DS90CR486 [TI]

133MHz 48 位 Channel Link 解串器;
DS90CR486
型号: DS90CR486
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

133MHz 48 位 Channel Link 解串器

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DS90CR486  
www.ti.com  
SNLS149C FEBRUARY 2003REVISED MARCH 2013  
DS90CR486 133MHz 48-Bit Channel Link Deserializer (6.384 Gbps)  
Check for Samples: DS90CR486  
The DS90CR486 deserializer is improved over prior  
1
FEATURES  
generations of Channel Link devices and offers  
higher bandwidth support and longer cable drive with  
three areas of enhancement. To increase bandwidth,  
the maximum clock rate is increased to 133 MHz and  
8 serialized LVDS outputs are provided. Cable drive  
is enhanced with a user selectable pre-emphasis (on  
DS90CR485) feature that provides additional output  
current during transitions to counteract cable loading  
effects. Optional DC balancing on a cycle-to-cycle  
basis, is also provided to reduce ISI (Inter-Symbol  
Interference). With pre-emphasis and DC balancing,  
a low distortion eye-pattern is provided at the receiver  
end of the cable. A cable deskew capability has been  
added to deskew long cables of pair-to-pair skew.  
These three enhancements allow long cables to be  
driven.  
2
Up to 6.384 Gbps Throughput  
66MHz to 133MHz Input Clock Support  
Reduces Cable and Connector Size and Cost  
Cable Deskew Function  
DC Balance Reduces ISI Distortion  
For Point-to-Point Backplane or Cable  
Applications  
Low Power, 890 mW Typ at 133MHz  
Flow through Pinout for Easy PCB Design  
+3.3V Supply Voltage  
100-pin TQFP Package  
Conforms to TIA/EIA-644-A-2001 LVDS  
Standard  
The DS90CR486 is intended to be used with the  
DS90CR485 Channel Link Serializer. It is also  
backward compatible with serializers DS90CR481  
and DS90CR483. The DS90CR486 is footprint  
compatible with the DS90CR484.  
DESCRIPTION  
The DS90CR486 receiver converts eight Low Voltage  
Differential Signaling (LVDS) data streams back into  
48 bits of LVCMOS/LVTTL data. Using a 133MHz  
clock, the data throughput is 6.384Gbit/s  
(798Mbytes/s).  
The chipset is an ideal solution to solve EMI and  
interconnect size problems for high-throughput point-  
to-point applications.  
The multiplexing of data lines provides a substantial  
cable reduction. Long distance parallel single-ended  
buses typically require a ground wire per active signal  
(and have very limited noise rejection capability).  
Thus, for a 48-bit wide data and one clock, up to 98  
conductors are required. With this Channel Link  
chipset as few as 19 conductors (8 data pairs, 1 clock  
pair and a minimum of one ground) are needed. This  
provides an 80% reduction in interconnect width,  
which provides a system cost savings, reduces  
connector physical size and cost, and reduces  
shielding requirements due to the cables' smaller  
form factor.  
For more details, please refer to the APPLICATIONS  
INFORMATION section of this datasheet.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2003–2013, Texas Instruments Incorporated  
DS90CR486  
SNLS149C FEBRUARY 2003REVISED MARCH 2013  
www.ti.com  
Generalized Block Diagram  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
(1)(2)  
Absolute Maximum Ratings  
Value  
Unit  
Supply Voltage (VCC  
)
0.3 to +3.6  
V
V
LVCMOS/LVTTL Output Voltage  
LVDS Receiver Input Voltage  
0.3 to (VCC + 0.3)  
0.3 to +3.6  
V
Junction Temperature  
+150  
°C  
°C  
°C  
W
Storage Temperature  
65 to +150  
Lead Temperature (Soldering, 4 sec.)  
Maximum Package Power Dissipation Capacity @ 25°C 100 TQFP Package:  
Package Derating:  
+260  
2.9  
23.8 mW/°C above +25°C  
ESD Rating: (HBM, 1.5k, 100pF)  
ESD Rating: (EIAJ, 0, 200pF)  
> 2  
kV  
V
> 200  
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply  
that the device should be operated at these limits. “Electrical Characteristics” specify conditions for device operation.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and  
specifications.  
Recommended Operating Conditions  
Min  
3.14  
10  
0
Nom  
3.3  
Max  
3.46  
+70  
2.4  
Units  
V
Supply Voltage (VCC  
)
Operating Free Air Temperature (TA)  
Receiver Input Range  
+25  
°C  
V
Supply Noise Voltage (VCC  
)
100  
133  
mVp-p  
MHz  
Clock Rate  
66  
2
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Electrical Characteristics(1)  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ(2)  
Max  
Units  
LVCMOS/LVTTL DC SPECIFICATIONS  
VIH  
High Level Input Voltage  
All LVCMOS/LVTTL inputs except PD .  
For PD input only.  
2.0  
2.5  
VCC  
VCC  
0.8  
V
V
VIL  
IIN  
Low Level Input Voltage  
Input Current  
GND  
V
(3)  
VIN = 0.4V, 2.5V, or VCC  
+1.8  
0
+15  
µA  
µA  
V
VIN = GND  
15  
VOH  
VOL  
IOS  
High Level Output Voltage IOH = 2 mA  
2.0  
Low Level Output Voltage IOL = +2 mA  
0.4  
V
Output Short Circuit  
Current  
VOUT = 0V  
120  
mA  
VCL  
Input Clamp Voltage  
ICL = 18 mA  
0.8  
1.5  
V
LVDS RECEIVER DC SPECIFICATIONS  
VTH  
VTL  
IIN  
Differential Input High  
Threshold  
VCM = +1.2V  
+100  
mV  
mV  
Differential Input Low  
Threshold  
100  
Input Current  
VIN = +2.4V, VCC = 3.6V  
VIN = 0V, VCC = 3.6V  
±10  
±10  
µA  
µA  
RECEIVER SUPPLY CURRENT  
ICCRW  
Receiver Supply Current  
Worst Case  
CL = 8 pF, BAL = Low,  
Worst Case Pattern  
(Figure 1 and Figure 2)  
f = 66 MHz  
f = 100 MHz  
f = 133 MHz  
190  
230  
270  
60  
245  
325  
340  
110  
mA  
mA  
mA  
µA  
ICCRZ  
Receiver Supply Current  
Power Down  
PD = Low  
Receiver Outputs stay low during Power down mode.  
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground  
unless otherwise specified (except VTH, VTL and ΔVID).  
(2) Typical values are given for VCC = 3.3V and T A = +25°C.  
(3) The IIN parameter for the PD pin is not tested at 2.5V.  
Receiver Switching Characteristics  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
CLHT  
LVCMOS/LVTTL Low-to-High Transition Time, (Figure 2), Rx  
data out,  
0.8  
1.3  
ns  
(1)  
LVCMOS/LVTTL Low-to-High Transition Time, (Figure 2), Rx  
clock out,  
0.7  
0.9  
0.8  
T
1.0  
1.3  
ns  
ns  
ns  
(1)  
CHLT  
LVCMOS/LVTTL High-to-Low Transition Time, (Figure 2), Rx  
(1)  
data out,  
LVCMOS/LVTTL High-to-Low Transition Time, (Figure 2), Rx  
1.0  
(1)  
clock out,  
RCOP  
RCOH  
RxCLK OUT Period, (Figure 3)  
7.518  
2.7  
15.152  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
RxCLK OUT High Time, (Figure 3)  
RxCLK OUT Low Time, (Figure 3)  
f = 133 MHz  
f = 100 MHz  
f = 66 MHz  
f = 133 MHz  
f = 100 MHz  
f = 66 MHz  
3.8  
6.0  
RCOL  
2.7  
3.8  
6.0  
(1) CLHT and CHLT are measurements of the receiver data outputs low-to-high and high-to-low time over the recommended frequency  
range. The limits are based on bench characterization and Specified By Design (SBD) using statistical analysis.  
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Receiver Switching Characteristics (continued)  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
Parameter  
Min  
2.0  
Typ  
3.5  
Max  
Units  
ns  
RSRC  
RxOUT Data valid before RxCLK OUT,  
(Figure 3)  
f = 133 MHz  
f = 100 MHz  
f = 66 MHz  
3.0  
4.7  
ns  
5.0  
7.0  
ns  
RHRC  
RxOUT Data valid after RxCLK OUT, (Figure 3) f = 133 MHz  
f = 100 MHz  
2.5  
4.1  
ns  
3.5  
5.0  
ns  
f = 66 MHz  
6.0  
8.0  
ns  
RPDL  
Receiver Propagation Delay - Latency, (Figure 4)  
Receiver Phase Lock Loop Set ,(Figure 5)  
Receiver Powerdown Delay, (Figure 6)  
Receiver Skew Margin with Deskew, BAL=Low f = 133 MHz  
2(TCIP)+5  
2(TCIP)+10  
2(TCIP)+15  
ns  
RPLLS  
RPDD  
RSKMD  
10  
1
ms  
µs  
ps  
275  
400  
(2)  
(Figure 7),  
f = 100 MHz  
ps  
f = 66 MHz  
500  
ps  
RDR  
Receiver Deskew Range  
f = 133 MHz  
f = 100 MHz  
f = 66 MHz  
150  
200  
200  
+150  
+200  
+200  
ps  
ps  
ps  
(2) Receiver Skew Margin with Deskew (RSKMD) is defined as the valid data sampling region at the receiver inputs. The DESKEW function  
will constrain the receiver’s sampling strobes to the middle half of the LVDS bit and removes (adjusts for) fixed interconnect skew. This  
margin (RSKMD) allows for inter-symbol interference (dependent on type/length of cable), Transmitter Pulse Position (TPPOS) variance,  
and LVDS clock jitter (TJCC).RSKMD ISI + TPPOS(variance) + LVDS Source Clock Jitter (cycle to cycle). See APPLICATIONS  
INFORMATION section for more details.  
4
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AC Timing Diagrams  
The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and LVCMOS/LVTTL I/O.  
Figure 1. “Worst Case” Test Pattern  
Figure 2. DS90CR486 LVCMOS/LVTTL Output Load and Transition Times  
Figure 3. DS90CR486 Setup/Hold and High/Low Times  
Figure 4. DS90CR486 Propagation Delay - Latency  
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Figure 5. DS90CR486 Phase Lock Loop Set Time (VCC > 3.0V)  
Figure 6. DS90CR486 Power Down Delay  
C—Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and  
max  
Tppos—Transmitter output pulse position (min and max)  
RSKMD = ISI (Inter-symbol interference) + TPPOS(variance) + LVDS Source Clock Jitter (cycle to cycle)  
Cable Skew—typically 10 ps–40 ps per foot, media dependent  
Refer to transmitter datasheet for Cycle-to-cycle LVDS Output jitter specification.  
ISI is dependent on interconnect length; may be zero. Pre-emphasis in the transimitter is used to reduce the ISI.  
Refer to transmitter datasheet for more information.  
Figure 7. Receiver Skew Margin with DESKEW (RSKMD)  
6
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LVDS Interface  
Figure 8. 48 LVCMOS/LVTTL Outputs Mapped to 8 LVDS Inputs  
(DC Balance Mode- Disable, BAL = Low)  
(E1 - Falling Edge; E2 - Rising Edge)  
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Figure 9. 48 LVCMOS/LVTTL Outputs Mapped to 8 LVDS Inputs  
(DC Balance Mode - Enable, BAL = High)  
(E1 - Falling Edge; E2 - Rising Edge)  
Table 1. DS90CR486 Outputs Mapped to DS90CR485 Outputs/DS90CR483 Inputs  
DS90CR486 Receiver Output  
DS90CR485 Transmitter Input *  
DS90CR483 Transmitter Input  
RxOUT0  
RxOUT1  
RxOUT2  
RxOUT3  
RxOUT4  
RxOUT5  
RxOUT6  
RxOUT7  
RxOUT8  
RxOUT9  
RxOUT10  
RxOUT11  
RxOUT12  
RxOUT13  
RxOUT14  
RxOUT15  
RxOUT16  
E2-D0  
E2-D1  
E2-D2  
E2-D3  
E2-D4  
E2-D5  
E2-D6  
E2-D7  
E2-D8  
E2-D9  
E2-D10  
E2-D11  
E2-D12  
E2-D13  
E2-D14  
E2-D15  
E2-D16  
TxIN0  
TxIN1  
TxIN2  
TxIN3  
TxIN4  
TxIN5  
TxIN6  
TxIN7  
TxIN8  
TxIN9  
TxIN10  
TxIN11  
TxIN12  
TxIN13  
TxIN14  
TxIN15  
TxIN16  
8
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Table 1. DS90CR486 Outputs Mapped to DS90CR485 Outputs/DS90CR483 Inputs (continued)  
DS90CR486 Receiver Output  
RxOUT17  
RxOUT18  
RxOUT19  
RxOUT20  
RxOUT21  
RxOUT22  
RxOUT23  
RxOUT24  
RxOUT25  
RxOUT26  
RxOUT27  
RxOUT28  
RxOUT29  
RxOUT30  
RxOUT31  
RxOUT32  
RxOUT33  
RxOUT34  
RxOUT35  
RxOUT36  
RxOUT37  
RxOUT38  
RxOUT39  
RxOUT40  
RxOUT41  
RxOUT42  
RxOUT43  
RxOUT44  
RxOUT45  
RxOUT46  
RxOUT47  
DS90CR485 Transmitter Input *  
E2-D17  
E2-D18  
E2-D19  
E2-D20  
E2-D21  
E2-D22  
E2-D23  
E1-D0  
DS90CR483 Transmitter Input  
TxIN17  
TxIN18  
TxIN19  
TxIN20  
TxIN21  
TxIN22  
TxIN23  
TxIN24  
E1-D1  
TxIN25  
E1-D2  
TxIN26  
E1-D3  
TxIN27  
E1-D4  
TxIN28  
E1-D5  
TxIN29  
E1-D6  
TxIN30  
E1-D7  
TxIN31  
E1-D8  
TxIN32  
E1-D9  
TxIN33  
E1-D10  
E1-D11  
E1-D12  
E1-D13  
E1-D14  
E1-D15  
E1-D16  
E1-D17  
E1-D18  
E1-D19  
E1-D20  
E1-D21  
E1-D22  
E1-D23  
TxIN34  
TxIN35  
TxIN36  
TxIN37  
TxIN38  
TxIN39  
TxIN40  
TxIN41  
TxIN42  
TxIN43  
TxIN44  
TxIN45  
TxIN46  
TxIN47  
* E1 = Falling Edge and E2 = Rising Edge of RxCLK P/M Input Clock Edge  
DS90CR486 PIN DESCRIPTIONS — CHANNEL LINK RECEIVER(1)  
Pin Name  
I/O  
No.  
8
Description  
Positive LVDS differential data inputs.  
Negative LVDS differential data inputs.  
RxINP  
RxINM  
I
I
8
RxOUT  
O
48  
LVCMOS/LVTTL level data outputs. In PowerDown (PD = Low) mode, receiver  
outputs are forced to a Low state.  
RxCLKP  
RxCLKM  
RxCLKOUT  
PLLSEL  
I
I
1
1
1
1
Positive LVDS differential clock input.  
Negative LVDS differential clock input.  
O
I
LVCMOS/LVTTL level clock output. The rising edge acts as data strobe.  
Control input for PLL range select. This pin must be tied to VCC. No connect or  
tied to GND is reserved for future use.  
(1) These receivers have input fail-safe bias circuitry to ensure a stable receiver output for floating or terminated receiver inputs. Under  
these conditions receiver inputs will be in a HIGH state. If a clock signal is present, outputs will all be HIGH; if the cable inter-connects  
are disconnected which results in floating/terminated inputs, the outputs will remain in the last valid state. A floating/terminated clock  
input will result in a LOW clock output.  
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Pin Name  
I/O  
No.  
Description  
PD  
I
1
Power Down pin. This pin must be tied to input level of 2.5V to Vcc for normal  
operation. When de-asserted (low input) the receiver outputs are Low. Please refer  
to the APPLICATIONS INFORMATION on the back for more information.  
DESKEW  
BAL  
I
I
1
1
This pin must be tied to logic High or Vcc for normal operation of Deskew function.  
De-asserting a pulse of duration greater than 4 clock cycles will restart the deskew  
initialization. Do NOT tie this pin to LOW. Please refer to the APPLICATIONS  
INFORMATION on the back for more information.  
LVCMOS/LVTTL level input. This pin must be tied to logic High or Vcc to enable  
DC Balance function(Figure 9). When tied low or left open, the DC Balance function  
is disabled(Figure 8). Please refer to the APPLICATIONS INFORMATION on the  
back for more infomation.  
CON1  
I
I
I
I
I
I
I
1
6
8
1
2
2
3
6
Control Pin. This pin must be tied to logic High or Vcc.  
Power supply pins for LVCMOS/LVTTL outputs and digital circuitry.  
Ground pins for LVCMOS/LVTTL outputs and digital circuitry.  
Power supply for PLL circuitry.  
VCC  
GND  
PLLVCC  
PLLGND  
LVDSVCC  
LVDSGND  
NC  
Ground pin for PLL circuitry.  
Power supply pin for LVDS inputs.  
Ground pins for LVDS inputs.  
No Connect. Make NO Connection to these pins - leave open.  
10  
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APPLICATIONS INFORMATION  
DC BALANCE  
In addition to data information an additional bit is transmitted on every LVDS data signal line during each cycle  
as shown in Figure 9. This bit is the DC balance bit (DCB). The purpose of the DC Balance bit is to minimize the  
short- and long-term DC bias on the signal lines. This is achieved by selectively sending the data either  
unmodified or inverted.  
The value of the DC balance bit is calculated from the running word disparity and the data disparity of the current  
word to be sent. The data disparity of the current word shall be calculated by subtracting the number of bits of  
value 0 from the number of bits value 1 in the current word. Initially, the running word disparity may be any value  
between +7 and 6. The running word disparity shall be calculated as a continuous sum of all the modified data  
disparity values, where the unmodified data disparity value is the calculated data disparity minus 1 if the data is  
sent unmodified and 1 plus the inverse of the calculated data disparity if the data is sent inverted. The value of  
the running word disparity shall saturate at +7 and 6.  
The value of the DC balance bit (DCB) shall be 0 when the data is sent unmodified and 1 when the data is sent  
inverted. To determine whether to send data unmodified or inverted, the running word disparity and the current  
data disparity are used. If the running word disparity is positive and the current data disparity is positive, the data  
shall be sent inverted. If the running word disparity is positive and the current data disparity is zero or negative,  
the data shall be sent unmodified. If the running word disparity is negative and the current data disparity is  
positive, the data shall be sent unmodified. If the running word disparity is negative and the current data disparity  
is zero or negative, the data shall be sent inverted. If the running word disparity is zero, the data shall be sent  
inverted.  
DC Balance mode is set when the BAL pin on the transmitter and receiver are tied HIGH - see DS90CR486 PIN  
DESCRIPTIONS — CHANNEL LINK RECEIVER.  
DESKEW  
The "DESKEW” function on this receiver will deskew or compensate fixed interconnect skew between data  
signals, with respect to the rising edge of the LVDS clock, on each of the independent differential pairs (pair-to-  
pair skew). The deskew initialization or calibration is done automatically when the device is powered up. The  
control pin CON1 must set High and the Deskew pin must set to High on the DS90CR486. However, the Deskew  
calibration can also be performed after the device is powered up. De-asserting with a pulse of duration greater  
than four clock cycles to the Deskew pin to restart the calibration of deskew. The calibration takes 4096 clock  
cycles to complete after the TX and RX PLLs lock (20ms). No RxIN data is sampled during this period. The data  
outputs during this period will be Low. For normal operation, deskew pin must set to High. Setting the deskew pin  
to Low or No Connect will continuously re-calibrate the sampling strobes. Data outputs are Low during this  
period.  
In order for the deskew function to work properly, it must be intialized. The DS90CR486 deskew can be initialized  
with any data pattern with a minimum of 1 transition per clock cycle; however, having multiple transition per clock  
cycle will further improve the chance for the deskew circuit to find the optimal edge. Therefore, there are mulitiple  
ways to initialize the deskew function depending on the setup configuration (Please refer to Figure 10). For  
example, to initialize the operation of deskew using DS90CR485 and DS90CR486 in DC balance mode, the  
DS_OPT pin at the input of the transmitter DS90CR485 can be set High OR Low when powered up. The period  
of this input to the DS_OPT pin must be at least 20ms (TX and RX PLLs lock time) plus 4096 clock cycles in  
order for the receiver to complete the deskew operation. For other configuration setup with DS90CR483 and  
DS90CR484, please refer to the flow chart on Figure 10.  
The DS_OPT pin at the input of the transmitter (DS90CR485) can be used to initiate the deskew calibration  
pattern. Depends on the configuration, it can be set High or applied Low when power up in order for the receiver  
to complete the deskew operation. For this reason, the LVDS clock signal with DS_OPT applied high (active data  
sampling) shall be 1111000 or 1110000 pattern and the LVDS data lines (TxOUT 0-7) shall be High for one clock  
cycle and Low for the next clock cycle. During the deskew operation with DS_OPT applied low, the LVDS clock  
signal shall be 1111100 or 1100000 pattern. The transmitter will also output a series of 1111000 or 1110000 onto  
the LVDS data lines (TxOUT 0-7) during deskew so that the receiver can automatically calibrated the data  
sampling strobes at the receiver inputs. Each data channel is deskewed independently and is tuned over a  
specific range. Please refer to corresponding receiver datasheet for a list of deskew ranges.  
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Note that the deskew initialization must be performed at least once after the PLL has locked to the input clock  
frequency, and it must be done at the time when the receiver is powered up and PLL has locked. If power is lost,  
or if the cable has been swithcd or disconnected, the initialization procedure must be repeated or else the  
receiver may not sample the incoming LVDS data correctly.  
POWER DOWN  
The receiver provides a power down feature. When de-asserted current draw through the supply pins is  
minimized and the PLLs are shut down. The receiver outputs are forced to an active LOW state when in the  
power down mode. (See DS90CR486 Pin Descriptions — Channel Link Receiver Table). This is not a  
LVCMOS/LVTTL input pin and has a high input threshold. For normal operation, this pin must be tied to an input  
level of 2.5V to Vcc.  
CONFIGURATIONS  
The chipset is designed to be connected typically to a single receiver load. This is known as a point-to-point  
configuration. It is also possible to drive multiple receiver loads if certain restrictions are made(i.e. low data rate).  
Only the final receiver at the end of the interconnect should provide termination across the pair. In this case, the  
driver still sees the intended DC load of 100 Ohms. Receivers connected to the cable between the transmitter  
and the final receiver must not load down the signal. To meet this system requirement, stub lengths from the line  
to the receiver inputs must be kept very short.  
CABLE TERMINATION  
A termination resistor is required for proper operation to be obtained. The termination resistor should be equal to  
the differential impedance of the media being driven. This should be in the range of 90 to 132 Ohms. 100 Ohms  
is a typical value common used with standard 100 Ohm twisted pair cables. This resistor is required for control of  
reflections and also to complete the current loop. It should be placed as close to the receiver inputs to minimize  
the stub length from the resistor to the receiver input pins.  
HOW TO CONFIGURE FOR BACKPLANE APPLICATIONS  
In a backplane application with differential line impedance of 100the differential line pair-to-pair skew can  
controlled by trace layout. The transmitter-DS90CR485 “DS_OPT” pin may be set high. In a backplane  
application with short PCB distance traces, pre-emphasis from the transmitter is typically not required. The “PRE”  
pin should be left open (do not tie to ground). A resistor pad provision for a pull up resistor to Vcc can be  
implemented in case pre-emphasis is needed to counteract heavy capacitive loading effects.  
SUPPLY BYPASS RECOMMENDATIONS  
Bypass capacitors must be used on the power supply pins. Different pins supply different portions of the circuit,  
therefore capacitors should be nearby all power supply pins except as noted in the DS90CR486 Pin  
Descriptions — Channel Link Receiver table. Use high frequency ceramic (surface mount recommended) 0.1μF  
capacitors close to each supply pin. If space allows, a 0.01μF capacitor should be used in parallel, with the  
smallest value closest to the device pin. Additional scattered capacitors over the printed circuit board will improve  
decoupling. Multiple (large) via should be used to connect the decoupling capacitors to the power plane. A 4.7 to  
10μF bulk cap is recommended near the PLLVCC pins and also the LVDSVCC pins. Connections between the  
caps and the pin should use wide traces.  
RECEIVER OUTPUT DRIVE STRENGTH  
The DS90CR486 output specifies a 8pF load, VOH and VOL are tested at ± 2mA, which is intended for only 1 or  
maybe 2 loads. The DS90CR486 receiver’s output driving capability has improved over prior generation of  
Channel Link devices. Additional buffering at the receiver output is not necessary. If high fan-out is required or  
long transmission line driving capability, buffering the receiver output is recommended. Receiver outputs do not  
support / provide a TRI-STATE function.  
LVDS INTERCONNECT GUIDELINES  
See AN-1108 (SNLA008) and AN-905 (SNLA035) for full details.  
Use 100coupled differential pairs  
Use the S/2S/3S rule in spacings  
12  
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Product Folder Links: DS90CR486  
DS90CR486  
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SNLS149C FEBRUARY 2003REVISED MARCH 2013  
S = space between the pair  
2S = space between pairs  
3S = space to TTL signal  
Minimize the number of VIA  
Use differential connectors when operating above 500Mbps line speed  
Maintain balance of the traces  
Minimize skew within the pair  
Minimize skew between pairs  
Terminate as close to the RXinputs as possible  
For more information:  
Channel Link Applications Notes currently available:  
AN-1041 Introduction to Channel Link (literature number SNLA218)  
AN-1108 PCB and Interconnect Guidelines (literature number SNLA008)  
AN-905 Differential Impedance (literature number SNLA035)  
TI’s LVDS Owner’s Manual (literature number SNLA187)  
Select TX  
Select RX  
Select RX  
Balance  
Mode  
Balance  
Mode  
Balance  
Mode  
Balance  
Mode  
DESKEW  
Not supported  
DESKEW  
Not supported  
Configuration 1  
Configuration 2  
Configuration 3  
Configuration 4  
Configuration 5  
Configuration 6  
Figure 10. Deskew Configuration Setup Chart  
CONFIGURATION 1  
DS90CR481/483 and DS90CR484 with DC Balance ON (BAL=High, 33MHz to 80MHz) The DS_OPT pin at  
the input of the transmitter DS90CR481/483 must be applied low for a minimum of four clock cycles in order for  
the receiver to complete the deskew operation. The input to the DS_OPT pin can be applied at any time after the  
PLL has locked to the input clock frequency. In this particular setup, the "DESKEW" pin on the receiver  
DS90CR484 must set High.  
CONFIGURATION 2  
DS90CR481/483 and DS90CR486 with DC Balance ON (BAL=High, CON1=High, 66MHz to 112MHz) The  
DS_OPT pin at the input of the transmitter DS90CR481/483 can be set to High OR Low when power up. The  
period of this input to the DS_OPT pin must be at least 20ms (TX and RX PLLs lock time) plus 4096 clock cycles  
in order for the receiver to complete the deskew operation. The "DESKEW" and CON1 pins on the receiver  
DS90CR486 must be tied to High for this setup.  
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DS90CR486  
SNLS149C FEBRUARY 2003REVISED MARCH 2013  
www.ti.com  
CONFIGURATION 3  
DS90CR481/483 and DS90CR486 with DC Balance OFF (BAL=Low, CON1=High, 66MHz to 112MHz) The  
input to the DS_OPT pin of the transmitter DS90CR481/483 in this configuration is completely ignored by the  
transimitters. In order to initialize the deskew operation on the receiver DS90CR486, data and clcok must be  
applied to the transimitter when power up. The "DESKEW" and CON1 pins on the receiver DS90CR486 must be  
tied to High for this setup.  
CONFIGURATION 4  
DS90CR485 and DS90CR484 with DC Balance ON (BAL=High, 66MHz to 80MHz) The DS_OPT pin at the  
input of the transmitter DS90CR485 must be applied low for a minimum of four clock cycles in order for the  
receiver to complete the deskew operation. The input to the DS_OPT pin can be applied at any time after the  
PLL has locked to the input clock frequency. In this setup, the "DESKEW" pin on the receiver DS90CR484 must  
set High.  
CONFIGURATION 5  
DS90CR485 and DS90CR486 with DC Balance ON (BAL=Hiigh, CON1=High, 66MHz to 133MHz) The  
DS_OPT pin at the input of the transmitter DS90CR485 can be set to High OR Low when power up. The period  
of this input to the DS_OPT pin must be at least 20ms (TX and RX PLLs lock time) plus 4096 clock cycles in  
order for the receiver to complete the deskew operation. The "DESKEW" and CON1 pins on the receiver  
DS90CR486 must set High.  
CONFIGURATION 6  
DS90CR485 and DS90CR486 with DC Balance OFF (BAL=Low, CON1=High, 66MHz to 133MHz) The input to  
the DS_OPT pin of the transmitter DS90CR485 in this configuration is completely ignored. In order to initialize  
the deskew operation on the receiver DS90CR486, data and clcok must be applied to the transimitter when  
power up. The "DESKEW" and CON1 pins on the receiver DS90CR486 must set High.  
DESKEW NOT SUPPORTED  
Deskew function is NOT supported in these configuration setups. The deskew feature is only supported with DC  
Balance ON (BAL=High) for DS90CR484. Note that the deskew function in the DS90CR486 works in both DC  
Balance and NON-DC Balance modes.  
NOTE  
For more details on Deskew operation, please refer to the APPLICATIONS  
INFORMATION section.  
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Product Folder Links: DS90CR486  
DS90CR486  
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SNLS149C FEBRUARY 2003REVISED MARCH 2013  
Pin Diagram  
Figure 11. Receiver - DS90CR486  
(Top View)  
See Package Number NEZ0100A  
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DS90CR486  
SNLS149C FEBRUARY 2003REVISED MARCH 2013  
www.ti.com  
REVISION HISTORY  
Changes from Revision B (March 2013) to Revision C  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 15  
16  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
17-Mar-2023  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
DS90CR486VS/NOPB  
DS90CR486VSX/NOPB  
ACTIVE  
TQFP  
TQFP  
NEZ  
100  
100  
90  
RoHS & Green  
NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
-10 to 70  
-10 to 70  
DS90CR486VS  
>B  
Samples  
Samples  
ACTIVE  
NEZ  
1000 RoHS & Green  
SN  
DS90CR486VS  
>B  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-Mar-2023  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Jun-2023  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
K0  
P1  
W
B0  
Reel  
Diameter  
Cavity  
A0  
A0 Dimension designed to accommodate the component width  
B0 Dimension designed to accommodate the component length  
K0 Dimension designed to accommodate the component thickness  
Overall width of the carrier tape  
W
P1 Pitch between successive cavity centers  
Reel Width (W1)  
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
Sprocket Holes  
Q1 Q2  
Q3 Q4  
Q1 Q2  
Q3 Q4  
User Direction of Feed  
Pocket Quadrants  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
DS90CR486VSX/NOPB  
TQFP  
NEZ  
100  
1000  
330.0  
32.4  
18.0  
18.0  
1.6  
24.0  
32.0  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Jun-2023  
TAPE AND REEL BOX DIMENSIONS  
Width (mm)  
H
W
L
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
TQFP NEZ 100  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 55.0  
DS90CR486VSX/NOPB  
1000  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Jun-2023  
TRAY  
L - Outer tray length without tabs  
KO -  
Outer  
tray  
height  
W -  
Outer  
tray  
width  
Text  
P1 - Tray unit pocket pitch  
CW - Measurement for tray edge (Y direction) to corner pocket center  
CL - Measurement for tray edge (X direction) to corner pocket center  
Chamfer on Tray corner indicates Pin 1 orientation of packed units.  
*All dimensions are nominal  
Device  
Package Package Pins SPQ Unit array  
Max  
matrix temperature  
(°C)  
L (mm)  
W
K0  
P1  
CL  
CW  
Name  
Type  
(mm) (µm) (mm) (mm) (mm)  
DS90CR486VS/NOPB  
NEZ  
TQFP  
100  
90  
6 x 15  
150  
322.6 135.9 7620 20.3  
15.4 15.45  
Pack Materials-Page 3  
MECHANICAL DATA  
NEZ0100A  
TYPICAL  
VJD100A (Rev C)  
www.ti.com  
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
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