DS14C88M/NOPB [TI]
Quad CMOS Line Driver;
| 型号： | DS14C88M/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Quad CMOS Line Driver 驱动 输入元件 光电二极管 接口集成电路 驱动器 |
| 文件： | 总12页 (文件大小：762K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS14C88
www.ti.com
SNLS080C –MAY 1998–REVISED APRIL 2013
DS14C88 Quad CMOS Line Driver
Check for Samples: DS14C88
1
FEATURES
DESCRIPTION
The DS14C88, pin-for-pin compatible to the
DS1488/MC1488, is a quad line drivers designed to
interface data terminal equipment (DTE) with data
circuit-terminating equipment (DCE). This device
translates standard TTL/CMOS logic levels to levels
conforming to EIA-232-D and CCITT V.28 standards.
2
•
•
•
•
Meets EIA-232D and CCITT V.28 Standards
LOW Power Consumption
Wide Power Supply Range: ±5V to ±12V
Available in SOIC Package
The device is fabricated in low threshold CMOS metal
gate technology. The device provides very low power
consumption compared to its bipolar equivalents: 500
μA (DS14C88) versus 25 mA (DS1488).
The DS14C88 simplifies designs by eliminating the
need for external slew rate control capacitors. Slew
rate control in accordance with EIA-232D is provided
on-chip, eliminating the output capacitors.
Connection Diagram
Figure 1. SOIC or PDIP Package- Top View
See Package Number NFF0014A or D0014A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS14C88
SNLS080C –MAY 1998–REVISED APRIL 2013
www.ti.com
Absolute Maximum Ratings(1)(2)(3)(4)
Supply Voltage
V+ Pin
V− Pin
+13V
−13V
Driver Input Voltage
Driver Output Voltage
(V+) +0.3V to GND −0.3V
|(V+) − VO| ≤ 30V
|(V−) − VO| ≤ 30V
Continuous Power Dissipation @+25°C(5)
NFF0014A Package
1513 mW
1063 mW
D0014A Package
Junction Temperature
+150°C
Lead Temperature (Soldering 4 seconds)
Storage Temperature Range
+260°C
−65°C to +150°C
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be Ensured. They are not meant to imply
that the devices should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) This Product does not meet 2000V ESD rating.
(4) ESD Rating (HBM, 1.5 kΩ, 100 pF) ≥ 1.0 kV.
(5) Derate NFF0014A Package 12.1 mW/°C, and D0014A Package 8.5 mW/°C above +25°C.
Recommended Operating Conditions
Min
+4.5
−4.5
Max
+12.6
−12.6
Units
V+ Supply (GND = 0V)
V− Supply (GND = 0V)
Operating Free Air Temp. (TA)
DS14C88
V
V
0
+75
°C
Electrical Characteristics
Over Recommended Operating Conditions, unless otherwise specified
Parameter
Test Conditions
Min
Typ
Max
Units
μA
μA
V
IIL
Maximum Low Input Current
Maximum High Input Current
Low Level Input Voltage
VIN = GND
VIN = V+
+10
IIH
VIL
−10
GND
GND
2.0
V+ ≥ +7V, V− ≤ −7V
V+ < +7V, V−> −7V
0.8
0.6
V+
V
VIH
High Level Input Voltage
Low Level Output Level
V
VOL
VIN = VIH
V+ = 4.5V, V− = −4.5V
V+ = 9V, V− = 9V
−4.0
−8.0
−10.5
4.0
−3.0
−6.5
−9.0
V
RL = 3 kΩ or 7 kΩ
V
V+ = 12V, V− = −12V
V+ = 4.5V, V− = −4.5V
V+ = 9V, V− = −9V
V
VOH
High Level Output Level
VIN = VIL
3.0
6.5
9.0
V
RL = 3 kΩ or 7 kΩ
8.0
V
V+ = 12V, V− = −12V
V+ = +12V, V− = −12V
10.5
V
IOS+
IOS−
ROUT
High Level Output Short Circuit
Current(1)
VIN = 0.8V, VO = GND
VIN = 2.0V, VO = GND
V+ = V− = GND = 0V
−45
mA
mA
Ω
Low Level Output Short Circuit
Current(1)
+45
Output Resistance
300
−2V ≤ VO ≤ +2V(2) (Figure 2 )
(1) IOS+ and IOS− values are for one output at a time. If more than one output is shorted simultaneously, the device dissipation may be
exceeded.
(2) Power supply (V+, V−) and GND pins are connected to ground for the Output Resistance Test (RO).
2
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS14C88
DS14C88
www.ti.com
SNLS080C –MAY 1998–REVISED APRIL 2013
Electrical Characteristics (continued)
Over Recommended Operating Conditions, unless otherwise specified
Parameter
Test Conditions
Min
Typ
Max
10
Units
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
ICC+
Positive Supply Current
VIN = VILmax
RL = OPEN
V+ = 4.5V, V− = −4.5V
V+ = 9V, V− = −9V
V+ = 12V, V− = −12V
V+ = 4.5V, V− = −4.5V
V+ = 9V, V− = −9V
V+ = 12V, V− = −12V
V+ = 4.5V, V− = −4.5V
V+ = 9V, V− = −9V
V+ = 12V, V− = −12V
V+ = 4.5V, V− = −4.5V
V+ = 9V, V− = −9V
30
60
VIN = VIHmin
RL = OPEN
50
300
500
−10
−10
−10
−30
−30
−60
ICC-
Negative Supply Current
VIN = VILmax
RL = OPEN
VIN = VIHmin
RL = OPEN
V+ = 12V, V− = −12V
Switching Characteristics(1)(2)
Over Recommended Operating Conditions, unless otheriwse specified (Figure 3, Figure 4)
Parameter
Test Conditions
V+ = +4.5V, V− = −4.5V
Min
Typ
1.5
Max
6.0
5.0
4.0
6.0
5.0
4.0
Units
μs
tPLH
Propagation Delay Low to High
V+ = +9.0V, V− = −9.0V
V+ = +12V, V− = −12V
V+ = +4.5V, V− = −4.5V
V+ = +9.0V, V− = −9.0V
V+ = +12V, V− = −12V
1.2
μs
1.2
μs
tPHL
Propagation Delay High to Low
1.5
μs
1.35
1.3
μs
μs
tr
Rise Time(3)
Fall Time(3)
0.2
0.2
1.0
μs
tf
1.0
μs
tsk
Typical Propagation Delay Skew
V+ = +4.5V, V− = −4.5V
V+ = +9.0V, V− = −9.0V
V+ = +12V, V− = −12V
250
200
150
ns
ns
ns
SR
Output Slew Rate(3)
RL = 3 kΩ to 7 kΩ
CL = 15 pF to 2500 pF
30
V/μs
(1) AC input test waveforms for test purposes: tr = tf ≤ 20 ns, VIH = 2V, VIL = 0.8V (0.6V at V+ = 4.5V, V− = −4.5V)
(2) Input rise and rall times must not exceed 5 μs.
(3) The output slew rate, rise time, and fall time are measured from the +3.0V to the −3.0V level on the output waveform.
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: DS14C88
DS14C88
SNLS080C –MAY 1998–REVISED APRIL 2013
www.ti.com
Parameter Measure Information
Figure 2. Output Resistance Test Circuit (Power-Off)
Figure 3. Driver Load Circuit(4)
Figure 4. Driver Switching Waveform
(4) CL include jig and probe capacitances.
TYPICAL APPLICATION INFORMATION
Figure 5. EIA-232D Data Transmission
4
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS14C88
DS14C88
www.ti.com
SNLS080C –MAY 1998–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 4
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: DS14C88
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
DS14C88M
NRND
ACTIVE
SOIC
SOIC
D
D
14
14
55
TBD
Call TI
CU SN
Call TI
0 to 70
0 to 70
DS14C88M
DS14C88M/NOPB
55
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
DS14C88M
DS14C88MX
NRND
SOIC
SOIC
D
D
14
14
2500
2500
TBD
Call TI
Call TI
0 to 70
0 to 70
DS14C88M
DS14C88M
DS14C88MX/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-260C-UNLIM
DS14C88N
NRND
PDIP
PDIP
NFF
NFF
14
14
25
25
TBD
Call TI
Call TI
0 to 70
0 to 70
DS14C88N
DS14C88N
DS14C88N/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-NA-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS14C88MX
SOIC
SOIC
D
D
14
14
2500
2500
330.0
330.0
16.4
16.4
6.5
6.5
9.35
9.35
2.3
2.3
8.0
8.0
16.0
16.0
Q1
Q1
DS14C88MX/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DS14C88MX
SOIC
SOIC
D
D
14
14
2500
2500
367.0
367.0
367.0
367.0
35.0
35.0
DS14C88MX/NOPB
Pack Materials-Page 2
MECHANICAL DATA
NFF0014A
N14A (Rev G)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明