DS26LS32 [TI]
DS26LS32AC/DS26LS32C/DS26LS32M/DS26LS33M Quad Differential Line Receivers; DS26LS32AC / DS26LS32C / DS26LS32M / DS26LS33M四路差动线路接收器
| 型号： | DS26LS32 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DS26LS32AC/DS26LS32C/DS26LS32M/DS26LS33M Quad Differential Line Receivers |
| 文件： | 总13页 (文件大小：837K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS26LS32AC, DS26LS32C, DS26LS32M, DS26LS33M
www.ti.com
SNLS352C –MAY 1999–REVISED FEBRUARY 2013
DS26LS32AC/DS26LS32C/DS26LS32M/DS26LS33M Quad Differential Line Receivers
Check for Samples: DS26LS32AC, DS26LS32C, DS26LS32M, DS26LS33M
1
FEATURES
DESCRIPTION
The DS26LS32 and DS26LS32A are quad differential
line receivers designed to meet the RS-422, RS-423
and Federal Standards 1020 and 1030 for balanced
and unbalanced digital data transmission.
2
•
High Differential or Common-Mode Input
Voltage Ranges of ±7V on the DS26LS32 and
DS26LS32A and ±15V on the DS26LS33
•
•
±0.2V Sensitivity Over the Input Voltage Range
on the DS26LS32 and DS26LS32A, ±0.5V
Sensitivity on the DS26LS33
The DS26LS32 and DS26LS32A have an input
sensitivity of 200 mV over the input voltage range of
±7V and the DS26LS33 has an input sensitivity of
500 mV over the input voltage range of ±15V.
DS26LS32 and DS26LS32A Meet All
Requirements of RS-422 and RS-423
The DS26LS32A differs in function from the popular
DS26LS32 and DS26LS33 in that input pull-up and
pull-down resistors are included which prevent output
oscillation on unused channels.
•
•
6k Minimum Input Impedance
100 mV Input Hysteresis on the DS26LS32 and
DS26LS32A, 200 mV on the DS26LS33
•
•
Operation From a Single 5V Supply
Each version provides an enable and disable function
common to all four receivers and features TRI-STATE
outputs with 8 mA sink capability. Constructed using
low power Schottky processing, these devices are
available over the full military and commercial
operating temperature ranges.
TRI-STATE Outputs, with Choice of
Complementary Output Enables for Receiving
Directly onto a Data Bus
Logic Diagram
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
DS26LS32AC, DS26LS32C, DS26LS32M, DS26LS33M
SNLS352C –MAY 1999–REVISED FEBRUARY 2013
www.ti.com
Connection Diagram
For Complete Military Product Specifications, refer to the appropriate SMD or MDS.
Figure 1. Dual-In-Line Package (Top View)
D Package or NFG0016E Package
Figure 2. 20-Lead Ceramic Leadless Chip Carrier
(1)
Truth Table
ENABLE
ENABLE
Input
Output
0
1
X
Hi-Z
1
See note below.(2)
V
ID ≥ VTH (Max)
ID ≤ VTH (Min)
V
0
(1) Hi-Z = TRI-STATE
(2) Note: Input conditions may be any combination not defined for ENABLE and ENABLE .
2
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: DS26LS32AC DS26LS32C DS26LS32M DS26LS33M
DS26LS32AC, DS26LS32C, DS26LS32M, DS26LS33M
www.ti.com
SNLS352C –MAY 1999–REVISED FEBRUARY 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage
7V
±25V
±25V
7V
Common-Mode Range
Differential Input Voltage
Enable Voltage
Output Sink Current
50 mA
Maximum Power Dissipation (3) at 25°C
Cavity Package
1433 mW
1362 mW
Molded DIP Package
SOIC Package(4) DS26LS32
1002 mW
DS26LS32A
1051 mW
Storage Temperature Range
Lead Temperature (Soldering, 4 seconds)
−65°C to +165°C
260°C
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to
imply that the device should be operated at these limits. The table of “Electrical Characteristics” provides conditions for actual device
operation.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Derate cavity package 9.6 mW/°C above 25°C; derate molded DIP package 10.9 mW/°C above 25°C.
(4) Derate SOIC Package 8.01 mW/°C for DS26LS32 8.41 mW/°C for DS26LS32A
Operating Conditions
Min
Max
Units
Supply Voltage, (VCC
)
DS26LS32M, DS26LS33M (MIL)
DS26LS32C, DS26LS32AC (COML)
Temperature, (TA)
4.5
5.5
V
V
4.75
5.25
DS26LS32M, DS26LS33M (MIL)
DS26LS32C, DS26LS32AC (COML)
−55
+125
+70
°C
°C
0
(1) (2) (3)
Electrical Characteristics
over the operating temperature range unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Units
V
VTH
Differential Input Voltage VOUT = VOH or
VOL
DS26LS32, DS26LS32A, −7V ≤ VCM ≤ +7V
DS26LS33, DS26LS33A, −15V ≤ VCM +15V
−0.2 ±0.07
−0.5 ±0.14
0.2
0.5
V
RIN
IIN
Input Resistance
−15V ≤ VCM ≤ +15V (One Input AC GND)
V IN = 15V, Other Input −15V ≤ VIN ≤ +15V
V IN = −15V, Other Input −15V ≤ VIN ≤ +15V
6.0
8.5
kΩ
mA
mA
V
Input Current (Under
Test)
2.3
−2.8
VOH
Output High Voltage
VCC = MIN, ΔVIN = 1V,
VENABLE = 0.8V, IOH = −440 μA
VCC = Min, ΔVIN = −1V,
VENABLE = 0.8V
Commercial
2.7
2.5
4.2
4.2
Military
V
VOL
Output Low Voltage
IOL = 4 mA
IOL = 8 mA
0.4
0.45
0.8
V
V
VIL
VIH
VI
Enable Low Voltage
Enable High Voltage
Enable Clamp Voltage
V
2.0
V
VCC = Min, IIN = −18 mA
−1.5
V
(1) All currents into device pins are shown as positive, all currents out of device pins are shown as negative, all voltages are referenced to
ground, unless otherwise specified. All values shown as max or min are so classified on absolute value basis.
(2) All typical values are VCC = 5V, TA = 25°C.
(3) Only one output at a time should be shorted.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: DS26LS32AC DS26LS32C DS26LS32M DS26LS33M
DS26LS32AC, DS26LS32C, DS26LS32M, DS26LS33M
SNLS352C –MAY 1999–REVISED FEBRUARY 2013
www.ti.com
Electrical Characteristics (1) (2) (3) (continued)
over the operating temperature range unless otherwise specified
Symbol
Parameter
Conditions
VO = 2.4V
Min
Typ
Max
Units
IO
OFF-State (High
Impedance) Output
Current
V CC = Max
20
μA
VO = 0.4V
−20
μA
IIL
Enable Low Current
Enable High Current
VIN = 0.4V
−0.36
mA
IIH
ISC
VIN = 2.7V
20
μA
Output Short-Circuit
Current
V O = 0V, VCC = Max, ΔVIN = 1V
−15
−85
mA
ICC
Power Supply Current
VCC = Max, All VIN = GND,
Outputs Disabled
VIN = 5.5V
DS26LS32, DS26LS32A
DS26LS33, DS26LS33A
52
57
70
80
mA
mA
μA
II
Input High Current
Input Hysteresis
100
VHYST
TA = 25°C, VCC = 5V,
VCM = 0V
DS26LS32, DS26S32A
DS26LS33, DS26LS33A
100
200
mV
mV
Switching Characteristics
VCC = 5V, TA = 25°C
DS26LS32/DS26LS33
DS26LS32A/DS26LS33A
Symbol
Parameter
Conditions
Units
Min
Typ
17
17
20
15
15
15
Max
25
Min
Typ
23
23
15
20
14
15
Max
tPLH
tPHL
tLZ
tHZ
tZL
Input to Output
CL = 15 pF
35
35
30
25
22
22
ns
ns
ns
ns
ns
ns
25
ENABLE to Output
ENABLE to Output
CL = 5 pF
30
22
CL = 15 pF
22
tZH
22
AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS
Figure 3. Load Test Circuit for TRI-STATE Outputs
4
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: DS26LS32AC DS26LS32C DS26LS32M DS26LS33M
DS26LS32AC, DS26LS32C, DS26LS32M, DS26LS33M
www.ti.com
SNLS352C –MAY 1999–REVISED FEBRUARY 2013
Diagram shown for ENABLE low.
Pulse generator for all pulses: Rate = 1.0 MHz; ZO = 50Ω; tr ≤ 6 ns; tf ≤ 6.0 ns.
Figure 4. Propagation Delay
S1 and S2 of load circuit are closed except where shown.
Pulse generator for all pulses: Rate = 1.0 MHz; ZO = 50Ω; tr ≤ 6 ns; tf ≤ 6.0 ns.
Figure 5. Enable and Disable Times
TYPICAL APPLICATIONS
Figure 6. Two-Wire Balanced Interface—RS-422
Figure 7. Single Wire with Driver Ground Reference—RS-423
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: DS26LS32AC DS26LS32C DS26LS32M DS26LS33M
DS26LS32AC, DS26LS32C, DS26LS32M, DS26LS33M
SNLS352C –MAY 1999–REVISED FEBRUARY 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (February 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 5
6
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: DS26LS32AC DS26LS32C DS26LS32M DS26LS33M
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
NFG
NFG
D
Qty
(1)
(2)
(6)
(3)
(4/5)
AM26LS32CN
AM26LS32PC
DS26LS32ACM
NRND
NRND
NRND
PDIP
PDIP
SOIC
16
16
16
25
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
0 to 70
0 to 70
0 to 70
DS26LS32CN
25
DS26LS32CN
48
DS26LS32
ACM
DS26LS32ACM/NOPB
DS26LS32ACMX
ACTIVE
NRND
SOIC
SOIC
SOIC
D
D
D
16
16
16
48
Green (RoHS
& no Sb/Br)
CU SN
Call TI
CU SN
Level-1-260C-UNLIM
Call TI
0 to 70
0 to 70
0 to 70
DS26LS32
ACM
2500
2500
TBD
DS26LS32
ACM
DS26LS32ACMX/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
DS26LS32
ACM
DS26LS32ACN
NRND
PDIP
PDIP
NFG
NFG
16
16
25
25
TBD
Call TI
CU SN
Call TI
0 to 70
0 to 70
DS26LS32ACN
DS26LS32ACN
DS26LS32ACN/NOPB
ACTIVE
Pb-Free
(RoHS)
Level-1-NA-UNLIM
DS26LS32CM
NRND
SOIC
SOIC
D
D
16
16
48
48
TBD
Call TI
CU SN
Call TI
0 to 70
0 to 70
DS26LS32CM
DS26LS32CM
DS26LS32CM/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
DS26LS32CMX
NRND
SOIC
SOIC
D
D
16
16
2500
2500
TBD
Call TI
CU SN
Call TI
0 to 70
0 to 70
DS26LS32CM
DS26LS32CM
DS26LS32CMX/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
DS26LS32CN
NRND
PDIP
PDIP
NFG
NFG
16
16
25
25
TBD
Call TI
SN
Call TI
0 to 70
0 to 70
DS26LS32CN
DS26LS32CN
DS26LS32CN/NOPB
ACTIVE
Pb-Free
(RoHS)
Level-1-NA-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS26LS32ACMX
DS26LS32ACMX/NOPB
DS26LS32CMX
SOIC
SOIC
SOIC
SOIC
D
D
D
D
16
16
16
16
2500
2500
2500
2500
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
6.5
6.5
6.5
6.5
10.3
10.3
10.3
10.3
2.3
2.3
2.3
2.3
8.0
8.0
8.0
8.0
16.0
16.0
16.0
16.0
Q1
Q1
Q1
Q1
DS26LS32CMX/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DS26LS32ACMX
DS26LS32ACMX/NOPB
DS26LS32CMX
SOIC
SOIC
SOIC
SOIC
D
D
D
D
16
16
16
16
2500
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
DS26LS32CMX/NOPB
Pack Materials-Page 2
MECHANICAL DATA
NFG0016E
N16E (Rev G)
www.ti.com
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