JM3851030107SEA [TI]
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR; HEX路/四路D型触发器与Clear
| 型号： | JM3851030107SEA |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR |
| 文件： | 总14页 (文件大小：668K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175,
SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
Copyright 2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175,
SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175,
SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54174, SN54175, SN74174, SN74175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS174, SN54LS175, SN74LS174, SN74LS175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54S174, SN54S175, SN74S174, SN74S175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
1-Jun-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
JM38510/01702BEA
JM38510/01702BFA
JM38510/07105BEA
JM38510/07105BFA
JM38510/07106BEA
JM38510/30106B2A
JM38510/30106BEA
JM38510/30106BFA
JM38510/30107B2A
JM38510/30107BEA
JM38510/30107BFA
JM38510/30107SEA
JM38510/30107SFA
M38510/07105BEA
M38510/07105BFA
M38510/07106BEA
M38510/30106B2A
M38510/30106BEA
M38510/30106BFA
M38510/30107B2A
M38510/30107BEA
M38510/30107BFA
M38510/30107SEA
M38510/30107SFA
SN54175J
OBSOLETE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
CDIP
CFP
J
W
J
16
16
16
16
16
20
16
16
20
16
16
16
16
16
16
16
20
16
16
20
16
16
16
16
16
16
16
16
16
16
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
A42
Call TI
Call TI
CDIP
CFP
1
1
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
W
J
A42
CDIP
LCCC
CDIP
CFP
1
A42
FK
J
1
POST-PLATE N / A for Pkg Type
1
A42
A42
N / A for Pkg Type
N / A for Pkg Type
W
FK
J
1
LCCC
CDIP
CFP
1
POST-PLATE N / A for Pkg Type
1
A42
A42
A42
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
W
J
1
CDIP
CFP
25
25
1
W
J
CDIP
CFP
W
J
1
CDIP
LCCC
CDIP
CFP
1
FK
J
1
POST-PLATE N / A for Pkg Type
1
A42
A42
N / A for Pkg Type
N / A for Pkg Type
W
FK
J
1
LCCC
CDIP
CFP
1
POST-PLATE N / A for Pkg Type
1
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
W
J
1
CDIP
CFP
25
25
A42
W
J
A42
CDIP
CDIP
CDIP
CDIP
CDIP
PDIP
Call TI
A42
SN54LS174J
J
1
1
1
1
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
SN54LS175J
J
A42
SN54S174J
J
A42
SN54S175J
J
A42
SN74174N
N
Call TI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Jun-2012
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
SN74175N
SN74175N3
SN74LS174D
OBSOLETE
OBSOLETE
ACTIVE
PDIP
PDIP
SOIC
N
N
D
16
16
16
TBD
TBD
Call TI
Call TI
Call TI
Call TI
40
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SN74LS174DE4
SN74LS174DG4
SN74LS174DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
16
16
16
16
16
Green (RoHS
& no Sb/Br)
40
Green (RoHS
& no Sb/Br)
2500
2500
2500
Green (RoHS
& no Sb/Br)
SN74LS174DRE4
SN74LS174DRG4
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SN74LS174J
SN74LS174N
OBSOLETE
ACTIVE
CDIP
PDIP
PDIP
PDIP
SO
J
N
16
16
16
16
16
TBD
Call TI
CU NIPDAU N / A for Pkg Type
Call TI Call TI
Call TI
25
Pb-Free (RoHS)
TBD
SN74LS174N3
SN74LS174NE4
SN74LS174NSR
OBSOLETE
ACTIVE
N
N
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
ACTIVE
NS
2000
Green (RoHS
& no Sb/Br)
SN74LS174NSRE4
SN74LS174NSRG4
SN74LS175D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
NS
NS
D
16
16
16
16
16
16
16
2000
2000
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SO
Green (RoHS
& no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
Green (RoHS
& no Sb/Br)
SN74LS175DE4
SN74LS175DG4
SN74LS175DR
D
40
Green (RoHS
& no Sb/Br)
D
40
Green (RoHS
& no Sb/Br)
D
2500
2500
Green (RoHS
& no Sb/Br)
SN74LS175DRE4
D
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
1-Jun-2012
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
SN74LS175DRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS175J
SN74LS175N
OBSOLETE
ACTIVE
CDIP
PDIP
PDIP
PDIP
SO
J
N
16
16
16
16
16
TBD
Call TI
CU NIPDAU N / A for Pkg Type
Call TI Call TI
Call TI
25
Pb-Free (RoHS)
TBD
SN74LS175N3
SN74LS175NE4
SN74LS175NSR
OBSOLETE
ACTIVE
N
N
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
ACTIVE
NS
2000
Green (RoHS
& no Sb/Br)
SN74LS175NSRE4
SN74LS175NSRG4
ACTIVE
ACTIVE
SO
SO
NS
NS
16
16
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
SN74S174J
SN74S174N
SN74S174N3
SN74S174NE4
SN74S175D
OBSOLETE
NRND
CDIP
PDIP
PDIP
PDIP
SOIC
J
16
16
16
16
16
TBD
Call TI
CU NIPDAU N / A for Pkg Type
Call TI Call TI
Call TI
N
N
N
D
25
Pb-Free (RoHS)
TBD
OBSOLETE
NRND
25
40
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
ACTIVE
Green (RoHS
& no Sb/Br)
SN74S175DE4
SN74S175DG4
ACTIVE
ACTIVE
SOIC
SOIC
D
D
16
16
40
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
SN74S175DR
SN74S175N
OBSOLETE
ACTIVE
SOIC
PDIP
PDIP
PDIP
CDIP
CFP
D
N
16
16
16
16
16
16
20
16
16
20
16
TBD
Pb-Free (RoHS)
TBD
Call TI
CU NIPDAU N / A for Pkg Type
Call TI Call TI
CU NIPDAU N / A for Pkg Type
Call TI
25
25
SN74S175N3
SN74S175NE4
SNJ54175J
OBSOLETE
ACTIVE
N
N
Pb-Free (RoHS)
TBD
OBSOLETE
OBSOLETE
ACTIVE
J
Call TI
Call TI
Call TI
Call TI
SNJ54175W
W
FK
J
TBD
SNJ54LS174FK
SNJ54LS174J
SNJ54LS174W
SNJ54LS175FK
SNJ54LS175J
LCCC
CDIP
CFP
1
1
1
1
1
TBD
POST-PLATE N / A for Pkg Type
ACTIVE
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
ACTIVE
W
FK
J
TBD
ACTIVE
LCCC
CDIP
TBD
POST-PLATE N / A for Pkg Type
A42 N / A for Pkg Type
ACTIVE
TBD
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
1-Jun-2012
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
SNJ54LS175W
SNJ54S174FK
SNJ54S174J
SNJ54S174W
SNJ54S175FK
SNJ54S175J
SNJ54S175W
ACTIVE
NRND
CFP
LCCC
CDIP
CFP
W
FK
J
16
20
16
16
20
16
16
1
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
A42
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
A42
A42
N / A for Pkg Type
N / A for Pkg Type
W
FK
J
LCCC
CDIP
CFP
POST-PLATE N / A for Pkg Type
A42
A42
N / A for Pkg Type
N / A for Pkg Type
W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54175, SN54LS174, SN54LS175, SN54LS175-SP, SN54S174, SN54S175, SN74175, SN74LS174, SN74LS175, SN74S174,
SN74S175 :
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
1-Jun-2012
Catalog: SN74175, SN74LS174, SN74LS175, SN54LS175, SN74S174, SN74S175
•
Military: SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175
•
Space: SN54LS175-SP
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
•
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74LS174DR
SN74LS174NSR
SN74LS175DR
SN74LS175NSR
SOIC
SO
D
NS
D
16
16
16
16
2500
2000
2500
2000
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
6.5
8.2
6.5
8.2
10.3
10.5
10.3
10.5
2.1
2.5
2.1
2.5
8.0
12.0
8.0
16.0
16.0
16.0
16.0
Q1
Q1
Q1
Q1
SOIC
SO
NS
12.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74LS174DR
SN74LS174NSR
SN74LS175DR
SN74LS175NSR
SOIC
SO
D
NS
D
16
16
16
16
2500
2000
2500
2000
333.2
367.0
333.2
367.0
345.9
367.0
345.9
367.0
28.6
38.0
28.6
38.0
SOIC
SO
NS
Pack Materials-Page 2
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