INA226_15 [TI]

Bi-Directional Current and Power Monitor with I2C Compatible Interface;
INA226_15
型号: INA226_15
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Bi-Directional Current and Power Monitor with I2C Compatible Interface

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INA226  
www.ti.com  
SBOS547 JUNE 2011  
High-or Low-Side Measurement,  
Bi-Directional CURRENT/POWER MONITOR with I2CInterface  
Check for Samples: INA226  
1
FEATURES  
DESCRIPTION  
The INA226 is a current shunt and power monitor  
with an I2C interface. The INA226 monitors both a  
shunt voltage drop and bus supply voltage.  
Programmable calibration value, conversion times,  
and averaging, combined with an internal multiplier,  
enable direct readouts of current in amperes and  
power in watts.  
23  
SENSES BUS VOLTAGES FROM 0V TO +36V  
HIGH- OR LOW-SIDE SENSING  
REPORTS CURRENT, VOLTAGE, AND POWER  
HIGH ACCURACY:  
0.1% Gain Error (Max)  
10μV Offset (Max)  
CONFIGURABLE AVERAGING OPTIONS  
16 PROGRAMMABLE ADDRESSES  
OPERATES FROM 2.7 to 5.5V POWER SUPPLY  
MSOP-10 PACKAGE  
The INA226 senses current on buses that can vary  
from 0V to +36V, while the device obtains its power  
from a single +2.7V to +5.5V supply, drawing a  
typical of 330μA of supply current. The INA226 is  
specified over the operating temperature range  
of 40°C to +125°C. The I2C interface features 16  
programmable addresses.  
APPLICATIONS  
SERVERS  
TELECOM EQUIPMENT  
COMPUTERS  
POWER MANAGEMENT  
BATTERY CHARGERS  
POWER SUPPLIES  
TEST EQUIPMENT  
RELATED PRODUCTS  
DESCRIPTION  
DEVICE  
Current/Power Monitor with Watchdog, Peak-Hold,  
and Fast Comparator Functions  
INA209  
INA210, INA211,  
INA212, INA213,  
INA214  
Zerø-Drift, Low-Cost, Analog Current Shunt Monitor  
Series in Small Package  
Zerø-Drift, Bi-Directional Current Power Monitor with  
INA219  
INA220  
Two-Wire Interface  
High or Low Side, Bi-Directional Current/Power  
Monitor with Two-Wire Interface  
Power Supply  
(0V to 36V)  
CBYPASS  
0.1mF  
VS  
VBUS  
High-  
Side  
Shunt  
(Supply Voltage)  
INA226  
SDA  
SCL  
Power Register  
´
Load  
V
I
I2C  
Interface  
Current Register  
ADC  
Low-  
Side  
Shunt  
Alert  
Voltage Register  
A0  
A1  
Alert Register  
GND  
High-or Low-Side Sensing  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
I2C is a trademark of NXP Semiconductors.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2011, Texas Instruments Incorporated  
 
INA226  
SBOS547 JUNE 2011  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
PACKAGING INFORMATION(1)  
PRODUCT  
PACKAGE-LEAD  
PACKAGE DESIGNATOR  
PACKAGE MARKING  
INA226AIDGS  
MSOP-10  
DGS  
226  
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the  
INA226 product folder at www.ti.com.  
ABSOLUTE MAXIMUM RATINGS(1)  
Over operating free-air temperature range (unless otherwise noted).  
INA226  
UNIT  
V
Supply Voltage, VS  
6
Differential (VIN+) (VIN)(2)  
40 to +40  
V
Analog Inputs,  
VIN+, VIN–  
Common-Mode  
0.3 to +40  
V
SDA  
SCL  
GND 0.3 to +6  
V
GND 0.3 to VS + 0.3  
V
Input Current Into Any Pin  
Open-Drain Digital Output Current  
Storage Temperature  
5
10  
mA  
mA  
°C  
°C  
V
65 to +150  
+150  
Junction Temperature  
Human Body Model (HBM)  
2500  
ESD Ratings  
Charged-Device Model (CDM)  
Machine Model (MM)  
1000  
V
150  
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may  
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond  
those specified is not implied.  
(2) VIN+ and VINmay have a differential voltage of 40V to +40V; however, the voltage at these pins must not exceed the range 0.3V to  
+40V.  
2
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INA226  
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SBOS547 JUNE 2011  
ELECTRICAL CHARACTERISTICS: VS = +3.3V  
Boldface limits apply over the specified temperature range, TA = 40°C to +125°C.  
At TA = +25°C, VIN+ = 12V, VSENSE = (VIN+ VIN) = 0mV, VBUS = 12V, unless otherwise noted.  
INA226  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
INPUT  
Shunt voltage input range  
Bus voltage input range(1)  
Common-mode rejection  
Shunt offset voltage, RTI(2)  
vs Temperature  
-81.9175  
81.92  
mV  
V
0
36  
CMRR  
VOS  
VIN+ = 0V to +36V  
126  
140  
dB  
±2.5  
0.02  
2.5  
±10  
μV  
0.1  
μV/°C  
μV/V  
mV  
vs Power supply  
Bus offset voltage, RTI(2)  
PSRR  
VOS  
VS = +2.7V to +5.5V  
±1.25  
10  
±7.5  
vs Temperature  
40  
μV/°C  
mV/V  
μA  
vs Power supply  
PSRR  
0.5  
Input bias current  
IIN+, IIN-  
10  
VBUS input impedance  
830  
kΩ  
(VIN+ Pin) + (VINPin),  
Power-down mode  
Input leakage(3)  
0.1  
0.5  
μA  
DC ACCURACY  
ADC native resolution  
1 LSB step size  
16  
2.5  
Bits  
μV  
Shunt voltage  
Bus voltage  
1.25  
0.02  
10  
mV  
%
Shunt voltage gain error  
vs Temperature  
0.1  
50  
ppm/°C  
%
Bus voltage gain error  
vs Temperature  
0.02  
10  
0.1  
50  
ppm/°C  
LSB  
μs  
Differential nonlinearity  
ADC conversion time  
±0.1  
140  
CT bit = 000  
CT bit = 001  
CT bit = 010  
CT bit = 011  
CT bit = 100  
CT bit = 101  
CT bit = 110  
CT bit = 111  
154  
224  
204  
μs  
332  
365  
μs  
588  
646  
μs  
1.1  
1.21  
2.328  
4.572  
9.068  
ms  
2.116  
4.156  
8.244  
ms  
ms  
ms  
SMBus  
SMBus timeout(4)  
DIGITAL INPUT/OUTPUT  
Input capacitance  
Leakage input current  
Input logic levels:  
VIH  
28  
35  
1
ms  
3
pF  
0 VIN VS  
0.1  
μA  
0.7(VS)  
6
V
V
VIL  
0.5  
0.3(VS)  
Output logic level  
VOL SDA, alert  
Hysteresis  
IOL = 3mA  
0
0.4  
V
500  
mV  
(1) While the input range is 36V, the full-scale range of the ADC scaling is 40.96V. See the Basic ADC Functions section. Do not apply  
more than 36V.  
(2) RTI = Referred-to-input.  
(3) Input leakage is positive (current flowing into the pin) for the conditions shown at the top of this table. Negative leakage currents can  
occur under different input conditions.  
(4) SMBus timeout in the INA226 resets the interface any time SCL is low for more than 28ms.  
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INA226  
SBOS547 JUNE 2011  
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ELECTRICAL CHARACTERISTICS: VS = +3.3V (continued)  
Boldface limits apply over the specified temperature range, TA = 40°C to +125°C.  
At TA = +25°C, VIN+ = 12V, VSENSE = (VIN+ VIN) = 0mV, VBUS = 12V, unless otherwise noted.  
INA226  
PARAMETER  
POWER SUPPLY  
CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Operating supply range  
Quiescent current  
+2.7  
+5.5  
V
μA  
μA  
V
330  
0.5  
2
420  
2
Quiescent current, power-down mode  
Power-on reset threshold  
TEMPERATURE RANGE  
Specified range  
40  
+125  
°C  
THERMAL INFORMATION  
INA226  
DGS  
10 PINS  
171.4  
42.9  
THERMAL METRIC(1)  
UNITS  
θJA  
Junction-to-ambient thermal resistance  
θJCtop  
θJB  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
91.8  
°C/W  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
1.5  
ψJB  
90.2  
θJCbot  
n/a  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
4
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INA226  
www.ti.com  
SBOS547 JUNE 2011  
PIN CONFIGURATIONS  
DGS PACKAGE  
MSOP-10  
(Top View)  
1
2
3
4
5
10 VIN+  
A1  
A0  
9
8
7
6
VIN-  
VBUS  
Alert  
SDA  
SCL  
GND  
VS+  
PIN DESCRIPTIONS  
MSOP-10  
(DGS)  
PIN NO  
NAME  
A1  
DESCRIPTION  
1
2
Address pin. Connect to GND, SCL, SDA, or VS. Table 7 shows pin settings and corresponding addresses.  
Address pin. Connect to GND, SCL, SDA, or VS. Table 7 shows pin settings and corresponding addresses.  
Multi-functional alert, open-drain output.  
A0  
3
Alert  
SDA  
SCL  
VS+  
4
Serial bus data line, open-drain input/output.  
5
Serial bus clock line, open-drain input.  
6
Power supply, 2.7V to 5.5V.  
7
GND  
VBUS  
VIN–  
VIN+  
Ground.  
8
Bus voltage input.  
9
Negative differential shunt voltage. Connect to negative side of shunt resistor.  
Positive differential shunt voltage. Connect to positive side of shunt resistor.  
10  
REGISTER BLOCK DIAGRAM  
Power(1)  
Bus Voltage(1)  
´
Current(1)  
Shunt Voltage  
Channel  
ADC  
Bus Voltage  
Channel  
Calibration(2)  
´
Shunt Voltage(1)  
Data Registers  
(1) Read-only  
(2) Read/write  
Figure 1. INA226 Register Block Diagram  
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SBOS547 JUNE 2011  
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TYPICAL CHARACTERISTICS  
At TA = +25°C, VS = +3.3V, VIN+ = 12V, VSENSE = (VIN+ VIN) = 0mV, VBUS = 12V, unless otherwise noted.  
SHUNT INPUT OFFSET VOLTAGE  
FREQUENCY RESPONSE  
PRODUCTION DISTRIBUTION  
0
−10  
−20  
−30  
−40  
−50  
−60  
1
10  
100  
1k  
10k  
100k  
Frequency (Hz)  
G001  
Input Offset Voltage (mV)  
Figure 2.  
Figure 3.  
SHUNT INPUT OFFSET VOLTAGE  
vs TEMPERATURE  
SHUNT INPUT COMMON-MODE REJECTION RATIO  
vs TEMPERATURE  
−1  
−1.2  
−1.4  
−1.6  
−1.8  
−2  
170  
160  
150  
140  
−2.2  
−2.4  
−50  
−25  
0
25  
50  
75  
100  
125  
−50  
−25  
0
25  
50  
75  
100  
125  
Temperature (°C)  
Temperature (°C)  
G003  
G004  
Figure 4.  
Figure 5.  
SHUNT INPUT GAIN ERROR PRODUCTION DISTRIBUTION  
SHUNT INPUT GAIN ERROR vs TEMPERATURE  
600  
500  
400  
300  
200  
100  
0
−50  
−25  
0
25  
50  
75  
100  
125  
Temperature (°C)  
G007  
Input Gain Error (m%)  
Figure 6.  
Figure 7.  
6
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INA226  
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SBOS547 JUNE 2011  
TYPICAL CHARACTERISTICS (continued)  
At TA = +25°C, VS = +3.3V, VIN+ = 12V, VSENSE = (VIN+ VIN) = 0mV, VBUS = 12V, unless otherwise noted.  
SHUNT INPUT GAIN ERROR  
vs COMMON-MODE VOLTAGE  
BUS INPUT OFFSET VOLTAGE  
PRODUCTION DISTRIBUTION  
300  
250  
200  
150  
100  
50  
0
−50  
0
4
8
12  
16  
20  
24  
28  
32  
36  
Common−Mode Input Voltage (V)  
G008  
Input Offset Voltage (mV)  
Figure 8.  
Figure 9.  
BUS INPUT OFFSET VOLTAGE vs TEMPERATURE  
BUS INPUT GAIN ERROR PRODUCTION DISTRIBUTION  
−0.6  
−0.8  
−1.0  
−1.2  
−1.4  
−50  
−25  
0
25  
50  
75  
100  
125  
Temperature (°C)  
G009  
Input Gain Error (m%)  
Figure 10.  
Figure 11.  
BUS INPUT GAIN ERROR vs TEMPERATURE  
INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE  
600  
500  
400  
300  
200  
100  
0
25  
20  
15  
10  
5
0
−50  
−25  
0
25  
50  
75  
100  
125  
0
4
8
12  
16  
20  
24  
28  
32  
36  
Temperature (°C)  
Common−Mode Input Voltage (V)  
G012  
G012  
Figure 12.  
Figure 13.  
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INA226  
SBOS547 JUNE 2011  
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TYPICAL CHARACTERISTICS (continued)  
At TA = +25°C, VS = +3.3V, VIN+ = 12V, VSENSE = (VIN+ VIN) = 0mV, VBUS = 12V, unless otherwise noted.  
INPUT BIAS CURRENT vs TEMPERATURE  
INPUT BIAS CURRENT vs TEMPERATURE, SHUTDOWN  
24  
22  
20  
18  
16  
260  
220  
180  
140  
100  
60  
20  
−50  
−50  
−25  
0
25  
50  
75  
100  
125  
−25  
0
25  
50  
75  
100  
125  
Temperature (°C)  
Temperature (°C)  
G013  
G014  
Figure 14.  
Figure 15.  
ACTIVE IQ vs TEMPERATURE  
SHUTDOWN IQ vs TEMPERATURE  
500  
400  
300  
200  
100  
1.2  
1
0.8  
0.6  
0.4  
0.2  
−50  
−25  
0
25  
50  
75  
100  
125  
−50  
−25  
0
25  
50  
75  
100  
125  
Temperature (°C)  
Temperature (°C)  
G015  
G016  
Figure 16.  
Figure 17.  
ACTIVE IQ vs I2C CLOCK FREQUENCY  
SHUTDOWN IQ vs I2C CLOCK FREQUENCY  
500  
300  
250  
200  
150  
100  
50  
450  
400  
350  
300  
0
1
10  
100  
1,000  
10,000  
1
10  
100  
1,000  
10,000  
Frequency (kHz)  
Frequency (kHz)  
Figure 18.  
Figure 19.  
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INA226  
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SBOS547 JUNE 2011  
APPLICATION INFORMATION  
The INA226 is a digital current shunt monitor with an I2C- and SMBus-compatible interface. It provides digital  
current, voltage, and power readings necessary for accurate decision-making in precisely-controlled systems.  
Programmable registers allow flexible configuration for measurement resolution as well as  
continuous-versus-triggered operation. Detailed register information appears at the end of this data sheet,  
beginning with Table 2. See the Register Block Diagram for a block diagram of the INA226.  
INA226 TYPICAL APPLICATION  
The front-page figure shows a typical application circuit for the INA226. Use a 0.1μF ceramic capacitor for  
power-supply bypassing, placed as closely as possible to the supply and ground pins.  
BASIC ADC FUNCTIONS  
The INA226 performs two measurements on the power-supply bus of interest. The voltage developed from the  
load current that flows through a shunt resistor creates a shunt voltage that is measured at the VIN+ and VIN–  
pins. The device can also measure the power supply bus voltage by connecting this voltage to the VBUS pin. The  
differential shunt voltage is measured with respect to the VINpin while the bus voltage is measured with  
respect to ground.  
The INA226 is typically powered by a separate supply that can range from 2.7V to 5.5V. The bus that is being  
monitored can range in voltage from 0V to 36V. It is important to note here that based on the fixed 1.25mV LSB  
for the bus voltage register that a full-scale register would result in a 40.96V value. The actual voltage that is  
applied to the input pins of the INA226 should not exceed 36V. There are no special considerations for  
power-supply sequencing because the common-mode input range and power-supply voltage are independent of  
each other; therefore, the bus voltage can be present with the supply voltage off, and vice-versa.  
As noted, the INA226 takes two measurements, shunt voltage and bus voltage. It then converts these  
measurements to current, based on the Calibration Register value, and then calculates power. Refer to the  
Configure/Measure/Calculate Example section for additional information on programming the Calibration  
Register.  
The INA226 has two operating modes, continuous and triggered, that determine how the ADC operates following  
these conversions. When the INA226 is in the normal operating mode (that is, MODE bits of the Configuration  
Register are set to '111'), it continuously converts a shunt voltage reading followed by a bus voltage reading.  
After the shunt voltage reading, the current value is calculated (based on Equation 3). This current value is then  
used to calculate the power result (using Equation 4). These values are subsequently stored in an accumulator,  
and the measurement/calculation sequence repeats until the number of averages set in the Configuration  
Register is reached. Following every sequence, the present set of values measured and calculated are  
appended to previously collected values. Once all of the averaging has been completed, the final values for  
shunt voltage, bus voltage, current, and power are updated in the corresponding registers that can then be read.  
These values remain in the data output registers until they are replaced by the next fully completed conversion  
results. Reading the data output registers does not affect a conversion in progress.  
The Mode control in the Configuration Register also permits selecting modes to convert only the shunt voltage or  
the bus voltage in order to further allow the user to configure the monitoring function to fit the specific application  
requirements.  
All current and power calculations are performed in the background and do not contribute to conversion time.  
In triggered mode, writing any of the triggered convert modes into the Configuration Register (that is, MODE bits  
of the Configuration Register are set to 001, 010, or 011) triggers a single-shot conversion. This action  
produces a single set of measurements; thus, to trigger another single-shot conversion, the Configuration  
Register must be written to a second time, even if the mode does not change.  
In addition to the two operating modes (continuous and triggered), the INA226 also has a power-down mode that  
reduces the quiescent current and turns off current into the INA226 inputs, reducing the impact of supply drain  
when the device is not being used. Full recovery from power-down mode requires 40ms. The registers of the  
INA226 can be written to and read from while the device is in power-down mode. The device remains in  
power-down mode until one of the active modes settings are written into the Configuration Register.  
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Although the INA226 can be read at any time, and the data from the last conversion remain available, the  
Conversion Ready Flag bit (Mask/Enable Register, CVRF bit) is provided to help coordinate one-shot or triggered  
conversions. The Conversion Ready Flag bit is set after all conversions, averaging, and multiplication operations  
are complete.  
The Conversion Ready Flag bit clears under these conditions:  
1. Writing to the Configuration Register, except when configuring the MODE bits for power-down mode; or  
2. Reading the Status Register.  
Power Calculation  
The Current and Power are calculated following shunt voltage and bus voltage measurements as shown in  
Figure 20. Current is calculated following a shunt voltage measurement based on the value set in the Calibration  
Register. If there is no value loaded into the Calibration Register, the current value stored is zero. Power is  
calculated following the bus voltage measurement based on the previous current calculation and bus voltage  
measurement. If there is no value loaded in the Calibration Register, the power value stored is also zero. Again,  
these calculations are performed in the background and do not add to the overall conversion time. These current  
and power values are considered intermediate results (unless the averaging is set to 1) and are stored in an  
internal accumulation register, not the corresponding output registers. Following every measured sample, the  
newly-calculated values for current and power are appended to this accumulation register until all of the samples  
have been measured and averaged based on the number of averages set in the Configuration Register.  
Current Limit Detect Following  
Every Shunt Voltage Conversion  
Bus and Power Limit Detect  
Following Every Bus Voltage Conversion  
V
I
I
V
I
V
I
V
I
V
I
V
I
V
I
V
I
V
I
V
I
V
I
V
I
V
I
V
I
V
I
V
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
Power Average  
Bus Voltage Average  
Shunt Voltage Average  
Figure 20. Power Calculation Scheme  
In addition to the current and power accumulating after every sample, the shunt and bus voltage measurements  
are also collected. Once all of the samples have been measured and the corresponding current and power  
calculations have been made, the accumulated average for each of these parameters is then loaded to the  
corresponding output registers, where they can then be read.  
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Averaging and Conversion Time Considerations  
The INA226 has programmable conversion times for both the shunt voltage and bus voltage measurements. The  
conversion times for these measurements can be selected from as fast as 140μs to as long as 8.244ms. The  
conversion time settings, along with the programmable averaging mode, allow the INA226 to be configured to  
optimize the available timing requirements in a given application. For example, if a system requires that data be  
read every 5ms, the INA226 could be configured with the conversion times set to 588μs and the averaging mode  
set to 4. This configuration results in the data updating approximately every 4.7ms. The INA226 could also be  
configured with a different conversion time setting for the shunt and bus voltage measurements. This type of  
approach is common in applications where the bus voltage tends to be relatively stable. This situation can allow  
for the time focused on the bus voltage measurement to be reduced relative to the shunt voltage measurement.  
The shunt voltage conversion time could be set to 4.156ms with the bus voltage conversion time set to 588μs,  
with the averaging mode set to 1. This configuration also results in data updating approximately every 4.7ms.  
There are trade-offs associated with the settings for conversion time and the averaging mode used. The  
averaging feature can significantly improve the measurement accuracy by effectively filtering the signal. This  
approach allows the INA226 to reduce any noise in the measurement that may be caused by noise coupling into  
the signal. A greater number of averages enables the INA226 to be more effective in reducing the noise  
component of the measurement.  
The conversion times selected can also have an impact on the measurement accuracy. This effect can seen in  
Figure 21. Multiple conversion times are shown here to illustrate the impact of noise on the measurement. In  
order to achieve the highest accuracy measurement possible, a combination of the longest allowable conversion  
times and highest number of averages should be used, based on the timing requirements of the system.  
Conversion Time: 140ms  
Conversion Time: 1.1ms  
Conversion Time: 8.244ms  
0
200  
400  
600  
800  
1000  
Number of Conversions  
Figure 21. Noise vs Conversion Time  
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Filtering and Input Considerations  
Measuring current is often noisy, and such noise can be difficult to define. The INA226 offers several options for  
filtering by allowing the conversion times and number of averages to be selected independently in the  
Configuration Register. The conversion times can be set independently for the shunt voltage and bus voltage  
measurements to allow added flexibility in configuring the monitoring of the power-supply bus.  
The internal ADC is based on a delta-sigma (ΔΣ) front-end with a 500kHz (±30%) typical sampling rate. This  
architecture has good inherent noise rejection; however, transients that occur at or very close to the sampling  
rate harmonics can cause problems. Because these signals are at 1MHz and higher, they can be managed by  
incorporating filtering at the input of the INA226. The high frequency enables the use of low-value series resistors  
on the filter with negligible effects on measurement accuracy. In general, filtering the INA226 input is only  
necessary if there are transients at exact harmonics of the 500kHz (±30%) sampling rate (greater than 1MHz).  
Filter using the lowest possible series resistance (typically 10Ω or less) and a ceramic capacitor. Recommended  
values for this capacitor are 0.1μF to 1.0μF. Figure 22 shows the INA226 with an additional filter added at the  
input.  
Overload conditions are another consideration for the INA226 inputs. The INA226 inputs are specified to tolerate  
40V across the inputs. A large differential scenario might be a short to ground on the load side of the shunt. This  
type of event can result in full power-supply voltage across the shunt (as long the power supply or energy  
storage capacitors support it). Keep in mind that removing a short to ground can result in inductive kickbacks that  
could exceed the 40V differential and common-mode rating of the INA226. Inductive kickback voltages are best  
controlled by zener-type transient-absorbing devices (commonly called transzorbs) combined with sufficient  
energy storage capacitance.  
In applications that do not have large energy storage electrolytics on one or both sides of the shunt, an input  
overstress condition may result from an excessive dV/dt of the voltage applied to the input. A hard physical short  
is the most likely cause of this event, particularly in applications with no large electrolytics present. This problem  
occurs because an excessive dV/dt can activate the ESD protection in the INA226 in systems where large  
currents are available. Testing has demonstrated that the addition of 10Ω resistors in series with each input of  
the INA226 sufficiently protect the inputs against this dV/dt failure up to the 40V rating of the INA226. Selecting  
these resistors in the range noted has minimal effect on accuracy.  
Power Supply  
(0V to 36V)  
CBYPASS  
0.1mF  
VS  
VBUS  
(Supply Voltage)  
CFILTER  
SDA  
SCL  
0.1mF to 1mF  
Ceramic  
Capacitor  
Power Register  
Current Register  
Voltage Register  
Alert Register  
´
RFILTER  
V
I
£10W  
I2C  
Interface  
VIN+  
ADC  
Alert  
A0  
VIN-  
RFILTER  
A1  
£10W  
Load  
GND  
Figure 22. INA226 with Input Filtering  
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ALERT PIN  
The INA226 has a single Alert Limit register, 07h, that allows the Alert pin to be programmed to respond to a  
single user-defined event or to a conversion ready notification if desired. The Mask/Enable Register allows the  
user to select from one of the five available functions to monitor and/or set the conversion ready bit to control the  
response of the Alert pin. Based on the function being monitored, the user would then enter a value into the Alert  
Limit Register to set the corresponding threshold value that asserts the Alert pin.  
The Alert pin allows for one of several available alert functions to be monitored to determine if a user-defined  
threshold has been exceeded. The five alert functions that can be monitored are:  
Shunt Voltage Over Limit (SOL)  
Shunt Voltage Under Limit (SUL)  
Bus Voltage Over Limit (BOL)  
Bus Voltage Under Limit (BUL)  
Power Over Limit (POL)  
The Alert pin is an open-drain output. This pin is asserted when the alert function selected in the Mask/Enable  
register exceeds the value programmed into the Alert Limit register. Only one of these alert functions can be  
enabled and monitored at a time. If multiple alert functions are enabled, the selected function in the highest  
significant bit position takes priority and responds to the Alert Limit register value. For example, if the Shunt  
Voltage Over Limit and the Shunt Voltage Under Limit are both selected, the Alert pin asserts when the Shunt  
Voltage Over Limit Register exceeds the value in the Alert Limit register.  
The Conversion Ready state of the device can also be monitored at the Alert pin to inform the user when the  
device has completed the previous conversion and is ready to begin a new conversion. Conversion Ready can  
be monitored at the Alert pin along with one of the alert functions. If an alert function and the Conversion Ready  
are both enabled to be monitored at the Alert pin, after the Alert pin is asserted, the Mask/Enable register must  
be read following the alert to determine the source of the alert. By reading the Conversion Ready Flag (CVRF),  
bit D3, and the Alert Function Flag (AFF), bit D4 in the Mask/Enable register, the source of the alert can be  
determined. If the conversion ready feature is not desired, and the CNVR bit is not set, the Alert pin only  
responds to an exceeded alert limit based on the alert function enabled.  
If the Alert function is not used, the Alert pin can be left floating without impacting the operation of the device.  
Refer to Figure 20 to see the relative timing of when the value in the Alert Limit Register is compared to the  
corresponding converted value. For example, if the alert function that is enabled is Shunt Voltage Over Limit  
(SOL), following every shunt voltage conversion the value in the Alert Limit Register is compared to the  
measured shunt voltage to determine if the measurements has exceeded the programmed limit. The AFF, bit 4 of  
the Mask/Enable Register, asserts high any time the measured voltage exceeds the value programmed into the  
Alert Limit Register. In addition to the AFF being asserted, the Alert pin is asserted based on the Alert Polarity Bit  
(APOL, bit 1 of the Mask/Enable Register). If the Alert Latch is enabled, the AFF and Alert pin remain asserted  
until either the Configuration Register is written to or the Mask/Enable Register is read.  
The Bus Voltage alert functions compare the measured bus voltage to the Alert Limit Register following every  
bus voltage conversion and assert the AFF bit and Alert pins if the limit threshold is exceeded.  
The Power Over Limit alert function is also compared to the calculated power value following every bus voltage  
measurement conversion and asserts the AFF bit and Alert pins if the limit threshold is exceeded.  
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PROGRAMMING THE INA226  
An important aspect of the INA226 is that it does not necessarily measure current or power. The INA226  
measures both the differential voltage applied between the VIN+ and VIN- input pins and the voltage applied to  
the VBUS pin. In order for the INA226 to report both current and power values, the user must program the  
resolution of the Current Register and the value of the shunt resistor present in the application to develop the  
differential voltage applied between the input pins. The Power Register is internally set to be 25 times the  
programmed Current_LSB. Both the Current_LSB and shunt resistor value are used in the calculation of the  
Calibration Register value the INA226 uses to calculate the corresponding current and power values based on  
the measured shunt and bus voltages.  
The Calibration Register is calculated based on Equation 1. This equation includes the term Current_LSB. This is  
the programmed value for the LSB for the Current Register. This is the value the user will use to convert the  
value in the Current Register to the actual current in amps. The highest resolution for the Current Register can  
be obtained by using the smallest allowable Current_LSB based on the maximum expected current as shown in  
Equation 2. While this value will yield the highest resolution, it is common to select a value for the Current_LSB  
to the nearest round number above this value to simplify the conversion of the Current Register and Power  
Register to amps and watts respectively. The RSHUNT term is the value of the external shunt used to develop  
the differential voltage across the input pins. The 0.00512 value in Equation 1 is an internal fixed value used to  
ensure scaling is maintained properly.  
0.00512  
Current_LSB · RSHUNT  
CAL =  
(1)  
Maximum Expected Current  
Current_LSB =  
215  
(2)  
Once the Calibration Register has been programmed, the Current Register and Power Register will be updated  
accordingly based on the corresponding shunt voltage and bus voltage measurements. Until the Calibration  
Register is programmed, the Current and Power Registers remain at zero.  
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CONFIGURE/MEASURE/CALCULATE EXAMPLE  
In this example, shown in Figure 23, a nominal 10A load creates a differential voltage of 20mV across a 2mΩ  
shunt resistor. The bus voltage for the INA226 is measured at the external VBUS input pin, which in this example  
is connected to the VINpin to measure the voltage level delivered to the load. For this example, the VBUS pin  
measures less than 12V because the voltage at the VINpin is 11.98V as a result of the voltage drop across the  
shunt resistor.  
+12V Supply  
CBYPASS  
0.1mF  
VS  
VBUS  
(Supply Voltage)  
SDA  
SCL  
Power Register  
Current Register  
Voltage Register  
Alert Register  
´
V
I2C  
Interface  
VIN+  
ADC  
RSHUNT  
2mW  
Alert  
A0  
I
VIN-  
A1  
10A  
Load  
GND  
Figure 23. Example Circuit Configuration  
For this example, assuming a maximum expected current of 15A, the Current_LSB is calculated to be  
457.7μA/bit using Equation 2. Using a value for the Current_LSB of 500μA/Bit or 1mA/Bit would significantly  
simplifiy the conversion from the Current Register and Power Register to amps and watts. For this example, a  
value of 1mA/bit was chosen for the current LSB. Using this value for the Current_LSB does trade a small  
amount of resolution for having a simpler conversion process on the user side. Using Equation 1 in this example  
with a current LSB of 1mA/bit and a shunt resistor of 2mΩ results in a Calibration Register value of 2560, or  
A00h.  
The Current Register (04h) is then calculated by multiplying the decimal value of the Shunt Voltage Register  
contents by the decimal value of the Calibration Register and then dividing by 2048, as shown in Equation 3. For  
this example, the Shunt Voltage Register contains a value of 8,000, which is multiplied by the Calibration  
Register value of 2560 and then divided by 2048 to yield a decimal value for the Current Register of 10000, or  
2710h. Multiplying this value by 1mA/bit results in the original 10A level stated in the example.  
ShuntVoltage · CalibrationRegister  
Current =  
2048  
(3)  
The LSB for the Bus Voltage Register (02h) is a fixed 1.25mV/bit, which means that the 11.98V present at the  
VBUS pin results in a register value of 2570h, or a decimal equivalent of 9584. Note that the MSB of the Bus  
Voltage Register is always zero because the VBUS pin is only able to measure positive voltages.  
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The Power Register (03h) is then be calculated by multiplying the decimal value of the Current Register, 10000,  
by the decimal value of the Bus Voltage Register, 9584, and then dividing by 20,000, as defined in Equation 4.  
For this example, the result for the Power Register is 12B8h, or a decimal equivalent of 4792. Multiplying this  
result by the power LSB (25 times the [1 × 103 Current LSB]) results in a power calculation of (4792 ×  
25mW/bit), or 119.82W. The power LSB has a fixed ratio to the current LSB of 25W/bit to 1A/bit. For this  
example, a programmed 1mA/bit current LSB results in a power LSB of 25mW/bit. This ratio is internally  
programmed to ensure that the scaling of the power calculation is within an acceptable range. A manual  
calculation for the power being delivered to the load would use a bus voltage of 11.98V (12VCM 20mV shunt  
drop) multiplied by the load current of 10A to give a result of 119.8W.  
Current · BusVoltage  
Power =  
20,000  
(4)  
Table 1 shows the steps for configuring, measuring, and calculating the values for current and power for this  
device.  
Table 1. Configure/Measure/Calculate Example(1)  
STEP #  
Step 1  
Step 2  
Step 3  
Step 4  
Step 5  
Step 6  
REGISTER NAME  
Configuration  
Shunt  
ADDRESS  
00h  
CONTENTS  
4127h  
1F40h  
2570h  
A00h  
DEC  
LSB  
VALUE  
01h  
8000  
9584  
2560  
10000  
4792  
2.5µV  
1.25mV  
20mV  
11.98V  
Bus  
02h  
Calibration  
Current  
05h  
04h  
2710  
1mA  
25mW  
10A  
Power  
03h  
12B8h  
119.82W  
(1) Conditions: Load = 10A, VCM = 12V, RSHUNT = 2mΩ, and VBUS = 12V.  
PROGRAMMING THE INA226 POWER MEASUREMENT ENGINE  
Calibration Register and Scaling  
The Calibration Register makes it possible to set the scaling of the Current and Power Registers to whatever  
values are most useful for a given application. One strategy may be to set the Calibration Register such that the  
largest possible number is generated in the Current Register or Power Register at the expected full-scale point.  
This approach would yield the highest resolution based using the previously calculated minimum current LSB in  
the equation for the Calibration Register. The Calibration Register can also be selected to provide values in the  
Current and Power Registers that either provide direct decimal equivalents of the values being measured, or  
yield a round LSB value for each corresponding register. After these choices have been made, the Calibration  
Register also offers possibilities for end user system-level calibration. By physically measuring the current with  
an external ammeter, the exact current is known. The value of the Calibration Register can then be adjusted  
based on the measured current result of the INA226 to cancel the total system error as shown in Equation 5.  
Cal ´ MeasShuntCurrent  
INA226_Current  
Corrected_Full_Scale_Cal = trunc  
(5)  
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Simple Current Shunt Monitor Usage  
(No Programming Necessary)  
The INA226 can be used without any programming if it is only necessary to read a shunt voltage drop and bus  
voltage with the default power-on reset configuration and continuous conversion of shunt and bus voltage.  
Without programming the INA226 Calibration Register, the device is unable to provide either a valid current or  
power value, because these outputs are both derived using the values loaded into the Calibration Register.  
Default INA226 Settings  
The default power-up states of the registers are shown in the INA226 Register Descriptions section of this data  
sheet. These registers are volatile, and if programmed to a value other than the default values shown in Table 2,  
they must be re-programmed at every device power-up. Detailed information on programming the Calibration  
Register specifically is given in the Configure/Measure/Calculate Example section and calculated based on  
Equation 1.  
REGISTER INFORMATION  
The INA226 uses a bank of registers for holding configuration settings, measurement results, minimum/maximum  
limits, and status information. Table 2 summarizes the INA226 registers; refer to Figure 1 for an illustration of the  
registers.  
Table 2. Summary of Register Set  
POINTER  
ADDRESS  
POWER-ON RESET  
BINARY  
HEX  
REGISTER NAME  
FUNCTION  
HEX  
TYPE(1)  
All-register reset, shunt voltage and bus  
voltage ADC conversion times and  
averaging, operating mode.  
0
Configuration Register  
01000001 00100111  
4127  
R/W  
1
2
Shunt Voltage  
Bus Voltage  
Shunt voltage measurement data.  
Bus voltage measurement data.  
00000000 00000000  
00000000 00000000  
0000  
0000  
R
R
Contains the value of the calculated  
power being delivered to the load.  
3
Power(2)  
00000000 00000000  
0000  
R
Contains the value of the calculated  
current flowing through the shunt  
resistor.  
4
Current(2)  
00000000 00000000  
0000  
R
Sets full-scale range and LSB of current  
and power measurements. Overall  
system calibration.  
5
Calibration  
00000000 00000000  
0000  
R/W  
Alert configuration and conversion ready  
flag.  
6
7
Mask/Enable  
Alert Limit  
Die ID  
00000000 00000000  
00000000 00000000  
ASCII  
0000  
0000  
ASCII  
R/W  
R/W  
R
Contains the limit value to compare to  
the selected Alert function.  
Contains unique die identification  
number.  
FF  
(1) Type: R = Read-Only, R/W = Read/Write.  
(2) The Current Register defaults to '0' because the Calibration Register defaults to '0', yielding a zero current and power value until the  
Calibration Register is programmed.  
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REGISTER DETAILS  
All 16-bit INA226 registers are two 8-bit bytes via the I2C interface.  
Configuration Register 00h (Read/Write)  
BIT #  
D15  
D14  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
BIT  
NAME  
RST  
AVG2  
AVG1  
AVG0  
VBUSCT2 VBUSCT1 VBUSCT0 VSHCT2 VSHCT1 VSHCT0 MODE3 MODE2 MODE1  
POR  
VALUE  
0
1
0
0
0
0
0
1
0
0
1
0
0
1
1
1
The Configuration Register settings control the operating modes for the INA226. This register controls the  
conversion time settings for both the shunt and bus voltage measurements as well as the averaging mode used.  
The operating mode that controls what signals are selected to be measured is also programmed in the  
Configuration Register.  
The Configuration Register can be read from at any time without impacting or affecting the device settings or a  
conversion in progress. Writing to the Configuration Register will halt any conversion in progress until the write  
sequence is completed resulting in a new conversion starting based on the new contents of the Configuration  
Register. This prevents any uncertainty in the conditions used for the next completed conversion.  
Bit Descriptions  
RST:  
Reset Bit  
Bit 15  
Setting this bit to '1' generates a system reset that is the same as power-on reset. Resets all registers to default  
values; this bit self-clears.  
AVG:  
Averaging Mode  
Bits 911  
Sets the number of samples that will be collected and averaged together. Table 3 summarizes the AVG bit settings  
and related number of averages for each bit.  
Table 3. AVG Bit Settings[11:9](1)  
AVG2  
D11  
AVG1  
D10  
AVG0  
D9  
NUMBER OF  
AVERAGES  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1
4
16  
64  
128  
256  
512  
1024  
(1) Shaded values are default.  
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VBUS CT:  
Bus Voltage Conversion Time  
Bits 68  
Sets the conversion time for the bus voltage measurement. Table 4 shows the VBUS CT bit options and related  
conversion times for each bit.  
(1)  
Table 4. VBUS CT Bit Settings [8:6]  
VBUS CT2  
D8  
VBUS CT1  
D7  
VBUS CT0  
D6  
CONVERSION TIME  
140µs  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
204µs  
332µs  
588µs  
1.1ms  
2.116ms  
4.156ms  
8.244ms  
(1) Shaded values are default.  
VSH CT:  
Shunt Voltage Conversion Time  
Bits 35  
Sets the conversion time for the shunt voltage measurement. Table 5 shows the VSH CT bit options and related  
conversion times for each bit.  
Table 5. VSH CT Bit Settings [5:3](1)  
VSH CT2  
D5  
VSH CT1  
D4  
VSH CT0  
D3  
CONVERSION TIME  
140µs  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
204µs  
332µs  
588µs  
1.1ms  
2.116ms  
4.156ms  
8.244ms  
(1) Shaded values are default.  
MODE:  
Operating Mode  
Bits 02  
Selects continuous, triggered, or power-down mode of operation. These bits default to continuous shunt and bus  
measurement mode. The mode settings are shown in Table 6.  
Table 6. Mode Settings [2:0](1)  
MODE3  
D2  
MODE2  
D1  
MODE1  
D0  
MODE  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Power-Down  
Shunt Voltage, Triggered  
Bus Voltage, Triggered  
Shunt and Bus, Triggered  
Power-Down  
Shunt Voltage, Continuous  
Bus Voltage, Continuous  
Shunt and Bus, Continuous  
(1) Shaded values are default.  
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DATA OUTPUT REGISTERS  
Shunt Voltage Register 01h (Read-Only)  
The Shunt Voltage Register stores the current shunt voltage reading, VSHUNT. Negative numbers are represented  
in twos complement format. Generate the twos complement of a negative number by complementing the  
absolute value binary number and adding 1. Extend the sign, denoting a negative number by setting the MSB =  
'1'.  
Example: For a value of VSHUNT = 80mV:  
1. Take the absolute value: 80mV  
2. Translate this number to a whole decimal number (80mV ÷ 2.5µV) = 32000  
3. Convert this number to binary = 111 1101 0000 0000  
4. Complement the binary result = 000 0010 1111 1111  
5. Add '1' to the complement to create the twos complement result = 000 0011 0000 0000  
6. Extend the sign and create the 16-bit word: 1000 0011 0000 0000 = 8300h  
If averaging is enabled, this register displays the averaged value. Full-scale range = 81.92mV (decimal = 7FFF);  
LSB: 2.5μV.  
BIT #  
D15  
D14  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
BIT  
NAME  
SIGN  
SD14  
SD13  
SD12  
SD11  
SD10  
SD9  
SD8  
SD7  
SD6  
SD5  
SD4  
SD3  
SD2  
SD1  
SD0  
POR  
VALUE  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Bus Voltage Register 02h (Read-Only)(1)  
The Bus Voltage Register stores the most recent bus voltage reading, VBUS  
.
If averaging is enabled, this register displays the averaged value. Full-scale range = 40.96V (decimal = 7FFF);  
LSB = 1.25mV.  
BIT #  
D15  
D14  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
BIT  
NAME  
BD14  
BD13  
BD12  
BD11  
BD10  
BD9  
BD8  
BD7  
BD6  
BD5  
BD4  
BD3  
BD2  
BD1  
BD0  
POR  
VALUE  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
(1) D15 is always zero because bus voltage can only be positive.  
Power Register 03h (Read-Only)  
If averaging is enabled, this register displays the averaged value.  
BIT #  
D15  
D14  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
BIT  
NAME  
PD15  
PD14  
PD13  
PD12  
PD11  
PD10  
PD9  
PD8  
PD7  
PD6  
PD5  
PD4  
PD3  
PD2  
PD1  
PD0  
POR  
VALUE  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
The Power Register LSB is internally programmed to equal 25 times the programmed value of the Current_LSB.  
The Power Register records power in watts by multiplying the decimal values of the current register with the  
decimal value of the bus voltage register according to Equation 4.  
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Current Register 04h (Read-Only)  
If averaging is enabled, this register displays the averaged value.  
BIT #  
D15  
D14  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
BIT  
NAME  
CSIGN  
CD14  
CD13  
CD12  
CD11  
CD10  
CD9  
CD8  
CD7  
CD6  
CD5  
CD4  
CD3  
CD2  
CD1  
CD0  
POR  
VALUE  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
The value of the Current Register is calculated by multiplying the decimal value in the Shunt Voltage Register  
with the decimal value of the Calibration Register, according to Equation 3.  
Calibration Register 05h (Read/Write)  
This register provides the INA226 with the value of the shunt resistor that was present to create the measured  
differential voltage. It also sets the resolution of the Current Register. The current LSB and power LSB are set  
through the programming of this register. This register is also suitable for use in overall system calibration. See  
the Configure/Measure/Calculate Example for additional information on programming the Calibration Register.  
BIT #  
D15  
D14  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
BIT  
NAME  
FS14  
FS13  
FS12  
FS11  
FS10  
FS9  
FS8  
FS7  
FS6  
FS5  
FS4  
FS3  
FS2  
FS1  
FS0  
POR  
VALUE  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Mask/Enable 06h (Read/Write)  
The Mask/Enable Register selects the function that is enabled to control the Alert pin, as well as how that pin  
functions. If multiple functions are enabled, the highest significant bit position Alert Function (D11-D15) takes  
priority and responds to the Alert Limit register.  
BIT #  
D15  
D14  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
BIT  
NAME  
SOL  
SUL  
BOL  
BUL  
POL  
CNVR  
AFF  
CVRF  
OVF  
APOL  
LEN  
POR  
VALUE  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
SOL:  
Shunt Voltage Over-Voltage  
Bit 15  
Setting this bit high configures the Alert pin to be asserted when the Shunt Voltage Register exceeds the value in  
the Alert Limit Register.  
SUL:  
Shunt Voltage Under-Voltage  
Bit 14  
Setting this bit high configures the Alert pin to be asserted when the Shunt Voltage Register drops below the value  
in the Alert Limit Register.  
BOL:  
Bus Voltage Over-Voltage  
Bit 13  
Setting this bit high configures the Alert pin to be asserted when the Bus Voltage Register exceeds the value in the  
Alert Limit Register.  
BUL:  
Bus Voltage Under-Voltage  
Bit 12  
Setting this bit high configures the Alert pin to be asserted when the Bus Voltage Register drops below the value in  
the Alert Limit Register.  
POL:  
Over-Limit Power  
Bit 11  
Setting this bit high configures the Alert pin to be asserted when the Power Register exceeds the value in the Alert  
Limit Register.  
CNVR:  
Conversion Ready  
Bit 10  
Setting this bit high configures the Alert pin to be asserted when the Conversion Ready Flag, Bit 3, is asserted  
indicating that the device is ready for the next conversion.  
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AFF:  
Alert Function Flag  
Bit 4  
While only one Alert Function can be monitored at the Alert pin at a time, the Conversion Ready can also be  
enabled to assert the Alert pin. Reading the Alert Function Flag following an alert allows the user to determine if the  
Alert Function was the source of the Alert.  
When the Alert Latch Enable bit is set to Latch mode, the Alert Function Flag clears only when the Mask/Enable  
Register is read. When the Alert Latch Enable bit is set to Transparent mode, the Alert Function Flag is cleared  
following the next conversion that does not result in an Alert condition.  
CVRF:  
Conversion Ready Flag  
Bit 3  
Although the INA226 can be read at any time, and the data from the last conversion is available, the Conversion  
Ready bit is provided to help coordinate one-shot or triggered conversions. The Conversion bit is set after all  
conversions, averaging, and multiplications are complete. Conversion Ready clears under the following conditions:  
1.) Writing to the Configuration Register (except for Power-Down or Disable selections)  
2.) Reading the Mask/Enable Register  
OVF:  
Math Overflow Flag  
Bit 2  
This bit is set to '1' if an arithmetic operation resulted in an overflow error. It indicates that current and power data  
may be invalid.  
APOL:  
Alert Polarity bit; sets the Alert pin polarity.  
Bit 1  
1 = Inverted (active-high open collector)  
0 = Normal (active-low open collector) (default)  
LEN:  
Alert Latch Enable; configures the latching feature of the Alert pin and Flag bits.  
Bit 0  
1 = Latch enabled  
0 = Transparent (default)  
When the Alert Latch Enable bit is set to Transparent mode, the Alert pin and Flag bits will reset to their idle states  
when the fault has been cleared. When the Alert Latch Enable bit is set to Latch mode, the Alert pin and Flag bits  
will remain active following a fault until the Mask/Enable Register has been read.  
Alert Limit 07h (Read/Write)  
The Alert Limit Register contains the value used to compare to the register selected in the Mask/Enable Register  
to determine if a limit has been exceeded.  
BIT #  
D15  
D14  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
BIT  
NAME  
AUL15  
AUL14  
AUL13  
AUL12  
AUL11  
AUL10  
AUL9  
AUL8  
AUL7  
AUL6  
AUL5  
AUL4  
AUL3  
AUL2  
AUL1  
AUL0  
POR  
VALUE  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
BUS OVERVIEW  
The INA226 offers compatibility with both I2C and SMBus interfaces. The I2C and SMBus protocols are  
essentially compatible with one another.  
The I2C interface is used throughout this data sheet as the primary example, with SMBus protocol specified only  
when a difference between the two systems is discussed. Two bidirectional lines, SCL and SDA, connect the  
INA226 to the bus. Both SCL and SDA are open-drain connections.  
The device that initiates a data transfer is called a master, and the devices controlled by the master are slaves.  
The bus must be controlled by a master device that generates the serial clock (SCL), controls the bus access,  
and generates START and STOP conditions.  
To address a specific device, the master initiates a start condition by pulling the data signal line (SDA) from a  
high to a low logic level while SCL is high. All slaves on the bus shift in the slave address byte on the rising edge  
of SCL, with the last bit indicating whether a read or write operation is intended. During the ninth clock pulse, the  
slave being addressed responds to the master by generating an Acknowledge and pulling SDA low.  
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Data transfer is then initiated and eight bits of data are sent, followed by an Acknowledge bit. During data  
transfer, SDA must remain stable while SCL is high. Any change in SDA while SCL is high is interpreted as a  
start or stop condition.  
Once all data have been transferred, the master generates a stop condition, indicated by pulling SDA from low to  
high while SCL is high. The INA226 includes a 28ms timeout on its interface to prevent locking up the bus.  
Serial Bus Address  
To communicate with the INA226, the master must first address slave devices via a slave address byte. The  
slave address byte consists of seven address bits and a direction bit that indicates whether the action is to be a  
read or write operation.  
The INA226 has two address pins, A0 and A1. Table 7 describes the pin logic levels for each of the 16 possible  
addresses. The state of pins A0 and A1 is sampled on every bus communication and should be set before any  
activity on the interface occurs.  
Table 7. INA226 Address Pins and  
Slave Addresses  
A1  
A0  
SLAVE ADDRESS  
1000000  
1000001  
1000010  
1000011  
1000100  
1000101  
1000110  
1000111  
1001000  
1001001  
1001010  
1001011  
1001100  
1001101  
1001110  
1001111  
GND  
GND  
GND  
GND  
VS+  
GND  
VS+  
SDA  
SCL  
GND  
VS+  
VS+  
VS+  
SDA  
SCL  
GND  
VS+  
VS+  
SDA  
SDA  
SDA  
SDA  
SCL  
SCL  
SCL  
SCL  
SDA  
SCL  
GND  
VS+  
SDA  
SCL  
Serial Interface  
The INA226 operates only as a slave device on both the I2C bus and the SMBus. Connections to the bus are  
made via the open-drain I/O lines SDA and SCL. The SDA and SCL pins feature integrated spike suppression  
filters and Schmitt triggers to minimize the effects of input spikes and bus noise. While there is spike suppression  
integrated into the digital I/O lines, proper layout should be used to minimize the amount of coupling into the  
communication lines. This noise introduction could occur from capacitively coupling signal edges between the  
two communication lines themselves or from other switching noise sources present in the system. Routing traces  
in parallel with ground in between layers on a printed circuit board (PCB) typically reduces the effects of coupling  
between the communication lines. Shielding communication lines in general is recommended to reduce to  
possibility of unintended noise coupling into the digital I/O lines that could be incorrectly interpreted as start or  
stop commands.  
The INA226 supports the transmission protocol for Fast (1kHz to 400kHz) and High-speed (1kHz to 3.4MHz)  
modes. All data bytes are transmitted most significant byte first.  
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WRITING TO/READING FROM THE INA226  
Accessing a specific register on the INA226 is accomplished by writing the appropriate value to the register  
pointer. Refer to Table 2 for a complete list of registers and corresponding addresses. The value for the register  
pointer (as shown in Figure 27) is the first byte transferred after the slave address byte with the R/W bit low.  
Every write operation to the INA226 requires a value for the register pointer.  
Writing to a register begins with the first byte transmitted by the master. This byte is the slave address, with the  
R/W bit low. The INA226 then acknowledges receipt of a valid address. The next byte transmitted by the master  
is the address of the register which data will be written to. This register address value updates the register  
pointer to the desired register. The next two bytes are written to the register addressed by the register pointer.  
The INA226 acknowledges receipt of each data byte. The master may terminate data transfer by generating a  
start or stop condition.  
When reading from the INA226, the last value stored in the register pointer by a write operation determines  
which register is read during a read operation. To change the register pointer for a read operation, a new value  
must be written to the register pointer. This write is accomplished by issuing a slave address byte with the R/W  
bit low, followed by the register pointer byte. No additional data are required. The master then generates a start  
condition and sends the slave address byte with the R/W bit high to initiate the read command. The next byte is  
transmitted by the slave and is the most significant byte of the register indicated by the register pointer. This byte  
is followed by an Acknowledge from the master; then the slave transmits the least significant byte. The master  
acknowledges receipt of the data byte. The master may terminate data transfer by generating a  
Not-Acknowledge after receiving any data byte, or generating a start or stop condition. If repeated reads from the  
same register are desired, it is not necessary to continually send the register pointer bytes; the INA226 retains  
the register pointer value until it is changed by the next write operation.  
Figure 24 and Figure 25 show the write and read operation timing diagrams, respectively. Note that register  
bytes are sent most-significant byte first, followed by the least significant byte.  
1
9
1
9
1
9
1
9
SCL  
D15 D14 D13 D12 D11 D10 D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
SDA  
1
0
0
A3  
A2  
A1  
A0  
R/W  
P7  
P6  
P5  
P4  
P3  
P2  
P1  
P0  
ACK By  
ACK By  
Stop By  
Master  
Start By  
Master  
ACK By  
ACK By  
INA226  
INA226  
INA226  
INA226  
Frame 1 Two-Wire Slave Address Byte(1)  
Frame 2 Register Pointer Byte  
Frame 3 Data MSByte  
Frame 4 Data LSByte  
(1) The value of the Slave Address byte is determined by the settings of the A0 and A1 pins. Refer to Table 7.  
Figure 24. Timing Diagram for Write Word Format  
1
9
1
9
1
9
SCL  
SDA  
D7 D6  
D5  
D4  
D3  
D2  
D1  
D0  
1
0
0
A3  
A2  
A1  
A0  
R/W  
D15 D14 D13 D12 D11 D10 D9  
D8  
From  
No ACK By(3) Stop  
Master  
From  
Start By  
Master  
ACK By  
ACK By  
Master  
INA226  
INA226  
INA226  
Frame 1 Two-Wire Slave Address Byte(1)  
Frame 2 Data MSByte(2)  
Frame 3 Data LSByte(2)  
(1) The value of the Slave Address byte is determined by the settings of the A0 and A1 pins. Refer to Table 7.  
(2) Read data is from the last register pointer location. If a new register is desired, the register pointer must be updated.  
See Figure 23.  
(3) ACK by Master can also be sent.  
Figure 25. Timing Diagram for Read Word Format  
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Figure 26 shows the timing diagram for the SMBus Alert response operation. Figure 27 illustrates a typical  
register pointer configuration.  
ALERT  
1
9
1
9
SCL  
SDA  
0
0
0
1
1
0
0
R/W  
1
0
0
A3  
A2  
A1  
A0  
0
Start By  
Master  
ACK By  
From  
INA226  
NACK By Stop By  
INA226  
Master  
Master  
Frame 1 SMBus ALERT Response Address Byte  
Frame 2 Slave Address Byte(1)  
(1) The value of the Slave Address Byte is determined by the settings of the A0 and A1 pins. Refer to Table 7.  
Figure 26. Timing Diagram for SMBus ALERT  
1
9
1
9
SCL  
SDA  
¼
1
0
0
A3  
A2  
A1  
A0 R/W  
P7  
P6  
P5  
P4  
P3  
P2  
P1  
P0  
Stop  
Start By  
Master  
ACK By  
ACK By  
INA226  
INA226  
Frame 1 Two-Wire Slave Address Byte(1)  
Frame 2 Register Pointer Byte  
(1) The value of the Slave Address Byte is determined by the settings of the A0 and A1 pins. Refer to Table 7.  
Figure 27. Typical Register Pointer Set  
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High-Speed I2C Mode  
When the bus is idle, both the SDA and SCL lines are pulled high by the pull-up devices. The master generates  
a start condition followed by a valid serial byte containing High-Speed (HS) master code 00001XXX. This  
transmission is made in fast (400kHz) or standard (100kHz) (F/S) mode at no more than 400kHz. The INA226  
does not acknowledge the HS master code, but does recognize it and switches its internal filters to support  
3.4MHz operation.  
The master then generates a repeated start condition (a repeated start condition has the same timing as the start  
condition). After this repeated start condition, the protocol is the same as F/S mode, except that transmission  
speeds up to 3.4MHz are allowed. Instead of using a stop condition, repeated start conditions should be used to  
secure the bus in HS-mode. A stop condition ends the HS-mode and switches all the internal filters of the  
INA226 to support the F/S mode.  
t(LOW)  
tF  
tR  
t(HDSTA)  
SCL  
SDA  
t(SUSTO)  
t(HDSTA)  
t(HIGH) t(SUSTA)  
t(HDDAT)  
t(SUDAT)  
t(BUF)  
S
P
P
S
Figure 28. Bus Timing Diagram  
Bus Timing Diagram Definitions  
FAST MODE  
HIGH-SPEED MODE  
PARAMETER  
MIN  
MAX  
MIN  
MAX  
UNITS  
SCL operating frequency  
f(SCL)  
t(BUF)  
0.001  
0.4  
0.001  
3.4  
MHz  
Bus free time between stop and start  
conditions  
600  
100  
160  
100  
ns  
Hold time after repeated START condition.  
t(HDSTA)  
ns  
After this period, the first clock is generated.  
Repeated start condition setup time  
STOP condition setup time  
Data hold time  
t(SUSTA)  
t(SUSTO)  
t(HDDAT)  
t(SUDAT)  
t(LOW)  
t(HIGH)  
tF  
100  
100  
0
100  
100  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Data setup time  
100  
1300  
600  
10  
SCL clock low period  
160  
60  
SCL clock high period  
Clock/data fall time  
300  
300  
160  
160  
Clock/data rise time  
tR  
Clock/data rise time for SCLK 100kHz  
tR  
1000  
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SMBus Alert Response  
The INA226 is designed to respond to the SMBus Alert Response address. The SMBus Alert Response provides  
a quick fault identification for simple slave devices. When an Alert occurs, the master can broadcast the Alert  
Response slave address (0001 100) with the Read/Write bit set high. Following this Alert Response, any slave  
devices that generated an alert will identify themselves by acknowledging the Alert Response and sending their  
respective address on the bus.  
The Alert Response can activate several different slave devices simultaneously, similar to the I2C General Call. If  
more than one slave attempts to respond, bus arbitration rules apply. The losing device does not generate an  
Acknowledge and continues to hold the Alert line low until the interrupt is cleared.  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
INA226AIDGSR  
INA226AIDGST  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
VSSOP  
VSSOP  
DGS  
10  
10  
2500  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
226  
226  
ACTIVE  
DGS  
250  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
-40 to 125  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-Nov-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
INA226AIDGSR  
INA226AIDGST  
VSSOP  
VSSOP  
DGS  
DGS  
10  
10  
2500  
250  
330.0  
330.0  
12.4  
12.4  
5.3  
5.3  
3.4  
3.4  
1.4  
1.4  
8.0  
8.0  
12.0  
12.0  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-Nov-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
INA226AIDGSR  
INA226AIDGST  
VSSOP  
VSSOP  
DGS  
DGS  
10  
10  
2500  
250  
366.0  
366.0  
364.0  
364.0  
50.0  
50.0  
Pack Materials-Page 2  
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