DS14C89AM/NOPB [TI]
四路 CMOS 接收器 | D | 14 | 0 to 70;
| 型号： | DS14C89AM/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 四路 CMOS 接收器 | D | 14 | 0 to 70 |
| 文件： | 总15页 (文件大小：416K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS14C89A
www.ti.com
SNLS081C –MAY 1998–REVISED APRIL 2013
DS14C89A Quad CMOS Receiver
Check for Samples: DS14C89A
1
FEATURES
DESCRIPTION
The DS14C89A, pin-for-pin compatible to the
DS1489A/MC1489A, ia a quad receiver designed to
interface data terminal equipment (DTE) with data
circuit-terminating equipment (DCE). These devices
translate levels conforming to EIA-232E and CCITT
V.28 standards to TTL/CMOS logic levels.
2
•
Meets EIA/TIA-232-E and CCITT V.28
Standards
•
•
•
•
Failsafe - Output High for Open Input
LOW Power Consumption
On Chip Noise Filter
The device is fabricated in low threshold CMOS metal
gate technology. The device provides very low power
consumption compared to their bipolar equivalents:
900 μA (DS14C89A) versus 26 mA (DS1489A).
Available in SOIC Package
The DS14C89A provides on chip noise filtering which
eliminates the need for external response control filter
capacitors. When replacing the DS1489A with the
DS14C89A, the response control filter pins can be
tied high, low, or not connected.
Connection Diagram
Figure 1. See Package Number D, NFF0014A
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS14C89A
SNLS081C –MAY 1998–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
VCC
+6V
−30V to +30V
(VCC) +0.3V to GND−0.3V
+150°C
Input Voltage
Receiver Output Voltage
Junction Temperature
NFF0014A Package
D Package
1513 mW
Continuous Power Dissipation @ +25°C(3)
1063 mW
Lead Temp.
(Soldering 4 seconds)
+260°C
Storage Temp. Range
−65°C to +150°C
ESD Rating ≥ 1.8 kV, Typically ≥ 2 kV (HMB, 1.5 kΩ, 100 pF)
(1) Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that
the devices should be operated at these limits. The tables of AC Electrical Characteristics specify conditions for device operation.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Derate NFF0014A Package 12.1 mW/°C, and D Package 8.5 mW/°C above +25°C.
Recommended Operating Conditions
Min
+4.5
0
Max
+5.5
+75
Units
V
VCC (GND = 0V)
Operating Free Air Temp. (TA)
DS14C89A
°C
2
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS14C89A
DS14C89A
www.ti.com
SNLS081C –MAY 1998–REVISED APRIL 2013
Electrical Characteristics
Over recommended operating conditions, unless otherwise specified
Symbol
VTH
Parameter
Input High Threshold
Input Low Threshold
Typical Input Hysteresis
Input Current
Conditions
Min
1.3
0.5
Typ
Max
2.7
Units
V
VTL
1.9
V
VHY
1.0
V
IIN
VIN = +25V
VIN = −25V
VIN = +3V
VCC = +4.5V to +5.5V
VCC = 0V (Power-Off)(1)
3.6
−3.6
0.43
−0.43
2.14
−2.14
0.43
−0.43
2.8
8.3
−8.3
1.0
mA
mA
mA
mA
mA
mA
mA
mA
V
VIN = −3V
−1.0
5.0
VIN = +15V
VIN = −15V
VIN = +3V
−5.0
1.0
VIN = −3V
−1.0
VOH
VOL
ICC
Output High Voltage
Output Low Voltage
Supply Current
VIN = VTL (min)
IOUT = −3.2 mA
IOUT = −20μA
4.0
4.7
3.5
V
VIN = VTH (max)
IOUT = +3.2 mA
0.15
0.5
0.4
V
No Load, VIN = 2.7V or 0.5V
900
μA
(1) Under the power-off supply conditions it is assumed that the power supply potential drops to zero (0V) and is replaced by a low
impedance or short circuit to ground.
AC Electrical Characteristics(1)
Over recommended operating conditions, unless otherwise specified, CI = 50 pF
Symbol
tPLH
Parameter
Propagation Delay Low to High
Propagation Delay High to Low
Typical Propagation Delay Skew
Output Rise TIme
ConditIons
Input Pulse Width ≥ 10 μs
Input Pulse Width ≥ 10 μs
Min
Typ
3.5
3.2
400
40
Max
6.5
Units
μs
μs
ns
ns
ns
μs
tPHL
tSK
tr
6.5
300
300
1.0
tf
Output Fall Time
40
tnw
Pulse Width assumed to be Noise
(1) AC input waveforms for test purposes: tr = tf = 200 ns, VIH = +3V, VL = −3V, f = 20 KHz.
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: DS14C89A
DS14C89A
SNLS081C –MAY 1998–REVISED APRIL 2013
www.ti.com
Parameter Measurement Information
Figure 2. Receiver Load Circuit
Figure 3. Receiver Switching Waveform(2)
(2) AC input waveforms for test purposes: tr = tf = 200 ns, VIH = +3V, VL = −3V, f = 20 KHz.
4
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS14C89A
DS14C89A
www.ti.com
SNLS081C –MAY 1998–REVISED APRIL 2013
TYPICAL APPLICATION INFORMATION
Figure 4. Receiver Block Diagram
Figure 5. EIA-232D Data Transmission
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: DS14C89A
DS14C89A
SNLS081C –MAY 1998–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 5
6
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS14C89A
PACKAGE OPTION ADDENDUM
www.ti.com
15-Jul-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DS14C89AM/NOPB
DS14C89AMX/NOPB
LIFEBUY
ACTIVE
SOIC
SOIC
D
D
14
14
55
RoHS & Green
SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
DS14C89AM
2500 RoHS & Green
DS14C89AM
Samples
DS14C89AN/NOPB
LIFEBUY
PDIP
N
14
25 RoHS & Green
NIPDAU
Level-1-NA-UNLIM
0 to 70
DS14C89AN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Jul-2023
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS14C89AMX/NOPB
SOIC
D
14
2500
330.0
16.4
6.5
9.35
2.3
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC 14
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 35.0
DS14C89AMX/NOPB
D
2500
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TUBE
T - Tube
height
L - Tube length
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device
Package Name Package Type
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
DS14C89AM/NOPB
DS14C89AN/NOPB
D
N
SOIC
PDIP
14
14
55
25
495
502
8
4064
3.05
4.32
14
11938
Pack Materials-Page 3
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明