LF147-MD8 [TI]

四路、30V、4MHz、FET 输入运算放大器 | Y | 0 | -55 to 125;
LF147-MD8
型号: LF147-MD8
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

四路、30V、4MHz、FET 输入运算放大器 | Y | 0 | -55 to 125

放大器 运算放大器
文件: 总21页 (文件大小:1620K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LF147, LF347-N  
www.ti.com  
SNOSBH1D MAY 1999REVISED MARCH 2013  
LF147/LF347 Wide Bandwidth Quad JFET Input Operational Amplifiers  
Check for Samples: LF147, LF347-N  
1
FEATURES  
DESCRIPTION  
The LF147 is a low cost, high speed quad JFET input  
operational amplifier with an internally trimmed input  
offset voltage ( BI-FET II™ technology). The device  
requires a low supply current and yet maintains a  
large gain bandwidth product and a fast slew rate. In  
addition, well matched high voltage JFET input  
devices provide very low input bias and offset  
currents. The LF147 is pin compatible with the  
standard LM148. This feature allows designers to  
immediately upgrade the overall performance of  
existing LF148 and LM124 designs.  
23  
Internally Trimmed Offset Voltage: 5 mV max  
Low Input Bias Current: 50 pA  
Low Input Noise Current: 0.01 pA/Hz  
Wide Gain Bandwidth: 4 MHz  
High Slew Rate: 13 V/μs  
Low Supply Current: 7.2 mA  
High Input Impedance: 1012Ω  
Low Total Harmonic Distortion: 0.02%  
Low 1/f Noise Corner: 50 Hz  
The LF147 may be used in applications such as high  
speed integrators, fast D/A converters, sample-and-  
hold circuits and many other circuits requiring low  
input offset voltage, low input bias current, high input  
impedance, high slew rate and wide bandwidth. The  
device has low noise and offset voltage drift.  
Fast Settling Time to 0.01%: 2 μs  
Simplified Schematic  
Connection Diagram  
¼ Quad  
LF147 available as per JM38510/11906.  
Figure 1. 14-Pin PDIP / CDIP / SOIC  
Top View  
See Package Number J0014A, D0014A or  
NFF0014A  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
BI-FET II is a trademark of dcl_owner.  
2
3
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 1999–2013, Texas Instruments Incorporated  
LF147, LF347-N  
SNOSBH1D MAY 1999REVISED MARCH 2013  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
(1)(2)  
Absolute Maximum Ratings  
LF147  
±22V  
LF347B/LF347  
±18V  
Supply Voltage  
Differential Input Voltage  
±38V  
±30V  
(3)  
Input Voltage Range  
±19V  
±15V  
(4)  
Output Short Circuit Duration  
Continuous  
900 mW  
150°C  
Continuous  
1000 mW  
150°C  
(5) (6)  
Power Dissipation  
Tj max  
θjA  
CDIP (J) Package  
PDIP (NFF) Package  
SOIC Narrow (D)  
SOIC Wide (D)  
70°C/W  
75°C/W  
100°C/W  
85°C/W  
(7)  
(7)  
Operating Temperature Range  
Storage Temperature Range  
See  
See  
65°CTA150°C  
Lead Temperature (Soldering, 10 sec.)  
260°C  
260°C  
260°C  
215°C  
220°C  
900V  
Soldering Information  
PDIP / CDIP  
SOIC Package  
Soldering (10 seconds)  
Vapor Phase (60 seconds)  
Infrared (15 seconds)  
(8)  
ESD Tolerance  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is functional, but do not ensure specific performance limits.  
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.  
(3) Unless otherwise specified the absolute maximum negative input voltage is equal to the negative power supply voltage.  
(4) Any of the amplifier outputs can be shorted to ground indefinitely, however, more than one should not be simultaneously shorted as the  
maximum junction temperature will be exceeded.  
(5) For operating at elevated temperature, these devices must be derated based on a thermal resistance of θjA.  
(6) Max. Power Dissipation is defined by the package characteristics. Operating the part near the Max. Power Dissipation may cause the  
part to operate outside ensured limits.  
(7) The LF147 is available in the military temperature range 55°CTA125°C, while the LF347B and the LF347 are available in the  
commercial temperature range 0°CTA70°C. Junction temperature can rise to Tj max = 150°C.  
(8) Human body model, 1.5 kΩ in series with 100 pF.  
(1)(2)  
DC Electrical Characteristics  
Symbol  
Parameter  
Conditions  
LF147  
LF347B  
LF347  
Units  
Min Typ Max Min Typ Max Min Typ Max  
VOS  
Input Offset Voltage  
RS=10 kΩ, TA=25°C  
Over Temperature  
RS=10 kΩ  
1
5
8
3
5
7
5
10  
13  
mV  
mV  
ΔVOS/Δ Average TC of Input  
T
10  
25  
10  
25  
10  
25  
μV/°C  
Offset Voltage  
(2) (3)  
IOS  
Input Offset Current  
Tj=25°C,  
100  
25  
100  
4
100  
4
pA  
nA  
pA  
nA  
Ω
Over Temperature  
(2) (3)  
IB  
Input Bias Current  
Input Resistance  
Tj=25°C,  
50  
200  
50  
50  
200  
8
50  
200  
8
Over Temperature  
Tj=25°C  
RIN  
1012  
1012  
1012  
(1) Refer to RETS147X for LF147D and LF147J military specifications.  
(2) Unless otherwise specified the specifications apply over the full temperature range and for VS=±20V for the LF147 and for VS=±15V for  
the LF347B/LF347. VOS, IB, and IOS are measured at VCM=0.  
(3) The input bias currents are junction leakage currents which approximately double for every 10°C increase in the junction temperature,  
Tj. Due to limited production test time, the input bias currents measured are correlated to junction temperature. In normal operation the  
junction temperature rises above the ambient temperature as a result of internal power dissipation, PD. Tj=TA+θjA PD where θjA is the  
thermal resistance from junction to ambient. Use of a heat sink is recommended if input bias current is to be kept to a minimum.  
2
Submit Documentation Feedback  
Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LF147 LF347-N  
LF147, LF347-N  
www.ti.com  
SNOSBH1D MAY 1999REVISED MARCH 2013  
DC Electrical Characteristics (1)(2) (continued)  
Symbol  
Parameter  
Conditions  
LF147  
LF347B  
LF347  
Units  
Min Typ Max Min Typ Max Min Typ Max  
AVOL  
Large Signal Voltage Gain VS=±15V, TA=25°C  
VO=±10V, RL=2 kΩ  
50 100  
25  
50  
25  
100  
25  
15  
100  
V/mV  
Over Temperature  
V/mV  
V
VO  
Output Voltage Swing  
VS=±15V, RL=10 kΩ  
±12 ±13.  
5
±12 ±13.  
5
±12 ±13.  
5
VCM  
Input Common-Mode  
Voltage Range  
±11 +15  
12  
±11 +15  
±11 +15  
V
V
VS=±15V  
12  
12  
CMRR Common-Mode Rejection RS10 kΩ  
80 100  
80  
80  
100  
100  
7.2  
70  
70  
100  
100  
7.2  
dB  
Ratio  
(4)  
PSRR  
IS  
Supply Voltage Rejection See  
Ratio  
80 100  
7.2  
dB  
Supply Current  
11  
11  
11  
mA  
(4) Supply voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously in accordance with  
common practice from VS = ± 5V to ±15V for the LF347 and LF347B and from VS = ±20V to ±5V for the LF147.  
(1)(2)  
AC Electrical Characteristics  
Symbol  
Parameter  
Conditions  
LF147  
LF347B  
LF347  
Units  
Min Typ Max Min Typ Max Min Typ Max  
Amplifier to Amplifier  
Coupling  
TA=25°C,  
120  
120  
120  
dB  
f=1 Hz20 kHz  
(Input Referred)  
VS=±15V, TA=25°C  
VS=±15V, TA=25°C  
SR  
Slew Rate  
8
13  
4
8
13  
4
8
13  
4
V/μs  
MHz  
GBW  
en  
Gain-Bandwidth Product  
2.2  
2.2  
2.2  
Equivalent Input Noise  
Voltage  
TA=25°C, RS=100Ω,  
f=1000 Hz  
20  
20  
20  
nV / Hz  
in  
Equivalent Input Noise  
Current  
Tj=25°C, f=1000 Hz  
0.01  
0.01  
0.01  
pA / Hz  
THD  
Total Harmonic Distortion  
AV=+10, RL=10k,  
VO=20 Vp-p,  
<0.0  
2
<0.0  
2
<0.0  
2
%
BW=20 Hz20 kHz  
(1) Unless otherwise specified the specifications apply over the full temperature range and for VS=±20V for the LF147 and for VS=±15V for  
the LF347B/LF347. VOS, IB, and IOS are measured at VCM=0.  
(2) Refer to RETS147X for LF147D and LF147J military specifications.  
Copyright © 1999–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Links: LF147 LF347-N  
 
LF147, LF347-N  
SNOSBH1D MAY 1999REVISED MARCH 2013  
www.ti.com  
Typical Performance Characteristics  
Input Bias Current  
Input Bias Current  
Figure 2.  
Figure 3.  
Positive Common-Mode  
Input Voltage Limit  
Supply Current  
Figure 4.  
Figure 5.  
Negative Common-Mode  
Input Voltage Limit  
Positive Current Limit  
Figure 6.  
Figure 7.  
4
Submit Documentation Feedback  
Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LF147 LF347-N  
LF147, LF347-N  
www.ti.com  
SNOSBH1D MAY 1999REVISED MARCH 2013  
Typical Performance Characteristics (continued)  
Negative Current Limit  
Output Voltage Swing  
Figure 8.  
Figure 9.  
Output Voltage Swing  
Gain Bandwidth  
Figure 10.  
Bode Plot  
Figure 11.  
Slew Rate  
Figure 12.  
Figure 13.  
Copyright © 1999–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Links: LF147 LF347-N  
LF147, LF347-N  
SNOSBH1D MAY 1999REVISED MARCH 2013  
www.ti.com  
Typical Performance Characteristics (continued)  
Distortion  
vs  
Frequency  
Undistorted Output Voltage  
Swing  
Figure 14.  
Figure 15.  
Open Loop Frequency  
Response  
Common-Mode Rejection  
Ratio  
Figure 16.  
Figure 17.  
Power Supply Rejection  
Ratio  
Equivalent Input Noise  
Voltage  
Figure 18.  
Figure 19.  
6
Submit Documentation Feedback  
Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LF147 LF347-N  
LF147, LF347-N  
www.ti.com  
SNOSBH1D MAY 1999REVISED MARCH 2013  
Typical Performance Characteristics (continued)  
Open Loop Voltage Gain  
Output Impedance  
Figure 20.  
Figure 21.  
Inverter Settling Time  
Figure 22.  
Copyright © 1999–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Links: LF147 LF347-N  
LF147, LF347-N  
SNOSBH1D MAY 1999REVISED MARCH 2013  
www.ti.com  
Pulse Response  
RL=2 kΩ, CL=10 pF  
Small Signal Inverting  
Large Signal Inverting  
Small Signal Non-Inverting  
Large Signal Non-Inverting  
Current Limit (RL=100Ω)  
8
Submit Documentation Feedback  
Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LF147 LF347-N  
LF147, LF347-N  
www.ti.com  
SNOSBH1D MAY 1999REVISED MARCH 2013  
APPLICATION HINTS  
The LF147 is an op amp with an internally trimmed input offset voltage and JFET input devices (BI-FET II).  
These JFETs have large reverse breakdown voltages from gate to source and drain eliminating the need for  
clamps across the inputs. Therefore, large differential input voltages can easily be accommodated without a large  
increase in input current. The maximum differential input voltage is independent of the supply voltages. However,  
neither of the input voltages should be allowed to exceed the negative supply as this will cause large currents to  
flow which can result in a destroyed unit.  
Exceeding the negative common-mode limit on either input will force the output to a high state, potentially  
causing a reversal of phase to the output. Exceeding the negative common-mode limit on both inputs will force  
the amplifier output to a high state. In neither case does a latch occur since raising the input back within the  
common-mode range again puts the input stage and thus the amplifier in a normal operating mode.  
Exceeding the positive common-mode limit on a single input will not change the phase of the output; however, if  
both inputs exceed the limit, the output of the amplifier will be forced to a high state.  
The amplifiers will operate with a common-mode input voltage equal to the positive supply; however, the gain  
bandwidth and slew rate may be decreased in this condition. When the negative common-mode voltage swings  
to within 3V of the negative supply, an increase in input offset voltage may occur.  
Each amplifier is individually biased by a zener reference which allows normal circuit operation on ±4.5V power  
supplies. Supply voltages less than these may result in lower gain bandwidth and slew rate.  
The LF147 will drive a 2 kΩ load resistance to ±10V over the full temperature range. If the amplifier is forced to  
drive heavier load currents, however, an increase in input offset voltage may occur on the negative voltage swing  
and finally reach an active current limit on both positive and negative swings.  
Precautions should be taken to ensure that the power supply for the integrated circuit never becomes reversed in  
polarity or that the unit is not inadvertently installed backwards in a socket as an unlimited current surge through  
the resulting forward diode within the IC could cause fusing of the internal conductors and result in a destroyed  
unit.  
As with most amplifiers, care should be taken with lead dress, component placement and supply decoupling in  
order to ensure stability. For example, resistors from the output to an input should be placed with the body close  
to the input to minimize “pick-up” and maximize the frequency of the feedback pole by minimizing the  
capacitance from the input to ground.  
A feedback pole is created when the feedback around any amplifier is resistive. The parallel resistance and  
capacitance from the input of the device (usually the inverting input) to AC ground set the frequency of the pole.  
In many instances the frequency of this pole is much greater than the expected 3 dB frequency of the closed  
loop gain and consequently there is negligible effect on stability margin. However, if the feedback pole is less  
than approximately 6 times the expected 3 dB frequency a lead capacitor should be placed from the output to the  
input of the op amp. The value of the added capacitor should be such that the RC time constant of this capacitor  
and the resistance it parallels is greater than or equal to the original feedback pole time constant.  
Copyright © 1999–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
9
Product Folder Links: LF147 LF347-N  
LF147, LF347-N  
SNOSBH1D MAY 1999REVISED MARCH 2013  
www.ti.com  
Detailed Schematic  
10  
Submit Documentation Feedback  
Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LF147 LF347-N  
LF147, LF347-N  
www.ti.com  
SNOSBH1D MAY 1999REVISED MARCH 2013  
Typical Applications  
Figure 23. Digitally Selectable Precision Attenuator  
All resistors 1% tolerance  
Accuracy of better than 0.4% with standard 1% value resistors  
No offset adjustment necessary  
Expandable to any number of stages  
Very high input impedance  
A1  
A2  
A3  
VO  
Attenuation  
0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1 dB  
2 dB  
3 dB  
4 dB  
5 dB  
6 dB  
7 dB  
Copyright © 1999–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
11  
Product Folder Links: LF147 LF347-N  
LF147, LF347-N  
SNOSBH1D MAY 1999REVISED MARCH 2013  
www.ti.com  
Figure 24. Long Time Integrator with Reset, Hold and Starting Threshold Adjustment  
VOUT starts from zero and is equal to the integral of the input voltage with respect to the threshold voltage:  
Output starts when VINVTH  
Switch S1 permits stopping and holding any output value  
Switch S2 resets system to zero  
Figure 25. Universal State Variable Filter  
For circuit shown:  
fo=3 kHz, fNOTCH=9.5 kHz  
Q=3.4  
Passband gain:  
Highpass—0.1  
Bandpass—1  
Lowpass—1  
Notch—10  
• fo×Q200 kHz  
• 10V peak sinusoidal output swing without slew limiting to 200 kHz  
• See LM148 data sheet for design equations  
12  
Submit Documentation Feedback  
Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LF147 LF347-N  
 
LF147, LF347-N  
www.ti.com  
SNOSBH1D MAY 1999REVISED MARCH 2013  
REVISION HISTORY  
Changes from Revision C (March 2013) to Revision D  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 12  
Copyright © 1999–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
13  
Product Folder Links: LF147 LF347-N  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
LF147J  
ACTIVE  
CDIP  
PDIP  
J
14  
14  
25  
TBD  
Call TI  
SN  
Call TI  
-55 to 125  
0 to 70  
LF147J  
LF347BN/NOPB  
ACTIVE  
NFF  
25  
Green (RoHS  
& no Sb/Br)  
Level-1-NA-UNLIM  
LF347BN  
LF347BN/PB  
LF347M  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SOIC  
SOIC  
NFF  
D
14  
14  
14  
25  
55  
55  
TBD  
Call TI  
Call TI  
CU SN  
Call TI  
Call TI  
LF347BN  
LF347M  
LF347M  
TBD  
0 to 70  
0 to 70  
LF347M/NOPB  
D
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LF347MX  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
D
D
14  
14  
2500  
2500  
TBD  
Call TI  
CU SN  
Call TI  
0 to 70  
0 to 70  
LF347M  
LF347M  
LF347MX/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LF347N/NOPB  
LF347N/PB  
ACTIVE  
ACTIVE  
PDIP  
PDIP  
NFF  
NFF  
14  
14  
25  
25  
Green (RoHS  
& no Sb/Br)  
SN  
Level-1-NA-UNLIM  
Call TI  
0 to 70  
LF347N  
LF347N  
TBD  
Call TI  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Mar-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LF347MX  
SOIC  
SOIC  
D
D
14  
14  
2500  
2500  
330.0  
330.0  
16.4  
16.4  
6.5  
6.5  
9.35  
9.35  
2.3  
2.3  
8.0  
8.0  
16.0  
16.0  
Q1  
Q1  
LF347MX/NOPB  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Mar-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LF347MX  
SOIC  
SOIC  
D
D
14  
14  
2500  
2500  
367.0  
367.0  
367.0  
367.0  
35.0  
35.0  
LF347MX/NOPB  
Pack Materials-Page 2  
MECHANICAL DATA  
NFF0014A  
N14A (Rev G)  
www.ti.com  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense  
Video and Imaging  
www.ti.com/space-avionics-defense  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/omap  
OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  

相关型号:

LF147AGC

Voltage-Feedback Operational Amplifier
ETC

LF147AJ

Voltage-Feedback Operational Amplifier
ETC

LF147BGC

Voltage-Feedback Operational Amplifier
ETC

LF147BJ

Voltage-Feedback Operational Amplifier
ETC

LF147D

WIDE BANDWIDTH QUAD J-FET OPERATIONAL AMPLIFIERS
STMICROELECTR
TI

LF147D/883

IC QUAD OP-AMP, 8000 uV OFFSET-MAX, 4 MHz BAND WIDTH, CDIP14, HERMETIC SEALED, DIP-14, Operational Amplifier
NSC

LF147D/883B

IC QUAD OP-AMP, 8000 uV OFFSET-MAX, 4 MHz BAND WIDTH, CDIP14, HERMETIC SEALED, CAVITY, DIP-14, Operational Amplifier
NSC

LF147D/883C

IC,OP-AMP,QUAD,BIPOLAR/JFET,DIP,14PIN,CERAMIC
NSC

LF147DT

WIDE BANDWIDTH QUAD J-FET OPERATIONAL AMPLIFIERS
STMICROELECTR

LF147GC

Voltage-Feedback Operational Amplifier
ETC

LF147J

Wide Bandwidth Quad JFET Input Operational Amplifiers
NSC