HDC1010 [TI]
采用 WCSP 封装的 ±2% 低功耗数字湿度和温度传感器;
| 型号： | HDC1010 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 采用 WCSP 封装的 ±2% 低功耗数字湿度和温度传感器 温度传感 传感器 温度传感器 |
| 文件： | 总31页 (文件大小：1668K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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HDC1010
ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
HDC1010 具有温度传感器的低功耗、高精度数字湿度传感器
1 特性
3 说明
1
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相对湿度精度为 ±2%（典型值）
HDC1010 是一款具有集成温度传感器的数字湿度传感
器，其能够以超低功耗提供出色的测量精度。
HDC1010 支持较宽的工作电源电压范围，并且相比竞
争解决方案，该器件可为各类常见应用提供低成本和低
功耗 优势。创新型 WLCSP（晶圆级芯片规模封装）
凭借超紧凑型封装简化了电路板设计。HDC1010 的传
感元件位于器件底部，这样可使 HDC1010 免受灰尘、
粉尘以及其他环境污染物的影响，从而提高耐用性。湿
度和温度传感器均经过出厂校准，校准数据存储在片上
非易失性存储器中。
温度精度为 ±0.2°C（典型值）
高湿度下具有出色的稳定性
14 位测量分辨率
睡眠模式的电流为 100nA
平均电源电流：
–
–
1 sps、11 位相对湿度 (RH) 测量时为 710nA
1 sps、11 位 RH 与温度测量时为 1.3µA
•
•
•
电源电压为 2.7V 至 5.5V
微型 2mm x 1.6mm 器件封装
I2C 接口
器件信息 (1)
部件号
HDC1010
封装
封装尺寸（标称值）
2 应用
DSBGA（8 凸点）
2.04mm x 1.59mm
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制热、通风与空调控制 (HVAC)
(1) 要了解所有可用封装，请见数据表末尾的可订购产品附录。
物联网 (IoT) 智能温度调节装置和室温监视器
冰箱
打印机
白色家电
医疗设备
无线传感器（TIDA：00374、00484、00524）
4 典型应用
3.3 V
VDD
3.3 V
3.3 V
VDD
RH
HDC1010
MCU
I2C
SDA
SCL
Registers
and
Logic
Peripheral
DRDYn
ADR0
ADR1
ADC
I2C
GPIO
OTP
Calibration Coefficients
TEMPERATURE
GND
GND
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SNAS685
HDC1010
ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
www.ti.com.cn
目录
8.4 Device Functional Modes.......................................... 9
8.5 Programming........................................................... 10
8.6 Register Map .......................................................... 14
Application and Implementation ........................ 17
9.1 Application Information............................................ 17
9.2 Typical Application ................................................. 17
9.3 Do's and Don'ts ...................................................... 18
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
典型应用................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 I2C Interface Electrical Characteristics..................... 6
7.7 I2C Interface Timing Requirements ........................ 6
7.8 Typical Characteristics.............................................. 7
Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................... 9
9
10 Power Supply Recommendations ..................... 19
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
11.2 Layout Example .................................................... 21
12 器件和文档支持 ..................................................... 22
12.1 文档支持................................................................ 22
12.2 接收文档更新通知 ................................................. 22
12.3 社区资源................................................................ 22
12.4 商标....................................................................... 22
12.5 静电放电警告......................................................... 22
12.6 Glossary................................................................ 22
13 机械、封装和可订购信息....................................... 22
8
5 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Original (May 2016) to Revision A
Page
•
已更改 “产品预览”至“量产数据”............................................................................................................................................... 1
2
Copyright © 2016, Texas Instruments Incorporated
HDC1010
www.ti.com.cn
ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
6 Pin Configuration and Functions
WLCSP (DSBGA)
8 Pin YPA
Top View
A1
B1
C1
D1
A2
B2
C2
D2
Pin Functions
PIN
I/O TYPE(1) DESCRIPTION
NAME
SCL
NO.
A1
B1
C1
D1
A2
B2
C2
I
P
I
Serial clock line for I2C, open-drain; requires a pull-up resistor to VDD
VDD
Supply Voltage
ADR0
ADR1
SDA
Address select pin – hardwired to GND or VDD
Address select pin – hardwired to GND or VDD
I
I/O
G
-
Serial data line for I2C, open-drain; requires a pull-up resistor to VDD
Ground
GND
DNC
Do not connect, or, may be connected to GND.
Data ready, active low, open-drain. Requires a pull-up resistor to VDD. If not used tie to
GND.
DRDYn
D2
O
(1) P=Power, G=Ground, I=Input, O=Output
Copyright © 2016, Texas Instruments Incorporated
3
HDC1010
ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
www.ti.com.cn
7 Specifications
7.1 Absolute Maximum Ratings(1)
MIN
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-65
MAX
UNIT
V
VDD
SCL
6
6
SDA
Input Voltage
6
6
DRDYn
ADR0
ADR1
VDD+0.3
VDD+0.3
150
Storage Temperature
TSTG
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins
±1000
(1)
V
Charged device model (CDM), per JEDEC specification –500 500
JESD22-C101, all pins
±250
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating range (unless otherwise noted)
MIN
2.7
-40
-20
-20
NOM
MAX
5.5
125
70
UNIT
V
VDD
Supply Voltage
3
TA, Temperature Sensor
TA, Humidity Sensor(1)
TA, Humidity sensor(1)
Ambient Operating Temperature
Ambient Operating Temperature
Functional Operating Temperature
°C
°C
85
°C
(1) See Figure 2
7.4 Thermal Information
HDC1010
THERMAL METRIC(1)
DSBGA -YPA
8 PINS
98.0
UNIT
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
0.8
Junction-to-board thermal resistance
17.8
Junction-to-top characterization parameter
Junction-to-board characterization parameter
3.7
ψJB
17.8
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Copyright © 2016, Texas Instruments Incorporated
HDC1010
www.ti.com.cn
ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
7.5 Electrical Characteristics(1)
The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. TA = 30°C,
VDD = 3V, and RH = 40%.
PARAMETER
TEST CONDITION(2)
MIN(3)
TYP(4)
MAX(3)
UNIT
POWER CONSUMPTION
IDD
Supply Current
RH measurement, bit 12 of 0x02 register =
0(5)
190
160
220
185
200
µA
µA
Temperature measurement, bit 12 of 0x02
register = 0(5)
Sleep Mode
100
710
nA
nA
Average @ 1 measurement/second, RH (11
bit), bit 12 of 0x02 register = 0(5)(6)
Average @ 1 measurement/second, Temp
(11 bit), bit 12 of 0x02 register = 0(5)(6)
590
1.3
nA
µA
Average @ 1 measurement/second, RH
(11bit) +temperature (11 bit), bit 12 of 0x02
register = 1(5)(6)
Startup (average on Start-up time)
Peak current
300
7.2
50
µA
mA
µA
IHEAT
Heater Current(7)
Average @ 1 measurement/second, RH
(11bit) +temperature (11 bit), bit 12 of 0x02
register = 1(5)(6)
RELATIVE HUMIDITY SENSOR
RHACC
Accuracy
Refer to Figure 2 in Typical Characteristics
section.
±2
%RH
RHREP
RHHYS
RHRT
Repeatability(7)
14 bit resolution.
±0.1
±1
%RH
%RH
s
(8)
Hysteresis
10% ≤ RH ≤ 70%
Response Time(9)
Conversion Time(7)
t 63%
15
(10)
RHCT
8 bit resolution
11 bit resolution
14 bit resolution
Non-condensing
2.50
3.85
6.50
ms
ms
ms
RHHOR
RHLTD
Operating Range(11)
Long Term Drift(12)
0
100
%RH
%RH/yr
±0.25
TEMPERATURE SENSOR
TEMPACC Accuracy(7)
TEMPREP Repeatability(7)
5°C < TA< 60°C
14 bit accuracy
11 bit accuracy
14 bit accuracy
±0.2
±0.1
3.65
6.35
±0.4
°C
°C
TEMPCT
Conversion Time(7)
ms
ms
(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
(2) Register values are represented as either binary (b is the prefix to the digits), or hexadecimal (0x is the prefix to the digits). Decimal
values have no prefix.
(3) Limits are ensured by testing, design, or statistical analysis at 30°C. Limits over the operating temperature range are ensured through
correlations using statistical quality control (SQC) method.
(4) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on
shipped production material.
(5) I2C read/write communication and pull-up resistors current through SCL and SDA not included.
(6) Average current consumption while conversion is in progress.
(7) This parameter is specified by design and/or characterization and it is not tested in production.
(8) The hysteresis value is the difference between an RH measurement in a rising and falling RH environment, at a specific RH point.
(9) Actual response times will vary dependent on system thermal mass and air-flow.
(10) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity.
(11) Recommended humidity operating range is 10% to 70% RH. Prolonged operation outside this range may result in a measurement
offset. The measurement offset will decrease after operating the sensor in this recommended operating range.
(12) Drift due to aging effects at typical conditions (30°C and 20% to 50% RH). This value may be impacted by dust, vaporized solvents, out-
gassing tapes, adhesives, packaging materials, etc.
Copyright © 2016, Texas Instruments Incorporated
5
HDC1010
ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
www.ti.com.cn
Electrical Characteristics(1) (continued)
The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. TA = 30°C,
VDD = 3V, and RH = 40%.
PARAMETER
TEST CONDITION(2)
MIN(3)
TYP(4)
MAX(3)
UNIT
TEMPOR
Operating Range
-40
125
°C
7.6 I2C Interface Electrical Characteristics
At TA=30°C, VDD=3V (unless otherwise noted)
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
I2C INTERFACE VOLTAGE LEVEL
VIH
VIL
Input High Voltage
Input Low Voltage
Output Low Voltage
0.7xVDD
V
V
0.3xVDD
0.4
VOL
HYS
CIN
Sink current 3mA
V
(1)
Hysteresis
0.1xVDD
V
Input Capacitance on all digital pins
0.5
pF
(1) This parameter is specified by design and/or characterization and it is not tested in production.
7.7 I2C Interface Timing Requirements
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
I2C INTERFACE VOLTAGE LEVEL
fSCL
tLOW
tHIGH
tSP
Clock Frequency
10
1.3
0.6
400
kHz
µs
Clock Low Time
Clock High Time
µs
Pulse width of spikes that must be
suppressed by the input filter
50
15
ns
(1)
tSTART
Device Start-up time
From VDD ≥ 2.7 V to ready for a
10
ms
conversion(1)(2)
(1) This parameter is specified by design and/or characterization and it is not tested in production.
(2) Within this interval it is not possible to communicate to the device.
SDA
t
LOW
t
SP
SCL
t
HIGH
STOP START
START
REPEATED
START
Figure 1. I2C Timing
6
Copyright © 2016, Texas Instruments Incorporated
HDC1010
www.ti.com.cn
ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
7.8 Typical Characteristics
Unless otherwise noted. TA = 30°C, VDD = 3V.
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10
Typical
Typical
9
8
7
6
5
4
3
2
1
0
-40
-25
-10
5
20
35
50
65
80
95
110
125
0
10
20
30
40
50
60
70
80
90
100
Temp (°C)
RH (%RH)
Figure 2. RH Accuracy vs. RH
Figure 3. Temperature Accuracy vs. Temperature
300
275
250
225
200
175
150
125
100
300
275
250
225
200
175
150
125
100
T= -20°C
T= 25°C
T= 40°C
T= 85°C
T= 125°C
Vdd=2.7V
Vdd=3V
Vdd=3.3V
Vdd=5V
2.7
3
3.3
3.6
3.9
4.2
4.5
4.8
5
0
25
50
75
100
125
Vdd (V)
Temp (°C)
Figure 4. Supply Current vs. Supply Voltage, RH
Measurement
Figure 5. Supply Current vs. Temperature, RH Measurement
300
275
250
225
200
175
150
125
100
300
T= -20°C
T= 25°C
T= 40°C
T= 85°C
T= 125°C
Vdd=2.7V
Vdd=3V
Vdd=3.3V
Vdd=5V
275
250
225
200
175
150
125
100
2.7
3
3.3
3.6
3.9
4.2
4.5
4.8
5
0
25
50
75
100
125
Vdd (V)
Temp (°C)
Figure 6. Supply Current vs. Supply Voltage, Temp
Measurement
Figure 7. Supply Current vs. Temperature, Temp
Measurement
Copyright © 2016, Texas Instruments Incorporated
7
HDC1010
ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
www.ti.com.cn
Typical Characteristics (continued)
Unless otherwise noted. TA = 30°C, VDD = 3V.
1200
1200
1000
800
600
400
200
0
T= -20°C
T= 25°C
T= 40°C
Vdd=2.7V
Vdd=3V
Vdd=3.3V
Vdd=5V
1000
800
600
400
200
0
T= 85°C
T= 125°C
2.7
3
3.3
3.6
3.9
4.2
4.5
4.8
5
0
25
50
75
100
125
Vdd (V)
Temp (°C)
Figure 8. Supply Current vs. Supply Voltage, Sleep Mode
Figure 9. Supply Current vs. Temperature, Sleep Mode
8
Copyright © 2016, Texas Instruments Incorporated
HDC1010
www.ti.com.cn
ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
8 Detailed Description
8.1 Overview
The HDC1010 is a digital humidity sensor with integrated temperature sensor that provides excellent
measurement accuracy at very low power. The sensing element of the HDC1010 is placed on the bottom part of
the device, which makes the HDC1010 more robust against dirt, dust, and other environmental contaminants.
Measurement results can be read out through the I2C compatible interface. Resolution is based on the
measurement time and can be 8, 11, or 14 bits for humidity; 11 or 14 bits for temperature.
8.2 Functional Block Diagram
RH
VDD
HDC1010
SDA
SCL
DRDYn
ADR0
ADR1
Registers
and
Logic
ADC
I2C
OTP
Calibration Coefficients
TEMPERATURE
GND
Copyright © 2016, Texas Instruments Incorporated
8.3 Feature Description
8.3.1 Power Consumption
One of the key features of the HDC1010 is its low power consumption, which makes the device suitable in
battery or power harvesting applications. In these applications the HDC1010 spends most of the time in sleep
mode: with a typical 100nA of current consumption in sleep mode, the averaged current consumption is minimal.
Its low consumption in measurement mode minimizes any self-heating.
8.3.2 Voltage Supply Monitoring
The HDC1010 monitors the supply voltage level and indicates when the voltage supply of the HDC1010 is less
than 2.8V. This information is useful in battery-powered systems in order to inform the user to replace the
battery. This is reported in the BTST field (register address 0x02:bit[11]) which is updated after power-on reset
(POR) and after each measurement request.
8.3.3 Heater
The heater is an integrated resistive element that can be used to test the sensor or to drive condensation off the
sensor. The heater can be activated using HEAT, bit 13 in Configuration Register. The heater helps in reducing
the accumulated offset after long exposure at high humidity conditions.
Once enabled the heater is turned on only in the measurement mode. To have a reasonable increase of the
temperature it is suggested to increase the measurement data rate.
8.4 Device Functional Modes
The HDC1010 has two modes of operation: sleep mode and measurement mode. After power up, the HDC1010
is in sleep mode. In this mode, the HDC1010 waits for I2C input including commands to configure the conversion
times, read the status of the battery, trigger a measurement, and read measurements. Once it receives a
command to trigger a measurement, the HDC1010 moves from sleep mode to measurement mode. In
measurement mode, the HDC1010 acquires the configured measurements and sets the DRDYn line low when
the measurement is complete. After completing the measurement and setting DRDYn low, the HDC1010 returns
to sleep mode.
Copyright © 2016, Texas Instruments Incorporated
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HDC1010
ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
www.ti.com.cn
8.5 Programming
8.5.1 I2C Serial Bus Address Configuration
To communicate with the HDC1010, the master must first address slave devices via a slave address byte. The
slave address byte consists of seven address bits and a direction bit that indicates the intent to execute a read or
write operation. The HDC1010 features two address pins to allow up to 4 devices to be addressed on a single
bus. Table 1 describes the pin logic levels used to properly connect up to 4 devices. The state of the ADR0 and
ADR1 pins is sampled on every bus communication and should be set before any activity on the interface
occurs. The address pin is read at the start of each communication event.
Table 1. HDC1010 ADDRESS
ADR1
ADR0
ADDRESS (7-bit address)
1000000
0
0
1
1
0
1
0
1
1000001
1000010
1000011
8.5.2 I2C Interface
The HDC1010 operates only as a slave device on the I2C bus interface. It is not allowed to have on the I2C bus
multiple devices with the same address. Connection to the bus is made via the open-drain I/O lines, SDA, and
SCL. The SDA and SCL pins feature integrated spike-suppression filters and Schmitt triggers to minimize the
effects of input spikes and bus noise. After power-up, the sensor needs at most 15 ms, to be ready to start RH
and temperature measurement. During this power-up time the HDC1010 is only able to provide the content of the
serial number registers (0xFB to 0xFF) if requested. After the power-up the sensor is in the sleep mode until a
communication or measurement is performed. All data bytes are transmitted MSB first.
8.5.2.1 Serial Bus Address
To communicate with the HDC1010, the master must first address slave devices via a slave address byte. The
slave address byte consists of seven address bits, and a direction bit that indicates the intent to execute a read
or write operation.
8.5.2.2 Read and Write Operations
To access a particular register on the HDC1010, write the desired register address value to the Pointer Register.
The pointer value is the first byte transferred after the slave address byte with the R/W bit low. Every write
operation to the HDC1010 requires a value for the pointer register (refer to Figure 10).
When reading from the HDC1010, the last value stored in the pointer by a write operation is used to determine
which register is read by a read operation. To change the pointer register for a read operation, a new value must
be written to the pointer. This transaction is accomplished by issuing the slave address byte with the R/W bit low,
followed by the pointer byte. No additional data is required (refer to Figure 11).
The master can then generate a START condition and send the slave address byte with the R/W bit high to
initiate the read command. Note that register bytes are sent MSB first, followed by the LSB. A write operation in
a read-only register such as (DEVICE ID, MANUFACTURER ID, SERIAL ID) returns a NACK after each data
byte; read/write operation to unused address returns a NACK after the pointer; a read/write operation with
incorrect I2C address returns a NACK after the I2C address.
10
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HDC1010
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ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
1
9
1
9
SCL
SDA
!6
!5
!4
!3
!2
!1
!0
ꢂ7
ꢂ6
ꢂ5
ꢂ4
ꢂ3
ꢂ2
ꢂ1
ꢂ0
R/W
{tart by
ꢀaster
!ck by
{lave
!ck by
{lave
Frame 1
7-bit Serial Bus Address Byte
Frame 2
Pointer Register Byte
1
9
1
9
SCL
SDA
ꢁ15 ꢁ14 ꢁ13 ꢁ12 ꢁ11 ꢁ10
ꢁ9
ꢁ8
ꢁ7
ꢁ6
ꢁ5
ꢁ4
ꢁ3
ꢁ2
ꢁ1
ꢁ0
!ck by
{lave
!ck by
{lave
{top by
ꢀaster
Frame 3
Data MSB from
MASTER
Frame 4
Data LSB from
MASTER
Figure 10. Writing Frame (Configuration Register)
1
9
1
9
SCL
SDA
!6 !5 !4 !3 !2 !1 !0 R/W
ꢃ7 ꢃ6 ꢃ5 ꢃ4 ꢃ3 ꢃ2 ꢃ1 ꢃ0
{tart by
ꢀaster
!ck by
{lave
!ck by
{lave
Frame 1
Frame 2
7-bit Serial Bus Address Byte
Pointer Register Byte
1
9
1
9
1
9
SCL
SDA
!6 !5 !4 !3 !2 !1 !0 R/W
ꢁ15 ꢁ14 ꢁ13 ꢁ12 ꢁ11 ꢁ10 ꢁ9 ꢁ8
ꢁ7 ꢁ6 ꢁ5 ꢁ4 ꢁ3 ꢁ2 ꢁ1 ꢁ0
{tart by
ꢀaster
!ck by
{lave
!ck by
ꢀaster
ꢂack by {top by
ꢀaster ꢀaster
Frame 4
Data MSB from
Slave
Frame 5
Data LSB from
Slave
Frame 3
7-bit Serial Bus Address Byte
Figure 11. Reading Frame (Configuration Register)
8.5.2.3 Device Measurement Configuration
By default the HDC1010 will first perform a temperature measurement followed by a humidity measurement. On
power-up, the HDC1010 enters a low power sleep mode and is not actively measuring. Use the following steps
to perform a measurement of both temperature and humidity and then retrieve the results:
1. Configure the acquisition parameters in register address 0x02:
(a) Set the acquisition mode to measure both temperature and humidity by setting Bit[12] to 1.
(b) Set the desired temperature measurement resolution:
–
Set Bit[10] to 0 for 14 bit resolution.
–
Set Bit[10] to 1 for 11 bit resolution.
(c) Set the desired humidity measurement resolution:
–
–
–
Set Bit[9:8] to 00 for 14 bit resolution.
Set Bit[9:8] to 01 for 11 bit resolution.
Set Bit[9:8] to 10 for 8 bit resolution.
2. Trigger the measurements by executing a pointer write transaction with the address pointer set to 0x00.
Refer to Figure 12.
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11
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3. Wait for the measurements to complete, based on the conversion time (refer to Electrical Characteristics(1)
for the conversion time). Alternatively, wait for the assertion of DRDYn.
4. Read the output data:
Read the temperature data from register address 0x00, followed by the humidity data from register address
0x01 in a single transaction as shown in Figure 14. A read operation will return a NACK if the contents of the
registers have not been updated as shown in Figure 13.
To perform another acquisition with the same measurement configuration simply repeat steps 2 through 4.
If only a humidity or temperature measurement is desired, the following steps will perform a measurement and
retrieve the result:
1. Configure the acquisition parameters in register address 0x02:
(a) Set the acquisition mode to independently measure temperature or humidity by setting Bit[12] to 0.
(b) For a temperature measurement, set the desired temperature measurement resolution:
–
Set Bit[10] to 0 for 14 bit resolution.
–
Set Bit[10] to 1 for 11 bit resolution.
(c) For a humidity measurement, set the desired humidity measurement resolution:
–
–
–
Set Bit[9:8] to 00 for 14 bit resolution.
Set Bit[9:8] to 01 for 11 bit resolution.
Set Bit[9:8] to 10 for 8 bit resolution.
2. Trigger the measurement by executing a pointer write transaction. Refer to Figure 12
–
–
Set the address pointer to 0x00 for a temperature measurement.
Set the address pointer to 0x01 for a humidity measurement.
3. Wait for the measurement to complete, based on the conversion time (refer to Electrical Characteristics(1) for
the conversion time). Alternatively, wait for the assertion of DRDYn.
4. Read the output data:
Retrieve the completed measurement result from register address 0x00 or 0x01, as appropriate, as shown in
Figure 10. A read operation will return a NACK if the measurement result is not yet available, as shown in
Figure 13.
To perform another acquisition with the same measurement configuration repeat steps 2 through 4.
It is possible to read the output registers (addresses 0x00 and 0x01) during an Temperature or Relative Humidity
measurement without affecting any ongoing measurement. Note that a write to address 0x00 or 0x01 while a
measurement is ongoing will abort the ongoing measurement. If the newest acquired measurement is not read,
DRDYn stays low until the next measurement is triggered.
1
9
1
9
SCL
SDA
!6 !5 !4 !3 !2 !1 !0 R/W
ꢁ7 ꢁ6 ꢁ5 ꢁ4 ꢁ3 ꢁ2 ꢁ1 ꢁ0
{tart by
ꢀaster
!ck by
{lave
!ck by
{lave
Frame 1
Frame 2
7-bit Serial Bus Address Byte
Pointer Register Byte
Figure 12. Trigger Humidity/Temperature Measurement
(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
12
Copyright © 2016, Texas Instruments Incorporated
HDC1010
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ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
1
9
SCL
SDA
!6 !5 !4 !3 !2 !1 !0 R/W
{tart by
ꢀaster
ꢁack by
{lave
Frame 3
7-bit Serial Bus Address Byte
Figure 13. Read Humidity/Temperature Measurement (Data Not Ready)
1
9
1
9
1
9
SCL
SDA
!6 !ꢀ !4 !3 !2 !1 !0 R/W
51ꢀ 514 513 512 511 510 59 58
57 56 5ꢀ 54 53 52 51 50
{tꢁrt by
aꢁster
!ck by
{lꢁve
!ck by
aꢁster
!ck by
aꢁster
Frame 4
Data MSB from
Slave
Frame 5
Data LSB from
Slave
Frame 3
7-bit Serial Bus Address Byte
1
9
1
9
SCL
51ꢀ 514 513 512 511 510 59 58
57 56 5ꢀ 54 53 52 51 50
SDA
!ck by
aꢁster
ꢂꢁck by {top by
aꢁster aꢁster
Frame 6
Data MSB from
Slave
Frame 7
Data LSB from
Slave
Figure 14. Read Humidity and Temperature Measurement (Data Ready)
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HDC1010
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8.6 Register Map
The HDC1010 contains data registers that hold configuration information, temperature and humidity
measurement results, and status information.
Table 2. Register Map
Pointer
0x00
Name
Reset value
0x0000
Description
Temperature
Humidity
Temperature measurement output
Relative Humidity measurement output
HDC1010 configuration and status
First 2 bytes of the serial ID of the part
Mid 2 bytes of the serial ID of the part
Last byte bit of the serial ID of the part
ID of Texas Instruments
0x01
0x0000
0x02
Configuration
Serial ID
0x1000
0xFB
0xFC
0xFD
0xFE
0xFF
device dependent
device dependent
device dependent
0x5449
Serial ID
Serial ID
Manufacturer ID
Device ID
0x1000
ID of HDC1010 device
Registers from 0x03 to 0xFA are reserved and should not be written.
The HDC1010 has an 8-bit pointer used to address a given data register. The pointer identifies which of the data
registers should respond to a read or write command on the two-wire bus. This register is set with every write
command. A write command must be issued to set the proper value in the pointer before executing a read
command. The power-on reset (POR) value of the pointer is 0x00, which selects a temperature measurement.
8.6.1 Temperature Register
The temperature register is a 16-bit result register in binary format (the 2 LSBs D1 and D0 are always 0). The
result of the acquisition is always a 14 bit value. The accuracy of the result is related to the selected conversion
time (refer to Electrical Characteristics(1)). The temperature can be calculated from the output data with:
TEMPERATURE
[
15:00
]
≈
∆
’
÷
Temperature(èC)=
*165èC-40èC
216
«
◊
Table 3. Temperature Register Description (0x00)
Name
Registers
[15:02]
Description
TEMPERATURE
Temperature
Reserved
Temperature measurement (read only)
Reserved, always 0 (read only)
[01:00]
(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
8.6.2 Humidity Register
The humidity register is a 16-bit result register in binary format (the 2 LSBs D1 and D0 are always 0). The result
of the acquisition is always a 14 bit value, while the accuracy is related to the selected conversion time (refer to
Electrical Characteristics(1)). The humidity can be calculated from the output data with:
HUMIDITY
216
[15:00
]
≈
∆
’
÷
Relative Humidity(% RH)=
*100%RH
«
◊
Table 4. Humidity Register Description (0x01)
Name
Registers
Description
HUMIDITY
[15:02]
Relative
Relative Humidity measurement (read only)
Humidity
[01:00]
Reserved
Reserved, always 0 (read only)
(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
14
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8.6.3 Configuration Register
This register configures device functionality and returns status.
Table 5. Configuration Register Description (0x02)
NAME
REGISTERS
[15]
DESCRIPTION
Normal Operation, this bit self clears
Software Reset
RST
Software reset
bit
0
1
0
0
1
0
1
0
1
0
1
Reserved
HEAT
[14]
[13]
Reserved
Heater
Reserved, must be 0
Heater Disabled
Heater Enabled
MODE
BTST
TRES
[12]
[11]
[10]
Mode of
acquisition
Temperature or Humidity is acquired.
Temperature and Humidity are acquired in sequence, Temperature first.
Battery voltage > 2.8V (read only)
Battery voltage < 2.8V (read only)
14 bit
Battery Status
Temperature
Measurement
Resolution
11 bit
HRES
[9:8]
[7:0]
Humidity
Measurement
Resolution
00
01
10
0
14 bit
11 bit
8 bit
Reserved
Reserved
Reserved, must be 0
8.6.4 Serial Number Registers
These registers contain a 40bit unique serial number for each individual HDC1010.
Table 6. Serial Number Register Description (0xFB)
Name
Registers
Description
SERIAL ID[40:25]
[15:0]
Serial Id bits
Device Serial Number bits from 40 to 25 (read only)
Table 7. Serial Number Register Description (0xFC)
Name
Registers
Description
SERIAL ID[24:9]
[15:0]
Serial Id bits
Device Serial Number bits from 24 to 9 (read only)
Table 8. Serial Number Register Description (0xFD)
Name
Registers
[15:7]
Description
SERIAL ID[8:0]
Serial Id bits
Reserved
Device Serial Number bits from 8 to 0 (read only)
Reserved, always 0 (read only)
[6:0]
8.6.5 Manufacturer ID Register
This register contains a factory-programmable identification value that identifies this device as being
manufactured by Texas Instruments. This register distinguishes this device from other devices that are on the
same I2C bus. The manufacturer ID reads 0x5449.
Table 9. Manufacturer ID Register Description (0xFE)
Name
Registers
Description
MANUFACTURER
ID
[15:0]
Manufacturer
ID
0x5449
Texas instruments ID (read only)
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8.6.6 Device Register ID
This register contains a factory-programmable identification value that identifies this device as a HDC1010. This
register distinguishes this device from other devices that are on the same I2C bus. The Device ID for the
HDC1010 is 0x1000.
Table 10. Device ID Register Description (0xFF)
Name
Registers
Description
DEVICE ID
[15:0]
Device ID
0x1000
HDC1010 Device ID (read only)
16
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ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
An HVAC system thermostat control is based on environmental sensors and a micro-controller. The micro-
controller acquires data from humidity sensors and temperature sensors and controls the heating/cooling system.
The collected data are then showed on a display that can be easily controlled by the micro controller. Based on
data from the humidity and temperature sensor, the heating/cooling system then maintains the environment at
customer-defined preferred conditions.
9.2 Typical Application
In a battery-powered HVAC system thermostat, one of the key parameters in the selection of components is the
power consumption. The HDC1010, with its 1.3μA of current consumption (average consumption over 1s for RH
and Temperature measurements) in conjunction with an MSP430 represents an excellent choice for the low
power consumption, which extends the battery life. A system block diagram of a battery powered HVAC or
Thermostat is shown in Figure 15.
DISPLAY
Temp 29°C
RH 40%
-
+
Lithium
ion battery
TPL5110
TIME xx:xx
Date xx/xx/xxxx
EN/
ONE_SHOT
VDD
DRV
DELAY/
M_DRIVE
GND
DONE
KEYBOARD
Button
RH
VDD
HDC1010
ADC
VDD
MCU
I2C
SDA
SCL
Registers
and
Logic
Peripheral
DRDYn
ADR0
ADR1
I2C
GPIO
Button
Button
GPIO
GPIO
GPIO
GPIO
GPIO
OTP
Calibration Coefficients
GPIO
GND
TEMPERATURE
GND
To Air
Conditioning
System
Copyright © 2016, Texas Instruments Incorporated
Figure 15. Typical Application Schematic HVAC
9.2.1 Design Requirements
In order to correctly sense the ambient temperature and humidity, the HDC1010 should be positioned away from
heat sources on the PCB. Generally, it should not be close to the LCD and battery. Moreover, to minimize any
self-heating of the HDC1010 it is recommended to acquire at a maximum sample rate of 1sps (RH + Temp). In
home systems, humidity and the temperature monitoring rates of less than 1sps (even 0.5sps or 0.2sps) can be
still effective.
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Typical Application (continued)
9.2.2 Detailed Design Procedure
When a circuit board layout is created from the schematic shown in Figure 15 a small circuit board is possible.
The accuracy of a RH and temperature measurement depends on the sensor accuracy and the setup of the
sensing system. The HDC1010 samples relative humidity and temperature in its immediate environment, it is
therefore important that the local conditions at the sensor match the monitored environment. Use one or more
openings in the physical cover of the thermostat to obtain a good airflow even in static conditions. Refer to the
layout below ( Figure 20) for a PCB layout which minimizes the thermal mass of the PCB in the region of the
HDC1010, which can improve measurement response time and accuracy.
9.2.3 Application Curve
The data showed below have been acquired with the HDC1010EVM. A humidity chamber was used to control
the environment.
Figure 16. RH vs. Time
9.3 Do's and Don'ts
9.3.1 Soldering
For soldering HDC1010 use the standard soldering profile IPC/JEDEC J-STD-020 with peak temperatures at 260
°C. Refer to the document SNVA009 for more details on the DSBGA package. In the document refer to DSBGA
package with bump size 0.5mm pitch and 0.32mm diameter.
When soldering the HDC1010 it is mandatory to use no-clean solder paste and no board wash shall be applied.
The HDC1010 should be limited to a single IR reflow and no rework is recommended.
9.3.2 Chemical Exposure and Sensor Protection
The humidity sensor is not a standard IC and therefore should not be exposed to particulates or volatile
chemicals such as solvents or other organic compounds. If any type of protective coating must be applied to the
circuit board, the sensor must be protected during the coating process.
9.3.3 High Temperature and Humidity Exposure
Long exposure outside the recommended operating conditions may temporarily offset the RH output. Table 11
shows the RH offset values that can be expected for exposure to 85°C and 85% RH for duration between 12 and
500 hours (continuos).
18
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HDC1010
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ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
Table 11. Induced RH Offset Due to Extended Exposure to High Humidity and High Temperature
(85°C/85% RH)
85°C/85% RH Duration (hours)
12
24
168
500
RH Offset (%)
3
6
12
15
When the sensor is exposed to less severe conditions, Figure 17 shows the typical RH offset at other
combinations of temperature and RH.
100
90
80
70
60
50
40
30
20
10
±3%
±4%
±2%
±3%
0
10
20
30
40
50
60
70
Temperature (°C)
Figure 17. Relative Humidity Accuracy vs Temperature
10 Power Supply Recommendations
The HDC1010 require a voltage supply within 2.7V and 5.5V. A multilayer ceramic bypass X7R capacitor of
0.1µF between VDD and GND pin is recommended.
11 Layout
11.1 Layout Guidelines
The Relative Humidity sensor element is located on the bottom side of the package. It is positioned between the
two rows of bumps
It is recommended to not route any traces below the sensor element. Moreover the external components, such
as pull-up resistors and bypass capacitors need to be placed next to the 2 rows of bumps or on the bottom side
of the PCB in order to guarantee a good air flow.
It is recommended to isolate the sensor from the rest of the PCB by eliminating copper layers below the device
(GND, VDD) and creating a slot into the PCB around the sensor to enhance thermal isolation.
11.1.1 Surface Mount
Two types of PCB land patterns are used for surface mount packages:
1. Non-solder mask defined (NSMD)
2. Solder mask defined (SMD)
Pros and cons of NSMD and SMD:
1. The NSMD configuration is preferred due to its tighter control of the copper etch process and a reduction in
the stress concentration points on the PCB side compared to SMD configuration.
2. A copper layer thickness of less than 1 oz. is recommended to achieve higher solder joint stand-off. A 1 oz.
(30 micron) or greater copper thickness causes a lower effective solder joint stand-off, which may
Copyright © 2016, Texas Instruments Incorporated
19
HDC1010
ZHCSFF0A –MAY 2016–REVISED AUGUST 2016
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Layout Guidelines (continued)
compromise solder joint reliability.
3. For the NSMD pad geometry, the trace width at the connection to the land pad should not exceed 2/3 of the
pad diameter.
0.05 MAX
(
0.263)
METAL
METAL
UNDER
MASK
0.05 MIN
(
0.263)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
Figure 18. Solder Mask
11.1.2 Stencil Printing Process
1. Use laser cutting followed by electro-polishing for stencil fabrication
2. If possible, offset apertures from land pads to maximize separation and minimize possibility of bridging for
DSBGA packages
3. Use Type 3 (25 to 45 micron particle size range) or finer solder paste for printing
(0.5) TYP
8X ( 0.25)
(R0.05) TYP
1
2
A
B
SYMM
(0.5) TYP
C
D
METAL
TYP
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1mm THICK STENCIL
SCALE:25X
Figure 19. Solder Paste
20
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HDC1010
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11.2 Layout Example
The only component next to the device is the supply bypass capacitor. Since the relative humidity is dependent
on the temperature, the HDC1010 should be positioned away from hot points present on the board such as
battery, display or micro-controller. Slots around the device can be used to reduce the thermal mass, for a
quicker response to environmental changes.
Çht [!ò9w
.hÇÇha [!ò9w
Figure 20. Layout
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21
HDC1010
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12 器件和文档支持
12.1 文档支持
12.1.1 相关文档ꢀ
《适用于星型网络的无线湿度和温度传感器节点参考设计，可实现 10 年以上的纽扣电池使用寿命》 TIDA-00374
《适用于低于 1GHz 的星型网络的湿度和温度传感器节点，可实现 10 年以上的纽扣电池使用寿命》 TIDA-00484
《具有 NFC 接口的超低功耗多传感器数据记录器参考设计》TIDA-00524
《HDC1010 德州仪器 (TI) 湿度传感器》，SNAA216
12.2 接收文档更新通知
如需接收文档更新通知，请访问 www.ti.com.cn 网站上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册
后，即可每周定期收到已更改的产品信息。有关更改的详细信息，请查阅已修订文档中包含的修订历史记录。
12.3 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏
22
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Copyright © 2016, 德州仪器半导体技术（上海）有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
HDC1010YPAR
HDC1010YPAT
ACTIVE
ACTIVE
DSBGA
DSBGA
YPA
YPA
8
8
3000 RoHS & Green
250 RoHS & Green
SAC405 SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
3N
3N
SAC405 SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Sep-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
HDC1010YPAR
HDC1010YPAT
DSBGA
DSBGA
YPA
YPA
8
8
3000
250
178.0
178.0
8.4
8.4
1.68
1.68
2.13
2.13
0.76
0.76
4.0
4.0
8.0
8.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Sep-2016
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
HDC1010YPAR
HDC1010YPAT
DSBGA
DSBGA
YPA
YPA
8
8
3000
250
210.0
210.0
185.0
185.0
35.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
YPA0008
DSBGA - 0.675 mm max height
SCALE 8.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
0.675 MAX
C
SEATING PLANE
0.265
0.215
BALL TYP
1
TYP
D
C
1.5
TYP
0.5
TYP
D: Max = 2.07 mm, Min = 2.01 mm
E: Max = 1.62 mm, Min = 1.56 mm
B
A
1
2
0.335
0.305
8X
C A
0.005
B
4215068/A 11/2013
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YPA0008
DSBGA - 0.675 mm max height
DIE SIZE BALL GRID ARRAY
0.275
0.250
(0.5) TYP
2
8X
1
A
B
C
SYMM
(0.5) TYP
D
SYMM
LAND PATTERN EXAMPLE
SCALE:20X
0.05 MAX
0.05 MIN
(
0.263)
METAL
METAL
UNDER
MASK
(
0.263)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4215068/A 11/2013
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SBVA017 (www.ti.com/lit/sbva017).
www.ti.com
EXAMPLE STENCIL DESIGN
YPA0008
DSBGA - 0.675 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
8X ( 0.25)
(R0.05) TYP
1
2
A
B
SYMM
(0.5) TYP
C
D
METAL
TYP
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1mm THICK STENCIL
SCALE:25X
4215068/A 11/2013
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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Copyright © 2020 德州仪器半导体技术（上海）有限公司
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