DS36954 [TI]
Quad Differential Bus Transceiver;
| 型号： | DS36954 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Quad Differential Bus Transceiver |
| 文件： | 总17页 (文件大小：888K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS36954
www.ti.com
SNLS077C –JULY 1998–REVISED APRIL 2013
DS36954 Quad Differential Bus Transceiver
Check for Samples: DS36954
1
FEATURES
DESCRIPTION
The DS36954 is
a low power, quad EIA-485
2
•
•
•
Pinout for SCSI Interface
differential bus transceiver especially suited for high
speed, parallel, multipoint, I/O bus applications. A
compact 20-pin surface mount PLCC or SOIC
package provides high transceiver integration and a
very small PC board footprint.
Compact 20-Pin PLCC or SOIC Package
Meets EIA-485 Standard for Multipoint Bus
Transmission
•
•
•
Greater than 60 mA Source/Sink Currents
Thermal Shutdown Protection
Propagation delay skew between devices is specified
to aid in parallel interface designs—limits on
maximum and minimum delay times are verified.
Glitch-Free Driver Outputs on Power Up and
Down
Five devices can implement a complete SCSI initiator
or target interface. Three transceivers in a package
are pinned out for data bus connections. The fourth
transceiver, with the flexibility provided by its
individual enables, can serve as a control bus
transceiver.
Connection Diagram
Logic Diagram
See Package Number FN (S-PQCC-J20)
See Package Number DW (R-PDSO-G20)
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS36954
SNLS077C –JULY 1998–REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)(2)
Absolute Maximum Ratings
Supply Voltage
7V
VCC + 0.5V
VCC + 0.5V
−10V to +15V
5.5V
Control Input Voltage
Driver Input Voltage
Driver Output Voltage/Receiver Input Voltage
Receiver Output Voltage
Continuous Power Dissipation @ +25°C
FN Package
1.73W
1.73W
DW Package
Derate FN Package
13.9 mW/°C above +25°C
13.7 mW/°C above +25°C
−65°C to +150°C
260°C
Derate DW Package
Storage Temperature Range
Lead Temperature (Soldering 4 Sec.)
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be verified. They are not meant to imply
that the devices should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instrument Sales Office/ Distributors for availability and
specifications.
Recommended Operating Conditions
Min
4.75
−7
Max
5.25
+12
+70
Units
V
Supply Voltage, VCC
Bus Voltage
V
Operating Free Air Temperature (TA)
0
°C
(1)(2)
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DRIVER CHARACTERISTICS
VODL
Differential Driver Output Voltage (Full IL = 60 mA
1.5
1.9
V
Load)
VCM = 0V
VOD
Differential Driver Output Voltage
(Termination Load)
RL = 100Ω (EIA-422)
RL = 54Ω (EIA-485)
RL = 54 or 100Ω (3)(Figure 1 ) (EIA-422/485)
2.0
1.5
2.25
2.0
V
V
V
ΔIVODI
Change in Magnitude of Driver
Differential Output Voltage for
Complementary Output States
0.2
VOC
Driver Common Mode Output Voltage RL = 54Ω (Figure 1 ) (EIA-485)
3.0
0.2
V
V
(4)
ΔIVOCI
Change in Magnitude of Common
Mode Output Voltage
(3)(Figure 1 ) (EIA-422/485)
VOH
VOL
VIH
Output Voltage High
Output Voltage Low
Input Voltage High
Input Voltage Low
Input Clamp Voltage
IOH = −55 mA
2.7
2.0
3.2
1.4
V
V
V
V
V
IOL = 55 mA
1.7
VIL
0.8
VCL
ICL = −18 mA
−1.5
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
unless otherwise specified.
(2) All typicals are given for VCC = 5V and TA = 25°C.
(3) Δ IVODI and Δ IVOCI are changes in magnitude of VOD and VOC, respectively, that occur when the input changes state.
(4) In EIA Standards EIA-422 and EIA-485, VOC, which is the average of the two output voltages with respect to ground, is called output
offset voltage, VOS
.
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Electrical Characteristics (1)(2) (continued)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Symbol
IIH
Parameter
Input High Current
Conditions
Min
Typ
Max
20
Units
μA
(5)
(5)
VIN = 2.4V
VIN = 0.4V
IIL
Input Low Current
−20
−250
−150
250
μA
(6)
IOSC
Driver Short-Circuit Output Current
VO = −7V (EIA-485)
VO = 0V (EIA-422)
VO = +12V (EIA-485)
−130
−90
mA
mA
mA
130
RECEIVER CHARACTERISTICS
(6)
IOSR
IOZ
Short Circuit Output Current
TRI-STATE Output Current
Output Voltage High
VO = 0V
−15
−28
−75
mA
μA
V
VO = 0.4V to 2.4V
20
VOH
VOL
VTH
VID = 0.2V, IOH = 0.4 mA
2.4
3.0
Output Voltage Low
VID = −0.2V, IOL = 4 mA
0.35
0.5
0.2
V
Differential Input High Threshold
Voltage
VO = VOH, IO = −0.4 mA (EIA-422/485)
0.03
V
VTL
Differential Input Low Threshold
Voltage
VO = VOL, IO = 4.0 mA (EIA-422/485)
VCM = 0V
−0.2
0
−0.03
V
(7)
(8)
VHST
Hysteresis
35
60
mV
DRIVER AND RECEIVER CHARACTERISTICS
VIH
VIL
VCL
IIN
Enable Input Voltage High
Enable Input Voltage Low
Enable Input Clamp Voltage
2.0
V
V
0.8
−1.5
1.0
ICL = −18 mA
V
(9)
Line Input Current
Other Input = 0V
DE/RE = 0.8V
DE4 = 0.8V
VI = +12V
0.5
mA
mA
VI = −7V
−0.45
−0.8
(9)
IING
Line Input Current
Other Input = 0V
DE/RE and DE4 = 2V
VCC = 3.0V
VI = +12V
1.0
−0.8
40
mA
mA
VI = −7V
TA = +25°C
IIH
Enable Input Current High
Enable Input Current Low
VIN = 2.4V
DE/RE
VCC = 3.0V
VCC = 4.75V
VCC = 5.25V
VCC = 3.0V
VCC = 5.25V
VCC = 3.0V
VCC = 4.75V
VCC = 5.25V
VCC = 3.0V
VCC = 5.25V
1
1
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
mA
mA
1
40
20
VIN = 2.4V
DE4 or RE4
1
1
20
IIL
VIN = 0.8V
DE/RE
−6
−12
−14
−3
−7
75
50
−40
−40
−20
−20
90
VIN = 0.8V
DE4 or RE4
(10)
ICCD
ICCR
Supply Current
No Load, DE/RE and DE4 = 2.0V
No Load, DE/RE and RE4 = 0.8V
(10)
Supply Current
70
(5) IIH and IIL include driver input current and receiver TRI-STATE leakage current on DR(1–3).
(6) Short one output at a time.
(7) Threshold parameter limits specified as an algebraic value rather than by magnitude.
(8) Hysteresis defined as VHST = V TH − VTL
.
(9) IIN includes the receiver input current and driver TRI-STATE leakage current.
(10) Total package supply current.
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Units
Switching Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
DRIVER SINGLE-ENDED CHARACTERISTICS
tPZH
tPZL
tPHZ
tPLZ
Output Enable Time to High Level
Output Enable Time to Low Level
Output Disable Time to High Level
Output Disable Time to Low Level
RL = 110Ω
(Figure 6 )
35
25
15
35
40
40
25
40
ns
ns
ns
ns
(Figure 8 )
(Figure 6 )
(Figure 8 )
DRIVER DIFFERENTIAL CHARACTERISTICS
tr, tf
Rise and Fall Time
RL = 54Ω
CL = 50 pF
CD = 15 pF
13
15
12
3
16
19
19
6
ns
ns
ns
ns
tPLHD
tPHLD
tSKD
Differential Propagation
9
9
(2)
(1)
Delays
(Figure 3 Figure 4
)
|tPLHD − tPHLD| Diff. Skew
RECEIVER CHARACTERISTICS
tPLHD
tPHLD
tSKD
tPZH
tPZL
Differential Propagation Delays
CL = 15 pF
VCM = 2.0V
(Figure 10 )
9
9
14
13
1
19
19
3
ns
ns
ns
ns
ns
ns
ns
|tPLHD − tPHLD| Diff. Receiver Skew
Output Enable Time to High Level
Output Enable Time to Low Level
Output Disable Time from High Level
Output Disable Time from Low Level
CL = 15 pF
(Figure 15 )
15
20
20
17
22
30
30
25
tPHZ
tPLZ
(1) Propagation Delay Timing for Calculations of Driver Differential Propagation Delays
(2) Differential propagation delays are calculated from single-ended propagation delays measured from driver input to the 20% and 80%
levels on the driver outputs (Figure 16) .
4
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SNLS077C –JULY 1998–REVISED APRIL 2013
PARAMETER MEASUREMENT INFORMATION
(3)
Figure 1. Driver VOD and VOC
Figure 2. Receiver VOH and VOL
(2)
(1)
(1) The input pulse is supplied by a generator having the following characteristics: f = 1.0 MHz, 50% duty cycle, trand tf <
6.0 ns, ZO = 50Ω
(2) CL includes probe and stray capacitance.
Figure 3. Driver Differential Propagation Delay Load Circuit
(1)
(1) Differential propagation delays are calculated from single-ended propagation delays measured from driver input to the
20% and 80% levels on the driver outputs (Figure 16).
Figure 4. Driver Differential Propagation Delays and Transition Times
(3) CL includes probe and stray capacitance.
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(2)
(1)
S1 to OA for DI = 3V
S1 to OB for DI = 0V
(1) The input pulse is supplied by a generator having the following characteristics: f = 1.0 MHz, 50% duty cycle, trand tf <
6.0 ns, ZO = 50Ω.
(2) CL includes probe and stray capacitance.
Figure 5.
Figure 6. Driver Enable and Disable Timing (tPZH, t PHZ
)
(1)
(2)
S1 to OA for DI = 0V
S1 to OB for DI = 3V
(1) The input pulse is supplied by a generator having the following characteristics: f = 1.0 MHz, 50% duty cycle, trand tf <
6.0 ns, ZO = 50Ω.
(2) CL includes probe and stray capacitance.
Figure 7.
6
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SNLS077C –JULY 1998–REVISED APRIL 2013
Figure 8. Driver Enable and Disable Timing (tPZL, t PLZ
)
(1)
(2)
(1) The input pulse is supplied by a generator having the following characteristics: f = 1.0 MHz, 50% duty cycle, trand tf <
6.0 ns, ZO = 50Ω.
(2) CL includes probe and stray capacitance.
Figure 9.
Figure 10. Receiver Differential Propagation Delay Timing
(1)
(4)
(3)
(2)
(1) The input pulse is supplied by a generator having the following characteristics: f = 1.0 MHz, 50% duty cycle, trand tf <
6.0 ns, ZO = 50Ω.
(2) CL includes probe and stray capacitance.
(3) Diodes are 1N916 or equivalent.
(4) On transceivers 1–3 the driver is loaded with receiver input conditions when DE/RE is high. Do not exceed the
package power dissipation limit when testing.
Figure 11.
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SNLS077C –JULY 1998–REVISED APRIL 2013
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S1 1.5V
S2 Open
S3 Closed
Figure 12.
Figure 13.
Figure 14.
S1 −1.5V
S2 Closed
C3 Open
S1 1.5V
S2 Closed
C3 Closed
S1 −1.5V
S2 Closed
C3 Closed
Figure 15. Receiver Enable and Disable Timing
8
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SNLS077C –JULY 1998–REVISED APRIL 2013
Tra, Trb, Tfa and Tfb are propagation delay measurements to the 20% and 80% levels.
TCP = Crossing Point
Figure 16. Propagation Delay Timing for Calculations of Driver Differential Propagation Delays
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REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 9
10
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PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
DS36954M
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
NRND
SOIC
SOIC
SOIC
DW
20
20
20
36
TBD
Call TI
Call TI
DS36954
M
DS36954M/NOPB
DS36954MX/NOPB
ACTIVE
ACTIVE
DW
DW
36
Green (RoHS
& no Sb/Br)
SN | CU SN
SN | CU SN
Level-3-260C-168 HR
Level-3-260C-168 HR
Call TI
0 to 70
DS36954
M
1000
Green (RoHS
& no Sb/Br)
0 to 70
DS36954
M
DS36954VX
NRND
PLCC
PLCC
FN
FN
20
20
1000
1000
TBD
Call TI
CU SN
0 to 70
0 to 70
DS36954V
DS36954V
DS36954VX/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-2A-250C-4
WEEK
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS36954MX/NOPB
SOIC
DW
20
1000
330.0
24.4
10.9
13.3
3.25
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC DW 20
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 45.0
DS36954MX/NOPB
1000
Pack Materials-Page 2
MECHANICAL DATA
MPLC004A – OCTOBER 1994
FN (S-PQCC-J**)
PLASTIC J-LEADED CHIP CARRIER
20 PIN SHOWN
Seating Plane
0.004 (0,10)
0.180 (4,57) MAX
0.120 (3,05)
D
0.090 (2,29)
D1
0.020 (0,51) MIN
3
1
19
0.032 (0,81)
0.026 (0,66)
4
18
D2/E2
D2/E2
E
E1
8
14
0.021 (0,53)
0.013 (0,33)
0.050 (1,27)
9
13
0.007 (0,18)
M
0.008 (0,20) NOM
D/E
D1/E1
D2/E2
NO. OF
PINS
**
MIN
0.385 (9,78)
MAX
MIN
MAX
MIN
MAX
0.395 (10,03)
0.350 (8,89)
0.356 (9,04)
0.141 (3,58)
0.191 (4,85)
0.291 (7,39)
0.341 (8,66)
0.169 (4,29)
0.219 (5,56)
0.319 (8,10)
0.369 (9,37)
20
28
44
52
68
84
0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58)
0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66)
0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20)
0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91)
1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45)
4040005/B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
1
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