LF147-MD8 [TI]
四路、30V、4MHz、FET 输入运算放大器 | Y | 0 | -55 to 125;型号: | LF147-MD8 |
厂家: | TEXAS INSTRUMENTS |
描述: | 四路、30V、4MHz、FET 输入运算放大器 | Y | 0 | -55 to 125 放大器 运算放大器 |
文件: | 总21页 (文件大小:1620K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LF147, LF347-N
www.ti.com
SNOSBH1D –MAY 1999–REVISED MARCH 2013
LF147/LF347 Wide Bandwidth Quad JFET Input Operational Amplifiers
Check for Samples: LF147, LF347-N
1
FEATURES
DESCRIPTION
The LF147 is a low cost, high speed quad JFET input
operational amplifier with an internally trimmed input
offset voltage ( BI-FET II™ technology). The device
requires a low supply current and yet maintains a
large gain bandwidth product and a fast slew rate. In
addition, well matched high voltage JFET input
devices provide very low input bias and offset
currents. The LF147 is pin compatible with the
standard LM148. This feature allows designers to
immediately upgrade the overall performance of
existing LF148 and LM124 designs.
23
•
Internally Trimmed Offset Voltage: 5 mV max
Low Input Bias Current: 50 pA
Low Input Noise Current: 0.01 pA/√Hz
Wide Gain Bandwidth: 4 MHz
•
•
•
•
•
•
•
•
•
High Slew Rate: 13 V/μs
Low Supply Current: 7.2 mA
High Input Impedance: 1012Ω
Low Total Harmonic Distortion: ≤0.02%
Low 1/f Noise Corner: 50 Hz
The LF147 may be used in applications such as high
speed integrators, fast D/A converters, sample-and-
hold circuits and many other circuits requiring low
input offset voltage, low input bias current, high input
impedance, high slew rate and wide bandwidth. The
device has low noise and offset voltage drift.
Fast Settling Time to 0.01%: 2 μs
Simplified Schematic
Connection Diagram
¼ Quad
LF147 available as per JM38510/11906.
Figure 1. 14-Pin PDIP / CDIP / SOIC
Top View
See Package Number J0014A, D0014A or
NFF0014A
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
BI-FET II is a trademark of dcl_owner.
2
3
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LF147, LF347-N
SNOSBH1D –MAY 1999–REVISED MARCH 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
(1)(2)
Absolute Maximum Ratings
LF147
±22V
LF347B/LF347
±18V
Supply Voltage
Differential Input Voltage
±38V
±30V
(3)
Input Voltage Range
±19V
±15V
(4)
Output Short Circuit Duration
Continuous
900 mW
150°C
Continuous
1000 mW
150°C
(5) (6)
Power Dissipation
Tj max
θjA
CDIP (J) Package
PDIP (NFF) Package
SOIC Narrow (D)
SOIC Wide (D)
70°C/W
75°C/W
100°C/W
85°C/W
(7)
(7)
Operating Temperature Range
Storage Temperature Range
See
See
−65°C≤TA≤150°C
Lead Temperature (Soldering, 10 sec.)
260°C
260°C
260°C
215°C
220°C
900V
Soldering Information
PDIP / CDIP
SOIC Package
Soldering (10 seconds)
Vapor Phase (60 seconds)
Infrared (15 seconds)
(8)
ESD Tolerance
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Unless otherwise specified the absolute maximum negative input voltage is equal to the negative power supply voltage.
(4) Any of the amplifier outputs can be shorted to ground indefinitely, however, more than one should not be simultaneously shorted as the
maximum junction temperature will be exceeded.
(5) For operating at elevated temperature, these devices must be derated based on a thermal resistance of θjA.
(6) Max. Power Dissipation is defined by the package characteristics. Operating the part near the Max. Power Dissipation may cause the
part to operate outside ensured limits.
(7) The LF147 is available in the military temperature range −55°C≤TA≤125°C, while the LF347B and the LF347 are available in the
commercial temperature range 0°C≤TA≤70°C. Junction temperature can rise to Tj max = 150°C.
(8) Human body model, 1.5 kΩ in series with 100 pF.
(1)(2)
DC Electrical Characteristics
Symbol
Parameter
Conditions
LF147
LF347B
LF347
Units
Min Typ Max Min Typ Max Min Typ Max
VOS
Input Offset Voltage
RS=10 kΩ, TA=25°C
Over Temperature
RS=10 kΩ
1
5
8
3
5
7
5
10
13
mV
mV
ΔVOS/Δ Average TC of Input
T
10
25
10
25
10
25
μV/°C
Offset Voltage
(2) (3)
IOS
Input Offset Current
Tj=25°C,
100
25
100
4
100
4
pA
nA
pA
nA
Ω
Over Temperature
(2) (3)
IB
Input Bias Current
Input Resistance
Tj=25°C,
50
200
50
50
200
8
50
200
8
Over Temperature
Tj=25°C
RIN
1012
1012
1012
(1) Refer to RETS147X for LF147D and LF147J military specifications.
(2) Unless otherwise specified the specifications apply over the full temperature range and for VS=±20V for the LF147 and for VS=±15V for
the LF347B/LF347. VOS, IB, and IOS are measured at VCM=0.
(3) The input bias currents are junction leakage currents which approximately double for every 10°C increase in the junction temperature,
Tj. Due to limited production test time, the input bias currents measured are correlated to junction temperature. In normal operation the
junction temperature rises above the ambient temperature as a result of internal power dissipation, PD. Tj=TA+θjA PD where θjA is the
thermal resistance from junction to ambient. Use of a heat sink is recommended if input bias current is to be kept to a minimum.
2
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LF147 LF347-N
LF147, LF347-N
www.ti.com
SNOSBH1D –MAY 1999–REVISED MARCH 2013
DC Electrical Characteristics (1)(2) (continued)
Symbol
Parameter
Conditions
LF147
LF347B
LF347
Units
Min Typ Max Min Typ Max Min Typ Max
AVOL
Large Signal Voltage Gain VS=±15V, TA=25°C
VO=±10V, RL=2 kΩ
50 100
25
50
25
100
25
15
100
V/mV
Over Temperature
V/mV
V
VO
Output Voltage Swing
VS=±15V, RL=10 kΩ
±12 ±13.
5
±12 ±13.
5
±12 ±13.
5
VCM
Input Common-Mode
Voltage Range
±11 +15
−12
±11 +15
±11 +15
V
V
VS=±15V
−12
−12
CMRR Common-Mode Rejection RS≤10 kΩ
80 100
80
80
100
100
7.2
70
70
100
100
7.2
dB
Ratio
(4)
PSRR
IS
Supply Voltage Rejection See
Ratio
80 100
7.2
dB
Supply Current
11
11
11
mA
(4) Supply voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously in accordance with
common practice from VS = ± 5V to ±15V for the LF347 and LF347B and from VS = ±20V to ±5V for the LF147.
(1)(2)
AC Electrical Characteristics
Symbol
Parameter
Conditions
LF147
LF347B
LF347
Units
Min Typ Max Min Typ Max Min Typ Max
Amplifier to Amplifier
Coupling
TA=25°C,
−120
−120
−120
dB
f=1 Hz−20 kHz
(Input Referred)
VS=±15V, TA=25°C
VS=±15V, TA=25°C
SR
Slew Rate
8
13
4
8
13
4
8
13
4
V/μs
MHz
GBW
en
Gain-Bandwidth Product
2.2
2.2
2.2
Equivalent Input Noise
Voltage
TA=25°C, RS=100Ω,
f=1000 Hz
20
20
20
nV / √Hz
in
Equivalent Input Noise
Current
Tj=25°C, f=1000 Hz
0.01
0.01
0.01
pA / √Hz
THD
Total Harmonic Distortion
AV=+10, RL=10k,
VO=20 Vp-p,
<0.0
2
<0.0
2
<0.0
2
%
BW=20 Hz−20 kHz
(1) Unless otherwise specified the specifications apply over the full temperature range and for VS=±20V for the LF147 and for VS=±15V for
the LF347B/LF347. VOS, IB, and IOS are measured at VCM=0.
(2) Refer to RETS147X for LF147D and LF147J military specifications.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LF147 LF347-N
LF147, LF347-N
SNOSBH1D –MAY 1999–REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics
Input Bias Current
Input Bias Current
Figure 2.
Figure 3.
Positive Common-Mode
Input Voltage Limit
Supply Current
Figure 4.
Figure 5.
Negative Common-Mode
Input Voltage Limit
Positive Current Limit
Figure 6.
Figure 7.
4
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LF147 LF347-N
LF147, LF347-N
www.ti.com
SNOSBH1D –MAY 1999–REVISED MARCH 2013
Typical Performance Characteristics (continued)
Negative Current Limit
Output Voltage Swing
Figure 8.
Figure 9.
Output Voltage Swing
Gain Bandwidth
Figure 10.
Bode Plot
Figure 11.
Slew Rate
Figure 12.
Figure 13.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LF147 LF347-N
LF147, LF347-N
SNOSBH1D –MAY 1999–REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
Distortion
vs
Frequency
Undistorted Output Voltage
Swing
Figure 14.
Figure 15.
Open Loop Frequency
Response
Common-Mode Rejection
Ratio
Figure 16.
Figure 17.
Power Supply Rejection
Ratio
Equivalent Input Noise
Voltage
Figure 18.
Figure 19.
6
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LF147 LF347-N
LF147, LF347-N
www.ti.com
SNOSBH1D –MAY 1999–REVISED MARCH 2013
Typical Performance Characteristics (continued)
Open Loop Voltage Gain
Output Impedance
Figure 20.
Figure 21.
Inverter Settling Time
Figure 22.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LF147 LF347-N
LF147, LF347-N
SNOSBH1D –MAY 1999–REVISED MARCH 2013
www.ti.com
Pulse Response
RL=2 kΩ, CL=10 pF
Small Signal Inverting
Large Signal Inverting
Small Signal Non-Inverting
Large Signal Non-Inverting
Current Limit (RL=100Ω)
8
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LF147 LF347-N
LF147, LF347-N
www.ti.com
SNOSBH1D –MAY 1999–REVISED MARCH 2013
APPLICATION HINTS
The LF147 is an op amp with an internally trimmed input offset voltage and JFET input devices (BI-FET II).
These JFETs have large reverse breakdown voltages from gate to source and drain eliminating the need for
clamps across the inputs. Therefore, large differential input voltages can easily be accommodated without a large
increase in input current. The maximum differential input voltage is independent of the supply voltages. However,
neither of the input voltages should be allowed to exceed the negative supply as this will cause large currents to
flow which can result in a destroyed unit.
Exceeding the negative common-mode limit on either input will force the output to a high state, potentially
causing a reversal of phase to the output. Exceeding the negative common-mode limit on both inputs will force
the amplifier output to a high state. In neither case does a latch occur since raising the input back within the
common-mode range again puts the input stage and thus the amplifier in a normal operating mode.
Exceeding the positive common-mode limit on a single input will not change the phase of the output; however, if
both inputs exceed the limit, the output of the amplifier will be forced to a high state.
The amplifiers will operate with a common-mode input voltage equal to the positive supply; however, the gain
bandwidth and slew rate may be decreased in this condition. When the negative common-mode voltage swings
to within 3V of the negative supply, an increase in input offset voltage may occur.
Each amplifier is individually biased by a zener reference which allows normal circuit operation on ±4.5V power
supplies. Supply voltages less than these may result in lower gain bandwidth and slew rate.
The LF147 will drive a 2 kΩ load resistance to ±10V over the full temperature range. If the amplifier is forced to
drive heavier load currents, however, an increase in input offset voltage may occur on the negative voltage swing
and finally reach an active current limit on both positive and negative swings.
Precautions should be taken to ensure that the power supply for the integrated circuit never becomes reversed in
polarity or that the unit is not inadvertently installed backwards in a socket as an unlimited current surge through
the resulting forward diode within the IC could cause fusing of the internal conductors and result in a destroyed
unit.
As with most amplifiers, care should be taken with lead dress, component placement and supply decoupling in
order to ensure stability. For example, resistors from the output to an input should be placed with the body close
to the input to minimize “pick-up” and maximize the frequency of the feedback pole by minimizing the
capacitance from the input to ground.
A feedback pole is created when the feedback around any amplifier is resistive. The parallel resistance and
capacitance from the input of the device (usually the inverting input) to AC ground set the frequency of the pole.
In many instances the frequency of this pole is much greater than the expected 3 dB frequency of the closed
loop gain and consequently there is negligible effect on stability margin. However, if the feedback pole is less
than approximately 6 times the expected 3 dB frequency a lead capacitor should be placed from the output to the
input of the op amp. The value of the added capacitor should be such that the RC time constant of this capacitor
and the resistance it parallels is greater than or equal to the original feedback pole time constant.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: LF147 LF347-N
LF147, LF347-N
SNOSBH1D –MAY 1999–REVISED MARCH 2013
www.ti.com
Detailed Schematic
10
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LF147 LF347-N
LF147, LF347-N
www.ti.com
SNOSBH1D –MAY 1999–REVISED MARCH 2013
Typical Applications
Figure 23. Digitally Selectable Precision Attenuator
All resistors 1% tolerance
•
Accuracy of better than 0.4% with standard 1% value resistors
No offset adjustment necessary
Expandable to any number of stages
Very high input impedance
•
•
A1
A2
A3
VO
Attenuation
0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
−1 dB
−2 dB
−3 dB
−4 dB
−5 dB
−6 dB
−7 dB
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: LF147 LF347-N
LF147, LF347-N
SNOSBH1D –MAY 1999–REVISED MARCH 2013
www.ti.com
Figure 24. Long Time Integrator with Reset, Hold and Starting Threshold Adjustment
•
VOUT starts from zero and is equal to the integral of the input voltage with respect to the threshold voltage:
•
•
•
Output starts when VIN≥VTH
Switch S1 permits stopping and holding any output value
Switch S2 resets system to zero
Figure 25. Universal State Variable Filter
For circuit shown:
fo=3 kHz, fNOTCH=9.5 kHz
Q=3.4
Passband gain:
Highpass—0.1
Bandpass—1
Lowpass—1
Notch—10
• fo×Q≤200 kHz
• 10V peak sinusoidal output swing without slew limiting to 200 kHz
• See LM148 data sheet for design equations
12
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LF147 LF347-N
LF147, LF347-N
www.ti.com
SNOSBH1D –MAY 1999–REVISED MARCH 2013
REVISION HISTORY
Changes from Revision C (March 2013) to Revision D
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 12
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: LF147 LF347-N
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
LF147J
ACTIVE
CDIP
PDIP
J
14
14
25
TBD
Call TI
SN
Call TI
-55 to 125
0 to 70
LF147J
LF347BN/NOPB
ACTIVE
NFF
25
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
LF347BN
LF347BN/PB
LF347M
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
SOIC
NFF
D
14
14
14
25
55
55
TBD
Call TI
Call TI
CU SN
Call TI
Call TI
LF347BN
LF347M
LF347M
TBD
0 to 70
0 to 70
LF347M/NOPB
D
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LF347MX
ACTIVE
ACTIVE
SOIC
SOIC
D
D
14
14
2500
2500
TBD
Call TI
CU SN
Call TI
0 to 70
0 to 70
LF347M
LF347M
LF347MX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LF347N/NOPB
LF347N/PB
ACTIVE
ACTIVE
PDIP
PDIP
NFF
NFF
14
14
25
25
Green (RoHS
& no Sb/Br)
SN
Level-1-NA-UNLIM
Call TI
0 to 70
LF347N
LF347N
TBD
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LF347MX
SOIC
SOIC
D
D
14
14
2500
2500
330.0
330.0
16.4
16.4
6.5
6.5
9.35
9.35
2.3
2.3
8.0
8.0
16.0
16.0
Q1
Q1
LF347MX/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LF347MX
SOIC
SOIC
D
D
14
14
2500
2500
367.0
367.0
367.0
367.0
35.0
35.0
LF347MX/NOPB
Pack Materials-Page 2
MECHANICAL DATA
NFF0014A
N14A (Rev G)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号:
LF147D/883
IC QUAD OP-AMP, 8000 uV OFFSET-MAX, 4 MHz BAND WIDTH, CDIP14, HERMETIC SEALED, DIP-14, Operational Amplifier
NSC
LF147D/883B
IC QUAD OP-AMP, 8000 uV OFFSET-MAX, 4 MHz BAND WIDTH, CDIP14, HERMETIC SEALED, CAVITY, DIP-14, Operational Amplifier
NSC
©2020 ICPDF网 联系我们和版权申明