DS36276_11 [TI]
FAILSAFE Multipoint Transceiver;
| 型号： | DS36276_11 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | FAILSAFE Multipoint Transceiver |
| 文件： | 总13页 (文件大小：279K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS36276
DS36276 FAILSAFE Multipoint Transceiver
Literature Number: SNLS085A
July 1998
DS36276
FAILSAFE Multipoint Transceiver
General Description
Features
n FAILSAFE receiver, RO = HIGH for:
— OPEN inputs
The DS36276 FAILSAFE Multipoint Transceiver is designed
for use on bi-directional differential busses. It is compatible
with existing TIA/EIA-485 transceivers, however, it offers an
additional feature not supported by standard transceivers.
— Terminated inputs
— SHORTED inputs
n Compatible with popular interface standards:
— TIA/EIA-485 (RS-485)
— TIA/EIA-422-A (RS-422-A)
— CCITT Recommendation V.11
n Bi-Directional Transceiver
— Designed for multipoint transmission
The FAILSAFE feature guarantees the receiver output to a
known state when the Interface is in the following conditions:
Floating Line, Idle Line (no active drivers), and Line Fault
conditions (open or short). The receiver output is in a HIGH
state for the following conditions: OPEN Inputs, Terminated
Inputs (50Ω), and SHORTED Inputs.
n Separate driver input, driver enable, receiver enable,
and receiver output for maximum flexibility
n Wide bus common mode range
— (−7V to +12V)
FAILSAFE is a highly desirable feature when the transceiv-
ers are used with Asynchronous Controllers such as UARTs.
n Pin compatible with: DS75176B, DS96176, DS3695 and
SN75176A and B
n Available in SOIC package
Connection and
Logic Diagram
Driver
Inputs
Outputs
RE
X
DE
H
DI
H
L
DO/RI
DO /RI
H
L
L
H
Z
X
H
X
L
X
Z
Receiver
Inputs
DE
Output
DS011383-1
RE
L
RI–RI
RO
H
Order Number DS36276M
See NS Package Number M08A
L
L
X
≥0V
L
≤−500 mV
L
H
X
Z
Receiver FAILSAFE
Inputs
Output
RE
L
DE
L
RI–RI
SHORTED
OPEN
X
RO
H
L
L
H
H
X
Z
TRI-STATE® is a registered trademark of National Semiconductor Corporation.
© 2001 National Semiconductor Corporation
DS011383
www.national.com
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Lead Temperature (Soldering 4
sec.)
260˚C
150˚C
Max Junction Temperature
ESD Rating (HBM, 1.5 kΩ, 100
pF)
≥ 6.0 kV
Supply Voltage (VCC
)
7V
Input Voltage (DE, RE , and DI)
Driver Output Voltage/
5.5V
Recommended Operating
Conditions
Receiver Input Voltage
−10V to +15V
5.5V
Min
Max
5.25
+12
Units
Receiver Output Voltage (RO)
Supply Voltage, VCC
Bus Voltage
4.75
−7
V
V
@
Maximum Package Power Dissipation +25˚C
M Package
(derate 5.8 mW/˚C above
+25˚C)
Operating Temperature (TA)
DS36276
726 mW
−65˚C to +150˚C
0
+70
˚C
Storage Temperature Range
Electrical Characteristics (Notes 2, 4)
Over recommended Supply Voltage and Operating Temperature ranges, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DRIVER CHARACTERISTICS
VOD
VoDO
VoDO
VT1
Differential Output Voltage
IO = 0 mA (No Load)
IO = 0 mA (Output to GND)
1.5
0
4.8
6.0
6.0
V
V
Output Voltage
Output Voltage
0
6.0
V
Differential Output Voltage
(Termination Load)
RL = 54Ω (485)
RL = 100Ω (422)
RL = 54Ω
(Figure 1)
1.5
2.0
−0.2
−0.2
0
2.0
2.3
5.0
V
5.0
V
∆VT1
VOS
Balance of VT1
(Note 3)
(Figure 1)
(Note 3)
(Figure 3)
0.07
0.07
2.5
+0.2
+0.2
3.0
V
|VT1| − |VT1
|
RL = 100Ω
RL = 54Ω
V
Driver Common Mode
Output Voltage
V
RL = 100Ω
RL = 54Ω
0
2.3
3.0
V
∆VOS
Balance of VOS
−0.2
−0.2
0.08
0.08
134
140
−140
−180
+0.2
+0.2
290
V
|VOS| − |VOS
|
RL = 100Ω
VO = +12V
VO = VCC
V
IOSD
Driver Short-Circuit
Output Current
mA
mA
mA
mA
VO = 0V
VO = −7V
−290
0
RECEIVER CHARACTERISTICS
VTH
Differential Input High
Threshold Voltage (Note 5)
VO = VOH, IO = −0.4 mA
−7V ≤ VCM ≤ +12V
−0.18
−0.23
V
V
VTL
Differential Input Low
Threshold Voltage (Note 5)
VO = VOL, IO = 8.0 mA
−7V ≤ VCM ≤ +12V
−0.5
VHST
IIN
Hysteresis (Note 6)
VCM = 0V
50
0.7
mV
mA
mA
mA
µA
V
Line Input Current
(VCC = 4.75V, 5.25V, 0V)
Other Input = 0V
DE = VIH (Note 7)
VI = +12V
VI = −7V
1.0
−0.8
−85
+20
−0.5
−30
IOSR
IOZ
Short Circuit Current
TRI-STATE® Leakage Current
VO = 0V
RO
−5.0
−20
2.5
VO = 0.4 to 2.4V
VOH
Output High Voltage
(Figure 12)
VID = 0V, IOH = −0.4 mA
VID = OPEN, IOH = −0.4 mA
VID = −0.5V, IOL = +8 mA
VID = −0.5V, IOL = +16 mA
3.5
3.5
2.5
V
VOL
RIN
Output Low Voltage
(Figure 12 )
0.25
0.35
19
0.6
0.7
V
V
Input Resistance
12
kΩ
www.national.com
2
Electrical Characteristics (Notes 2, 4) (Continued)
Over recommended Supply Voltage and Operating Temperature ranges, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DEVICE CHARACTERISTICS
VIH
VIL
High Level Input Voltage
DE,
RE,
or
2.0
VCC
0.8
20
V
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Clamp Voltage
GND
V
IIH
VIH = 2.4V
VIL = 0.4V
µA
µA
V
DI
IIL
−100
−1.5
60
VCL
ICC
ICCR
ICCD
ICCX
ICL = −18 mA
−0.75
42
Output Low Voltage
Supply Current
(No Load)
DE = 3V, RE = 0V, DI = 0V
DE = 0V, RE = 0V, DI = 0V
DE = 3V, RE = 3V, DI = 0V
DE = 0V, RE = 3V, DI = 0V
mA
mA
mA
mA
28
45
43
60
31
50
Switching Characteristics (Note 4)
Over recommended Supply Voltage and Operating Temperature ranges, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DRIVER CHARACTERISTICS
tPLHD
tPHLD
tSKD
tr
Diff. Prop. Delay Low to High
RL = 54Ω
7
7
21
19
2
60
60
10
50
50
45
45
55
65
55
55
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CL = 50 pF
CD = 50 pF
(Figures 4, 5)
Diff. Prop. Delay High to Low
Diff. Skew (|tPLHD–tPHLD|)
Diff. Rise Time
12
12
22
22
32
32
22
16
tf
Diff. Fall Time
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
Prop. Delay Low to High
Prop. Delay High to Low
Enable Time Z to High
Enable Time Z to Low
Disable Time High to Z
Disable Time Low to Z
RL = 27Ω, CL = 15 pF
(Figures 6, 7)
RL = 110Ω
CL = 50 pF
(Figure 8 – Figure 11)
RECEIVER CHARACTERISTICS
tPLH
tPHL
tSK
Prop. Delay Low to High
Prop. Delay High to Low
Skew (|tPLH–tPHL|)
VID = −1.5V to +1.5V
CL = 15 pF
(Figures 13, 14)
15
15
40
42
2
70
70
15
50
50
50
50
ns
ns
ns
ns
ns
ns
ns
tPZH
tPZL
tPHZ
tPLZ
Enable Time Z to High
Enable Time Z to Low
Disable Time High to Z
Disable Time Low to Z
CL = 15 pF
(Figures 15, 16)
15
17
24
19
Note 1: “Absolute Maximum Ratings”are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise
specified.
Note 3: ∆ |V | and ∆ |V | are changes in magnitude of V and V , respectively, that occur when the input changes state.
T1
OS
T1
OS
Note 4: All typicals are given for V
= 5.0V and T = +25˚C.
A
CC
Note 5: Threshold parameter limits specified as an algebraic value rather than by magnitude.
Note 6: Hysteresis defined as V = V − V
.
TL
HST
TH
Note 7: I includes the receiver input current and driver TRI-STATE leakage current.
IN
3
www.national.com
Parameter Measurement Information
DS011383-2
FIGURE 1. Driver VT1 and VOS Test Circuit
DS011383-3
FIGURE 2. Driver VOH and VOL Test Circuit
DS011383-4
FIGURE 3. Driver Short Circuit Test Circuit
DS011383-5
FIGURE 4. Driver Differential Propagation Delay and Transition Time Test Circuit
www.national.com
4
Parameter Measurement Information (Continued)
DS011383-6
FIGURE 5. Driver Differential Propagation Delays and Transition Times
DS011383-7
FIGURE 6. Driver Propagation Delay Test Circuit
DS011383-8
FIGURE 7. Driver Propagation Delays
DS011383-9
S1 to DO for DI = 3V
S1 to DO for DI = 0V
FIGURE 8. Driver TRl-STATE Test Circuit (tPZH, tPHZ
)
5
www.national.com
Parameter Measurement Information (Continued)
DS011383-10
FIGURE 9. Driver TRI-STATE Delays (tPZH, tPHZ
)
DS011383-11
S1 to DO for DI = 0V
S1 to DO for DI = 3V
FIGURE 10. Driver TRI-STATE Test Circuit (tPZL, tPLZ
)
DS011383-12
FIGURE 11. Driver TRl-STATE Delays (tPZL, tPLZ
)
DS011383-13
FIGURE 12. Receiver VOH and VOL
DS011383-14
FIGURE 13. Receiver Propagation Delay Test Circuit
www.national.com
6
Parameter Measurement Information (Continued)
DS011383-15
FIGURE 14. Receiver Propagation Delays
DS011383-16
FIGURE 15. Receiver TRI-STATE Delay Test Circuit
DS011383-18
DS011383-17
S1 −1.5V
S1 1.5V
S2 CLOSED
S3 OPEN
S2 OPEN
S3 CLOSED
DS011383-20
DS011383-19
S1 −1.5V
S1 1.5V
S2 CLOSED
S3 CLOSED
S2 CLOSED
S3 CLOSED
<
Note 8: The input pulse is supplied by a generator having the following characteristics: f = 1.0 MHz, 50% duty cycle, t and t
6.0 ns, Z = 50Ω.
O
r
f
Note 9: C includes probe and stray capacitance.
L
Note 10: Diodes are 1N916 or equivalent.
FIGURE 16. Receiver Enable and Disable Timing
7
www.national.com
Typical Performance Characteristics
Differential Output Voltage
vs Output Current
Differential Output Voltage
vs Output Current
DS011383-21
DS011383-22
DS011383-24
DS011383-26
Driver VOH vs IOH vs VCC
Driver VOH vs IOH vs Temperature
DS011383-23
Driver VOL vs IOL vs VCC
Driver VOL vs IOL vs Temperature
DS011383-25
www.national.com
8
Typical Performance Characteristics (Continued)
Receiver VOH vs IOH vs VCC
Receiver VOL vs IOL vs VCC
Supply Currrent vs Supply Voltage
Receiver VOH vs IOH vs Temperature
DS011383-27
DS011383-29
DS011383-31
DS011383-28
DS011383-30
DS011383-32
Receiver VOL vs IOL vs Temperature
Supply Current vs Temperature
9
www.national.com
Typical Performance Characteristics (Continued)
Voltage Output vs Voltage Input
(Hysteresis)
DS011383-33
www.national.com
10
Physical Dimensions inches (millimeters) unless otherwise noted
Order Number DS36276M
NS Package Number M08A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National Semiconductor
Corporation
Americas
National Semiconductor
Europe
National Semiconductor
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
National Semiconductor
Japan Ltd.
Tel: 81-3-5639-7560
Fax: 81-3-5639-7507
Fax: +49 (0) 180-530 85 86
Email: support@nsc.com
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
Email: ap.support@nsc.com
www.national.com
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Medical
Security
Logic
Space, Avionics and Defense www.ti.com/space-avionics-defense
Transportation and Automotive www.ti.com/automotive
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明