DS3695A [TI]
DS3695A/DS3695AT/DS3696A Multipoint RS485/RS422 Transceivers; DS3695A / DS3695AT / DS3696A多点RS485 / RS422收发器
| 型号： | DS3695A |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DS3695A/DS3695AT/DS3696A Multipoint RS485/RS422 Transceivers |
| 文件： | 总13页 (文件大小：807K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS3695A, DS3695AT, DS3696A
www.ti.com
SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
DS3695A/DS3695AT/DS3696A Multipoint RS485/RS422 Transceivers
Check for Samples: DS3695A, DS3695AT, DS3696A
1
FEATURES
DESCRIPTION
The DS3695A and DS3696A are high speed
2
•
Meets EIA Standard RS485 for Multipoint Bus
Transmission and is Compatible with RS-422
differential TRI-STATE bus/line transceivers designed
to meet the requirements of EIA standard RS485 with
extended common mode range (+12V to −7V), for
multipoint data transmission. In addition they are
compatible with requirements of RS-422.
•
•
•
10 Ns Driver Propagation Delays (Typical)
Single +5V Supply
−7V to +12V Bus Common Mode Range
Permits ±7V Ground Difference between
Devices on the Bus
The driver and receiver outputs feature TRI-STATE
capability. The driver outputs remain in over the
entire common mode range of +12V to −7V. Bus
faults that cause excessive power dissipation within
the device trigger a thermal shutdown circuit, which
forces the driver outputs into the high impedance
state. The DS3696A provides an output pin (TS)
which reports the thermal shutdown of the device. TS
is an “open collector” pin with an internal 10 kΩ pull-
up resistor. This allows the TS outputs of several
devices to be wire OR-ed.
•
•
Thermal Shutdown Protection
High Impedance to Bus with Driver in TRI-
STATE or with Power Off, over the Entire
Common Mode Range Allows the Unused
Devices on the Bus to be Powered Down
•
Combined Impedance of a Driver Output and
Receiver Input is less than One RS485 Unit
Load, Allowing up to 32 Transceivers on the
Bus
Both AC and DC specifications are guaranteed over
the 0°C to 70°C temperature and 4.75V to 5.25V
supply voltage range.
•
•
70 mV Typical Receiver Hysteresis
Available in SOIC Packaging
Connection and Logic Diagrams
Figure 1. Molded Package, Small Outline (D0008A)
Top View
Figure 2. Top View
(See Package Number D0008A)
TS was LF (Line Fault) on previous datasheets, TS goes low upon thermal shutdown.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1996–2013, Texas Instruments Incorporated
DS3695A, DS3695AT, DS3696A
SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)(2)
Absolute Maximum Ratings
Supply Voltage, VCC
7V
7V
Control Input Voltages
Driver Input Voltage
7V
Driver Output Voltages
Receiver Input Voltages
Receiver Output Voltage
Continuous Power Dissipation @ 25°C
D0008A Package
+15V/−10V
+15V/−10V
5.5V
(3)
630 mW
Storage Temp. Range
−65°C to +150°C
Lead Temp. (Soldering 4 seconds)
260°C
(1) “Absolute maximum ratings” are those beyond which the safety of the device cannot be verified. They are not meant to imply that the
device should be operated at these limits. The tables of “Electrical Characteristics” provide conditions for actual device operation.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Derate linearly at 6.5 mW/°C to 337 mW at 70°C.
Recommended Operating Conditions
Min Max Units
Supply Voltage, VCC
4.75 5.25
V
V
Bus Voltage
−7
+12
Operating Free Air Temperature (TA)
Commercial (DS3695AM)
Industrial (DS3695ATM)
Commercial (DS3696AM)
0
+70
°C
°C
°C
−40 +85
0
+70
(1) (2)
Electrical Characteristics
0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25V unless otherwise specified
Parameter
Test Conditions
Min
Typ
Max
Units
VOD1
VOD2
Differential Driver Output Voltage (Unloaded)
Differential Driver Output Voltage (with Load)
IO = 0
5
V
V
V
V
(3)
R = 50Ω; (RS-422)
R = 27Ω; (RS-485)
R = 27Ω
2
1.5
ΔVOD
Complementary Output States
Differential Output Voltage For
Change in Magnitude of Driver
0.2
VOC
Driver Common Mode Output Voltage
3.0
0.2
V
V
Δ|VOC
|
Change in Magnitude of Driver
Common Mode Output Voltage
For Complementary Output States
VIH
VIL
VCL
IIL
Input High Voltage
Input Low Voltage
Input Clamp Voltage
Input Low Current
Input High Current
DI, DE, RE ,
RE/DE
2
V
V
0.8
−1.5
−200
20
IIN = −18 mA
VIL = 0.4V
VIH = 2.4V
V
μA
μA
IIH
(1) All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
(2) All typicals are given for VCC = 5V and TA = 25°C.
(3) All limits for which this note is applied must be derated by 10% for DS3695AT. Other parameters remain the same for this extended
temperature range device (−40°C ≤ TA ≤ +85°C).
2
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Copyright © 1996–2013, Texas Instruments Incorporated
Product Folder Links: DS3695A DS3695AT DS3696A
DS3695A, DS3695AT, DS3696A
www.ti.com
SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
Electrical Characteristics (1) (2) (continued)
0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25V unless otherwise specified
Parameter
Test Conditions
Min
Typ
Max
+1.0
−0.8
+0.2
Units
mA
mA
V
IIN
Input Current
RI, RI, DO/RI,
DO/RI
VCC = 0V or 5.25V,
VIN = 12V
DE or RE /DE = 0V
VIN = −7V
VTH
Differential Input Threshold Voltage for Receiver
Receiver Input Hysteresis
−7V ≤ VCM ≤ +12V
VCM = 0V
−0.2
ΔVTH
VOH
VOL
70
mV
V
Receiver Output High Voltage
IOH = −400 μA
2.4
(3)
Output Low Voltage
RO
TS
IOL = 16 mA
0.5
V
IOL = 8 mA
0.45
V
IOZR
Output Current at Receiver OFF-State (High
Impedance)
0.4V ≤ VO ≤ 2.4V, VCC = Max,
±20
μA
RIN
ICC
Receiver Input Resistance
Supply Current
−7V ≤ VCM ≤ +12V
12
kΩ
Driver Outputs
Enabled
42
27
60
40
mA
No Load(3)
Driver Outputs
Disabled
mA
(3)
IOSD
VO = −7V
VO = +12V
VO = 0V
−250
+250
−85
mA
mA
mA
Output Current Driver Short-Circuit
Output Current Receiver Short-Circuit
(3)
IOSR
−15
Receiver Switching Characteristics
0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25V unless otherwise specified
(4)
Symbol
Test Conditions
Min
15
15
0
Typ Max
Units
ns
tPLH
tPHL
|tPLH–tPHL
tPLZ
CL = 15 pF
28
28
3
42
42
S1 and S2
ns
|
Closed
ns
CL = 15 pF, S2 Open
CL = 15 pF, S1 Open
CL = 15 pF, S2 Open
CL = 15 pF, S1 Open
5
29
12
15
15
35
16
28
20
ns
tPHZ
5
ns
tPZL
7
ns
tPZH
7
ns
(4) All typicals are given for VCC = 5V and TA = 25°C.
Driver Switching Characteristics
0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25V unless otherwise specified
(1)
Symbol
Test Conditions
Min
Typ Max Units
SINGLE ENDED CHARACTERISTICS (Figure 7, Figure 8, and Figure 10)
tPLH
RLDIFF = 60Ω
9
9
15
15
2
22
22
8
ns
ns
ns
ns
ns
ns
ns
tPHL
CL1 = CL2 = 100 pF
tSKEW|tPLH–tPHL
|
0
tPLZ
tPHZ
tPZL
tPZH
CL = 15 pF, S2 Open
CL = 15 pF, S1 Open
CL = 100 pF, S2 Open
CL = 100 pF, S1 Open
7
15
15
35
35
30
30
50
50
7
30
30
DIFFERENTIAL SWITCHING CHARACTERISTICS (Figure 10)
tr, tf
RLDIFF = 60Ω
CL1 = CL2 = 100 pF
6
10
18
ns
(1) All typicals are given for VCC = 5V and TA = 25°C.
Copyright © 1996–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: DS3695A DS3695AT DS3696A
DS3695A, DS3695AT, DS3696A
SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
www.ti.com
AC TEST CIRCUITS AND SWITCHING WAVEFORMS
Figure 3. Receiver Propagation Delay Test Circuit
Differential input voltage may be realized by grounding RI and pulsing RI between +2.5V and −2.5V
Figure 4. Receiver Input-to-Output Propagation Delay Timing
Figure 5. Receiver Enable/Disable Propagation Delay Timing
Figure 6. Unless Otherwise Specified the Switches are Closed
4
Submit Documentation Feedback
Copyright © 1996–2013, Texas Instruments Incorporated
Product Folder Links: DS3695A DS3695AT DS3696A
DS3695A, DS3695AT, DS3696A
www.ti.com
SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
Figure 7. Driver Propagation Delay Test Circuits
tPLH and tPHL are measured to the respective 50% points. tSKEW is the difference between propagation delays of the
complementary outputs.
Figure 8. Driver Input-to-Output Propagation Delay Timing (Single-Ended)
Figure 9. Driver Enable/Disable Propagation Delay Timing
Figure 10. Driver Differential Transition Timing
Copyright © 1996–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: DS3695A DS3695AT DS3696A
DS3695A, DS3695AT, DS3696A
SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
www.ti.com
Table 1. Function Tables DS3695A/DS3696A Transmitting(1)
Inputs
Line
Condition
No Fault
No Fault
X
Outputs
TS * (DS3696A Only)
RE
X
DE
1
DI
1
DO
0
DO
1
H
H
H
L
X
1
0
1
0
X
0
X
X
Z
Z
X
1
Fault
Z
Z
Table 2. Function Tables DS3695A/DS3696A Receiving(1)
Inputs
Outputs
RE
DE
0
RI–RI
≥+0.2V
RO
1
TS * (DS3696A Only)
0
0
0
1
H
H
H
H
0
≤−0.2V
0
0
Inputs Open**
X
1
0
Z
(1) X — Don't care condition
Z — High impedance state
Fault — Improper line conditions causing excessive power dissipation in the driver, such as shorts or bus contention situations
* TS is an “open collector” output with an on-chip 10 kΩ pull-up resistor.
** This is a fail safe condition
(1) X — Don't care condition
Z — High impedance state
Fault — Improper line conditions causing excessive power dissipation in the driver, such as shorts or bus contention situations
* TS is an “open collector” output with an on-chip 10 kΩ pull-up resistor.
** This is a fail safe condition
Typical Application
Repeater control logic not shown.
Figure 11.
6
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Copyright © 1996–2013, Texas Instruments Incorporated
Product Folder Links: DS3695A DS3695AT DS3696A
DS3695A, DS3695AT, DS3696A
www.ti.com
SNLS353C –FEBRUARY 1996–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 6
Copyright © 1996–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: DS3695A DS3695AT DS3696A
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
DS3695AM
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
NRND
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
8
8
8
8
8
8
8
8
95
TBD
Call TI
SN | CU SN
Call TI
Call TI
Level-1-260C-UNLIM
Call TI
DS36
95AM
DS3695AM/NOPB
DS3695AMX
ACTIVE
NRND
D
D
D
D
D
D
D
95
2500
2500
95
Green (RoHS
& no Sb/Br)
0 to 70
DS36
95AM
TBD
0 to 70
DS36
95AM
DS3695AMX/NOPB
DS3695ATM
ACTIVE
NRND
Green (RoHS
& no Sb/Br)
SN | CU SN
Call TI
Level-1-260C-UNLIM
Call TI
0 to 70
DS36
95AM
TBD
-40 to 85
-40 to 85
-40 to 85
-40 to 85
DS369
5ATM
DS3695ATM/NOPB
DS3695ATMX
ACTIVE
NRND
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
Call TI
DS369
5ATM
2500
2500
TBD
Call TI
DS369
5ATM
DS3695ATMX/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
DS369
5ATM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS3695AMX
DS3695AMX/NOPB
DS3695ATMX
SOIC
SOIC
SOIC
SOIC
D
D
D
D
8
8
8
8
2500
2500
2500
2500
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
6.5
6.5
6.5
6.5
5.4
5.4
5.4
5.4
2.0
2.0
2.0
2.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
DS3695ATMX/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DS3695AMX
DS3695AMX/NOPB
DS3695ATMX
SOIC
SOIC
SOIC
SOIC
D
D
D
D
8
8
8
8
2500
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
DS3695ATMX/NOPB
Pack Materials-Page 2
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