DS3696MDC [TI]
LINE TRANSCEIVER, UUC, DIE;
| 型号： | DS3696MDC |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LINE TRANSCEIVER, UUC, DIE |
| 文件： | 总17页 (文件大小：577K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS3695, DS3695T, DS3696, DS3697
www.ti.com
SNLS072C –MAY 1998–REVISED APRIL 2013
Multipoint RS485/RS422 Transceivers/Repeaters
Check for Samples: DS3695, DS3695T, DS3696, DS3697
1
FEATURES
DESCRIPTION
The DS3695, DS3696, and DS3697 are high speed
differential TRI-STATE bus/line
transceivers/repeaters designed to meet the
requirements of EIA standard RS485 with extended
common mode range (+12V to −7V), for multipoint
data transmission.
2
•
Meets EIA standard RS485 for Multipoint Bus
Transmission and is Compatible with RS-422
•
15 ns Driver Propagation Delays with 2 ns
Skew (Typical)
•
•
Single +5V supply
−7V to +12V Bus Common Mode Range
Permits ±7V Ground Difference Between
Devices on the Bus
The driver and receiver outputs feature TRI-STATE
capability. The driver outputs remain in TRI-STATE
over the entire common mode range of +12V to −7V.
Bus faults that cause excessive power dissipation
within the device trigger a thermal shutdown circuit,
which forces the driver outputs into the high
impedance state. The DS3696 provides an output pin
TS (thermal shutdown) which reports the occurrence
of the thermal shutdown of the device. This is an
“open collector” pin with an internal 10 kΩ pull-up
resistor. This allows the line fault outputs of several
devices to be wire OR-ed.
•
•
Thermal Shutdown Protection
High Impedance to Bus with Driver in TRI-
STATE or with Power Off, Over the Entire
Common Mode Range Allows the Unused
Devices on the Bus to be Powered Down
•
•
Combined Impedance of a Driver Output and
Receiver Input is Less than one RS485 Unit
Load, Allowing up to 32 Transceivers on the
Bus
Both AC and DC specifications are specified over the
0°C to 70°C temperature and 4.75V to 5.25V supply
voltage range.
70 mV Typical Receiver Hysteresis
Connection and Logic Diagrams
Figure 1. PDIP (Top View)
See Package Number P (R-PDIP-T8)
Figure 2. PDIP (Top View)
See Package Number P (R-PDIP-T8)
Figure 3. PDIP (Top View)
See Package Number P (R-PDIP-T8)
TS pin was LF (Line Fault) in previous data sheets and reports the occurrence of a thermal shutdown of the device.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS3695, DS3695T, DS3696, DS3697
SNLS072C –MAY 1998–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)(2)
Absolute Maximum Ratings
VALUE
UNIT
V
Supply Voltage, VCC
7
7
Control Input Voltages
V
Driver Input Voltage
7
V
Driver Output Voltages
+15/−10
+15/−10
±25
V
Receiver Input Voltages (DS3695, DS3696)
Receiver Common Mode Voltage (DS3697)
Receiver Output Voltage
V
V
5.5
V
Continuous Power Dissipation @ 25°C - N Package(3)
1.07
W
°C
°C
Storage Temperature Range
−65 to +150
260
Lead Temperature (Soldering, 4 sec.)
(1) “Absolute Maximum Ratings” are those beyond which the safety of the device cannot be verified. They are not meant to imply that the
device should be operated at these limits. The tables of “Electrical Characteristics” provide conditions for actual device operation.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) All typicals are given for VCC = 5V and TA = 25°C.
Recommended Operating Conditions
Min
4.75
−7
Max
5.25
+12
+70
+85
Units
V
Supply Voltage, VCC
Bus Voltage
V
Operating Free Air Temp. (TA)
Commercial
Industrial
0
°C
°C
−40
(1)(2)
Electrical Characteristics
0°C ≤ TA ≤ +70°C, 4.75V < VCC < 5.25V unless otherwise specified
Symbol
VOD1
Parameter
Conditions
Min
Typ
Max
Units
Differential Driver Output Voltage (Unloaded)
Differential Driver Output Voltage (with Load)
IO = 0
5
V
V
V
V
(3)
VOD2
See Figure 4
R = 50Ω; (RS-422)
2
R = 27Ω; (RS-485)
R = 27Ω
1.5
ΔVOD
Change in Magnitude of Driver
Differential Output Voltage for
Complementary Output States
See Figure 4
0.2
VOC
Driver Common Mode Output Voltage
3.0
0.2
V
V
Δ|VOC
|
Change in Magnitude of Driver
Common Mode Output Voltage for
Complementary Output States
VIH
VIL
VCL
IIL
Input High Voltage
Input Low Voltage
Input Clamp Voltage
Input Low Current
Input High Current
Input Current
DI, DE, RE , E, RE /DE
2
V
V
0.8
−1.5
−200
20
IIN = −18 mA
VIL = 0.4V
VIH = 2.4V
VIN = 12V
VIN = −7V
V
μA
μA
mA
mA
IIH
IIN
DO/RI, DO /RI RI, RI
VCC = 0V or 5.25V
RE /DE or DE = 0V
+1.0
−0.8
(1) All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
(2) All typicals are given for VCC = 5V and TA = 25°C.
(3) All limits for which derate linearly at 11.1 mW/°C to 570 mW at 70°C is applied must be derated by 10% for DS3695T and DS3696T.
Other parameters remain the same for this extended temperature range device (−40°C ≤ TA ≤ +85°C).
2
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS3695 DS3695T DS3696 DS3697
DS3695, DS3695T, DS3696, DS3697
www.ti.com
SNLS072C –MAY 1998–REVISED APRIL 2013
Electrical Characteristics (1)(2) (continued)
0°C ≤ TA ≤ +70°C, 4.75V < VCC < 5.25V unless otherwise specified
Symbol
Parameter
TRI-STATE Current DO, DO
DS3697 & DS3698
Conditions
Min
Typ
Max
Units
IOZD
VCC = 0V or 5.25V, E = 0V
±100
μA
−7V < VO < +12V
VTH
Differential Input Threshold
Voltage for Receiver
−7V ≤ VCM ≤ +12V
−0.2
+0.2
V
ΔVTH
VOH
VOL
Receiver Input Hysteresis
VCM = 0V
70
mV
V
Receiver Output High Voltage
IOH = −400 μA
2.4
(3)
Output Low Voltage
RO
TS
IOL = 16 mA
0.5
V
IOL = 8 mA
0.45
V
IOZR
OFF-State (High Impedance)
Output Current at Receiver
VCC = Max
0.4V ≤ VO ≤ 2.4V
±20
μA
RIN
ICC
Receiver Input Resistance
Supply Current
−7V ≤ VCM ≤ +12V
12
kΩ
mA
mA
mA
mA
mA
(3)
No Load
Driver Outputs Enabled
Driver Outputs Disabled
42
27
60
40
(3)
IOSD
Driver Short-Circuit Output Current
Receiver Short-Circuit Output Current
VO = −7V
−250
+250
−85
(3)
VO = +12V
VO = 0V
IOSR
−15
(1)(2)
Receiver Switching Characteristics
0°C ≤ TA ≤ +70°C, 4.75V < VCC < 5.25V unless otherwise specified (Figure 5, Figure 6, Figure 7)
Symbol
Conditions
Min
15
15
0
Typ
Max
Units
tPLH
CL = 15 pF
25
25
37
37
ns
ns
ns
ns
ns
ns
ns
tPHL
S1 and S2
|tPLH–tPHL
|
Closed
tPLZ
CL = 15 pF, S2 Open
CL = 15 pF, S1 Open
CL = 15 pF, S2 Open
CL = 15 pF, S1 Open
5
12
12
15
15
16
16
20
20
tPHZ
5
tPZL
7
tPZH
7
(1) All typicals are given for VCC = 5V and TA = 25°C.
(2) Switching Characteristics apply for DS3695, DS3695T, DS3696, DS3697 only.
Driver Switching Characteristics
0°C ≤ TA ≤ +70°C, 4.75V < VCC < 5.25V unless otherwise specified
Symbol
Conditions
Min
Typ
Max
Units
SINGLE ENDED CHARACTERISTICS (Figure 8, Figure 9, Figure 10)
tPLH
RLDIFF = 60Ω
9
9
15
15
2
22
22
8
ns
ns
ns
ns
ns
ns
ns
tPHL
CL1 = CL2 = 100 pF
tSKEW|tPLH–tPHL
|
tPLZ
tPHZ
tPZL
tPZH
CL = 15 pF, S2 Open
CL = 15 pF, S1 Open
CL = 100 pF, S2 Open
CL = 100 pF, S1 Open
7
7
15
15
35
35
30
30
50
50
30
30
DIFFERENTIAL CHARACTERISTICS (Figure 8 Figure 11)
tr, tf
RLDIFF = 60Ω
CL1 = CL2 = 100 pF
6
10
18
ns
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: DS3695 DS3695T DS3696 DS3697
DS3695, DS3695T, DS3696, DS3697
SNLS072C –MAY 1998–REVISED APRIL 2013
www.ti.com
AC Test Circuits and Switching Waveforms
Figure 4. Driver VOD and VOC
Figure 5. Receiver Propagation Delay Test Circuit
Note: Differential input voltage may be realized by grounding RI and pulsing RI between +2.5V and −2.5V.
Figure 6. Receiver Input-to-Output Propagation Delay Timing
Figure 7. Receiver Enable/Disable Propagation Delay Timing
Note: Unless otherwise specified the switches are closed.
4
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS3695 DS3695T DS3696 DS3697
DS3695, DS3695T, DS3696, DS3697
www.ti.com
SNLS072C –MAY 1998–REVISED APRIL 2013
Figure 8. Driver Propagation Delay and Transition Time Test Circuits
Note: tPLH and tPHL are measured to the respective 50% points. tSKEW is the difference between propagation delays of
the complementary outputs.
Figure 9. Driver Input-to-Output Propagation Delay Timing (Single-Ended)
Figure 10. Driver Enable/Disable Propagation Delay Timing
Figure 11. Driver Differential Transition Timing
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: DS3695 DS3695T DS3696 DS3697
DS3695, DS3695T, DS3696, DS3697
SNLS072C –MAY 1998–REVISED APRIL 2013
www.ti.com
Function Tables
Table 1. DS3695/DS3696 Transmitting(1)
Inputs
DE
Outputs
DO
Thermal
Shutdown
TS *
(DS3696 Only)
RE
DI
DO
X
X
X
X
1
1
0
1
1
0
OFF
OFF
OFF
ON
0
1
Z
Z
1
0
Z
Z
H
H
H
L
X
X
(1) X—Don't care condition
Z—High impedance state
*TS is an “open collector” output with an on-chip 10 kΩ pull-up resistor that reports the occurrence of a thermal shutdown of the device.
Table 2. DS3695/DS3696 Receiving(1)
Inputs
DE
Outputs
TS *
(DS3696 Only)
RE
RI–RI
RO
0
0
1
0
0
0
≥ +0.2V
≤ −0.2V
X
1
0
Z
H
H
H
(1) X—Don't care condition
Z—High impedance state
*TS is an “open collector” output with an on-chip 10 kΩ pull-up resistor that reports the occurrence of a thermal shutdown of the device.
Table 3. DS3697(1)
Inputs
Outputs
DO
Thermal
Shutdown
RO
E
RI-RI
DO
(DS3697 Only)
1
1
0
1
1
≥ +0.2V
≤ −0.2V
X
OFF
OFF
OFF
ON
0
1
Z
Z
Z
1
0
Z
Z
Z
1
0
Z
1
0
≥ +0.2V
≤ −0.2V
ON
(1) X—Don't care condition
Z—High impedance state
*TS is an “open collector” output with an on-chip 10 kΩ pull-up resistor that reports the occurrence of a thermal shutdown of the device.
Typical Application
Note: Repeater control logic not shown
6
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS3695 DS3695T DS3696 DS3697
DS3695, DS3695T, DS3696, DS3697
www.ti.com
SNLS072C –MAY 1998–REVISED APRIL 2013
Typical Performance Characteristics
Driver VOH
Driver VOH
vs IOH
vs
IOH
vs
vs VCCDriver VOH
vs IOH
Temperature
vs VCC
Figure 12.
Figure 13.
Driver VOL
vs
IOL
vs
Driver VOH
vs IOH
vs VCC
Temperature
Figure 14.
Figure 15.
Driver Differential
Propagation Delay
vs
Driver Differential
Propagation Delay
vs
VCC
Temperature
Figure 16.
Figure 17.
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: DS3695 DS3695T DS3696 DS3697
DS3695, DS3695T, DS3696, DS3697
SNLS072C –MAY 1998–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
Driver Single-Ended
Propagation Delay
vs
Driver Single-Ended
Propagation Delay
vs
VCC
Temperature
Figure 18.
Figure 19.
Driver Transition Time
Driver Transition Time
vs
vs
Temperature
VCC
Figure 20.
Figure 21.
Cable Length
vs
Data Rate
Supply Current
vs
Temperature
Figure 22.
Figure 23.
8
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS3695 DS3695T DS3696 DS3697
DS3695, DS3695T, DS3696, DS3697
www.ti.com
SNLS072C –MAY 1998–REVISED APRIL 2013
Typical Performance Characteristics (continued)
Supply Current
vs
Power Supply Voltage
Driver ICC
vs
Switching Frequency
Figure 24.
Figure 25.
Receiver VOH
vs
Driver Short Circuit Current
IOH
vs
vs
Temperature
Temperature
Figure 26.
Figure 27.
Receiver VOH
vs
IOH
vs
Driver Short Circuit Current
vs
VCC
Temperature
Figure 28.
Figure 29.
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: DS3695 DS3695T DS3696 DS3697
DS3695, DS3695T, DS3696, DS3697
SNLS072C –MAY 1998–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
Receiver VOH
Receiver VOH
vs
vs
IOH
vs
IOH
vs
Temperature
VCC
Figure 30.
Figure 31.
Receiver VOL
Receiver VOL
vs
vs
IOL
vs
IOL
vs
Temperature
VCC
Figure 32.
Figure 33.
Receiver Differential
Propagation Delay
vs
Receiver Differential
Propagation Delay
vs
VCC
Temperature
Figure 34.
Figure 35.
10
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS3695 DS3695T DS3696 DS3697
DS3695, DS3695T, DS3696, DS3697
www.ti.com
SNLS072C –MAY 1998–REVISED APRIL 2013
Typical Performance Characteristics (continued)
Receiver Short
Circuit Current
vs
Receiver Short
Circuit Current
vs
Temperature
Power Supply
Figure 36.
Figure 37.
Receiver Non-Inverting
Input Current
vs
Receiver Non-Inverting
Input Current
vs
Temperature
Power Supply Voltage
Figure 38.
Figure 39.
Receiver Inverting
Input Current
vs
Receiver Inverting
Input Current
vs
Temperature
Power Supply Voltage
Figure 40.
Figure 41.
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: DS3695 DS3695T DS3696 DS3697
DS3695, DS3695T, DS3696, DS3697
SNLS072C –MAY 1998–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
Hysteresis and
Hysteresis and Differential
Transition Voltage
vs
Differential Transition
Voltage
vs
VCC
Temperature
Figure 42.
Figure 43.
12
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS3695 DS3695T DS3696 DS3697
DS3695, DS3695T, DS3696, DS3697
www.ti.com
SNLS072C –MAY 1998–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 11
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: DS3695 DS3695T DS3696 DS3697
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
DS3695N
NRND
ACTIVE
PDIP
PDIP
P
P
8
8
40
TBD
Call TI
Call TI
0 to 70
0 to 70
DS3695N
DS3695N/NOPB
40
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-NA-UNLIM
DS3695N
DS3695TN
NRND
PDIP
PDIP
P
P
8
8
40
40
TBD
Call TI
Call TI
-40 to 85
-40 to 85
DS
3695TN
DS3695TN/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-NA-UNLIM
DS
3695TN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明