (pins 16, 21, 40, and 45 respectively) upon power-up. In either SMBus mode these address  
lines are input pins on power-up.  
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The DS110RT410 can be configured with any of 16 SMBus addresses. The SMBus addressing scheme uses the  
least-significant bit of the SMBus address as the Read/Write_N address bit. When an SMBus device is  
addressed for writing, this bit is set to 0; for reading, to 1. The table below shows the write address setting for the  
DS110RT410 versus the values latched in on the address lines at power-up.  
The address byte sent by the SMBus master over the SMBus is always 8 bits long. The least-significant bit  
indicates whether the address is for a write operation, in which the master will output data to the SMBus to be  
read by the slave, or a read operation, in which the slave will output data to the SMBus to be read by the master.  
if the least-significant bit is a 0, the address is for a write operation. If it is a 1, the address is for a read  
operation. Accordingly, SMBus addresses are sometimes referred to as seven-bit addresses. To produce the  
write address for the SMBus, the seven-bit address is left-shifted by one bit. To produce the read address, it is  
left shifted by one bit and the least-significant bit is set to 1. Table 4 shows the seven-bit addresses  
corresponding to each set of address line values.  
When the DS110RT410 is used in SMBus slave mode, the READ_EN pin must be tied low. If it is tied high or  
floating, the DS110RT410 will not latch in its address from the address lines on power-up. When the READ_EN  
pin is tied high in SMBus slave mode i.e. when the EN_SMB pin (pin 20) is tied high, the DS110RT410 will revert  
to an SMBus write address of 0x30. This is a test feature. If there are multiple DS110RT410 on the same  
SMBus, they will all revert to an SMBus write address of 0x30, which can cause SMBus collisions and failure to  
access the devices over the SMBus.  
Table 4. DS110RT410 SMBus Write Address Assignment  
ADDR_3  
ADDR_2  
ADDR_1  
ADDR_0  
SMBus Write  
Address  
Seven-bit SMBus  
Address  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0x30  
0x32  
0x34  
0x36  
0x38  
0x3a  
0x3c  
0x3e  
0x40  
0x42  
0x44  
0x46  
0x48  
0x4a  
0x4c  
0x4e  
0x18  
0x19  
0x1a  
0x1b  
0x1c  
0x1d  
0x1e  
0x1f  
0x20  
0x21  
0x22  
0x23  
0x24  
0x25  
0x26  
0x27  
Once the DS110RT410 has latched in its SMBus address, its registers can be read and written using the two  
pins of the SMBus interface, Serial Data (SDA) and Serial Data Clock (SDC).  
SDA and SDC  
In both SMBus master and SMBus slave mode, the DS110RT410 is configured using the SMBus. The SMBus  
consists of two lines, the SDA or serial data line (pin 18) and the SDC or serial clock line (pin 17). In the  
DS110RT410 these pins are 3.3V tolerant. The SDA and SDC lines are both open-drain. They require a pull-up  
resistor to a supply voltage, which may be either 2.5V or 3.3V. A pull-up resistor in the 2KΩ to 5KΩ range will  
provide reliable SMBus operation.  
The SMBus is a standard communications bus for configuring simple systems. For a specification of the SMBus  
an description of its operation, see http://smbus.org/specs/ .  
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REGISTER INFORMATION  
There are two types of device registers in the DS110RT410. These are the control/shared registers and the  
channel registers. The control/shared registers control or allow observation of settings which affect the operation  
of all channels of the DS110RT410. They are also used to select which channel of the device is to be the target  
channel for reads from and writes to the channel registers.  
The channel registers are used to set all the configuration settings of the DS110RT410. They provide  
independent control for each channel of the DS110RT410 for all the settable device characteristics.  
Any registers not described in the tables that follow should be treated as reserved. The user should not try to  
write new values to these registers. The user-accessible registers described in the tables that follow provide a  
complete capability for customizing the operation of the DS110RT410 on a channel-by-channel basis.  
Bit Fields in the Register Set  
Many of the registers in the DS110RT410 are divided into bit fields. This allows a single register to serve multiple  
purposes, which may be unrelated.  
Often configuring the DS110RT410 requires writing a bit field that makes up only part of a register value while  
leaving the remainder of the register value unchanged. The procedure for accomplishing this is to read in the  
current value of the register to be written, modify only the desired bits in this value, and write the modified value  
back to the register. Of course, if the entire register is to be changed, rather than just a bit field within the  
register, it is not necessary to read in the current value of the register first.  
In all the register configuration procedures described in the following sections, this procedure should be kept in  
mind. In some cases, the entire register is to be modified. When only a part of the register is to be changed,  
however, the procedure described above should be used.  
Writing to and Reading from the Control/Shared Registers  
Any write operation targeting register 0xff writes to the control/shared register 0xff. This is the only register in the  
DS110RT410 with an address of 0xff.  
Bit 2 of register 0xff is used to select either the control/shared register set or a channel register set. If bit 2 of  
register 0xff is cleared (written with a 0), then all subsequent read and write operations over the SMBus are  
directed to the control/shared register set. This situation persists until bit 2 of register 0xff is set (written with a 1).  
There is a register with address 0x00 in the control/shared register set, and there is also a register with address  
0x00 in each channel register set. If you read the value in register 0x00 when bit 2 of register 0xff is cleared to 0,  
then the value returned by the DS110RT410 is the value in register 0x00 of the control/shared register set. If you  
read the value in register 0x00 when bit 2 of register 0xff is set to 1, then the value returned by the DS110RT410  
is the value in register 0x00 of the selected channel register set. The channel register set is selected by bits 1:0  
of register 0xff.  
If bit 3 of register 0xff is set to 1 and bit 2 of register 0xff is also set to 1, then any write operation to any register  
address will write all the channel register sets in the DS110RT410 simultaneously. This situation will persist until  
either bit 3 of register 0xff or bit 2 of register 0xff is cleared. Note that when you write to register 0xff,  
independent of the current settings in register 0xff, the write operation ALWAYS targets the control/shared  
register 0xff. This channel select register, register 0xff, is unique in this regard.  
Table 5 shows the control/shared register set. Any register addresses or register bits in the control/shared  
register set not shown in this table should be considered reserved. In this table, the mode is either R for Read-  
Only, R/W for Read-Write, or R/W/SC for Read-Write-Self-Clearing. If you try to write to a Read-Only register, the  
DS110RT410 will ignore it.  
Table 5. Control/Shared Registers  
Address (Hex)  
0x00  
Bits  
7:4  
7:5  
4:0  
Default Value (Hex)  
Mode  
Description  
0x0  
R
R
R
SMBus Address Strap Observation <3:0>  
Device Revision  
0x01  
0x6  
0x10  
Device ID  
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Table 5. Control/Shared Registers (continued)  
Address (Hex)  
Bits  
6
Default Value (Hex)  
Mode  
R/W/SC  
R/W  
R/W  
R/W  
R
Description  
0x04  
0x0  
0x0  
0x0  
Self-Clearing Reset for Control/Shared Registers  
Reset for SMBus Master Mode  
Force EEPROM Configuration  
Disable Master Mode EEPROM Configuration  
EEPROM Read Complete  
5
4
0x05  
7
0x0  
(1)  
4
3
0x0  
0x0  
0x0  
0x0  
0X0  
R
Set on Channel 0 Interrupt  
2
R
Set on Channel 1 Interrupt  
1
R
Set on Channel 2 Interrupt  
0
R
Set on Channel 3 Interrupt  
0x06  
0xff  
3:0  
R/W  
Diagnostic Test Control  
Set to 0xa to read SMBus strap values from register 0x00  
3
2
0x0  
0x0  
W
W
Selects All Channels for Register Write  
See Table 6  
Enables Register Write to One or All Channels and Register Read  
from One Channel  
See Table 6  
1:0  
0x0  
W
Selects Target Channel for Register Reads and Writes  
See Table 6  
(1) There is no default value. This bit always indicates whether the EEPROM read is complete or not.  
SMBus Strap Observation  
Register 0x00, bits 7:4 and register 0x06, bits 3:0  
In order to communicate with the DS110RT410 over the SMBus, it is necessary for the SMBus controller to know  
the address of the DS110RT410 . The address strap observation bits in control/shared register 0x00 are primarily  
useful as a test of SMBus operation. There is no way to get the DS110RT410 to tell you what its SMBus address  
is unless you already know what it is.  
In order to use the address strap observation bits of control/shared register 0x00, it is necessary first to set the  
diagnostic test control bits of control/shared register 0x06. This four-bit field should be written with a value of 0xa.  
When this value is written to bits 3:0 of control/shared register 0x06, then the value of the SMBus address straps  
can be read in register 0x00, bits 7:4. The value read will be the same as the value present on the  
ADDR3:ADDR0 lines when the DS110RT410 was powered up. For example, if a value of 0x1 is read from  
control/shared register 0x00, bits 7:4, then at power-up the ADDR0 line was set to 1 and the other address lines,  
ADDR3:ADDR1, were all set to 0. The DS110RT410 is set to an SMBus Write address of 0x32.  
Device Revision and Device ID  
Register 0x01  
Control/shared register 0x01 contains the device revision and device ID. The device revision shown in Table 5 is  
the current revision for the DS110RT410. The device ID will be different for the different devices in the retimer  
family. The value shown in Register 0x01, bits 4:0 = 0x10 is the correct values for the DS110RT410. This  
register is useful because it can be interrogated by software to determine the device variant and revision installed  
in a particular system. The software might then configure the device with appropriate settings depending upon  
the device variant and revision.  
Control/Shared Register Reset  
Register 0x04, bit 6  
Register 0x04, bit 6, clears all the control/shared registers back to their factory defaults. This bit is self-clearing,  
so it is cleared after it is written and the control/shared registers are reset to their factory default values.  
Interrupt Channel Flag Bits  
Register 0x05, bits 3:0  
The operation of these bits is described in the section on interrupt handling later in this data sheet.  
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SMBus Master Mode Control Bits  
Register 0x04, bits 5 and 4 and register 0x05, bits 7 and 4  
Register 0x04, bit 5, can be used to reset the SMBus master mode. This bit should not be set if the  
DS110RT410 is in SMBus slave mode. This is an undefined condition.  
When this bit is set, if the EN_SMB pin is floating (meaning that the DS110RT410 is in SMBus master mode),  
then the DS110RT410 will read the contents of the external EEPROM when the READ_EN pin is pulled low. This  
bit is not self-clearing, so it should be cleared after it is set.  
When the DS110RT410 EN_SMB pin is floating (meaning that the device is in SMBus master mode), it will read  
from its external EEPROM when its READ_EN pin goes low. After the EEPROM read operation is complete,  
register 0x05, bit 4 will be set. Alternatively, the DS110RT410 will read from its external EEPROM when triggered  
by register 0x04, bit 4, as described below.  
When register 0x04, bit 4, is set, the DS110RT410 reads its configuration from an external EEPROM over the  
SMBus immediately. When this bit is set, the DS110RT410 does not wait until the READ_EN pin is pulled low to  
read from the EEPROM. This EEPROM read occurs whether the DS110RT410 is in SMBus master mode or not.  
If the read from the EEPROM is not successful, for example because there is no EEPROM present, then the  
DS110RT410 may hang up and a power-up reset may be necessary to return it to proper operation. You should  
only set this bit if you know that the EEPROM is present and properly configured.  
If the EEPROM read has already completed, then setting register 0x04, bit 4, will not have any effect. To cause  
the DS110RT410 to read from the EEPROM again it is necessary to set bit 5 of register 0x04, resetting the  
SMBus master mode. If the DS110RT410 is not in SMBus master mode, do not set this bit. After setting this bit,  
it should be cleared before further SMBus operations.  
After SMBus master mode has been reset, the EEPROM read may be initiated either by pulling the READ_EN  
pin low or by then setting register 0x04, bit 4.  
Register 0x05, bit 7, disables SMBus master mode. This prevents the DS110RT410 from trying to take command  
of the SMBus to read from the external EEPROM. Obviously this bit will have no effect if the EEPROM read has  
already taken place. It also has no effect if an EEPROM read is currently in progress. The only situations in  
which disabling EEPROM master mode read is valid are (1) when the DS110RT410 is in SMBus master mode,  
but the READ_EN pin has not yet gone low, and (2) when register 0x04, bit 5, has been used to reset SMBus  
master mode but the EEPROM read operation has not yet occurred.  
Do not set this bit and bit 4 of register 0x04 simultaneously. This is an undefined condition and can cause the  
DS110RT410 to hang up.  
Channel Select Register  
Register 0xff, bits 3:0  
Register 0xff, as described above, selects the channel or channels for channel register reads and writes. It is  
worth describing the operation of this register again for clarity. If bit 3 of register 0xff is set, then any channel  
register write applies to all channels. Channel register read operations always target only the channel specified in  
bits 1:0 of register 0xff regardless of the state of bit 3 of register 0xff. Read and write operations target the  
channel register sets only when bit 2 of register 0xff is set.  
Bit 2 of register 0xff is the universal channel register enable. This bit must be set in order for any channel register  
reads and writes to occur. If this bit is set, then read operations from or write operations to register 0x00, for  
example, target channel register 0x00 for the selected channel rather than the control/shared register 0x00. In  
order to access the control/shared registers again, bit 2 of register 0xff should be cleared. Then the  
control/shared registers can again be accessed using the SMBus. Write operations to register 0xff always target  
the register with address 0xff in the control/shared register set. There is no other register, and specifically, no  
channel register, with address 0xff.  
The contents of the channel select register, register 0xff, cannot be read back over the SMBus. Read operations  
on this register will always yield an invalid result. All eight bits of this register should always be set to the desired  
values whenever this register is written. Always write 0x0 to the four MSBs of register 0xff. The register set target  
selected by each valid value written to the channel select register is shown in Table 6  
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Table 6. Channel Select Register Values Mapped to Register Set Target  
Register 0xff Value (hex) Shared/Channel  
Register Selection  
Broadcast Channel  
Register Selection  
Targeted Channel  
Selection  
Comments  
0x00  
0x04  
0x05  
0x06  
0x07  
0x0c  
Shared  
N/A  
N/A  
All reads and writes target  
shared register set  
Channel  
Channel  
Channel  
Channel  
Channel  
No  
0
All reads and writes target  
channel 0 register set  
No  
1
All reads and writes target  
channel 1 register set  
No  
2
All reads and writes target  
channel 2 register set  
No  
3
All reads and writes target  
channel 3 register set  
Yes  
0
All writes target all  
channel register sets, all  
reads target channel 0  
register set  
0x0d  
0x0e  
0x0f  
Channel  
Channel  
Channel  
Yes  
Yes  
Yes  
1
2
3
All writes target all  
channel register sets, all  
reads target channel 1  
register set  
All writes target all  
channel register sets, all  
reads target channel 2  
register set  
All writes target all  
channel register sets, all  
reads target channel 3  
register set  
Reading to and Writing from the Channel Registers  
Each of the four channels has a complete set of channel registers associated with it. The channel registers or the  
control/shared registers are selected by channel select register 0xff. The settings in this register control the target  
for subsequent register reads and writes until the contents of register 0xff are explicitly changed by a register  
write to register 0xff. As noted, there is only one register with an address of 0xff, the channel select register.  
Table 7. Channel Registers  
Address (Hex) Bits  
Default Value (Hex) Mode  
Field Name  
Description  
0x00  
2
0x0  
R/W/SC rst_regs  
Reset Channel Registers to Defaults (Self-  
clearing)  
0x01  
4
0x0  
0x0  
0x0  
R
R
R
cdr_lock_loss_int  
signal_detect_loss_int  
cdr_status  
CDR Lock Loss Interrupt  
0
Signal Detect Loss Interrupt  
0x02  
7:0  
CDR Status [7:0]  
Bit[7] = PPM Count met  
Bit[6] = Auto Adapt Complete  
Bit[5] = Fail Lock Check  
Bit[4] = Lock  
Bit[3] = CDR Lock  
Bit[2] = Single Bit Limit Reached  
Bit[1] = Comp LPF High  
Bit[0] = Comp LPF Low  
0x03  
0x08  
7:6  
5:4  
3:2  
1:0  
4:0  
0x0  
0x0  
0x0  
0x0  
0x00  
R/W  
R/W  
R/W  
R/W  
R/W  
eq_BST0[1:0]  
CTLE Boost Stage 0 <1:0>  
eq_BST1[1:0]  
CTLE Boost Stage 1 <1:0>  
eq_BST2[1:0]  
CTLE Boost Stage 2 <1:0>  
eq_BST3[1:0]  
CTLE Boost Stage 3 <1:0>  
cdr_cap_dac_start[4:0]  
Override Starting VCO Cap DAC Setting 0 <4:0>  
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Table 7. Channel Registers (continued)  
Address (Hex) Bits  
Default Value (Hex) Mode  
Field Name  
Description  
0x09  
7
0x0  
R/W  
reg_divsel_vco_cap_ov  
Enable Override VCO Cap DAC (Registers 0x08  
and 0x0b)  
5
0x0  
0x0  
0x0  
0x0  
0x0f  
0x0  
0x0  
0x1  
0x0  
0x0  
0x0  
0x0  
0x0  
0x4  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
RW  
reg_bypass_pfd_ov  
reg_divsel_ov  
Enable Override Output Mux (Register 0x1e)  
Enable Override Divider Select (Register 0x18)  
Enable CDR Reset Override (Register 0x0a)  
CDR Reset Override Bit  
2
0x0a  
3
reg_cdr_reset_ov  
reg_cdr_reset_sm  
cdr_cap_dac_start1[4:0]  
2
0x0b  
0x0d  
0x11  
4:0  
5
Override VCO Cap DAC Setting 1 <4:0>  
PRBS_PATT_SHIFT_EN PRBS Generator Clock Enable  
7:6  
5
eom_sel_vrange[1:0]  
eom_PD  
Eye Opening Monitor Voltage Range <1:0>  
Eye Opening Monitor Power Down  
CTLE Boost Stage 3, Bit 2 (Limiting Bit)  
Force Signal Detect On  
0x13  
0x14  
2
eq_BST3[2]  
7
R/W  
R/W  
R/W  
R/W  
R/W  
eq_sd_preset  
eq_sd_reset  
6
Force Signal Detect Off  
0x15  
0x18  
6
drv_dem_range  
drv_dem[2:0]  
pdiq_sel_div[2:0]  
Driver De-emphasis Range  
2:0  
6:4  
Driver De-emphasis Setting<2:0>  
VCO Divider Ratio <2:0> (Enable from Register  
0x09, Bit 2)  
2
0x0  
0x7  
R/W  
R/W  
drv_sel_slow  
Enable Slow Rise/Fall Time on Output Driver  
0x1e  
7:5  
pfd_sel_data_mux[2:0]  
OutputMux <2:0> (Enable from Register 0x09, Bit  
5)  
4
7
7
0
0x0  
0x0  
0x0  
0x0  
R/W  
R/W  
R/W  
prbs_en  
Enable PRBS Generator  
0x1f  
drv_sel_inv  
fast_eom  
Select Output Polarity Inverted  
Enable Fast Eye Opening Monitor Mode  
0x24  
R/W/SC eom_start  
Start Eye Opening Monitor Counter (Self-  
Clearing)  
0x25  
0x26  
0x27  
0x28  
0x29  
7:0  
7:0  
7:0  
7:0  
6:5  
0x0  
0x0  
0x0  
0x0  
0x0  
R
R
R
R
R
eom_count[15:8]  
Eye Opening Monitor Count <15:8>  
Eye Opening Monitor Count <7:0>  
HEO Value <7:0>  
eom_count[7:0]  
heo[7:0]  
veo[7:0]  
VEO Value <7:0>  
eom_vrange_setting[1:0] Eye Opening Monitor Voltage Range Setting  
<1:0>  
0x2a  
0x2d  
0x2f  
7:0  
2:0  
7:6  
5:4  
3
0x30  
0x0  
0x0  
0x0  
0x0  
0x1  
0x1  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
eom_timer_thr[7:0]  
drv_sel_vod[2:0]  
RATE[1:0]  
Eye Opening Monitor Timer Threshold <7:0>  
Driver VOD <2:0>  
Rate <1:0> (see Table 1)  
SUBRATE[1:0]  
index_ov  
Subrate <1:0> (see Table 1)  
CTLE Adaptation Index Override (Register 0x13)  
Enable Frequency Counter for Lock Detect  
2
en_ppm_check  
en_fld_check  
1
False Lock Detector for lock detect is disabled by  
default. Must set bit to 0 to enable the FLD.  
0
0x0  
0x0  
0x0  
0x0  
0x1  
0x0  
0x1  
0x1  
0x8  
0x8  
R/W  
R
ctle_adapt  
Start CTLE Adaptation  
0x30  
4
heo_veo_interrupt  
prbs_en_dig_clk  
prbs_pattern_sel[1:0]  
adapt_mode[1:0]  
eq_sm_fom[1:0]  
heo_int_thresh[3:0]  
veo_int_thresh[3:0]  
heo_thresh[3:0]  
veo_thresh[3:0]  
Goes High if Interrupt from CDR Goes High  
PRBS Generator Enable  
3
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
1:0  
6:5  
4:3  
7:4  
3:0  
7:4  
3:0  
PRBS Generator Pattern Select <1:0>  
Adaptation Mode <1:0>  
0x31  
0x32  
0x33  
CTLE Adaptation Figure of Merit Type <1:0>  
HEO Interrupt Threshold <3:0>  
VEO Interrupt Threshold <3:0>  
HEO Threshold for CTLE Adaptation Handoff  
VEO Threshold for CTLE Adaptation Handoff  
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Table 7. Channel Registers (continued)  
Address (Hex) Bits  
Default Value (Hex) Mode  
Field Name  
Description  
0x36  
6
0x0  
0x3  
0x0  
0x1  
0x0  
R/W  
R/W  
R/W  
R/W  
R/W  
heo_veo_int_enable  
ref_mode[1:0]  
Enable HEO/VEO Interrupt  
Reference Clock Mode <1:0>  
5:4  
2
mr_cdr_cap_dac_rng_ov Enable Override for VCO Cap DAC Range  
mr_cdr_cap_dac_rng[1:0] Cap DAC Range <1:0>  
1:0  
4:0  
0x39  
0x3a  
start_index[4:0]  
Start Index for CTLE Adaptation <4:0> (Enable  
from Register 0x2f, Bit 3)  
7:6  
5:4  
3:2  
1:0  
7
0x2  
0x2  
0x1  
0x1  
0x1  
R/W  
R/W  
R/W  
R/W  
R/W  
fixed_eq_BST0[1:0]  
fixed_eq_BST1[1:0]  
fixed_eq_BST2[1:0]  
fixed_eq_BST3[1:0]  
Fixed CTLE Stage 0 Boost Setting for Lower Data  
Rates <1:0>  
Fixed CTLE Stage 1 Boost Setting for Lower Data  
Rates <1:0>  
Fixed CTLE Stage 2 Boost Setting for Lower Data  
Rates <1:0>  
Fixed CTLE Stage 3 Boost Setting for Lower Data  
Rates <1:0>  
0x3e  
HEO_VEO_LOCKMON_E Enable HEO/VEO Lock Monitoring  
N
0x40 – 0x5f  
0x60  
CTLE Settings for Adaptation – see Table 14  
7:0  
7
0x00  
0x0  
0x00  
0x00  
0x0  
0x00  
0x0  
0x0  
0x4  
0x4  
0x0  
0x0  
0x0  
0x0  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
grp0_ov_cnt[7:0]  
cnt_dlta_ov_0  
PPM count, Group 0, lower-order byte  
Override PPM count and delta for Group 0  
PPM count, Group 0, higher-order byte  
PPM count, Group 1, lower-order byte  
Override PPM count and delta for Group 1  
PPM count, Group 1, higher-order byte  
PPM count delta, Group 0  
0x61  
6:0  
7:0  
7
grp0_ov_cnt[14:8]  
grp1_ov_cnt[7:0]  
cnt_dlta_ov_1  
0x62  
0x63  
6:0  
7:4  
3:0  
7:4  
3:0  
7:0  
7:0  
7:0  
7
grp1_ov_cnt[14:8]  
grp0_ov_dlta[3:0]  
grp1_ov_dlta[3:0]  
veo_lck_thrsh[3:0]  
heo_lck_thrsh[3:0]  
fom_a[7:0]  
0x64  
0x6a  
PPM count delta, Group 1  
Vertical Eye Opening Lock Threshold <3:0>  
Horizontal Eye Opening Lock Threshold <3:0>  
Adaptation Figure of Merit Term a<7:0>  
Adaptation Figure of Merit Term b<7:0>  
Adaptation Figure of Merit Term c<7:0>  
0x6b  
0x6c  
0x6d  
0x6e  
fom_b[7:0]  
fom_c[7:0]  
en_new_fom_ctle  
Enable Alternate Figure of Merit for CTLE  
Adaptation  
0x70  
2:0  
0x3  
R/W  
eq_lb_cnt[2:0]  
CTLE Adaptation Look-Beyond Count <2:0>  
Resetting Individual Channels of the Retimer  
Register 0x00, bit 2, and register 0x0a, bits 3:2  
Bit 2 of channel register 0x00 are used to reset all the registers for the corresponding channel to their factory  
default settings. This bit is self-clearing. Writing this bit will clear any register changes you have made in the  
DS110RT410 since it was powered-up.  
To reset just the CDR state machine without resetting the register values, which will re-initiate the lock and  
adaptation sequence for a particular channel, use channel register 0x0a. Set bit 3 of this register to enable the  
reset override, then set bit 2 to force the CDR state machine into reset. These bits can be set in the same  
operation. When bit 2 is subsequently cleared, the CDR state machine will resume normal operation. If a signal  
is present at the input to the selected channel, the DS110RT410 will attempt to lock to it and will adapt its CTLE.  
Interrupt Status  
Control/Shared Register 0x05, bits 3:0, Register 0x01, bits 4 and 0, Register 0x30, bit 4, Register 0x32, and  
Register 0x36, bit 6  
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Each channel of the DS110RT410 will generate an interrupt under several different conditions. The DS110RT410  
will always generate an interrupt when it loses CDR lock or when a signal, once detected, is no longer detected  
at its input. If the HEO/VEO interrupt is enabled by setting bit 6 of register 0x36, then the retimer will generate an  
interrupt when the horizontal or vertical eye opening falls below the preset values even if the retimer remains  
locked. When one of these interrupt conditions occurs, the retimer alerts the system controller via hardware and  
provides additional details via register reads over the SMBus.  
First, the open-drain interrupt line INT is pulled low. This indicates that one or more of the channels of the retimer  
has generated an interrupt. The interrupt lines from multiple retimers can be wire-ANDed together so that if any  
retimer generates an interrupt the system controller can be notified using a single interrupt input.  
If the interrupt has occurred because the horizontal or vertical eye opening has dropped below the pre-set  
threshold, which is set in channel register 0x32, then bit 4 of register 0x30 will go high. This indicates that the  
source of the interrupt was the HEO or VEO.  
If the interrupt has occurred because the CDR has fallen out of lock, or because the signal is no longer detected  
at the input, then bit 4 and/or bit 0 of register 0x01 will go high, indicating the cause of the interrupt.  
In either case, the control/shared register set will indicate which channel caused the interrupt. This is read from  
bits 3:0 of control/shared register 0x05.  
When an interrupt is detected by the controller on the interrupt input, the controller should take the following  
steps to determine the cause of the interrupt and clear it.  
1. The controller detects the interrupt by detecting that the INT line has been pulled low by one of the retimers  
to which it is connected.  
2. The controller reads control/shared register 0x05 from all the DS110RT410s connected to the INT line. For at  
least one of these devices, at least one of the bits 3:0 will be set in this register.  
3. For each device with a bit set in bits 3:0 of control/shared register 0x05, the controller determines which  
channel or channels produced an interrupt. Refer to Table 5 for a mapping of the bits in this bit field to the  
channel producing the interrupt.  
4. When the controller detects that one of the retimers has a 1 in one of the four LSBs of this register, the  
controller selects the channel register set for that channel of that retimer by writing to the channel select  
register, 0xff, as previously described.  
5. For each channel that generated an interrupt, the controller reads channel register 0x01. If bit 4 of this  
register is set, then the interrupt was caused by a loss of CDR lock. If bit 0 is set, then the interrupt was  
caused by a loss of signal. it is possible that both bits 0 and 4 could be set. Reading this register will clear  
these bits.  
6. Optionally, for each channel that generated an interrupt, the controller reads channel register 0x30. If bit 4 of  
this register is set, then the interrupt was caused by HEO and/or VEO falling out of the configured range.  
This interrupt will only occur if bit 6 of channel register 0x36 is set, enabling the HEO/VEO interrupt. Reading  
register 0x30 will clear this interrupt bit.  
7. Once the controller has determined what condition caused the interrupt, the controller can then take the  
appropriate action. For example, the controller might reset the CDR to cause the retimer to re-adapt to the  
incoming signal. If there is no longer an incoming signal (indicated by a loss of signal interrupt, bit 0 of  
channel register 0x01), then the controller might alert an operator or change the channel configuration. This  
is system dependent.  
8. Reading the interrupt status registers will clear the interrupt. If this does not cause the interrupt input to go  
high, then another device on the same input has generated an interrupt. The controller can address the next  
device using the procedure above.  
9. Once all the interrupt registers for all channels for all DS110RT410s that generated interrupts have been  
read, clearing all the interrupt indications, the INT line should go high again. This indicates that all the  
existing interrupt conditions have been serviced.  
The channel registers referred to above, registers 0x01, 0x30, 0x32, and 0x36, are described in the channel  
registers table, Table 7.  
Overriding the CTLE Boost Setting  
Register 0x03, Register 0x13, bit 2, and Register 0x3a  
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To override the CTLE boost settings, register 0x03 is used. This register contains the currently-applied CTLE  
boost settings. The boost values can be overridden by using the two-bit fields in this register as shown in the  
table.  
The final stage of the CTLE has an additional control bit which sets it to a limiting mode. For some channels, this  
additional setting improves the bit error rate performance. This bit is bit 2 of register 0x13.  
If the DS110RT410 loses lock because of a change in the CTLE settings, the device will initiate its lock and  
adaptation sequence again. Thus, if you write new CTLE boost values to register 0x03 and 0x13 which cause the  
device to drop out of lock, the DS110RT410 may in the process of reacquiring the CDR lock, reset the CTLE  
settings to different values than those you set in register 0x03 and 0x13. If this behavior is not understood, it can  
appear that the DS110RT410 did not accept the values you wrote to the CTLE boost registers. What's really  
happening, however, is that the lock and adaptation sequence is overriding the CTLE values you wrote to the  
CTLE boost registers. This will not happen unless the DS110RT410 drops out of lock.  
If the adapt mode is set to 0 (bits 6:5 of channel register 0x31), then the CTLE boost values will not be  
overridden, but the DS110RT410 may still lose lock. If this happens, the device will attempt to reacquire lock.  
The DS110RT410 will begin searching for CDR lock at the highest allowable VCO divider ratio – that is, at the  
lowest configured bit rate. At divider values of 4 and 8, the CTLE boost settings used will come not from the  
values in register 0x03, and 0x13, but rather from register 0x3a, the fixed CTLE boost setting for lower data  
rates. This setting will be written into boost setting register 0x03 during the lock search process. This value may  
be different from the value you set in register 0x03, so, again, it may appear that the DS110RT410 has not  
accepted the CTLE boost settings you set in registers 0x03 and 0x13. The interactions of the lock and adaptation  
sequences with the manually-set CTLE boost settings can be difficult to understand.  
To manually override the CTLE boost under all conditions, perform the following steps.  
1. Set the DS110RT410 channel adapt mode to 0 by writing 0x0 to bits 6:5 of channel register 0x31.  
2. Set the desired CTLE boost setting in register 0x3a. If the DS110RT410 loses lock and attempts to lock to a  
lower data rate, it will use this CTLE boost setting.  
3. Set the desired CTLE boost setting in register 0x03.  
4. Set the desired CTLE boost setting in register 0x40.  
5. If desired, set the CTLE stage 3 limiting bit, bit 2 of register 0x13.  
If the DS110RT410 loses lock when the CTLE boost settings are set according to the sequence above, the  
DS110RT410 will try to reacquire lock, but it will not change the CTLE boost settings in order to do so.  
Overriding the VCO CAP DAC Values  
Register 0x08, bits 4:0, Register 0x09, bit 7, Register 0x0b, bits 4:0, Register 0x36, bits 5:4, and Register 0x2f,  
bits 7:6 and 5:4  
Registers 0x08 and 0x0b contain CAP DAC override values. Normally, when bits 5:4 of register 0x36 are set to  
2'b11, then the DS110RT410 performs an initial search to determine the correct CAP DAC setting (coarse VCO  
tuning) for the selected rate and subrate. The rate and subrate settings (bits 7:6 and 5:4 of register 0x2f)  
determine the frequency range to be searched, with the 25 MHz reference clock used as the frequency reference  
for the frequency search.  
The CAP DAC value can be overridden by writing new values to bits 4:0 of register 0x08 (for CAP DAC setting 1)  
and bits 4:0 of 0x0b (for CAP DAC setting 2). The override bit, bit 7 of register 0x09 must be set for the override  
CAP DAC values to take effect. Since some rate and subrate setting combinations apply to multiple data rates,  
there are two CAP DAC values for some rates. The first is in register 0x08, bits 4:0, and the second is in register  
0x0b, bits 4:0. The DS110RT410 will use the CAP DAC value in register 0x08 for the larger divide ratios  
associated with the selected rate and subrate to try and acquire lock. If it fails to acquire lock, it will use the CAP  
DAC value in register 0x0b with the smaller divide ratio (higher VCO frequency) associated with the selected rate  
and subrate. it will continue to try to acquire lock in this way until it either succeeds or the override bit (bit 7 of  
register 0x09) is cleared.  
Overriding the Output Multiplexer  
Register 0x09, bit 5, Register 0x14, bits 7:6, and Register 0x1e, bits 7:5  
By default, the DS110RT410 output for each channel will be as shown in Table 8.  
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Table 8. Default Output Status Description  
Input Signal Status  
Not Present  
Present  
Channel Status  
No Signal Detected  
Not Locked  
Output Status  
Muted  
Muted  
Present  
Locked  
Retimed Data  
This default behavior can be modified by register writes.  
Register 0x1e, bits 7:5, contain the output multiplexer override value. The values of this three-bit field and the  
corresponding meanings of each are shown in Table 9.  
Table 9. Output Multiplexer Override Settings  
Bit Field Value  
Output Multiplexer Setting  
Comments  
0x7  
Mute  
Default when no signal is present or when  
the retimer is unlocked  
0x6  
0x5  
N/A  
Invalid Setting  
10 MHz Clock  
Internal 10 MHz clock  
Clock frequency may not be precise, There is  
no production test coverage for this and is  
only use for testing.  
0x4  
0x3  
PRBS Generator  
VCO Q-Clock  
PRBS Generator must be enabled to output  
PRBS sequence  
Register 0x09, bit 4, and register 0x1e, bit 0,  
must be set to enable the VCO Q-Clock.  
There is no production test coverage for this  
and is only use for testing.  
0x2  
VCO I-Clock  
There is no production test coverage for this  
and is only use for testing.  
0x1  
0x0  
Retimed Data  
Raw Data  
Default when the retimer is locked  
Bypass the CDR, output is not retimed and  
must set bit 5 of register 0x09 and bit 7 of  
0x3F.  
If the output multiplexer is not overridden, that is, if bit 5 of register 0x09 is not set, then the value in register  
0x1e, bits 7:5, controls the output produced when the retimer has a signal at its input, but is not locked to it. The  
default value for this bit field, 0x7, causes the retimer output to mute when the retimer is not locked to an input  
signal. Writing a value of 0x0 to this bit field, for example, will cause the retimer to output raw data (not retimed)  
when it is not locked to its input signal.  
Set the override bit to 1, bit 5 of register 0x09, will cause the retimer to output the value selected by the bit field  
in register 0x1e, bits 7:5. In the raw data mode (CDR is bypassed), the register 0x3F, bit 7 should be set to 1,  
this will disable the fast cap re-search which stops the output from powering down (muting) during raw mode.  
When no signal is present at the input to the selected channel of the DS110RT410 the signal detect circuitry will  
power down the channel. This includes the output driver which is therefore muted when no signal is present at  
the input. If you want to get an output when no signal is present at the input, for example to enable a free-  
running PRBS sequence, the first step is to override the signal detect. In order to force the signal detect on, set  
bit 7 and clear bit 6 of channel register 0x14. Even if there is no signal at the input to the channel, the channel  
will be enabled. If the channel was disabled before, the current drain from the supply will increase by 100–150  
mA depending upon the other channel settings in the device. This increased current drain indicates that the  
channel is now enabled.  
The second step is to override the output multiplexer setting. This is accomplished by setting bit 5 of register  
0x09, the output multiplexer override. Once this bit is set, the value of register 0x1e, bits 7:5 will control the  
output of the channel. Note that if either retimed or raw data is selected, the output will just be noise. The device  
output may saturate to a static 1 or 0.  
If there is no signal, the VCO clock will be free-running. Its frequency will depend upon the divider and CAP DAC  
settings and it will vary from part to part and over temperature.  
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If the PRBS generator is enabled, the PRBS generator output can be selected. This can either be at a data rate  
determined by the free-running VCO or at a data rate determined by the input signal, if one is present. If a signal  
is present at the input and the DS110RT410 can lock to it, the output of the PRBS generator will be synchronous  
with the input signal, but the bit stream output will be determined by the PRBS generator selection.  
The 10 MHz clock is always available at the output when the output multiplexer is overridden. The 10 MHz clock  
is a free-running oscillator in the DS110RT410 and is not synchronous to the input or to anything else in the  
system. The clock frequency will be approximately 10 MHz, but this will vary from part to part.  
If there is a signal present at the input, it is not necessary to override the signal detect. Clearing bits 7 and 6 of  
register 0x14 will return control of the signal detect to the DS110RT410. Normally, when the retimer is locked to  
a signal at its input, it will output retimed data. However, if desired, the output multiplexer can be overridden in  
this condition to output raw data. It can also be set to output any of the other signals shown in Table 9. If there is  
an input signal, and if the DS110RT410 is locked to it, the VCO I-Clock, the VCO Q-Clock, and the output of the  
PRBS generator, if it is enabled, will be synchronous to the input signal.  
When a signal is present at the input, it might be desired to output the raw data in order to see the effects of the  
CTLE without the CDR. It might also be desired to enable the PRBS generator and output this signal, replacing  
the data content of the input signal with the internally-generated PRBS sequence.  
Overriding the VCO Divider Selection  
Register 0x09, bit 2, and Register 0x18, bits 6:4  
In standards-based operation, the DS110RT410 sets its VCO divider to the correct divide ratio, either 1, 2, 4, or  
8, depending upon the bit rate of the signal at the channel input. It is possible to override the divider selection.  
This might be desired for frequency-range-based operation, or if the VCO is set to free-run, or to output a signal  
at a sub-harmonic of the actual VCO frequency.  
In order to override the VCO divider settings, first set bit 2 of register 0x09. This is the VCO divider override  
enable. Once this bit is set, the VCO divider setting is controlled by the value in register 0x18, bits 6:4. The valid  
values for this three-bit field are 0x0 to 0x4. The mapping of the bit field values to the divider ratio is shown in  
Table 10.  
Table 10. Divider Ratio Mapping to Register 0x18, Bits 6:4  
Bit Field Value  
Divider Ratio  
0
1
2
3
4
1
2
4
8
16  
in standards-based operation, the DS110RT410 will determine the required VCO divider ratio automatically. The  
most common application for overriding the divider ratio is when the VCO is set to free-run. Normally the divider  
ratio should not be overridden except in this case.  
In Reference Mode 3, as shown in Table 2, the divider ratio can be automatically set by the DS110RT410 to  
multiple settings. This is useful for data rates which are harmonically-related.  
Using the PRBS Generator  
Register 0x0d, bit 5, Register 0x1e, bit 4, and Register 0x30, bit 3 and bits 1:0  
The DS110RT410 includes an internal PRBS generator which can generate standard PRBS-9 and PRBS-31 bit  
sequences. The PRBS generator can produce a PRBS sequence that is synchronous to the incoming data  
signal, or it can generate a PRBS sequence using the internal free-running VCO as a clock. Both modes of  
operation are described in the paragraphs that follow.  
To produce a PRBS sequence that is synchronized to the incoming data signal, the DS110RT410 must be  
locked to the incoming signal. When this is true, the signal detect is set and the channel is active. In addition, the  
VCO is locked to the incoming signal The VCO will remain locked to the incoming signal regardless of the state  
of the output multiplexer.  
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To activate the PRBS generator, first set bit 4 of register 0x1e. This bit enables the PRBS generator digital  
circuitry. Then reset the PRBS clock by clearing bit 3 of register 0x30. Select either PRBS-9 or PRBS-31 by  
setting bits 1:0 of register 0x30. Set this bit field to 0x0 for PRBS-9 and to 0x2 for PRBS-31. Then load the PRBS  
clock by setting bit 3 of register 0x30. Finally, enable the PRBS clock by setting bit 5 of register 0x0d. This  
sequence of register writes will enable the internal PRBS generator.  
As described above, to select the PRBS generator as the output for the selected channel, set bit 5 of register  
0x09, the output multiplexer override. Then write 0x4 to bits 7:5 of register 0x1e. This selects the PRBS  
generator for output.  
For the case described above, the output PRBS sequence will be synchronous to the incoming data. There are  
two other cases of interest. The first is when there is an input signal but the PRBS sequence should not be  
synchronous to it. In other words, in this case it is desired that the VCO should free-run. The second case is  
when there is no input signal, but the PRBS sequence should still be output. Again, in this case, the VCO is free-  
running.  
The register settings for these two cases are almost the same. The only difference is that, if there is no input  
signal, then the channel will be disabled and powered-down by default. In order to force enable the channel,  
write a 1 to bit 7 and a 0 to bit 6 of register 0x14. This forces the signal detect to be active and enables the  
selected channel.  
The remainder of the register write sequence is designed to disable the phase-locked loop so that the VCO can  
free run.  
First write a 1 to bit 3 of register 0x09, then 0x0 to bits 1:0 of register 0x1b. This disables the charge pump for  
the phase-locked loop.  
Next write a 1 to bit 2 of register 0x09. This enables the VCO divider override. Then set the VCO divider ratio by  
writing to register 0x18 as shown in Table 10. For an output frequency of approximately 10.3125 GHz, set the  
divider ratio to 1 by writing 0x0 to bits 6:4 of register 0x18. Do not clear bit 3 when you write a 1 to bit 2 of  
register 0x09.  
Now write a 1 to bit 7 of register 0x09. This enables the VCO CAP DAC override. Write the desired VCO cap  
count to register 0x08, bits 4:0. The mapping of VCO frequencies to cap count will vary somewhat from part to  
part. The VCO cap count should be set to 0x0c to yield an output VCO frequency of approximately 10.3125 GHz.  
Do not clear bits 3 and 2 when you write a 1 to bit 7 of register 0x09.  
Now write a 1 to bit 6 of register 0x09. This enables the VCO LPF DAC which can generate a VCO control  
voltage internally to the DS110RT410. Once the LPF DAC is enabled, write the desired value of the LPF DAC  
output in register 0x1f, bits 4:0. For an output VCO frequency of approximately 10.3125 GHz, set the LPF DAC  
setting to 0x12. Do not clear the remaining bits of register 0x09 when you write a 1 to bit 6.  
Now, as above, enable the PRBS generator and set it to the desired bit sequence, then select the output to be  
the PRBS generator by setting the output multiplexer. Notice that when this entire sequence has been  
completed, bits 7:2 of register 0x09 will all be set. The default value of register 0x09 is 0x00, so you can clear all  
the overrides when you are ready to return to normal operation by writing 0x00 to register 0x09.  
The VCO frequency in free-run will vary somewhat from part to part. In order to determine exact values of the  
CAP DAC and LPF DAC settings, it will be necessary to directly measure the VCO frequency using some sort of  
frequency-measurement device such as a frequency counter or a spectrum analyzer. When the VCO is set to  
free-run mode as above, you can select the VCO I-clock (in-phase clock) to be the output as shown in Table 9.  
You can measure the frequency of the VCO I-clock while adjusting the CAP DAC and LPF DAC values until the  
VCO I-clock frequency is acceptable for your application. Then you can once again select the PRBS generator  
as the output using the output multiplexer selection field.  
Using the Internal Eye Opening Monitor  
Register 0x11, bits 7:6 and bit 5, Register 0x22, bit 7, Register 0x24, bit 7 and bit 0, Register 0x25, Register  
0x26, Register 0x27, Register 0x28, Register 0x2a and Register 0x3e, bit 7  
The DS110RT410 includes an internal eye opening monitor. The eye opening monitor is used by the retimer to  
compute a figure of merit for automatic adaptation of the CTLE. It can also be controlled and queried through the  
SMBus by a system controller.  
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The eye opening monitor produces error hit counts for settable phase and voltage offsets of the comparator in  
the retimer. This is similar to the way many Bit Error Rate Test Sets measure eye opening. At each phase and  
amplitude offset setting, the eye opening monitor determines the nominal bit value (“0” or “1”) using its primary  
comparator. This is the bit value that is resynchronized to the recovered clock and presented at the output of the  
DS110RT410. The eye opening monitor also determines the bit value detected by the offset comparator. This  
information yields an eye contour. Here's how this works.  
If the offset comparator is offset in voltage by an amount larger than the vertical eye opening, for example, then  
the offset comparator will always decide that the current bit has a bit value of “0”. When the bit is really a “1”, as  
determined by the primary comparator, this is considered a bit error. The number of bit errors is counted for a  
settable interval at each setting of the offset phase and voltage of the offset comparator. These error counts can  
be read from registers 0x25 and 0x26 for sequential phase and voltage offsets. These error counts for all phase  
and voltage offsets form a 64 X 64 point array. A surface or contour plot of the error hit count versus phase and  
voltage offset produces an eye diagram, which can be plotted by external software.  
The eye opening monitor works in two modes. In the first, only the horizontal and vertical eye openings are  
measured. The eye opening monitor first sweeps its variable-phase clock through one unit interval with the  
comparison voltage set to the mid point of the signal. This determines the midpoint of the horizontal eye opening.  
The eye opening monitor then sets its variable phase clock to the midpoint of the horizontal eye opening and  
sweeps its comparison voltage. These two measurements determine the horizontal and vertical eye openings.  
The horizontal eye opening value is read from register 0x27 and the vertical eye opening from register 0x28.  
Both values are single byte values.  
The measurement of horizontal and vertical eye opening is very fast. The speed of this measurement makes it  
useful for determining the adaptation figure of merit. In normal operation, the HEO and VEO are automatically  
measured periodically to determine whether the DS110RT410 is still in lock. Reading registers 0x27 and 0x28  
will yield the most-recently measured HEO and VEO values.  
In normal operation, the eye monitor circuitry is powered down most of the time to save power. When the eye is  
to be measured under external control, it must first be enabled by writing a 0 to bit 5 of register 0x11. The default  
value of this bit is 1, which powers down the eye monitor except when it is powered-up periodically by the CDR  
state machine and used to test CDR lock. The eye monitor must be powered up to measure the eye under  
external SMBus control.  
Bits 7:6 of register 0x11 are also used during eye monitor operation to set the EOM voltage range. This is  
described below. A single write to register 0x11 can set both bit 5 and bits 7:6 in one operation.  
Register 0x3e, bit 7, enables horizontal and vertical eye opening measurements as part of the lock validation  
sequence. When this bit is set, the CDR state machine periodically uses the eye monitor circuitry to measure the  
horizontal and vertical eye opening. If the eye openings are too small, according to the pre-determined  
thresholds in register 0x6a, then the CDR state machine declares lock loss and begins the lock acquisition  
process again. For SMBus acquisition of the internal eye, this lock monitoring function must be disabled. Prior to  
overriding the EOM by writing a 1 to bit 0 of register 0x24, disable the lock monitoring function by writing a 0 to  
bit 7 of register 0x3e. Once the eye has been acquired, you can reinstate HEO and VEO lock monitoring by once  
again writing a 1 to bit 7 of register 0x3e.  
Under external SMBus control, the eye opening monitor can be programmed to sweep through all its 64 states of  
phase and voltage offset autonomously. This mode is initiated by setting register 0x24, bit 7, the fast_eom mode  
bit. Register 0x22, bit 7, the eom_ov bit, should be cleared in this mode.  
When the fast_eom bit is set, the eye opening monitor operation is initiated by setting bit 0 of register 0x24,  
which is self-clearing. As soon as this bit is set, the eye opening monitor begins to acquire eye data. The results  
of the eye opening monitor error counter are stored in register 0x25 and 0x26. In this mode the eye opening  
monitor results can be obtained by repeated multi-byte reads from register 0x25. It is not necessary to read from  
register 0x26 for a multi-byte read. As soon as the eight most significant bits are read from register 0x25, the  
eight least significant bits for the current setting are loaded into register 0x25 and they can be read immediately.  
As soon as the read of the eight most significant bits has been initiated, the DS110RT410 sets its phase and  
voltage offsets to the next setting and starts its error counter again. The result of this is that the data from the eye  
opening monitor is available as quickly as it can be read over the SMBus with no further register writes required.  
The external controller just reads the data from the DS110RT410 over the SMBus as fast as it can. When all the  
data has been read, the DS110RT410 clears the eom_start bit.  
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If multi-byte reads are not used, meaning that the device is addressed each time a byte is read from it, then it is  
necessary to read register 0x25 to get the MSB (the eight most significant bits) and register 0x26 to get the LSB  
(the eight least significant bits) of the current eye monitor measurement. Again, as soon as the read of the MSB  
has been initiated, the DS110RT410 sets its phase and voltage offsets to the next setting and starts its error  
counter again. In this mode both registers 0x25 and 0x26 must be read in order to get the eye monitor data. The  
eye monitor data for the next set of phase and voltage offsets will not be loaded into registers 0x25 and 0x26  
until both registers have been read for the current set of phase and voltage offsets.  
In all eye opening monitor modes, the amount of time during which the eye opening monitor accumulates eye  
opening data can be set by the value of register 0x2a. In general, the greater this value the longer the  
accumulation time. When this value is set to its maximum possible value of 0xff, the maximum number of  
samples acquired at each phase and amplitude offset is approximately 218. Even with this setting, the eye  
opening monitor values can be read from the SMBus with no delay. The eye opening monitor operation is  
sufficiently fast that the SMBus read operation cannot outrun it.  
The eye opening is measured at the input to the data comparator. At this point in the data path, a significant  
amount of gain has been applied to the signal by the CTLE. In many cases, the vertical eye opening as  
measured by the EOM will be on the order of 400 to 500 mV peak-to-peak. The secondary comparator, which is  
used to measure the eye opening, has an adjustable voltage range from ±100 mV to ±400 mV. The EOM voltage  
range is normally set by the CDR state machine during lock and adaptation, but the range can be overridden by  
writing a two-bit code to bits 7:6 of register 0x11. The values of this code and the corresponding EOM voltage  
ranges are shown in Table 11.  
Table 11. EOM Voltage Range vs. Bits 7:6 of Register 0x11  
Value in Bits 7:6 of Register 0x11  
EOM Voltage Range (± mV)  
0x0  
0x1  
0x2  
0x3  
±100  
±200  
±300  
±400  
Note that the voltage ranges shown in Table 11 are the voltage ranges of the signal at the input to the data path  
comparator. These values are not directly equivalent to any observable voltage measurements at the input to the  
DS110RT410 . Note also that if the EOM voltage range is set too small the voltage sweep of the secondary  
comparator may not be sufficient to capture the vertical eye opening. When this happens the eye boundaries will  
be outside the vertical voltage range of the eye measurement.  
To summarize, the procedure for reading the eye monitor data from the DS110RT410 is shown below.  
1. Select the DS110RT410 channel to be used for the eye monitor measurement by writing the channel select  
register, register 0xff, with the appropriate value as shown in Table 6. if the correct channel register set is  
already selected, this step may be skipped.  
2. Disable the HEO and VEO lock monitoring function by writing a 0 to bit 7 of register 0x3e.  
3. Select the eye monitor voltage range by setting bits 7:6 of register 0x11 according to the values in Table 11.  
The CDR state machine will have set this range during lock acquisition, but it may be necessary to change it  
to capture the entire vertical eye extent.  
4. Power up the eye monitor circuitry by clearing bit 5 of register 0x11. Normally the eye monitor circuitry is  
powered up periodically by the CDR state machine. Clearing bit 5 of register 0x11 enables the eye monitor  
circuitry unconditionally. This bit should be set again once the eye acquisition is complete. Clearing bit 5 and  
setting bits 7:6 of register 0x11 as desired can be combined into a single register write if desired.  
5. Clear bit 7 of register 0x22. This is the eye monitor override bit. It is cleared by default, so you may not need  
to change it.  
6. Set bit 7 of register 0x24. This is the fast eye monitor enable bit.  
7. Set bit 1 of register 0x24. This initiates the automatic fast eye monitor measurement. This bit can be set at  
the same time a bit 7 of register 0x24 if desired.  
8. Read the data array from the DS110RT410. This can be accomplished in two ways.  
If you are using multi-byte reads, address the DS110RT410 to read from register 0x25. Continue to read  
from this register without addressing the device again until you have read all the data desired. The  
read operation can be interrupted by addressing the device again and then resumed by reading once  
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again from register 0x25.  
If you are not using multi-byte reads, then read the MSB for each phase and amplitude offset setting from  
register 0x25 and the LSB for each setting from register 0x26. In this mode, you address the device each  
time you want to read a new byte.  
9. In either mode, the first four bytes do not contain valid data. These should be discarded.  
10. Continue reading eye monitor data until you have read the entire 64 X 64 array.  
11. Clear bit 7 of register 0x24. This disables fast eye monitor mode.  
12. Set bit 5 of register 0x11. This will return control of the eye monitor circuitry to the CDR state machine.  
13. Set bit 7 of register 0x3e. This re-enables the HEO and VEO lock monitoring.  
Enabling Slow Rise/Fall Time on the Output Driver  
Register 0x18, bit 2  
Normally the rise and fall times of the output driver of the DS110RT410 are set by the slew rate of the output  
transistors. By default, the output transistors are biased to provide the maximum possible slew rate, and hence  
the minimum possible rise and fall times. In some applications, slower rise and fall times may be desired. For  
example, slower rise and fall times may reduce the amplitude of electromagnetic interference (EMI) produced by  
a system.  
Setting bit 2 of register 0x18 will adjust the output driver circuitry to increase the rise and fall times of the signal.  
Setting this bit will approximately double the nominal rise and fall times of the DS110RT410 output driver. This bit  
is cleared by default.  
Inverting the Output Polarity  
Register 0x1f, bit 7  
In some systems, the polarity of the data does not matter. In systems where it does matter, it is sometimes  
necessary, for the purposes of trace routing, for example, to invert the normal polarities of the data signals.  
The DS110RT410 can invert the polarity of the data signals by means of a register write. Writing a 1 to bit 7 of  
register 0x1f inverts the polarity of the output signal for the selected channel. This can provide additional flexibility  
in system design and board layout.  
Overriding the Figure of Merit for Adaptation  
Register 0x31, bits 4:3, Register 0x6b, Register 0x6c, Register 0x6d, and Register 0x6e bit 7  
The default figure of merit for both the CTLE adaptation in the DS110RT410 is simple. The horizontal and  
vertical eye openings are measured for each CTLE boost setting. The vertical eye opening is scaled to a  
constant reference vertical eye opening and the smaller of the horizontal or vertical eye opening is taken as the  
figure of merit for that set of equalizer settings. The objective is to adapt the equalizer to a point where the  
horizontal and vertical eye openings are both as large as possible. This usually provides optimum bit error rate  
performance for most transmission channels.  
In some systems the adaptation can reach a better setting if only the horizontal or only vertical eye opening is  
used to compute the figure of merit rather than using both. This will be system-dependent and the user must  
determine through experiment whether this provides better adaptation in the user's system. For the  
DS110RT410, the CTLE figure of merit type can be set using register 0x31, bits 4:3. The value of this two-bit  
field versus the configured figure of merit type is shown in Table 12.  
Table 12. Figure of Merit Type Setting  
Register 0x31, bits 4:3  
Figure of Merit Type  
Not Valid  
0x0  
0x1  
0x2  
0x3  
Only HEO is used  
Only VEO is used  
Both HEO and VEO are used (default)  
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For some transmission media the adaptation can reach a better setting if a different figure of merit is used. The  
DS110RT410 includes the capability of adapting based on a configurable figure of merit. The configurable figure  
of merit is structured as shown in the equation below.  
FOM = (HEO – b) x a + (VEO – c) x (1 – a)  
In this equation, HEO is horizontal eye opening, VEO is vertical eye opening, FOM is the figure of merit, and the  
factors a, b, and c are set using registers 0x6b, 0x6c, and 0x6d respectively. The value of a is the 8-bit value in  
register 0x6b divided by 255. It therefore ranges from 0 to 1.  
In order to use the configurable figure of merit, the enable bits must be set. To use the configurable figure of  
merit for the CTLE adaptation, set bit 7 of register 0x6e, the en_new_fom_ctle bit.  
Setting the Adaptation/Lock Mode  
Register 0x31, bits 6:5, Register 0x3e, bit 7, and Register 0x6a  
There are four adaptation modes available in the DS110RT410.  
Mode 0: The user is responsible for setting the CTLE values. this mode is used if the transmission channel  
response is fixed.  
Mode 1: Only the CTLE is adapted to equalize the transmission channel. This mode is primarily used for  
smoothly-varying high-loss transmission channels such as cables and simple PCB traces.  
Bits 6:5 of register 0x31 determine the adaptation mode to be used. The mapping of these register bits to the  
adaptation algorithm is shown in Table 13.  
Table 13. DS110RT410 Adaptation Algorithm Settings  
Register 0x31, Bit 6  
adapt_mode[1]  
Register 0x31, Bit 5  
adapt_mode[0]  
Adapt Mode Setting <1:0>  
Adaptation Algorithm  
0
0
0
1
00  
01  
No Adaptation  
Adapt CTLE Until Optimum  
(Default)  
By default the DS110RT410 requires that the equalized internal eye exhibit horizontal and vertical eye openings  
greater than a pre-set minimum in order to declare a successful lock. The minimum values are set in register  
0x6a.  
The DS110RT410 continuously monitors the horizontal and vertical eye openings while it is in lock. If the eye  
opening falls below the threshold set in register 0x6a, the DS110RT410 will declare a loss of lock.  
The continuous monitoring of the horizontal and vertical eye openings may be disabled by clearing bit 7 of  
register 0x3e.  
Initiating Adaptation  
Register 0x24, bit 2, and Register 0x2f, bit 0  
When the DS110RT410 becomes unlocked, it will automatically try to acquire lock. If an adaptation mode is  
selected using bits 6:5 in register 0x31, the DS125RT410 will also try to adapt its CTLE.  
Adaptation can also be initiated by the user. CTLE adaptation can be initiated by setting and then clearing  
register 0x2f, bit 0.  
Overriding the CTLE Settings Used for CTLE Adaptation  
Register 0x2c, bits 3:0, Register 0x2f, bit 3, Register 0x39, bits 4:0, and Registers 0x50-0x5f  
The CTLE adaptation algorithm operates by setting the CTLE boost stage controls to a set of pre-determined  
boost settings, each of which provides progressively more high-frequency boost. At each stage in the adaptation  
process, the DS110RT410 attempts to phase lock to the equalized signal. If the phase lock succeeds, the  
DS110RT410 measures the horizontal and vertical eye openings using the internal eye monitor circuit. The  
DS110RT410 computes a figure of merit for the eye opening and compares it to the previous best value of the  
figure of merit. While the figure of merit continues to improve, the DS110RT410 continues to try additional values  
of the CTLE boost setting until the figure of merit ceases to improve and begins to degrade. When the figure of  
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merit starts to degrade, the DS110RT410 still continues to try additional CTLE settings for a pre-determined trial  
count called the “look-beyond” count, and if no improvement in the figure of merit results, it resets the CTLE  
boost values to those that produced the best figure of merit. The resulting CTLE boost values are then stored in  
register 0x03. The “look-beyond” count is configured by the value in register 0x2c, bits 3:0. The value is 0x2 by  
default.  
The set of boost values used as candidate values during CTLE adaptation are stored as bit fields in registers  
0x40-0x5f. The default values for these settings are shown in Table 14. These values may be overridden by  
setting the corresponding register values over the SMBus. If these values are overridden, then the next time the  
CTLE adaptation is performed the set of CTLE boost values stored in these registers will be used for the  
adaptation. Resetting the channel registers by setting bit 2 of channel register 0x00 will reset the CTLE boost  
settings to their defaults. So will power-cycling the DS110RT410.  
Table 14. CTLE Settings for Adaptation  
Register (Hex)  
Bits 7:6 (CTLE  
Stage 0)  
Bits 5:4 (CTLE  
Stage 1)  
Bits 3:2 (CTLE  
Stage 2)  
Bits 1:0 (CTLE  
Stage 3)  
CTLE Boost  
String  
CTLE Adaptation  
Index  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
4A  
4B  
4C  
4D  
4E  
4F  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
5A  
5B  
5C  
5D  
5E  
5F  
0
0
0
0
1
0
0
2
0
0
0
1
1
3
1
2
2
2
2
1
1
2
2
3
1
1
1
1
3
2
2
2
0
0
0
1
0
0
0
0
0
0
3
0
1
0
2
1
0
0
2
0
1
0
3
0
1
1
2
3
1
1
1
2
0
0
1
0
0
2
0
0
0
3
0
0
0
0
0
0
2
0
0
1
0
3
0
2
1
3
2
1
1
2
1
1
0
1
0
0
0
0
2
0
3
0
0
1
0
0
0
0
0
2
0
2
2
0
0
0
3
1
1
1
1
1
2
1
0000  
0001  
0010  
0100  
1000  
0020  
0002  
2000  
0003  
0030  
0300  
1001  
1100  
3000  
1200  
2100  
2020  
2002  
2200  
1012  
1102  
2030  
2300  
3020  
1113  
1131  
1221  
1311  
3111  
2121  
2112  
2211  
0
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
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As an alternative to, or in conjunction with, writing the CTLE boost setting registers 0x40 through 0x5f, it is  
possible to set the starting CTLE boost setting index. To override the default setting, which is 0, set bit 3 of  
register 0x2f. When this bit is set, the starting index for adaptation comes from register 0x39, bits 4:0. This is the  
index into the CTLE settings table in registers 0x40 through 0x5f. When this starting index is 0, which is the  
default, CTLE adaptation starts at the first setting in the table, the one in register 0x40, and continues until the  
optimum FOM is reached.  
Setting the Output Differential Voltage  
Register 0x2d, bits 2:0  
There are eight levels of output differential voltage available in the DS110RT410, from 0.6 V to 1.3 V in 0.1 V  
increments. The values drv_sel_vod[2:0] in bits 2:0 of register 0x2d set the output VOD. The available VOD  
settings and the corresponding values of this bit field are shown in Table 15.  
Table 15. VOD Settings  
Bit 2, drv_sel_vod[2]  
Bit 1, drv_sel_vod[1]  
Bit 0, drv_sel_vod[0]  
Selected VOD (V, peak-to-peak,  
differential)  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0.6  
0.7  
0.8  
0.9  
1.0  
1.1  
1.2  
1.3  
Setting the Output De-emphasis Setting  
Register 0x15, bits 2:0 and bit 6  
Fifteen output de-emphasis settings are available in the DS110RT410, ranging from 0 dB to -12 dB. The de-  
emphasis values come from register 0x15, bits 2:0, which make up the bit field dvr_dem<2:0>, and register 0x15,  
bit 6, which is the de-emphasis range bit.  
The available driver de-emphasis settings and the mapping to these bits are shown in Table 16.  
Table 16. Driver De-Emphasis Settings  
Register 0x15, Bit 2,  
dvr_dem[2]  
Register 0x15, Bit 1,  
drv_dem[1]  
Register 15, Bit 0,  
drv_dem[0]  
Register 0x15, Bit 6,  
drv_dem_range  
De-emphasis Setting  
(dB)  
0
0
0
0
0
1
0
1
1
0
1
1
1
1
1
0
0
0
1
1
0
1
0
1
1
1
0
0
1
1
0
1
1
0
1
0
0
1
0
1
1
0
1
0
1
X
1
0
1
1
1
0
1
1
0
1
0
0
0
0
0.0  
-0.9  
-1.5  
-2.0  
-2.8  
-3.3  
-3.5  
-3.9  
-4.5  
-5.0  
-5.6  
-6.0  
-7.5  
-9.0  
-12.0  
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PACKAGING INFORMATION  
Orderable Device  
DS110RT410SQ/NOPB  
DS110RT410SQE/NOPB  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
ACTIVE  
WQFN  
WQFN  
RHS  
48  
48  
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN  
Level-3-260C-168 HR  
110R410AB  
110R410AB  
ACTIVE  
RHS  
250  
Green (RoHS  
& no Sb/Br)  
Level-3-260C-168 HR  
-40 to 85  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
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14-Jun-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
DS110RT410SQ/NOPB WQFN  
DS110RT410SQE/NOPB WQFN  
RHS  
RHS  
48  
48  
1000  
250  
330.0  
178.0  
16.4  
16.4  
7.3  
7.3  
7.3  
7.3  
1.3  
1.3  
12.0  
12.0  
16.0  
16.0  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jun-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
DS110RT410SQ/NOPB  
DS110RT410SQE/NOPB  
WQFN  
WQFN  
RHS  
RHS  
48  
48  
1000  
250  
367.0  
213.0  
367.0  
191.0  
38.0  
55.0  
Pack Materials-Page 2  
MECHANICAL DATA  
RHS0048A  
SQA48A (Rev B)  
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