INA326IDGKR [TI]

INSTRUMENTATION AMPLIFIER, PDSO8, PLASTIC, MSOP-8;
INA326IDGKR
型号: INA326IDGKR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

INSTRUMENTATION AMPLIFIER, PDSO8, PLASTIC, MSOP-8

放大器 光电二极管
文件: 总24页 (文件大小:1005K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INA326  
INA327  
I
N
A
I
N
A
3
2
6
3
2
7
SBOS222D – NOVEMBER 2001 – REVISED NOVEMBER 2004  
Precision, Rail-to-Rail I/O  
INSTRUMENTATION AMPLIFIER  
FEATURES  
DESCRIPTION  
The INA326 and INA327 (with shutdown) are high-perfor-  
PRECISION  
mance, low-cost, precision instrumentation amplifiers with  
rail-to-rail input and output. They are true single-supply  
instrumentation amplifiers with very low DC errors and input  
common-mode ranges that extends beyond the positive and  
negative rails. These features make them suitable for appli-  
cations ranging from general-purpose to high-accuracy.  
LOW OFFSET: 100µV (max)  
LOW OFFSET DRIFT: 0.4µV/°C (max)  
EXCELLENT LONG-TERM STABILITY  
VERY-LOW 1/f NOISE  
TRUE RAIL-TO-RAIL I/O  
Excellent long-term stability and very low 1/f noise assure  
low offset voltage and drift throughout the life of the product.  
INPUT COMMON-MODE RANGE:  
20mV Below Negative Rail to 100mV Above  
Positive Rail  
The INA326 (without shutdown) comes in the MSOP-8 pack-  
age. The INA327 (with shutdown) is offered in an MSOP-10.  
Both are specified over the industrial temperature range,  
–40°C to +85°C, with operation from –40°C to +125°C.  
WIDE OUTPUT SWING: Within 10mV of Rails  
SUPPLY RANGE: Single +2.7V to +5.5V  
SMALL SIZE  
microPACKAGE: MSOP-8, MSOP-10  
INA326 AND INA327 RELATED PRODUCTS  
LOW COST  
PRODUCT FEATURES  
INA337  
INA114  
INA118  
INA122  
INA128  
INA321  
Precision, 0.4µV/°C Drift, Specified –40°C to +125°C  
50µV VOS, 0.5nA IB, 115dB CMR, 3mA IQ, 0.25µV/°C Drift  
50µV VOS, 1nA IB, 120dB CMR, 385µA IQ, 0.5µV/°C Drift  
250µV VOS, –10nA IB, 85µA IQ, Rail-to-Rail Output, 3µV/°C Drift  
50µV VOS, 2nA IB, 125dB CMR, 750µA IQ, 0.5µV/°C Drift  
500µV VOS, 0.5pA IB, 94dB CMRR, 60µA IQ, Rail-to-Rail Output  
APPLICATIONS  
LOW-LEVEL TRANSDUCER AMPLIFIER FOR  
BRIDGES, LOAD CELLS, THERMOCOUPLES  
WIDE DYNAMIC RANGE SENSOR  
MEASUREMENTS  
V+  
V−  
HIGH-RESOLUTION TEST SYSTEMS  
WEIGH SCALES  
7
2
1
VIN  
4
MULTI-CHANNEL DATA ACQUISITION  
6
VO  
SYSTEMS  
R1  
INA326  
8
3
MEDICAL INSTRUMENTATION  
GENERAL-PURPOSE  
5
G = 2(R2/R1)  
VIN+  
R2  
C2  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2001-2004, Texas Instruments Incorporated  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
www.ti.com  
PACKAGE/ORDERING INFORMATION(1)  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESIGNATOR  
PACKAGE  
MARKING  
ORDERING  
NUMBER  
TRANSPORT  
MEDIA, QUANTITY  
PRODUCT  
PACKAGE-LEAD  
INA326  
MSOP-8  
DGK  
40°C to +85°C  
B26  
INA326EA/250  
INA326EA/2K5  
Tape and Reel, 250  
Tape and Reel, 2500  
"
"
"
"
"
INA327  
MSOP-10  
DGS  
40°C to +85°C  
B27  
INA327EA/250  
INA327EA/2K5  
Tape and Reel, 250  
Tape and Reel, 2500  
"
"
"
"
"
NOTE: (1) For the most current package and ordering information, download the latest version of this data sheet and see the Package Option Addendum located  
at the end of the data sheet.  
ABSOLUTE MAXIMUM RATINGS(1)  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
Supply Voltage .................................................................................. +5.5V  
Signal Input Terminals: Voltage(2) ..............................0.5V to (V+) + 0.5V  
Current(2) ................................................... ±10mA  
This integrated circuit can be damaged by ESD. Texas  
Instruments recommends that all integrated circuits be handled  
with appropriate precautions. Failure to observe proper han-  
dling and installation procedures can cause damage.  
Output Short-Circuit ................................................................. Continuous  
Operating Temperature Range ....................................... 40°C to +125°C  
Storage Temperature Range .......................................... 65°C to +150°C  
Junction Temperature .................................................................... +150°C  
Lead Temperature (soldering, 10s) ............................................... +300°C  
ESD damage can range from subtle performance degrada-  
tion to complete device failure. Precision integrated circuits  
may be more susceptible to damage because very small  
parametric changes could cause the device not to meet its  
published specifications.  
NOTES: (1) Stresses above these ratings may cause permanent damage.  
Exposure to absolute maximum conditions for extended periods may degrade  
device reliability. These are stress ratings only, and functional operation of the  
device at these or any other conditions beyond those specified is not implied.  
(2)Inputterminalsarediodeclampedtothepower-supplyrails. Inputsignalsthat  
can swing more than 0.5V beyond the supply rails should be current limited to  
10mA or less.  
PIN CONFIGURATION  
Top View  
INA326  
INA327  
R1  
V+  
VO  
R2  
R1  
VIN−  
VIN+  
V−  
1
2
3
4
8
7
6
5
R1  
R1  
1
2
3
4
5
10  
9
V+  
VIN  
VIN+  
VO  
8
R2  
V  
7
Enable  
(Connect to V+)  
6
MSOP- 8  
MSOP- 10  
INA326, INA327  
2
SBOS222D  
www.ti.com  
ELECTRICAL CHARACTERISTICS: VS = +2.7V to +5.5V  
BOLDFACE limits apply over the specified temperature range, TA = 40°C to +85°C  
At TA = +25°C, RL = 10k, G = 100 (R1 = 2k, R2 = 100k), external gain set resistors, and IACOMMON = VS /2, with external equivalent filter corner of 1kHz, unless  
otherwise noted.  
INA326EA, INA327EA  
PARAMETER  
CONDITION  
MIN  
TYP  
MAX  
UNITS  
INPUT  
Offset Voltage, RTI  
Over Temperature  
vs Temperature  
vs Power Supply  
Long-Term Stability  
Input Impedance, Differential  
Common-Mode  
Input Voltage Range  
Safe Input Voltage  
VOS  
VS = +5V, VCM = VS /2  
±20  
±100  
±124  
±0.4  
µV  
µV  
µV/°C  
µV/V  
dVOS/dT  
±0.1  
±3  
See Note (1)  
1010 || 2  
1010 || 14  
PSR  
VS = +2.7V to +5.5V, VCM = VS /2  
±20  
|| pF  
|| pF  
V
V
dB  
(V) 0.02  
(V) 0.5  
100  
(V+) + 0.1  
(V+) + 0.5  
Common-Mode Rejection  
Over Temperature  
CMR VS = +5V, VCM = (V) 0.02V to (V+) + 0.1V  
114  
94  
dB  
INPUT BIAS CURRENT  
Bias Current  
vs Temperature  
Offset Current  
VCM = VS /2  
VS = +5V  
IB  
±0.2  
±2  
nA  
nA  
See Typical Characteristics  
IOS  
VS = +5V  
±0.2  
±2  
NOISE  
Voltage Noise, RTI  
f = 10Hz  
RS = 0, G = 100, R1 = 2k, R2 = 100kΩ  
RS = 0, G = 10, R1 = 20k, R2 = 100kΩ  
Hz  
Hz  
Hz  
33  
33  
33  
0.8  
nV/  
nV/  
nV/  
f = 100Hz  
f = 1kHz  
f = 0.01Hz to 10Hz  
Voltage Noise, RTI  
f = 10Hz  
µVp-p  
Hz  
Hz  
Hz  
120  
97  
97  
4
nV/  
nV/  
nV/  
f = 100Hz  
f = 1kHz  
f = 0.01Hz to 10Hz  
Current Noise, RTI  
f = 1kHz  
f = 0.01Hz to 10Hz  
Output Ripple, VO Filtered(2)  
µVp-p  
Hz  
0.15  
4.2  
pA/  
pAp-p  
See Applications Information  
GAIN  
Gain Equation  
Range of Gain  
Gain Error(3)  
vs Temperature  
Nonlinearity  
G = 2(R2/R1)  
< 0.1  
> 10000  
±0.2  
±25  
V/V  
%
ppm/°C  
% of FS  
G = 10, 100, VS = +5V, VO = 0.075V to 4.925V  
G = 10, 100, VS = +5V, VO = 0.075V to 4.925V  
G = 10, 100, VS = +5V, VO = 0.075V to 4.925V  
±0.08  
±6  
±0.004  
±0.01  
OUTPUT  
Voltage Output Swing from Rail  
RL = 100kΩ  
RL = 10k, VS = +5V  
5
10  
mV  
mV  
mV  
pF  
75  
75  
Over Temperature  
Capacitive Load Drive  
Short-Circuit Current  
500  
±25  
ISC  
mA  
INTERNAL OSCILLATOR  
Frequency of Auto-Correction  
Accuracy  
90  
±20  
kHz  
%
FREQUENCY RESPONSE  
Bandwidth(4), 3dB  
Slew Rate(4)  
BW  
SR  
G = 1 to 1k  
VS = +5V, All Gains, CL = 100pF  
1
kHz  
Filter Limited  
Settling Time(4), 0.1%  
0.01%  
0.1%  
0.01%  
Overload Recovery(4)  
tS 1kHz Filter, G = 1 to 1k, VO = 2V step, CL = 100pF  
0.95  
1.3  
130  
160  
30  
ms  
ms  
µs  
µs  
µs  
µs  
10kHz Filter, G = 1 to 1k, VO = 2V step, CL = 100pF  
1kHz Filter, 50% Output Overload, G = 1 to 1k  
10kHz Filter, 50% Output Overload, G = 1 to 1k  
5
INA326, INA327  
3
SBOS222D  
www.ti.com  
ELECTRICAL CHARACTERISTICS: VS = +2.7V to +5.5V (Cont.)  
BOLDFACE limits apply over the specified temperature range, TA = 40°C to +85°C  
At TA = +25°C, RL = 10k, G = 100 (R1 = 2k, R2 = 100k), external gain set resistors, and IACOMMON = VS /2, with external equivalent filter corner of 1kHz, unless  
otherwise noted.  
INA326EA, INA327EA  
PARAMETER  
CONDITION  
MIN  
TYP  
MAX  
UNITS  
POWER SUPPLY  
Specified Voltage Range  
Quiescent Current  
Over Temperature  
+2.7  
+5.5  
3.4  
3.7  
V
mA  
mA  
IQ  
IO = 0, Diff VIN = 0V, VS = +5V  
2.4  
SHUTDOWN  
Disable (Logic Low Threshold)  
Enable (Logic High Threshold)  
Enable Time(5)  
Disable Time  
Shutdown Current and Enable Pin Current  
0.25  
V
V
µs  
µs  
µA  
1.6  
75  
100  
2
VS = +5V, Disabled  
5
TEMPERATURE RANGE  
Specified Range  
Operating Range  
Storage Range  
40  
40  
65  
+85  
+125  
+150  
°C  
°C  
°C  
Thermal Resistance  
θJA  
MSOP-8, MSOP-10 Surface-Mount  
150  
°C/W  
NOTES: (1) 1000-hour life test at 150°C demonstrated randomly distributed variation in the range of measurement limitsapproximately 10µV. (2) See Applications  
Information section, and Figures 1 and 3. (3) Does not include error and TCR of external gain-setting resistors. (4) Dynamic response is limited by filtering. Higher  
bandwidths can be achieved by adjusting the filter. (5) See Typical Characteristics, Input Offset Voltage vs Warm-Up Time.  
INA326, INA327  
4
SBOS222D  
www.ti.com  
TYPICAL CHARACTERISTICS  
At TA = 25°C, VS = +5V, Gain = 100, and RL = 10kwith external equivalent filter corner of 1kHz, unless otherwise noted.  
GAIN vs FREQUENCY  
1kHz FILTER  
GAIN vs FREQUENCY  
10kHz FILTER  
80  
60  
80  
60  
G = 1k  
G = 1k  
40  
40  
G = 100  
G = 10  
G = 1  
G = 100  
G = 10  
G = 1  
20  
20  
0
0
20  
40  
20  
40  
10  
100  
1k  
10k  
100k  
1M  
10  
10  
1
100  
1k  
10k  
100k  
1M  
1M  
10k  
Frequency (Hz)  
Frequency (Hz)  
COMMON- MODE REJECTION vs FREQUENCY  
1kHz FILTER  
COMMON- MODE REJECTION vs FREQUENCY  
10kHz FILTER  
160  
140  
120  
100  
80  
160  
140  
120  
100  
80  
G = 1k  
G = 100  
G = 1k  
G = 10  
G = 1  
G = 100  
60  
60  
G = 1  
G = 10  
40  
40  
20  
20  
10  
100  
1k  
10k  
100k  
1M  
100  
1k  
10k  
100k  
Frequency (Hz)  
Frequency (Hz)  
INPUT- REFERRED VOLTAGE NOISE AND  
INPUT BIAS CURRENT NOISE vs FREQUENCY  
10kHz FILTER  
POWER- SUPPLY REJECTION vs FREQUENCY  
G = 100, 1k  
120  
100  
80  
60  
40  
20  
0
10k  
1k  
1
Current Noise  
(all gains)  
G = 10  
G = 1  
0.1  
G = 1  
G = 10  
100  
10  
0.01  
0.001  
Filter Frequency  
10kHz  
G = 100  
G = 1000  
1kHz  
10  
100  
1k  
10k  
100k  
10  
100  
1k  
Frequency (Hz)  
Frequency (Hz)  
INA326, INA327  
5
SBOS222D  
www.ti.com  
TYPICAL CHARACTERISTICS (Cont.)  
At TA = 25°C, VS = +5V, Gain = 100, and RL = 10kwith external equivalent filter corner of 1kHz, unless otherwise noted.  
INPUT OFFSET VOLTAGE vs TURN- ON TIME  
1kHz FILTER, G = 100  
INPUT OFFSET VOLTAGE vs WARM- UP TIME  
10kHz FILTER, G = 100  
Filter  
Settling  
Time  
Device  
Turn- On  
Time  
Filter  
Settling  
Time  
Device  
Turn- On  
Time  
(75µs)  
0
1
2
0
0.1  
0.2  
0.3  
0.4  
Turn- On Time (ms)  
Warm- Up Time (ms)  
SMALL- SIGNAL RESPONSE  
G = 1, 10, AND 100  
SMALL- SIGNAL STEP RESPONSE  
G = 1000  
1kHz Filter  
10kHz Filter  
500µs/div  
500µs/div  
LARGE- SIGNAL RESPONSE  
G = 1 TO 1000  
0.01Hz TO 10Hz VOLTAGE NOISE  
1kHz Filter  
10kHz Filter  
10s/div  
500µs/div  
INA326, INA327  
6
SBOS222D  
www.ti.com  
TYPICAL CHARACTERISTICS (Cont.)  
At TA = 25°C, VS = +5V, Gain = 100, and RL = 10kwith external equivalent filter corner of 1kHz, unless otherwise noted.  
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION  
G = 1  
OFFSET VOLTAGE PRODUCTION DISTRIBUTION  
G = 1  
Offset Voltage Drift (µV/°C)  
Offset Voltage (µV)  
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION  
G = 10  
OFFSET VOLTAGE PRODUCTION DISTRIBUTION  
G = 10  
Offset Voltage Drift (µV/°C)  
Offset Voltage (µV)  
OFFSET VOLTAGE PRODUCTION DISTRIBUTION  
G = 100, 1000  
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION  
G = 100, 1000  
Offset Voltage (µV)  
Offset Voltage Drift (µV/°C)  
INA326, INA327  
7
SBOS222D  
www.ti.com  
TYPICAL CHARACTERISTICS (Cont.)  
At TA = 25°C, VS = +5V, Gain = 100, and RL = 10kwith external equivalent filter corner of 1kHz, unless otherwise noted.  
GAIN ERROR PRODUCTION DISTRIBUTION  
G = 100  
INPUT- REFERRED RIPPLE SPECTRUM  
G = 100  
100  
110  
120  
130  
140  
150  
160  
170  
180  
100.000  
31.600  
1.000  
0.316  
0.100  
0.030  
0.010  
0.003  
0.001  
0
200k  
400k  
600k  
800k  
1M  
Frequency (Hz)  
Gain Error (m%)  
QUIESCENT CURRENT vs TEMPERATURE  
VS = +5V  
INPUT BIAS CURRENT vs TEMPERATURE  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
2.0  
1.5  
1.0  
IB  
0.5  
VS = +2.7V  
0
0.5  
1.0  
1.5  
2.0  
IB+  
25  
Temperature (°C)  
25  
Temperature (°C)  
50  
25  
0
50  
75  
100  
125  
50  
25  
0
50  
75  
100  
125  
INA326, INA327  
8
SBOS222D  
www.ti.com  
SETTING THE GAIN  
APPLICATIONS INFORMATION  
The INA326 is a 2-stage amplifier with each stage gain set  
by R1 and R2, respectively (see Figure 5, Inside the INA326,  
for details). Overall gain is described by the equation:  
Figure 1 shows the basic connections required for operation of  
the INA326. A 0.1µF capacitor, placed close to and across the  
power-supply pins is strongly recommended for highest accu-  
racy. RoCo is an output filter that minimizes auto-correction  
circuitry noise. This output filter may also serve as an anti-  
aliasing filter ahead of an Analog-to-Digital (A/D) converter. It  
is also optional based on desired precision.  
R2  
G = 2  
(1)  
R1  
The stability and temperature drift of the external gain-setting  
resistors will affect gain by an amount that can be directly  
inferred from the gain equation (1).  
The output reference terminal is taken at the low side of R2  
(IACOMMON).  
Resistor values for commonly used gains are shown in  
Figure 1. Gain-set resistor values for best performance are  
different for +5V single-supply and for ±2.5V dual-supply  
operation. Optimum value for R1 can be calculated by:  
The INA326 uses a unique internal topology to achieve excel-  
lent Common-Mode Rejection (CMR). Unlike conventional  
instrumentation amplifiers, CMR is not affected by resistance  
in the reference connections or sockets. See Inside the  
INA326for further detail. To achieve best high-frequency  
CMR, minimize capacitance on pins 1 and 8.  
R1 = VIN, MAX/12.5µA  
(2)  
where R1 must be no less than 2k.  
+2.5V  
7
2.5V  
DESIRED  
GAIN  
R1  
()  
R2 || C2  
(|| nF)  
0.1µF  
0.1  
0.2  
0.5  
1
400k  
400k  
400k  
200k  
100k  
40k  
20k  
10k  
4k  
20k || 5  
40k || 2.5  
100k || 1  
100k || 1  
100k || 1  
100k || 1  
100k || 1  
100k || 1  
100k || 1  
100k || 1  
200k || 0.5  
500k || 0.2  
1M || 0.1  
2M || 0.05  
5M || 0.02  
10M || 0.01  
2
1
VIN−  
RO  
100Ω  
4
5
VO  
6
VO Filtered  
R1  
INA326  
2
(1)  
8
3
CO  
1µF  
5
G = 2(R2/R1)  
10  
VIN+  
f
O = 1kHz  
20  
50  
(1)  
R2  
C2  
100  
200  
500  
1000  
2000  
5000  
10000  
2k  
2k  
(2)  
2k  
IACOMMON  
2k  
2k  
(1) C2 and CO combine to form a 2-pole response that is 3dB at 1kHz.  
Each individual pole is at 1.5kHz.  
(2) Output voltage is referenced to IACOMMON (see text).  
2k  
2k  
Single-supply operation may require  
R2 > 100kfor full output swing.  
This may produce higher input referred  
V+  
DESIRED  
GAIN  
R1  
()  
R2 || C2  
(|| nF)  
0.1µF  
offset voltage. See Offset Voltage,  
Drift, and Circuit Values for detail.  
0.1  
0.2  
0.5  
1
400k  
400k  
400k  
400k  
200k  
80k  
40k  
20k  
8k  
20k || 5  
7
2
1
VIN  
40k || 2.5  
100k || 1  
RO  
4
VO  
100Ω  
200k || 0.5  
200k || 0.5  
200k || 0.5  
200k || 0.5  
200k || 0.5  
200k || 0.5  
200k || 0.5  
200k || 0.5  
500k || 0.2  
1M || 0.1  
6
VO Filtered  
R1  
INA326  
2
(1)  
8
3
CO  
1µF  
5
5
G = 2(R2/R1)  
O = 1kHz  
10  
VIN+  
f
(3)  
20  
50  
(1)  
R2  
C2  
100  
200  
500  
1000  
2000  
5000  
10000  
4k  
2k  
(2)  
IACOMMON  
2k  
2k  
2k  
2M || 0.05  
5M || 0.02  
10M || 0.01  
(1) C2 and CO combine to form a 2-pole response that is 3dB at 1kHz.  
Each individual pole is at 1.5kHz.  
(2) Output voltage is referenced to IACOMMON (see text).  
(3) Output offset voltage required for measurement near zero (see Figure 28).  
2k  
2k  
NOTES: (1) C2 and CO combine to form a 2-pole response that is 3dB at 1kHz. Each individual pole is at 1.5kHz. (2) Output voltage is referenced to  
IACOMMON (see text). (3) Output offset voltage required for measurement near zero (see Figure 6).  
FIGURE 1. Basic Connections. NOTE: Connections for INA327 differsee Pin Configuration for detail.  
INA326, INA327  
9
SBOS222D  
www.ti.com  
Following this design procedure for R1 produces the maximum  
possible input stage gain for best accuracy and lowest noise.  
The enable time following shutdown is 75µs plus the settling  
time due to filters (see Typical Characteristics, Input Offset  
Voltage vs Warm-up Time). Disable time is 100µs. This  
allows the INA327 to be operated as a gatedamplifier, or  
to have its output multiplexed onto a common output bus.  
When disabled, the output assumes a high-impedance state.  
Circuit layout and supply bypassing can affect performance.  
Minimize the stray capacitance on pins 1 and 8. Use recom-  
mended supply bypassing, including a capacitor directly from  
pin 7 to pin 4 (V+ to V), even with dual (split) power supplies  
(see Figure 1).  
INA327 PIN 5  
OFFSET VOLTAGE, DRIFT, AND CIRCUIT VALUES  
Pin 5 of the INA327 should be connected to V+ to ensure  
proper operation.  
As with other multi-stage instrumentation amplifiers, input-  
referred offset voltage depends on gain and circuit values. The  
specified offset and drift performance is rated at R1 = 2k,  
R2 = 100k, and VS = ±2.5V. Offset voltage and drift for other  
circuit values can be estimated from the following equations:  
DYNAMIC PERFORMANCE  
The typical characteristic Gain vs Frequencyshows that the  
INA326 has nearly constant bandwidth regardless of gain.  
This results from the bandwidth limiting from the recom-  
mended filters.  
VOS = 10µV + (50nA)(R2)/G  
(3)  
(4)  
dVOS/dT = 0.12µV/°C + (0.16nA/°C)(R2)/G  
These equations might imply that offset and drift can be  
minimized by making the value of R2 much lower than the  
values indicated in Figure 1. These values, however, have  
been chosen to assure that the output current into R2 is kept  
less than or equal to ±25µA, while maintaining R1s value  
greater than or equal to 2k. Some applications with limited  
output voltage swing or low power-supply voltage may allow  
lower values for R2, thus providing lower input-referred offset  
voltage and offset voltage drift.  
NOISE PERFORMANCE  
Internal auto-correction circuitry eliminates virtually all 1/f  
noise (noise that increases at low frequency) in gains of 100  
or greater. Noise performance is affected by gain-setting  
resistor values. Follow recommendations in the Setting  
Gainsection for best performance.  
Total noise is a combination of input stage noise and output  
stage noise. When referred to the input, the total mid-band  
noise is:  
Conversely, single-supply operation with R2 grounded re-  
quires that R2 values be made larger to assure that current  
remains under 25µA. This will increase the input-referred  
offset voltage and offset voltage drift.  
800nV / Hz  
VN = 33nV / Hz +  
(5)  
G
The output noise has some 1/f components that affect  
performance in gains less than 10. See typical characteristic  
Input-Referred Voltage Noise vs Frequency.”  
Circuit conditions that cause more than 25µA to flow in R2 will  
not cause damage, but may produce more nonlinearity.  
High-frequency noise is created by internal auto-correction  
circuitry and is highly dependent on the filter characteristics  
chosen. This may be the dominant source of noise visible  
when viewing the output on an oscilloscope. Low cutoff  
frequency filters will provide lowest noise. Figure 3 shows the  
typical noise performance as a function of cutoff frequency.  
INA327 ENABLE FUNCTION  
The INA327 adds an enable/shutdown function to the INA326.  
Its pinout differs from the INA326see the Pin Configuration  
for detail.  
The INA327 can be enabled by applying a logic HIGH  
voltage level to the Enable pin. Conversely, a logic LOW  
voltage level will disable the amplifier, reducing its supply  
current from 2.4mA to typically 2µA. For battery-operated  
applications, this feature may be used to greatly reduce the  
average current and extend battery life. This pin should be  
connected to a valid high or low voltage or driven, not left  
open circuit. The Enable pin can be modeled as a CMOS  
input gate as in Figure 2.  
1k  
G = 1000  
100  
G = 100  
10  
V+  
G = 10  
G = 1  
10  
Required Filter Cutoff Frequency (Hz)  
1
2µA  
1
100  
1k  
10k  
Enable  
6
FIGURE 3. Total Output Noise vs Required Filter Cutoff  
Frequency.  
FIGURE 2. Enable Pin Model.  
10  
INA326, INA327  
SBOS222D  
www.ti.com  
Applications sensitive to the spectral characteristics of high-  
frequency noise may require consideration of the spurious  
frequencies generated by internal clocking circuitry. Spurs”  
occur at approximately 90kHz and its harmonics (see typical  
characteristic Input-Referred Ripple Spectrum) which may  
be reduced by additional filtering below 1kHz.  
Thermocouple  
INA326  
5
Insufficient filtering at pin 5 can cause nonlinearity with large  
output voltage swings (very near the supply rails). Noise  
must be sufficiently filtered at pin 5 so that noise peaks do not  
hit the railand change the average value of the signal.  
Figure 3 shows guidelines for filter cutoff frequency.  
FIGURE 4. Providing Input Bias Current Return Path.  
HIGH-FREQUENCY NOISE  
INPUT PROTECTION  
C2 and CO form filters to reduce internally generated auto-  
correction circuitry noise. Filter frequencies can be chosen to  
optimize the trade-off between noise and frequency re-  
sponse of the application, as shown in Figure 3. The cutoff  
frequencies of the filters are generally set to the same  
frequency. Figure 3 shows the typical output noise for four  
gains as a function of the 3dB cutoff frequency of each filter  
response. Small signals may exhibit the addition of internally  
generated auto-correction circuitry noise at the output. This  
noise, combined with broadband noise, becomes most evi-  
dent in higher gains with filters of wider bandwidth.  
The inputs of the INA326 are protected with internal diodes  
connected to the power-supply rails. These diodes will clamp  
the applied signal to prevent it from damaging the input  
circuitry. If the input signal voltage can exceed the power  
supplies by more than 0.5V, the input signal current should  
be limited to less than 10mA to protect the internal clamp  
diodes. This can generally be done with a series input  
resistor. Some signal sources are inherently current-limited  
and do not require limiting resistors.  
FILTERING  
INPUT BIAS CURRENT RETURN PATH  
Filtering can be adjusted through selection of R2C2 and  
ROCO for the desired trade-off of noise and bandwidth.  
Adjustment of these components will result in more or less  
ripple due to auto-correction circuitry noise and will also  
affect broadband noise. Filtering limits slew rate, settling  
time, and output overload recovery time.  
The input impedance of the INA326 is extremely high—  
approximately 1010. However, a path must be provided for  
the input bias current of both inputs. This input bias current is  
approximately ±0.2nA. High input impedance means that this  
input bias current changes very little with varying input voltage.  
It is generally desirable to keep the resistance of RO relatively  
low to avoid DC gain error created by the subsequent stage  
loading. This may result in relatively high values for CO to  
produce the desired filter response. The impedance of ROCO  
can be scaled higher to produce smaller capacitor values if  
the load impedance is very high.  
Input circuitry must provide a path for this input bias current  
for proper operation. Figure 4 shows provision for an input  
bias current path in a thermocouple application. Without a  
bias current path, the inputs will float to an undefined poten-  
tial and the output voltage may not be valid.  
Certain capacitor types greater than 0.1µF may have dielec-  
tric absorption effects that can significantly increase settling  
time in high-accuracy applications (settling to 0.01%). Polypro-  
pylene, polystyrene, and polycarbonate types are generally  
good. Certain high-Kceramic types may produce slow  
settling tails.Settling time to 0.1% is not generally affected  
by high-K ceramic capacitors. Electrolytic types are not  
recommended for C2 and CO.  
INPUT COMMON-MODE RANGE  
Common instrumentation amplifiers do not respond linearly with  
common-mode signals near the power-supply rails, even if rail-  
to-railop amps are used. The INA326 uses a unique topology  
to achieve true rail-to-rail input behavior (see Figure 5, Inside  
the INA326). The linear input voltage range of each input  
terminal extends to 20mV below the negative rail, and 100mV  
above the positive rail.  
INA326, INA327  
11  
SBOS222D  
www.ti.com  
INSIDE THE INA326  
The INA326 uses a new, unique internal circuit topology  
A1 and A2s output stages. A2 combines the current in R1  
with a mirrored replica of the current from A1. The result-  
ing current in A2s output and associated current mirror is  
two times the current in R1. This current flows in (or out)  
of pin 5 into R2. The resulting gain equation is:  
that provides true rail-to-rail input. Unlike other instrumen-  
tation amplifiers, it can linearly process inputs up to 20mV  
below the negative power-supply rail, and 100mV above  
the positive power-supply rail. Conventional instrumenta-  
tion amplifier circuits cannot deliver such performance,  
even if rail-to-rail op amps are used.  
R2  
G = 2  
R1  
The ability to reject common-mode signals is derived in  
most instrumentation amplifiers through a combination of  
amplifier CMR and accurately matched resistor ratios.  
The INA326 converts the input voltage to a current.  
Current-mode signal processing provides rejection of com-  
mon-mode input voltage and power-supply variation with-  
out accurately matched resistors.  
Amplifiers A1, A2, and their associated mirrors are pow-  
ered from internal charge-pumps that provide voltage  
supplies that are beyond the positive and negative supply  
rails. As a result, the voltage developed on R2 can actually  
swing 20mV below the negative power-supply rail, and  
100mV above the positive supply rail. A3 provides a  
buffered output of the voltage on R2. A3s input stage is  
also operated from the charge-pumped power supplies for  
true rail-to-rail operation.  
A simplified diagram shows the basic circuit function. The  
differential input voltage, (VIN+) (VIN) is applied across  
R1. The signal-generated current through R1 comes from  
V+  
V  
0.1µF  
7
4
Current Mirror  
INA326  
IR1  
IR1  
2
1
VIN  
A1  
Current Mirror  
IR1  
R1  
Current Mirror  
IR1  
8
3
2IR1  
2IR1  
A2  
VIN+  
VO  
6
A3  
2IR1  
2IR1  
2IR1  
Current Mirror  
5
R2  
C2  
IACOMMON  
FIGURE 5. Simplified Circuit Diagram.  
INA326, INA327  
12  
SBOS222D  
www.ti.com  
APPLICATION CIRCUITS  
2
R0  
1
6
VO  
R1  
INA326  
5
8
VREF  
C0  
3
R2  
R2 and R2 are chosen to  
R2  
C2  
create a small output offset  
voltage (e.g., 100mV).  
Gain is determined by  
the parallel combination  
of R2 and R2.  
G = 2 (R2 || R2)/R1  
FIGURE 6. Generating Output Offset Voltage.  
VREF  
2
1
RO  
100Ω  
A/D  
Converter  
6
INA326  
2kΩ  
8
3
5
CO  
1µF  
200kΩ  
200kΩ  
C2  
G = 2(200k|| 200k)/2k= 100  
FIGURE 7. Output Referenced to VREF/2.  
+5V  
RS must be chosen  
so that the input voltage  
does not exceed 100mV  
beyond the rail.  
RS  
IL  
2
1
7
RO  
RL  
100Ω  
2kΩ  
6
R1  
VO  
INA326  
8
3
5
CO  
1µF  
NOTE: Connection point  
of V+ will include ( ) or  
exclude ( ) quiescent  
R2  
C2  
current in the measurement  
as desired. Output offset  
required for measurements  
near zero (see Figure 6).  
R2  
VO = 2(IL × RS)  
R1  
FIGURE 8. High-Side Current Shunt Measurement.  
INA326, INA327  
13  
SBOS222D  
www.ti.com  
+5V  
2
1
RO  
100Ω  
R2  
R1  
7
VO = 2(IL × RS)  
VO  
6
R1  
INA326  
5
8
3
CO  
1µF  
RL  
R2  
C2  
2kΩ  
IL  
RS must be chosen so that  
the input voltage does not  
exceed 20mV beyond the rail.  
RS  
NOTE: Connection point of Vwill include (  
) or  
exclude ( ) quiescent current in the measurement  
as desired. Output offset required for measurements  
near zero (see Figure 6).  
FIGURE 9. Low-Side Current Shunt Measurement.  
1nF  
R
F = 100kΩ  
NOTE: 0.2% accuracy. Current shunt  
+5V  
monitor circuit can be designed for 250V supply  
with appropriate selection of high- voltage FET.  
2
3
7
RF  
RI  
6
V
O = 2(IL × RS)  
OPA336PA  
4
RSTART  
100kΩ  
RPULL- DOWN  
200kΩ  
ZVN4525G  
8.45kΩ  
(zetex)  
RL  
(High- Voltage  
n- Channel  
2
1
IL  
7
FET)  
VCC  
+
ZMM5231BDICT  
5.1V  
6
RI = 2kΩ  
0.1µF  
RS  
VS  
=
0mV  
INA326  
GND  
4
5
8
3
to 50mV max  
48V  
FIGURE 10. Low-Side 48V Current Shunt Monitor.  
+48V  
+
7
3
VCC  
VSHUNT = 0mV  
to 50mV  
8
ZMM5231BDICT  
5.1V  
RI  
2k  
6
RSHUNT  
0.1µF  
INA326  
5
1
2
GND  
ZVP4525  
(zetex)  
4
Load  
(High- Voltage  
p- Channel FET)  
8.45kΩ  
+5V  
3
2
7
6
VO = 0.1V to 4.9V  
OPA336PA  
1nF  
75kΩ  
4
49.9kΩ  
165kΩ  
FIGURE 11. High-Side +48V Current Shunt Monitor.  
14  
INA326, INA327  
SBOS222D  
www.ti.com  
2
1
+
VO = VIN (100) + VDAC  
6
VIN  
2k  
INA326  
8
3
5
+5V  
1nF  
100kΩ  
2
1
7
INA326  
4
+15V  
7
DAC  
VDAC = 0.075V  
to 4.925V  
6
NC(1)  
R1  
VD  
2
3
5
8
3
6
VO  
OPA277  
FIGURE 12. Output Offset Adjustment.  
4
(2)  
VCM  
15V  
+1.8V to +5V  
R2  
C2  
+5V  
9
Logic  
NOTES: (1) NC denotes No Connection.  
(2) Typical swing capability 20mV to (+5V + 100mV).  
2
1
6
Enable  
8
R1  
INA327  
7
10  
3
4
(1)  
R2  
1nF  
FIGURE 14. Output from Pin 5 to Allow Swing Beyond the Rail.  
+5V  
9
2
1
6
Enable  
8
R3  
VO  
INA327  
7
10  
3
+5V  
4
0V < VDAC < +5V  
(1)  
R4  
1nF  
((+VREF) (VDAC))  
2
1
IOUT  
=
± 50nA  
7
INA326  
4
DAC  
R1  
R1  
200kΩ  
6
8
3
5
+5V  
9
VREF = +2.5V  
RF = 10k  
CF  
2
1
6
Enable  
8
R5  
INA327  
NOTE: Output resistance is typically 800M.  
Resolution < 5nA. Recommended values of CF = 1nF to 1µF.  
7
10  
3
4
(1)  
R6  
1nF  
NOTE: (1) R2, R4, and R6 could be a  
single, shared resistor to save board space.  
FIGURE 13. Multiplexed Output.  
FIGURE 15. Programmable ±25µA Current Source with High  
Output Resistance.  
INA326, INA327  
15  
SBOS222D  
www.ti.com  
VREF = +2.5V  
+2.5V  
2
1
7
INA326  
4
DAC  
6
RI = 200kΩ  
5
8
3
49.9Ω  
10kΩ  
0.1µF  
2.5V  
IO  
V
REF VDAC  
10kΩ  
49.9Ω  
IOUT = 2  
1 +  
RL  
200kΩ  
IO = ±5mA with  
0.1µA stability.  
FIGURE 16. Programmable ±5mA Current Source.  
RI = 1kΩ  
RF = 100kΩ  
VI  
+30V  
7
20kΩ  
2
3
6
VO = 27V  
OPA551  
+5V  
4
VOS = 100µV at 200mA  
IB  
20kΩ  
2
1
30V  
RF  
7
G = −  
= 100V/V  
RI  
6
2kΩ  
INA326  
5
8
3
Offset of the high- voltage op amp  
is controlled by the INA326.  
4
Internal charge pump in the INA326 allows  
this node to swing 20mV below ground  
without a negative supply.  
1MΩ  
10nF  
NOTES: (1) The OPA551 is a 60V op amp. (2) The INA326 does not require a  
negative supply to correct for negative VOS values from the high-voltage op amp.  
(3) Voltage offset contribution of IB (OPA551) is 100pA 2k= 0.2µV.  
FIGURE 17. ±27V Output at 200mA Amplifier with 100µV Offset.  
INA326, INA327  
16  
SBOS222D  
www.ti.com  
FIGURE 18. Single-Supply PID Temperature Control Loop.  
INA326, INA327  
17  
SBOS222D  
www.ti.com  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
INA326EA/250  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
DGK  
8
8
250  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
B26  
B26  
B26  
B26  
B27  
B27  
B27  
B27  
INA326EA/250G4  
INA326EA/2K5  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DGK  
DGK  
DGK  
DGS  
DGS  
DGS  
DGS  
250  
2500  
2500  
250  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
8
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
INA326EA/2K5G4  
INA327EA/250  
8
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
10  
10  
10  
10  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
INA327EA/250G4  
INA327EA/2K5  
250  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
2500  
2500  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
INA327EA/2K5G4  
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Jan-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
INA326EA/250  
INA326EA/2K5  
INA327EA/250  
INA327EA/2K5  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
DGK  
DGK  
DGS  
DGS  
8
8
250  
2500  
250  
330.0  
330.0  
180.0  
330.0  
12.4  
12.4  
12.4  
12.4  
5.3  
5.3  
5.3  
5.3  
3.4  
3.4  
3.4  
3.4  
1.4  
1.4  
1.4  
1.4  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
Q1  
10  
10  
2500  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Jan-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
INA326EA/250  
INA326EA/2K5  
INA327EA/250  
INA327EA/2K5  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
DGK  
DGK  
DGS  
DGS  
8
8
250  
2500  
250  
366.0  
366.0  
210.0  
367.0  
364.0  
364.0  
185.0  
367.0  
50.0  
50.0  
35.0  
35.0  
10  
10  
2500  
Pack Materials-Page 2  
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