DS14C241MDC [TI]
IC,LINE TRANSCEIVER,CMOS,4 DRIVER,5 RCVR,DIE;
| 型号： | DS14C241MDC |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | IC,LINE TRANSCEIVER,CMOS,4 DRIVER,5 RCVR,DIE 驱动 |
| 文件： | 总8页 (文件大小：150K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
May 1998
DS14C241
Single Supply TIA/EIA-232 4 x 5 Driver/Receiver
General Description
The DS14C241 is four driver, five receiver device which con-
forms to the TIA/EIA-232-E standard and CCITT V.28 recom-
Features
n Conforms to TIA/EIA-232-E and CCITT V.28
n Internal DC–DC converter
±
mendations. This device eliminates 12V supplies by em-
n Operates with single +5V supply
n Low power requirement — ICC 10 mA max
n Shutdown mode — ICX 10 µA max
n Internal driver slew rate control
n Receiver noise filtering
n Operates above 120 kbits/sec
n TRI-STATE receiver outputs
n Direct replacement for MAX241
ploying an internal DC–DC converter to generate the
necessary output levels from a single +5V supply. Driver
slew rate control and receiver noise filtering have also been
internalized to eliminate the need for external slew rate con-
trol and noise filtering capacitors. With the addition of TRI-
STATE®receiver outputs and
a shutdown mode, device
power consumption is kept to a minimum.
Connection Diagram
Functional Diagram
DS011281-1
Order Number DS14C241WM
See NS Package Number M28B
DS011281-2
TRI-STATE® is a registered trademark of National Semiconductor Corporation.
© 1998 National Semiconductor Corporation
DS011281
www.national.com
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Storage Temperature Range
−65˚C to +150˚C
Lead Temperature (Soldering, 4
sec.)
+260˚C
Short Circuit Duration (DOUT
)
continuous
ESD Rating (HBM, 1.5 kΩ, 100
Supply Voltage (VCC
)
−0.3V to +6V
(VCC − 0.3V) to +15V
+0.3V to −15V
pF)
≥ 2.0 kV
V+ Pin
V− Pin
Recommended Operating
Conditions
Driver Input Voltage
−0.3V to (VCC + 0.3V)
(V+ + 0.3V) to (V− − 0.3V)
Driver Output Voltage
Min
Max
Units
±
Receiver Input Voltage
30V
Supply Voltage (VCC
)
4.5
5.5
V
Receiver Output Voltage
Junction Temperature
−0.3V to (VCC + 0.3V)
+150˚C
Operating Free Air Temp. (TA)
DS14C241
0
+70
˚C
Maximum Package Power Dissipation
@
+25˚C (Note 6)
WM Package
1520 mW
Electrical Characteristics (Note 2)
Over recommended operating conditions, unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DEVICE CHARACTERISTICS
V+
V−
ICC
ICX
VIH
VIL
IIH
Positive Power Supply
Negative Power Supply
RL = 3 kΩ, C1–C4 = 1.0 µF, DIN = 0.8V
9.0
−8.0
8.5
V
V
RL = 3 kΩ, C1–C4 = 1.0 µF, DIN = 2.0V
Supply Current (VCC
)
No Load
10
10
mA
µA
V
Supply Current Shutdown
High Level Enable Voltage
Low Level Enable Voltage
High Level Enable Current
Low Level Enable Current
RL = 3 kΩ, SD = VCC
1.0
SD
2.4
VCC
0.8
+10
+10
GND
−10
V
µA
µA
IIL
−10
DRIVER CHARACTERISTICS
VIH
VIL
IIH
High Level Input Voltage
DIN
2.0
GND
−10
−10
5.0
VCC
0.8
V
V
Low Level Input Voltage
High Level Input Current
Low Level Input Current
High Level Output Voltage
Low Level Output Voltage
Output High Short Circuit Current
Output Low Short Circuit Current
Output Resistance
VIN ≥ 2.0V
VIN ≤ 0.8V
RL = 3 kΩ
+10
+10
µA
µA
V
IIL
VOH
VOL
7.5
−6.5
−15
12
−5.0
−5.0
30
V
IOS
IOS
RO
+
VO = 0V, VIN = 0.8V
−30
5.0
mA
mA
Ω
−
VO = 0V, VIN = 2.0V
−2V ≤ VO ≤ +2V, VCC = GND = 0V
300
RECEIVER CHARACTERISTICS
VTH
VTL
VHY
RIN
IIN
Input High Threshold Voltage
1.9
1.5
0.4
4.5
3.8
0.6
2.4
V
V
Input Low Threshold Voltage
Hysteresis
0.8
0.2
1.0
7.0
5.0
1.0
V
Input Resistance
Input Current
3.0
kΩ
mA
mA
mA
mA
V
VIN = +15V
2.14
0.43
−1.0
−5.0
3.5
VIN = +3V
VIN = −3V
−0.6 −0.43
−3.8 −2.14
4.6
VIN = −15V
VOH
High Level Output Voltage
Low Level Output Voltage
VIN = −3V, IO = −3.2 mA
VIN = −3V, IO = −20 µA
VIN = +3V, IO = +2.0 mA
4.0
4.9
V
VOL
0.25
0.4
V
www.national.com
2
Electrical Characteristics (Note 2) (Continued)
Over recommended operating conditions, unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Units
RECEIVER CHARACTERISTICS
VIH
VIL
IIH
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Output Leakage Current
EN
2.0
GND
−10
−10
−10
VCC
0.8
V
V
VIN ≥ 2.0V
VIN ≤ 0.8V
+10
+10
+10
µA
µA
µA
IIL
IOZ
EN = VCC, 0V ≤ ROUT ≤ VCC
Switching Characteristics (Note 4)
Over recommended operating conditions, unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DRIVER CHARACTERISTICS
tPLH
tPHL
tSK
Propagation Delay LOW to HIGH
Propagation Delay HIGH to LOW
Skew |tPLH–tPHL
RL = 3 kΩ
0.7
0.6
0.1
15
4.0
4.0
1.0
30
µs
µs
CL = 50 pF
(Figures 1, 2)
|
µs
SR1
SR2
Output Slew Rate
Output Slew Rate
RL = 3 kΩ to 7 kΩ, CL = 50 pF
RL = 3 kΩ, CL = 2500 pF
4.0
3.0
V/µs
V/µs
5.0
RECEIVER CHARACTERISTICS
>
tPLH
tPHL
tSK
Propagation Delay LOW to HIGH
Propagation Delay HIGH to LOW
Skew |tPLH–tPHL
Input Pulse Width 10 µs
CL = 50 pF
(Figures 3, 4)
2.0
2.8
0.8
0.1
0.6
0.2
0.6
2.5
6.5
6.5
2.0
2.0
2.0
2.0
2.0
1.0
µs
µs
µs
µs
µs
µs
µs
µs
|
tPLZ
tPZL
tPHZ
tPZH
tNW
(Figures 5, 7)
(Figures 5, 6)
(Figures 3, 4)
Noise Pulse Width Rejected
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise speci-
fied.
Note 3:
I + and I − values are for one output at a time. If more than one output is shorted simultaneously, the device power dissipation may be exceeded.
OS OS
Note 4: Receiver AC input waveform for test purposes: t = t = 200 ns, V = 3V, V = −3V, f = 64 kHz (128 kbits/sec). Driver AC input waveform for test purposes:
IH IL
r
f
t
= t ≤ 10 ns, V = 3V, V = 0V, f = 64 kHz (128 kbits/sec).
IH IL
r
f
Note 5: All typicals are given for V
CC
= 5.0V and T = +25˚C.
A
Note 6: Ratings apply to ambient temperature at +25˚C. Above this temperature derate: WM package 14.3 mW/˚C.
Parameter Measurement Information
DS011281-4
FIGURE 1. Driver Load Circuit
3
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Parameter Measurement Information (Continued)
DS011281-5
FIGURE 2. Driver Switching Waveform
DS011281-6
FIGURE 3. Receiver Load Circuit
DS011281-7
FIGURE 4. Receiver Propagation Delays and Noise Rejection
DS011281-8
FIGURE 5. Receiver Disable Load Circuit
DS011281-9
FIGURE 6. Receiver TRI-STATE Timing (tPHZ, tPZH
)
www.national.com
4
Parameter Measurement Information (Continued)
DS011281-10
FIGURE 7. Receiver TRI-STATE Timing (tPLZ, tPZL
)
D
IN 1–4 (pins 7, 6, 20 and 21) — Driver input pins are TTL/
Pin Descriptions
CMOS compatible. Inputs of unused drivers may be left
open, an internal pull-up resistor (500 kΩ minimum, typically
5 MΩ) pulls input to VCC. Output will be LOW for open inputs.
VCC (pin 11) — Power supply pin for the device,
±
+5V ( 10%).
V+ (pin 13) — Positive supply for TIA/EIA-232-E drivers.
Recommended external capacitor: C4 = 1.0 µF (6.3V). This
supply is not intended to be loaded externally.
V− (pin 17) — Negative supply for TIA/EIA-232-E drivers.
Recommended external capacitor: C3 = 1.0 µF (16V). This
supply is not intended to be loaded externally.
DOUT 1–4 (pins 2, 3, 1 and 28) — Driver output pins con-
form to TIA/EIA-232-E levels.
R
IN 1–5 (pins 9, 4, 27, 23 and 18) — Receiver input pins ac-
±
cept TIA/EIA-232-E input voltages ( 15V). Receivers fea-
ture a noise filter and guaranteed hysteresis of 200 mV. Un-
used receiver input pins may be left open. Internal input
resistor (5 kΩ) pulls input LOW, providing a failsafe HIGH
output.
C1+, C1− (pins 12 and 14) — External capacitor connection
pins. Recommended capacitor — 1.0 µF (6.3V).
C2+, C2− (pins 15 and 16) — External capacitor connection
pins. Recommended capacitor — 1.0 µF (16V).
R
OUT 1–5 (pins 8, 5, 26, 22 and 19) — Receiver output pins
are TTL/CMOS compatible. Receiver output HIGH voltage is
specified for both CMOS and TTL load conditions.
EN (pin 24) — Controls the Receiver output TRI-STATE Cir-
cuit. A HIGH level on this pin will disable the Receiver Out-
put.
GND (pin 10) — Ground pin.
SHUTDOWN (SD) (pin 25) — A High on the SHUTDOWN
pin will lower the total ICC current to less than 10 µA. Provid-
ing a low power state.
Typical Performance Characteristics
Slew Rate vs Cap. Load vs VCC
(Four Drivers)
Slew Rate vs Temperature vs
Cap. Load (Four Drivers Switching)
DS011281-11
DS011281-12
5
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Typical Performance Characteristics (Continued)
Slew Rate vs Cap. Load vs VCC
(One Driver)
Slew Rate vs Temperature vs
Cap. Load (One Driver Switching)
DS011281-13
DS011281-14
Driver Slew Rate vs Cap. Load
vs Number of Drivers
DS011281-15
DS011281-16
FIGURE 8. Driver Shutdown (SD) Delay Test Circuit
www.national.com
6
Typical Performance Characteristics (Continued)
DS011281-17
FIGURE 9. Driver Shutdown (SD) Delay Timing Waveforms
Typical data only.
Symbol
Parameter
Conditions
VCC = 5V (Notes 7, 8)
TA = 25˚C
Typ
124
110
114
97
Units
tPHS
Propagation Delay High to SD
Propagation Delay Low to SD
Propagation Delay SD to High
Propagation Delay SD to Low
µs
µs
µs
µs
tPLS
tPSH
tPSL
Note 7: Sample size = 10 parts; 3 different datecodes.
Note 8: All drivers are loaded as shown in Figure 8 .
7
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Physical Dimensions inches (millimeters) unless otherwise noted
Order Number DS14C241WM
NS Package Number M28B
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DE-
VICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMI-
CONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or sys-
tems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose fail-
ure to perform when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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