INA330AIDGST [TI]
用于温度控制的热敏电阻信号放大器 | DGS | 10 | -40 to 85;
| 型号： | INA330AIDGST |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 用于温度控制的热敏电阻信号放大器 | DGS | 10 | -40 to 85 放大器 光电二极管 |
| 文件： | 总17页 (文件大小：640K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INA330
I
N
A
3
3
0
SBOS260 – NOVEMBER 2002
THERMISTOR SIGNAL AMPLIFIER
FOR TEMPERATURE CONTROL
DESCRIPTION
FEATURES
The INA330 is a precision amplifier designed for thermoelec-
tric cooler (TEC) control in optical networking applications. It
is optimized for use in 10kΩ thermistor-based temperature
controllers. The INA330 provides thermistor excitation and
generates an output voltage proportional to the difference in
resistances applied to the inputs. It uses only one precision
resistor plus the thermistor, thus providing an alternative to
the traditional bridge circuit. This new topology eliminates the
need for two precision resistors while maintaining excellent
accuracy for temperature control applications.
ꢀ OPTIMIZED FOR PRECISION 10kΩ
THERMISTOR APPLICATIONS
ꢀ LOW OFFSET OVER TEMPERATURE:
0.009°C Temperature Error, –40°C to +85°C
ꢀ EXCELLENT LONG-TERM STABILITY
ꢀ VERY LOW 1/f NOISE: (0.01Hz to 10Hz)
(Peak-to-Peak Equivalent to 0.0001°C)
ꢀ WIDE OUTPUT SWING: Within 10mV of Rails
ꢀ SUPPLY RANGE: Single +2.7V to +5.5V
ꢀ microPACKAGE: MSOP-10
An excitation voltage is applied to the thermistor (RTHERM
)
and precision resistor (RSET), creating currents I1 and I2. The
current conveyor circuit produces an output current, IO, equal
to I1 – I2, which flows through the external gain-setting
resistor. A buffered voltage output proportional to IO is also
provided.
ꢀ REQUIRES ONLY ONE PRECISION RESISTOR
APPLICATIONS
ꢀ THERMISTOR-BASED TEMPERATURE
The INA330 offers excellent long-term stability, and very low
1/f noise throughout the life of the product. The low offset
results in a 0.009°C temperature error from –40°C to +85°C.
It comes in MSOP-10 packaging and operates with supply
voltages from +2.7V to +5.5V. It is specified over the indus-
trial temperature range, –40°C to +85°C, with operation from
–40°C to +125°C.
CONTROLLERS FOR OPTICAL NETWORKING
ꢀ HIGH ACCURACY FOR TEC APPLICATIONS
ꢀ LASER TEMPERATURE CONTROL
V+
Enable High = On
Low = Off
PID CONTROLLER
9
5
6
VEXCITE
1V
V2
V1
2
3
VO
8
VREF
2.5V
10
1
7
IO = I1 – I2
I1
4
I2
CFILTER
500pF
Thermistor
RTHERM = 10kΩ
RSET
10kΩ
RG
200kΩ
D/A
Converter
VADJUST = +2.5V
INA330 In A Temperature Control Loop
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2002, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
Supply Voltage .................................................................................. +5.5V
Signal Input Terminals:
(Pins 1, 2, 3, 6, and 10) Voltage(2) ......................... –0.5V to (V+) + 0.5V
Current(2) ............................................... ±10mA
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature Range ....................................... –40°C to +125°C
Storage Temperature Range .......................................... –65°C to +150°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied.
(2)Inputterminalsarediodeclampedtothepower-supplyrails. Inputsignalsthat
can swing more than 0.5V beyond the supply rails should be current limited to
10mA or less. (3) Short-circuit to ground.
PACKAGE/ORDERING INFORMATION
SPECIFIED
PACKAGE
DESIGNATOR(1)
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
PRODUCT
PACKAGE-LEAD
INA330
MSOP-10
DGS
–40°C to +85°C
TLB
INA330AIDGST
INA330AIDGSR
Tape and Reel, 250
Tape and Reel, 2500
"
"
"
"
"
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
PIN CONFIGURATION
Top View
MSOP
I1 (RTHERM
)
I2 (RSET
)
1
2
3
4
5
10
9
V+
V2
V1
VO
INA330
8
IO (RG)
Enable
GND
7
(Connect to V+)
6
INA330
2
SBOS260
www.ti.com
ELECTRICAL CHARACTERISTICS: VS = +5V
BOLDFACE limits apply over the specified temperature range, TA = –40°C to +85°C
At TA = +25°C, V1 = V2 = +1V, VADJUST = +2.5V, RSET = 10kΩ, RTHERM = 10kΩ, RG = 200kΩ, CFILTER = 500pF, external 1kHz filtering, unless otherwise noted.
INA330
PARAMETER
CONDITION
MIN
TYP
MAX
UNITS
VOLTAGE EXCITATION BUFFERS
Voltage Range
RSET = 10kΩ, RTHERM = 10kΩ
RSET = 100kΩ, RTHERM = 100kΩ
VS = +5V, V1 – V2 = 0
0.1
1.25
V
V
µV
0.1 to 4.9
±60
Offset Voltage
VOS
vs Temperature
vs Power Supply
Offset Voltage Match(1)
vs Temperature
Input Bias Current
Output Current
∆VOS
PSR
±0.2
3
±30
0.2
±0.2
µV/°C
µV/V
µV
µV/°C
nA
VS = +2.7V to +5.5V, V1 – V2 = 0
IB
+125
µA
CURRENT CONVEYOR(2)
Gain Equation
IO = I1 – I2
Current Output Range
Voltage Compliance Range
Gain
±12.5
0.075
µA
V
A/A
4.925
1
Gain Error
VO = +0.075V to +4.925V
I1 = I2
+25°C to +85°C, or +25°C to –40°C
V1 = V2 = +0.1V to +1.25V
±0.1
±100
±0.2
±200
±40
%
nA
nA
nA/V
nA/V
pA/√Hz
pAp-p
Current Offset Error
Change Over Temperature
vs V1, V2
vs Power Supply
Noise Current
IERROR
±100
25
12
±200
f = 0.01Hz to 10Hz
500
OUTPUT BUFFER
Voltage Output Swing-to-Rail
RL = 100kΩ
5
10
mV
mV
RL = 10kΩ
75
Offset Voltage
30
µV
vs Temperature
Input Bias Current
Short-Circuit Current
dVOS /dT
0.1
Included in IERROR
±25
µV/°C
ISC
mA
NOTES: (1) Total errors in voltage seen between pin 1 and pin 10. (2) See Figure 2.
V+
Enable High = On
Low = Off
TEST CONFIGURATION
9
5
6
VEXCITE
1V
V2
V1
2
3
VO
8
10
1
7
IO = I1 – I2
I1
I2
4
Thermistor
RSET
CFILTER
500pF
RG
200kΩ
RTHERM = 10kΩ
10kΩ
VADJUST = +2.5V
INA330
SBOS260
3
www.ti.com
ELECTRICAL CHARACTERISTICS: VS = +5V (Cont.)
BOLDFACE limits apply over the specified temperature range, TA = –40°C to +85°C.
At TA = +25°C, V1 = V2 = +1V, VADJUST = +2.5V, RSET = 10kΩ, RTHERM = 10kΩ, RG = 200kΩ, CFILTER = 500pF, external 1kHz filtering, unless otherwise noted.
INA330
PARAMETER
CONDITION
MIN
TYP
MAX
UNITS
FREQUENCY RESPONSE
Bandwidth, –3dB(3)
Slew Rate
BW
SR
1
kHz
Not Slew Rate Limited
POWER SUPPLY
Specified Voltage Range
Quiescent Current
Over Temperature
+2.7
1.6
+5.5
3.6
3.9
V
mA
mA
IQ
IO = 0, V1 – V2 = 0V, VS = +5V
2.6
SHUTDOWN
Disable (Logic LOW Threshold)
Enable (Logic HIGH Threshold)
Enable Time
Disable Time
Shutdown Current and Enable Pin Current
0.25
5
V
V
µs
µs
µA
75
100
2
VS = +5V, Disabled
TEMPERATURE RANGE
Specified Range
Operating Range
–40
–40
–65
+85
+125
+150
°C
°C
°C
Storage Range
Thermal Resistance
MSOP-10 Surface-Mount
150
°C/W
NOTES: (3) Dynamic response is limited by filtering.
INA330
4
SBOS260
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C, V1 = V2 = +1V, VADJUST = +2.5V, RSET = 10kΩ, RTHERM = 10kΩ (5%), RG = 200kΩ, CFILTER = 500pF, and external 1kHz filtering, unless otherwise noted.
CURRENT CONVEYOR OFFSET ERROR
CURRENT CONVEYOR OFFSET ERROR
PRODUCTION DISTRIBUTION
CHANGE OVER TEMPERATURE
PRODUCTION DISTRIBUTION
Change in offset error from
+25°C to +85°C, or from
+25°C to –40°C.
This error is generally
calibrated out.
A 40nA current offset error
variation with ambient
temperature results in a
0.009°C variation in set-
point temperature over
–40°C to +85°C ambient.
Current Conveyor Offset Error
Change Over Temperature (nA)
Current Conveyor Offset Error (nA)
+5V
Test Configuration
for this page.
0.01Hz TO 10Hz VOLTAGE NOISE
9
5
6
VEXCITE
V2
V1
2
3
8
7
1V
VO
10
1
INA330
I1
4
I2
5s/div
10kΩ
10kΩ
CFILTER
500pF
RG
200kΩ
2.5V
INA330
SBOS260
5
www.ti.com
APPLICATIONS INFORMATION
OVERVIEW
2
3
1V
8
Precision temperature controllers are generally adjusted to
their set-point temperature to achieve the desired system
performance and to compensate for tolerance of the ther-
mistor and reference circuitry. After this adjustment, the
crucial issue is the stability of this set-point temperature.
When used in a temperature control loop (Figure 1), the
INA330 provides excellent control-point stability over time
and ambient temperature changes. Low 1/f noise assures
excellent short-term stability. Internal auto-zero circuitry as-
sures excellent stability throughout product life.
Current Conveyor: measures
the current difference between
pins 10 and 1.
10
1
7
I1
IO = I1 – I2 + IERROR + ∆IERROR /∆T
I2
RTHERM
10kΩ at 25°C
9.55kΩ at 26°C
∆I = 4500nA
RSET
SOURCES OF ERRORS
FIGURE 2. Current Conveyor Portion of the INA330.
The largest source of error in a control system will occur due
to RSET, see “Selecting Components” section.
ambient). This is the variation in set-point temperature due to
variation in ambient temperature of the INA330.
The INA330 errors are extremely low. The primary errors in
the INA330 occur in the current conveyer circuitry, as shown
in Figure 2. Equal currents in RSET and RTHERM produce a
small output current error of 200nA (maximum), and some
variation with temperature of 40nA (maximum). The offset is
calibrated out. Only the variation affects set-point stability.
Insignificant Errors
Input offset voltage of the voltage excitation buffers are auto-
zeroed to approximately 60µV and match to 30µV. Drift with
temperature is very low. They contribute negligible error.
The variation can be referred to the input as a set-point temp
variation: 10kΩ thermistor with a 4.5% temperature coeffi-
cient, (α = –0.045) changes resistance by 450Ω/°C. This
results in 4500nA change in I1 for a 1°C temperature change
at the thermistor. Therefore, the 40nA maximum current
offset error variation with ambient temperature results in a
0.009°C variation in set-point temperature over –40°C to
+85°C ambient (40nA/4500nA/°C = 0.009°C set-point/°C
Voltage excitation buffers have an input bias current of
0.2nA. With a source impedance of less than 10kΩ, errors
produced by the input bias current will be negligible.
Output buffer errors are auto-zeroed. When referred to the
input, their errors are negligible.
Gain error does not produce any significant temperature set-
point error when used in a temperature set-point control loop.
Place 0.1µF capacitor close
V+
Enable High = On
Low = Off
to and across the power-
supply pins.
0.1µF
PID CONTROLLER
9
5
6
VEXCITE
1V
V2
V1
2
3
VO
8
Power
Amp
+0.9V/°C
for increasing
temperature.
VREF
2.5V
TEC
10
1
7
IO = I1 – I2
I1
4
I2
CFILTER
500pF
Thermistor
RTHERM = 10kΩ
RSET
(Selection of RSET
RG
200kΩ
10kΩ significantly affects
control system—see
“Selecting Components”
section.)
D/A
Converter
VADJUST = +2.5V
FIGURE 1. The INA330 In Simplified Temperature Control Loop.
6
INA330
SBOS260
www.ti.com
loop can be accomplished by simply reversing the connec-
tions to the TEC, or by creating the desired polarity in the
intervening control circuitry. If differing values of V1 and V2
are used, resistor values should be chosen to maintain
balanced currents, I1 and I2. Likewise, if a lower value of RSET
is used, the excitation voltage must be lowered to keep I1 and
I2 at or below 125µA.
SELECTING COMPONENTS
RSET is the primary “reference” for the temperature control
loop. Its absolute resistance controls the set-point tempera-
ture. Again, its initial accuracy can be calibrated, but its
stability is crucial. Therefore, a high-quality, low-temperature
coefficient type must be used.
A 25ppm/°C precision resistor changes 0.15% from –40°C to
+85°C. This will produce a 0.03°C change in set-point tem-
perature. This error is approximately three-times larger than
that produced by the INA330.
CFILTER is calculated by:
CFILTER
1
2πRG 1.6kHz
=
(
)
The transfer function for the configuration shown in Figure 3 is:
VO = VADJ + RG I – I
(
)
1
2
NOISE PERFORMANCE
or
Temperature control loops require low noise over a small
bandwidth, typically 10Hz, or less. The INA330’s internal
auto-correction circuitry eliminates virtually all 1/f noise (noise
that increases at low frequency). The peak-to-peak voltage
noise due to IERROR, RTHERM, RSET, and the buffers at 0.01Hz
to 10Hz results in a 0.0001°C contribution.
V1
V2
VO = VADJ + RG
–
RTHERM RSET
With V1 = V2 = VEXCITE
,
1
1
VO = VADJ + VEXCITE RG
–
OUTPUT
RTHERM RSET
The INA330 output (pin 8) is capable of swinging to within
10mV of the power-supply rails. It is able to achieve rail-to-
rail output performance while sinking or sourcing 12.5µA.
V+
Enable High = On
Low = Off
VADJUST can be used to create an offset voltage around which
the output can be centered.
9
5
6
VEXCITE
1V
V2
V1
2
3
8
VO
ENABLE FUNCTION
The INA330 is enabled by applying a logic HIGH voltage
level to the Enable pin. Conversely, a logic LOW voltage
level will disable the amplifier, reducing its supply current
from 2.6mA to typically 2µA. This pin should be connected to
a valid HIGH or LOW voltage or driven, not left open circuit.
Applications not requiring disable can connect pin 6 directly
to V+. The Enable pin can be modeled as a CMOS input
gate, as shown in Figure 4.
10
1
7
IO = I1 – I2
I1
4
I2
CFILTER
500pF
Thermistor
RTHERM = 10kΩ
RSET
10kΩ
RG
200kΩ
VADJUST = +2.5V
V+
FIGURE 3. Basic Configuration for the INA330.
2µA
Enable
6
Nominal values should use RSET = RTHERM = 10kΩ at the
designed control temperature. Values less than 2kΩ can
cause the voltage excitation buffers to become unstable. The
buffer connected to pin 10 is characterized and tested to
supply the changing current in the thermistor. The thermistor
should not be connected to pin 1. An inversion of the control
FIGURE 4. Enable Pin Model.
INA330
SBOS260
7
www.ti.com
INSIDE THE INA330
The INA330 is designed and tested for amplifying 10kΩ
current I1 – I2. The gain is set by the value of RG. The
output voltage, VO, is the voltage resulting from IO flowing
through RG.
thermistor signals used in the control of thermoelectric
coolers for optical networking applications. The simplified
schematic in Figure 5 shows the basic function of the
INA330. An excitation voltage is applied as V1 and V2.
Typically, these voltages are equal. They generate cur-
rents I1 and I2 in the thermistor and RSET resistor.
The INA330 uses internal charge pumps to create volt-
ages beyond the power-supply rails. As a result, the
voltage on RG can actually swing 20mV below the nega-
tive power-supply rail, and 100mV beyond the positive
supply rail. An internal oscillator has a frequency of
90kHz and accuracy of ±20%.
Auto-corrected current mirror circuitry around A1 and A2
produce an output current, IO, equal to the difference
V+
Enable
9
5
6
Current Mirror
INA330
I2
I2
2
1
V2
A1
Current Mirror
I2
Current Mirror
I2
10
I1
RTHERM
I1 – I2
IO = I1 – I2
RSET
A2
VO
3
8
A3
IO
IO
Current Mirror
V1
4
7
RG
CFILTER
VADJUST
FIGURE 5. INA330 Simplified Schematic.
mistor current is approximately 100µA at 25°C, but will vary
above or below this value over the ±2.5°C set-point tempera-
ture range. The difference of these two currents flows in the
gain-set resistor, RG. This produces a voltage output of
approximately 0.9V/°C.
INA330 PIN 5
Pin 5 of the INA330 should be connected to V+ to ensure
proper operation.
COMPLETE TEMPERATURE CONTROLLER
The set-point temperature is adjusted with VADJ. Thus, the
voltage at VO is the sum of (IO)(RG) + VADJ. VADJ can be
manually adjusted or set with a Digital-to-Analog (D/A) con-
verter. Optionally, set-point temperature can be adjusted by
choosing a different fixed value resistor more closely ap-
proximating the value of RTHERM at the desired temperature.
See Figure 6 for a complete temperature control loop with a
TEC (thermoelectric cooler) for cooling and heating. PID
(proportional, integral, differential) control circuitry is shown
for loop compensation and stability.
The loop controls temperature to an adjustable set-point of
22.5°C to 27.5°C. The nominal 10kΩ at 25°C thermistor
ranges from approximately 11.4kΩ to 8.7kΩ over this range.
A 1V excitation voltage is applied to V1 and V2, producing a
nominal 100µA current in the 10kΩ RSET resistor. The ther-
The noninverting input of the integrator in the PID compen-
sation is connected to VBIAS. Thus, the feedback loop will
drive the heating or cooling of the TEC to force VO to equal
VBIAS. VADJ = 2.5V will produce a set-point temperature of
INA330
8
SBOS260
www.ti.com
25°C. VADJ = 2.5V + 0.9V will change the set-point by 1°C.
A 0V to 5V D/A converter will provide approximately ±2.5°C
adjustment range. A 12-bit D/A converter will allow for
approximately 0.001°C resolution on the set-point tempera-
ture.
source for V1 and V2 should be derived from the same
reference.
The PID loop compensation can be optimized for loop
stability and best response to thermal transients by adjusting
C1, C2, C3, R2, R3, and R4. This is highly dependant on the
thermal characteristics of the temperature-controlled block
and thermistor/TEC mounting. Figure 7 shows a circuit that
can be used as an intermediate circuit to easily adjust
components and determine system requirements.
For best temperature stability, the set-point temperature
voltage should be derived ratiometrically from VBIAS. A D/A
converter used to derive the set-point voltage should share
the same reference voltage source as VBIAS. Likewise, the 1V
TEC DRIVER AMPLIFIER OPTIONS
OPA569
DRV591
DRV593
DRV594
2A Linear Amplifier
3A PWM Power Driver
3A PWM Power Driver
3A PWM Power Driver
Enable
+5V
PID
+5V(2)
(1)
VREF
+5V
C1
R2
C2
R4
C3
3.3V
3.3V
9
5
6
4kΩ
1kΩ
V2
V1
2
3
R1
R3
ꢀ
1V(1)
10kΩ
VO
8
10kΩ
(1)
VREF
+5V
10kΩ
10kΩ
INA330
+5V
IO = I1 – I2
10
1
7
–
+
I1
10kΩ
TEC
OPA569
OPA569
10kΩ
10kΩ
ꢀ
ꢀ
OPA348
(1)
VBIAS
2.5V
ꢀ
Cooling
4
I2
Thermistor
RSET
RSET = 10kΩ
10kΩ
VREF(1) = +5V
CFILTER
500pF
RG
200kΩ
NOTES: (1) Ratiometrically derived voltages.
(2) The INA330 can also use a 3.3V, supply;
however, components must be chosen appropriate
to the smaller output voltage range.
D/A
Converter
Temperature
Adjust
V
ADJUST = 0V to 5V
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀindicates direction of voltage change for
rising temperature at the thermistor.
= 2.5V at 25°C Set-Point
FIGURE 6. PID Temperature Control Loop.
This versatile PID compensation circuit allows
independent adjustment of the Proportional,
Integral, and Derivative control signals to
facilitate optimization of loop dynamics. The
results can then be duplicated using the circuit
shown in Figure 6.
R7
10MΩ
C2
1µF
R6
5kΩ
R8
10kΩ
1/4
OPA4340
Integrator
TC: 1s to 10s
C4
0.1µF
VBIAS
R10
100kΩ
Enable
+5V
R2
200Ω
R3
10kΩ
OPA569
+5V
R15
10kΩ
DRV591
DRV593
DRV594
Power
Amplifier
VBIAS
R9
100kΩ
R1
2kΩ
R11
10kΩ
7
5
6
1/4
OPA4340
R4
10kΩ
1/4
OPA340
V2
V1
2
3
1/2
OPA2340
To
TEC
+1V
8
7
VBIAS
VBIAS
C1
22nF
Proportional
INA330
R13
1MΩ
10
1
I1
C3
R12
1µF 100kΩ
R14
10kΩ
R5
5kΩ
1/4
OPA4340
I2
4
CFILTER
500pF
Ref
Thermistor
RTHERM = 10kΩ
RSET
10kΩ
RG
200kΩ
Differentiator
TC: 100ms to 1s
VBIAS
D/A
Converter
VADJ
FIGURE 7. Diagnostic and Optimization PID Temperature Control Loop.
INA330
SBOS260
9
www.ti.com
100pF(1)
+5V
2µF(1)
10MΩ(1)
9
5
6
VEXCITE
1.25V
+5V
10MΩ(1)
2
3
VO
REF3012
8
Output
to Power Amp
0.1µF
OPA340
VREF
2.5V
INA330
NOTE: (1) Time constants
were selected for THORLABS
model TCLM9 Laser Diode
Mount.
Proportional-Integrator
compensation is simpler to
adjust and often provides
adequate thermal transient
response.
10
1
7
4
RTHERM
10kΩ
RSET
10kΩ
RG
200kΩ
CFILTER
500pF
VADJ
FIGURE 8. Simple PI Temperature Control Amplifier.
FILTERING
RO
100Ω
Subsequent stages will frequently provide adequate filtering
for the INA330. However, filtering can be adjusted through
selection of RGCFILTER, and by adding a filter at VO for the
desired trade-off of noise and bandwidth. Adjustment of
these components will result in more or less ripple due to
auto-correction circuitry noise and will also affect broadband
noise.
2
3
8
CO
1µF
It is generally desirable to keep any resistor added at VO (see
RO in Figure 9) relatively low to avoid DC gain error created
by the subsequent stage loading. This may result in relatively
high values for the filter capacitor at VO to produce the
desired filter response. The impedance of this filter can be
scaled higher to produce smaller capacitor values if the load
impedance is very high. Electrolytic capacitors are not rec-
ommended for the filters due to dielectric absorption effects.
10
1
7
CFILTER
500pF
RG
200kΩ
VADJ
FIGURE 9. Required 1.6kHz (or lower) Filtering.
INA330
10
SBOS260
www.ti.com
chosen. “Spurs” occur at approximately 90kHz and its har-
monics which is reduced by additional filtering at or below
1kHz. This may be the dominant source of noise visible when
viewing the output on an oscilloscope. Low cutoff frequency
filters will provide lowest noise.
DIGITALLY COMPENSATED LOOP
The PID compensation can be replaced with a microcontroller
or DSP, as shown in Figure 10. An Analog-to-Digital (A/D)
converter would be used to digitize the output of the INA330.
The analog PID provides sufficient filtering inherently, and,
therefore requires no additional filtering. The digital control
loop shown in Figure 10 does not provide this inherent
filtering, requiring additional output filtering (RO and CO) as
shown to avoid sampling the internal chopping noise of the
INA330 and the A/D converter input and affecting accuracy.
High-frequency noise is created by internal auto-correction
circuitry and is highly dependent on the filter characteristics
TRADITIONAL BRIDGE CIRCUIT
The traditional bridge circuit (Figure 11) uses three matched
resistors and a thermistor to detect temperature changes.
The INA326 and INA327 instrumentation amplifiers are well
suited to a bridge implementation for thermistor measure-
ment.
Enable
+5V
Loop Compensation
is performed in DSP.
+5V
9
5
6
RO
100Ω
V1
V2
2
3
+1V
8
7
A/D
Converter
D/A
Converter
DSP
CO
1µF
TEC
INA330
CFILTER
500pF
RSET
10kΩ
RG
200kΩ
Ref
RTHERM
Temp
Adjust
D/A
Converter
VADJ
0V to 5V
FIGURE 10. Digitally Compensated Loop.
VEXCITE
PID CONTROLLER
+5V
10kΩ(1)
10kΩ(1)
10kΩ(2)
ꢀ
INA326
5kΩ
VREF
2.5V
ꢀ 10kΩ at set-point
temperature.
1nF
100kΩ
VADJ
D/A
Converter
NOTES: (1) Requires ratio matching tracking.
(2) Requires absolute accuracy and stability.
FIGURE 11. Traditional Bridge Circuit.
INA330
SBOS260
11
www.ti.com
PACKAGE DRAWING
DGS (S-PDSO-G10)
PLASTIC SMALL-OUTLINE PACKAGE
0,27
0,17
M
0,08
0,50
10
6
0,15 NOM
3,05
2,95
4,98
4,78
Gage Plane
0,25
0°–6°
1
5
0,69
0,41
3,05
2,95
Seating Plane
0,10
0,15
0,05
1,07 MAX
4073272/B 08/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
A. Falls within JEDEC MO-187
INA330
12
SBOS260
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
INA330AIDGST
ACTIVE
VSSOP
DGS
10
250
RoHS & Green Call TI | NIPDAUAG
Level-2-260C-1 YEAR
-40 to 85
TLB
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OUTLINE
DGS0010A
VSSOP - 1.1 mm max height
S
C
A
L
E
3
.
2
0
0
SMALL OUTLINE PACKAGE
C
SEATING PLANE
0.1 C
5.05
4.75
TYP
PIN 1 ID
AREA
A
8X 0.5
10
1
3.1
2.9
NOTE 3
2X
2
5
6
0.27
0.17
10X
3.1
2.9
1.1 MAX
0.1
C A
B
B
NOTE 4
0.23
0.13
TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.7
0.4
0 - 8
DETAIL A
TYPICAL
4221984/A 05/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-187, variation BA.
www.ti.com
EXAMPLE BOARD LAYOUT
DGS0010A
VSSOP - 1.1 mm max height
SMALL OUTLINE PACKAGE
10X (1.45)
(R0.05)
TYP
SYMM
10X (0.3)
1
5
10
SYMM
6
8X (0.5)
(4.4)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221984/A 05/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DGS0010A
VSSOP - 1.1 mm max height
SMALL OUTLINE PACKAGE
10X (1.45)
SYMM
(R0.05) TYP
10X (0.3)
8X (0.5)
1
5
10
SYMM
6
(4.4)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4221984/A 05/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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相关型号：
INA331AIDGK
INSTRUMENTATION AMPLIFIER, 1000uV OFFSET-MAX, 2MHz BAND WIDTH, PDSO8, PLASTIC, MSOP-8
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