INA1651IPW [TI]
SoundPlus™ 高共模抑制 (91dB)、低 THD+N (-120dB) 差分线路接收器 | PW | 14 | -40 to 125;型号: | INA1651IPW |
厂家: | TEXAS INSTRUMENTS |
描述: | SoundPlus™ 高共模抑制 (91dB)、低 THD+N (-120dB) 差分线路接收器 | PW | 14 | -40 to 125 |
文件: | 总41页 (文件大小:2688K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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INA1650, INA1651
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
INA165x SoundPlus™ 高共模抑制线路接收器
1 特性
3 说明
1
•
高共模抑制:
91dB(典型值)
双通道 INA1650 和单通道 INA1651 (INA165x)
SoundPlus™音频线路接收器可实现 91dB 的超高共模
抑制比 (CMRR),同时对于 22dBu 信号电平可在
1kHz 时保持 –120dB 的超低 THD+N。片上电阻器的
精密匹配特性为 INA165x 器件提供了出色的 CMRR
性能。这些电阻器具有远远优于外部组件的匹配特性,
并且不受印刷电路板 (PCB) 布局所导致的失配问题的
影响。不同于其他线路接收器产品,INA165x CMRR
在额定温度范围内能保持特性不变,经生产测试可在各
种应用中提供始终如一的 性能。
•
•
•
高输入阻抗:1MΩ 差分
超低噪声:–104.7dBu,未加权
超低总谐波失真 + 噪声:
–120dB THD+N(22dBu,22kHz 带宽)
•
•
•
•
•
•
高带宽:2.7MHz
低静态电流:6mA(INA1651,典型值)
短路保护
集成电磁干扰 (EMI) 滤波器
宽电源电压范围:±2.25V 至 ±18V
采用小型 14 引脚 TSSOP 封装
INA165x 器件支持 ±2.25V 到 ±18V 的宽电源电压范
围,电源电流为 10.5mA。除线路接收器通道之
外,INA165x 还包含一个缓冲的中间电压基准输出,
因此可将其配置为用于双电源或单电源 应用。中间电
源输出可用作信号链中其他模拟电路的偏置电压。这些
器件额定工作温度范围为 –40°C 至 +125°C。
2 应用
•
•
•
•
•
•
差分音频接口
音频输入电路
线路驱动器
器件信息(1)
音频功率放大器
音频分析仪
器件型号
INA1650
INA1651
封装
TSSOP (14)
TSSOP (14)
封装尺寸(标称值)
4.40mm × 5.00mm
4.40mm × 5.00mm
高端影音 (A/V) 接收器
(1) 如需了解所有可用封装,请参阅数据表末尾的封装选项附录。
INA165x 简化内部原理图
VCC
VEE
IN+ A
COM A
INœ A
CMRR 直方图(5746 通道)
+
25
OUT A
REF A
œ
20
15
10
5
VCC
œ
+
VMID(IN)
VEE
INA1650 ONLY
0
REF B
OUT B
INœ B
COM B
IN+ B
CMRR (ꢀV/V)
œ
C001
+
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SBOS818
INA1650, INA1651
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
www.ti.com.cn
目录
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics: ........................................ 6
6.6 Typical Characteristics.............................................. 8
Detailed Description ............................................ 15
7.1 Overview ................................................................. 15
7.2 Functional Block Diagram ....................................... 15
7.3 Feature Description................................................. 15
7.4 Device Functional Modes........................................ 17
8
9
Application and Implementation ........................ 18
8.1 Application Information............................................ 18
8.2 Typical Applications ................................................ 22
Power Supply Recommendations...................... 29
10 Layout................................................................... 29
10.1 Layout Guidelines ................................................. 29
10.2 Layout Examples................................................... 30
11 器件和文档支持 ..................................................... 32
11.1 器件支持................................................................ 32
11.2 文档支持................................................................ 32
11.3 相关链接................................................................ 32
11.4 接收文档更新通知 ................................................. 33
11.5 社区资源................................................................ 33
11.6 商标....................................................................... 33
11.7 静电放电警告......................................................... 33
11.8 术语表 ................................................................... 33
12 机械、封装和可订购信息....................................... 33
7
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
Changes from Revision A (September 2018) to Revision B
Page
•
已更改 将 INA1651 器件从产品预览更改为生产数据(正在供货) ........................................................................................ 1
Changes from Original (September 2018) to Revision A
Page
•
已添加 新的 INA1651 作为预告信息....................................................................................................................................... 1
2
Copyright © 2016–2018, Texas Instruments Incorporated
INA1650, INA1651
www.ti.com.cn
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
5 Pin Configuration and Functions
INA1650 PW Package
14-Pin TSSOP
Top View
VCC
IN+ A
1
2
3
4
5
6
7
14
VEE
13
12
11
10
9
OUT A
REF A
COM A
INœ A
VMID(IN)
VMID(OUT)
REF B
INœ B
COM B
IN+ B
8
OUT B
Not to scale
Pin Functions
PIN
I/O
DESCRIPTION
NAME
COM A
COM B
IN+ A
IN– A
IN+ B
IN– B
OUT A
OUT B
REF A
REF B
VCC
NO.
3
I
I
Input common, channel A
Input common, channel B
Noninverting input, channel A
Inverting input, channel A
Noninverting input, channel B
Inverting input, channel B
Output, channel A
6
2
I
4
I
7
I
5
I
13
8
O
O
I
Output, channel B
12
9
Reference input, channel A. This pin must be driven from a low impedance.
Reference input, channel B. This pin must be driven from a low impedance.
Positive (highest) power supply
I
1
—
—
VEE
14
Negative (lowest) power supply
Input node of internal supply divider. Connect a capacitor to this pin to reduce noise from the
supply divider circuit.
VMID(IN)
11
10
I
VMID(OUT)
O
Buffered output of internal supply divider.
Copyright © 2016–2018, Texas Instruments Incorporated
3
INA1650, INA1651
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
www.ti.com.cn
INA1651 PW Package
14-Pin TSSOP
Top View
VCC
IN+ A
COM A
INœ A
NC
1
2
3
4
5
6
7
14
VEE
13
12
11
10
9
OUT A
REF A
VMID(IN)
VMID(OUT)
NC
NC
NC
8
NC
Not to scale
Pin Functions
PIN
I/O
DESCRIPTION
NAME
COM A
IN+ A
IN– A
NC
NO.
3
I
Input common, channel A
Noninverting input, channel A
Inverting input, channel A
No internal connection
No internal connection
No internal connection
No internal connection
No internal connection
Output, channel A
2
I
4
I
5
—
—
—
—
—
O
I
NC
6
NC
7
NC
8
NC
9
OUT A
REF A
VCC
VEE
13
12
1
Reference input, channel A. This pin must be driven from a low impedance.
Positive (highest) power supply
—
—
14
Negative (lowest) power supply
Input node of internal supply divider. Connect a capacitor to this pin to reduce noise from the
supply divider circuit.
VMID(IN)
11
10
I
VMID(OUT)
O
Buffered output of internal supply divider.
4
Copyright © 2016–2018, Texas Instruments Incorporated
INA1650, INA1651
www.ti.com.cn
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
V
Supply voltage, VS = (V+) – (V–)
40
Voltage
Input voltage (Signal inputs, enable, ground)
Input differential voltage
Input current (all pins except power-supply pins)
Output short-circuit(2)
(V–) – 0.5
(V+) + 0.5
(V+) – (V–)
±10
mA
Current
Continuous
125
Operating, TA
–55
–65
Temperature
Junction, TJ
150
°C
Storage, Tstg
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Short-circuit to VS / 2 (ground in symmetrical dual supply setups), one amplifier per package.
6.2 ESD Ratings
VALUE
UNIT
INA1650
V(ESD)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±4000
±1000
Electrostatic discharge
V
INA1651
V(ESD)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±4000
±750
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
4.5 (±2.25)
–40
NOM
MAX
36 (±18)
125
UNIT
Supply voltage (V+ – V–)
Specified temperature
V
°C
6.4 Thermal Information
INA1650
INA1651
THERMAL METRIC(1)
PW (TSSOP)
14 PINS
97.0
PW (TSSOP)
14 PINS
99.4
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
22.6
29.9
40.4
42.6
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.9
1.5
ψJB
39.6
42.0
RθJC(bot)
N/A
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Copyright © 2016–2018, Texas Instruments Incorporated
5
INA1650, INA1651
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
www.ti.com.cn
6.5 Electrical Characteristics:
at TA = 25°C, VS = ±2.25 V to ±18 V, VCM = VOUT = midsupply, and RL = 2 kΩ (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
AUDIO PERFORMANCE
0.00039%
–108.1
VO = 3 VRMS, f = 1kHz, 90-kHz measurement bandwidth,
VS = ±18 V
dB
dB
dB
dB
Total harmonic distortion +
noise
THD+N
IMD
0.000174%
–115.2
VIN = 22 dBu (9.7516 VRMS) , FIN = 1 kHz, VS = ±18 V,
90-kHz measurement bandwidth
0.0005%
–106.1
SMPTE and DIN two-tone, 4:1 (60 Hz and 7 kHz)
VO = 3 VRMS, 90-kHz measurement bandwidth
Intermodulation distortion
0.00066%
–103.6
CCIF twin-tone (19 kHz and 20 kHz),
VO = 3 VRMS, 90-kHz measurement bandwidth
AC PERFORMANCE
BW
SR
Small-signal bandwidth
2.7
10
MHz
V/μs
MHz
Slew rate
Full-power bandwidth(1)
VO = 1 VP
1.59
71°
54°
2.2
CL = 20 pF
PM
ts
Phase margin
CL = 200 pF
Settling time
To 0.01%, Vs = ±18 V, 10-V step
μs
ns
Overload recovery time
330
140
130
80
f = 1 kHz, REF and COM pins connected to ground
f = 1 kHz, REF and COM pins connected to VMID(OUT)
dB
Channel separation
dB
EMI/RFI filter corner frequency
MHz
NOISE
4.5
–104.7
47
μVRMS
Output voltage noise
f = 20 Hz to 20 kHz, no weighting
dBu
f = 100 Hz
f = 1 kHz
en
Output voltage noise density(2)
nV/√Hz
31
OFFSET VOLTAGE
±1
±3
±4
7
VOS
Output offset voltage
mV
TA = –40°C to +125°C(2)
TA = –40°C to +125°C
dVOS/dT Output offset voltage drift(2)
2
2
μV/°C
μV/V
PSRR
Power-supply rejection ratio
GAIN
Gain
1
0.04%
0.05%
1
V/V
0.05%
0.06%
5
Gain error
Gain nonlinearity
TA = –40°C to +125°C(2)
(2)
VS = ±18 V, –10 V < VO < 10 V
ppm
INPUT VOLTAGE RANGE
VCM
Common-mode voltage range
(V–) + 0.25
(V+) – 2
V
(V–) + 0.25 V ≤ VCM ≤ (V+) – 2 V, REF and COM pins
connected to ground, VS = ±18 V
TA = –40°C to +125°C(2)
85
82
82
76
91
89
86
84
84
dB
CMRR
Common-mode rejection ratio
(V–) + 0.25 V ≤ VCM ≤ (V+) – 2 V, REF and COM pins
connected to VMID(OUT), VS = ±18 V
TA = –40°C to +125°C(2)
(V–) + 0.25 V ≤ VCM ≤ (V+) – 2 V, REF and COM pins
connected to ground, VS = ±18 V, RS mismatch = 20 Ω
CMRR
Common-mode rejection ratio
dB
(1) Full-power bandwidth = SR / (2π × VP), where SR = slew rate.
(2) Specified by design and characterization.
6
Copyright © 2016–2018, Texas Instruments Incorporated
INA1650, INA1651
www.ti.com.cn
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
Electrical Characteristics: (continued)
at TA = 25°C, VS = ±2.25 V to ±18 V, VCM = VOUT = midsupply, and RL = 2 kΩ (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
INPUT IMPEDANCE
Differential
850
1000
250
1150
287.5
0.25%
kΩ
kΩ
Common-mode
212.5
Input resistance mismatch
0.01%
SUPPLY DIVIDER CIRCUIT
Nominal output voltage
Output voltage offset
Input impedance
[ (V+) + (V–) ] / 2
V
mV
kΩ
VMID(IN) = ((V+) + (V–) / 2
2
250
0.35
1.56
150
4
VMID(IN) pin, f = 1 kHz
VMID(OUT) pin
Output resistance
Ω
Output voltage noise
Output capacitive load limit
20 Hz to 20 kHz, CMID = 1 µF
Phase margin > 45°, RISO = 0 Ω
µVRMS
pF
OUTPUT
RL = 2 kΩ
RL = 600 Ω
RL = 2 kΩ
RL = 600 Ω
350
1100
Positive rail
Negative rail
VO
Voltage output swing from rail
mV
430
1300
ZOUT
ISC
Output impedance
Short-circuit current
Capacitive load drive
f ≤ 100 kHz, IOUT = 0 A
< 1
Ω
VS = ±18 V
±75
mA
pF
CLOAD
See 图 19
POWER SUPPLY
4.6
8
6
6.9
8
IOUT = 0 A, INA1651
IOUT = 0 A, INA1650
TA = –40°C to +125°C(2)
TA = –40°C to +125°C(2)
IQ
Quiescent current
mA
10.5
12
14
版权 © 2016–2018, Texas Instruments Incorporated
7
INA1650, INA1651
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
www.ti.com.cn
6.6 Typical Characteristics
at TA = 25°C, VS = ±18 V, VCM = VOUT = midsupply, and RL = 2 kΩ (unless otherwise noted)
25
20
15
10
5
25
20
15
10
5
0
0
CMRR (ꢀV/V)
CMRR (ꢀV/V)
C001
C001
5746 Channels
5746 Channels
VREF Pins Connected to Ground
VREF Pins Connected to VMID(OUT)
图 1. Common-Mode Rejection Ratio Distribution
图 2. Common-Mode Rejection Ratio Distribution
35
30
25
20
15
10
5
35
30
25
20
15
10
5
0
0
Input Resistance Mismatch (%)
Gain Error (%)
C001
C001
5746 Channels
5746 Channels
图 3. Distribution of Mismatch in 500-kΩ Input Resistors
图 4. Gain Error Distribution
25
20
15
10
5
30
25
20
15
10
5
0
0
Output Offset Voltage (ꢀV)
Offset Voltage Drift (µV/°C)
C001
C001
5746 Channels
52 Channels
图 5. Offset Voltage Distribution
图 6. Offset Voltage Drift Distribution
8
版权 © 2016–2018, Texas Instruments Incorporated
INA1650, INA1651
www.ti.com.cn
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
Typical Characteristics (接下页)
at TA = 25°C, VS = ±18 V, VCM = VOUT = midsupply, and RL = 2 kΩ (unless otherwise noted)
20
10
VS = +/- 18 V
VS = +/- 5 V
18
5
VS = +/- 2.25 V
16
14
0
12
10
8
-5
-10
-15
-20
6
4
2
0
100
1k
10k
100k
1M
10M
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
C004
C015
图 7. Frequency Response
图 8. Maximum Output Voltage vs Frequency
100
90
80
70
60
50
40
120
100
80
60
40
20
0
+PSRR
REF / COM Pins Connected to VMID(OUT)
REF / COM Pins Connected to Ground
œPSRR
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
C004
C004
图 9. Common-Mode Rejection Ratio vs Frequency
图 10. Power Supply Rejection Ratio vs Frequency
0.01
-80
1000
100
10
600-ꢀ Load
2-kꢀ Load
0.001
0.0001
-100
-120
-140
0.00001
1
10
100
1k
10k
100k
10
100
1k
Frequency (Hz)
10k
Frequency (Hz)
C002
C001
3 VRMS, 90-kHz Measurement Bandwidth
图 11. Voltage Noise Spectral Density
图 12. THD+N vs Frequency
版权 © 2016–2018, Texas Instruments Incorporated
9
INA1650, INA1651
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
www.ti.com.cn
Typical Characteristics (接下页)
at TA = 25°C, VS = ±18 V, VCM = VOUT = midsupply, and RL = 2 kΩ (unless otherwise noted)
0.1
-60
0.1
-60
600-ꢀ Load
2-kꢀ Load
-70
0.01
-80
0.01
-80
-90
0.001
-100
-110
-120
-130
-140
0.001
0.0001
-100
-120
0.0001
0.00001
600-ꢀ Load
2-kꢀ Load
0.01
0.1
1
10
10
100
1k
Frequency (Hz)
10k
100k
Output Voltage (VRMS
)
C003
C001
1 kHz, 90-kHz Measurement Bandwidth
3 VRMS, 500-kHz Measurement Bandwidth
图 14. THD+N vs Output Amplitude
图 13. THD+N vs Frequency
0.1
0.01
-60
0.1
0.01
-60
-70
-70
-80
-80
-90
-90
0.001
-100
-110
-120
-130
-140
0.001
-100
-110
-120
-130
-140
0.0001
0.00001
0.0001
0.00001
600-ꢀ Load
2-kꢀ Load
600-ꢀ Load
2-kꢀ Load
0.01
0.1
1
10
0.01
0.1
1
10
Output Voltage (VRMS
)
Output Voltage (VRMS
)
C003
C003
SMPTE 4:1 60 Hz and 7 kHz, 90-kHz Measurement Bandwidth
CCIF 19 kHz and 20 kHz, 90-kHz Measurement Bandwidth
图 15. SMPTE Intermodulation Distortion vs Output
图 16. CCIF Intermodulation Distortion vs Output Amplitude
Amplitude
100
10
100
10
1
1
0.1
0.1
0.01
0.01
0.001
0.0001
0.001
0.0001
0.00001
1
10
100
1k
10k
100k
1M
10M
1
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
C007
C007
CF = 1 µF
图 17. Signal Path Output Impedance vs Frequency
图 18. Supply Divider Output Impedance vs Frequency
10
版权 © 2016–2018, Texas Instruments Incorporated
INA1650, INA1651
www.ti.com.cn
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
Typical Characteristics (接下页)
at TA = 25°C, VS = ±18 V, VCM = VOUT = midsupply, and RL = 2 kΩ (unless otherwise noted)
-40
70
60
50
40
30
20
10
0
REF / COM Pins Grounded
REF / COM Pins Connected to VMID(OUT)
Positive Overshoot
Negative Overshoot
-60
-80
-100
-120
-140
-160
-180
1
10
100
1000
10k
100k
Frequency (Hz)
1M
10M
Capacitive Load (pF)
C004
C007
100-mV Input Step
图 19. Overshoot vs Capacitive Load
图 20. Channel Separation vs Frequency
Time (2.5 µs/div)
Time (2.5 µs/div)
C017
C017
10-mV Input Step
10-V Input Step
图 21. Small-Signal Step Response
图 22. Large-Signal Step Response
Time (500 ns/div)
Time (500 ns/div)
C017
C017
10-V Input Step, 0.01% Settling = ± 1 mV
10-V Input Step, 0.01% Settling = ± 1 mV
图 23. Rising-Edge Settling Time
图 24. Falling-Edge Settling Time
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Typical Characteristics (接下页)
at TA = 25°C, VS = ±18 V, VCM = VOUT = midsupply, and RL = 2 kΩ (unless otherwise noted)
115
Unit 1
Unit 3
Unit 5
Unit 2
Unit 4
110
105
100
95
90
Input Signal
Output Signal
85
Time (0.25 ms/div)
-50
-25
0
25
50
75
100
125
Temperature (°C)
C001
C017
5 Typical Units
图 26. CMRR vs Temperature
图 25. No Phase Reversal
1500
1000
500
110
100
90
80
0
70
-500
-1000
-1500
60
Unit 1
Unit 3
Unit 5
Unit 2
Unit 4
50
Isc Sourcing
Isc Sinking
40
-20
-15
-10
-5
0
5
10
15
20
-50
-25
0
25
50
75
100
125
VCM (V)
Temperature (°C)
C003
C001
5 Typical Units
图 27. Output Offset Voltage vs Common-Mode Voltage
图 28. Short-Circuit Current vs Temperature
-10
-11
-12
-13
-14
-15
-16
-17
-18
-40 C
25 C
18
17
16
15
14
85 C
125 C
13
-40 C
12
11
10
25 C
85 C
125 C
0
10
20
30
40
50
60
70
80
90
0
10
20
30
40
50
60
70
80
90
IO (mA)
IO (mA)
C001
C001
图 29. Positive Output Voltage vs Output Current
图 30. Negative Output Voltage vs Output Current
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Typical Characteristics (接下页)
at TA = 25°C, VS = ±18 V, VCM = VOUT = midsupply, and RL = 2 kΩ (unless otherwise noted)
14
12
10
8
13
12
11
10
9
Minimum Supply = 4.5 V
6
4
VS = +/- 18 V
2
VS = +/- 2.25 V
8
0
0
25
50
75
100
125
œ50
œ25
0
10
20
30
40
Temperature (°C)
Supply Voltage (V)
C001
C001
图 32. Power Supply Current vs Temperature
图 31. Power Supply Current vs Power Supply Voltage
20
5
4
VS = +/- 18 V
VS = +/- 5 V
VS = +/- 12 V
15
VS = +/- 2.25 V
3
10
5
2
1
0
0
œ1
œ2
œ3
œ4
œ5
œ5
œ10
œ15
œ20
0
10
20
1
3
5
œ20
œ10
œ5
œ3
œ1
Output Voltage (V)
Output Voltage (V)
C006
C006
REF A/B connected to 0 V
REF A/B connected to 0 V
图 33. Input Common-Mode Voltage vs Output Voltage
图 34. Input Common-Mode Voltage vs Output Voltage
20
8
VS = +18 V
18
7
6
5
4
3
2
VS = +12 V
16
14
12
10
8
6
4
1
0
VS = +9 V
2
VS = +4.5 V
0
0
5
10
15
20
0
2
4
6
8
10
Output Voltage (V)
Output Voltage (V)
C006
C006
REF A/B connected to VMID(OUT)
图 35. Input Common-Mode Voltage vs Output Voltage
REF A/B connected to VMID(OUT)
图 36. Input Common-Mode Voltage vs Output Voltage
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Typical Characteristics (接下页)
at TA = 25°C, VS = ±18 V, VCM = VOUT = midsupply, and RL = 2 kΩ (unless otherwise noted)
20
18
16
14
12
10
8
8
7
6
5
4
3
2
1
0
6
4
VS = +18 V
VS = +12 V
VS = +9 V
2
VS = +4.5 V
0
0
5
10
15
20
0
2
4
6
8
Output Voltage (V)
Output Voltage (V)
C006
C006
REF A/B connected to 0 V
图 37. Input Common-Mode Voltage vs Output Voltage
REF A/B connected to 0 V
图 38. Input Common-Mode Voltage vs Output Voltage
14
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7 Detailed Description
7.1 Overview
The INA165x combines high-performance audio operational amplifier cores with high-precision resistor networks
to provide exceptional audio performance and rejection of noise which may be externally coupled into the audio
signal path. The INA165x uses an instrumentation amplifier topology with a fixed unity gain to provide high input
impedance and a high common-mode rejection ratio (CMRR). Unlike other line receiver products that use a
simple four-resistor difference amplifier topology, the INA165x topology provides excellent CMRR even with
mismatched source impedances.
7.2 Functional Block Diagram
VCC
VEE
10 kꢀ
10 kꢀ
IN+ A
COM A
IN- A
500
kꢀ
+
OUT A
REF A
œ
500
kꢀ
10 kꢀ
10 kꢀ
VCC
500
kꢀ
œ
+
VMID(IN)
500
kꢀ
VEE
VMID(OUT)
REF B
INA1650 ONLY
10 kꢀ
10 kꢀ
IN- B
COM B
IN+ B
500
kꢀ
œ
OUT B
+
500
kꢀ
10 kꢀ
10 kꢀ
Copyright © 2018, Texas Instruments Incorporated
7.3 Feature Description
7.3.1 Audio Signal Path
图 39 highlights the basic elements present in the audio signal pathway. The primary elements are: input biasing
resistors, electromagnetic interference (EMI) filtering, input buffers, and a difference amplifier. The primary role of
an audio line receiver is to convert a differential input signal into a single-ended output signal while rejecting
noise that is common to both inputs (common-mode noise). The difference amplifier (which consists of an op
amp and four matched 10-kΩ resistors) accomplishes this task. The basic transfer function of the circuit is shown
in 公式 1:
VOUT = V - VIN- + V
IN+
REF
(1)
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Feature Description (接下页)
10 kꢀ
10 kꢀ
IN+
REF
OUT
500
kꢀ
+
COM
œ
500
kꢀ
IN-
10 kꢀ
10 kꢀ
Input
Biasing
Resistors
EMI
Filtering
Input
Buffers
Difference
Amplifier
Copyright © 2016, Texas Instruments Incorporated
图 39. INA165x Audio Signal Path (Single Channel Shown)
The input buffers prevent external resistances (such as those from the PCB, connectors, or cables) from ruining
the precise matching of the internal 10-kΩ resistors which would degrade the high common-mode rejection of the
difference amplifier. As is typical of many amplifiers, a small bias current flows into or out of the buffer amplifier
inputs. This current must flow to a common potential for the buffer to function properly. The input biasing
resistors provide an internal pathway for this current to the COM pin. The COM pin can connect to ground in a
dual-supply system or the output of the internal supply divider (VMID(OUT)) in single-supply applications. Finally,
EMI filtering is added to the input buffers to prevent high-frequency interference signals from propagating through
the audio signal pathway.
7.3.2 Supply Divider
The INA165x integrates a supply-divider circuit which may bias the input common-mode voltage and output
reference voltage to the halfway point between the applied power supply voltages. The nominal output voltage of
the supply divider circuit is shown in 公式 2:
VCC + VEE
VMID(OUT)
=
2
(2)
图 40 illustrates the internal topology of the supply-divider circuit. The supply divider consists of two 500-kΩ
resistors connected between the VCC and VEE pins of the INA165x. The noninverting input of a buffer amplifier
is connected to the midpoint of the voltage divider that is formed by the 500-kΩ resistors. The buffer amplifier
provides a low-impedance output that is required to bias the REF pins without degrading the CMRR. For dual-
supply applications where the supply divider circuit may not be used, no connection is required for the VMID(IN) or
VMID(OUT) pins.
VCC
500
kꢀ
œ
VMID(IN)
+
500
kꢀ
VEE
VMID(OUT)
Copyright © 2016, Texas Instruments Incorporated
图 40. Internal Supply Divider Circuit
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Feature Description (接下页)
7.3.3 Electrical Overstress
Designers typically ask questions about the capability of an amplifier to withstand electrical overstress. These
questions typically focus on the device inputs, but can involve the supply voltage pins or the output pin. Each of
these different pin functions have electrical stress limits determined by the voltage breakdown characteristics of
the particular semiconductor fabrication process and specific circuits connected to the pin. Additionally, internal
ESD protection is built into these circuits to protect them from accidental ESD events both before and during
product assembly. A good understanding of basic ESD circuitry and the relevance of circuitry to an electrical
overstress event is helpful. 图 41 illustrates the ESD circuits contained in the INA165x. The ESD protection
circuitry involves several current-steering diodes that are connected from the input and output pins and routed
back to the internal power-supply lines. This protection circuitry is intended to remain inactive during normal
circuit operation. The input pins of the INA165x are protected with internal diodes that are connected to the
power-supply rails. These diodes clamp the applied signal to prevent the input circuitry from damage. If the input
signal voltage exceeds the power supplies by more than 0.3 V, limit the input signal current to less than 10 mA to
protect the internal clamp diodes. A series input resistor can typically limit the current. Some signal sources are
inherently current-limited and do not require limiting resistors.
VCC
VEE
Power Supply
ESD Cell
VCC
+
IN+
COM
IN-
10 kꢀ
10 kꢀ
VEE
REF
OUT
œ
VCC
VEE
VCC
+
œ
VEE
VCC
VEE
VCC
œ
+
10 kꢀ
10 kꢀ
VCC
VEE
500
kꢀ
œ
+
VMID(IN)
500
kꢀ
VEE
VCC
VEE
VMID(OUT)
Copyright © 2016, Texas Instruments Incorporated
图 41. INA165x Internal ESD Protection Circuitry
(Single Channel and Supply-Divider Shown for Simplicity)
7.3.4 Thermal Shutdown
If the junction temperature of the INA165x exceeds approximately 170ºC, a thermal shutdown circuit disables the
amplifier to protect the device from damage. The amplifier is automatically re-enabled after the junction
temperature falls below the shutdown threshold temperature. If the condition that caused excessive power
dissipation is not removed, the amplifier oscillates between a shutdown and enabled state until the output fault is
corrected.
7.4 Device Functional Modes
7.4.1 Single-Supply Operation
The INA165x can be used on single power supplies ranging from 4.5 V to 36 V. Use the COM and REF pins to
level shift the internal voltages into a linear operating condition. Ideally, connecting the REF and COM pins to a
midsupply potential (such as the VMID(OUT) pin) avoids saturating the output of the internal amplifiers.
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8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Input Common-Mode Range
The linear input voltage range of the INA165x input circuitry extends from 350 mV inside the negative supply
voltage to 2 V below the positive supply, and maintains 85-dB (minimum) common-mode rejection throughout
this range. The INA165x operates over a wide range of power supplies and VREF configurations; providing a
comprehensive guide to common-mode range limits for all possible conditions is impractical. The common-mode
range for most operating conditions is best calculated using the INA common-mode range calculating tool.
8.1.2 Common-Mode Input Impedance
The high CMRR of many line receivers can degrade by impedance mismatches in the system. 图 42 shows a
common-mode noise source (VCM) connected to both inputs of a single channel of the INA165x. An external
parasitic resistance (REXT) represents the mismatch in impedances between the common-mode noise source and
the inputs of the INA165x. This mismatched impedance may be due to PCB layout, connectors, cabling, passive
component tolerances, or the circuit topology. The presence of REXT in series with the IN+ input degrades the
overall CMRR of the system because the voltage at IN+ is no longer equal to the voltage at IN–. Therefore, a
portion of the common-mode noise converts to a differential signal and passes to the output.
REXT
10 kꢀ
10 kꢀ
REF
OUT
IN+
RIN+
RCOM
+
œ
COM
VCM
RIN-
IN-
10 kꢀ
10 kꢀ
Copyright © 2016, Texas Instruments Incorporated
图 42. A Single Channel of the INA165x Shown With Source Impedance Mismatch (REXT) and Optional
Resistor (RCOM
)
While the INA165x is significantly more resistant to these effects than typical line receivers, connecting a resistor
(RCOM) from the COM pin to the system ground further improves CMRR performance. 图 43 shows the CMRR of
the INA165x (typical CMRR of 92 dB) for increasing source impedance mismatches. If the COM pin is connected
directly to ground (RCOM equal to 0 Ω), a 20-Ω source impedance mismatch degrades the CMRR from 92 dB to
83.7 dB. However, if RCOM has a value of 1 MΩ, the CMRR only degrades to 89.6 dB, which is an improvement
of approximately 6 dB.
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Application Information (接下页)
100
95
90
85
80
75
70
65
0 ꢀ
250 kꢀ
500 kꢀ
1 Mꢀ
60
0
20
40
60
80
100
Source Impedance Mismatch (O)
C006
图 43. CMRR vs Source Impedance Mismatch for Different RCOM Values
RCOM does not need to be a high-precision resistor with a very tight tolerance. Low cost 5% or 1% resistors can
be used with no degradation in overall performance. The addition of RCOM does not increase the noise of the
audio signal path.
In single-supply systems where AC coupling is used at the inputs of the INA165x, adding RCOM lengthens the
start-up time of the circuit. The input AC-coupling capacitors are charged to the midsupply voltage through the
RCOM resistor, which may take a substantial amount of time if RCOM has a large value (such as 1 MΩ). Do not
use RCOM in these systems if start-up time is a concern. In dual-supply systems with input AC-coupling
capacitors, the capacitor voltage does not need to be charged to a midsupply point, since the capacitor voltage
settles to ground by default. Therefore, RCOM does not increase start-up time in dual-supply systems.
8.1.3 Start-Up Time in Single-Supply Applications
The internal supply divider of the INA165x is constructed using two 500-kΩ resistors connected in series between
the VCC and VEE pins. These resistors are matched on-chip to provide a reference voltage that is exactly one
half of the power supply voltage. Noise from the power supplies and thermal noise from the resistors degrades
the overall audio performance of the INA165x if allowed to enter the signal path. Therefore, TI recommends a
filter capacitor (CF) is connected to the VMID(IN) pin, as shown in 图 44 The CF capacitor forms a low-pass filter
with the internal 500-kΩ resistors. Noise above the corner frequency of this filter is passed to ground and is
removed from the audio signal path. The corner frequency of the filter is shown in 公式 3:
1
F-3dB
=
2∂ p∂ 250 kW ∂CF
(3)
VCC
VCC
VCC
500
kꢀ
500
kꢀ
ZD1
CF
œ
œ
VMID(IN)
VMID(IN)
+
+
500
kꢀ
500
kꢀ
CF
VEE
VEE
VMID(OUT)
VMID(OUT)
Copyright © 2016, Texas Instruments Incorporated
Copyright © 2016, Texas Instruments Incorporated
图 44. Connect a Capacitor (CF) to the VMID(IN) Pin
图 45. A Zener Diode (ZD1) Connected to the
Positive Supply Can Decrease Start-Up Time
to Reduce Noise from the Voltage Divider
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Application Information (接下页)
When power is applied to the INA165x, the filter capacitor (CF) charges through the internal 500-kΩ resistors. If
the CF capacitor has a large value, the time required for VMID(OUT) to reach the final midsupply voltage may be
extensive. Adding a zener diode from the VMID(IN) pin to the positive power supply (as shown in 图 45) reduces
this time. The zener voltage must be slightly greater than one half of the power supply voltage.
Using large AC-coupling capacitors increases the start-up time of the line receiver circuit in single-supply
applications. When power is applied, the AC-coupling capacitors begin to charge to the midsupply voltage
applied to the COM pin through a current flowing through the input resistors as shown in 图 46. The INA165x
functions properly when the input common-mode voltage (and the capacitor voltage) is within the specified
range. The time required for the input common-mode voltage to reach 98% of the final value is shown in 公式 4:
T98% = 4∂R ∂CIN = 4∂500 kW ∂CIN
(4)
CIN
IN+
500
kꢀ
VMID(OUT)
COM
VS
500
kꢀ
IN-
CIN
Copyright © 2016, Texas Instruments Incorporated
图 46. AC-Coupling Capacitors Charge to the Midsupply Voltage Through the Input Resistors
8.1.4 Input AC Coupling
The signal path in most audio systems is typically AC-coupled to avoid the propagation of DC voltages, which
can potentially damage loudspeakers or saturate power amplifiers. The capacitor values must be selected to
pass the desired bandwidth of audio signals. The high-pass corner frequency is calculated with 公式 5:
1
1
FC =
=
CIN
2∂ p ∂RIN ∂CIN
2∂ p ∂(2∂RIN)∂
2
(5)
CIN
IN+
500
kꢀ
COM
VS
500
kꢀ
IN-
CIN
Copyright © 2016, Texas Instruments Incorporated
图 47. AC-Coupling Capacitors Form a High-Pass Filter With INA165x Input Resistors
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Application Information (接下页)
Although the input resistors of the INA165x are matched typically within 0.01%, large capacitors are usually
mismatched. The mismatch in the values of the AC-coupling capacitors causes the corner frequencies at the two
signal inputs (IN+ and IN–) to be different, which can degrade CMRR at low frequency. For this reason, TI
recommends placing the high-pass corner frequency well below the audio bandwidth and to use a resistor in
series with the COM pin (RCOM), as shown in 图 42 if possible. See the Common-Mode Input Impedance section
for more information on placing a resistor in series with the COM pin. 图 48 shows the effect of a 5% mismatch in
the values of the input AC-coupling capacitors with and without an RCOM resistor. Comparing CMRR at 100 Hz:
1-µF AC-coupling capacitors with a 5% mismatch degrade the CMRR to 75 dB, while 10-µF capacitors and a 1-
MΩ RCOM resistor shows 92 dB of CMRR.
95
90
85
80
75
70
65
1 ꢀF
1 ꢀF / 1 Mꢁ
60
55
50
10 ꢀF
10 ꢀF / 1 Mꢁ
10
100
1k
10k
Frequency (Hz)
C007
图 48. CMRR Degradation Due to a 5% Mismatch in AC-Coupling Capacitors
8.1.5 Supply Divider Capacitive Loading
The VMID(OUT) pin of the INA165x is stable with capacitive loads up to 150 pF. An isolation resistor (RISO in 图
49), must be used if capacitive loads larger than 150 pF are connected to the VMID(OUT) pin. 图 49 shows the
recommended configuration of an isolation resistor in series with the capacitive load. The REF pins of the
INA1650 must connect directly to the VMID(OUT) pin before the isolation resistor. Any resistance placed
between the VMID(OUT) pin and the reference pins degrades the CMRR of the device. 图 50 shows the
recommended value for the isolation resistor for increasing capacitive loads.
VCC
500
kꢀ
œ
VMID(IN)
+
500
kꢀ
CF
REF A
RISO
VEE
VMID(OUT)
CLOAD
REF B
Copyright © 2016, Texas Instruments Incorporated
图 49. Place an Isolation Resistor Between the VMID(OUT) Pin and Large Capacitive Loads
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Application Information (接下页)
1000
60°Phase Margin
45°Phase Margin
100
10
1
0.01
0.1
1
10
CLOAD (nF)
100
1000
C041
图 50. Recommended Isolation Resistor Value vs Capacitive Load
8.2 Typical Applications
The low noise and distortion of the INA165x make these devices an excellent choice for a variety of applications
in professional and consumer audio products. However, these same performance metrics make the INA165x
useful for industrial, test and measurement, and data-acquisition applications. The examples shown here are
possible applications where the INA165x provide exceptional performance.
8.2.1 Line Receiver for Differential Audio Signals in a Split-Supply System
The INA165x devices are designed to require a minimum number of external components to achieve data sheet-
level performance in audio line-receiver applications. 图 51 shows the INA1650 used as a differential audio line
receiver in split-supply systems that are common in professional audio applications. The line receiver recovers a
differential audio signal which may have been affected by significant common-mode noise.
18 V
-18 V
C5 1 ꢀF
C7 1 ꢀF
Input Differential
Audio Signals
C6 0.1 ꢀF
C8 0.1 ꢀF
C1 10 ꢀF
R3 1 Mꢁ
R1
100 kꢁ
VCC
1
2
VEE 14
2
IN+ A
13
OUT A
1
R2
3
100 kꢁ
3 COM A
REF A 12
XLR Connector
VMID(IN)
IN- A
IN- B
4
5
6
7
11
10
9
C2 10 ꢀF
C3 10 ꢀF
Output Single-Ended
Audio Signals
VMID(OUT)
REF B
R4
100 kꢁ
COM B
IN+ B
3
R4 1 Mꢁ
8
OUT B
1
R5
100 kꢁ
2
INA1650
XLR Connector
C4 10 ꢀF
Copyright © 2016, Texas Instruments Incorporated
图 51. INA1650 Used as a Line Receiver for Differential Audio Signals in a Split-Supply System
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Typical Applications (接下页)
8.2.1.1 Design Requirements
•
•
•
•
Power Supply Voltage: ±18 V
Frequency Response: < 0.1 dB deviation from 20 Hz to 20 kHz
Common-Mode Rejection Ratio: > 80 dB at 1 kHz
THD+N: < –100 dB (4-dBu input signal, 1-kHz fundamental, 90-kHz measurement bandwidth)
8.2.1.2 Detailed Design Procedure
The passive components shown in 图 51 are selected using the information given in the Application Information
and Layout Guidelines sections. All 10-µF input AC-coupling capacitors (C1, C2, C3, and C4) maximize the
CMRR performance at low frequency, as shown in 图 48. The high-pass corner frequency for input signals meets
the design requirement for frequency response, as 公式 6 shows:
1
1
FC =
=
= 0.032 Hz
2∂ p∂RIN ∂CIN 2∂ p∂(500 kW)∂(10 mF)
(6)
1-MΩ RCOM resistors (R3 and R4) further improve CMRR performance at low frequency. Resistors R1, R2, R4,
and R5 provide a discharge pathway for the AC-coupling capacitors in the event that audio equipment with a DC
offset voltage is connected to the inputs of the circuit. These resistors are optional and may degrade the CMRR
performance with mismatches in source impedance. Finally, capacitors C5, C6, C7, and C8 provide a low-
impedance pathway for power supply noise to pass to ground rather than interfering with the audio signal. No
connection is necessary on the VMID(IN) and VMID(OUT) pins because the supply-divider circuit is not used in this
particular application.
8.2.1.3 Application Curves
图 52 through 图 57 illustrate the measured performance of the line receiver circuit. 图 52 shows the measured
frequency response. The gain of the circuit is 0 dB as expected with 0.1-dB magnitude variation at 10 Hz. The
measured CMRR of the circuit (图 53) at 1 kHz equals 94 dB without any source impedance mismatch. Adding a
10-Ω source impedance mismatch degrades the CMRR at 1 kHz to 92 dB. The high-frequency degradation of
CMRR shown in 图 53 for the 10-Ω source impedance mismatch cases is due to the capacitance of the cables
used for the measurement. The total harmonic distortion plus noise (THD+N) is plotted over frequency in 图 54.
For a 4-dBu (1.23 VRMS) input signal level, the THD+N remains flat at –101.6 dB (0.0008%) over the measured
frequency range. Increasing the signal level to 22 dBu further decreases the THD+N to –115.2 dB (0.00017%) at
1 kHz, but the THD+N rises above 7 kHz. Measuring the THD+N vs Output Amplitude (图 55) at 1 kHz shows a
constant downward slope until the noise floor of the audio analyzer is reached at 5 VRMS. The constant
downward slope indicates that noise from the device dominates THD+N at this frequency instead of distortion
harmonics. 图 56 and 图 57 confirm this conclusion. For a 4–dBu signal level, the second harmonic is barely
visible above the noise floor at –140 dBu. Increasing the signal level to 22 dBu produces distortion harmonics
above
the
noise
floor.
The
largest
harmonic
in
this
case
is
the
second
at
–111.2 dBu, or –133.2 dB relative to the fundamental.
版权 © 2016–2018, Texas Instruments Incorporated
23
INA1650, INA1651
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
www.ti.com.cn
Typical Applications (接下页)
1
0.8
0.6
0.4
0.2
0
œ40
œ50
œ60
œ70
œ80
œ90
œ100
No Mismatch
10-ꢀ Mismatch, XLR Pin 2
10-ꢀ Mismatch, XLR Pin 3
-0.2
-0.4
-0.6
-0.8
-1
10
10
0
100
1k
10k
100k
10
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
C001
C001
1-VRMS Common-Mode Signal
图 53. Common-Mode Rejection Ratio vs Frequency
图 52. Frequency Response
0.01
0.001
-80
0.1
-60
22 dBu (9.75 VRMS)
4 dBu (1.23 VRMS)
0.01
-80
-100
-120
-140
0.001
-100
-120
-140
0.0001
0.00001
0.0001
0.00001
100
1k
10k
0.01
0.1
1
10
Frequency (Hz)
Output Voltage (VRMS
)
C001
C014
90-kHz Measurement Bandwidth
22-kHz Measurement Bandwidth
图 54. THD+N vs Frequency
图 55. THD+N vs Amplitude
20
0
40
20
0
œ20
œ20
œ40
œ60
œ80
œ100
œ120
œ140
œ160
œ40
œ60
œ80
HD2: -111.2 dBu (-133.2 dBc)
HD3: -120.1 dBu (-142.1 dBc)
œ100
œ120
œ140
œ160
HD4: -130.7 dBu (-152.7 dBc)
5k
10k
15k
20k
0
5k
10k
15k
20k
Frequency (Hz)
Frequency (Hz)
C004
C004
4–dBu Output Amplitude
22–dBu Output Amplitude
图 56. Output Spectrum
图 57. Output Spectrum
24
版权 © 2016–2018, Texas Instruments Incorporated
INA1650, INA1651
www.ti.com.cn
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
Typical Applications (接下页)
8.2.2 Differential Line Receiver for Single-Supply Applications
The INA1650 can simply operate in single-supply applications by connecting the COM and REF pins to the
output of the internal supply divider.
(VMID(OUT). Adding a 1-µF capacitor to the VMID(IN) pin to filters noise from the power supply and the internal
voltage divider.
12 V
C7 1 ꢀF
C6 0.1 ꢀF
Input Differential
Audio Signals
C1
10 ꢀF
VCC
1
2
14
13
VEE
R1
100 kꢁ
2
IN+ A
OUT A
C2
10 ꢀF
1
R2
100 kꢁ
3 COM A
REF A 12
3
C5 1 ꢀF
Output Single-Ended
Audio Signals
VMID(IN)
IN- A
IN- B
4
5
6
7
11
10
9
XLR Connector
VMID(OUT)
REF B
R4
100 kꢁ
C3
10 ꢀF
C4
3
2
COM B
IN+ B
1
R5
100 kꢁ
8
OUT B
10 ꢀF
INA1650
XLR Connector
Copyright © 2016, Texas Instruments Incorporated
图 58. Differential Line Receiver for Single-Supply Applications
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25
INA1650, INA1651
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
www.ti.com.cn
Typical Applications (接下页)
8.2.3 Floating Single-Ended Input Line Receiver for Ground Loop Noise Reduction
Ground loops commonly form in audio systems where the equipment is interconnected with coaxial cables, which
introduces significant common-mode noise. If the sheath of the coaxial cable is connected to the equipment
chassis and safety ground, a ground loop forms, which includes the main electrical wiring and the audio signal
path. The INA165x can break these ground loops by floating the sheath of the coaxial cable through resistors
(R3 and R4 in 图 59) so ground noise appears at the inputs of the INA165x as a common-mode signal.
Capacitors C8 and C9 provide a high-frequency pathway to ground for radio frequency interference (RFI). A
transient voltage suppressor (TVS) connected between the coaxial sheath and the chassis ground is shown in 图
59. This TVS protects the inputs of the INA165x in the event of an electrostatic discharge to the signal input.
12 V
C7 1 ꢀF
C6 0.1 ꢀF
C1
10 ꢀF
VCC
1
2
VEE 14
13
RCA Input
IN+ A
OUT A
REF A 12
R1
10 kꢁ
3 COM A
C2
10 ꢀF
C5 1 ꢀF
VMID(IN)
IN- A
IN- B
4
5
6
7
11
10
9
VMID(OUT)
REF B
C3
10 ꢀF
R2
10 kꢁ
COM B
IN+ B
R3
C9
C8
R4
33 ꢁ
10 nF
10 nF 33 ꢁ
8
OUT B
C4
10 ꢀF
RCA Input
INA1650
TPD2E007
Copyright © 2016, Texas Instruments Incorporated
图 59. Ground Loop Isolation in Single-Ended Systems
26
版权 © 2016–2018, Texas Instruments Incorporated
INA1650, INA1651
www.ti.com.cn
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
Typical Applications (接下页)
8.2.4 Floating Single-Ended Input Line Receiver With Differential Outputs
The application in 图 59 can be further extended to include differential outputs, which are necessary for audio
ADCs and many Class-D amplifier devices. 图 60 shows the addition of an OPA1688 audio operational amplifier
to the outputs of the INA1650 that convert the single-ended outputs to differential outputs.
12 V
C7 1 ꢀF
R5
10 kꢁ
C8 0.1 ꢀF
Differential
Output
+12V
VCC
C1
10 ꢀF
1
2
3
4
5
6
7
14
13
VEE
R3 33
R6
10 kꢁ
C11
10 pF
RCA Input
IN+ A
COM A
IN- A
C5 10 nF
OUT A
½
OPA1688
R1
10 kꢁ
REF A 12
C2
10 ꢀF
C9 1 ꢀF
VMID(IN)
11
10
9
TPD2E007
IN- B
VMID(OUT)
REF B
C3
10 ꢀF
R2
10 kꢁ
COM B
IN+ B
½
OPA1688
C6 10 nF
R4 33
8
OUT B
R7
10 kꢁ
C10
10 pF
C4
10 ꢀF
RCA Input
INA1650
Differential
Output
R8
10 kꢁ
Copyright © 2016, Texas Instruments Incorporated
图 60. Single-Ended Line-Receiver Circuit With Differential Outputs
8.2.5 TRS Audio Interface in Single-Supply Applications
The INA1650 can be used for auxiliary audio inputs which may use a tip-ring-sleeve (TRS) connector where both
audio channels share a common ground connection. 图 61 shows the INA1650 configured as a line receiver for a
TRS interface to remove common-mode noise on the sleeve connection.
12 V
C7 1 ꢀF
C6 0.1 ꢀF
TRS Jack
VCC
1
2
3
4
5
6
7
VEE 14
13
C1
10 ꢀF
Ring
Tip
Right
Output
IN+ A
COM A
IN- A
OUT A
REF A 12
R1
100 kꢁ
C2
10 ꢀF
C5 1 ꢀF
VMID(IN)
11
10
9
Sleeve
IN- B
VMID(OUT)
REF B
C3
10 ꢀF
R2
100 kꢁ
COM B
IN+ B
Left
Output
8
OUT B
C4
10 ꢀF
INA1650
Copyright © 2016, Texas Instruments Incorporated
图 61. TRS Audio Interface in Single-Supply Applications
版权 © 2016–2018, Texas Instruments Incorporated
27
INA1650, INA1651
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
www.ti.com.cn
Typical Applications (接下页)
8.2.6 Differential Line Driver With Single-Ended Input
The INA1650 can be employed in line-driver applications (图 62) where the precision matched internal resistor
networks are useful in converting a single-ended signal to a balanced signal. Resistors R1 and R4 (shown in 图
62) isolate the large cable capacitance from the outputs of the INA1650 to maintain stability. TI recommends
AC-coupling capacitors C1 and C2 since the DC voltages of the connected equipment may be unknown.
Resistors R2 and R3 dissipate any charge collected on the capacitors due to connecting equipment with a DC
voltage present.
18 V
-18 V
C5 1 ꢀF
C3 1 ꢀF
C6 0.1 ꢀF
C4 0.1 ꢀF
C1
10 ꢀF
R1
49.9 ꢁ
VCC
1
2
VEE 14
Differential
Output Signal
IN+ A
13
OUT A
R2
100 kꢁ
3 COM A
REF A 12
Single-Ended
Input Signal
2
VMID(IN)
IN- A
IN- B
4
5
6
7
11
10
9
XLR Connector
1
VMID(OUT)
REF B
3
R3
100 kꢁ
COM B
IN+ B
8
OUT B
R4
49.9 ꢁ
C2
10 ꢀF
INA1650
Copyright © 2016, Texas Instruments Incorporated
图 62. INA1650 Used as a Balanced Audio Line Driver
28
版权 © 2016–2018, Texas Instruments Incorporated
INA1650, INA1651
www.ti.com.cn
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
9 Power Supply Recommendations
The INA165x operates from ±2.25-V to ±18-V supplies while maintaining excellent performance. However, some
applications do not require equal positive and negative output voltage swing. With the INA165x, power-supply
voltages do not need to be equal. For example, the positive supply can be set to 25 V with the negative supply at
–5 V.
10 Layout
10.1 Layout Guidelines
For best operational performance of the device, use good printed circuit board (PCB) layout practices, including:
•
Connect low-ESR, 1.0-µF and 0.1-µF ceramic bypass capacitors between each supply pin and ground,
placed as close to the device as possible. Connecting bypass capacitors only from V+ to ground is
acceptable in single-supply applications. Noise can propagate into analog circuitry through the power pins of
this device. The bypass capacitors reduce the coupled noise by providing low-impedance pathways to
ground.
•
Connect the device REF pins to a low-impedance, low-noise, system reference point (such as an analog
ground or the VMID(OUT) pin) with the shortest trace possible.
•
•
Place the external components as close to the device as possible, as shown in 图 63 and 图 64.
Use ground pours and planes to shield input signal traces and minimize additional noise introduced into the
signal path.
•
Keep the length of input traces equal and as short as possible. Route the input traces as a differential pair
with as minimal spacing between them as possible.
版权 © 2016–2018, Texas Instruments Incorporated
29
INA1650, INA1651
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
www.ti.com.cn
10.2 Layout Examples
+V
-V
C5
C6
C7
C8
C1
R3
IN+ A
VCC
1
2
3
4
5
6
7
VEE 14
R1
Input reference /
shield
IN+ A
COM A
IN- A
13
OUT A
R2
REF A 12
IN- A
VMID(IN)
11
10
9
C2
C3
IN- B
VMID(OUT)
REF B
IN+ B
COM B
IN+ B
R4
R4
C4
Input reference /
8
OUT B
shield
R5
INA1650
IN- B
Place bypass
capacitors as close to
IC as possible
+V
-V
GND
C5
C7
GND
GND
Connect COM pins to
input signal reference
C6
VCC
C8
IN+ A
C1
R3
C2
1
2
3
4
5
6
7
VEE 14
13
Input reference /
shield
IN+ A
COM A
IN- A
OUT A
REF A 12
IN- A
IN- B
VMID(IN)
11
10
9
GND
IN- B
VMID(OUT)
C3
COM B
IN+ B
REF B
OUT B
Input reference /
shield
R4
C4
8
INA1650
IN+ B
Input pairs routed
adjacent to each
other
Use ground pours for
shielding the input
signal pairs
GND
Copyright © 2016, Texas Instruments Incorporated
图 63. Layout Example for a Dual-Supply Line Receiver
30
版权 © 2016–2018, Texas Instruments Incorporated
INA1650, INA1651
www.ti.com.cn
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
Layout Examples (接下页)
+V
C7
C6
C1
C2
VCC
1
2
3
4
5
6
7
VEE 14
13
IN+
R1
R4
IN+ A
COM A
IN- A
OUT A
REF A 12
Input reference /
shield
R2
C5
VMID(IN)
IN-
IN-
11
10
9
IN- B
VMID(OUT)
REF B
C3
C4
COM B
IN+ B
Input reference /
shield
8
OUT B
R5
INA1650
IN+
+V
GND
C7
C6
GND
Connect VEE to low-
impedance ground
Place VMID(IN) filter
capacitor as close to
IC as possible
IN+
C1
VCC
1
2
3
4
5
6
7
VEE 14
13
Input reference /
shield
IN+ A
COM A
IN- A
OUT A
REF A 12
C2
C3
IN-
IN-
GND
VMID(IN)
11
10
9
C5
IN- B
VMID(OUT)
COM B
IN+ B
REF B
OUT B
Input reference /
shield
Use a low-impedance
connection to
8
connect reference
pins to VMID(OUT)
C4
IN+
GND
Copyright © 2016, Texas Instruments Incorporated
图 64. Layout Example for a Single-Supply Line Receiver
版权 © 2016–2018, Texas Instruments Incorporated
31
INA1650, INA1651
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
www.ti.com.cn
11 器件和文档支持
11.1 器件支持
11.1.1 开发支持
11.1.1.1 TINA-TI™(免费软件下载)
TINA™是一款简单、功能强大且易于使用的电路仿真程序,此程序基于 SPICE 引擎。TINA-TI 是 TINA 软件的一
款免费全功能版本,除了一系列无源和有源模型外,此版本软件还预先载入了一个宏模型库。TINA-TI 提供所有传
统的 SPICE 直流、瞬态和频域分析,以及其他设计功能。
TINA-TI 可从 WEBENCH® 设计中心免费下载,它提供全面的后续处理能力,使得用户能够以多种方式形成结果。
虚拟仪器提供选择输入波形和探测电路节点、电压和波形的功能,从而创建一个动态的快速入门工具。
注
这些文件需要安装 TINA 软件(由 DesignSoft™提供)或者 TINA-TI 软件。请从 TINA-TI 文
件夹 中下载免费的 TINA-TI 软件。
11.1.1.2 TI 高精度设计
欲获取 TI 高精度设计,请访问 http://www.ti.com.cn/ww/analog/precision-designs/。TI 高精度设计是由 TI 公司高
精度模拟 应用 专家创建的模拟解决方案,提供了许多实用电路的工作原理、组件选择、仿真、完整印刷电路板
(PCB) 电路原理图和布局布线、物料清单以及性能测量结果。
11.2 文档支持
11.2.1 相关文档
请参阅如下相关文档:
《电路板布局布线技巧》
11.3 相关链接
表 1 列出了快速访问链接。类别包括技术文档、支持和社区资源、工具与软件,以及立即订购快速访问。
表 1. 相关链接
器件
产品文件夹
请单击此处
请单击此处
立即订购
请单击此处
请单击此处
技术文档
请单击此处
请单击此处
工具与软件
请单击此处
请单击此处
支持和社区
请单击此处
请单击此处
INA1650
INA1651
32
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INA1650, INA1651
www.ti.com.cn
ZHCSFV5B –DECEMBER 2016–REVISED NOVEMBER 2018
11.4 接收文档更新通知
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.5 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,
并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
11.6 商标
SoundPlus, E2E are trademarks of Texas Instruments.
TINA-TI is a trademark of Texas Instruments, Inc and DesignSoft, Inc.
TINA, DesignSoft are trademarks of DesignSoft, Inc.
All other trademarks are the property of their respective owners.
11.7 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.8 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。
版权 © 2016–2018, Texas Instruments Incorporated
33
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
INA1650IPW
INA1650IPWR
INA1651IPW
INA1651IPWR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
14
14
14
14
90
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
-40 to 125
-40 to 125
IN1650C
2000 RoHS & Green
90 RoHS & Green
2000 RoHS & Green
NIPDAU
NIPDAU
NIPDAU
IN1650C
INA1651
INA1651
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Feb-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
INA1650IPWR
INA1651IPWR
TSSOP
TSSOP
PW
PW
14
14
2000
2000
330.0
330.0
12.4
12.4
6.9
6.9
5.6
5.6
1.6
1.6
8.0
8.0
12.0
12.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Feb-2022
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
INA1650IPWR
INA1651IPWR
TSSOP
TSSOP
PW
PW
14
14
2000
2000
367.0
367.0
367.0
367.0
35.0
35.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Feb-2022
TUBE
*All dimensions are nominal
Device
Package Name Package Type
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
INA1650IPW
INA1651IPW
PW
PW
TSSOP
TSSOP
14
14
90
90
530
530
10.2
10.2
3600
3600
3.5
3.5
Pack Materials-Page 3
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