DS14C535MSA/NOPB [TI]
5V Supply EIA/TIA-232 3 x 5 Driver/Receiver;
| 型号： | DS14C535MSA/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 5V Supply EIA/TIA-232 3 x 5 Driver/Receiver |
| 文件： | 总14页 (文件大小：796K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS14C535
www.ti.com
SNLS092C –MAY 1998–REVISED APRIL 2013
DS14C535 +5V Supply EIA/TIA-232 3 x 5 Driver/Receiver
Check for Samples: DS14C535
1
FEATURES
DESCRIPTION
The DS14C535 is three driver, five receiver device
which conforms to EIA/TIA-232-E and CCITT (ITU-T)
V.28 standard specifications. This device employs an
internal DC-DC converter to generate the necessary
2
•
•
Pin Compatible with DS14C335
Conforms to EIA/TIA-232-E and CCITT (ITU-T)
V.28 Specifications
•
Failsafe Receiver Outputs High When Inputs
Open
output levels from
a
+5V power supply.
A
SHUTDOWN (SD) mode reduces the supply current
to 10 μA maximum. In the SD mode, one receiver is
active, allowing ring indicator (RI) to be monitored.
PC Board space consumption is minimized by the
availability of Shrink Small Outline Packaging
(SSOP).
•
•
•
•
•
Operates with Single +5V Power Supply
Low Power Requirement—ICC 12 mA Maximum
SHUTDOWN Mode—ICX 10 μA Maximum
One Receiver (R5) Active During SHUTDOWN
The DS14C535 provides a one-chip solution for the
common 9-pin serial RS-232 interface between data
terminal and data circuit-terminating equipment.
Operates up to 128 kbps—Lap-Link
Compatible
•
•
•
4V/μs Minimum Slew Rate Ensured
This device allows an easy migration path to the 3.3V
DS14C335. The packages are the same. The N/C
pins on the DS14C535 are not physically connected
to the chip. Board layout for the DS14C335 will
accommodate both devices.
ESD Rating of 3 kV on All Pins (H, B, M)
Available in 28-lead SSOP EIAJ Type II
Package
•
Only Four 0.1 μF Capacitors Required for the
DC-DC Converter
This device's low power requirement and small
footprint makes it an ideal choice for Laptop and
Notebook applications.
Connection Diagram
Top View
Figure 1. 28-Lead SSOP
See DB Package
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS14C535
SNLS092C –MAY 1998–REVISED APRIL 2013
www.ti.com
Functional Diagram
Figure 2.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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DS14C535
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SNLS092C –MAY 1998–REVISED APRIL 2013
Absolute Maximum Ratings(1)(2)
Supply Voltage (VCC
V+ Pin
V− Pin
)
−0.3V to +6V
(VCC − 0.3V) to +14V
+0.3V to −14V
−0.3V to +5.5V
(V+ +0.3V) to (V− − 0.3V)
±25V
Input Voltage (DIN, SD)
Driver Output Voltage
Receiver Input Voltage
Receiver Output Voltage
Junction Temperature
− 0.3V to (VCC +0.3V)
+150°C
Storage Temperature Range
Lead Temperature (Soldering 4 sec.)
−65°C to +150°C
+260°C
Short Circuit Duration (DOUT
)
Continuous
Maximum Package Power Dissipation @ +25°C
SSOP DB Package
1286 mW
10.3 mW/°C above +25°C
≥ 3.0 kV
Derate DB Package
ESD Rating (HBM, 1.5 kΩ, 100 pF)
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be specified. They are not meant to imply
that the devices should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Recommended Operating Conditions
Min
Max
Units
Supply Voltage (VCC
)
4.5
5.5
V
Operating Free Air Temperature (TA)
DS14C535
0
+70
°C
Electrical Characteristics(1)(2)
Over recommended operating conditions, SD = 0.8V, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DEVICE CHARACTERISTICS
V+
V−
ICC
ICX
VIH
VIL
IIH
Positive Power Supply
Negative Power Supply
Supply Current
No Load
DIN = 0.8V
DIN = 2.0V
+8.5
V
V
C1–C4 = 0.1 μF
No Load
−7.0
12
10
mA
μA
V
SHUTDOWN Supply Current
High Level Enable Voltage
Low Level Enable Voltage
High Level Enable Current
Low Level Enable Current
RL = 3 kΩ, SD = VCC
1.0
SD
2.0
GND
0.8
V
2.0V ≤ VIN ≤ 5.5V
GND ≤ VIN ≤ 0.8V
+2.0
μA
μA
IIL
−2.0
DRIVER CHARACTERISTICS
VIH
VIL
IIH
High Level Input Voltage
DIN
2.0
V
V
Low Level Input Voltage
High Level Input Current
Low Level Input Current
High Level Output Voltage
Low Level Output Voltage
Output High Short Circuit Current
GND
0.8
2.0V ≤ VIN ≤ 5.5V
GND ≤ VIN ≤ 0.8V
RL = 3 kΩ
+1.0
μA
μA
V
IIL
−1.0
VOH
VOL
IOS+
+5.0
8
−6.7
−20
−5.0
−8
V
VO = 0V, VIN = 0.8V(3)
−40
mA
(1) Typical values are given for VCC = 5V and TA = +25°C.
(2) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
unless otherwise specified. For voltage logic levels, the more positive value is designated as maximum. For example, if −5V is a
maximum, the typical value (−6.7V) is more negative.
(3) Only one driver output shorted at a time.
Copyright © 1998–2013, Texas Instruments Incorporated
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Electrical Characteristics(1)(2) (continued)
Over recommended operating conditions, SD = 0.8V, unless otherwise specified.
Symbol
IOS−
RO
Parameter
Output Low Short Circuit Current
Output Resistance
Conditions
VO = 0V, VIN = 2.0V(3)
Min
6
Typ
15
Max
Units
mA
Ω
40
−2V ≤ VO ≤ +2V, VCC = GND = 0V
300
1200
RECEIVER CHARACTERISTICS(4)
VTH
VTL
Input High Threshold Voltage
Input Low Threshold Voltage
R1–R5, SD = 0.8V (Active Mode)
1.4
2.0
1.1
1.1
2.4
2.8
V
V
R5, 2.0V ≤ SD ≤ 5.5V (Shutdown Mode)
R1–R5, SD = 0.8V (Active Mode)
0.8
0.8
V
R5, 2.0V ≤ SD ≤ 5.5V (Shutdown Mode)
V
VHY
RIN
IIN
Hysteresis(4)
0.15
3.0
1.0
7.0
V
Input Resistance
Input Current
VIN = ±3V to ±15V
VIN = +15V
5.4
kΩ
mA
mA
mA
mA
V
2.14
0.43
−1.0
−5.0
3.8
5.0
VIN = +3V
1.0
VIN = −3V
−0.43
−2.14
VIN = −15V
VOH
High Level Output Voltage
Low Level Output Voltage
VIN = −3V, IOH = −2.0 mA
VIN = −3V, IOH = −20 μA
VIN = +3V, IOL = +2.0 mA
4.0
V
VOL
0.23
0.4
V
(4) Receiver characteristics are ensured for SD = 0.8V. When SD = 2.0V, receiver five (R5) is active and meets receiver parameters in
SHUTDOWN (SD) mode, unless otherwise specified.
Switching Characteristics(1)
Over recommended operating conditions, SD = 0.8V, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DRIVER CHARACTERISTICS
tPLH
tPHL
tSK
Propagation Delay LOW to HIGH
Propagation Delay HIGH to LOW
Skew |tPLH–tPHL
RL = 3 kΩ
CL = 50 pF
(See Figure 3 and Figure 4)
0.1
0.1
0.6
0.6
0
1.0
1.0
0.2
30
μs
μs
|
μs
SR1
SR2
tPLS
tPSL
tPHS
tPSH
Output Slew Rate
RL = 3 kΩ to 7 kΩ, CL = 50 pF (See Figure 4)
RL = 3 kΩ, CL = 2500 pF (See Figure 4)
(See Figure 7 and Figure 8)
4
4
13
V/μs
V/μs
ms
ms
ms
ms
Output Slew Rate
10
30
Propagation Delay LOW to SD
Propagation Delay SD to LOW
Propagation Delay HIGH to SD
Propagation Delay SD to HIGH
0.48
1.88
0.62
1.03
RL = 3 kΩ
CL = 50 pF
RECEIVER CHARACTERISTICS
tPLH
tPHL
tSK
Propagation Delay LOW to HIGH
Propagation Delay HIGH to LOW
Skew |tPLH–tPHL
CL = 50 pF (See Figure 5 and Figure 6)
0.1
0.1
0.4
0.6
1.0
1.0
0.5
μs
μs
μs
μs
μs
μs
μs
|
0.1
tPLS
tPSL
tPHS
tPSH
Propagation Delay LOW to SD
Propagation Delay SD to LOW
Propagation Delay HIGH to SD
Propagation Delay SD to HIGH
0.13
1.0
RL = 1 kΩ
CL = 50 pF
R1–R4 Only
(See Figure 9 and Figure 10)
0.19
0.58
(1) Receiver characteristics are ensured for SD = 0.8V. When SD = 2.0V, receiver five (R5) is active and meets receiver parameters in
SHUTDOWN (SD) mode, unless otherwise specified.
4
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DS14C535
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SNLS092C –MAY 1998–REVISED APRIL 2013
Parameter Measurement Information
Figure 3. Driver Propagation Delay and Slew Rate Test Circuit
Figure 4. Driver Propagation Delay and Slew Rate Timing
Figure 5. Receiver Propagation Delay Test Circuit
Figure 6. Receiver Propagation Delay Timing
Figure 7. Driver SHUTDOWN (SD) Delay Test Circuit
Figure 8. Driver SHUTDOWN (SD) Delay Timing
Copyright © 1998–2013, Texas Instruments Incorporated
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SNLS092C –MAY 1998–REVISED APRIL 2013
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Figure 9. Receiver SHUTDOWN (SD) Delay Test Circuit
Figure 10. Receiver SHUTDOWN (SD) Delay Timing
PIN DESCRIPTIONS
VCC (Pin 3). Power supply pin for the device, +5V (±0.5V).
V+ (Pin 1). Positive supply for EIA/TIA-232-E drivers. Recommended external capacitor—0.1 μF (16V). This supply is not intended to be
loaded externally.
V− (Pin 25). Negative supply for EIA/TIA-232-E drivers. Recommended external capacitor—0.1 μF (16V). This supply is not intended to be
loaded externally.
C1+, C1− (Pins 2, 4). External capacitor connection pins.
C2+, C2− (Pins 28, 26). External capacitor connection pins.
SHUTDOWN (SD) (Pin 23). A High on the SHUTDOWN pin will lower the total ICC current to less than 10 μA, providing a low power state.
In this mode receiver R5 remains active. The SD pin should be driven or tied low (GND) to disable the shutdown mode.
DIN 1–3 (Pins 7, 8, 9). Driver input pins.
DOUT 1–3 (Pins 22, 21, 20). Driver output pins conform to EIA/TlA-232 -E levels.
RIN 1–5 (Pins 19, 18, 17, 16, 15). Receiver input pins accept EIA/TIA-232-E input voltages (±25V). Receivers ensures hysteresis of TBD
mV. Unused receiver input pins may be left open. Internal input resistor (5 kΩ) pulls input LOW, providing a failsafe HIGH output.
ROUT 1–5 (Pins 10, 11, 12, 13, 14). Receiver output pins.
GND (Pins 5, 27). Ground Pins. Both pins must be connected to external ground. These pins are not connected together on the chip.
6
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DS14C535
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SNLS092C –MAY 1998–REVISED APRIL 2013
APPLICATION INFORMATION
In a typical Data Terminal Equipment (DTE) to Data Circuit-Terminating Equipment (DCE) 9-pin de-facto
interface implementation, 2 data lines and 6 control lines are required. The data lines are TXD and RXD and the
control lines are RTS, DTR, DSR, DCD, CTS and RI. The DS14C535 is a 3 x 5 Driver/Receiver and offers a
single chip solution for the DTE interface as shown in Figure 11.
Ring Indicator (RI) is used to inform the DTE that an incoming call is coming from a remote DCE. When the
DS14C535 is in SHUTDOWN (SD) mode, receiver five (R5) remains active and monitors RI circuit. This active
receiver (R5) alerts the DTE to switch the DS14C535 from SHUTDOWN to active mode.
To achieve minimum power consumption, the DS14C535 can be in SHUTDOWN mode and only activated when
communications are needed.
Figure 11. Typical DTE Application
Capacitors
Capacitors can be ceramic or tantalum. Standard surface mount in the range of 0.1 μF to 0.68 μF are readily
available from several manufacturers. A minimum 20V rating is recommended. Contact manufacturers for
specific detail on surface mounting and dielectrics. A partial list of manufacturers include:
Manufacturer
KEMET
Phone Number
803-963-6300
803-448-9411
800-831-9172
AVX
MURATA-ERIE
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SNLS092C –MAY 1998–REVISED APRIL 2013
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REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
8
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PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
PACKAGING INFORMATION
Orderable Device
DS14C535MSA/NOPB
DS14C535MSAX/NOPB
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LIFEBUY
SSOP
SSOP
DB
28
28
47
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
DS14C535
MSA
LIFEBUY
DB
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
0 to 70
DS14C535
MSA
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS14C535MSAX/NOPB
SSOP
DB
28
2000
330.0
16.4
8.4
10.7
2.4
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SSOP DB 28
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 38.0
DS14C535MSAX/NOPB
2000
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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相关型号：
DS14C535MSAX/NOPB
IC TRIPLE LINE TRANSCEIVER, PDSO28, EIAJ TYPE2, SSOP-28, Line Driver or Receiver
NSC
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