ESD441 [TI]
采用 0201 封装的 1pF、5.5V、30KV ESD 保护器件;
| 型号： | ESD441 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 采用 0201 封装的 1pF、5.5V、30KV ESD 保护器件 |
| 文件： | 总12页 (文件大小：968K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ESD441
ZHCSRZ1A –APRIL 2023 –REVISED JUNE 2023
ESD441 采用0201 封装的单通道±30kV 单向ESD 二极管
1 特性
3 说明
• IEC 61000-4-2 4 级ESD 保护
ESD441 是一款单向 ESD 保护二极管，用于保护数据
线路和其他 I/O 端口。ESD441 的额定 ESD 冲击消散
值高达±30kV，符合IEC 61000-4-2 国际标准（高于4
级）。
– ±30kV 接触放电
– ±30kV 空气间隙放电
• IEC 61000-4-5 浪涌保护
– 6.2 A (8µs/20µs)
• IO 电容：
该器件具有 1pF（典型值）IO 电容，可为 USB 2.0 等
协议提供高速接口保护。指定了极低动态电阻 (0.1Ω)
和钳位电压（16A TLP 时为 7.6V），可针对瞬态事件
提供系统级保护。
– 1pF（典型值）
• 直流击穿电压：7 V（典型值）
• 超低漏电流：50nA（最大值）
• 极低ESD 钳位电压
30kV ESD 等级和 6.2 A 浪涌采用微型封装，可提供强
大的瞬态保护，用于保护便携式电子产品和其他空间狭
小应用（如可穿戴设备）中的5.5 V 电源轨。
– 16A TLP 时为7.6 V
– RDYN：0.1Ω（I/O 至GND）
• 低插入损耗：2GHz（–3dB 带宽）
• 支持速率高达4Gbps 的高速接口
• 工业温度范围：–55°C 至+150°C
• 节省空间的业界通用0201 封装
(0.6mm × 0.3mm × 0.3mm)
ESD441 采用业界通用的0201 (DPL) 封装。
封装信息
封装(1)
封装尺寸(2)
器件型号
ESD441
DPL（X2SON，2） 0.6 mm x 0.3 mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
(2) 封装尺寸（长× 宽）为标称值，并包括引脚（如适用）。
2 应用
• 终端设备：
– 扫地机器人
– 可穿戴设备
– 智能扬声器
– 便携式电子产品
– 小型电器
– 零售自动化和支付
– 便携式计算机和台式机
– 电视和监视器
– 扩展坞
• 接口：
– USB 2.0
– HDMI™ 1.4 和2.0
– DisplayPort™
– SIM 卡
功能方框图
– GPIO
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSH26
ESD441
www.ti.com.cn
ZHCSRZ1A –APRIL 2023 –REVISED JUNE 2023
Table of Contents
6.7 Typical Characteristics................................................7
7 Application and Implementation....................................9
7.1 Application Information............................................... 9
8 Device and Documentation Support............................10
8.1 Documentation Support............................................ 10
8.2 接收文档更新通知..................................................... 10
8.3 支持资源....................................................................10
8.4 Trademarks...............................................................10
8.5 静电放电警告............................................................ 10
8.6 术语表....................................................................... 10
9 Mechanical, Packaging, and Orderable Information..10
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings—JEDEC Specification...........................4
6.3 ESD Ratings—IEC Specification................................ 4
6.4 Recommended Operating Conditions.........................4
6.5 Thermal Information....................................................4
6.6 Electrical Characteristics.............................................6
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision * (April 2023) to Revision A (June 2023)
Page
• 将数据表的状态从预告信息 更改为量产数据 .....................................................................................................1
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SLVSH26
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ZHCSRZ1A –APRIL 2023 –REVISED JUNE 2023
5 Pin Configuration and Functions
1
2
图5-1. DPL Package, 2-Pin X2SON (Top View)
表5-1. Pin Functions
PIN
TYPE(1)
DESCRIPTION
NAME
IO
NO.
1
I/O
ESD protected channel
GND
2
GND
Ground. Connect to ground.
(1) I = input, O = output, GND = ground
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English Data Sheet: SLVSH26
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ZHCSRZ1A –APRIL 2023 –REVISED JUNE 2023
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
45
UNIT
W
IEC 61000-4-5 power (tp - 8/20 µs)
Peak Pulse (2) (3)
IEC 61000-4-5 Current (tp - 8/20 µs)
6
A
TA
Ambient Operating Temperature
Storage Temperature
-55
-65
150
155
°C
Tstg
°C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not
sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,
performance, and shorten the device lifetime.
(2) Voltages are with respect to GND unless otherwise noted.
(3) Measured at 25℃
6.2 ESD Ratings—JEDEC Specification
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001 (1)
±2500
V
V(ESD)
Electrostatic discharge
Charged device model (CDM), per JEDEC
specification JS-002 (2)
±1000
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 ESD Ratings—IEC Specification
VALUE
UNIT
IEC 61000-4-2 contact discharge
IEC 61000-4-2 air-gap discharge
±30000
±30000
V(ESD)
Electrostatic discharge
V
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VIO Input pin voltage
Pin 1 to 2
0
5.5
V
TA Operating free-air temperature
-55
150
°C
6.5 Thermal Information
ESD441
DPL (X2SON)
2 PINS
519.9
THERMAL METRIC (1)
UNIT
RθJA
RθJC(top)
RθJB
ΨJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
336.9
209.2
Junction-to-top characterization parameter
Junction-to-board characterization parameter
136.7
207.2
ΨJB
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ESD441
THERMAL METRIC (1)
DPL (X2SON)
2 PINS
UNIT
RθJC(bot)
Junction-to-case (bottom) thermal resistance
NA
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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MAX UNIT
ZHCSRZ1A –APRIL 2023 –REVISED JUNE 2023
6.6 Electrical Characteristics
At TA=25℃(unless otherwise noted) (1)
PARAMETER
TEST CONDITION
MIN
TYP
Reverse stand-off
voltage
VRWM
ILEAK
IIO <100 nA, across operating temperature range
VIO = 5.5 V, IO to GND
5.5
50
8
V
Reverse leakage
current
1
nA
Break-down
voltage
VBR
IIO = 1 mA, IO to GND
6
7
0.8
6.2
V
V
V
VFWD
VHOLD
Forward voltage IIO = 1 mA, GND to IO
Holding voltage
TLP, IO to GND
(2)
IPP = 1 A, TLP, IO to GND
6.3
6.5
7.6
3.8
V
V
V
V
IPP = 5 A, TLP, IO to GND
IPP = 16 A, TLP, IO to GND
IPP =16 A, TLP, GND to IO
Clamping voltage
with TLP (2)
VCLAMP
Clamping voltage
with surge strike IPP = 6 A, tp = 8/20 µs , IO to GND
7.6
V
(4)
IO to GND
0.1
0.16
1
Dynamic
RDYN
CL
Ω
resistance (3)
GND to IO
Line capacitance
pF
VIO = 0 V; ƒ= 1 MHz, Vpp = 30 mV, IO to GND
(1) Typical parameters are measured at 25℃
(2) Transition line pulse with 100 ns width and 10 ns rise and fall time
(3) Extraction of RDYN using least squares fit of TLP characteristics between I = 10 A and I = 20 A
(4) Nonrepetitive current pulse 8 to 20 µs exponentially decaying waveform according to IEC 61000-4-5
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6.7 Typical Characteristics
32
28
24
20
16
12
8
32
28
24
20
16
12
8
4
4
0
0
-4
-4
0
1
2
3
4
5
6
7
8
9
10
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Voltage (V)
Voltage (V)
图6-1. Positive TLP Curve
图6-2. Negative TLP Curve
200
25
0
Voltage at 30 ns = 9 V
175
150
125
100
75
-25
-50
-75
-100
-125
-150
-175
-200
50
25
0
-25
-50
Voltage at 30 ns = -3 V
-10
0
10 20 30 40 50 60 70 80 90 100
Time (ns)
-10
0
10 20 30 40 50 60 70 80 90 100
Time (ns)
图6-4. -8-kV Clamped IEC Waveform
图6-3. +8-kV Clamped IEC Waveform
950
945
940
935
930
925
920
915
910
905
900
1.1
1.075
1.05
1.025
1
0.975
0.95
0.925
0.9
0.875
0.85
-75
-50
-25
0
25
50
75
100 125 150
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Temperature (ꢀC)
Voltage (V)
图6-6. Temperature vs. Capacitance
图6-5. Bias Voltage vs. Capacitance
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6.7 Typical Characteristics (continued)
1.4
1.2
1
3
0
-3
0.8
0.6
0.4
0.2
0
-6
-9
-12
-15
-75
-50
-25
0
25
50
75
100 125 150
10M
100M
1G
Temperature (ꢀC)
freq[Hz]
图6-7. Temperature vs. Leakage Current
图6-8. Insertion Loss
0.001
0.0008
0.0006
0.0004
0.0002
0
-0.0002
-0.0004
-0.0006
-0.0008
-0.001
-2
-1
0
1
2
3
4
5
6
7
8
Voltage (V)
图6-9. DC I-V Curve
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7 Application and Implementation
备注
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
7.1 Application Information
The ESD441 is a diode type TVS which provides a path to ground for dissipating transient voltage spikes, such
as ESD or surge, on signal lines and power lines. The device should be connected in parallel to the down stream
circuitry it is protecting. As the current from the transient passes through the TVS, only a small voltage drop is
present across the diode. This is the voltage presented to the protected IC. The low RDYN of the triggered TVS
holds this voltage (VCLAMP) to a safe level for the protected IC. For more information on how to properly use this
device, please refer to the ESD Packaging and Layout Guide for details.
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ZHCSRZ1A –APRIL 2023 –REVISED JUNE 2023
8 Device and Documentation Support
8.1 Documentation Support
8.1.1 Related Documentation
For related documentation, see the following:
• Texas Instruments, ESD Packaging and Layout Guide
• Texas Instruments, ESD Layout Guide application reports
• Texas Instruments, Generic ESD Evaluation Module user's guide
• Texas Instruments, Picking ESD Diodes for Ultra High-Speed Data Lines application reports
• Texas Instruments, Reading and Understanding an ESD Protection data sheet
8.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
8.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
8.4 Trademarks
HDMI™ is a trademark of HDMI Licensing LLC.
DisplayPort™ is a trademark of Video Electronics Standards Association.
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
8.5 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
8.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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English Data Sheet: SLVSH26
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PACKAGE OPTION ADDENDUM
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13-Jul-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
ESD441DPLR
ACTIVE
X2SON
DPL
2
15000 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
E
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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