HVD233HKX/EM [TI]

具有待机模式和环回功能的耐辐射加固保障 (RHA) 3.3V CAN 收发器 | HKX | 8 | 25 to 25;
HVD233HKX/EM
型号: HVD233HKX/EM
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有待机模式和环回功能的耐辐射加固保障 (RHA) 3.3V CAN 收发器 | HKX | 8 | 25 to 25

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SN55HVD233-SP  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
SN55HVD233-SP 3.3V 耐辐射 CAN 收发器  
1 特性  
3 说明  
1
符合 MIL-PRF 38535 QMLVQML V 类)耐辐  
(RHA) SMD 5962L1420901VXC  
SN55HVD233-SP 依照 ISO 11898 标准, 用于 使用  
控制器区域网络 (CAN) 串行通信物理层的航天器应用  
中。作为 CAN 收发器,此器件在差分 CAN 总线和  
CAN 控制器间提供传输和接收能力,信令速度高达  
1Mbps。  
单粒子闩锁 (SEL) 125°C 下的抗扰度可达  
86MeV-cm2/mg  
电离辐射总剂量 (TID) 在低剂量率下可达  
50kRad (Si)  
SN55HVD233-SP 专门用于严苛的辐射环境, 具有 交  
叉线保护、过压保护、±16V 接地失效保护和过热(热  
关断)保护。此器件可在 –7V 12V 的宽共模范围内  
运行。此收发器是用于卫星应用的微处理器、FPGA  
ASIC 的主机 CAN 控制器与差分 CAN 总线之间的  
接口。  
符合军用温度范围(-55°C 125°C)  
高性能 8 引脚陶瓷扁平封装 (HKX)  
符合 ISO 11898-2 标准  
总线引脚故障保护大于 ±16V  
总线引脚 ESD 保护大于 ±16kV HBM  
数据传输速率高达 1Mbps  
器件信息(1)  
扩展级共模范围:–7V 12V  
高输入阻抗,允许连接 120 个节点  
器件型号  
等级  
封装  
低电压晶体管-晶体管逻辑电路 (LVTTL) I/O 可耐受  
5V 电压  
QMLV RHA  
[50kRad]  
8 引线 CFP [HKX]  
6.48mm × 6.48mm  
5962L1420901VXC  
8 引线 CFP [HKX]  
6.48mm × 6.48mm  
HVD233HKX/EM(2) 工程样片  
可调节的驱动器传输次数,用于改善信号质量  
未供电节点不会干扰总线  
低电流待机模式,200μA 典型值  
诊断回送功能  
SN55HVD233EVM-  
陶瓷评估板  
CVAL  
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附  
录。  
热关断保护  
(2) 这些部件仅适用于工程评估。部件按照不合规的流程进行加工  
处理。这些部件不适用于质检、生产、辐射测试或飞行。这些  
零部件无法在 –55°C 125°C 的完整 MIL 额定温度范围内或  
运行寿命中保证其性能。  
加电和断电无干扰总线输入和输出  
具有低 VCC 的高输入阻抗  
功率循环过程中单片输出  
简化原理图  
2 应用  
VCC  
VCC  
航天器背板数据总线通信和控制  
VCC  
VCC  
CANopenDeviceNetCAN KingdomISO  
D
11783NMEA 2000SAE J1939 CAN 总线标  
VCC  
RS  
SLOPE CONTROL  
and MODE  
LOGIC  
LBK / EN /AB  
R
GND  
Copyright © 2017, Texas Instruments Incorporated  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
English Data Sheet: SLLSEI2  
 
 
 
 
 
SN55HVD233-SP  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
www.ti.com.cn  
目录  
1
2
3
4
5
6
7
特性.......................................................................... 1  
应用.......................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 2  
说明 (续.............................................................. 3  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 4  
7.1 Absolute Maximum Ratings ...................................... 4  
7.2 ESD Ratings.............................................................. 4  
7.3 Recommended Operating Conditions....................... 4  
7.4 Thermal Information.................................................. 5  
7.5 Driver Electrical Characteristics ................................ 6  
7.6 Receiver Electrical Characteristics ........................... 6  
7.7 Driver Switching Characteristics ............................... 7  
7.8 Receiver Switching Characteristics........................... 8  
7.9 Device Switching Characteristics.............................. 8  
7.10 Typical Characteristics............................................ 9  
Parameter Measurement Information ................ 11  
9
Detailed Description ............................................ 15  
9.1 Overview ................................................................. 15  
9.2 Functional Block Diagram ....................................... 15  
9.3 Feature Description................................................. 15  
9.4 Device Functional Modes........................................ 19  
10 Application and Implementation........................ 20  
10.1 Application Information.......................................... 20  
10.2 Typical Application ................................................ 22  
11 Power Supply Recommendations ..................... 24  
12 Layout................................................................... 24  
12.1 Layout Guidelines ................................................. 24  
12.2 Layout Example .................................................... 26  
13 器件和文档支持 ..................................................... 27  
13.1 接收文档更新通知 ................................................. 27  
13.2 社区资源................................................................ 27  
13.3 ....................................................................... 27  
13.4 静电放电警告......................................................... 27  
13.5 Glossary................................................................ 27  
14 机械、封装和可订购信息....................................... 27  
8
4 修订历史记录  
Changes from Original (September 2017) to Revision A  
Page  
已更改 将器件状态从高级信息 更改为生产数据...................................................................................................................... 1  
2
版权 © 2017, Texas Instruments Incorporated  
 
SN55HVD233-SP  
www.ti.com.cn  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
5 说明 (续)  
模式:SN55HVD233-SP 的引脚 8 RS 具有三种运行模式:高速、斜率控制或低功耗待机模式。用户可直接将引脚  
8 接地以选择高速运行模式,驱动器输出晶体管将尽快开启和关闭,无上升和下降斜率限制。由于斜率与引脚的输  
出电流成比例,用户可在引脚 8 连接接地的电阻器以调节上升和下降斜率。斜率控制可通过 0Ω 电阻进行,以实现  
38V/μs 的转换率;最高可通过 50kΩ电阻进行,从而实现约 4V/μs 的转换率。有关斜率控制的更多信息,请参  
应用和实现 部分。  
如果引脚 8 具有高模式电平,当驱动器关闭且接收器保持工作状态时,SN55HVD233-SP 将进入低电流待机(只  
听)模式。当本地协议控制器需要向总线传输时,将会改变此低电流待机模式。有关回送模式的更多信息,请参阅  
应用信息 部分。  
回送:SN55HVD233-SP 的回送 LBK 引脚 5 逻辑高电平使总线输出和总线输入处于高阻抗状态。其余电路将保持  
工作状态,可用于驱动器到接收器的回送和自诊断节点功能,且不会干扰总线。  
CAN 总线状态:在器件供电运行期间,CAN 总线具有两种状态:显性和隐性。在总线显性状态下,总线采用差分  
驱动方式,D R 引脚相应地置为逻辑低电平。在隐性总线状态下,总线通过接收器的高电阻内部输入电阻器 RIN  
偏置为 VCC/2D R 引脚相应地偏置为逻辑高电平(请参阅总线状态(物理位表示) 简化的隐性共模偏置和  
接收器)。  
6 Pin Configuration and Functions  
HKX Package  
8-Pin CFP  
Top View  
RS  
1
2
3
4
8
7
6
5
D
GND  
CANH  
CANL  
LBK  
V
CC  
R
Pin Functions  
PIN  
TYPE  
DESCRIPTION  
NAME  
D
NO.  
1
I
CAN transmit data input (LOW for dominant and HIGH for recessive bus states), also called TXD, driver input.  
GND  
VCC  
2
GND Ground connection.  
3
Supply Transceiver 3.3-V supply voltage.  
CAN receive data output (LOW for dominant and HIGH for recessive bus states), also called RXD, receiver  
output.  
R
4
O
LBK  
5
6
7
I
Loopback mode input pin.  
Low-level CAN bus line.  
High-level CAN bus line.  
CANL  
CANH  
I/O  
I/O  
Mode select pin:  
Tie to GND = high-speed mode,  
Strong pullup to VCC = low power mode,  
0-Ω to 50-kΩ pulldown to GND = slope control mode.  
RS  
8
I
Copyright © 2017, Texas Instruments Incorporated  
3
SN55HVD233-SP  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
www.ti.com.cn  
7 Specifications  
7.1 Absolute Maximum Ratings  
over operating junction temperature unless otherwise noted(1)(2)  
MIN  
–0.3  
–16  
MAX  
UNIT  
V
VCC Supply voltage  
7
16  
100  
7
Voltage at any bus pin (CANH or CANL)  
V
Voltage input, transient pulse, CANH and CANL, through 100 (see Figure 18)  
–100  
–0.5  
–0.5  
–10  
V
VI  
Input voltage, (D, RS, LBK)  
Output voltage, (R)  
V
VO  
IO  
7
V
Receiver output current  
Operating junction temperature  
Storage temperature  
10  
150  
150  
mA  
°C  
°C  
TJ  
Tstg  
–65  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating  
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground pin.  
7.2 ESD Ratings  
VALUE  
±14000  
±4000  
±500  
UNIT  
CANH, CANL, and GND  
Other pins  
Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins(2)  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
Electrostatic  
discharge  
V(ESD)  
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
7.3 Recommended Operating Conditions  
MIN  
NOM  
MAX UNIT  
VCC  
Supply voltage  
3
3.6  
12  
5.5  
0.8  
6
V
V
Voltage at any bus pin (separately or common mode)  
–7  
VIH  
VIL  
VID  
High-level input voltage  
Low-level input voltage  
Differential input voltage  
D, LBK  
D, LBK  
2
V
0
–6  
V
V
Resistance from RS to ground for slope control  
VI(RS) Input voltage at RS for standby  
0
50  
5.5  
kΩ  
V
0.75 VCC  
–50  
Driver  
IOH  
High-level output current  
mA  
Receiver  
Driver  
–10  
50  
10  
IOL  
TJ  
Low-level output current  
mA  
°C  
Receiver  
Operating junction temperature(1)  
–55  
125  
(1) Maximum junction temperature operation is allowed as long as the device maximum junction temperature is not exceeded.  
4
Copyright © 2017, Texas Instruments Incorporated  
SN55HVD233-SP  
www.ti.com.cn  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
7.4 Thermal Information  
SN55HVD233-SP  
THERMAL METRIC(1)(2)  
HKX (CFP)  
8 PINS  
97.1  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
RθJC(top)  
RθJB  
21.5  
79.1  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
13.7  
ψJB  
73.6  
RθJC(bot)  
7.0  
(1) All values except RθJC were taken on a JEDEC-51 standard High-K PCB using a nominal lead form. Differences in lead form,  
component density, or PCB design can affect these values.  
(2) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report, SPRA953.  
Copyright © 2017, Texas Instruments Incorporated  
5
SN55HVD233-SP  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
www.ti.com.cn  
7.5 Driver Electrical Characteristics  
The specifications shown below are valid across temperature range of –55°C to 125°C pre-radiation and 25°C post-radiation.  
When different, the post-radiation values are shown in a separate row specified by the corresponding RHA level (L = 50  
krad).  
PARAMETER  
TEST CONDITIONS  
SUBGROUP(1)  
MIN TYP(2) MAX UNIT  
Bus output  
voltage  
(dominant)  
CANH  
CANL  
CANH  
CANL  
[1, 2, 3]  
2.4  
0.5  
VCC  
V(D) = 0 V, V(RS) = 0 V, see Figure 12 and  
Figure 13  
VO(D)  
V
V
[1, 2, 3]  
1.25  
Bus output  
voltage  
(recessive)  
2.3  
2.3  
2
V(D) = 3 V, V(RS) = 0 V, see Figure 12 and  
Figure 13  
VO  
1.5  
1.4  
3
3
V(D) = 0 V, V(RS) = 0 V, see Figure 12 and  
Figure 13  
[1, 2, 3]  
[1, 2, 3]  
Differential output voltage  
(dominant)  
L
VOD(D)  
V
V(D) = 0 V, V(RS) = 0 V, see Figure 13 and  
Figure 14  
1.2  
2
V(D) = 3 V, V(RS) = 0 V, see Figure 12 and  
Figure 13  
[1, 2, 3]  
[1, 2, 3]  
–120  
–0.5  
12 mV  
Differential output voltage  
(recessive)  
VOD  
V(D) = 3 V, V(RS) = 0 V, no load  
0.05  
V
V
Peak-to-peak common-  
mode output voltage  
VOC(pp)  
IIH  
See Figure 20  
1
High-level  
D, LBK  
V(D) = 2 V  
[1, 2, 3]  
[1, 2, 3]  
–30  
30  
30  
μA  
μA  
input current  
Low-level input  
D, LBK  
IIL  
V(D) = 0.8 V  
–30  
current  
V(CANH) = –7 V, CANL open, see Figure 23  
V(CANH) = 12 V, CANL open, see Figure 23  
V(CANL) = –7 V, CANH open, see Figure 23  
V(CANL) = 12 V, CANH open, see Figure 23  
See receiver input capacitance  
[1, 2, 3]  
[1, 2, 3]  
[1, 2, 3]  
[1, 2, 3]  
–250  
1
IOS  
Short-circuit output current  
Output capacitance  
mA  
–1  
250  
CO  
RS input current for  
standby  
IIRS(s)  
V(RS) = 0.75 VCC  
[1, 2, 3]  
–10  
μA  
μA  
Standby  
V(RS) = VCC, V(D) = VCC, V(LBK) = 0 V  
[1, 2, 3]  
[1, 2, 3]  
[1, 2, 3]  
200 600  
ICC  
Supply current Dominant V(D) = 0 V, no load, V(LBK) = 0 V, RS = 0 V  
Recessive V(D) = VCC, no load, V(LBK) = 0 V, V(RS) = 0 V  
6
6
mA  
(1) For subgroup definitions, please see Table 1.  
(2) All typical values are at 25°C and with a 3.3-V supply.  
7.6 Receiver Electrical Characteristics  
The specifications shown below are valid across temperature range of –55°C to 125°C pre-radiation and 25°C post-radiation.  
When different, the post-radiation values are shown in a separate row specified by the corresponding RHA level (L = 50  
krad).  
PARAMETER  
TEST CONDITIONS  
SUBGROUP(1)  
MIN TYP(2) MAX UNIT  
Positive-going input threshold  
voltage  
VIT+  
VIT–  
Vhys  
[1, 2, 3]  
750 900  
650  
mV  
mV  
mV  
Negative-going input threshold  
voltage  
V(LBK) = 0 V, see Table 2  
[1, 2, 3]  
500  
2.4  
Hysteresis voltage (VIT+  
VIT–  
100  
)
VOH High-level output voltage  
VOL Low-level output voltage  
IO = –4 mA, see Figure 17  
IO = 4 mA, see Figure 17  
[1, 2, 3]  
[1, 2, 3]  
V
V
0.4  
(1) For subgroup definitions, please see Table 1.  
(2) All typical values are at 25°C and with a 3.3-V supply.  
6
Copyright © 2017, Texas Instruments Incorporated  
SN55HVD233-SP  
www.ti.com.cn  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
Receiver Electrical Characteristics (continued)  
The specifications shown below are valid across temperature range of –55°C to 125°C pre-radiation and 25°C post-radiation.  
When different, the post-radiation values are shown in a separate row specified by the corresponding RHA level (L = 50  
krad).  
PARAMETER  
TEST CONDITIONS  
V(CANH) or V(CANL) = 12 V  
SUBGROUP(1)  
MIN TYP(2) MAX UNIT  
[1, 2, 3]  
150  
500  
V(CANH) or V(CANL) = 12 V,  
VCC = 0 V  
Other bus pin = 0 V,  
V(D) = 3 V,  
V(LBK) = 0 V,  
V(RS) = 0 V  
[1, 2, 3]  
[1, 2, 3]  
[1, 2, 3]  
150  
600  
II  
Bus input current  
μA  
CANH or CANL = –7 V  
–610  
–450  
–100  
–100  
CANH or CANL = –7 V,  
VCC = 0 V  
Input capacitance (CANH or  
CANL)  
Pin-to-ground, VI = 0.4 sin(4E6πt) + 0.5 V,  
V(D) = 3 V, V(LBK) = 0 V  
CI  
40  
20  
pF  
Pin-to-pin, VI = 0.4 sin(4E6πt) + 0.5 V,  
V(D) = 3 V, V(LBK) = 0 V  
CID  
RID  
RIN  
Differential input capacitance  
Differential input resistance  
pF  
kΩ  
kΩ  
[4, 5, 6]  
[4, 5, 6]  
40  
20  
105  
55  
V(D) = 3 V, V(LBK) = 0 V  
Input resistance (CANH or  
CANL)  
Standby  
V(RS) = VCC, V(D) = VCC, V(LBK) = 0 V  
[1, 2, 3]  
[1, 2, 3]  
[1, 2, 3]  
200 600  
μA  
mA  
mA  
Supply  
current  
ICC  
Dominant  
V(D) = 0 V, no load, V(RS) = 0 V, V(LBK) = 0 V  
V(D) = VCC, no load, V(RS) = 0 V, V(LBK) = 0 V  
6
6
Recessive  
7.7 Driver Switching Characteristics  
The specifications shown below are valid across temperature range of –55°C to 125°C pre-radiation and 25°C post-radiation.  
When different, the post-radiation values are shown in a separate row specified by the corresponding RHA level (L = 50  
krad).  
PARAMETER  
TEST CONDITIONS  
V(RS) = 0 V, see Figure 15  
SUBGROUP(1)  
[9, 10, 11]  
[9, 10, 11]  
[9, 10, 11]  
[9, 10, 11]  
[9, 10, 11]  
[9, 10, 11]  
MIN TYP(2) MAX UNIT  
35 85  
Propagation delay time,  
low-to-high-level output  
tPLH  
tPHL  
tsk(p)  
RS with 10 kto ground, see Figure 15  
RS with 50 kto ground, see Figure 15  
V(RS) = 0 V, see Figure 15  
70 125  
500 870  
70 120  
130 180  
870 1200  
35  
ns  
ns  
ns  
Propagation delay time,  
high-to-low-level output  
RS with 10 kto ground, see Figure 15  
RS with 50 kto ground, see Figure 15  
V(RS) = 0 V, see Figure 15  
Pulse skew (|tPHL – tPLH|)  
RS with 10 kto ground, see Figure 15  
RS with 50 kto ground, see Figure 15  
60  
370  
tr  
tf  
tr  
tf  
tr  
tf  
Differential output signal rise time  
Differential output signal fall time  
Differential output signal rise time  
Differential output signal fall time  
Differential output signal rise time  
Differential output signal fall time  
[9, 10, 11]  
[9, 10, 11]  
[9, 10, 11]  
[9, 10, 11]  
[9, 10, 11]  
[9, 10, 11]  
20  
20  
70  
ns  
ns  
ns  
ns  
ns  
ns  
V(RS) = 0 V, see Figure 15  
70  
30  
135  
RS with 10 kto ground, see Figure 15  
30  
135  
350  
350  
1400  
RS with 50 kto ground, see Figure 15  
1400  
Enable time from standby to  
dominant  
ten(s)  
See Figure 19  
[9, 10, 11]  
0.6  
1.5  
μs  
(1) For subgroup definitions, please see Table 1.  
(2) All typical values are at 25°C and with a 3.3-V supply.  
Copyright © 2017, Texas Instruments Incorporated  
7
SN55HVD233-SP  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
www.ti.com.cn  
7.8 Receiver Switching Characteristics  
The specifications shown below are valid across temperature range of –55°C to 125°C pre-radiation and 25°C post-radiation.  
When different, the post-radiation values are shown in a separate row specified by the corresponding RHA level (L = 50  
krad).  
PARAMETER  
TEST CONDITIONS  
SUBGROUP(1)  
MIN TYP(2) MAX UNIT  
Propagation delay time, low-to-high-level  
output  
tPLH  
tPHL  
[9, 10, 11]  
35  
35  
105 ns  
105 ns  
Propagation delay time, high-to-low-level  
output  
[9, 10, 11]  
See Figure 17  
tsk(p) Pulse skew (|tPHL – tPLH|)  
7
2
2
ns  
ns  
ns  
tr  
tf  
Output signal rise time  
Output signal fall time  
(1) For subgroup definitions, please see Table 1.  
(2) All typical values are at 25°C and with a 3.3-V supply.  
7.9 Device Switching Characteristics  
The specifications shown below are valid across temperature range of –55°C to 125°C pre-radiation and 25°C post-radiation.  
When different, the post-radiation values are shown in a separate row specified by the corresponding RHA level (L = 50  
krad).  
PARAMETER  
TEST CONDITIONS  
See Figure 22  
SUBGROUP(1)  
MIN TYP(2) MAX UNIT  
Loopback delay, driver input to  
receiver output  
t(LBK)  
7.5  
ns  
V(RS) at 0 V, see Figure 21  
[9, 10, 11]  
[9, 10, 11]  
70 150  
105 225  
V(RS) with 10 kto ground, see  
Figure 21  
Total loop delay, driver input to  
receiver output, recessive to dominant  
t(loop1)  
ns  
V(RS) with 50 kto ground, see  
Figure 21  
[9, 10, 11]  
[9, 10, 11]  
[9, 10, 11]  
500 600  
70 150  
105 225  
V(RS) at 0 V, See Figure 21  
V(RS) with 10 kto ground, see  
Figure 21  
Total loop delay, driver input to  
receiver output, dominant to recessive  
t(loop2)  
ns  
V(RS) with 50 kto ground, see  
Figure 21  
[9, 10, 11]  
500 600  
(1) For subgroup definitions, please see Table 1.  
(2) All typical values are at 25°C and with a 3.3-V supply.  
Table 1. Quality Conformance Inspection(1)  
SUBGROUP  
DESCRIPTION  
Static tests at  
TEMPERATURE (°C)  
1
2
25  
125  
–55  
25  
Static tests at  
3
Static tests at  
4
Dynamic tests at  
Dynamic tests at  
Dynamic tests at  
Functional tests at  
Functional tests at  
Functional tests at  
Switching tests at  
Switching tests at  
Switching tests at  
5
125  
–55  
25  
6
7
8A  
8B  
9
125  
–55  
25  
10  
11  
125  
–55  
(1) MIL-STD-883, Method 5005 - Group A  
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7.10 Typical Characteristics  
100  
95  
90  
85  
80  
75  
70  
65  
60  
100  
95  
90  
85  
80  
75  
VCC = 3.6 V  
VCC = 3.3 V  
VCC = 3 V  
VCC = 3.6 V  
VCC = 3.3 V  
VCC = 3 V  
-55 -40 -25 -10  
5
20 35 50 65 80 95 110 125  
Temperature (°C)  
-55 -40 -25 -10  
5
20 35 50 65 80 95 110 125  
Temperature (èC)  
D005  
D002  
V(RS), V(LBK) = 0 V  
V(RS), V(LBK) = 0 V  
Figure 1. Recessive-To-Dominant Loop Time vs  
Temperature  
Figure 2. Dominant-To-Recessive Loop Time vs  
Temperature  
20  
19  
18  
17  
16  
15  
160  
140  
120  
100  
80  
60  
40  
20  
0
200  
400  
600  
800  
1000  
0
1
2
3
4
Frequency (kbps)  
V(RS), V(LBK) = 0 V  
Low-Level Output Voltage (V)  
C003  
C004  
VCC = 3.3 V  
TA = 25°C  
VCC = 3.3 V  
V(RS), V(LBK) = 0 V  
TA = 25°C  
60-Ω load  
Figure 3. Supply Current vs Frequency  
Figure 4. Driver Low-Level Output Current vs  
Low-Level Output Voltage  
2.2  
2
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0.00  
1.8  
1.6  
1.4  
1.2  
1
VCC = 3.6 V  
VCC = 3.3 V  
VCC = 3 V  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
-55 -40 -25 -10  
5
20 35 50 65 80 95 110 125  
Temperature (°C)  
High-Level Output Voltage (V)  
C005  
D001  
VCC = 3.3 V  
V(RS), V(LBK) = 0 V  
TA = 25°C  
RL = 60 Ω  
V(RS), V(LBK) = 0 V  
Figure 5. Driver High-Level Output Current vs  
High-Level Output Voltage  
Figure 6. Differential Output Voltage vs  
Temperature  
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Typical Characteristics (continued)  
55  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
VCC = 3.6 V  
VCC = 3.3 V  
VCC = 3 V  
VCC = 3.6 V  
VCC = 3.3 V  
VCC = 3 V  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
-55 -40 -25 -10  
5
20 35 50 65 80 95 110 125  
-55 -40 -25 -10  
5
20 35 50 65 80 95 110 125  
Temperature (èC)  
Temperature (èC)  
D007  
D006  
V(RS), V(LBK) = 0 V  
See Figure 17  
V(RS), V(LBK) = 0 V  
See Figure 17  
Figure 7. Receiver Low-To-High Propagation Delay vs  
Temperature  
Figure 8. Receiver High-To-Low Propagation Delay vs  
Temperature  
60  
55  
50  
45  
40  
35  
30  
25  
55  
50  
45  
40  
VCC = 3.6 V  
VCC = 3.3 V  
VCC = 3 V  
VCC = 3.6 V  
VCC = 3.3 V  
VCC = 3 V  
-55 -40 -25 -10  
5
20 35 50 65 80 95 110 125  
-55 -40 -25 -10  
5
20 35 50 65 80 95 110 125  
Temperature (°C)  
Temperature (èC)  
D003  
D004  
V(RS), V(LBK) = 0 V  
See Figure 15  
V(RS), V(LBK) = 0 V  
See Figure 15  
Figure 10. Driver High-To-Low Propagation Delay vs  
Temperature  
Figure 9. Driver Low-To-High Propagation Delay vs  
Temperature  
35  
30  
25  
20  
15  
10  
5
0
œ5  
0.0  
0.6  
1.2  
1.8  
2.4  
3.0  
3.6  
Supply Voltage (V)  
C011  
V(RS), V(LBK) = 0 V  
RL = 60 Ω  
TA = 25°C  
Figure 11. Driver Output Current vs Supply Voltage  
10  
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8 Parameter Measurement Information  
I
O(CANH)  
D
I
I
60 Ω ±1%  
V
OD  
V
O(CANH)  
V
+ V  
O(CANH)  
O(CANL)  
I
R
S
IRs  
2
V
I
V
OC  
I
O(CANL)  
+
V
I(Rs)  
V
O(CANL)  
-
Figure 12. Driver Voltage, Current, and Test Definition  
Dominant  
3 V  
V
O(CANH)  
Recessive  
2.3 V  
1 V  
V
O(CANL)  
Figure 13. Bus Logic State Voltage Definitions  
330 Ω ±1%  
CANH  
D
V
OD  
V
I
60 Ω ±1%  
+
-7 V V 12 V  
TEST  
R
S
_
CANL  
330 Ω ±1%  
Figure 14. Driver VOD  
CANH  
CANL  
V
CC  
V
/2  
CC  
V /2  
CC  
C
= 50 pF ±20%  
(see Note B)  
L
V
I
0 V  
V
D
V
O
t
t
PHL  
PLH  
R
L
= 60 Ω ±1%  
V
I
R
S
O(D)  
+
90%  
10%  
0.9 V  
V
O
V
0.5 V  
I(Rs)  
(see Note A)  
V
O(R)  
-
t
r
t
f
A. The input pulse is supplied by a generator having the following characteristics:  
Pulse repetition rate (PRR) 125 kHz, 50% duty cycle  
tr 6 ns  
tf 6 ns  
ZO = 50 Ω  
B. CL includes fixture and instrumentation capacitance.  
Figure 15. Driver Test Circuit and Voltage Waveforms  
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Parameter Measurement Information (continued)  
CANH  
R
I
O
V
V
ID  
I(CANH)  
V
+ V  
I(CANH  
I(CANL)  
V
IC  
=
2
V
O
CANL  
V
I(CANL)  
Figure 16. Receiver Voltage and Current Definitions  
2.9 V  
1.5 V  
CANH  
CANL  
2.2 V  
2.2 V  
V
I
R
I
O
V
I
t
t
PHL  
PLH  
C
L
= 15 pF ±20%  
1.5 V  
V
V
OH  
V
O
(see Note A)  
(see Note B)  
90%  
90%  
50%  
10%  
50%  
10%  
V
O
OL  
t
r
t
f
A. The input pulse is supplied by a generator having the following characteristics:  
PRR 125 kHz, 50% duty cycle  
tr 6 ns  
tf 6 ns  
ZO = 50 Ω  
B. CL includes fixture and instrumentation capacitance.  
Figure 17. Receiver Test Circuit and Voltage Waveforms  
Table 2. Differential Input Voltage Threshold Test  
INPUT  
OUTPUT  
R
MEASURED  
|VID  
VCANH  
–6.1 V  
12 V  
VCANL  
–7 V  
|
L
L
900 mV  
900 mV  
6 V  
11.1 V  
–7 V  
VOL  
–1 V  
L
12 V  
6 V  
L
6 V  
–6.5 V  
12 V  
–7 V  
H
H
H
H
H
500 mV  
500 mV  
6 V  
11.5 V  
–1 V  
–7 V  
VOH  
6 V  
12 V  
6 V  
Open  
Open  
X
CANH  
CANL  
R
100  
Pulse Generator  
15 µs Duration  
1% Duty Cycle  
D at 0 V or V  
CC  
Rs, LBK, at 0 V or V  
CC  
t , t 100 ns  
r f  
NOTE: This test is conducted to test survivability only. Data stability at the R output is not specified.  
Figure 18. Test Circuit, Transient Overvoltage Test  
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HVD233  
R
S
CANH  
V
I
D
60 1%  
0 V  
LBK  
CANL  
R
V
O
+
-
15 pF 20%  
V
CC  
50%  
V
I
0 V  
V
V
OH  
50%  
V
O
OL  
t
en(s)  
Copyright © 2017, Texas Instruments Incorporated  
NOTE: All VI input pulses are supplied by a generator having the following characteristics:  
tr or tf 6 ns  
PRR = 125 kHz, 50% duty cycle  
Figure 19. Ten(s) Test Circuit and Voltage Waveforms  
27 Ω ±±1  
27 Ω ±±1  
CANH  
CANL  
V
OC(PP)  
D
V
OC  
V
I
R
S
V
OC  
50 pF ±201  
NOTE: All VI input pulses are supplied by a generator having the following characteristics:  
tr or tf 6 ns  
PRR = 125 kHz, 50% duty cycle  
Figure 20. VOC(pp) Test Circuit and Voltage Waveforms  
0, 10 k,  
or 100 k5%  
DUT  
R
S
CANH  
V
CC  
50%  
50%  
D
V
I
60 1%  
V
I
0 V  
LBK  
t
t
(loop1)  
(loop2)  
CANL  
V
OH  
OL  
V
50%  
50%  
V
O
CC  
V
R
+
-
V
O
15 pF 20%  
Figure 21. T(loop) Test Circuit and Voltage Waveforms  
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HVD233  
V
R
CC  
S
CANH  
50%  
50%  
V
I
+
D
0 V  
V
I
V
OD  
60 W 1%  
-
t
t
(LBK2)  
(LBK1)  
V
LBK  
R
OH  
V
CC  
CANL  
50%  
= t  
50%  
V
O
V
OL  
t
= t  
(LBK2)  
(LBK)  
(LBK1)  
V
OD  
2.3 V  
+
V
O
15 pF 20%  
-
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Figure 22. T(LBK) Test Circuit and Voltage Waveforms  
I
OS  
I
OS  
15 s  
CANH  
D
0 V  
0 V or V  
CC  
+
I
OS  
V
I
12 V  
_
CANL  
V
I
0 V  
0 V  
and  
10 µs  
V
I
-7 V  
Figure 23. IOS Test Circuit and Waveforms  
3.3 V  
T
A
= 25°C  
V
= 3.3 V  
CC  
R2 ± 1%  
R1 ± 1%  
R1 ± 1%  
CANH  
CANL  
+
ID  
-
R
V
V
ac  
V
I
R2 ± 1%  
The R Output State Does Not Change During  
Application of the Input Waveform.  
V
ID  
R1  
R2  
500 mV  
900 mV  
50 Ω  
50 Ω  
280 Ω  
130 Ω  
12 V  
V
I
-7 V  
NOTE: All input pulses are supplied by a generator with ƒ 1.5 MHz.  
Figure 24. Common-Mode Voltage Rejection  
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9 Detailed Description  
9.1 Overview  
The SN55HVD233-SP is used in applications employing the CAN serial communication physical layer in  
accordance with the ISO 11898 standard. As a CAN transceiver, the device provides transmit and receive  
capability between the differential CAN bus and a CAN controller, with signaling rates up to 1 Mbps.  
Designed for operation in especially harsh environments, the SN55HVD233-SP features cross-wire, overvoltage,  
and loss of ground protection to ±16 V, overtemperature (thermal shutdown) protection, and common-mode  
transient protection of ±100 V. This device operates over a wide –7-V to 12-V common mode range. This  
transceiver is the interface between the host CAN controller on the microprocessor, FPGA, or ASIC, and the  
differential CAN bus used in satellite applications.  
9.2 Functional Block Diagram  
8
ws  
7
/!bI  
1
5
6
/!b[  
4
w
[.Y  
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9.3 Feature Description  
9.3.1 Modes  
The RS, pin 8 of the SN55HVD233-SP, provides for three modes of operation: high-speed, slope control, or low-  
power standby mode. The user selects the high-speed mode of operation by connecting pin 8 directly to ground,  
allowing the driver output transistors to switch on and off as fast as possible with no limitation on the rise and fall  
slope. The user can adjust the rise and fall slope by connecting a resistor to ground at pin 8, because the slope  
is proportional to the pin's output current. Slope control is implemented with a resistor values of 0 to achieve a  
single ended slew rate of approximately 38 V/μs up to a value of 50 kto achieve approximately 4 V/μs slew  
rate. For more information about slope control, refer to Application and Implementation.  
The SN55HVD233-SP enters a low-current standby (listen-only) mode during which the driver is switched off and  
the receiver remains active if a high logic level is applied to pin 8. The local protocol controller reverses this low-  
current standby mode when it needs to transmit to the bus.  
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Feature Description (continued)  
9.3.2 Loopback  
A logic high on the loopback LBK pin 5 of the SN55HVD233-SP places the bus output and bus input in a high-  
impedance state. The remaining circuit remains active and available for driver-to-receiver loopback, self-  
diagnostic node functions without disturbing the bus. For more information on the loopback mode, refer to the  
Application Information.  
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Feature Description (continued)  
9.3.3 CAN Bus States  
The CAN bus has two states during powered operation of the device: dominant and recessive. A dominant bus  
state is when the bus is driven differentially, corresponding to a logic low on the D and R pin. A recessive bus  
state is when the bus is biased to VCC / 2 through the high-resistance internal input resistors RIN of the receiver,  
corresponding to a logic high on the D and R pins (see Figure 25 and Figure 26).  
/!bI  
Vdiff(D)  
Vdiff(R)  
/!b[  
Çime, t  
wecessive  
[ogic I  
5ominant  
[ogic [  
wecessive  
[ogic I  
Figure 25. Bus States (Physical Bit Representation)  
/!bI  
wó5  
VCC/2  
/!b[  
Figure 26. Simplified Recessive Common Mode Bias and Receiver  
9.3.4 ISO 11898 Compliance of SN55HVD233-SP  
9.3.4.1 Introduction  
Many users value the low-power consumption of operating their CAN transceivers from a 3.3-V supply. However,  
some users are concerned about the interoperability with 5-V supplied transceivers on the same bus. This report  
analyzes this situation to address those concerns.  
9.3.4.2 Differential Signal  
CAN is a differential bus where complementary signals are sent over two wires and the voltage difference  
between the two wires defines the logical state of the bus. The differential CAN receiver monitors this voltage  
difference and outputs the bus state with a single-ended output signal.  
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Feature Description (continued)  
NOISE MARGIN  
900 mV Threshold  
500 mV Threshold  
RECEIVER DETECTION WINDOW  
75% SAMPLE POINT  
NOISE MARGIN  
Figure 27. Typical SN55HVD233-SP Differential Output Voltage Waveform  
The CAN driver creates the difference in voltage between CANH and CANL in the dominant state. The dominant  
differential output of the SN55HVD233-SP is greater than 1.5 V and less than 3 V across a 60-Ω load. The  
minimum required by ISO 11898 is 1.5 V and maximum is 3 V. These are the same limiting values for 5-V  
supplied CAN transceivers. The bus termination resistors drive the recessive bus state and not the CAN driver.  
A CAN receiver is required to output a recessive state with less than 500 mV and a dominant state with more  
than 900 mV difference voltage on its bus inputs. The CAN receiver must do this with common-mode input  
voltages from –2 V to 7 V. The SN55HVD233-SP receiver meets these same input specifications as 5-V supplied  
receivers.  
9.3.4.2.1 Common-Mode Signal  
A common-mode signal is an average voltage of the two signal wires that the differential receiver rejects. The  
common-mode signal comes from the CAN driver, ground noise, and coupled bus noise. The supply voltage of  
the CAN transceiver has nothing to do with noise. The SN55HVD233-SP driver lowers the common-mode output  
in a dominant bit by a couple hundred millivolts from that of most 5-V drivers. While this does not fully comply  
with ISO 11898, this small variation in the driver common-mode output is rejected by differential receivers and  
does not effect data, signal noise margins, or error rates.  
9.3.4.3 Interoperability of 3.3-V CAN in 5-V CAN Systems  
The 3.3-V supplied CAN transceivers are electrically interchangeable with 5-V CAN transceivers. The differential  
output is the same. The recessive common mode output is the same. The dominant common mode output  
voltage is a couple hundred millivolts lower than 5 V supplied drivers, while the receivers exhibit identical  
specifications as 5-V devices.  
To help ensure the widest interoperability possible, the SN55HVD233-SP successfully passed the internationally  
recognized GIFT ICT conformance and interoperability testing for CAN transceivers. Electrical interoperability  
does not always assure interchangeability, however. Most implementers of CAN buses recognize that ISO 11898  
does not sufficiently specify the electrical layer and that strict standard compliance alone does not ensure full  
interchangeability. Interchangeability is ensured with thorough equipment testing.  
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Feature Description (continued)  
9.3.5 Thermal Shutdown  
If the junction temperature of the device exceeds the thermal shutdown threshold, the device turns off the CAN  
driver circuits thus blocking the D pin to bus transmission path. The shutdown condition is cleared when the  
junction temperature drops below the thermal shutdown temperature of the device. The CAN bus pins are high-  
impedance biased to recessive level during a thermal shutdown, and the receiver-to-R pin path remains  
operational.  
9.4 Device Functional Modes  
Table 3. Driver I/O  
DRIVER(1)  
INPUTS  
OUTPUTS  
D
LBK  
RS  
CANH  
CANL  
BUS STATE  
Recessive  
Dominant  
X
X
> 0.75 VCC  
Z
H
Z
Z
Z
L
Z
Z
L
H or open  
X
L or open  
0.33 VCC  
0.33 VCC  
X
H
Recessive  
Recessive  
(1) H = High level; L = Low level; Z = High impedance; X = Irrelevant  
Table 4. Receiver I/O  
RECEIVER(1)  
INPUTS  
OUTPUT  
BUS STATE  
Dominant  
Recessive  
?
VID = V(CANH) – V(CANL)  
ID 0.9 V  
ID 0.5 V or open  
0.5 V < VID < 0.9 V  
ID 0.9 V  
D
R
L
V
X
V
H or open  
H
?
H or open  
Dominant  
Recessive  
Recessive  
?
V
X
H
L
L
V
ID 0.5 V or open  
ID 0.5 V or open  
H
L
V
0.5 V < VID < 0.9 V  
L
L
(1) H = High level; L = Low level; Z = High impedance; X = Irrelevant; ? = Indeterminate  
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10 Application and Implementation  
NOTE  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
10.1 Application Information  
10.1.1 Diagnostic Loopback  
The diagnostic loopback or internal loopback function of the SN55HVD233-SP is enabled with a high-level input  
on pin 7, LBK. This mode disables the driver output while keeping the bus pins biased to the recessive state.  
This mode also redirects the D data input (transmit data) through logic to the received data output (R), thus  
creating an internal loopback of the transmit-to-receive data path. This mimics the loopback that occurs normally  
with a CAN transceiver because the receiver loops back the driven output to the R (receive data) pin. This mode  
allows the host microprocessor to input and read back a bit sequence or CAN messages to perform diagnostic  
routines without disturbing the CAN bus. Figure 33 shows a typical CAN bus application.  
If the LBK pin is not used, it may be tied to ground (GND). However, it is pulled low internally (defaults to a low-  
level input) and may be left open if not in use.  
20  
Copyright © 2017, Texas Instruments Incorporated  
SN55HVD233-SP  
www.ti.com.cn  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
Application Information (continued)  
RS INPUT  
V
D INPUT  
CANH INPUT  
V
CC  
CC  
V
CC  
110 kW  
45 kW  
9 kW  
100 kW  
1 kW  
INPUT  
INPUT  
9 V  
9 kW  
40 V  
+
_
INPUT  
CANL INPUT  
CANH AND CANL OUTPUTS  
R OUTPUT  
V
CC  
V
CC  
V
CC  
110 kW  
45 kW  
9 kW  
5 W  
OUTPUT  
9 V  
INPUT  
40 V  
OUTPUT  
40 V  
9 kW  
LBK INPUT  
V
CC  
1 kW  
INPUT  
100 kW  
9 V  
Copyright © 2017, Texas Instruments Incorporated  
Figure 28. Equivalent Input and Output Schematic Diagrams  
Copyright © 2017, Texas Instruments Incorporated  
21  
SN55HVD233-SP  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
www.ti.com.cn  
10.2 Typical Application  
Bus Lines -- 40 m max  
CANH  
Stub Lines -- 0.3 m max  
120  
W
120 W  
CANL  
3.3 V  
Vcc  
3.3 V  
Vcc  
3.3 V  
Rs  
Rs  
Vcc  
Rs  
0.1  
0.1 mF  
SN55HVD233-SP  
SN55HVD233-SP  
SN55HVD233-SP  
0.1  
m
mF  
F
GND  
GND  
GND  
D
R
D
R
D
R
LBK  
LBK  
LBK  
CANTX  
CANRX  
CANTX  
CANRX  
GPIO  
CANTX  
CANRX  
GPIO  
GPIO  
FPGA/MCU  
FPGA/MCU  
FPGA/MCU  
Sensor, Actuator, or Control  
Equipment  
Sensor, Actuator, or Control  
Equipment  
Sensor, Actuator, or Control  
Equipment  
Copyright © 2017, Texas Instruments Incorporated  
Figure 29. Typical Application Schematic  
10.2.1 Design Requirements  
The High-Speed ISO 11898 Standard specifications are given for a maximum signaling rate of 1 Mbps with a bus  
length of 40 m and a maximum of 30 nodes. It also recommends a maximum unterminated stub length of 0.3 m.  
The cable is specified to be a shielded or unshielded twisted-pair with a 120-Ω characteristic impedance (ZO).  
The standard defines a single line of twisted-pair cable with the network topology as shown in Figure 29. It is  
terminated at both ends with 120-Ω resistors, which match the characteristic impedance of the line to prevent  
signal reflections. According to ISO 11898, placing RL on a node should be avoided because the bus lines lose  
termination if the node is disconnected from the bus.  
10.2.2 Detailed Design Procedure  
Table 5. Suggested Cable Length vs Signaling Rate  
BUS LENGTH (m)  
SIGNALING RATE (Mbps)  
40  
100  
200  
500  
1000  
1
0.5  
0.25  
0.1  
0.05  
Basically, the maximum bus length is determined by, or rather is a trade-off with the selected signaling rate as  
listed in Table 5.  
A signaling rate decreases as transmission distance increases. While steady-state losses may become a factor  
at the longest transmission distances, the major factors limiting signaling rate as distance is increased are time  
varying. Cable bandwidth limitations, which degrade the signal transition time and introduce inter-symbol  
interference (ISI), are primary factors reducing the achievable signaling rate when transmission distance is  
increased.  
For a CAN bus, the signaling rate is also determined from the total system delay – down and back between the  
two most distant nodes of a system and the sum of the delays into and out of the nodes on a bus with the typical  
5 ns/m prop delay of a twisted-pair cable. Also, consideration must be given the signal amplitude loss due to  
resistance of the cable and the input resistance of the transceivers. Under strict analysis, skin effects, proximity  
to other circuitry, dielectric loss, and radiation loss effects all act to influence the primary line parameters and  
degrade the signal.  
A conservative rule of thumb for bus lengths over 100 m is derived from the product of the signaling rate in Mbps  
and the bus length in meters, which should be less than or equal to 50.  
22  
Copyright © 2017, Texas Instruments Incorporated  
 
 
SN55HVD233-SP  
www.ti.com.cn  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
Signaling Rate (Mbps) × Bus Length (m) 50. Operation at extreme temperatures should employ additional  
conservatism.  
10.2.2.1 Slope Control  
Adjust the rise and fall slope of the SN55HVD233-SP driver output by connecting a resistor from the RS (pin 8)  
to ground (GND), or to a low-level input voltage as shown in Figure 30.  
The slope of the driver output signal is proportional to the pin's output current. This slope control is implemented  
with an external resistor value ranging from 0 to achieve a 38 V/μs single ended slew rate, and up to 50 kto  
achieve a 4 V/μs slew rate as displayed in Figure 31. Figure 32 shows typical driver output waveforms with  
slope control.  
0 kΩ to  
50 kΩ  
GPIO  
RS  
1
2
3
4
5
10  
9
D
GND  
VCC  
R
CANH  
CANL  
LBK  
MCU/DSP  
8
7
6
N/C  
N/C  
Figure 30. Slope Control/Standby Connection to a DSP  
10.2.2.2 Standby  
If a high-level input (> 0.75 VCC) is applied to RS (pin 8), the circuit enters a low-current, listen-only standby  
mode during which the driver is switched off and the receiver remains active. The local controller can reverse this  
low-power standby mode when the rising edge of a dominant state (bus differential voltage > 900-mV typical)  
occurs on the bus.  
10.2.3 Application Curves  
40  
35  
30  
25  
20  
15  
10  
5
0
0
10000  
20000  
30000  
40000  
50000  
60000  
Slope Control Resistance (kW)  
D008  
Figure 31. HVD233 Driver Output Signal Slope vs Slope  
Control Resistance Value  
Figure 32. Typical SN55HVD233-SP 250-Kbps Output Pulse  
Waveforms With Slope Control  
Copyright © 2017, Texas Instruments Incorporated  
23  
 
 
SN55HVD233-SP  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
www.ti.com.cn  
11 Power Supply Recommendations  
TI recommends to have localized capacitive decoupling near device VCC pin to GND. Values of 4.7 µF at VCC  
pin and 10 µF, 1 µF, and 0.1 µF at supply have tested well on evaluation modules.  
12 Layout  
12.1 Layout Guidelines  
Minimize stub length from node insertion to bus.  
12.1.1 Bus Loading, Length, and Number of Nodes  
The ISO11898 standard specifies up to 1-Mbps data rate, maximum bus length of 40 m, maximum drop line  
(stub) length of 0.3 m, and a maximum of 30 nodes. However, with careful network design, the system may have  
longer cables, longer stub lengths, and many more nodes to a bus. Many CAN organizations and standards have  
scaled the use of CAN for applications outside the original ISO11898 standard. They made system level trade-  
offs for data rate, cable length, and parasitic loading of the bus. Examples of some of these specifications are  
ARINC825, CANopen, CAN Kingdom, DeviceNet, and NMEA200.  
A high number of nodes requires a transceiver with high input impedance and wide common mode range such  
as the SN55HVD233-SP CAN. ISO11898-2 specifies the driver differential output with a 60-load (two 120-Ω  
termination resistors in parallel), and the differential output must be greater than 1.5 V. The SN55HVD233-SP is  
specified to meet the 1.5-V requirement with a 60-load, and additionally specified with a differential output  
voltage minimum of 1.2 V across a common mode range of –2 to 7 V through a 330-coupling network. This  
network represents the bus loading of 120 SN55HVD233-SP transceivers based on their minimum differential  
input resistance of 40 k. Therefore, the SN55HVD233-SP supports up to 120 transceivers on a single bus  
segment with margin to the 1.2-V minimum differential input voltage requirement at each node. For CAN network  
design, margin must be given for signal loss across the system and cabling, parasitic loadings, network  
imbalances, ground offsets, and signal integrity; thus, a practical maximum number of nodes may be lower. Bus  
length may also be extended beyond the original ISO11898 standard of 40 m by careful system design and data  
rate tradeoffs. For example, CANopen network design guidelines allow the network to be up to 1 km with  
changes in the termination resistance, cabling, less than 64 nodes, and significantly lowered data rate.  
This flexibility in CAN network design is one of the key strengths of the various extensions and additional  
standards that have been built on the original ISO11898 CAN standard. Using this flexibility requires good  
network design.  
12.1.2 CAN Termination  
The ISO11898 standard specifies the interconnect to be a twisted pair cable (shielded or unshielded) with 120-Ω  
characteristic impedance (ZO). Use resistors equal to the characteristic impedance of the line to terminate both  
ends of the cable to prevent signal reflections. Keep unterminated drop lines (stubs) connecting nodes to the bus  
as short as possible to minimize signal reflections. The termination may be on the cable or in a node, but if  
nodes may be removed from the bus, the termination must be carefully placed so that it is not removed from the  
bus.  
24  
Copyright © 2017, Texas Instruments Incorporated  
SN55HVD233-SP  
www.ti.com.cn  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
Layout Guidelines (continued)  
Node n  
(with termination)  
Node 1  
Node 2  
Node 3  
MCU or DSP  
MCU or DSP  
MCU or DSP  
MCU or DSP  
CAN  
Controller  
CAN  
Controller  
CAN  
Controller  
CAN  
Controller  
CAN  
Transceiver  
CAN  
Transceiver  
CAN  
Transceiver  
CAN  
Transceiver  
RTERM  
RTERM  
Figure 33. Typical CAN Bus  
Termination is typically a 120-Ω resistor at each end of the bus. If filtering and stabilization of the common mode  
voltage of the bus is desired, then the user may use split termination (see Figure 34). Split termination uses two  
60-Ω resistors with a capacitor in the middle of these resistors to ground. Split termination improves the  
electromagnetic emissions behavior of the network by eliminating fluctuations in the bus common mode voltages  
at the start and end of message transmissions.  
Take care with the power ratings of the termination resistors used, especially for the worst-case condition (if a  
system power supply is shorted across the termination resistance to ground). In most cases, under the worst-  
case condition, much higher current passes through the termination resistance than the CAN transceiver's  
current limit.  
Split Termination  
Standard Termination  
CANH  
CANH  
R
/2  
TERM  
CAN  
Transceiver  
CAN  
R
TERM  
Transceiver  
C
SPLIT  
R
/2  
TERM  
CANL  
CANL  
Figure 34. CAN Bus Termination Concepts  
版权 © 2017, Texas Instruments Incorporated  
25  
 
SN55HVD233-SP  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
www.ti.com.cn  
12.2 Layout Example  
RS  
GND  
D
R1  
GND  
GND  
R5  
GND  
U1  
C7  
VCC  
R6  
R2  
R
LBK  
Figure 35. Board Layout Example  
26  
版权 © 2017, Texas Instruments Incorporated  
SN55HVD233-SP  
www.ti.com.cn  
ZHCSH84A SEPTEMBER 2017REVISED DECEMBER 2017  
13 器件和文档支持  
13.1 接收文档更新通知  
如需接收文档更新通知,请导航至 TI.com 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产  
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。  
13.2 社区资源  
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商按照原样提供。这些内容并不构成 TI 技术规范,  
并且不一定反映 TI 的观点;请参阅 TI 《使用条款》。  
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在  
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。  
设计支持  
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。  
13.3 商标  
E2E is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
13.4 静电放电警告  
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损  
伤。  
13.5 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
14 机械、封装和可订购信息  
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知和修  
订此文档。如欲获取此数据表的浏览器版本,请参阅左侧的导航。  
版权 © 2017, Texas Instruments Incorporated  
27  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2022  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
5962L1420901VXC  
HVD233HKX/EM  
ACTIVE  
CFP  
CFP  
HKX  
8
8
1
RoHS & Green  
RoHS & Green  
NIAU  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
25 to 25  
L1420901VXC  
HVD233-SP  
Samples  
Samples  
ACTIVE  
HKX  
1
NIAU  
HVD233HKX/EM  
EVAL ONLY  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2022  
OTHER QUALIFIED VERSIONS OF SN55HVD233-SP :  
Catalog : SN55HVD233-SEP  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Jan-2022  
TUBE  
*All dimensions are nominal  
Device  
Package Name Package Type  
Pins  
SPQ  
L (mm)  
W (mm)  
T (µm)  
B (mm)  
5962L1420901VXC  
HVD233HKX/EM  
HKX  
HKX  
CFP (HSL)  
CFP (HSL)  
8
8
1
1
506.98  
506.98  
26.16  
26.16  
6220  
6220  
NA  
NA  
Pack Materials-Page 1  
PACKAGE OUTLINE  
HKX0008A  
CFP - 2.785 mm max height  
S
C
A
L
E
1
.
0
0
0
CERAMIC FLATPACK  
B
6X 1.27  
2X 3.81  
1
4
8
5
6.725  
6.225  
0.52  
8X  
0.42  
6.735  
6.235  
A
0.2  
C A B  
2.785 MAX  
0.20  
0.12  
0.95 MAX  
(4.445)  
C
4
5
8
1
PIN 1 ID  
24 MAX  
4223439/C 08/2021  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. This package is hermetically sealed with a metal lid.  
4. The leads are gold plated.  
www.ti.com  
重要声明和免责声明  
TI“按原样提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,  
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Copyright © 2022,德州仪器 (TI) 公司  

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