LM1815 [TI]
LM1815 Adaptive Variable Reluctance Sensor Amplifier;
| 型号： | LM1815 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LM1815 Adaptive Variable Reluctance Sensor Amplifier |
| 文件： | 总17页 (文件大小：1296K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM1815
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SNOSBU8F –SEPTEMBER 2000–REVISED MARCH 2013
LM1815 Adaptive Variable Reluctance Sensor Amplifier
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1
FEATURES
DESCRIPTION
The LM1815 is an adaptive sense amplifier and
default gating circuit for motor control applications.
The sense amplifier provides a one-shot pulse output
whose leading edge coincides with the negative-
going zero crossing of a ground referenced input
signal such as from a variable reluctance magnetic
pick-up coil.
2
•
•
•
•
•
•
Adaptive Hysteresis
Single Supply Operation
Ground Referenced Input
True Zero Crossing Timing Reference
Operates from 2V to 12V Supply Voltage
Handles Inputs from 100 mVP-P to over 120VP-P
with External Resistor
In normal operation, this timing reference signal is
processed (delayed) externally and returned to the
LM1815. A Logic input is then able to select either
the timing reference or the processed signal for
transmission to the output driver stage.
•
CMOS Compatible Logic
APPLICATIONS
•
•
•
•
•
Position Sensing with Notched Wheels
Zero Crossing Switch
Motor Speed Control
Tachometer
The adaptive sense amplifier operates with a positive-
going threshold which is derived by peak detecting
the incoming signal and dividing this down. Thus the
input hysteresis varies with input signal amplitude.
This enables the circuit to sense in situations where
the high speed noise is greater than the low speed
Engine Testing
signal amplitude. Minimum input signal is 150mVP-P
.
Connection Diagram
Figure 1. Top View
14-Lead SOIC or PDIP
See D or NFF0014A Package
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LM1815
SNOSBU8F –SEPTEMBER 2000–REVISED MARCH 2013
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Absolute Maximum Ratings(1)(2)
Supply Voltage
Power Dissipation(3)
12V
1250 mW
Operating Temperature Range
Storage Temperature Range
Junction Temperature
−40°C ≤ TA ≤ +125°C
−65°C ≤ TJ ≤ +150°C
+150°C
Input Current
±30 mA
Lead Temperature (Soldering, 10 sec.)
260°C
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply
that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) For operation at elevated temperatures, the device must be derated based on a 150°C maximum junction temperature and a thermal
resistance of 80°C/W (DIP), 120°C/W (SO-14) junction to ambient.
Electrical Characteristics
(TA = 25°C, VCC = 10V, unless otherwise specified, see Figure 17)
Parameter
Operating Supply Voltage
Supply Current
Conditions
Min
Typ
10
Max
12
6
Units
V
2.5
Pin 3 = -0.1V, Pin 9 = 2V, Pin 11 = 0.8V
fIN = 1Hz to 2kHz, R = 150kΩ, C = 0.001µF
VIN = 2V, (Pin 9 and Pin 11)
VIN = 0V dc, (Pin 3)
3.6
100
mA
µs
Reference Pulse Width
Logic Input Bias Current
Signal Input Bias Current
Logic Threshold
70
130
5
µA
-200
1.1
8.6
0.3
0.01
0.2
0
nA
(Pin 9 and Pin 11)
0.8
7.5
2.0
V
VOUT High
RL = 1kΩ, (Pin 10)
V
VOUT Low
ISINK = 0.1mA, (Pin 10)
V12 = 11V
0.4
10
V
Output Leakage Pin 12
Saturation Voltage P12
Input Zero Crossing Threshold
µA
I12 = 2mA
0.4
25
V
All Modes, VSIGNAL = 1V pk-pk
Mode 1, Pin 5 = Open
Mode 2, Pin 5 = VCC
-25
30
mV(1)
mV(1)
mV(1)
mV(1)
45
60
Minimum Input Arming Threshold
200
-25
300
0
450
25
Mode 3, Pin 5 = Gnd
Mode 1, Pin 5 = Open
V
(1)
40
80
80
80
90
%
SIGNAL ≥ 230mV pk-pk(2)
Mode 2, Pin 5 = VCC
SIGNAL ≥ 1.0V pk-pk(2)
(1)
Adaptive Input Arming Threshold
%
V
Mode 3, Pin 5 = Gnd
SIGNAL ≥ 150mV pk-pk(2)
(1)
%
V
(1) The Min/Typ Max limits are relative to the positive voltage peak seen at VIN Pin 3.
(2) Tested per Figure 17, VSIGNAL is a Sine Wave; FSIGNAL is 1000Hz.
2
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SNOSBU8F –SEPTEMBER 2000–REVISED MARCH 2013
Typical Performance Characteristics
Mode 1 Minimum Arming Threshold
vs Temperature
Mode 2 Minimum Arming Threshold
vs Temperature
Figure 2.
Figure 3.
Mode 3 Minimum Arming Threshold
vs Temperature
Mode 1 Minimum Arming Threshold vs VCC
Figure 4.
Figure 5.
Mode 2 Minimum Arming Threshold vs VCC
Pin 3 VIN vs VSIGNAL
Figure 6.
Figure 7.
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Typical Performance Characteristics (continued)
Pin 3 VIN vs VSIGNAL, RIN = 10kΩ
Pin 3 VIN vs VSIGNAL, RIN = 20kΩ
Figure 8.
Figure 9.
Pin 3 VIN vs VSIGNAL, RIN = 50kΩ
Pin 3 Bias Current vs Temperature
Figure 10.
Figure 11.
Peak Detector Charge Current
vs Temperature
Peak Detector Charge Current vs VCC
Figure 12.
Figure 13.
4
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SNOSBU8F –SEPTEMBER 2000–REVISED MARCH 2013
Typical Performance Characteristics (continued)
Peak Detector Voltage
vs Pin 3 VIN, Mode 1
Peak Detector Voltage
vs Pin 3 VIN, Mode 2
Figure 14.
Figure 15.
Peak Detector Voltage
vs Pin 3 VIN, Mode 3
Figure 16.
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SNOSBU8F –SEPTEMBER 2000–REVISED MARCH 2013
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TRUTH TABLE
Signal Input
Pin 3
RC Timing
Pin 14
Input Select
Pin 11
Timing Input
Pin 9
Gated Output
Pin 10
± Pulses
RC
X
L
H
H
L
X
H
L
Pulses = RC
X
X
H
X
L
± Pulses
L
L
Zero Crossing
Figure 17. LM1815 Adaptive Sense Amplifier
6
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SNOSBU8F –SEPTEMBER 2000–REVISED MARCH 2013
Schematic Diagram
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SNOSBU8F –SEPTEMBER 2000–REVISED MARCH 2013
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APPLICATION HINTS
Figure 18. LM1815 Oscillograms
INPUT VOLTAGE CLAMP
The signal input voltage at pin 3 is internally clamped. Current limit for the Input pin is provided by an external
resistor which should be selected to allow a peak current of ±3 mA in normal operation. Positive inputs are
clamped by a 1kΩ resistor and series diode (see R4 and Q12 in the internal schematic diagram), while an active
clamp limits pin 3 to typically 350mV below Ground for negative inputs (see R2, R3, Q10, and Q11 in the internal
schematic diagram). Thus for input signal transitions that are more than 350mV below Ground, the input pin
current (up to 3mA) will be pulled from the V+ supply. If the V+ pin is not adequately bypassed the resulting
voltage ripple at the V+ pin will disrupt normal device operation. Likewise, for input signal transitions that are
more than 500mV above Ground, the input pin current will be dumped to Ground through device pin 2. Slight
shifts in the Ground potential at device pin 2, due to poor grounding techniques relative to the input signal
ground, can cause unreliable operation. As always, adequate device grounding, and V+ bypassing, needs to be
considered across the entire input voltage and frequency range for the intended application.
INPUT CURRENT LIMITING
As stated earlier, current limiting for the Input pin is provided by a user supplied external resistor. For purposes of
selecting the appropriate resistor value the Input pin should be considered to be a zero ohm connection to
ground. For applications where the input voltage signal is not symmetrical with relationship to Ground the worst
case voltage peak should be used.
Minimum Rext = [(Vin peak)/3mA]
In the application example shown in Figure 17 (Rext = 18kΩ) the recommended maximum input signal voltage is
±54V (i.e. 108Vp-p).
OPERATION OF ZERO CROSSING DETECTOR
The LM1815 is designed to operate as a zero crossing detector, triggering an internal one shot on the negative-
going edge of the input signal. Unlike other zero crossing detectors, the LM1815 cannot be triggered until the
input signal has crossed an "arming" threshold on the positive-going portion of the waveform. The arming circuit
is reset when the chip is triggered, and subsequent zero crossings are ignored until the arming threshold is
exceeded again. This threshold varies depending on the connection at pin 5. Three different modes of operation
are possible:
8
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SNOSBU8F –SEPTEMBER 2000–REVISED MARCH 2013
MODE 1, PIN 5 OPEN
The adaptive mode is selected by leaving device pin 5 open circuit. For input signals of less than ±135mV (i.e.
270 mVp-p) and greater than typically ±75mV (i.e. 150mVp-p), the input arming threshold is typically at 45mV.
Under these conditions the input signal must first cross the 45mV threshold in the positive direction to arm the
zero crossing detector, and then cross zero in the negative direction to trigger it.
If the signal is less than 30mV peak (minimum rating in Electrical Characteristics), the one shot is ensured to not
trigger.
Input signals of greater than ±230mV (i.e. 460 mVp-p) will cause the arming threshold to track at 80% of the
peak input voltage. A peak detector capacitor at device pin 7 stores a value relative to the positive input peaks to
establish the arming threshold. Input signals must exceed this threshold in the positive direction to arm the zero
crossing detector, which can then be triggered by a negative-going zero crossing.
The peak detector tracks rapidly as the input signal amplitude increases, and decays by virtue of the resistor
connected externally at pin 7 track decreases in the input signal.
If the input signal amplitude falls faster than the voltage stored on the peak detector capacitor there may be a
loss of output signal until the capacitor voltage has decayed to an appropriate level.
Note that since the input voltage is clamped, the waveform observed at pin 3 is not identical to the waveform
observed at the variable reluctance sensor. Similarly, the voltage stored at pin 7 is not identical to the peak
voltage appearing at pin 3.
MODE 2, PIN 5 CONNECTED TO V+
The input arming threshold is fixed at 200mV minimum when device pin 5 is connected to the positive supply.
The chip has no output for signals of less than ±200 mV (i.e. 400mVp-p) and triggers on the next negative-going
zero crossing when the arming threshold is has been exceeded.
MODE 3, PIN 5 GROUNDED
With pin 5 grounded, the input arming threshold is set to 0V, ±25mV maximum. Positive-going zero crossings
arm the chip, and the next negative-going zero crossing triggers it. This is the very basic form of zero-crossing
detection.
ONE SHOT TIMING
The one shot timing is set by a resistor and capacitor connected to pin 14. The recommended maximum resistor
value is 150kohms. The capacitor value can be changed as needed, as long as the capacitor type does not
present any signfigant leakage that would adversely affect the RC time constant.
The output pulse width is:
pulse width = 0.673 x R x C
(1)
For a given One Shot pulse width, the recommended maximum input signal frequency is:
Fin(max) = 1/(1.346 x R x C)
(2)
In the application example shown in Figure 17 (R=150kohms, C=0.001µF) the recommended maximum input
frequency will typically be 5kHz. Operating with input frequencies above the recommended Fin (max) value may
result in unreliable performance of the One Shot circuitry. For those applications where the One Shot circuit is
not required, device pin 14 can be tied directly to Ground.
LOGIC INPUTS
In some systems it is necessary to externally generate pulses, such as during stall conditions when the variable
reluctance sensor has no output. External pulse inputs at pin 9 are gated through to pin 10 when Input Select
(pin 11) is pulled high. Pin 12 is a direct output for the one shot and is unaffected by the status of pin 11.
Input/output pins 9, 11, 10, and 12 are all CMOS logic compatible. In addition, pins 9, 11, and 12 are TTL
compatible. Pin 10 is not ensured to drive a TTL load.
Pins 1, 4, 6 and 13 have no internal connections and can be grounded.
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REVISION HISTORY
Changes from Revision E (March 2013) to Revision F
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 9
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PACKAGE OPTION ADDENDUM
www.ti.com
19-Mar-2015
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM1815M
NRND
ACTIVE
SOIC
SOIC
D
D
14
14
55
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
LM1815M
LM1815M/NOPB
55
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM1815M
LM1815M
LM1815N
LM1815MX/NOPB
LM1815N/NOPB
ACTIVE
ACTIVE
SOIC
PDIP
D
14
14
2500
25
Green (RoHS
& no Sb/Br)
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-NA-UNLIM
-40 to 125
-40 to 125
NFF
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
19-Mar-2015
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM1815MX/NOPB
SOIC
D
14
2500
330.0
16.4
6.5
9.35
2.3
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC 14
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 35.0
LM1815MX/NOPB
D
2500
Pack Materials-Page 2
MECHANICAL DATA
NFF0014A
N14A (Rev G)
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