LM10000SDX/NOPB [TI]
AVS 系统控制器 | NHK | 14 | -40 to 125;
| 型号： | LM10000SDX/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | AVS 系统控制器 | NHK | 14 | -40 to 125 控制器 光电二极管 |
| 文件： | 总23页 (文件大小：959K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM10000
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SNVS643C –JUNE 2010–REVISED APRIL 2013
AVS System Controller
Check for Samples: LM10000
1
FEATURES
KEY SPECIFICATIONS
23
•
Flexible Enable Inputs to Allow Independent
Enable Control of External Controller and
LM10000
•
•
•
PWI 2.0 Interface
AVS Control for One Output
Precision Enable
•
Fault Input Restores Output Voltage Setting to
Default Value
DESCRIPTION
•
•
CNTL_EN Output That Enables/Disables
External Controller
The LM10000 is used to enable Adaptive Voltage
Scaling (AVS) to non-AVS regulators. It includes a
complete Slave Power Controller (SPC 2.0) to
communicate to the PowerWise™ Interface (PWI
2.0), and a programmable current output DAC that
allows voltage control to any regulator utilizing a
feedback node/resistors to set the output voltage.
7-Bit Current DAC That Can Directly Connect
to the Feedback Node of an External Controller
and Provide Smooth Voltage Control
•
Programmable Slew Rate Control
In addition to enabling AVS the LM10000 allows the
system to control power states such as sleep and
shutdown, and to configure the voltage step slew rate
from the PWI.
APPLICATIONS
•
AVS-Enabled ASICs and FPGAs
TYPICAL APPLICATION CIRCUIT
Slave Regulator
Controller or Switcher
Single or Multi-Phase
ASIC/FPGA
VIN
External
Controller
VIN
VOUT
0.6V - 1.2V, 20A
HG
LG
VOUT
RTN
CORE
HPM
PGN
D
PWRGD
Enable
FB
LM10000
CNTL_EN
AVS
IAVS
0 mA œ 60 mA, 7 bit
FLT_N
SPWI
SCLK
2
APC 2
EN_BIAS
CONTROL
VPWI
V I/O
RESET_N
VDD
3V œ 5.5V
AGND
AGND
ADDR
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerWise is a trademark of Texas Instruments.
2
3
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2013, Texas Instruments Incorporated
LM10000
SNVS643C –JUNE 2010–REVISED APRIL 2013
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CONNECTION DIAGRAM
Figure 1. 14-Lead Plastic WSON
PIN DESCRIPTIONS
Pin No.
Pad Name
FLT_N
Type
Input
Pad Description
1
2
External fault input. Usually connected to PWGD output of integrated regulator.
Analog Bias power input.
AGND
GND
Power
GND
Input
Input
Input
Output
Output
Input
Output
Power
I/O
3
VDD
4
AGND
5
ADDR
PWI address selection
6
EN_BIAS
CONTROL
IAVS
Enable input.
7
VOUT control input from system. Logic level.
Current DAC output that connects to feedback node of integrated regulator
Current DAC output that mirrors IAVS output current
Reset, active low.
8
9
IAVS_MIRROR
RESET_N
CNTL_EN
VPWI
10
11
12
13
14
Enable signal that connects to integrated regulator
PWI IO bias power
SPWI
PWI Data
SCLK
Input
PWI Clock
2
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1) (2)(3)
ABSOLUTE MAXIMUM RATINGS
VPWI to GND
−0.2V to VDD
−0.2V to 6V
FLT_N, VDD, ADR, EN_BIAS, CONTROL, IAVS, IAVS_MIRROR, RESET_N, CNTL_EN,
VPWI, SPWI, SCLK to GND
Junction Temperature
−45°C to +125°C
−45°C to +150°C
Storage Temperature
Soldering Information: See http://www.ti.com/lit/SNOA549
ESD Ratings(4)
Human Body Model
Machine Model
2kV
200V
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for
which the device operates correctly. Operating Ratings do not imply ensured performance limits.
(2) The power MOSFETs can run on a separate 1V to 14V rail (Input voltage, VIN). Practical lower limit of VIN depends on selection of the
external MOSFET. See the MOSFET GATE DRIVERS section under Application Information for further details.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4) ESD using the human body model which is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
(1) (2)
OPERATING RATINGS
VDD
VPWI(3)
3.0V to 5.5V
1.6V to 3.6V
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for
which the device operates correctly. Operating Ratings do not imply ensured performance limits.
(2) The power MOSFETs can run on a separate 1V to 14V rail (Input voltage, VIN). Practical lower limit of VIN depends on selection of the
external MOSFET. See the MOSFET GATE DRIVERS section under Application Information for further details.
(3) VPWI cannot be higher than VDD.
THERMAL PROPERTIES
Junction-to-Ambient thermal resistance
54.7°C
ELECTRICAL CHARACTERISTICS
Limits appearing in standard type apply for TJ = 25°C. Limits appearing in boldface type apply over full operating junction
temperature range (−40°C ≤ TJ ≤ +125°C. Unless otherwise noted, specifications apply to the LM10000 Typical Application
Circuit (pg. 2) with: VDD = 5.0V, CIN = 1µF.
Symbol
Parameter
Conditions
Min
Typ
Max
10
Units
EN_BIAS = 0V, CONTROL = 0V
1.5
EN_BIAS = VDD, CONTROL = VDD
R0 = 0x7F
315
410
Iq
Quiescent Current
µA
EN_BIAS = VDD, PWI Sleep Command
196
23
300
75
EN_BIAS = VDD, PWI Shutdown Command
Rising Threshold
Falling Threshold
Hysteresis
2.65
2.40
257
7.5
2.75
V
UVLO
2.27
mV
µA
IADDR
IDAC
ACC
LSB
Address pin source current
Accuracy
Measured at full scale
IDAC-MAX / 2n (1≤ n ≤ 7)
−3
3
%
DAC Step Size
Resolution
470
nA
7
Bits
µA
FS
Full Scale
59.69
INL
DNL
Integral Non-Linearity
Differential Non-Linearity
−2
2
LSB
LSB
−0.5
0.5
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ELECTRICAL CHARACTERISTICS (continued)
Limits appearing in standard type apply for TJ = 25°C. Limits appearing in boldface type apply over full operating junction
temperature range (−40°C ≤ TJ ≤ +125°C. Unless otherwise noted, specifications apply to the LM10000 Typical Application
Circuit (pg. 2) with: VDD = 5.0V, CIN = 1µF.
Symbol
ZE
Parameter
Conditions
Min
Typ
Max
Units
Zero Code Error/Offset Error
57
nA
LOGIC AND CONTROL INPUTS
Rising
1.32
1.19
1.4
EN_BIASTH Precision enable threshold
V
Falling
1.09
−10
−1
FLT_N, RESET_N
IIL
Input Current Low
Input Current High
ENBIAS, CONTROL
µA
SPWI, SCLK
−1
FLT_N, RESET_N
1
10
5
IIH
ENBIAS, CONTROL
µA
SPWI, SCLK
VIL
Input Low Voltage
Input High Voltage
Input Low Voltage, PWI
Input High Voltage, PWI
PWI2 SCLK
CONTROL, FLT_N, RESET_N
CONTROL, FLT_N, RESET_N
SPWI, SCLK, 1.6 < VPWI < 3.6
SPWI, SCLK, 1.6 < VPWI < 3.6
**DC useful for testing/debug
0.5
V
V
VIH
1.1
VIL_PWI
VIH_PWI
fSCLK
30
15M
0.4
% of VPWI
Hz
70
0
LOGIC AND CONTROL OUTPUTS
VOL
Output Low Level
CNTL_EN, ISINK ≤ 100 µA
VDD -
0.4
VOH
Output High Level
CNTL_EN, ISOURCE ≤ 100 µA
V
VPWI -
0.4
VOH_PWI
Output High Level, PWI
SPWI, ISOURCE ≤ 1mA
4
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BLOCK DIAGRAM
UVLO
VDD
Slew Rate
Control
Ready
IAVS
IDAC
IDAC
CNTL_EN
CONTROL
IAVS_MIRROR
VPWI
FLT_N
ADDR
Slave Power
Controller
(SPC 2)
SPWI
SCLK
RESET_N
1.3V
+
-
EN_BIAS
Precision Enable
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TYPICAL PERFORMANCE CHARACTERISTICS
EN_BIAS to CNTL_EN Delay
CONTROL to CNTL_EN Delay
(EN_BIAS held HIGH)
(CONTROL held HIGH)
CONTROL
2V/DIV
EN_BIAS
2V/DIV
CNTL_EN
CNTL_EN
200 ns/DIV
50 ms/DIV
Figure 2.
Figure 3.
VOUT Reset by FLT_N Trigger
IAVS Slew Rate Programmability
Figure 4.
Figure 5.
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LM10000 PWI REGISTER MAP
The PWI 2.0 standard defines 32 8-bit base registers, and up to 256 8-bit extended registers, on each PWI slave.
The table below summarizes these registers and shows default register bit values after reset, as programmed by
the factory. The following sub-sections provide additional details on the use of each individual register.
Table 1. SUMMARY(1)
Base Registers
Register Register
Register Usage
Typ
e
Reset Default Value
Address
Name
7
0*
0
6
5
4
3
2
1
0
0x00
0x03
0x04
0x09
0x0A
0x0F
0x1F
R0
R3
IAVS
R/W
R/O
R/O
Configured by R9
0
0
0
0
0
0
1
0
1
0
1
1
FLT_N
0
R4
Device Capability
IAVS Default
0
R9
R/W IAVS Default Code
R10
R15
R31
Ramp Control
Revision ID
R/W
N/A
1
0
-
0
0
-
0
0
-
1
0
-
1
0
-
1
0
-
0
0
-
0
0
-
Reserved
R/W
Do not write to
(1) A bit with an asterisk (*) denotes a register bit that is always read as a fixed value. Writes to these bits will be ignored. A bit with a
hyphen (-) denotes a bit in an unimplemented register location. A write into unimplemented register(s) will be ignored. A read of an
unimplemented register(s) will produce a “No response frame”. Please refer to PWI specification version 2.0 for further information.
R0 - IAVS
AVS FEEDBACK CURRENT INJECTION
Address
Type
0x00
R/W
Reset Default
8h'7F
Bit
Field Name
Description or Comment
7
Sign
This bit is fixed to '0'. Reading this bit will result in a '0'. Any data written into this bit position
using the Register Write command is ignored.
Programmed voltage value. Default value is in bold.
Current Data Code [6:0]
Current (µA)
60
6:0
IAVS Sourcing Current
7h'00
7h'xx
7h'7F
Linear Scaling
0 (default)
R3 - STATUS
LM10520 ADDRESS
Address
Type
0x03
R/O
–
Reset Default
Bit
Field Name
Description or Comment
7:4
3:1
0
Not Used
Always read back 0
Always read back 1
Not Used
FLT_N
1: FLT_N is high (no fault)
0: FLT_N is low (fault)
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R4 - DEVICE CAPABILITY REGISTER
Address
Type
0x04
R/O
Reset Default
8h'02
Bit
7:3
2:0
Field Name
Description or Comment
Always read back 0
Always read back 010, specifying PWI 2.0
R9 - IAVS DEFAULT REGISTER
Address
Type
0x09
R/W
Reset Default
8h'7F
Bit
Field Name
Description or Comment
7
Sign
Always read back 0.
Current Data Code [6:0]
Current (µA)
60
7h'00
7h'xx
7h'7F
6:0
IAVS Default
Linear Scaling
0 (Default)
R10 - RAMP CONTROL
Address
0x0A
Type
R/W
Reset Default
8h'9C
Bit
Field Name
Description or Comment
7
Ramp Control Enable
1: Enabled
0: Disabled
6
Not Used
Always read 0
5:3
Ramp Time Step Control
Ramp Time Step Control
Ramp Time Step (µs)
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1
2
3
4
6
8
12
16
2:0
Ramp Code Step Control
Ramp Code Step
Rising Step
(LSB)
Falling Step
(LSB)
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1
2
3
4
6
8
12
16
1
1
2
3
4
5
6
8
8
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R15 - REVISION ID REGISTER
Address
Type
0x0F
R/O
Reset Default
8h'00
Bit
Field Name
Description or Comment
7:0
Always read back 0
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OPERATION DESCRIPTION
GENERAL DESCRIPTION
The LM10000 provides all the circuitry needed to enable most DC/DC regulators to work in a PowerWise®
Adaptive Voltage Scaling (AVS) system. It communicates via the PowerWise Interface (PWI), and has analog
outputs to control the output voltage of a slave power regulator. The slave power regulator can be any device
that sets its output voltage with a feedback resistor divider.
THEORY OF OPERATION
The LM10000 can be thought of as a D/A converter, converting PWI communication to analog outputs. One of
the outputs is a current DAC (IAVS), which is connected to the feedback node of a slave regulator. Therefore, all
PWI Change Voltage Commands (CVC) are decoded into a 7-bit current DAC output. The impedance of the
feedback node at DC appears as the top feedback resistor. This is because the control loop of the slave
regulator effectively maintains a constant current/voltage across the bottom feedback resistor, and creates low
impedance at the VOUT node. Therefore, as more current is sourced into the feedback node, the more the output
voltage is reduced. See Figure 6.
Slave Regulator
V
OUT
+
+
FB
IRFB1
RFB1
RFB2
VRFB1
-
LM10000
+
IAVS
-
VOUT
IAVS
LM10000
+
VFB
-
-
IRFB2
PWI
IAVS
Figure 6. Output Voltage Is Controlled Via current Injection Into Feedback Node
DIGITAL POWER MANAGEMENT
In addition to adaptive voltage scaling, the PWI and LM10000 enhance the slave regulator with basic digital
power management control. This includes control of power states such as SHUTDOWN, SLEEP, and ACTIVE,
ON/OFF sequencing, and voltage scaling slew rate. Figure 7 shows the LM10000 with available system
connectivity options. The LM10000 has a flexible set of logic enable pins to allow the system easy interface to
power states and sequencing. A logic CNTL_EN output is provided to drive the slave regulator enable according
the power state of the LM10000. For example, if a PWI SHUTDOWN command is issued to LM10000, the
CNTL_EN output is immediately driven to 0V, which if connected to the slave regulator enable input, will turn off
the output voltage and enter a low Iq state. A summary of the logic inputs and outputs is given is LOGIC INPUTS
AND OUTPUTS table.
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Logic output for enabling
slave regulator
LM10000
Slave
Regulator
(Non AVS)
ASIC
VDD
FB
CNTL_EN
IAVS
RTN
AVS
SCLK
SPWI
APC2
PWI 2.0
System
uC
EN_BIAS
RESETN
CONTROL
FLTN
Logic inputs for Vout
sequencing control
Figure 7. LM10000 provides flexible digital power management via multi-master PWI 2.0, and flexible
VOUT sequencing control
IAVS OUTPUT CURRENT: CONTROLLING THE OUTPUT VOLTAGE
The LM10000 uses a 7-bit current DAC to control the output voltage of a slave power regulator. Since it is a
current output, IAVS can be connected directly to the feedback node of the slave power regulator. IAVS has a
range of 0 – 60 µA with 7 bits of resolution, or a 0.469 µA LSB.
A typical connection of the IAVS injection current into a slave regulator is shown in Figure 8. The output voltage
VOUT is expressed as:
RFB1
≈
’
◊
VOUT = VFB x 1 +
- IAVS x RFB1
RFB2
«
(1)
Where VFB = the regulated feedback voltage of the slave regulator. This equation is valid for VOUT > VFB.
Slave DC/DC
V
OUT
FB
RFB1
RFB2
LM10000
IAVS
Figure 8. IAVS Injection Current Into A Slave Regulator
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USING REGISTER R9 TO CHANGE THE DEFAULT OUTPUT VOLTAGE
The LM10000 default IAVS current is set by R9. R9 is trimmed to 0x7F, so that IAVS = 0µA when power is
applied to LM10000. Between power cycling, R9 can be changed so that IAVS defaults to values between 0 - 60
µA. This can be useful for software trim of the default output voltage of the LM10000 controlled regulator. In
order to do this, the system must take care to write to R9 before enabling the output (the output can be
enabled/disabled while keeping the LM10000 logic on via the CONTROL input). Therefore, R9 must be written to
by some system controller that is on a different power domain than that provided by LM10000. In addition, the
“INITIAL_VDD” register in the Advanced Power Controller (APC) must have the same value as R9 so that the
APC and LM10000 default to the same voltage code.
IAVS MIRROR OUTPUT CURRENT
IAVS Mirror sources a current equal to IAVS.
DIGITAL SLEW RATE CONTROL
The IAVS and IAVS Mirror outputs have an adjustable, digital slew rate control. The slew rate control is
programmed in register R10. The slew rate of the output voltage will effect both the output and input inrush
current needed to scale the output voltage up or down. The amount of output current source or sink needed to
scale the output voltage is governed by the equation describing current in a capacitor:
iC = C x dV/dt
(2)
Therefore, more current is needed for larger voltage steps (dV) and for smaller settling times (dt). This current is
in addition to the load current that the slave regulator is providing. It is recommended that the total current (load
current + voltage slew current) not exceed the slave regulator current limit.
Single PWI Core Voltage
Adjust Command (value)
Code Step
Time Step
Figure 9. Digital Slew Rate Control
PWI ADDRESS
A resistor from the ADDR pin to ground sets the device's PWI address. The device senses the resistance as it is
initializing from the shutdown state. The device will not update the address until it cycles through shutdown
again. Use the table below to choose the appropriate resistor to place form ADDR pin to ground.
PWI Address
Resistance (± 1% tolerance)
0
1
2
3
4
5
6
7
≤ 40.2 kΩ
60.4 kΩ
80.6 kΩ
100 kΩ
120 kΩ
140 kΩ
160 kΩ
180 kΩ
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INPUTS: ENBIAS, CONTROL, FLT_N, RESET_N, SCLK, SPWI
ENBIAS
The ENBIAS logic input enables the internal circuitry of the LM10000. The LM10000 goes through an
initialization procedure upon the rising edge of ENBIAS. Initialization is complete within 100 µsec, after which the
device is ready to be used.
If at any point ENBIAS goes low, the device enters a low Iq shutdown state.
CONTROL
The CONTROL logic input allows control of the CNTL_EN output without incurring delays associated with
initialization. This signal is effectively ANDed with the internal ‘ready’ signal, which is high once initialization is
complete.
The CONTROL pin level toggles the device between Active and Sleep states, and will reset the R0 register
FLT_N
The FLT_N logic input resets and holds the R0 register when its input signal is low. It has no effect on
CNTL_EN. This provides a convenient way to support automatic fault recovery modes in the slave power
regulator. When connected to a standard PWGD pin of a DC/DC regulator, FLT_N will reset and hold R0 as long
as PWGD is low, allowing the slave regulator to recover from the fault by returning to the default voltage. Once
FLT_N returns high, R0 can be written to.
RESET_N
The RESET_N provides a separate, level controlled logic reset.
SCLK and SPWI
SCLK and SPWI provide serial PWI communication
OUTPUTS: CNTL_EN, IAVS
CNTL_EN
The CNTL_EN output connects to the slave regulator enable pin. CNTL_EN allows power state control via the
PWI interface or ENBIAS/CONTROL logic inputs. For a direct connection from CNTL_EN to the enable pin of the
slave regulator, the enable pin on the slave regulator needs to be level based and active high (a logic high
voltage enables the slave regulator). LM10000 will drive CNTL_EN to the VDD voltage to enable the slave
regulator, and to 0V to disable the slave regulator. In the case that the enable/disable on the slave regulator is a
different function (impedance based or active low), extra circuitry is required.
UVLO
The LM10000 includes a UVLO circuit with hysteresis that triggers off of VDD. The system designer should be
aware of the different UVLO thresholds of LM10000 and the slave regulator it is controlling. Since LM10000 is
controlling the output of the slave regulator, the UVLO circuits in both the LM10000, and the slave regulator can
react to severe input voltage transients. This is normally not a problem unless the application is operating very
close to the UVLO thresholds of the two devices.
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STATES
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STARTUP
During the startup state, the LM10000 initializes all its registers and enables its bandgap. This process typically
takes 100 µsec. CNTL_EN is low during startup.
ACTIVE
During the active state, CNTL_EN is high, the IAVS DACs are enabled, and PWI registers can be accessed.
SLEEP
During the sleep state, CNTL_EN is low, the IAVS DACs are disabled, and PWI registers can be accessed.
FAULT
During the fault state, the IAVS current register (R0) is reset, after which the LM10000 automatically returns to its
previous state.
SHUTDOWN
During the shutdown state, CNTL_EN is low, the IAVS DACs are disabled, and most internal circuitry is disabled.
Only the PWI state machine is biased to allow register access.
Pin State
ENBIAS Falling Edge
ENBIAS Rising Edge
Shutdown
CNTL_EN = 0
RESET Cmd
Low iq state
Shutdown
Cmd
Startup
CNTL_EN = 0
Shutdown
Cmd
CONTROL = 0
CONTROL = 0
Wakeup Cmd
(Reset R0)
SLEEP
CNTL_EN = 0
CONTROL = 1
(Reset R0)
CONTROL = 1
CONTROL = 0
Sleep Cmd
Active
CNTL_EN = 1
FLTN = 1
FLTN = 0
FLTN = 0
FLTN = 1
Fault
Reset and hold
R0
Figure 10. LM10000 State Diagram
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APPLICATION CIRCUITS
V
IN
C
VIN
R
VIN
V
IN
5V
V
IN
C
VCC
C
D
IN
C
VDD1
R
FF
C
FF
BOOT1
V
IN
BOOT1
SNSP
SNSP
SNSM
Q
T1
HG1
SW1
L1
R
R
FBT
FBB
SNSM
VDIF
FB
R
DCR1
C
DCR1
C
BOOT1
R
C
COMP
COMP
CS1
LG1
COMP
V
Q
EXT
B1
C
HF
LM3753/54
R
PGD
PGOOD
FAULT
FREQ
CSM
D
V
IN
BOOT2
BOOT2
R
C
FRQ1
BOOT2
HG2
PGOOD
Q
L2
T2
FRQ1
ASIC/FPGA
R
C
DCR2
SW2
CS2
LG2
DCR2
SYNC
SYNCOUT
C
EN
TRACK
LM3753
Q
B2
V
OUT
0.6 œ 1.2 V
40 œ 60 A
TRACK/SS
C
SS
R
ILIM1
ILIM
LM3754
VDD
SNSP
SNSM
C
OUT
R
AV1
C
AV1
RTN
5V
AVS
LM10000
VPWI
SPWI
V I/O
VDD
CNTLEN
SCLK
APC 2
FLTN
RESET!
IAVS
ADDR
CONTROL
ENBIAS
System Enable
Control
GND
Figure 11. 60A AVS solution using LM10000 paired with LM3573/4 2-Phase Controller
Copyright © 2010–2013, Texas Instruments Incorporated
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Product Folder Links: LM10000
LM10000
SNVS643C –JUNE 2010–REVISED APRIL 2013
www.ti.com
13.2k
6.6k
LMZ10505
FB
0.8V - 1.2V
5A
EN
ASIC/FPGA
VDD
RTN
V
IN
V
OUT
+
C
IN
47 mF
C
OUT
47 mF
GND
5V
AVS
LM10000
VPWI
SPWI
V I/O
VDD
FLTN
CNTLEN
SCLK
APC 2
RESET!
IAVS
ADDR
CONTROL
ENBIAS
System Enable
Control
GND
Figure 12. 5A AVS solution LM10000 paired with LMZ10505 Simple Switcher Module
16
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Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM10000
LM10000
www.ti.com
SNVS643C –JUNE 2010–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 16
Copyright © 2010–2013, Texas Instruments Incorporated
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Product Folder Links: LM10000
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM10000SD/NOPB
LM10000SDE/NOPB
LM10000SDX/NOPB
ACTIVE
ACTIVE
ACTIVE
WSON
WSON
WSON
NHK
NHK
NHK
14
14
14
1000 RoHS & Green
250 RoHS & Green
4500 RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
10000SD
SN
SN
10000SD
10000SD
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM10000SD/NOPB
LM10000SDE/NOPB
LM10000SDX/NOPB
WSON
WSON
WSON
NHK
NHK
NHK
14
14
14
1000
250
178.0
178.0
330.0
12.4
12.4
12.4
3.3
3.3
3.3
4.3
4.3
4.3
1.0
1.0
1.0
8.0
8.0
8.0
12.0
12.0
12.0
Q1
Q1
Q1
4500
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM10000SD/NOPB
LM10000SDE/NOPB
LM10000SDX/NOPB
WSON
WSON
WSON
NHK
NHK
NHK
14
14
14
1000
250
210.0
210.0
367.0
185.0
185.0
367.0
35.0
35.0
35.0
4500
Pack Materials-Page 2
MECHANICAL DATA
NHK0014A
SDA14A (Rev A)
www.ti.com
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